Light emitting device and method for manufacturing the same

The innovative design and manufacturing method for light emitting devices with recesses and protrusions on lead electrodes address peeling and strength issues, ensuring high die shear strength and reduced defects.

JP7752009B2Active Publication Date: 2025-10-09STANLEY ELECTRIC CO LTD
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Patent Information

Application Number
JP2021155361
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-09-24
Publication Date
2025-10-09
Estimated Expiration
2041-09-24

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Abstract

To provide a light-emitting device in which peeling of a frame body and a lead frame is prevented, a die share strength and a solder bond strength are improved and a disconnection defect, etc., is hard to occur.SOLUTION: A light-emitting device comprises: a plurality of tabular lead electrodes 12A (first electrodes) and lead electrodes 12B (second electrodes); a resin frame body 22 covering side parts of the plurality of lead electrodes 12A and 12B and separating parts between the plurality of lead electrodes 12A and 12B and including an opening 25 in which the plurality of lead electrodes 12A and 12B is exposed; and a light-emitting element 30 mounted on the plurality of lead electrodes 12A and 12B exposed from the opening 25. An outer side face of the frame body 22 includes a recess 23 from a top face to a bottom face of the frame body 22, and the lead electrodes 12A and 12B partially protrude inside of the recess 23.SELECTED DRAWING: Figure 1A
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Citation Information

Patent Citations

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    JP2002064225A

  • Resin molding and surface-mounted light emitting device, and manufacturing method thereof

    JP2006156704A

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    JP2008147611A

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Cited By

  • Light-emitting device, and method for producing light-emitting device

    US20240379926A1