Image pickup element and image pickup device

Abstract

The present invention achieves size reduction of an image capture element composed of a stack of a plurality of semiconductor substrates. This image capture element comprises pixels, a pixel circuit, a separating portion, an embedded electrode, and a connecting portion. The pixels each include a photoelectric conversion portion disposed on a first semiconductor substrate to perform photoelectric conversion of incident light, a charge holding portion for holding charge generated by the photoelectric conversion, and a charge transfer portion for transferring the charge from the photoelectric conversion portion to the charge holding portion. The pixel circuit is disposed on a second semiconductor substrate stacked on an upper surface side of the first semiconductor substrate, and generates an image signal on the basis of the charge being held. The separating portion is disposed at a boundary of the pixels. The embedded electrode is disposed by being embedded in the upper surface side of the first semiconductor substrate at the boundary of the pixels overlapping the separating portion, and is connected to the first semiconductor substrate. The connecting portion is connected to the embedded electrode.

Description

[Technical Field]

[0001] The present disclosure relates to an imaging element and an imaging device. [Background technology]

[0002] Image sensors that capture images of a subject typically use imaging elements constructed by stacking multiple substrates. These substrates include, for example, a substrate on which pixels that convert incident light from a subject into image signals using photoelectric conversion are formed, and a substrate on which circuits that generate pixel control signals and circuits that process the image signals are formed. Circuits that handle analog image signals are arranged in the pixels. Meanwhile, circuits that process image signals primarily use digital circuits that operate at high speed. By arranging circuits with different characteristics on different substrates in this way, it is possible to manufacture the substrates using processes that are optimal for these circuits. Furthermore, stacking these substrates also enables the area of ​​the image sensor to be reduced.

[0003] For example, an imaging element has been proposed in which a first substrate on which photoelectric conversion elements that perform photoelectric conversion of incident light are mainly arranged and a second substrate on which a readout circuit that outputs an image signal based on electric charges generated by the photoelectric conversion elements is arranged are stacked (see, for example, Patent Document 1). In this imaging element, a third substrate on which a logic circuit that processes the image signal is arranged is further stacked to form the imaging element. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2019 / 131965 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the above-mentioned conventional technology has a problem in that it is not possible to miniaturize pixels. Because the circuits constituting a pixel are divided into two substrates and stacked, a connection (contact) is arranged between the substrates to share a reference potential between these substrates. Here, the reference potential is a potential that serves as a reference for the signals and power supply voltage of the pixel circuit, such as a ground potential. An area for connecting this contact must be provided on the first substrate, which increases the pixel area.

[0006] Therefore, the present disclosure proposes an imaging element and an imaging device that can be miniaturized, among imaging elements and imaging devices configured by stacking multiple semiconductor substrates. [Means for solving the problem]

[0007] The present disclosure has been made to solve the above-mentioned problems, and its aspect is an imaging element having a pixel including a photoelectric conversion unit arranged on a first semiconductor substrate and performing photoelectric conversion of incident light, a charge holding unit that holds charges generated by the photoelectric conversion, and a charge transfer unit that transfers the charges from the photoelectric conversion unit to the charge holding unit, a pixel circuit arranged on a second semiconductor substrate stacked on the surface side of the first semiconductor substrate and generating an image signal based on the held charges, a separation unit arranged on the boundary of the pixel, a buried electrode arranged embedded in the surface side of the first semiconductor substrate at the boundary of the pixel overlapping the separation unit and connected to the first semiconductor substrate, and a connection unit connected to the buried electrode. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a block diagram illustrating an example of a functional configuration of an imaging device according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a plan view showing a schematic configuration of the imaging device shown in FIG. [Figure 3] FIG. 3 is a schematic diagram illustrating a cross-sectional configuration taken along line III-III′ shown in FIG. 2. [Figure 4] FIG. 2 is an equivalent circuit diagram illustrating an example of a configuration of a pixel sharing unit according to an embodiment of the present disclosure. [Figure 5] 1 is a cross-sectional view illustrating an example of the configuration of an imaging device according to an embodiment of the present disclosure. [Figure 6] FIG. 10 is a cross-sectional view showing another configuration example of an imaging device according to an embodiment of the present disclosure. [Figure 7] FIG. 10 is a cross-sectional view showing another configuration example of an imaging device according to an embodiment of the present disclosure. [Figure 8] FIG. 2 is a diagram illustrating an example of the configuration of a pixel sharing unit according to the first embodiment of the present disclosure. [Figure 9] FIG. 2 is a diagram illustrating an example of the configuration of a pixel according to the first embodiment of the present disclosure. [Figure 10A] 3A to 3C are diagrams illustrating an example of a method for manufacturing an imaging element according to the first embodiment of the present disclosure. [Figure 10B] 3A to 3C are diagrams illustrating an example of a method for manufacturing an imaging element according to the first embodiment of the present disclosure. [Figure 10C] 3A to 3C are diagrams illustrating an example of a method for manufacturing an imaging element according to the first embodiment of the present disclosure. [Figure 10D] 3A to 3C are diagrams illustrating an example of a method for manufacturing an imaging element according to the first embodiment of the present disclosure. [Figure 10E] 3A to 3C are diagrams illustrating an example of a method for manufacturing an imaging element according to the first embodiment of the present disclosure. [Figure 10F] 3A to 3C are diagrams illustrating an example of a method for manufacturing an imaging element according to the first embodiment of the present disclosure. [Figure 10G] 3A to 3C are diagrams illustrating an example of a method for manufacturing an imaging element according to the first embodiment of the present disclosure. [Figure 10H] 3A to 3C are diagrams illustrating an example of a method for manufacturing an imaging element according to the first embodiment of the present disclosure. [Figure 10I] 3A to 3C are diagrams illustrating an example of a method for manufacturing an imaging element according to the first embodiment of the present disclosure. [Figure 11] FIG. 4 is a diagram illustrating another configuration example of a pixel sharing unit according to the first embodiment of the present disclosure. [Figure 12A] 4A to 4C are diagrams illustrating other configuration examples of embedded electrodes according to the first embodiment of the present disclosure. [Figure 12B] 4A to 4C are diagrams illustrating other configuration examples of embedded electrodes according to the first embodiment of the present disclosure. [Figure 13] FIG. 4 is a diagram illustrating another configuration example of a pixel sharing unit according to the first embodiment of the present disclosure. [Figure 14] FIG. 10 is a diagram illustrating an example of the configuration of a pixel sharing unit according to a second embodiment of the present disclosure. [Figure 15A] FIG. 10 is a diagram illustrating a configuration example of boundary wiring according to a second embodiment of the present disclosure. [Figure 15B] FIG. 10 is a diagram illustrating a configuration example of boundary wiring according to a second embodiment of the present disclosure. [Figure 16A] 10A to 10C are diagrams illustrating an example of a method for manufacturing a boundary wiring according to a second embodiment of the present disclosure. [Figure 16B] 10A to 10C are diagrams illustrating an example of a method for manufacturing a boundary wiring according to a second embodiment of the present disclosure. [Figure 16C] 10A to 10C are diagrams illustrating an example of a method for manufacturing a boundary wiring according to a second embodiment of the present disclosure. [Figure 16D] 10A to 10C are diagrams illustrating an example of a method for manufacturing a boundary wiring according to a second embodiment of the present disclosure. [Figure 16E] 10A to 10C are diagrams illustrating an example of a method for manufacturing a boundary wiring according to a second embodiment of the present disclosure. [Figure 17A] FIG. 10 is a diagram illustrating another example of the configuration of boundary wiring according to the second embodiment of the present disclosure. [Figure 17B] FIG. 10 is a diagram illustrating another example of the configuration of boundary wiring according to the second embodiment of the present disclosure. [Figure 18A] 10A to 10C are diagrams illustrating an example of another method for manufacturing a boundary wiring according to the second embodiment of the present disclosure. [Figure 18B] 10A to 10C are diagrams illustrating an example of another method for manufacturing a boundary wiring according to the second embodiment of the present disclosure. [Figure 18C] 10A to 10C are diagrams illustrating an example of another method for manufacturing a boundary wiring according to the second embodiment of the present disclosure. [Figure 18D] 10A to 10C are diagrams illustrating an example of another method for manufacturing a boundary wiring according to the second embodiment of the present disclosure. [Figure 18E] 10A to 10C are diagrams illustrating an example of another method for manufacturing a boundary wiring according to the second embodiment of the present disclosure. [Figure 18F]10A to 10C are diagrams illustrating an example of another method for manufacturing a boundary wiring according to the second embodiment of the present disclosure. [Figure 18G] 10A to 10C are diagrams illustrating an example of another method for manufacturing a boundary wiring according to the second embodiment of the present disclosure. [Figure 19] FIG. 10 is a diagram illustrating another exemplary configuration of a pixel sharing unit according to the second embodiment of the present disclosure. [Figure 20A] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a third embodiment of the present disclosure. [Figure 20B] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a third embodiment of the present disclosure. [Figure 20C] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a third embodiment of the present disclosure. [Figure 21] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a third embodiment of the present disclosure. [Figure 22] FIG. 11 is a diagram showing a comparison result of a pixel array unit according to the third embodiment of the present disclosure. [Figure 23A] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a fourth embodiment of the present disclosure. [Figure 23B] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a fourth embodiment of the present disclosure. [Figure 23C] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a fourth embodiment of the present disclosure. [Figure 24] FIG. 10 is a diagram showing a comparison result of a pixel array unit according to the fourth embodiment of the present disclosure. [Figure 25A] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a fifth embodiment of the present disclosure. [Figure 25B] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a fifth embodiment of the present disclosure. [Figure 25C] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a fifth embodiment of the present disclosure. [Figure 25D] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a fifth embodiment of the present disclosure. [Figure 25E] FIG. 10 is a diagram illustrating an example of the configuration of a pixel array unit according to a fifth embodiment of the present disclosure. [Figure 26]FIG. 13 is a diagram showing a comparison result of a pixel array unit according to the fifth embodiment of the present disclosure. [Figure 27A] FIG. 13 is a diagram illustrating an example of the configuration of a pixel array unit according to a sixth embodiment of the present disclosure. [Figure 27B] FIG. 13 is a diagram illustrating an example of the configuration of a pixel array unit according to a sixth embodiment of the present disclosure. [Figure 27C] FIG. 13 is a diagram illustrating an example of the configuration of a pixel array unit according to a sixth embodiment of the present disclosure. [Figure 27D] FIG. 13 is a diagram illustrating an example of the configuration of a pixel array unit according to a sixth embodiment of the present disclosure. [Figure 27E] FIG. 13 is a diagram illustrating an example of the configuration of a pixel array unit according to a sixth embodiment of the present disclosure. [Figure 27F] FIG. 13 is a diagram illustrating an example of the configuration of a pixel array unit according to a sixth embodiment of the present disclosure. [Figure 28] FIG. 13 is a diagram showing a comparison result of a pixel array unit according to the sixth embodiment of the present disclosure. [Figure 29A] FIG. 13 is a diagram illustrating a configuration example of a separation unit according to a seventh embodiment of the present disclosure. [Figure 29B] FIG. 13 is a diagram illustrating a configuration example of a separation unit according to a seventh embodiment of the present disclosure. [Figure 30] FIG. 19 is a diagram illustrating an example of the configuration of a pixel sharing unit according to an eighth embodiment of the present disclosure. [Figure 31] FIG. 13 is a diagram illustrating an example of the configuration of a pixel according to an eighth embodiment of the present disclosure. [Figure 32] FIG. 13 is a diagram illustrating an example of the configuration of a pixel sharing unit according to a ninth embodiment of the present disclosure. [Figure 33] FIG. 13 is a diagram illustrating an example of the configuration of a pixel according to a ninth embodiment of the present disclosure. [Figure 34A] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34B] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34C] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34D]13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34E] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34F] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34G] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34H] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34I] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34J] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34K] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34L] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 34M] 13A to 13C are diagrams illustrating an example of a method for manufacturing an imaging element according to a ninth embodiment of the present disclosure. [Figure 35] FIG. 13 is a diagram illustrating a first modified example of the configuration of a charge transfer section according to a ninth embodiment of the present disclosure. [Figure 36A] FIG. 13 is a diagram illustrating a second modified example of the configuration of the charge transfer section according to the ninth embodiment of the present disclosure. [Figure 36B] FIG. 13 is a diagram illustrating a second modified example of the configuration of the charge transfer section according to the ninth embodiment of the present disclosure. [Figure 36C] FIG. 13 is a diagram illustrating a second modified example of the configuration of the charge transfer section according to the ninth embodiment of the present disclosure. [Figure 36D] FIG. 13 is a diagram illustrating a second modified example of the configuration of the charge transfer section according to the ninth embodiment of the present disclosure. [Figure 36E] FIG. 13 is a diagram illustrating a second modified example of the configuration of the charge transfer section according to the ninth embodiment of the present disclosure. [Figure 37]FIG. 23 is a diagram illustrating an example of the configuration of a pixel sharing unit according to a tenth embodiment of the present disclosure. [Figure 38] FIG. 1 is a diagram illustrating an example of a schematic configuration of an imaging system including an imaging device according to the above embodiment and its modified example. [Figure 39] FIG. 10 is a diagram illustrating an example of a flowchart of an imaging operation in the imaging system. [Figure 40] 1 is a block diagram illustrating a schematic configuration example of a vehicle control system that is an example of a mobile object control system to which the technology according to the present disclosure can be applied. [Figure 41] FIG. 12 is a diagram showing an example of the installation position of the imaging unit 12031. [Figure 42] 1 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure (the present technology) can be applied. [Figure 43] 43 is a block diagram showing an example of the functional configuration of the camera head 11102 and the CCU 11201 shown in FIG. 42. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be given in the following order. In the following embodiments, the same components are designated by the same reference numerals, and redundant description will be omitted. 1. First embodiment 2. Second embodiment 3. Third embodiment 4. Fourth Embodiment 5. Fifth Embodiment 6. Sixth Embodiment 7. Seventh Embodiment 8. Eighth Embodiment 9. Ninth embodiment 10. Tenth embodiment 11. Application Examples 12. Mobile application examples 13. Application example to endoscopic surgery system

[0010] (1. First embodiment) [Functional configuration of imaging device 1] FIG. 1 is a block diagram showing an example of a functional configuration of an imaging device (imaging device 1) according to an embodiment of the present disclosure.

[0011] The imaging device 1 in FIG. 1 includes, for example, an input section 510A, a row driver section 520, a timing control section 530, a pixel array section 540, a column signal processing section 550, an image signal processing section 560, and an output section 510B.

[0012] In the pixel array section 540, pixels 541 are repeatedly arranged in an array. More specifically, pixel-sharing units 539 each including a plurality of pixels are repeating units, and these repeating units are repeatedly arranged in an array having a row direction and a column direction. Note that, for convenience, the row direction may be referred to as the H direction, and the column direction perpendicular to the row direction may be referred to as the V direction in this specification. In the example of FIG. 1, one pixel-sharing unit 539 includes four pixels (pixels 541A, 541B, 541C, and 541D). Each of the pixels 541A, 541B, 541C, and 541D has a photoelectric conversion unit 101 (shown in FIG. 8, etc., described later). The pixel-sharing unit 539 is a unit that shares one pixel circuit (pixel circuit 210 in FIG. 3, described later). In other words, four pixels (pixels 541A, 541B, 541C, and 541D) have one pixel circuit (pixel circuit 210, described later). By operating this pixel circuit in a time-division manner, pixel signals from the pixels 541A, 541B, 541C, and 541D are sequentially read out. The pixels 541A, 541B, 541C, and 541D are arranged, for example, in two rows and two columns. The pixel array section 540 is provided with the pixels 541A, 541B, 541C, and 541D, as well as a plurality of row drive signal lines 542 and a plurality of vertical signal lines (column readout lines) 543. The row drive signal line 542 drives the pixels 541 included in each of a plurality of pixel-sharing units 539 arranged side by side in the row direction in the pixel array section 540. The row drive signal line 542 drives each pixel of the pixel-sharing unit 539 arranged side by side in the row direction. As will be described in detail later with reference to FIG. 4, the pixel-sharing unit 539 is provided with a plurality of transistors. To drive each of these transistors, a plurality of row drive signal lines 542 are connected to one pixel-sharing unit 539. The pixel sharing unit 539 is connected to the vertical signal line (column readout line) 543. Pixel signals are read out via the vertical signal line (column readout line) 543 from each of the pixels 541A, 541B, 541C, and 541D included in the pixel sharing unit 539.

[0013] The row driver 520 includes, for example, a row address control section that determines the position of the row for pixel driving, in other words, a row decoder section, and a row driver circuit section that generates signals for driving the pixels 541A, 541B, 541C, and 541D.

[0014] The column signal processing unit 550 includes, for example, a load circuit unit that is connected to the vertical signal line 543 and forms a source follower circuit together with the pixels 541A, 541B, 541C, and 541D (pixel-shared units 539). The column signal processing unit 550 may include an amplifier circuit unit that amplifies the signal read out from the pixel-shared units 539 via the vertical signal line 543. The column signal processing unit 550 may include a noise processing unit. The noise processing unit removes the system noise level from the signal read out from the pixel-shared units 539 as a result of photoelectric conversion, for example.

[0015] The column signal processing unit 550 includes, for example, an analog-to-digital converter (ADC). The analog-to-digital converter converts the signal read from the pixel shared unit 539 or the analog signal that has undergone the noise processing into a digital signal. The ADC includes, for example, a comparator unit and a counter unit. The comparator unit compares the analog signal to be converted with a reference signal to be compared with the analog signal. The counter unit measures the time until the comparison result in the comparator unit is inverted. The column signal processing unit 550 may also include a horizontal scanning circuit unit that controls scanning of the readout columns.

[0016] The timing control section 530 supplies signals for controlling timing to the row driving section 520 and the column signal processing section 550 based on the reference clock signal and timing control signal input to the device.

[0017] The image signal processing unit 560 is a circuit that performs various signal processing operations on data obtained as a result of photoelectric conversion, in other words, data obtained as a result of the imaging operation in the imaging device 1. The image signal processing unit 560 includes, for example, an image signal processing circuit unit and a data holding unit. The image signal processing unit 560 may also include a processor unit.

[0018] One example of signal processing executed by the image signal processing unit 560 is tone curve correction processing, which increases the gradation of AD converted imaging data when the data is of a dark subject, and decreases the gradation when the data is of a bright subject. In this case, it is desirable to store in advance in the data storage unit of the image signal processing unit 560 characteristic data of the tone curve based on which the gradation of the imaging data is to be corrected.

[0019] The input unit 510A is for inputting, for example, the above-mentioned reference clock signal, timing control signal, characteristic data, etc. from outside the device to the imaging device 1. The timing control signal is, for example, a vertical synchronization signal and a horizontal synchronization signal. The characteristic data is, for example, for storage in a data holding unit of the image signal processing unit 560. The input unit 510A includes, for example, an input terminal 511, an input circuit unit 512, an input amplitude changing unit 513, an input data conversion circuit unit 514, and a power supply unit (not shown).

[0020] The input terminal 511 is an external terminal for inputting data. The input circuit unit 512 is for inputting a signal input to the input terminal 511 into the imaging device 1. The input amplitude change unit 513 changes the amplitude of the signal input by the input circuit unit 512 to an amplitude that is easily usable inside the imaging device 1. The input data conversion circuit unit 514 changes the arrangement of the data string of the input data. The input data conversion circuit unit 514 is configured, for example, by a serial-parallel conversion circuit. This serial-parallel conversion circuit converts a serial signal received as input data into a parallel signal. Note that the input amplitude change unit 513 and the input data conversion circuit unit 514 may be omitted from the input unit 510A. The power supply unit supplies power set to various voltages required inside the imaging device 1 based on power supplied from an external source to the imaging device 1.

[0021] When the imaging device 1 is connected to an external memory device, the input unit 510A may be provided with a memory interface circuit that receives data from the external memory device, such as a flash memory, an SRAM, or a DRAM.

[0022] Output unit 510B outputs image data to the outside of the device. This image data is, for example, image data captured by imaging device 1 and image data that has been signal-processed by image signal processing unit 560. Output unit 510B includes, for example, output data conversion circuit unit 515, output amplitude change unit 516, output circuit unit 517, and output terminal 518.

[0023] The output data conversion circuit unit 515 is configured with, for example, a parallel-serial conversion circuit, and converts parallel signals used inside the imaging device 1 into serial signals. The output amplitude change unit 516 changes the amplitude of the signals used inside the imaging device 1. Signals with changed amplitudes are easier to use in external devices connected to the outside of the imaging device 1. The output circuit unit 517 is a circuit that outputs data from inside the imaging device 1 to outside the device, and the output circuit unit 517 drives wiring outside the imaging device 1 connected to an output terminal 518. Data is output from the imaging device 1 to outside the device through the output terminal 518. The output data conversion circuit unit 515 and the output amplitude change unit 516 may be omitted from the output unit 510B.

[0024] When the imaging device 1 is connected to an external memory device, the output unit 510B may be provided with a memory interface circuit that outputs data to the external memory device, such as a flash memory, an SRAM, or a DRAM.

[0025] [Schematic configuration of imaging device 1] 2 and 3 show an example of a schematic configuration of the imaging device 1. The imaging device 1 includes three substrates (a first substrate 100, a second substrate 200, and a third substrate 300). FIG. 2 shows a schematic planar configuration of each of the first substrate 100, the second substrate 200, and the third substrate 300, and FIG. 3 shows a schematic cross-sectional configuration of the first substrate 100, the second substrate 200, and the third substrate 300 stacked on top of each other. FIG. 3 corresponds to the cross-sectional configuration taken along line III-III′ shown in FIG. 2. The imaging device 1 is a three-dimensional imaging device formed by bonding together three substrates (the first substrate 100, the second substrate 200, and the third substrate 300). The first substrate 100 includes a semiconductor layer 100S and a wiring layer 100T. The second substrate 200 includes a semiconductor layer 200S and a wiring layer 200T. The third substrate 300 includes a semiconductor layer 300S and a wiring layer 300T. Here, for convenience, the combination of the wiring included in each of the first substrate 100, the second substrate 200, and the third substrate 300 and the surrounding interlayer insulating film is referred to as the wiring layer (100T, 200T, 300T) provided on each substrate (first substrate 100, second substrate 200, and third substrate 300). The first substrate 100, the second substrate 200, and the third substrate 300 are stacked in this order, with the semiconductor layer 100S, the wiring layer 100T, the semiconductor layer 200S, the wiring layer 200T, the wiring layer 300T, and the semiconductor layer 300S arranged in this order along the stacking direction. The specific configurations of the first substrate 100, the second substrate 200, and the third substrate 300 will be described later. The arrows in FIG. 3 indicate the direction of incidence of light L into the imaging device 1. For convenience, in the following cross-sectional views, the light incident side of the imaging device 1 may be referred to as "bottom," "lower side," or "bottom," and the side opposite the light incident side may be referred to as "top," "upper side," or "upper." Furthermore, for convenience, in the present specification, with respect to a substrate having a semiconductor layer and a wiring layer, the wiring layer side may be referred to as the front surface, and the semiconductor layer side may be referred to as the back surface. The description in the specification is not limited to the above terms. The imaging device 1 is, for example, a back-illuminated imaging device in which light is incident from the back surface side of the first substrate 100 having a photodiode.

[0026] The pixel array section 540 and the pixel-shared unit 539 included in the pixel array section 540 are both configured using both the first substrate 100 and the second substrate 200. The first substrate 100 is provided with a plurality of pixels 541A, 541B, 541C, and 541D included in the pixel-shared unit 539. Each of these pixels 541A, 541B, 541C, and 541D has a photodiode (a photoelectric conversion section 101 described below) and a transfer transistor (a charge transfer section 102 described below). The second substrate 200 is provided with a pixel circuit (a pixel circuit 210 described below) included in the pixel-shared unit 539. The pixel circuit reads pixel signals transferred from the photodiodes of the pixels 541A, 541B, 541C, and 541D via the transfer transistors or resets the photodiodes. In addition to these pixel circuits, the second substrate 200 also has a plurality of row drive signal lines 542 extending in the row direction and a plurality of vertical signal lines 543 extending in the column direction. The second substrate 200 further includes power lines 544 extending in the row direction. The third substrate 300 includes, for example, an input section 510A, a row driver 520, a timing control section 530, a column signal processing section 550, an image signal processing section 560, and an output section 510B. The row driver 520 is provided, for example, in a region that partially overlaps with the pixel array section 540 in the stacking direction (hereinafter simply referred to as the stacking direction) of the first substrate 100, the second substrate 200, and the third substrate 300. More specifically, the row driver 520 is provided, in the stacking direction, in a region that partially overlaps with the pixel array section 540 near an end of the pixel array section 540 in the H direction ( FIG. 2 ). The column signal processing section 550 is provided, for example, in a region that partially overlaps with the pixel array section 540 in the stacking direction. More specifically, the column signal processing unit 550 is provided in a region overlapping the vicinity of an end of the pixel array unit 540 in the V direction in the stacking direction (FIG. 2). Although not shown, the input unit 510A and the output unit 510B may be provided in a portion other than the third substrate 300, for example, on the second substrate 200. Alternatively, the input unit 510A and the output unit 510B may be provided on the back surface (light incident surface) side of the first substrate 100.The pixel circuits provided on the second substrate 200 may also be called pixel transistor circuits, pixel transistor groups, pixel transistors, pixel readout circuits, or readout circuits. In this specification, the term pixel circuits is used.

[0027] The first substrate 100 and the second substrate 200 are electrically connected by, for example, through electrodes (through electrodes 252, 253A, and 253B in FIG. 8 described below). The second substrate 200 and the third substrate 300 are electrically connected by, for example, contact portions 201, 202, 301, and 302. The second substrate 200 is provided with contact portions 201 and 202, and the third substrate 300 is provided with contact portions 301 and 302. The contact portion 201 of the second substrate 200 contacts the contact portion 301 of the third substrate 300, and the contact portion 202 of the second substrate 200 contacts the contact portion 302 of the third substrate 300. The second substrate 200 has a contact region 201R in which a plurality of contact portions 201 are provided, and a contact region 202R in which a plurality of contact portions 202 are provided. The third substrate 300 has a contact region 301R in which a plurality of contact portions 301 are provided and a contact region 302R in which a plurality of contact portions 302 are provided. The contact regions 201R and 301R are provided between the pixel array section 540 and the row driver section 520 in the stacking direction (FIG. 3). In other words, the contact regions 201R and 301R are provided, for example, in a region where the row driver section 520 (third substrate 300) and the pixel array section 540 (second substrate 200) overlap in the stacking direction, or in a region nearby this. The contact regions 201R and 301R are disposed, for example, at the end of such a region in the H direction (FIG. 2). The third substrate 300 has the contact region 301R provided, for example, at a position overlapping with a part of the row driver section 520, specifically, the end of the row driver section 520 in the H direction (FIGS. 2 and 3). The contact sections 201 and 301 connect, for example, a row drive section 520 provided on the third substrate 300 and a row drive signal line 542 provided on the second substrate 200. The contact sections 201 and 301 may connect, for example, an input section 510A provided on the third substrate 300 with a power supply line 544 and a reference potential line (a ground line, described below). The contact regions 202R and 302R are provided between the pixel array section 540 and the column signal processing section 550 in the stacking direction (FIG. 3).In other words, the contact regions 202R and 302R are provided, for example, in a region where the column signal processing unit 550 (third substrate 300) and the pixel array unit 540 (second substrate 200) overlap in the stacking direction, or in a region nearby this. The contact regions 202R and 302R are arranged, for example, at the end of such a region in the V direction ( FIG. 2 ). On the third substrate 300, for example, a contact region 301R is provided in a position overlapping with a part of the column signal processing unit 550, specifically, the end of the column signal processing unit 550 in the V direction ( FIGS. 2 and 3 ). The contact regions 202 and 302 are used to connect pixel signals (signals corresponding to the amount of charge generated as a result of photoelectric conversion in the photodiodes) output from each of the multiple pixel sharing units 539 included in the pixel array unit 540 to the column signal processing unit 550 provided on the third substrate 300. The pixel signals are sent from the second substrate 200 to the third substrate 300 .

[0028] As described above, FIG. 3 is an example cross-sectional view of the imaging device 1. The first substrate 100, the second substrate 200, and the third substrate 300 are electrically connected via wiring layers 100T, 200T, and 300T. For example, the imaging device 1 has an electrical connection portion that electrically connects the second substrate 200 and the third substrate 300. Specifically, the contact portions 201, 202, 301, and 302 are formed by electrodes made of a conductive material. The conductive material is formed of a metal material such as copper (Cu), aluminum (Al), or gold (Au). The contact regions 201R, 202R, 301R, and 302R electrically connect the second substrate and the third substrate by directly bonding wiring formed as electrodes, for example, thereby enabling input and / or output of signals between the second substrate 200 and the third substrate 300.

[0029] The electrical connection portion that electrically connects the second substrate 200 and the third substrate 300 can be provided in a desired location. For example, as described as contact regions 201R, 202R, 301R, and 302R in FIG. 3, the electrical connection portion may be provided in a region that overlaps with the pixel array section 540 in the stacking direction. Alternatively, the electrical connection portion may be provided in a region that does not overlap with the pixel array section 540 in the stacking direction. Specifically, the electrical connection portion may be provided in a region that overlaps with a peripheral portion disposed outside the pixel array section 540 in the stacking direction.

[0030] The first substrate 100 and the second substrate 200 are provided with, for example, connection holes H1 and H2. The connection holes H1 and H2 penetrate the first substrate 100 and the second substrate 200 (FIG. 3). The connection holes H1 and H2 are provided outside the pixel array section 540 (or a portion overlapping the pixel array section 540) (FIG. 2). For example, the connection hole H1 is disposed outside the pixel array section 540 in the H direction, and the connection hole H2 is disposed outside the pixel array section 540 in the V direction. For example, the connection hole H1 reaches the input section 510A provided on the third substrate 300, and the connection hole H2 reaches the output section 510B provided on the third substrate 300. The connection holes H1 and H2 may be hollow or may contain a conductive material at least in part. For example, there is a configuration in which a bonding wire is connected to an electrode formed as the input portion 510A and / or the output portion 510B. Alternatively, there is a configuration in which an electrode formed as the input portion 510A and / or the output portion 510B is connected to a conductive material provided in the connection holes H1 and H2. The conductive material provided in the connection holes H1 and H2 may be embedded in part or all of the connection holes H1 and H2, or the conductive material may be formed on the side walls of the connection holes H1 and H2.

[0031] 3 shows a structure in which the input unit 510A and the output unit 510B are provided on the third substrate 300, but the present invention is not limited to this. For example, the input unit 510A and / or the output unit 510B can be provided on the second substrate 200 by sending signals from the third substrate 300 to the second substrate 200 via the wiring layers 200T and 300T. Similarly, the input unit 510A and / or the output unit 510B can be provided on the first substrate 100 by sending signals from the second substrate 200 to the first substrate 1000 via the wiring layers 100T and 200T.

[0032] The imaging device 1 and the pixel array section 540 are an example of an imaging element described in the claims.

[0033] 4 is an equivalent circuit diagram showing an example of the configuration of a pixel-shared unit. The pixel-shared unit 539 includes a plurality of pixels 541 (four pixels 541A, 541B, 541C, and 541D are shown in FIG. 4), one pixel circuit 210 connected to the plurality of pixels 541, and a vertical signal line 543 connected to the pixel circuit 210. The pixel circuit 210 includes, for example, four transistors, specifically, an amplification transistor 213, a selection transistor 214, a reset transistor 211, and a capacitance switching transistor 212. As described above, the pixel-shared unit 539 is configured to sequentially output pixel signals of the four pixels 541 (pixels 541A, 541B, 541C, and 541D) included in the pixel-shared unit 539 to the vertical signal line 543 by operating one pixel circuit 210 in a time-division manner. A state in which one pixel circuit 210 is connected to multiple pixels 541 and the pixel signals of these multiple pixels 541 are output in a time-division manner by one pixel circuit 210 is said to be "multiple pixels 541 sharing one pixel circuit 210."

[0034] The pixels 541A, 541B, 541C and 541D have common components.

[0035] The pixels 541A, 541B, 541C, and 541D each include, for example, a photoelectric conversion unit 101, a charge transfer unit 102 electrically connected to the photoelectric conversion unit 101, and a charge retention unit 103 electrically connected to the charge transfer unit 102. In the photoelectric conversion unit 101 (photoelectric conversion units 101A, 101B, 101C, and 101D), the cathode is electrically connected to the source of the charge transfer unit 102, and the anode is electrically connected to a reference potential line (e.g., a ground line). The photoelectric conversion unit 101 photoelectrically converts incident light and generates charges according to the amount of light received. The charge transfer units 102 (charge transfer units 102A, 102B, 102C, and 102D) are, for example, n-channel MOS transistors. In the charge transfer unit 102, the drain is electrically connected to the charge retention unit 103, and the gate is electrically connected to drive signal lines (signal lines TG1, TG2, TG3, and TG4). These drive signal lines are part of the multiple row drive signal lines 542 (see FIG. 1) connected to one pixel shared unit 539. The charge transfer unit 102 transfers the charges generated in the photoelectric conversion unit 101 to the charge retention unit 103. The charge retention units 103 (charge retention units 103A, 103B, 103C, and 103D) are n-type diffusion layer regions formed in a p-type semiconductor layer. Such charge retention units 103 are called floating diffusions (FD). The charge retention units 103 are charge retention means that temporarily retain the charges transferred from the photoelectric conversion unit 101, and are charge-voltage conversion means that generate a voltage corresponding to the amount of charge.

[0036] The four charge retention units 103 (charge retention units 103A, 103B, 103C, and 103D) included in one pixel shared unit 539 are electrically connected to each other and to the gate of the amplification transistor 213 and the source of the capacitance switching transistor 212. The drain of the capacitance switching transistor 212 is connected to the source of the reset transistor 211, and the gate of the capacitance switching transistor 212 is connected to a drive signal line FDG. This drive signal line FDG is one of multiple row drive signal lines 542 connected to one pixel shared unit 539. The drain of the reset transistor 211 is connected to a power supply line Vdd, and the gate of the reset transistor 211 is connected to a drive signal line RST. This drive signal line RST is one of multiple row drive signal lines 542 connected to one pixel shared unit 539. The gate of the amplification transistor 213 is connected to the charge retention unit 103, the drain of the amplification transistor 213 is connected to the power supply line Vdd, and the source of the amplification transistor 213 is connected to the drain of the selection transistor 214. The source of the selection transistor 214 is connected to a vertical signal line 543, and the gate of the selection transistor 214 is connected to a drive signal line SEL. This drive signal line SEL is one of the multiple row drive signal lines 542 connected to one pixel sharing unit 539.

[0037] When the charge transfer unit 102 is turned on, it transfers the charges in the photoelectric conversion unit 101 to the charge holding unit 103. The gate (transfer gate) of the charge transfer unit 102 includes, for example, a so-called vertical electrode, and as shown in FIG. 8 (described later), is provided extending from the surface of the semiconductor layer (semiconductor layer 100S in FIG. 8 (described later)) to a depth reaching the photoelectric conversion unit 101. The reset transistor 211 resets the potential of the charge holding unit 103 to a predetermined potential. When the reset transistor 211 is turned on, it resets the potential of the charge holding unit 103 to the potential of the power supply line Vdd. The selection transistor 214 controls the output timing of the pixel signal from the pixel circuit 210. The amplification transistor 213 generates, as the pixel signal, a signal with a voltage corresponding to the level of the charges held in the charge holding unit 103. The amplification transistor 213 is connected to a vertical signal line 543 via the selection transistor 214. In the column signal processing unit 550, the amplification transistor 213 configures a source follower together with a load circuit unit (see FIG. 1) connected to a vertical signal line 543. When the selection transistor 214 is turned on, the amplification transistor 213 outputs the voltage of the charge holding unit 103 to the column signal processing unit 550 via the vertical signal line 543. The reset transistor 211, the amplification transistor 213, and the selection transistor 214 are, for example, n-channel MOS transistors.

[0038] The capacitance switching transistor 212 is used to change the gain of charge-to-voltage conversion in the charge holding unit 103. Generally, pixel signals are small when capturing images in dark locations. Based on Q=CV, when performing charge-to-voltage conversion, if the capacitance of the charge holding unit 103 (capacity C of the FD) is large, V when converted to a voltage by the amplification transistor 213 will be small. On the other hand, in bright locations, pixel signals are large, so if the capacitance C of the FD is not large, the charge holding unit 103 cannot fully receive the charge from the photoelectric conversion unit 101. Furthermore, the capacitance C of the FD needs to be large so that V when converted to a voltage by the amplification transistor 213 does not become too large (in other words, so that it becomes small). Taking these factors into consideration, when the capacitance switching transistor 212 is turned on, the gate capacitance of the capacitance switching transistor 212 increases, increasing the overall capacitance C of the FD. On the other hand, when the capacitance switching transistor 212 is turned off, the overall capacitance C of the FD decreases. In this way, by switching the capacitance switching transistor 212 on and off, the capacitance C of the FD can be varied, thereby changing the conversion efficiency. The capacitance switching transistor 212 is, for example, an n-channel MOS transistor.

[0039] It is also possible to configure the pixel circuit 210 without the capacitance switching transistor 212. In this case, for example, the pixel circuit 210 is configured with three transistors, for example, an amplification transistor 213, a selection transistor 214, and a reset transistor 211. The pixel circuit 210 has at least one pixel transistor, for example, the amplification transistor 213, the selection transistor 214, the reset transistor 211, and the capacitance switching transistor 212.

[0040] The selection transistor 214 may be provided between the power supply line Vdd and the amplification transistor 213. In this case, the drain of the reset transistor 211 is electrically connected to the power supply line Vdd and the drain of the selection transistor 214. The source of the selection transistor 214 is electrically connected to the drain of the amplification transistor 213, and the gate of the selection transistor 214 is electrically connected to a row drive signal line 542 (see FIG. 1). The source of the amplification transistor 213 (the output terminal of the pixel circuit 210) is electrically connected to a vertical signal line 543, and the gate of the amplification transistor 213 is electrically connected to the source of the reset transistor 211. Although not shown in the figure, the number of pixels 541 sharing one pixel circuit 210 may be other than four. For example, two or eight pixels 541 may share one pixel circuit 210.

[0041] [Cross-sectional structure of the imaging device] FIG. 5 is a cross-sectional view showing an example of the configuration of an imaging device according to an embodiment of the present disclosure. The figure is a cross-sectional view showing an outline of the imaging device 1. The imaging device 1 in the figure includes a first substrate 100, a second substrate 200, and a third substrate 300. As described above, the first substrate 100 includes a semiconductor layer 100S and a wiring layer 100T, the second substrate 200 includes a semiconductor layer 200S and a wiring layer 200T, and the third substrate 300 includes a semiconductor layer 300S and a wiring layer 300T. The imaging device 1 also includes a protective film 181, a color filter 182, and an on-chip lens 401. Pixels 541A and 541B are also shown in the figure.

[0042] The semiconductor layer 100S includes a first semiconductor substrate 120, an insulating film 129, and an isolation portion 171.

[0043] The first semiconductor substrate 120 is a semiconductor substrate on which the photoelectric conversion section 101 is disposed. A charge transfer section 102 and a charge retention section 103 are further disposed on the first semiconductor substrate 120 in the same figure. The same figure shows photoelectric conversion sections 101A and 101B, charge transfer sections 102A and 102B, and charge retention sections 103A and 103B. The first semiconductor substrate 120 can be made of, for example, silicon (Si). A wiring layer 100T is disposed on the front surface side of the first semiconductor substrate 120.

[0044] The insulating film 129 is a film that insulates the front surface side of the first semiconductor substrate 120. This insulating film 129 can be made of silicon oxide (SiO2) or silicon nitride (SiN).

[0045] The separation portion 171 is disposed at the boundary of the pixel 541 to separate the pixel 541. In the same figure, an example is shown in which the pixels 541A and 541B are separated by the separation portion 171. Note that embedded electrodes 161 and 162 are further disposed at the boundary of the pixel 541 in the same figure.

[0046] The wiring layer 100T includes an insulating layer 141. The insulating layer 141 insulates the gate electrodes, through electrodes 251, and the like, which are arranged on the front surface side of the first semiconductor substrate 120. This insulating layer 141 can be made of, for example, SiO2. Note that the wiring layer 100T has through electrodes 251 and 252, which will be described later, arranged therein.

[0047] The semiconductor layer 200S includes a second semiconductor substrate 220 and an insulating film 229. Furthermore, a through-hole 262 is arranged in the semiconductor layer 200S.

[0048] The second semiconductor substrate 220 is a semiconductor substrate on which the pixel circuit 210 is arranged. The reset transistor 211 and the amplification transistor 213 of the pixel circuit 210 are shown on the second semiconductor substrate 220 in the same figure. The second semiconductor substrate 220 can be made of Si, similar to the first semiconductor substrate 120. The through hole 262 is a through hole formed in the second semiconductor substrate 220 to allow the through electrode 251, etc., described later, to pass through. An insulating layer 241 is arranged in this through hole 262.

[0049] The wiring layer 200T includes an insulating layer 241, a wiring 242, a via plug 243, through electrodes 251 to 253, and contact portions 201 and 202. The wiring 242 is a conductor that transmits electrical signals to elements disposed on the second semiconductor substrate 220. The wiring 242 can be made of a metal such as copper (Cu). The insulating layer 241 insulates the wiring 242 and other elements. Like the insulating layer 141, the insulating layer 241 can be made of SiO2 or the like. The wiring 242 and insulating layer 241 can be configured in multiple layers. The diagram illustrates an example of the wiring 242 and insulating layer 241 configured in two layers. The wirings 242 disposed on different layers can be connected to each other by a via plug 243. The via plug 243 can be made of a columnar metal, for example, a columnar Cu.

[0050] The through electrodes 251 and 252 are columnar electrodes that connect the wiring 242 and a member arranged on the front surface side of the first semiconductor substrate 120. The through electrodes 251 and 252 are connected to the embedded electrodes 161 and 162, respectively. These through electrodes 252 and the like can be made of a metal such as tungsten, and can be arranged in the through hole 262.

[0051] The through electrode 251 connects the first semiconductor substrate 120 to another semiconductor substrate in order to share a reference potential. The through electrode 252 transfers the charge in the charge retention portion 103 of the first semiconductor substrate 120 to the second semiconductor substrate 220. These through electrodes 251 and 252 can be made of, for example, columnar tungsten. The through electrode 251 in the figure is connected to the third substrate 300 via the wiring 242, the via plug 243, and the contact portion 201.

[0052] As described above, the contact portions 201 and 202 are connected to the contact portions 301 and 303, respectively, of the third substrate 300. The contact portion 201 is connected to the through electrode 251 and transmits a reference potential. The contact portion 202 is used to transmit signals and the like.

[0053] The semiconductor layer 300S includes a third semiconductor substrate 320. The aforementioned image signal processing unit 560 (not shown) and the like are arranged on this third semiconductor substrate 320. A well region is also formed on the third semiconductor substrate 320. A semiconductor region 321 is arranged in this well region. The semiconductor region 321 is configured to have a relatively high impurity concentration, and a contact plug 344 is connected to the semiconductor region 321.

[0054] The wiring layer 300T includes an insulating layer 341, wiring 342, via plugs 343, contact plugs 344, and contact parts 301 and 302. These components have the same configuration as the insulating layer 241, wiring 242, via plugs 243, contact plugs 244, and contact parts 301 and 302, and therefore description thereof will be omitted.

[0055] The protective film 181 protects the back surface side of the first semiconductor substrate 120. This protective film 181 can be made of, for example, SiO2. The color filter 182 is an optical filter that is arranged for each pixel 541 and transmits light of a predetermined wavelength out of the incident light. The on-chip lens 401 is a lens that is arranged for each pixel 541 and focuses the incident light on the photoelectric conversion unit 101.

[0056] In this embodiment, the first substrate 100 and the second substrate 200 are connected via through electrodes, and the second substrate 200 and the third substrate 300 are connected via contact portions, but this is not limiting. For example, the first substrate 100 and the second substrate 200 may also be connected via contact portions.

[0057] 6 is a cross-sectional view showing another example configuration of an imaging device according to an embodiment of the present disclosure. In the second substrate 200 shown in the figure, an insulating layer 241 is also formed on the back surface of the semiconductor layer 200S, and a contact portion 249 is arranged. This contact portion 249 is connected to the contact portion 149 arranged on the first substrate 100 shown in the figure.

[0058] 7 is a cross-sectional view showing another example of the configuration of an imaging device according to an embodiment of the present disclosure. The second substrate 200 in the figure corresponds to the second substrate 200 in FIG. 6 turned upside down.

[0059] 3 and 5-7 illustrate examples in which the electrical connection portions between the first substrate 100 and the second substrate 200 and the electrical connection portions between the second substrate 200 and the third substrate 300 are arranged at positions overlapping the pixel array section 540. It is also possible to adopt a configuration in which the electrical connection portions between the first substrate 100 and the second substrate 200 and the electrical connection portions between the second substrate 200 and the third substrate 300 are arranged in regions outside the pixel array section 540. Specifically, in FIGS. 3 and 5-7, the contact portions 201, 202, 301, and 302, which are the electrical connection portions between the second substrate 200 and the third substrate 300, can also be arranged in regions outside the pixel array section 540. Similarly, in FIGS. 6 and 7, the contact portions 149 and 249, which are the electrical connection portions between the first substrate 100 and the second substrate 200, can also be arranged in regions outside the pixel array section 540.

[0060] [Pixel sharing unit configuration] 8 is a diagram showing a configuration example of a pixel sharing unit according to the first embodiment of the present disclosure. The figure is a plan view showing a configuration example of a pixel sharing unit 539 in a pixel array section 540. The figure also shows the configurations of the first substrate 100 and the second substrate 200 as seen from the second substrate 200 side.

[0061] In the figure, the open rectangular area represents the area of ​​the first semiconductor substrate 120 corresponding to the area of ​​the pixel 541. The dotted hatched area represents the semiconductor area formed on the first semiconductor substrate 120. The diagonal rectangular area represents the gate electrode of the charge transfer unit 102. The open circles represent the through electrodes 251 to 253. The dotted rectangle represents the elements of the pixel circuit 210 (the reset transistor 211, the capacitance switching transistor 212, the amplification transistor 213, and the selection transistor 214). The dotted rectangle drawn on the boundary of the pixel 541 represents the range of the pixel sharing unit 539. The two-dot chain rectangle represents the range of a pixel group 538, which will be described later.

[0062] Isolation portions 171 are arranged at the boundaries of the pixels 541. The isolation portions 171 are configured in a shape that surrounds the pixels 541. Furthermore, buried electrodes 161 and 162 are further arranged on the first semiconductor substrate 120 at the boundaries of the pixels 541. The buried electrode 161 is connected to a well region of the first semiconductor substrate 120. Note that a semiconductor region 123 is arranged on the first semiconductor substrate 120 of the pixel 541 adjacent to the buried electrode 161 in the same figure. The buried electrode 161 is connected to the well region via the semiconductor region 123. The buried electrode 162 is connected to the semiconductor region 122 that constitutes the charge retention portion 103. The buried electrodes 161 and 162 in the same figure are arranged to be buried in the first semiconductor substrate 120 adjacent to the corners of the four pixels 541.

[0063] As described above, the pixels 541A, 541B, 541C, and 541D are arranged on the first substrate 100. As shown in the figure, the pixels 541A, 541B, 541C, and 541D are arranged in two rows and two columns, and the charge retention units 103A, 103B, 103C, and 103D are arranged near the centers of these pixels. The charge transfer units 102A, 102B, 102C, and 102D and the photoelectric conversion units 101A, 101B, 101C, and 101D are arranged adjacent to these charge retention units 103A, 103B, 103C, and 103D, respectively. Note that the configuration of the pixel sharing unit 539 is not limited to this example. For example, the pixel sharing unit 539 may be configured to include a number of pixels 541 other than four.

[0064] The embedded electrode 162 is disposed in the center of the two rows and two columns of pixels 541A, 541B, 541C, and 541D. The pixels 541A, 541B, 541C, and 541D and the pixel circuit 210 on the second semiconductor substrate 220 configure a pixel-sharing unit 539. In other words, in the pixel-sharing unit 539 shown in the figure, the pixels 541A, 541B, 541C, and 541D are commonly connected to the embedded electrode 162 and the pixel circuit 210. Such pixel-sharing units 539 are arranged in a two-dimensional matrix.

[0065] On the other hand, pixel group 538 also has four pixels 541 arranged in two rows and two columns. The pixels 541 that make up pixel group 538 correspond to pixels that are shifted by one pixel in the vertical and horizontal directions of pixel sharing unit 539 in the same figure. The embedded electrode 161 is disposed in the center of the four pixels 541 arranged in two rows and two columns that make up pixel group 538. These four pixels 541 are commonly connected to the embedded electrode 161. Note that the configuration of pixel group 538 is not limited to this example. For example, pixel group 538 may be configured to have a number of pixels 541 other than four.

[0066] [Pixel configuration] 9 is a diagram showing a configuration example of a pixel according to the first embodiment of the present disclosure. The figure is a schematic cross-sectional view showing a configuration example of a pixel 541. The figure corresponds to a cross-sectional view taken along line a-a' in FIG. 8. The figure shows pixels 541A and 541B. The third semiconductor substrate 320 is also omitted from the figure.

[0067] As described above, the photoelectric conversion unit 101, the charge transfer unit 102, and the charge retention unit 103 are arranged on the first semiconductor substrate 120. In the figure, photoelectric conversion units 101A and 101B, charge transfer units 102A and 102B, and charge retention units 103A and 103B are shown. These elements are arranged in a well region formed in the first semiconductor substrate 120. For convenience, it is assumed that the first semiconductor substrate 120 in the figure constitutes a p-type well region. By arranging an n-type semiconductor region in this p-type well region, an element (diffusion layer) can be formed.

[0068] The dotted hatched area on the first semiconductor substrate 120 in the figure represents an n-type semiconductor region. The photoelectric conversion unit 101A is composed of an n-type semiconductor region 121A. Specifically, the photodiode composed of a pn junction formed at the interface between the n-type semiconductor region 121A and the surrounding p-type well region corresponds to the photoelectric conversion unit 101A. As shown in the figure, the photoelectric conversion unit 101A is formed near the back surface side of the first semiconductor substrate 120. Furthermore, a portion of the photoelectric conversion unit 101A extends near the front surface side of the first semiconductor substrate 120. Furthermore, the photoelectric conversion unit 101B is also configured in the same manner as the photoelectric conversion unit 101A.

[0069] The charge retention units 103A and 103B are respectively formed of n-type semiconductor regions 122A and 122B. These n-type semiconductor regions 122A and 122B form the FD described above. The semiconductor regions 122A and 122B are disposed adjacent to the embedded electrode 162.

[0070] The charge transfer unit 102A is composed of semiconductor regions 121A and 122A and a gate electrode 131A. The n-type semiconductor regions 121A and 122A correspond to the source region and drain region of the charge transfer unit 102A. The charge transfer unit 102A in the figure is composed of a planar or horizontal MOS transistor in which a channel is formed along the surface of the semiconductor substrate. The gate electrode 131A is disposed on the surface side of the first semiconductor substrate 120. Note that the gate electrode 131A in the figure has sidewalls. When a drive voltage is applied to this gate electrode 131A, a channel is formed in the well region adjacent to the gate electrode 131A, and conduction occurs between the n-type semiconductor regions 121A and 122A. In other words, conduction occurs between the photoelectric conversion unit 101A and the charge retention unit 103A, and the charge in the photoelectric conversion unit 101A is transferred to the charge retention unit 103A.

[0071] Similar to the charge transfer unit 102A, the charge transfer unit 102B is composed of semiconductor regions 121B and 122B and a gate electrode 131B. The gate electrodes 131A and 131B may be composed of polycrystalline silicon doped with impurities. An insulating film 129 between the gate electrodes 131A and 131B and the first semiconductor substrate 120 constitutes a gate insulating film.

[0072] The gate electrode 131A of the charge transfer unit 102A is connected to a through electrode 253. The gate electrode 131A of the charge transfer unit 102A is connected to a signal line TG1 via the through electrode 253. Similarly, the gate electrode 131B of the charge transfer unit 102B is connected to a signal line TG2 via the through electrode 253.

[0073] Furthermore, semiconductor regions 123A and 123B are arranged on the first semiconductor substrate 120. These semiconductor regions 123A and 123B are semiconductor regions arranged in a well region of the first semiconductor substrate 120, and are semiconductor regions configured to have a relatively high impurity concentration of the same conductivity type as this well region. Furthermore, the semiconductor regions 123A and 123B are arranged adjacent to the buried electrode 161. The semiconductor region 123 is an example of a high-concentration impurity region as defined in the claims.

[0074] The separation portions 171 are disposed at the boundaries of the pixels 541 to separate the pixels 541. The separation portions 171 separate adjacent pixels 541 on the first semiconductor substrate 120. The separation portions 171 can be formed, for example, by filling a groove portion 179 that penetrates from the front surface side to the back surface side of the first semiconductor substrate 120 with an insulating material such as SiO2. Also, a light-shielding member that blocks incident light can be disposed in the separation portions 171.

[0075] The embedded electrodes 161 and 162 are electrodes arranged at the boundary of the pixel 541. The embedded electrodes 161 and 162 are also arranged on the front surface side of the first semiconductor substrate 120 at positions overlapping with the isolation portion 171. The embedded electrodes 161 and 162 can be made of, for example, polycrystalline silicon into which impurities are implanted.

[0076] As described above, the buried electrode 161 is disposed adjacent to the semiconductor region 123 (semiconductor regions 123A and 123B) and is connected to the well region of the first semiconductor substrate 120. The through electrode 251 is connected to the buried electrode 161, and a reference potential (well potential) is supplied to the buried electrode 161. The semiconductor region 123 is a semiconductor region disposed to establish an ohmic connection between the buried electrode 161 and the first semiconductor substrate 120, etc., and is configured to have a relatively high impurity concentration of the same conductivity type as the well region.

[0077] The embedded electrode 162 is disposed adjacent to the semiconductor region 122 (semiconductor regions 122A and 122B) and is connected to the charge holding portion 103 (charge holding portions 103A and 103B). A through electrode 252 is connected to the embedded electrode 162. The through electrode 252 connects the charge holding portion 103 and the pixel circuit 210. The through electrodes 251 and 252 are an example of a connecting portion as defined in the claims.

[0078] The pixel circuit 210 is disposed on the second semiconductor substrate 220. The figure also shows a reset transistor 211 and an amplifier transistor 213. The reset transistor 211 and amplifier transistor 213 are disposed in a well region of the second semiconductor substrate 220. Similar to the first semiconductor substrate 120, a p-type well region is formed in the second semiconductor substrate 220. For convenience, it is assumed that the second semiconductor substrate 220 in the figure constitutes a p-type well region. The reset transistor 211 is composed of n-type semiconductor regions 221 and 222 and a gate electrode 231. The gate electrode 231 of the reset transistor 211 is connected to a signal line RST via a contact plug 244. The amplifier transistor 213 is composed of n-type semiconductor regions 223 and 224 and a gate electrode 232. The gate electrode 232 of the amplifier transistor 213 is connected to a through electrode 252 via the contact plug 244 and a wiring 242. That is, the gate electrode 232 of the amplifying transistor 213 is connected to the charge holding portions 103 A and 103 B via the contact plug 244 , the wiring 242 , the through electrode 252 and the embedded electrode 162 .

[0079] The second semiconductor substrate 220 has semiconductor regions 225A and 225B configured with a relatively high p-type impurity concentration. These p-type semiconductor regions 225A and 225B are connected to a through electrode 251 via a contact plug 244 and a wiring 242. This connects the well region of the second semiconductor substrate 220 to the well region of the first semiconductor substrate 120. A common well potential is supplied to the first semiconductor substrate 120 and the second semiconductor substrate 220. The through electrode 251 is further connected to a ground line Vss of a third semiconductor substrate 320 (not shown) via the wiring 242 and the contact plug 244. The ground potential of the third semiconductor substrate 320 is supplied to the through electrode 251 as a reference potential (well potential). A fixed potential other than the ground potential can also be applied as the reference potential.

[0080] The buried electrode 161 is disposed at the boundary of the pixel 541 and connected to the well region of the first semiconductor substrate 120 of the pixel 541. By supplying a reference potential (well potential) to this buried electrode 161, the well potential can be supplied to the first semiconductor substrate 120 of the pixel 541. The semiconductor region 123 for achieving ohmic connection can be configured in a small, dedicated area adjacent to the buried electrode 161. Furthermore, by connecting the buried electrode 161 in common to multiple pixels 541, the through electrode 251 can be shared by multiple pixels 541. This allows the number of through electrodes 251 to be reduced. Furthermore, the opening area of ​​the through hole 262 of the second semiconductor substrate 220 in which the through electrode 251 is disposed can be reduced, making it easier to arrange the elements of the pixel circuit 210 on the second semiconductor substrate 220.

[0081] On the other hand, if the embedded electrode 161 is not used, it is necessary to connect the through electrode 251 to the first semiconductor substrate 120 of the pixel 541 to supply a well potential. Specifically, the through electrode 251 is connected to the semiconductor region 123. In this case, it is necessary to arrange the semiconductor region 123 with a relatively large area. This is to reduce the occurrence of defects due to misalignment of the through electrode 251 during the manufacturing process. As a result, the area allocated to the photoelectric conversion unit 101 and the like in the pixel 541 is reduced.

[0082] Furthermore, by arranging the embedded electrode 162 at the boundary of the pixel 541 and connecting it to the charge retention portion 103 of the first semiconductor substrate 120 of the pixel 541, the area of ​​the semiconductor region 122 that constitutes the charge retention portion 103 can be reduced, similar to the semiconductor region 123 described above. Furthermore, by connecting the embedded electrode 162 in common to multiple pixels 541, the through electrode 252 can be shared by multiple pixels 541. This allows the number of through electrodes 252 to be reduced, and the opening area of ​​the through hole 262 to be reduced.

[0083] In this way, the embedded electrode 162 is disposed at a position overlapping the separation portion 171 at the boundary of the pixel 541 and is connected to the first semiconductor substrate 120 of the pixel 541. The through electrode 251 and the like that were connected to the first semiconductor substrate 120 inside the pixel 541 can be moved to the outside of the pixel 541, and the area occupied by the pixel 541 can be reduced.

[0084] The embedded electrodes 161 and 162 are configured to be embedded in a groove 179 formed in the first semiconductor substrate 120 at the boundary of the pixel 541. As a result, the embedded electrodes 161 and 162 are shaped to connect to the side surface of the first semiconductor substrate 120 adjacent to the groove 179. The connection surfaces between the embedded electrodes 161 and 162 and the first semiconductor substrate 120 are arranged in a direction perpendicular to the surface of the first semiconductor substrate 120, thereby reducing the area occupied by the embedded electrodes 161 and 162. This makes it possible to reduce the area occupied by the pixel 541. The embedding depth of the embedded electrodes 161 and the like into the first semiconductor substrate 120 ("D" in the figure) is preferably 50 nm or more. This is because the connection surfaces between the embedded electrodes 161 and 162 and the first semiconductor substrate 120 can be widened, thereby reducing the connection resistance.

[0085] On the other hand, when electrically connecting to the first semiconductor substrate 120 via an electrode disposed on the surface of the first semiconductor substrate 120, it is necessary to dispose an electrode with a relatively large area as shown in Fig. 21 (described later) in order to reduce the connection resistance between the electrode and the semiconductor region, which results in an increase in the area of ​​the pixel 541.

[0086] Furthermore, by arranging the buried electrode 162 at the boundary of the pixel 541 and configuring it to be small in size, the distance between the gate electrode 131 ("W" in the figure) can be increased. This makes it possible to reduce the parasitic capacitance between the gate electrode 131 of the charge transfer unit 102 and the charge holding unit 103. This makes it possible to improve the charge transfer efficiency of the charge transfer unit 102. Furthermore, it is preferable that the height of the gate electrode 131 ("H2" in the figure) be equal to or less than the height of the buried electrodes 161 and 162 ("H1" in the figure). This is because the parasitic capacitance between the gate electrode 131 and the buried electrodes 161 and 162 can be reduced.

[0087] [Method of manufacturing image sensor] 10A to 10I are diagrams illustrating an example of a manufacturing method for an imaging element according to the first embodiment of the present disclosure. 10A to 10I are diagrams illustrating an example of a manufacturing process for the imaging device 1, specifically, a manufacturing process related to the region of the first semiconductor substrate 120.

[0088] First, a well region and a semiconductor region 121 (not shown) are formed in the first semiconductor substrate 120. Next, a resist 601 is placed on the front surface side of the first semiconductor substrate 120. In this resist 601, openings 602 are placed at the boundary portions of the pixels 541 (FIG. 10A).

[0089] Next, the front surface side of the first semiconductor substrate 120 is etched using the resist 601 as a mask to form the grooves 179 (FIG. 10B). This can be done by, for example, dry etching.

[0090] Next, the separation portion 171 is disposed in the groove portion 179 (FIG. 10C). This can be done, for example, by forming a film of SiO2, which is the material of the separation portion 171, on the surface side of the first semiconductor substrate 120 including the groove portion 179 using CVD (Chemical Vapor Deposition), and then grinding it to the desired thickness. The SiO2 film can be ground using CMP (Chemical Mechanical Polishing).

[0091] Next, the separating portion 171 is ground to expose the side surface of the first semiconductor substrate 120 near the front surface side in the groove portion 179 (FIG. 10D). This can be done by etching the separating portion 171 using the resist 601 as a mask. For example, anisotropic dry etching can be used for this etching.

[0092] Next, the embedded electrodes 161 and 162 are disposed in the grooves 179 (FIG. 10E). This can be done, for example, by disposing polycrystalline silicon, which is the material of the embedded electrodes 161 and 162, in the grooves 179 by CVD or the like. Next, the resist 601 is removed (FIG. 10F).

[0093] Next, a gate insulating film, a gate electrode 131, and sidewalls are formed (FIG. 10G). Next, a semiconductor region 123 and the like are formed (FIG. 10H). This can be done by ion implantation. Next, an insulating film 129 is formed on the surface side of the first semiconductor substrate 120. Next, an insulating layer 141 is disposed (FIG. 10I). This can be done, for example, by depositing a film of SiO2, which is the material of the insulating layer 141, by CVD. Through the above steps, the first semiconductor substrate 120 portion of the imaging device 1 can be manufactured.

[0094] The configuration of the separation portion 171 is not limited to this example. For example, it is also possible to adopt a configuration in which the separation portion 171 is disposed in a groove portion 179 formed from the back surface side of the first semiconductor substrate 120. Furthermore, the separation portion 171 may be configured to have a depth that reaches from the front surface side of the first semiconductor substrate 120 to the vicinity of the back surface side, without penetrating the first semiconductor substrate 120.

[0095] [Other configurations of pixel sharing units] 11 is a diagram showing another configuration example of a pixel-sharing unit according to the first embodiment of the present disclosure. Similar to FIG. 8, this figure is a plan view showing a configuration example of a pixel-sharing unit 539. The pixel-sharing unit 539 in this figure differs from the pixel-sharing unit 539 in FIG. 8 in that strip-shaped embedded electrodes are arranged instead of the embedded electrodes 161.

[0096] The buried electrode 166 in the figure is a buried electrode connected to the well region of the first semiconductor substrate 120. This buried electrode 166 is configured in a strip shape and is disposed along the sides of the pixel 541, etc., which is rectangular in plan view. The buried electrode 166 in the figure represents an example configured in a shape that extends in the horizontal direction of the figure. The buried electrode 166 is connected to the well region via the semiconductor region 123. The semiconductor region 123 in the figure is configured in a strip shape that follows the buried electrode 166. By arranging such a strip-shaped buried electrode 166, the contact area between the buried electrode 166 and the well region of the semiconductor substrate 110 can be increased, and the connection resistance can be reduced.

[0097] [Other configurations of embedded electrodes] 12A and 12B are diagrams showing other configuration examples of the embedded electrode according to the first embodiment of the present disclosure. Fig. 12A is a cross-sectional view showing a configuration example of the embedded electrode 166, taken along line dd' in Fig. 11. The embedded electrode 166 in the figure shows an example in which the width is substantially the same as that of the separation portion 171.

[0098] 12B is a diagram showing an example of a buried electrode 166 configured to have a width wider than that of the separation portion 171. The buried electrode 166 in the figure is configured to have a cross section wider than that of the separation portion 171 on the surface of the semiconductor substrate 110. The buried electrode 166 in the figure also shows an example in which it is configured to have a width wider than the opening width of the insulating film 129.

[0099] Note that the method for manufacturing an imaging element is not limited to the method shown in FIGS. 10A-10I. For example, after forming the insulating film 129 shown in FIG. 10I, a groove-shaped opening may be formed in the insulating film 129 adjacent to the isolation portion 171, and a polycrystalline silicon film may be further disposed adjacent to the buried electrode 161 shown in FIG. 10I. Alternatively, after FIG. 10D, the resist 601 may be peeled off and the insulating film 129 may be formed. After removing the insulating film 129 inside the groove portion 179 and on the upper surface of the shoulder by pattern etching, a polycrystalline silicon film may be formed, and pattern etching may be performed to form the buried electrode 166. By applying these manufacturing methods, a buried electrode whose upper width is wider than the width of the isolation portion 171, such as the buried electrode 166 shown in FIG. 12B, may be formed.

[0100] 13 is a diagram showing another configuration example of a pixel-sharing unit according to the first embodiment of the present disclosure. Similar to FIG. 11, this figure is a plan view showing a configuration example of a pixel-sharing unit 539 in which strip-shaped embedded electrodes 166 are arranged. The pixel-sharing unit 539 in this figure differs from the pixel-sharing unit 539 in FIG. 11 in that pixels 541 and the like configured in a rectangular shape are arranged.

[0101] In the pixel array unit 540 shown in the figure, pixels 541A and 541C constitute phase difference pixels. These phase difference pixels can generate a phase difference signal for pupil-dividing incident light from an object to detect an image plane phase difference and an image signal based on the incident light from the object. When generating a phase difference signal, two image signals based on charges generated by photoelectric conversion in the photoelectric conversion units of pixels 541A and 541C are output as phase difference signals. On the other hand, when generating an image signal, the charges generated by photoelectric conversion in the two photoelectric conversion units are summed in the pixel, and an image signal generated based on the summed charges is output. Pixels 541B and 541D also constitute phase difference pixels, similar to pixels 541A and 541C.

[0102] Gaps are formed in the separation section 171 between the pixels 541A and 541C and between the pixels 541B and 541D. Overflow paths are formed in these gaps.

[0103] The pixels 541A and 541C constituting the phase difference pixel are provided with a common on-chip lens 401 for pupil division. Similarly, the pixels 541B and 541D are also provided with a common on-chip lens 401.

[0104] The above-described pixels 541A and 541C and pixels 541B and 541D can also be used as normal pixels that do not generate phase difference signals. Furthermore, the functions of phase difference pixels and normal pixels can be assigned to different regions of the pixel array unit 540. Specifically, some of the pixels 541A, etc. in the pixel array unit 540 can be made to function as phase difference pixels, and the other pixels 541A, etc. can be made to function as normal pixels. Furthermore, in the imaging device 1, some or all of the pixels 541A, etc. can be made to function as phase difference pixels when detecting an image plane phase difference, and the pixels 541A, etc. can be made to function as normal pixels in other cases.

[0105] In the figure, the semiconductor regions 122A to 122D that make up the FDs of the pixels 541A to 541D are shown as being elongated in the horizontal direction of the figure compared to the semiconductor regions 122A to 122D in Figure 8. The shapes of the semiconductor regions 122A to 122D are not limited to this example. For example, they may be configured to be elongated in the vertical direction of the figure or to have a symmetrical shape similar to that of Figure 8.

[0106] In this way, the imaging device 1 according to the first embodiment of the present disclosure has the embedded electrodes 161 disposed at the boundaries of the pixels 541. A reference potential is supplied to the first semiconductor substrate 120 via the embedded electrodes 161. This allows the region for supplying the reference potential to be disposed outside the pixels 541, thereby enabling the pixels 541 to be made smaller.

[0107] (2. Second Embodiment) In the imaging device 1 of the first embodiment described above, the embedded electrodes 161 are arranged in the separation portion 171 of the first semiconductor substrate 120. In contrast, the imaging device 1 of the second embodiment of the present disclosure differs from the first embodiment described above in that the embedded electrodes 161 are connected to each other.

[0108] [Pixel sharing unit configuration] 14 is a diagram showing a configuration example of a pixel-sharing unit according to the second embodiment of the present disclosure. Similar to FIG. 8, this figure is a plan view showing a configuration example of a pixel-sharing unit 539. The pixel-sharing unit 539 in this figure differs from the pixel-sharing unit 539 in FIG. 8 in that it includes boundary wiring 163 that connects the embedded electrodes 161 to each other.

[0109] The boundary wiring 163 is a wiring connected to the buried electrodes 161 arranged at the boundary of the pixels 541. The boundary wiring 163 in the figure shows an example in which the boundary wiring 163 is configured to be embedded in the first semiconductor substrate 120. Specifically, the boundary wiring 163 in the figure is configured to be embedded in the isolation portion 171. The boundary wiring 163 can be made of, for example, polycrystalline silicon doped with impurities. By arranging the boundary wiring 163 to connect the buried electrodes 161, the reference potential (well potential) can be made common between adjacent buried electrodes 161. The potential difference in the well potential between different pixels 541 can be reduced. Furthermore, by arranging the boundary wiring 163 to share the well potential of the pixels 541, the number of through electrodes 251 can be reduced. Note that the figure shows an example in which the boundary wiring 163 is arranged between buried electrodes 161 adjacent in one direction (the horizontal direction in the figure).

[0110] The boundary wiring 163 may be disposed between the buried electrodes 162 to connect the buried electrodes 161. In this case, the boundary wiring 163 connects the adjacent charge holding portions 103 to each other.

[0111] [Boundary Wiring Configuration] 15A and 15B are diagrams illustrating an example of the configuration of the boundary wiring according to the second embodiment of the present disclosure. FIGS. 15A and 15B respectively illustrate an example of the cross-section of the boundary wiring 163 taken along lines b-b' and c-c' in FIG. 14. The boundary wiring 163 in FIG. 15A is connected to the side of the embedded electrode 161 (FIG. 15A). The boundary wiring 163 in FIG. 15B is configured such that its upper surface is exposed on the surface side of the first semiconductor substrate 120 (FIG. 15B). As illustrated in FIG. 15B, the boundary wiring 163 in FIG. 15B can be configured to be separated from the first semiconductor substrate 120. The width of the separation portion 171 between the boundary wiring 163 and the first semiconductor substrate 120 ("W2" in FIG. 15B) can be 20 nm or more. The through electrode 251 can also be disposed on the boundary wiring 163. This is because the boundary wiring 163 is electrically connected to the embedded electrode 161.

[0112] [Method of manufacturing boundary wiring] 16A to 16E are diagrams illustrating an example of a manufacturing method for a boundary wiring according to the second embodiment of the present disclosure, and are diagrams illustrating an example of a manufacturing process for the boundary wiring 163.

[0113] First, the separation section 171 is formed on the first semiconductor substrate 120 (FIG. 16A). Next, a resist 603 is placed on the surface side of the first semiconductor substrate 120. This resist 603 has an opening 604 formed in the portion where the boundary wiring 163 will be placed (FIG. 16B). Next, the separation section 171 is etched using the resist 603 as a mask to form the opening 178 (FIG. 16C). This can be performed, for example, by anisotropic dry etching. Next, a material film 605 for the boundary wiring 163 is placed on the surface side of the first semiconductor substrate 120, including the opening 178 (FIG. 16D). This can be performed, for example, by depositing a polycrystalline silicon film by CVD. Next, the material film 605 is etched to remove the material film 605 in the portion other than the opening 178 (FIG. 16E). This allows the boundary wiring 163 to be formed. Thereafter, the resist 603 is removed.

[0114] [Other configurations of boundary wiring] 17A and 17B are diagrams illustrating another exemplary configuration of the boundary wiring according to the second embodiment of the present disclosure. FIGS. 17A and 17B are diagrams illustrating an exemplary configuration of the boundary wiring 164. The boundary wiring 164 is a wiring disposed adjacent to the surface of the first semiconductor substrate 120. FIG. 17A illustrates an exemplary cross-sectional configuration of the boundary wiring 164 along the boundary of the pixel 541, and FIG. 17B illustrates an exemplary cross-sectional configuration of the boundary wiring 164 perpendicular to the boundary of the pixel 541. The boundary wiring 164 in FIG. 17A is connected to the upper surface of the embedded electrode 161 (FIG. 17A). The boundary wiring 163 in FIG. 17B is configured such that its upper and side surfaces are exposed on the surface side of the first semiconductor substrate 120 (FIG. 17B). Similar to the boundary wiring 163, the boundary wiring 164 in FIG. 17B can also be configured to be separated from the region of the first semiconductor substrate 120. The distance between the boundary wiring 164 and the first semiconductor substrate 120 can be set to 20 nm or more. The through electrode 251 can be disposed on the boundary wiring 163 instead of the buried electrode 161.

[0115] [Other manufacturing methods for boundary wiring] 18A to 18G are diagrams illustrating another example of a manufacturing method for the boundary wiring according to the second embodiment of the present disclosure. Figures 18A to 18G are diagrams illustrating an example of a manufacturing process for the boundary wiring 164. Note that in each of Figures 18A to 18G, the left side shows a portion where the embedded electrode 161 is not arranged, and the right side shows a portion where the embedded electrode 161 is arranged.

[0116] First, an isolation portion 171 is formed in the first semiconductor substrate 120, and the buried electrode 161 is disposed thereon (FIG. 18A). Next, an insulating film 129 is disposed on the surface side of the first semiconductor substrate 120 (FIG. 18B). This can be done by, for example, thermal oxidation. Next, a resist 606 is disposed on the surface side of the first semiconductor substrate 120. An opening 607 is disposed in this resist 606 where the boundary wiring 164 will be disposed (FIG. 18C). Next, the insulating film 129 is etched using the resist 606 as a mask, and an opening 608 is formed in a region adjacent to the buried electrode 161 (FIG. 18D). This can be done by, for example, dry etching.

[0117] Next, the resist 606 is removed (FIG. 18E). Next, a material film 620 of the boundary wiring 164 is disposed on the surface side of the first semiconductor substrate 120 including the opening 608 (FIG. 18F). This can be done, for example, by depositing a polycrystalline silicon film by CVD. Next, the material film 620 is etched to remove the material film 620 except for the boundary of the pixel 541 (FIG. 18G). This allows the boundary wiring 164 to be formed.

[0118] [Other configurations of pixel sharing units] Fig. 19 is a diagram showing another configuration example of a pixel-sharing unit according to the second embodiment of the present disclosure. Similar to Fig. 14, Fig. 19 is a plan view showing a configuration example of a pixel-sharing unit 539. The pixel-sharing unit 539 in Fig. 19 differs from the pixel-sharing unit 539 in Fig. 14 in that the boundary wiring 163 is arranged in a mesh pattern.

[0119] The boundary wiring 163 in the figure connects the embedded electrodes 161 to each other in the vertical and horizontal directions in the figure, which allows the resistance of the wiring that supplies the well potential in the first semiconductor substrate 120 to be further reduced, and the potential difference in the well potential between different pixels 541 to be reduced.

[0120] Other than this, the configuration of the imaging device 1 is the same as the configuration of the imaging device 1 in the first embodiment of the present disclosure, and therefore a description thereof will be omitted.

[0121] In this way, in the imaging device 1 according to the second embodiment of the present disclosure, adjacent embedded electrodes 161 are connected to each other by the boundary wiring 163, etc. This makes it possible to reduce the potential difference in well potential between different pixels 541.

[0122] (3. Third Embodiment) In the imaging device 1 of the first embodiment described above, a through electrode 251 is arranged for each pixel group 538. In contrast, in the third embodiment of the present disclosure, an example will be described in which the number of through electrodes 251 is reduced by arranging boundary wiring 163 or the like.

[0123] [Pixel array configuration] 20A to 20C are diagrams illustrating a configuration example of a pixel array unit according to a third embodiment of the present disclosure. Figures 20A to 20C are diagrams illustrating a configuration example of a pixel array unit 540. Note that reference numerals are omitted in Figures 20A to 20C.

[0124] 20A is a diagram showing an example in which through electrodes 251 and 252 are arranged in all embedded electrodes 161 and 162, similar to Fig. 8. Fig. 20B is a diagram showing an example in which boundary wiring 163 is arranged between embedded electrodes 161 adjacent in the horizontal direction of the diagram, and through electrodes 251 are arranged alternately with respect to the adjacent embedded electrodes 161. Fig. 20C is a diagram showing an example in which boundary wiring 163 is arranged and through electrodes 251 are omitted.

[0125] 20C, as will be described later in FIG. 30, the through electrodes 251 that supply a reference potential are arranged outside the pixel array section 540. The through electrodes 251 arranged outside the pixel array section 540 can be connected to, for example, a well region that extends to an area outside the pixel array section 540. The through electrodes 251 can also be connected to the embedded electrodes 161 in the pixel array section 540 and to the boundary wiring 163 that extends to an area outside the pixel array section 540. In this way, a reference potential (well potential) can be supplied to the pixels 541 when the through electrodes 251 are not arranged in the pixel array section 540.

[0126] 21 is a diagram showing an example of the configuration of a pixel array unit according to a third embodiment of the present disclosure. This diagram illustrates an example in which electrodes 661 and 662 are used adjacent to the front surface of the first semiconductor substrate 120 instead of the embedded electrodes 161 and 162. This diagram illustrates a comparative example of the embodiment of the present disclosure. The electrodes 661 and 662 are configured so as not to be embedded in the first semiconductor substrate 120, and are bonded to the semiconductor region on the surface of the first semiconductor substrate 120. To reduce the connection resistance between the electrodes 661 and 662 and the semiconductor region, the electrodes 661 and 662 must be configured to have a larger area than the embedded electrodes 161 and 162.

[0127] The numbers of connecting portions such as through electrodes 251 are compared between the cases of FIGS. 20A to 20C and FIG.

[0128] [Comparison results] FIG. 22 is a diagram showing a comparison result of the pixel array unit according to the third embodiment of the present disclosure. In the figure, Comparative Example 1, Application Example 1, Application Example 2, and Application Example 3 represent examples of the pixel array unit 540 in FIGS. 21, 20A, 20B, and 20C, respectively. Furthermore, "charge retention unit sharing pixels" in the figure represents the number of pixels of the charge retention units 103 commonly connected by the embedded electrodes 162. "Pixel circuit sharing unit" represents the number of pixels per pixel circuit 210. "Connections" in the figure represent the number of connections connecting the first semiconductor substrate 120 and the second semiconductor substrate 220 in the pixel array unit 540. Specifically, they represent the number of through-electrodes 251 to 253. "Charge transfer units," "charge retention units," and "well regions" in the figure represent the number of connections of the charge transfer units 102 (gate electrodes 131), the charge retention units 103, and the well regions (semiconductor regions 123), respectively. The "total" in the figure represents the total of the charge transfer section 102, the charge holding section 103 and the connection section of the well region.

[0129] "Boundary wiring" in the figure indicates the presence or absence of boundary wiring 163, etc. "Well contact" in the figure indicates the position where the well contact is arranged. FD capacitance in the figure indicates the electrostatic capacitance (parasitic capacitance) between the gate electrode 131 and the charge storage portion 103.

[0130] In the four examples in the figure, there are four "charge storage unit-sharing pixels" and four "pixel circuit-sharing units," and the number of "charge transfer units" and "charge storage units" in the "connection units" is four and one, respectively. This is because in all examples, the pixel sharing unit 539 is composed of four pixels 541 and one pixel circuit 210.

[0131] In Comparative Example 1 and Application Example 1, the “well region” of the “connection portion” is 1. This is because a through electrode 251 is disposed for each embedded electrode 161. In contrast, in Application Example 2, the “well region” of the “connection portion” is 0.5. This is because the through electrode 251 is shared by two pixel groups 538. Furthermore, in Application Example 3, the “well region” of the “connection portion” is 0. The “total” of the “connection portion” in Comparative Example 1, Application Example 1, Application Example 2, and Application Example 3 is 6, 6, 5.5, and 5, respectively. With regard to the “well contact,” Application Example 3 is outside the pixel, while the others are inside the pixel. As described above, Application Example 3, which omits the well contact (through electrode 251), has the well contact disposed outside the pixel array section 540. In the “FD capacitance” category, Comparative Example 1 has a higher value than Application Examples 1 to 3. This is because the distance between the gate electrode 131 and the electrodes 661 and 662 is short.

[0132] In this way, the number of connections can be reduced in an application example in which the boundary wirings 163 and 164 are arranged.

[0133] (4. Fourth Embodiment) In the third embodiment described above, a comparison was made for an example having a pixel-sharing unit 539 including four pixels 541. In contrast, in the fourth embodiment of the present disclosure, an example having a pixel-sharing unit 539 including eight pixels 541 will be described.

[0134] The pixel sharing unit 539 in the figure includes two sets of four pixels 541 that share the embedded electrode 162. This pixel sharing unit 539 includes a total of eight pixels 541.

[0135] [Pixel array configuration] 23A-23C are diagrams illustrating an example configuration of a pixel array unit according to a fourth embodiment of the present disclosure. Similar to FIGS. 20A-20C, FIGS. 23A-23C are diagrams illustrating an example configuration of a pixel array unit 540. The pixel sharing unit 539 in FIGS. 23A-23C differs from the pixel sharing unit 539 in FIGS. 20A-20C in that it includes eight pixels 541.

[0136] FIG. 23A is a diagram illustrating an example in which through electrodes 251 and the like are arranged in all of the embedded electrodes 161 and 162, similar to FIG. 20A . A through electrode 252 is arranged in each of the two embedded electrodes 162 in the pixel sharing unit 539. These through electrodes 252 are commonly connected to a wiring 242 on the second semiconductor substrate 220 and connected to the pixel circuit 210. FIG. 23B is a diagram illustrating an example in which a boundary wiring 163 is arranged between embedded electrodes 161 adjacent in the horizontal direction of the diagram, and the two embedded electrodes 162 in the pixel sharing unit 539 are connected by the boundary wiring 163 and the like. FIG. 23B also illustrates an example in which the through electrode 251 is connected to the boundary wiring 163 and the like. FIG. 23C is a diagram illustrating an example in which the through electrode 251 is further omitted from the example of FIG. 23B .

[0137] [Comparison results] FIG. 24 is a diagram showing comparison results of a pixel array unit according to the fourth embodiment of the present disclosure. In the figure, Comparative Example 2 assumes an example in which a pixel-sharing unit 539 includes eight pixels 541 in a pixel array unit 540 having the pixel 541 of FIG. 21. Application Example 4 represents an example in the case of the pixel array unit 540 of FIG. 23A. Application Examples 5 and 6 assume examples in which a pixel-sharing unit 539 includes eight pixels 541 in the pixel array unit 540 of FIGS. 20B and 15C, respectively. Application Examples 7 and 8 represent examples in the case of the pixel array unit 540 of FIGS. 23B and 23C, respectively.

[0138] In the six examples in the figure, the "charge storage portion sharing pixels" and the "pixel circuit sharing unit" are 4 pixels and 2 × 4 pixels, respectively, and the "charge transfer portion" of the "connection portion" is 8. This is because in all examples, the pixel sharing unit 539 is composed of eight pixels 541 and one pixel circuit 210.

[0139] In Comparative Example 2 and Application Example 4, the "charge retention portion" and "well region" of the "connection portion" are 2. This is because a through electrode 251 is arranged for each embedded electrode 161, and a through electrode 252 is arranged for each embedded electrode 162. In Comparative Example 2 and Application Example 4, the "total" of the "connection portion" is 12.

[0140] In Application Examples 5 and 6, as in Application Example 4, the "charge retention portion" of the "connection portion" is 2. On the other hand, in Application Example 5, the "well region" of the "connection portion" is 1. This is because the through electrode 251 is shared between the two pixel groups 538. Also, in Application Example 6, the "well region" of the "connection portion" is 0. The "total" of the "connection portion" in Application Examples 5 and 6 is 11 and 10, respectively.

[0141] In Application Examples 7 and 8, the "charge holding portion" of the "connection portion" is 1. This is because the two embedded electrodes 162 share the through electrode 252. Also, in Application Examples 7 and 8, as in Application Examples 5 and 6, the "well region" of the "connection portion" is 1 and 0, respectively. The "total" of the "connection portion" in Application Examples 7 and 8 is 10 and 9, respectively.

[0142] In Comparative Example 2 and Application Example 4, the "boundary wiring" is "absent," while in the other examples, the "boundary wiring" is "present." In addition, in Application Examples 6 and 8, which omit the through electrode 251, the "well contact" is "outside the pixel," while in the other examples, the "well contact" is "inside the pixel." In the "FD capacitance" category, Comparative Example 1 has a higher value than Application Examples 4 to 8. This is because, as in Comparative Example 1, the distance between the gate electrode 131 and the electrodes 661 and 662 is short.

[0143] In this way, in an application where the boundary wirings 163 and 164 are connected to the buried electrodes 161 and 162, the number of connections can be further reduced.

[0144] (5. Fifth Embodiment) In the above-described fourth embodiment, four pixels 541 share the embedded electrode 162 connected to the charge holding unit 103. In contrast, in the fifth embodiment of the present disclosure, an example will be described in which two pixels 541 share the embedded electrode 162 connected to the charge holding unit 103.

[0145] [Pixel array configuration] 25A-25E are diagrams illustrating a configuration example of a pixel array section according to a fifth embodiment of the present disclosure. Similar to FIGS. 23A-23C, FIGS. 25A-25E are diagrams illustrating a configuration example of a pixel array section 540. The pixel array section 540 in FIGS. 25A-25E differs from the pixel array section 540 in FIGS. 23A-23C in that the embedded electrodes 161 and 162 are shared by two pixels 541 and the pixel sharing unit 539 includes six pixels 541.

[0146] The pixel sharing unit 539 in the figure includes three pairs of two pixels 541 that share the embedded electrode 162. This pixel sharing unit 539 includes a total of six pixels 541.

[0147] FIG. 25A is a diagram illustrating an example in which through electrodes 251 and the like are arranged in all of the embedded electrodes 161 and 162, similar to FIG. 23A . The through electrodes 252 arranged in the three embedded electrodes 162 of the pixel sharing unit 539 are commonly connected to the wiring 242 of the second semiconductor substrate 220 and connected to the pixel circuit 210. FIG. 25B is a diagram illustrating an example in which the three embedded electrodes 161 are connected to each other by the boundary wiring 163 and the like. FIG. 23B also illustrates an example in which the through electrodes 251 are connected to the boundary wiring 163 and the like. FIG. 25C is a diagram illustrating an example in which the example of FIG. 25B further includes the boundary wiring 163 and the like that connects the three embedded electrodes 162 to each other. FIG. 25D is a diagram illustrating an example in which the example of FIG. 25A further includes the boundary wiring 163 and the like that connects the embedded electrodes 161 of the pixels 541 in two horizontal columns to each other. FIG. 25E is a diagram illustrating an example in which boundary wiring 163 and the like are further provided to connect the embedded electrodes 161 of the pixels 541 in two horizontal columns in the same figure to each other, in addition to the example in FIG. 25B.

[0148] [Comparison results] 26 is a diagram showing a comparison result of a pixel array section according to the fifth embodiment of the present disclosure. In the figure, Comparative Example 3 assumes an example in which the embedded electrodes 161 and 162 are shared by two pixels 541 in a pixel array section 540 having the pixel 541 of FIG. 21, and the pixel sharing unit 539 includes six pixels 541. Application Examples 9 to 13 represent examples in the case of the pixel array section 540 of FIGS. 25A to 20E, respectively.

[0149] In the six examples in the figure, the "charge storage portion sharing pixels" and the "pixel circuit sharing unit" are 2 pixels and 3 × 2 pixels, respectively, and the "charge transfer portion" of the "connection portion" is 6. This is because in all examples, the pixel sharing unit 539 is composed of six pixels 541 and one pixel circuit 210.

[0150] In Comparative Example 3 and Application Example 9, the "charge retention portion" and "well region" of the "connection portion" are 3. This is because a through electrode 251 is arranged for every three embedded electrodes 161, and a through electrode 252 is arranged for every three embedded electrodes 162. In Comparative Example 2 and Application Example 4, the "total" of the "connection portion" is 12.

[0151] In Application Example 10, as in Application Example 9, the "charge retention portion" of the "connection portion" is 2. On the other hand, in Application Example 10, the "well region" of the "connection portion" is 1. This is because the through electrode 251 is shared by three embedded electrodes 161 connected to each other by the boundary wiring 163, etc. The "total" of the "connection portion" in Application Example 10 is 10.

[0152] In Application Example 11, the "charge holding portion" of the "connection portion" is 1. This is because the through electrode 252 is shared by three embedded electrodes 162 that are connected to each other by the boundary wiring 163, etc. Also, as in Application Example 10, the "well region" of the "connection portion" is 1. The "total" of the "connection portion" in Application Example 11 is 8.

[0153] In Application Example 12, as in Application Example 10, the "charge retention portion" of the "connection portion" is 3. Also, as in Application Example 5 in FIG. 24, the "well region" of the "connection portion" is 0. The "total" of the "connection portion" in Application Example 12 is 9.

[0154] In Application Example 13, as in Application Example 11, the "charge retention portion" of the "connection portion" is 1. Also, as in Application Example 5 in FIG. 24, the "well region" of the "connection portion" is 0. The "total" of the "connection portion" in Application Example 13 is 7.

[0155] In Comparative Example 3 and Application Example 9, "boundary wiring" is "absent", while in the other cases "boundary wiring" is "present". In Application Examples 12 and 13, in which the through electrode 251 is omitted, "well contact" is "outside the pixel", while in the other cases "well contact" is "inside the pixel". The "FD capacitance" item is omitted.

[0156] In this way, in an application example in which two pixels 541 share the embedded electrode 162 connected to the charge retention section 103 and the boundary wirings 163 and 164 are connected to the embedded electrodes 161 and 162, the number of connecting parts can be further reduced.

[0157] (6. Sixth Embodiment) In the fifth embodiment described above, a comparison was made on an example in which two pixels 541 share the embedded electrode 162 connected to the charge holding section 103 and a pixel-sharing unit 539 is provided with six pixels 541. In contrast, in the sixth embodiment of the present disclosure, an example in which the number of pixels 541 in the pixel-sharing unit 539 is further increased will be described.

[0158] [Pixel array configuration] 27A-27F are diagrams illustrating a configuration example of a pixel array unit according to a sixth embodiment of the present disclosure. Similar to FIGS. 25A-25E, FIGS. 27A-27F are diagrams illustrating a configuration example of a pixel array unit 540. The pixel array unit 540 in FIGS. 27A-25F differs from the pixel array unit 540 in FIGS. 25A-25E in that it includes pixel sharing units 539A and 539B.

[0159] The pixel sharing unit 539A has four pairs of two pixels 541 that share the embedded electrode 162, for a total of eight pixels 541. The pixel sharing unit 539B has five pairs of two pixels 541 that share the embedded electrode 162, for a total of ten pixels 541.

[0160] FIG. 27A, like FIG. 23A, is a diagram illustrating an example in which through electrodes 251 and the like are arranged in all of the embedded electrodes 161 and 162. The through electrodes 252 arranged in the multiple embedded electrodes 162 of the pixel sharing units 539A and 539B are commonly connected to wiring 242 on the second semiconductor substrate 220 and connected to the pixel circuit 210. FIG. 27B is a diagram illustrating an example in which boundary wiring 163 and the like that connect the embedded electrodes 161 of the pixels 541 in two horizontal columns in the diagram are provided. In this example, the through electrodes 251 are omitted. FIG. 27C is a diagram illustrating an example in which boundary wiring 163 and the like that connect three embedded electrodes 162 to each other are further provided in addition to the example of FIG. 27B. Figure 27D is a diagram showing an example in which a pixel sharing unit 539A has boundary wiring 163 connecting four embedded electrodes 162, and a pixel sharing unit 539B has boundary wiring 163 connecting five embedded electrodes 162.

[0161] FIG. 27E is a diagram illustrating an example in which boundary wiring 163 and the like that connect the embedded electrodes 161 of the pixels 541 in two horizontal columns in FIG. 27B are further provided, in contrast to the example in FIG. 27C. The boundary wiring 163 and the like that connect the embedded electrodes 161 are disposed at the upper and lower ends of the pixel sharing units 539A and 539B in the same figure, and are connected to adjacent embedded electrodes 161. It is necessary to connect through electrodes 251 to the embedded electrodes 161 in the centers of the pixel sharing units 539A and 539B. Also, unlike FIG. 27B, in FIG. 27E, through electrodes 251 are disposed in the boundary wiring 163 and the like. FIG. 27F is a diagram illustrating an example in which the through electrodes 251 of the boundary wiring 163 and the like are omitted, in contrast to the example in FIG. 27E.

[0162] [Comparison results] FIG. 28 is a diagram showing a comparison result of a pixel array unit according to the sixth embodiment of the present disclosure. In the figure, Comparative Example 4 assumes a pixel array unit 540 having pixel sharing units 539A and 539B including the pixel 541 of FIG. 21. Application Examples 14 to 19 respectively represent examples of the pixel array unit 540 of FIGS. 27A to 27F. Note that the "4×2 portion" and "5×2 portion" of the "connection portion" in the figure correspond to the portions of the pixel sharing units 539A and 539B, respectively. Furthermore, the "total" of the "connection portion" is the sum of the numbers of through electrodes 251 and the like in the "4×2 portion" and the "5×2 portion."

[0163] In the six examples in the figure, the "charge storage portion sharing pixels" are two pixels, and the "pixel circuit sharing units" are 4 x 2 pixels (pixel sharing unit 539A) and 5 x 2 pixels (pixel sharing unit 539B). In the seven examples in the figure, the "charge transfer portions" of the "4 x 2 portion" and "5 x 2 portion" in the "connection portion" are 8 and 10, respectively.

[0164] In Comparative Example 4 and Application Example 14, the "charge retention portions" of the "4×2 portion" and "5×2 portion" in the "connection portion" are 8 and 10, respectively, and the "well regions" of the "4×2 portion" and "5×2 portion" in the "connection portion" are 4 and 5, respectively. The totals of the "4×2 portion" and "5×2 portion", respectively, are 16 and 20. Therefore, the "total" in the "connection portion" is 36.

[0165] In Application Example 15, similar to Application Example 14, the "charge retention portions" of the "4×2 portion" and "5×2 portion" of the "connection portion" are 4 and 5, respectively. On the other hand, in Application Example 15, similar to Application Example 5 in FIG. 24, the "well regions" of the "4×2 portion" and "5×2 portion" of the "connection portion" are 0. The "total" of the "connection portion" in Application Example 5 is 27.

[0166] In Application Example 16, the "charge retention portion" of the "4×2 portion" and "5×2 portion" of the "connection portion" is 2. Also, as in Application Example 15, the "well region" of the "connection portion" is 0. The "total" of the "connection portion" in Application Example 11 is 22.

[0167] In Application Example 17, the "charge retention portion" of the "connection portion" is 1. This is because the plurality of through electrodes 252 of each of the pixel sharing units 539A and 539B are commonly connected by the boundary wiring 163, etc. Also, as in Application Example 14, the "well regions" of the "4×2 portion" and "5×2 portion" of the "connection portion" are 4 and 5, respectively. The "total" of the "connection portion" in Application Example 12 is 29.

[0168] In Application Example 18, as in Application Example 17, the "charge retention portion" of the "connection portion" is 1. Also, the "well regions" of the "4×2 portion" and "5×2 portion" of the "connection portion" are 2 and 3, respectively. This is because, unlike Application Examples 15 and 16, the through electrode 251 is disposed in the buried electrode 161. The "total" of the "connection portion" in Application Example 18 is 25.

[0169] In Application Example 19, as in Application Example 17, the "charge retention portion" of the "connection portion" is 1. Also, the "well regions" of the "4x2 portion" and "5x2 portion" of the "connection portion" are 1 and 2, respectively. This is because, unlike Application Examples 15 and 16, the through electrodes 251 are disposed in the embedded electrodes 161 in the centers of the pixel sharing units 539A and 539B. The "total" of the "connection portions" in Application Example 19 is 23.

[0170] In Comparative Example 4 and Application Example 14, the "boundary wiring" is "absent," while in the other cases the "boundary wiring" is "present." In Application Examples 15 and 16, in which the through electrode 251 is omitted, the "well contact" is "outside the pixel." In Application Example 19, the "well contact" is both "inside the pixel" and "outside the pixel." In the other cases, the "well contact" is "inside the pixel."

[0171] In this way, in an application example in which the embedded electrodes 162 of the pixel sharing units 539A and 539B are connected to each other by the boundary wiring 163 or the like and share the through electrode 251, the number of connecting parts can be further reduced.

[0172] (7. Seventh Embodiment) The imaging device 1 of the first embodiment described above uses a separation section 171 made of an insulating material. In contrast, the imaging device 1 of the seventh embodiment of the present disclosure differs from the first embodiment described above in that it uses a separation section 171 made of another member.

[0173] [Configuration of separation unit] 29A and 29B are diagrams illustrating a configuration example of a separation unit according to a seventh embodiment of the present disclosure, and are cross-sectional views illustrating the configuration example of a separation unit.

[0174] 29A is formed at a relatively shallow depth from the surface side of first semiconductor substrate 120. A polycrystalline silicon layer 172 is disposed below this separation portion 171. A separation portion 173 is disposed adjacent to this polycrystalline silicon layer 172. This separation portion 173 is a semiconductor region formed with a relatively high impurity concentration of the same conductivity type as the well region.

[0175] The polycrystalline silicon layer 172 is made of polycrystalline silicon into which impurities have been implanted. By disposing this polycrystalline silicon layer 172 in the groove 179 of the first semiconductor substrate 120 and performing a heat treatment, the impurities in the polycrystalline silicon layer 172 diffuse into the surrounding first semiconductor substrate 120. This allows the formation of an isolation portion 173 made of a semiconductor region with a relatively high impurity concentration adjacent to the polycrystalline silicon layer 172. This method of diffusing impurities is called a solid-phase diffusion method. The isolation portion 173 allows the first semiconductor substrate 120 in the pixel 541 to be separated.

[0176] 29B is a semiconductor region configured to have a relatively high impurity concentration of the same conductivity type as the well region, similar to the isolation region 173. The isolation region 174 can be formed by ion implantation into the first semiconductor substrate 120.

[0177] Other than this, the configuration of the imaging device 1 is the same as the configuration of the imaging device 1 in the first embodiment of the present disclosure, and therefore a description thereof will be omitted.

[0178] In this way, the imaging device 1 according to the seventh embodiment of the present disclosure separates the boundaries of the pixels 541 using the separation sections 173 and 174 formed from semiconductor regions.

[0179] (8. Eighth Embodiment) The imaging device 1 of the first embodiment described above has embedded electrodes 161 and 162 arranged at the boundaries of pixels 541, and transmits a reference potential and a potential of a charge storage section, respectively. In contrast, the imaging device 1 of the eighth embodiment of the present disclosure differs from the first embodiment described above in that embedded electrodes are arranged in a shape that surrounds pixels 541, and transmit only a reference potential.

[0180] [Pixel sharing unit configuration] 30 is a diagram showing a configuration example of a pixel-sharing unit according to an eighth embodiment of the present disclosure. Similar to FIG. 8, this figure is a plan view showing a configuration example of a pixel-sharing unit 539. The pixel-sharing unit 539 in this figure differs from the pixel-sharing unit 539 in FIG. 8 in that it includes an embedded electrode 165 instead of the embedded electrodes 161 and 162, and the charge holding unit 103 is disposed away from the boundary of the pixel 541.

[0181] The buried electrode 165 is disposed at the boundary of the pixel 541 and is configured to surround the pixel 541. Similar to the buried electrode 161, the buried electrode 165 transmits a reference potential (well potential). A semiconductor region 123 is disposed in the first semiconductor substrate 120 adjacent to the buried electrode 165. As described above, the semiconductor region 123 is a semiconductor region with a relatively high impurity concentration disposed in the well region of the first semiconductor substrate 120. By using the semiconductor region 123, the resistance of the connection between the buried electrode 165 and the well region can be reduced. As shown in the figure, the semiconductor region 123 can be configured to be adjacent to a part of the buried electrode 165. Alternatively, the semiconductor region 123 can be configured in a ring shape along the inside of the buried electrode 165 in a plan view.

[0182] As shown in the figure, the through electrode 251 that supplies the reference potential (well potential) is connected to the portion of the embedded electrode 165 that extends outside the pixel array section 540. This allows a common well potential to be supplied to the well region of each pixel 541, and also makes it possible to omit the through electrode 251 for each pixel 541.

[0183] Furthermore, as shown in the figure, by configuring the embedded electrode 165 in a mesh pattern, it is possible to reduce the resistance of the region of the embedded electrode 165 that serves as a transmission path for the reference potential, and it is possible to reduce the potential difference of the well potential between different pixels 541.

[0184] As shown in the figure, the semiconductor region 122 constituting the charge retention unit 103 is disposed at a position separated from the boundary of the pixel 541. This is to separate the semiconductor region 122 constituting the charge retention unit 103 from the embedded electrode 165 at the boundary of the pixel 541. In the pixel 541 shown in the figure, an electrode 143 is connected to the semiconductor region 122 constituting the charge retention unit 103. This electrode 143 is disposed in the charge retention unit 103 of all pixels 541 in the pixel sharing unit 539. The multiple electrodes 143 in this pixel sharing unit 539 are connected to the charge retention unit wiring 142 shown in the figure. This charge retention unit wiring 142 is wiring disposed between the first semiconductor substrate 120 and the second semiconductor substrate 220. A through electrode 254 is further connected to the charge retention unit wiring 142. The through electrode 254 is an electrode shaped to penetrate the second semiconductor substrate 220. This through electrode 254 is connected to the pixel circuit 210.

[0185] [Pixel configuration] 31 is a diagram showing a configuration example of a pixel according to an eighth embodiment of the present disclosure. Similar to FIG. 9, this diagram is a schematic cross-sectional view showing a configuration example of a pixel 541. The pixel 541 in this diagram differs from the pixel 541 in FIG. 9 in that it includes an embedded electrode 165 instead of the embedded electrodes 161 and 162, and the charge holding unit 103 is disposed away from the boundary of the pixel 541.

[0186] The buried electrode 165 is disposed buried in the surface side of the first semiconductor substrate 120 at the boundary of the pixel 541 that overlaps the separation portion 171. A semiconductor region 123 is disposed adjacent to this buried electrode 165. The semiconductor region 122 that constitutes the charge retention portion 103 is disposed away from the boundary of the pixel 541, and an electrode 143 is connected to it. This electrode 143 is an electrode formed of a columnar metal or the like, similar to the through electrode 251. The electrode 143 is also connected to the charge retention portion wiring 142. The through electrode 254, wiring 242, and via plug 243 are connected to the charge retention portion wiring 142 in this order, and are then connected to an element of the second semiconductor substrate 220 (the amplification transistor 213 in the figure). The electrode 143 is an example of a second connection portion as defined in the claims.

[0187] A part of the embedded electrode 165 extends to an area outside the pixel array section 540, and is connected to a through electrode 251. This through electrode 251 is connected to the ground line Vss of the third semiconductor substrate 320 via the wiring 242 and the contact plug 244, as in Fig. 9, and the ground potential is supplied as a reference potential (well potential). The through electrode 251 is also connected to the semiconductor region 225 of the second semiconductor substrate 220.

[0188] Other than this, the configuration of the imaging device 1 is the same as the configuration of the imaging device 1 in the first embodiment of the present disclosure, and therefore a description thereof will be omitted.

[0189] In this way, the imaging device 1 according to the eighth embodiment of the present disclosure supplies a reference potential by arranging the embedded electrode 165 in a shape that surrounds the pixel 541. The region related to the supply of the reference potential can be arranged outside the pixel 541, and the pixel 541 can be made smaller.

[0190] (9. Ninth embodiment) The imaging device 1 of the above-described eighth embodiment includes a charge transfer section 102 configured with planar (horizontal) MOS transistors. In contrast, the imaging device 1 of the ninth embodiment of the present disclosure differs from the above-described eighth embodiment in that it includes a charge transfer section 102 configured with vertical MOS transistors in which carriers move in the vertical direction.

[0191] [Pixel sharing unit configuration] Fig. 32 is a diagram showing a configuration example of a pixel sharing unit according to the ninth embodiment of the present disclosure. Similar to Fig. 30, Fig. 32 is a plan view showing a configuration example of a pixel sharing unit 539. The pixel sharing unit 539 in Fig. 32 differs from the pixel sharing unit 539 in Fig. 30 in that it includes a charge transfer unit 102 configured using vertical MOS transistors.

[0192] In the pixel 541 shown in the figure, the charge retention unit 103 and the charge transfer unit 102 are arranged in the center. The charge transfer unit 102 is arranged in a layer below the semiconductor region 125 that constitutes the charge retention unit 103. As described above, this charge transfer unit 102 is composed of a vertical MOS transistor. The channel region of the charge transfer unit 102 is arranged in a protruding portion formed on the surface side of the first semiconductor substrate 120, and is provided with a gate electrode 132. This gate electrode 132 is configured in a shape that surrounds the periphery of the channel region. The charge transfer unit 102 shown in the figure represents an example in which it is configured in a rectangular shape in plan view, similar to the pixel 541. A through electrode 253 is connected to the gate electrode 132. Furthermore, an electrode 143 is connected to the charge retention unit 103.

[0193] [Pixel configuration] 33 is a diagram showing a configuration example of a pixel according to the ninth embodiment of the present disclosure. The diagram is a schematic cross-sectional view showing a configuration example of a pixel 541. The pixel 541 in the diagram differs from the pixel 541 in FIG. 31 in that the charge holding unit 103 is configured using a vertical MOS transistor.

[0194] A protrusion 126 is formed on the surface side of the first semiconductor substrate 120. A channel region 124 of the charge retention unit 103 is disposed in this protrusion 126. An annular groove 127 is disposed on the surface side of the first semiconductor substrate 120. The protrusion 126 in the figure is formed by grinding the surface side of the first semiconductor substrate 120 into the shape of the annular groove 127. The photoelectric conversion unit 101 is disposed below the charge transfer unit 102, and the charge retention unit 103 is disposed at the upper end of the charge transfer unit 102. The channel region 124 of the charge transfer unit 102 is composed of an n-type semiconductor. The n-type semiconductor region 121 of the photoelectric conversion unit 101 and the n-type semiconductor region 125 of the charge retention unit 103 correspond to the source region and drain region of the charge transfer unit 102, respectively. In the channel region 124, carriers (electrons in the figure) move in the thickness direction (vertical direction) of the first semiconductor substrate 120 from the source region toward the drain region.

[0195] By applying such a vertical MOS transistor to the charge transfer section 102, it is possible to reduce the area of ​​the charge transfer section 102 on the front surface side of the first semiconductor substrate 120. In addition, it is possible to easily transfer charges from the photoelectric conversion section 101, which is configured as a back-illuminated type and is arranged deep in the first semiconductor substrate 120.

[0196] An insulating film 129 corresponding to a gate insulating film is disposed on the surface of the channel region 124. A gate electrode 132 is disposed adjacent to the channel region 124 via this insulating film 129. In this manner, the charge transfer unit 102 is configured as a depletion-type MOS transistor. The charge transfer unit 102 is a so-called normally-on MOS transistor. To put the charge transfer unit 102 into a non-conductive state, a negative control signal is applied to the gate electrode 132.

[0197] The gate electrode 132 in the figure shows an example in which it is configured in a shape that surrounds the channel region 124. By arranging the gate electrode 132 around the channel region 124 in this way, the effective channel width can be widened and the channel resistance can be reduced. In addition, a gate voltage can be applied to all sides of the channel region to form a depletion layer, making it possible to completely deplete the channel region. This can reduce leakage current when the device is off.

[0198] The gate electrode 132 in the figure is spaced apart from the charge retention portion 103 in the thickness direction of the first semiconductor substrate 120. A separation portion 134 is disposed between the gate electrode 132 and the semiconductor region 125 of the charge retention portion 103 in the figure. An insulator similar to the insulating layer 141 is disposed in this separation portion 134. The separation portion 134 can be formed by disposing an annular groove 128 between the gate electrode 132 and the protruding portion 126. By separating the gate electrode 132 from the charge retention portion 103 in this manner, the electric field between the gate electrode 132 and the semiconductor region 125 that constitutes the charge retention portion 103 can be reduced. When a high electric field is applied between the gate electrode 132 and the semiconductor region 125, charges migrate from the valence band and accumulate at the interface between the insulating film 129 and the first semiconductor substrate 120 near the gate electrode 132. This reduces the performance of the charge transfer portion 102. By setting the distance between the gate electrode 132 and the charge holding portion 103 to 100 nm or more, the electric field between the gate electrode 132 and the semiconductor region 125 that constitutes the charge holding portion 103 can be reduced.

[0199] On the other hand, if the distance between the gate electrode 132 and the charge holding unit 103 is too large, the diffusion region of the drain of the charge transfer unit 102 becomes longer. This increases the equivalent area of ​​the charge holding unit 103, and the capacitance (FD capacitance) of the charge holding unit 103 increases.

[0200] As described above, the charge transfer unit 102 in the figure is configured to have a rectangular shape in plan view similar to that of the pixel 541. By configuring the charge transfer unit 102 to have a planar shape similar to that of the pixel 541, the area of ​​the charge transfer unit 102 relative to the pixel 541 can be made larger.

[0201] The configuration of the pixel 541 is not limited to this example. For example, the embedded electrode 165 may be omitted. In this case, a through electrode 251 is disposed for each pixel 541 and connected to the semiconductor region 123 to supply a reference potential.

[0202] [Method of manufacturing image sensor] 34A to 34M are diagrams illustrating an example of a manufacturing method for an image sensor according to the ninth embodiment of the present disclosure. Figures 34A to 34M are diagrams illustrating an example of a manufacturing process for the image sensor 1, and are mainly diagrams illustrating an example of a manufacturing process related to the region of the charge transfer section 102.

[0203] First, the isolation portion 171 and the buried electrode 165 are disposed on the first semiconductor substrate 120 (FIG. 34A).

[0204] Next, a resist 609 is placed on the surface side of the first semiconductor substrate 120. An opening 610 is placed in this resist 609 where the annular groove 127 will be formed (FIG. 34B). Next, the surface side of the first semiconductor substrate 120 is etched using the resist 609 as a mask to form the annular groove 127. This can be done by, for example, dry etching. This process allows the protrusion 126 to be formed on the surface side of the first semiconductor substrate 120 (FIG. 34C).

[0205] Next, an insulating layer 141 is disposed in the annular groove 127 (FIG. 34D). This can be done, for example, by depositing a material film for the insulating layer 141 by CVD and then grinding away unnecessary portions. Next, a resist 611 is disposed on the surface side of the first semiconductor substrate 120. An opening 612 is formed in this resist 611 in the area where the gate electrode 132 will be disposed (FIG. 34E). Next, using the resist 611 as a mask, the insulating layer 141 disposed in the annular groove 127 is etched to form a groove portion 613 (FIG. 34F). This can be done, for example, by anisotropic dry etching. Next, an insulating film 129 corresponding to a gate insulating film is formed on the side surface of the protrusion 126 and the bottom of the annular groove 127 (FIG. 34G). This can be done, for example, by thermal oxidation.

[0206] Next, a material film 614 for the gate electrode 132 is disposed on the surface side of the first semiconductor substrate 120, including the groove portion 613 (FIG. 34H). This can be done, for example, by depositing a polycrystalline silicon film by CVD. Next, a resist 615 is disposed on the surface side of the first semiconductor substrate 120. An opening 616 is disposed in this resist 615 where the annular groove 128 will be formed (FIG. 34I). Next, the material film 614 is etched using the resist 615 as a mask. At this time, the etching is stopped when the gate electrode 132 adjacent to the channel region 124 reaches the desired width (FIG. 34J). This etching can be performed by, for example, dry etching. In this way, the annular groove 128 can be formed. Next, an insulating layer 141 is disposed in the annular groove 128, and the resist 615 is removed (FIG. 34K). Next, the material film 614 on the surface side of the first semiconductor substrate 120 is removed. This process allows the gate electrode 132 to be formed (FIG. 34L). Next, the insulating layer 141 is disposed on the front surface side of the first semiconductor substrate 120, and the through electrodes 253 and electrodes 143 are disposed (FIG. 34M). Through the above steps, the charge transfer section 102 can be formed.

[0207] [Variations] 35 is a diagram showing a first modified example of the configuration of the charge transfer section according to the ninth embodiment of the present disclosure. The figure is a schematic cross-sectional view showing a modified example of the configuration of the charge transfer section 102. The charge transfer section 102 in the figure differs from the charge transfer section 102 in FIG. 33 in that the annular groove 127 is configured in a substantially vertical cross section.

[0208] 36A to 36E are diagrams illustrating a second modified example of the configuration of the charge transfer section according to the ninth embodiment of the present disclosure, and are plan views illustrating a modified example of the configuration of the charge transfer section 102.

[0209] 36A is a diagram showing an example of a charge transfer unit 102 that is circular in plan view. In the same figure, the charge holding unit 103 can also be circular in plan view. Since the gate electrode 132 and the like are circular and have no corners, the concentration of the electric field can be alleviated.

[0210] 36B-36E are diagrams showing an example of reducing the gate electrode 132 adjacent to the channel region 124 of the charge transfer unit 102. The gate electrode 132 can be configured in any shape that does not surround the channel region 124. By reducing the gate electrode 132, the charge transfer unit 102 can be made smaller. Furthermore, by reducing the gate electrode 132, the capacitance between the gate electrode 132 and the channel region 124 can be reduced. The input capacitance of the charge transfer unit 102 is reduced, and the speed of the charge transfer unit 102 can be increased.

[0211] Other than this, the configuration of the imaging device 1 is the same as the configuration of the imaging device 1 in the eighth embodiment of the present disclosure, and therefore a description thereof will be omitted.

[0212] In this way, the imaging device 1 according to the ninth embodiment of the present disclosure includes the charge transfer section 102 configured by vertical MOS transistors, and thus the charge transfer section 102 can be made smaller.

[0213] (10. Tenth Embodiment) In the imaging device 1 of the above-described ninth embodiment, wiring for transmitting a control signal for the charge transfer unit 102 is arranged for each pixel sharing unit 539. In contrast, the imaging device 1 of the tenth embodiment of the present disclosure differs from the above-described ninth embodiment in that wiring for transmitting a control signal for the charge transfer unit 102 is shared between adjacent pixel sharing units 539.

[0214] [Pixel sharing unit configuration] Fig. 37 is a diagram showing a configuration example of a pixel sharing unit according to the tenth embodiment of the present disclosure. Similar to Fig. 32, Fig. 37 is a plan view showing a configuration example of a pixel sharing unit 539. The pixel sharing unit 539 in Fig. 37 differs from the pixel sharing unit 539 in Fig. 32 in that it includes a charge transfer section wiring 144.

[0215] The charge transfer unit wiring 144 is a signal line that is disposed in common to adjacent pixel sharing units 539 and transmits control signals for the charge transfer units 102. The charge transfer unit wiring 144 will be described using pixel sharing units 539E and 539F shown in the same figure. The gate electrodes 132 of the four charge transfer units 102 in the pixel sharing unit 539E are connected to the gate electrodes 132 of the corresponding charge transfer units 102 in the pixel sharing unit 539F by charge transfer unit wirings 144A to 144D, respectively. Specifically, the gate electrode 131A of the charge transfer unit 102A in pixel 541A in the pixel sharing unit 539E is connected to the gate electrode 131 of the charge transfer unit 102A in pixel 541A in the pixel sharing unit 539F by the charge transfer unit wiring 144A. Similarly, the gate electrodes 132 of the charge transfer units 102 in pixels 541B to 541D are connected to each other by charge transfer unit wirings 144B to 144D, respectively. The charge transfer wirings 144A to 144D each have a through electrode 253 disposed therein.

[0216] In this way, by sharing the signal lines that transmit the control signals between adjacent pixel sharing units 539, the number of through electrodes 253 that transmit the control signals can be reduced.

[0217] In addition, in the pixel sharing units 539E and 539F in the same figure, a U-shaped charge retention wiring 142 is arranged.

[0218] If a through electrode is disposed for each charge holding section 103 and charge transfer section 102 without using the charge retention section wiring 142 and the charge transfer section wiring 144, eight through electrodes 253 and the like are required for each pixel sharing unit 539. In contrast, by using the charge retention section wiring 142 and the charge transfer section wiring 144, the number of through electrodes 253 and 254 per pixel sharing unit 539 can be reduced to three. The opening area of ​​the through hole 262 in the second semiconductor substrate 220 for disposing the through electrodes 253 and the like can be reduced.

[0219] Other than this, the configuration of the imaging device 1 is the same as the configuration of the imaging device 1 in the ninth embodiment of the present disclosure, and therefore a description thereof will be omitted.

[0220] In this way, the imaging device 1 of the tenth embodiment of the present disclosure can reduce the number of through electrodes 253 by arranging the charge transfer section wiring 144 and sharing control signals between adjacent pixel sharing units 539.

[0221] (11. Application Examples) FIG. 38 shows an example of a schematic configuration of an imaging system including the imaging devices according to the above-described embodiment and the modifications thereof.

[0222] The imaging system 7 is, for example, an electronic device such as an imaging device such as a digital still camera or a video camera, or a portable terminal device such as a smartphone or a tablet terminal. The imaging system 7 includes, for example, the imaging device 1 according to the above embodiment and its modifications, a DSP circuit 743, a frame memory 744, a display unit 745, a storage unit 746, an operation unit 747, and a power supply unit 748. In the imaging system 7, the imaging device 1 according to the above embodiment and its modifications, the DSP circuit 743, the frame memory 744, the display unit 745, the storage unit 746, the operation unit 747, and the power supply unit 748 are connected to each other via a bus line 749.

[0223] The imaging device 1 according to the above-described embodiment and its modified examples outputs image data corresponding to incident light. The DSP circuit 743 is a signal processing circuit that processes signals (image data) output from the imaging device 1 according to the above-described embodiment and its modified examples. The frame memory 744 temporarily stores the image data processed by the DSP circuit 743 on a frame-by-frame basis. The display unit 745 is formed of a panel display device such as a liquid crystal panel or an organic EL (Electro Luminescence) panel, and displays moving or still images captured by the imaging device 1 according to the above-described embodiment and its modified examples. The storage unit 746 records image data of moving or still images captured by the imaging device 1 according to the above-described embodiment and its modified examples in a storage medium such as a semiconductor memory or a hard disk. The operation unit 747 issues operation commands for various functions of the imaging system 7 in accordance with user operations. The power supply unit 748 appropriately supplies various power sources to these power sources as operating power for the imaging device 1, DSP circuit 743, frame memory 744, display unit 745, storage unit 746, and operation unit 747 according to the above-described embodiment and its modified examples.

[0224] Next, the imaging procedure in the imaging system 7 will be described.

[0225] 39 shows an example of a flowchart of the imaging operation in the imaging system. The user operates the operation unit 747 to instruct the start of imaging (step S101). The operation unit 747 then transmits an imaging command to the imaging device 1 (step S102). Upon receiving the imaging command, the imaging device 1 (specifically, the system control circuit 36) performs imaging using a predetermined imaging method (step S103).

[0226] The imaging device 1 outputs image data obtained by imaging to the DSP circuit 743. Here, the image data refers to data for all pixels of pixel signals generated based on the charges temporarily stored in the floating diffusion FD. The DSP circuit 743 performs predetermined signal processing (e.g., noise reduction processing) based on the image data input from the imaging device 1 (step S104). The DSP circuit 743 stores the image data that has undergone the predetermined signal processing in the frame memory 744, and the frame memory 744 stores the image data in the storage unit 746 (step S105). In this manner, imaging is performed in the imaging system 7.

[0227] In this application example, the imaging device 1 according to the above-described embodiment and its modification example is applied to an imaging system 7. This allows the imaging device 1 to be made smaller or have higher resolution, and therefore a small or high-resolution imaging system 7 can be provided.

[0228] (12. Mobile Application Examples) The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of moving body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0229] FIG. 40 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied.

[0230] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 40, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (Interface) 12053.

[0231] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, a braking device for generating a braking force of the vehicle, etc.

[0232] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches may be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0233] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc., based on the received images.

[0234] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal according to the amount of light received. The imaging unit 12031 can output the electrical signal as an image, or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0235] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0236] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drivetrain control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including avoiding or mitigating collisions between vehicles, following based on the distance between vehicles, maintaining vehicle speed, warning of vehicle collisions, or warning of vehicle lane departure.

[0237] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0238] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information about the outside of the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control for the purpose of preventing glare, such as switching from high beams to low beams.

[0239] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying information to vehicle occupants or the outside of the vehicle. In the example of Fig. 40, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are exemplified as output devices. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0240] FIG. 41 is a diagram showing an example of the installation position of the imaging unit 12031.

[0241] In FIG. 41, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0242] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided at the front nose and the imaging unit 12105 provided at the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided at the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided at the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided at the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0243] 41 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, a bird's-eye view image of the vehicle 12100 viewed from above can be obtained.

[0244] At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera made up of multiple imaging elements, or may be an imaging element having pixels for phase difference detection.

[0245] For example, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104, thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (for example, 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of automatic driving, which runs autonomously without relying on driver operation.

[0246] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the degree of risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drivetrain control unit 12010.

[0247] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether or not a pedestrian is present in the images captured by the image capturing units 12101 to 12104. The pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104, which are infrared cameras, and then performing pattern matching on a series of feature points that indicate the outline of an object to determine whether or not the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0248] An example of a vehicle control system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to the imaging unit 12031 of the above-described configuration. Specifically, the imaging device 1 in FIG. 1 can be applied to the imaging unit 12031. By applying the technology according to the present disclosure to the imaging unit 12031, the imaging unit 12031 can be made smaller.

[0249] (13. Application to endoscopic surgery systems) The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

[0250] FIG. 42 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure (the present technology) can be applied.

[0251] Figure 42 shows an operator (doctor) 11131 performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgery system 11000. As shown in the figure, the endoscopic surgery system 11000 is composed of an endoscope 11100, other surgical tools 11110 such as an insufflation tube 11111 and an energy treatment tool 11112, a support arm device 11120 that supports the endoscope 11100, and a cart 11200 on which various devices for endoscopic surgery are mounted.

[0252] The endoscope 11100 is composed of a lens barrel 11101, a region of a predetermined length from the tip of which is inserted into a body cavity of a patient 11132, and a camera head 11102 connected to the base end of the lens barrel 11101. In the example shown, the endoscope 11100 is configured as a so-called rigid scope having a rigid lens barrel 11101, but the endoscope 11100 may also be configured as a so-called flexible scope having a flexible lens barrel.

[0253] An opening into which an objective lens is fitted is provided at the tip of the lens barrel 11101. A light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 11101, and is irradiated via the objective lens towards an object to be observed inside the body cavity of the patient 11132. The endoscope 11100 may be a direct-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0254] An optical system and an image sensor are provided inside the camera head 11102, and light reflected from the object of observation (observation light) is collected onto the image sensor by the optical system. The observation light is photoelectrically converted by the image sensor to generate an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observed image. The image signal is sent to a camera control unit (CCU) 11201 as RAW data.

[0255] The CCU 11201 is configured with a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc., and comprehensively controls the operations of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives an image signal from the camera head 11102, and performs various image processing on the image signal, such as development processing (demosaic processing), to display an image based on the image signal.

[0256] Under the control of the CCU 11201, the display device 11202 displays an image based on an image signal that has been subjected to image processing by the CCU 11201.

[0257] The light source device 11203 is configured from a light source such as an LED (light emitting diode), and supplies irradiation light to the endoscope 11100 when photographing an operation site or the like.

[0258] The input device 11204 is an input interface for the endoscopic surgery system 11000. A user can input various information and instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging conditions (type of irradiating light, magnification, focal length, etc.) of the endoscope 11100.

[0259] The treatment tool control device 11205 controls the driving of the energy treatment tool 11112 for cauterizing tissue, incising, sealing blood vessels, etc. The insufflation device 11206 inflates the body cavity of the patient 11132 through the insufflation tube 11111 in order to ensure a clear field of view for the endoscope 11100 and a working space for the surgeon. The recorder 11207 is a device capable of recording various types of information related to the surgery. The printer 11208 is a device capable of printing various types of information related to the surgery in various formats such as text, images, or graphs.

[0260] The light source device 11203 that supplies illumination light to the endoscope 11100 when photographing the surgical site can be configured from a white light source configured from, for example, an LED, a laser light source, or a combination of these. When the white light source is configured from a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, making it possible to adjust the white balance of the captured image in the light source device 11203. In this case, it is also possible to capture images corresponding to each RGB in a time-division manner by irradiating the object of observation with laser light from each RGB laser light source in a time-division manner and controlling the drive of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, a color image can be obtained without providing a color filter to the image sensor.

[0261] Furthermore, the light source device 11203 may be controlled to change the intensity of light it outputs at predetermined time intervals. By controlling the driving of the image sensor of the camera head 11102 in synchronization with the timing of the change in light intensity to acquire images in a time-division manner and combining the images, it is possible to generate an image with a high dynamic range that is free of so-called blocked-up shadows and blown-out highlights.

[0262] The light source device 11203 may also be configured to supply light in a predetermined wavelength band corresponding to special light observation. Special light observation, for example, utilizes the wavelength dependence of light absorption in body tissues to irradiate light with a narrower band than the light irradiated during normal observation (i.e., white light), thereby capturing high-contrast images of specific tissues, such as blood vessels on the surface of mucous membranes, known as narrow-band imaging. Alternatively, special light observation may be performed using fluorescence observation, in which images are obtained using fluorescence generated by irradiating excitation light. Fluorescence observation can involve irradiating excitation light onto body tissues and observing the fluorescence from the tissues (autofluorescence observation), or locally injecting a reagent such as indocyanine green (ICG) into the body tissue and irradiating the tissue with excitation light corresponding to the fluorescent wavelength of the reagent to obtain a fluorescent image. The light source device 11203 may be configured to supply narrow-band light and / or excitation light corresponding to such special light observation.

[0263] FIG. 43 is a block diagram showing an example of the functional configuration of the camera head 11102 and the CCU 11201 shown in FIG.

[0264] The camera head 11102 has a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 has a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other by a transmission cable 11400 so that they can communicate with each other.

[0265] The lens unit 11401 is an optical system provided at the connection point with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and enters the lens unit 11401. The lens unit 11401 is composed of a combination of multiple lenses including a zoom lens and a focus lens.

[0266] The imaging unit 11402 may include one imaging element (a so-called single-chip type) or multiple imaging elements (a so-called multi-chip type). When the imaging unit 11402 is configured as a multi-chip type, for example, each imaging element may generate an image signal corresponding to each of RGB, and a color image may be obtained by combining these signals. Alternatively, the imaging unit 11402 may be configured to have a pair of imaging elements for acquiring image signals for the right eye and the left eye corresponding to 3D (dimensional) display. 3D display allows the surgeon 11131 to more accurately grasp the depth of the biological tissue at the surgical site. Note that when the imaging unit 11402 is configured as a multi-chip type, multiple lens units 11401 may be provided corresponding to each imaging element.

[0267] Furthermore, the imaging unit 11402 does not necessarily have to be provided in the camera head 11102. For example, the imaging unit 11402 may be provided inside the lens barrel 11101, immediately after the objective lens.

[0268] The driving unit 11403 is configured by an actuator, and moves the zoom lens and focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. This allows the magnification and focus of the image captured by the imaging unit 11402 to be adjusted appropriately.

[0269] The communication unit 11404 is configured by a communication device for transmitting and receiving various types of information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 to the CCU 11201 via the transmission cable 11400 as RAW data.

[0270] Furthermore, the communication unit 11404 receives a control signal for controlling the driving of the camera head 11102 from the CCU 11201 and supplies the control signal to the camera head control unit 11405. The control signal includes information on the imaging conditions, such as information specifying the frame rate of the captured image, information specifying the exposure value at the time of imaging, and / or information specifying the magnification and focus of the captured image.

[0271] The image capturing conditions such as the frame rate, exposure value, magnification, and focus may be appropriately specified by the user, or may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. In the latter case, the endoscope 11100 is equipped with so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function.

[0272] The camera head control unit 11405 controls the driving of the camera head 11102 based on a control signal received from the CCU 11201 via the communication unit 11404 .

[0273] The communication unit 11411 is configured by a communication device for transmitting and receiving various information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.

[0274] Furthermore, the communication unit 11411 transmits to the camera head 11102 a control signal for controlling the driving of the camera head 11102. The image signal and the control signal can be transmitted by electrical communication, optical communication, or the like.

[0275] The image processing unit 11412 performs various image processing operations on the image signal, which is RAW data sent from the camera head 11102 .

[0276] The control unit 11413 performs various controls related to the imaging of the surgical site, etc. by the endoscope 11100 and the display of the captured image obtained by imaging the surgical site, etc. For example, the control unit 11413 generates a control signal for controlling the driving of the camera head 11102.

[0277] Furthermore, the control unit 11413 causes the display device 11202 to display a captured image showing the surgical site, etc., based on the image signal that has been image processed by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition technologies. For example, the control unit 11413 can recognize surgical tools such as forceps, specific biological parts, bleeding, mist generated when using the energy treatment tool 11112, etc., by detecting the shape and color of the edges of objects included in the captured image. When displaying the captured image on the display device 11202, the control unit 11413 may use the recognition results to superimpose various surgical support information on the image of the surgical site. By superimposing the surgical support information and presenting it to the surgeon 11131, the burden on the surgeon 11131 can be reduced and the surgeon 11131 can proceed with the surgery reliably.

[0278] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable for communication of electrical signals, an optical fiber for optical communication, or a composite cable of these.

[0279] In the illustrated example, communication is performed by wire using the transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may also be performed wirelessly.

[0280] An example of an endoscopic surgery system to which the technology according to the present disclosure can be applied has been described above. Of the above-described configurations, the technology according to the present disclosure can be applied to the endoscope 11100 and the imaging unit 11402 of the camera head 11102. Specifically, the imaging device 1 in FIG. 1 can be applied to the imaging unit 11402. By applying the technology according to the present disclosure to the imaging unit 11402, the imaging unit 11402 can be made smaller.

[0281] Although an endoscopic surgery system has been described as an example here, the technology disclosed herein may also be applied to other systems, such as a microsurgery system.

[0282] The configuration of the seventh embodiment of the present disclosure can be applied to other embodiments. Specifically, the separation unit 173 in Fig. 29A and the separation unit 174 in Fig. 29B can be applied to the second to sixth and eighth to tenth embodiments of the present disclosure.

[0283] (effect) The imaging device 1 has pixels 541, pixel circuits 210, separators 171, embedded electrodes (embedded electrodes 161 and 162), and connection portions (through-hole electrodes 251 and 252). The pixels 541 include a photoelectric conversion unit 101 disposed on a first semiconductor substrate 120 and performing photoelectric conversion of incident light, a charge holding unit 103 that holds charges generated by the photoelectric conversion, and a charge transfer unit 102 that transfers the charges from the photoelectric conversion unit 101 to the charge holding unit 103. The pixel circuits 210 are disposed on a second semiconductor substrate 220 stacked on the surface side of the first semiconductor substrate 120 and generate image signals based on the held charges. The separators 171 are disposed at the boundaries of the pixels 541. The embedded electrodes (embedded electrodes 161 and 162) are disposed embedded on the surface side of the first semiconductor substrate 120 at the boundaries of the pixels 541 that overlap the separators 171, and are connected to the first semiconductor substrate 120. The connection portions (through electrodes 251 and 252) are connected to the embedded electrodes (embedded electrodes 161 and 162). This brings about the effect that the embedded electrodes that transmit signals and the like are arranged at the boundaries of the pixels, thereby enabling the pixel size to be reduced.

[0284] Moreover, the pixel 541 may further include boundary wirings (boundary wirings 163 and 164) that are arranged at the boundaries of the pixel 541 and connected to the embedded electrodes (embedded electrodes 161 and 162). This allows the embedded electrodes to be connected to each other at the boundaries of the pixel 541.

[0285] Moreover, the boundary wiring (boundary wiring 163) may be disposed so as to be embedded in the first semiconductor substrate 120.

[0286] Moreover, the boundary wiring (boundary wiring 164) may be disposed adjacent to the front surface side of the first semiconductor substrate 120.

[0287] Furthermore, the connection portions (through electrodes 251 and 252) may be connected to the embedded electrodes (embedded electrodes 161 and 162) via the boundary wirings (boundary wirings 163 and 164). This allows the arrangement location of the connection portions to be expanded.

[0288] Furthermore, the buried electrode (buried electrode 161) may be connected to a well region of the first semiconductor substrate 120, and the connection portion (through electrode 251) may supply a reference potential. This allows the reference potential to be supplied via the buried electrode (buried electrode 161).

[0289] Furthermore, the embedded electrode (embedded electrode 161) may be configured in a shape that surrounds the pixel 541. This allows the embedded electrode (embedded electrode 161) to have a low resistance in the surface direction of the semiconductor substrate.

[0290] Furthermore, a plurality of the pixels 541 may be arranged on the first semiconductor substrate 120.

[0291] Furthermore, the embedded electrode (embedded electrode 161) may be commonly connected to the well regions of the pixels 541 of a pixel group 538 configured by two or more pixels 541 of the plurality of pixels 541. This allows the embedded electrode (embedded electrode 161) to be shared by the pixels 541 arranged in the pixel group 538.

[0292] Furthermore, the connection portion (through electrode 251) may be disposed for each pixel group 538. This makes it possible to reduce the number of connection portions.

[0293] Furthermore, the connection portions (through electrodes 251) may be disposed on the first semiconductor substrate 120 outside the plurality of pixels 541. This makes it possible to reduce the number of connection portions.

[0294] Furthermore, the pixel circuit 210 may be arranged in each pixel sharing unit 539 configured by two or more pixels 541 out of the plurality of pixels 541. This allows the pixel circuit 210 to be shared by the plurality of pixels arranged in the pixel sharing unit 639.

[0295] The pixel sharing unit 539 may further include an electrode 143 connected to the charge retention unit 103, and a charge retention unit wiring 142 disposed between the first semiconductor substrate 120 and the second semiconductor substrate 220 and commonly connected to the electrode 143 of each of the plurality of pixels 541 included in the pixel sharing unit 539, and the charge retention unit wiring 142 may be connected to the pixel circuit 210. This makes it possible to reduce the number of connection parts that penetrate the second semiconductor substrate 220.

[0296] The pixel sharing unit 539 may further include a charge transfer unit wiring 144 that is disposed between the first semiconductor substrate 120 and the second semiconductor substrate 220, transmits a control signal to the charge transfer unit 102, and is commonly connected to the charge transfer units 102 of the different pixel sharing units 539, and an electrode 143 that is connected to the charge transfer unit wiring and supplies the control signal. This makes it possible to reduce the number of connection parts that penetrate the second semiconductor substrate 220.

[0297] Furthermore, the connection portion (through electrode 251) may be connected to a well region in which elements of the pixel circuit 210 are arranged in the second semiconductor substrate 220. This allows the first semiconductor substrate 120 and the second semiconductor substrate 220 to have a common well potential.

[0298] Furthermore, the embedded electrode (embedded electrode 162) may be connected to the charge holding section 103, and the connection section (through electrode 252) may be connected to the pixel circuit 210. This allows the potential of the charge holding section 103 to be transmitted via the electrode (embedded electrode 162).

[0299] Furthermore, a plurality of the pixels 541 may be arranged on the first semiconductor substrate 120, and the pixel circuit 210 may be arranged for each pixel sharing unit 539 configured by two or more pixels 541 among the plurality of pixels 541. This allows the pixel circuit 210 to be shared by the plurality of pixels 541 arranged in the pixel sharing unit 539.

[0300] Furthermore, the embedded electrode (embedded electrode 162) may be commonly connected to the charge holding units 103 of the pixels 541 in the pixel sharing unit 539. This allows the embedded electrode (embedded electrode 162) to be shared by the multiple pixels 541 arranged in the pixel sharing unit 539.

[0301] Furthermore, the buried electrode (buried electrode 162) may be configured to have a shape that protrudes from the first semiconductor substrate 120, and the charge transfer section 102 may be configured by a MOS transistor including a gate electrode 131 having a height that is equal to or less than the protrusion height of the buried electrode (buried electrode 162) from the first semiconductor substrate 120. This makes it possible to reduce the parasitic capacitance of the charge holding section 103 to which the buried electrode (buried electrode 162) is connected.

[0302] Furthermore, the connection portion (through electrode 251) may be connected to the well region via a semiconductor region 123, which is a semiconductor region with a high impurity concentration formed in the first semiconductor substrate 120. This makes it possible to reduce the connection resistance between the connection portion (through electrode 251) and the first semiconductor substrate 120.

[0303] The buried electrodes (buried electrodes 161 and 162) may be made of silicon, which allows a high-temperature process to be employed in the manufacturing process after the buried electrodes (buried electrodes 161 and 162) are formed.

[0304] The separation portion 171 may be configured to penetrate through the first semiconductor substrate 120. This can improve separation performance.

[0305] The separating portion 171 may be made of an insulating material.

[0306] The separating portion 171 may be made of a semiconductor region with a high impurity concentration.

[0307] The device may further include a third semiconductor substrate 320 that is stacked on a side of the second semiconductor substrate 220 different from the side on which the first semiconductor substrate 120 is arranged and that has a circuit connected to the pixel circuit 210.

[0308] The charge transfer section 102 may be configured by a MOS transistor that includes a channel region disposed in a protruding section 126 formed on the surface side of the first semiconductor substrate 120 and a gate electrode 132 adjacent to a side surface of the protruding section 126 via an insulating film, and transfers the charges in the thickness direction of the first semiconductor substrate 120. This allows the area of ​​the charge transfer section 102 to be reduced.

[0309] The protrusion 126 may also be formed by grinding the surface side of the first semiconductor substrate 120 into the shape of an annular groove. This has the effect of embedding the protrusion 126 in the first semiconductor substrate 120. The surface side of the first semiconductor substrate 120 can be made flat.

[0310] The gate electrode 132 may be configured to surround the side surface of the protrusion 126. This allows the effective channel width to be increased.

[0311] The charge holding section 103 may be disposed at the end of the protrusion 126. This makes it possible to omit wiring between the charge transfer section 102 and the charge holding section 103.

[0312] Furthermore, the gate electrode 132 may be disposed at a distance from the charge holding portion 103 in the thickness direction of the first semiconductor substrate 120. This makes it possible to reduce the electric field between the gate electrode 132 and the charge holding portion 103.

[0313] Furthermore, the channel region may be configured to have a different conductivity type from the well region of the first semiconductor substrate 120. This allows a depletion-type MOS transistor to be configured.

[0314] The imaging device 1 includes pixels 541, pixel circuits 210, separators 171, embedded electrodes (embedded electrodes 161 and 162), connection sections (through-electrodes 251 and 252), and a column signal processing section 550. The pixels 541 include a photoelectric conversion section 101 disposed on a first semiconductor substrate 120 and performing photoelectric conversion of incident light, a charge holding section 103 that holds charges generated by the photoelectric conversion, and a charge transfer section 102 that transfers the charges from the photoelectric conversion section 101 to the charge holding section 103. The pixel circuits 210 are disposed on a second semiconductor substrate 220 stacked on the surface side of the first semiconductor substrate 120 and generate image signals based on the held charges. The separators 171 are disposed at the boundaries of the pixels 541. The embedded electrodes (embedded electrodes 161 and 162) are disposed embedded on the surface side of the first semiconductor substrate 120 at the boundaries of the pixels 541 that overlap the separators 171, and are connected to the first semiconductor substrate 120. The connection parts (through electrodes 251 and 252) are connected to the embedded electrodes (embedded electrodes 161 and 162). The column signal processing unit 550 processes the generated image signals. This brings about the effect that the embedded electrodes that transmit signals etc. are arranged at the boundaries of the pixels, thereby enabling the pixel size to be reduced.

[0315] The effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0316] The present technology can also be configured as follows. (1) a pixel including a photoelectric conversion unit disposed on a first semiconductor substrate and performing photoelectric conversion of incident light, a charge storage unit that stores charges generated by the photoelectric conversion, and a charge transfer unit that transfers the charges from the photoelectric conversion unit to the charge storage unit; a pixel circuit disposed on a second semiconductor substrate stacked on the front surface side of the first semiconductor substrate, the pixel circuit generating an image signal based on the stored electric charges; a separation portion disposed at a boundary of the pixel; a buried electrode disposed on the front surface side of the first semiconductor substrate at the boundary of the pixel overlapping with the isolation portion and connected to the first semiconductor substrate; a connection portion connected to the buried electrode; An imaging element having (2) The imaging element according to (1), further comprising boundary wiring arranged at the boundary of the pixel and connected to the embedded electrode. (3) The image sensor according to (2), wherein the boundary wiring is embedded in the first semiconductor substrate. (4) The image sensor according to (2), wherein the boundary wiring is disposed adjacent to the front surface side of the first semiconductor substrate. (5) The imaging element according to (2), wherein the connection portion is connected to the embedded electrode via the boundary wiring. (6) the buried electrode is connected to a well region of the first semiconductor substrate; The connection provides a reference potential The imaging element according to any one of (1) to (5) above. (7) The imaging element according to (6), wherein the embedded electrode is configured in a shape that surrounds the pixel. (8) The imaging element according to (6), wherein a plurality of the pixels are arranged on the first semiconductor substrate. (9) The imaging element according to (8), wherein the buried electrode is commonly connected to the well region of each pixel of a pixel group made up of two or more pixels among the plurality of pixels. (10) The imaging element according to (9), wherein the connection portion is arranged for each of the pixel groups. (11) The imaging element according to (8), wherein the connection portion is disposed on the first semiconductor substrate outside the plurality of pixels. (12) The imaging element according to (8), wherein the pixel circuit is arranged for each pixel sharing unit configured by two or more pixels among the plurality of pixels. (13) a second connection portion connected to the charge storage portion; a charge retention unit wiring that is disposed between the first semiconductor substrate and the second semiconductor substrate and is commonly connected to the second connection unit of each of the plurality of pixels included in the pixel sharing unit; and and The charge storage wiring is connected to the pixel circuit. The imaging element according to (12) above. (14) a charge transfer unit wiring that is disposed between the first semiconductor substrate and the second semiconductor substrate, transmits a control signal to the charge transfer unit, and is commonly connected to the charge transfer units of the different pixel sharing units; a second connection portion connected to the charge transfer portion wiring and supplying the control signal; The imaging element according to (12) above, further comprising: (15) The imaging element according to any one of (6) to (14), wherein the connection portion is connected to a well region in the second semiconductor substrate where elements of the pixel circuit are arranged. (16) The imaging element according to any one of (6) to (14), wherein the embedded electrodes are configured in a strip shape in a plan view. (17) the buried electrode is connected to the charge storage portion; The connection portion is connected to the pixel circuit. The imaging element according to (1) above. (18) A plurality of the pixels are disposed on the first semiconductor substrate. The pixel circuit is arranged for each pixel sharing unit configured by two or more pixels among the plurality of pixels. The imaging element according to (17) above. (19) The imaging element according to (18), wherein the embedded electrode is commonly connected to the charge storage portion of each pixel in the pixel sharing unit. (20) the buried electrode is configured to protrude from the first semiconductor substrate, The charge transfer section is composed of a MOS transistor having a gate electrode with a height equal to or less than the height of the buried electrode protruding from the first semiconductor substrate. The imaging element according to any one of (17) to (19) above. (twenty one) The imaging element according to any one of (6) to (20), wherein the connection portion is connected to the well region via a high-concentration impurity region, which is a semiconductor region with a high impurity concentration formed in the first semiconductor substrate. (twenty two) The imaging element according to any one of (1) to (21), wherein the buried electrode contains silicon. (twenty three) The imaging element according to any one of (1) to (22), wherein the separation portion is configured to have a shape that penetrates the first semiconductor substrate. (twenty four) The imaging element according to any one of (1) to (23), wherein the separation section is made of an insulating material. (twenty five) The imaging element according to any one of (1) to (23), wherein the separation section is configured by a semiconductor region with a high impurity concentration. (26) The imaging element described in any one of (1) to (25), further comprising a third semiconductor substrate stacked on a side of the second semiconductor substrate different from the side on which the first semiconductor substrate is arranged and having a circuit connected to the pixel circuit. (27) The image sensor according to any one of (1) to (26), wherein the charge transfer section is composed of a MOS transistor having a channel region disposed in a protrusion formed on the surface side of the first semiconductor substrate and a gate electrode adjacent to a side surface of the protrusion via an insulating film, and transferring the charge in the thickness direction of the first semiconductor substrate. (28) The imaging element according to (27), wherein the protrusion is formed by grinding the front surface side of the first semiconductor substrate into the shape of an annular groove. (29) The imaging element according to (27), wherein the gate electrode is configured in a shape that surrounds the side surface of the protrusion. (30) The imaging element according to any one of (27) to (29), wherein the charge holding portion is disposed at an end of the protrusion. (31) The imaging element according to (30), wherein the gate electrode is disposed apart from the charge storage portion in the thickness direction of the first semiconductor substrate. (32) The imaging element according to any one of (27) to (31), wherein the channel region is configured to have a conductivity type different from that of a well region of the first semiconductor substrate. (33) a pixel including a photoelectric conversion unit disposed on a first semiconductor substrate and performing photoelectric conversion of incident light, a charge storage unit that stores charges generated by the photoelectric conversion, and a charge transfer unit that transfers the charges from the photoelectric conversion unit to the charge storage unit; a pixel circuit disposed on a second semiconductor substrate stacked on the front surface side of the first semiconductor substrate, the pixel circuit generating an image signal based on the stored electric charges; a separation portion disposed at a boundary of the pixel; a buried electrode disposed on the front surface side of the first semiconductor substrate at the boundary of the pixel overlapping with the isolation portion and connected to the first semiconductor substrate; a connection portion connected to the buried electrode; a processing circuit for processing the generated image signal; An imaging device having the above configuration. [Explanation of symbols]

[0317] 1. Imaging device 100S, 200S, 300S Semiconductor layer 100T, 200T, 300T wiring layer 101, 101A, 101B Photoelectric conversion unit 102, 102A, 102B charge transfer section 103, 103A, 103B Charge holding section 120 First semiconductor substrate 123, 123A, 123B Semiconductor area 124 channel region 126 Protrusion 128 Annular groove 129 insulating film 132 gate electrode 134 Separation part 142 Charge holding part wiring 143 Electrode 144, 144A, 144B, 144C, 144D Charge transfer wiring 161, 162, 165, 166 Implanted electrodes 163, 164 Boundary wiring 171, 173, 174 Separation section 179 Groove 210 pixel circuit 220 Second semiconductor substrate 251~254 Through electrode 320 third semiconductor substrate 538 pixel groups 539, 539A, 539B, 539E, 539F pixel sharing unit 540 pixel array section 541, 541A, 541B, 541C, 541D pixels 550 column signal processing section 11402, 12031, 12101~12105 Imaging unit

Claims

1. a pixel including a photoelectric conversion unit disposed on a first semiconductor substrate and performing photoelectric conversion of incident light, a charge retention unit that retains charges generated by the photoelectric conversion, and a charge transfer unit that transfers the charges from the photoelectric conversion unit to the charge retention unit; a pixel circuit disposed on a second semiconductor substrate stacked on the front surface side of the first semiconductor substrate, the pixel circuit generating an image signal based on the stored electric charges; a separation portion disposed at a boundary of the pixel; a buried electrode disposed on the front surface side of the first semiconductor substrate at the boundary of the pixel overlapping with the isolation portion and connected to the first semiconductor substrate; a connection portion connected to the buried electrode; An imaging element having

2. 2. The image sensor according to claim 1, further comprising boundary wiring arranged at the boundary of the pixel and connected to the embedded electrode.

3. The image sensor according to claim 2 , wherein the boundary wiring is disposed so as to be embedded in the first semiconductor substrate.

4. The image sensor according to claim 2 , wherein the boundary wiring is disposed adjacent to the front surface side of the first semiconductor substrate.

5. The imaging device according to claim 2 , wherein the connection portion is connected to the buried electrode via the boundary wiring.

6. the buried electrode is connected to a well region of the first semiconductor substrate; The connection provides a reference potential The imaging device according to claim 1 .

7. 7. The imaging device according to claim 6, wherein the buried electrode is configured to surround the pixel.

8. The imaging device according to claim 6 , wherein a plurality of the pixels are arranged on the first semiconductor substrate.

9. 9. The image sensor according to claim 8, wherein the buried electrode is commonly connected to the well region of each pixel of a pixel group made up of two or more pixels among the plurality of pixels.

10. The image sensor according to claim 9 , wherein the connection portion is arranged for each of the pixel groups.

11. The imaging device according to claim 8 , wherein the connection portion is disposed on the first semiconductor substrate outside the plurality of pixels.

12. The imaging device according to claim 8 , wherein the pixel circuit is arranged for each pixel sharing unit configured by two or more pixels of the plurality of pixels.

13. a second connection portion connected to the charge storage portion; a charge retention unit wiring that is disposed between the first semiconductor substrate and the second semiconductor substrate and is commonly connected to the second connection unit of each of the plurality of pixels included in the pixel sharing unit; and The charge storage wiring is connected to the pixel circuit. The imaging device according to claim 12.

14. a charge transfer unit wiring that is disposed between the first semiconductor substrate and the second semiconductor substrate, transmits a control signal to the charge transfer unit, and is commonly connected to the charge transfer units of the different pixel sharing units; a second connection portion connected to the charge transfer portion wiring and supplying the control signal; The imaging device according to claim 12 , further comprising:

15. The imaging device according to claim 6 , wherein the connection portion is connected to a well region of the second semiconductor substrate in which elements of the pixel circuit are arranged.

16. The imaging device according to claim 6 , wherein the buried electrodes are configured in a strip shape in a plan view.

17. the buried electrode is connected to the charge storage portion; The connection portion is connected to the pixel circuit. The imaging device according to claim 1 .

18. A plurality of the pixels are disposed on the first semiconductor substrate. The pixel circuit is arranged for each pixel sharing unit configured by two or more pixels among the plurality of pixels. The imaging device according to claim 17.

19. The imaging device according to claim 18 , wherein the embedded electrode is commonly connected to the charge storage portion of each pixel in the pixel sharing unit.

20. the buried electrode is configured to protrude from the first semiconductor substrate, The charge transfer section is composed of a MOS transistor having a gate electrode with a height equal to or less than the height of the buried electrode protruding from the first semiconductor substrate. The imaging device according to claim 17.

21. 7. The image sensor according to claim 6, wherein the connection portion is connected to the well region via a high-concentration impurity region, which is a semiconductor region with a high impurity concentration formed in the first semiconductor substrate.

22. The imaging device according to claim 1 , wherein the buried electrode comprises silicon.

23. The imaging device according to claim 1 , wherein the separation portion is configured to penetrate through the first semiconductor substrate.

24. The imaging device according to claim 1 , wherein the separating portion is made of an insulating material.

25. 2. The image sensor according to claim 1, wherein the separating portion is formed of a semiconductor region with a high impurity concentration.

26. 2. The imaging element according to claim 1, further comprising a third semiconductor substrate stacked on a side of the second semiconductor substrate different from the side on which the first semiconductor substrate is disposed, the third semiconductor substrate including a circuit connected to the pixel circuit.

27. 2. The image sensor according to claim 1, wherein the charge transfer section is composed of a MOS transistor having a channel region disposed in a protrusion formed on the surface side of the first semiconductor substrate and a gate electrode adjacent to a side surface of the protrusion via an insulating film, and transferring the charges in a thickness direction of the first semiconductor substrate.

28. 28. The image sensor according to claim 27, wherein the protrusion is formed by grinding the front surface side of the first semiconductor substrate into the shape of an annular groove.

29. The image sensor according to claim 27 , wherein the gate electrode is configured to surround a side surface of the protrusion.

30. The imaging device according to claim 27 , wherein the charge holding portion is disposed at an end of the protrusion.

31. 31. The image sensor according to claim 30, wherein the gate electrode is disposed apart from the charge storage portion in the thickness direction of the first semiconductor substrate.

32. 28. The imaging device according to claim 27, wherein the channel region is configured to have a different conductivity type from a well region of the first semiconductor substrate.

33. a pixel including a photoelectric conversion unit disposed on a first semiconductor substrate and performing photoelectric conversion of incident light, a charge retention unit that retains charges generated by the photoelectric conversion, and a charge transfer unit that transfers the charges from the photoelectric conversion unit to the charge retention unit; a pixel circuit disposed on a second semiconductor substrate stacked on the front surface side of the first semiconductor substrate, the pixel circuit generating an image signal based on the stored electric charges; a separation portion disposed at a boundary of the pixel; a buried electrode disposed on the front surface side of the first semiconductor substrate at the boundary of the pixel overlapping with the isolation portion and connected to the first semiconductor substrate; a connection portion connected to the buried electrode; a processing circuit for processing the generated image signal; An imaging device having the above configuration.

Images