Manufacturing method of the structure

JP7757319B2Active Publication Date: 2025-10-21FUJIFILM CORP
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Patent Information

Application Number
JP2022572095
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-12-24
Filing Date
2021-12-08
Publication Date
2025-10-21
Estimated Expiration
2041-12-08

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Patent Text Reader

Abstract

Provided is a manufacturing method for a structure having excellent workability. This manufacturing method for a structure has: a pattern formation step for forming an electrically insulating pattern film on one surface of an electrically insulating film which has multiple through-holes extending in a thickness direction; a first metal layer formation step for forming a first metal layer in regions of the one surface other than the regions where the pattern film is formed; a filling step for filling, with a metal, through-holes in contact with the first metal layer among the multiple through-holes; and a second metal layer formation step for forming a second metal layer in regions of the other surface of the insulating film where the first metal layer is present on the one surface located on the opposite side.
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Citation Information

Patent Citations

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  • Anisotropic conductive film, production method of the same, device, electron emission element, field emission lamp, and field emission display

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