Semiconductor module, semiconductor device, and method of manufacturing the semiconductor device

Abstract

The present invention minimizes damage to an insulating sheet when welding terminals of a semiconductor module.　A semiconductor module (10A) comprises an insulating sheet (14), a first terminal (13), and a second terminal (15) that extend outward from a resin case (11). The first terminal (13) has a first end (13a) that is disposed on a first surface (14a) side so as to overlap with the insulating sheet (14) in plan view, and is distanced from the first surface (14a). The second terminal (15) has a second end (15a) that is disposed on a second surface (14b) side so as to overlap with the insulating sheet (14) and the first terminal (13) in plan view, and is distanced from the second surface (14b). The insulating sheet (14) extends farther outward from the resin case (11) in comparison to the first end (13a) and the second end (15a). Welding is performed on the first end (13a) and the second end (15a) that are distanced from the insulating sheet (14), thereby minimizing damage to the insulating sheet (14) during welding.