Peeling incision device and peeling incision method
The peeling incision device addresses low accuracy in stripping incision devices by using a cutting mechanism with contact detection and servo motors to ensure precise cutting depth, enhancing accuracy for thick and deformed wires.
JP7760221B2Active Publication Date: 2025-10-27YAZAKI CORP
Patent Information
- Application Number
- JP2023111456
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2023-07-06
- Publication Date
- 2025-10-27
- Estimated Expiration
- 2043-07-06
AI Technical Summary
Technical Problem
Existing stripping incision devices for insulated electric wires suffer from low cutting accuracy due to large tolerances and deformation of thick wires or wires stored on bobbins, leading to inconsistent incisions.
Method used
A peeling incision device with a cutting mechanism, rotation mechanism, and contact detection system that adjusts the cutting depth based on contact with the outermost conductor, using servo motors for precise movement and connection of the cutting cutter blade.
Benefits of technology
Improves incision accuracy by reducing the influence of stacking tolerances and deformation, ensuring consistent cutting depth even for thick wires or deformed wires stored on bobbins.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 0007760221000001 
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Abstract
To provide a slitting device and slitting method for peeling that can improve the slitting accuracy when the target is a thick wire or a covered wire wound around a bobbin and stored.SOLUTION: A cut mechanism 11 of a slitting device 1 for peeling includes a conductive cutter blade 111 for slitting, a contact detection part 113 that detects contact between an outermost conductor of a covered wire 2 and the cutter blade 111 for slitting on the basis of a current flowing through an electric circuit including a power source connection part 13, the outermost conductor, and the cutter blade 111 for slitting, a movement mechanism 112 for slitting, which is a mechanism that moves the cutter blade 111 for slitting in an intersecting direction D12 with respect to an outer surface 2a, and that adjusts the position of the cutter blade 111 for slitting in the intersecting direction D12 to a position corresponding to the specified slitting depth and makes slitting when contact is detected by a contact detection part 113 during movement of the cutter blade 111 for slitting.SELECTED DRAWING: Figure 1
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Citation Information
Patent Citations
Stripping device for electric wire
JP2000350324A
Device and Use of the Device for Stripping a Cable
US20230155360A1