Control device and mold device setup method

Abstract

To provide a control device that improves productivity, and a preparation method for a mold device.SOLUTION: There is proved a control device for controlling a preparation device that performs a preparation work for both an injection molding machine having a mold clamping device to which a mold device is attached, as well as the mold device. The control device comprises: performing a production process of a molded product using a currently-using mold device; then performing a production process of a molded product using a next mold device; performing a preparation work for the next mold device during production of a molded product by the currently-using mold device in the preparation work of the mold device for the next mold; and starting the preparation work of the mold device for the next mold in accordance with a progress of the production process using the currently-using mold.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a control device and a setup method for a mold device. [Background technology]

[0002] When a mold is replaced and molding is performed in an injection molding machine, a number of setup operations are performed, such as changing the mold, adjusting the mold thickness of the mold clamping device, and purging the injection device of molding material.

[0003] Patent Document 1 discloses an injection molding machine equipped with a mold changing means for automatically changing molds. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 7-9524 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the longer the setup time, the shorter the operating time of the injection molding machine, which may result in a decrease in the productivity of the injection molding machine. For this reason, there is a demand for shortening the setup time.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a control device and a setup method for a mold device that improves productivity. [Means for solving the problem]

[0007] The control device according to one aspect of the embodiment is an injection molding machine having a mold clamping device to which a mold device is attached, The aforementioned A control device for controlling a setup device that performs setup work on a mold device, the setup device comprises a mold changing device including a carriage having a first placement section and a second placement section on which the mold device is placed, and a temperature control device that controls the temperature of the mold device placed on the first placement section and / or the second placement section,a production process of a molded product by a next mold device is carried out after a production process of a molded product by a current mold device, and in the setup work of the next mold device, the setup work of the next mold device is carried out while the molded product is being produced by the current mold device, and the setup work of the next mold device is started according to the progress of the production process of the current mold, and the setup work of the next mold device is a temperature adjustment work of the next mold device, The carriage is placed at a standby position, and the mold device for the next mold is placed on the first placement portion, During the production of a molded product by the current mold device, a temperature control operation of the next mold device is started, The temperature control operation of the next mold device is continued until the production of the molded product by the current mold device is completed, and the carriage is moved from the standby position to the delivery position. Before moving, finish the temperature control work of the mold device for the next mold. the second mounting portion of the carriage is moved to the transfer position, the mold device for the current mold is moved from the mold clamping device to the second mounting portion, the first mounting portion of the carriage is moved to the transfer position, and the mold device for the next mold is carried into the mold clamping device. . [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a control device and a mold device setup method that improve productivity. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a configuration diagram of an injection molding machine system according to an embodiment; [Figure 2] FIG. 1 is a block diagram illustrating an example of an injection molding system according to an embodiment of the present invention. [Figure 3] 10 is an example of a display screen displayed on a display device. [Figure 4] 4 is a Gantt chart illustrating an example of a setup operation in the injection molding system S according to the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, identical or corresponding components are designated by identical or corresponding reference numerals, and the description thereof will be omitted.

[0011] Injection molding system according to one embodiment An injection molding system S according to one embodiment will be described with reference to Fig. 1. Fig. 1 is a plan view of the injection molding system S according to one embodiment. In Fig. 1, the X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to one another. The X-axis direction and Y-axis direction represent horizontal directions, and the Z-axis direction represents vertical directions. When the mold clamping unit 100 is of a horizontal type, the X-axis direction is the mold opening / closing direction, and the Y-axis direction is the width direction of the injection molding machine 10. The negative side of the Y-axis direction is called the operation side, and the positive side of the Y-axis direction is called the counter-operation side.

[0012] The injection molding system S includes an injection molding machine 10. The injection molding system S also includes a mold exchange device 20, a clamp device 30, and an auto-coupler 40 as peripheral devices.

[0013] <Injection molding machine> The injection molding machine 10 has a mold clamping unit 100, an ejector unit (not shown), an injection unit 300, a moving unit (not shown), a molding machine control device 700, and a frame 900. The frame 900 includes a mold clamping unit frame 910 and an injection unit frame 920. The mold clamping unit frame 910 and the injection unit frame 920 are each installed on a floor (not shown) via leveling adjusters (not shown). The molding machine control device 700 is disposed in the internal space of the injection unit frame 920. Each component of the injection molding machine 10 will be described below.

[0014] (mold clamping device) In the description of the mold clamping unit 100, the moving direction of the movable platen 120 during mold closing (for example, the positive X-axis direction) is defined as the front, and the moving direction of the movable platen 120 during mold opening (for example, the negative X-axis direction) is defined as the rear.

[0015] The mold clamping unit 100 closes, pressurizes, releases pressure, and opens the mold of the mold assembly 800. The operation from the start of pressurization to the end of release pressure is also called mold clamping. The mold assembly 800 includes a fixed mold 810 and a movable mold 820.

[0016] The mold clamping unit 100 is, for example, a horizontal type, and the mold opening and closing direction is horizontal. The mold clamping unit 100 has a fixed platen 110, a movable platen 120, a toggle support 130, tie bars 140, a toggle mechanism 150, a mold clamping motor 160, a motion conversion mechanism (not shown), and a mold thickness adjustment mechanism 180.

[0017] The stationary platen 110 is fixed to the mold clamping unit frame 910. A stationary mold 810 is attached to the surface of the stationary platen 110 that faces the movable platen 120.

[0018] The movable platen 120 is disposed so as to be movable in the mold opening / closing direction relative to the mold clamping unit frame 910. A guide (not shown) for guiding the movable platen 120 is installed on the mold clamping unit frame 910. A movable mold 820 is attached to the surface of the movable platen 120 facing the fixed platen 110. By moving the movable platen 120 back and forth relative to the fixed platen 110, mold closing, pressurization, depressurization, and mold opening of the mold device 800 are performed.

[0019] The toggle support 130 is disposed at a distance from the fixed platen 110, and is placed on the mold clamping unit frame 910 so as to be freely movable in the mold opening and closing direction. The toggle support 130 may be disposed so as to be freely movable along a guide laid on the mold clamping unit frame 910. The guide of the toggle support 130 may be the same as the guide of the movable platen 120 (not shown).

[0020] In this embodiment, the fixed platen 110 is fixed to the mold clamping unit frame 910, and the toggle support 130 is arranged so as to be freely movable in the mold opening and closing direction relative to the mold clamping unit frame 910, but the toggle support 130 may also be fixed to the mold clamping unit frame 910, and the fixed platen 110 may be arranged so as to be freely movable in the mold opening and closing direction relative to the mold clamping unit frame 910.

[0021] The tie bars 140 connect the fixed platen 110 and the toggle support 130 at intervals in the mold opening / closing direction. A plurality of tie bars 140 (for example, four) may be used. The plurality of tie bars 140 are arranged parallel to the mold opening / closing direction and extend in accordance with the mold clamping force. At least one tie bar 140 may be provided with a tie bar strain detector (not shown) that detects strain in the tie bar 140. The tie bar strain detector (not shown) sends a signal indicating the detection result to the molding machine control device 700. The detection result of the tie bar strain detector (not shown) is used to detect the mold clamping force, etc.

[0022] In this embodiment, a tie bar strain detector (not shown) is used as the clamping force detector for detecting the clamping force, but the technology of the present disclosure is not limited to this. The clamping force detector is not limited to the strain gauge type, and may be a piezoelectric type, a capacitance type, a hydraulic type, an electromagnetic type, or the like, and the attachment position thereof is also not limited to the tie bar 140.

[0023] The toggle mechanism 150 is disposed between the movable platen 120 and the toggle support 130, and moves the movable platen 120 in the mold opening / closing direction relative to the toggle support 130. The toggle mechanism 150 is composed of a crosshead 151, a pair of link groups, etc. Each of the pair of link groups has a first link 152 and a second link 153 that are connected to each other so as to be flexible and extendable by a pin or the like. The first link 152 is attached to the movable platen 120 so as to be swingable by a pin or the like, and the second link 153 is attached to the toggle support 130 so as to be swingable by a pin or the like. The second link 153 is attached to the crosshead 151 via a third link (not shown). When the crosshead 151 is advanced or retracted relative to the toggle support 130, the first link 152 and the second link 153 are bent or retracted, and the movable platen 120 advances or retracts relative to the toggle support 130.

[0024] The configuration of the toggle mechanism 150 is not limited to the above configuration. For example, although the number of joints in each link group is five in the above description, it may be four, and one end of the third link (not shown) may be connected to the joint between the first link 152 and the second link 153.

[0025] The mold clamping motor 160 is attached to the toggle support 130 and operates the toggle mechanism 150. The mold clamping motor 160 moves the crosshead 151 forward and backward relative to the toggle support 130, thereby bending and extending the first link 152 and the second link 153 and moving the movable platen 120 forward and backward relative to the toggle support 130. The mold clamping motor 160 is directly connected to a motion conversion mechanism (not shown), but may also be connected to the motion conversion mechanism (not shown) via a belt, pulley, or the like.

[0026] The motion conversion mechanism (not shown) converts the rotational motion of the mold clamping motor 160 into the linear motion of the crosshead 151. The motion conversion mechanism (not shown) includes a screw shaft and a screw nut that screws onto the screw shaft. A ball or roller may be interposed between the screw shaft and the screw nut.

[0027] The mold clamping unit 100 performs a mold closing process, a pressure increasing process, a pressure decreasing process, a mold opening process, and the like under the control of the molding machine control device 700.

[0028] In the mold closing process, the mold clamping motor 160 is driven to move the crosshead 151 forward at a set movement speed to the mold closing completion position, thereby moving the movable platen 120 forward and bringing the movable mold 820 into contact with the fixed mold 810. The position and movement speed of the crosshead 151 are detected using, for example, a mold clamping motor encoder 161. The mold clamping motor encoder 161 detects the rotation of the mold clamping motor 160 and sends a signal indicating the detection result to the molding machine control device 700.

[0029] The crosshead position detector that detects the position of the crosshead 151 and the crosshead movement speed detector that detects the movement speed of the crosshead 151 are not limited to the mold clamping motor encoder 161, and general types can be used. Furthermore, the movable platen position detector that detects the position of the movable platen 120 and the movable platen movement speed detector that detects the movement speed of the movable platen 120 are not limited to the mold clamping motor encoder 161, and general types can be used.

[0030] In the pressure increase step, the mold clamping motor 160 is further driven to move the crosshead 151 further forward from the mold closing completion position to the mold clamping position, thereby generating a mold clamping force. During mold clamping, a cavity space (not shown) is formed between the movable mold 820 and the fixed mold 810, and the injection device 300 fills the cavity space (not shown) with liquid molding material. The filled molding material solidifies to obtain a molded product.

[0031] The number of cavity spaces (not shown) may be one or more. In the latter case, multiple molded products are obtained at the same time. An insert material may be placed in one part of the cavity space (not shown), and the molding material may be filled in another part of the cavity space (not shown). A molded product is obtained in which the insert material and the molding material are integrated.

[0032] In the depressurization process, the mold clamping motor 160 is driven to move the crosshead 151 back from the mold clamping position to the mold opening start position, thereby moving the movable platen 120 back and reducing the mold clamping force. The mold opening start position and the mold closing completion position may be the same position.

[0033] In the mold opening process, the mold clamping motor 160 is driven to move the crosshead 151 backward at a set moving speed from the mold opening start position to the mold opening completion position, thereby moving the movable platen 120 backward and separating the movable mold 820 from the fixed mold 810. Thereafter, an ejector device (not shown) ejects the molded product from the movable mold 820.

[0034] The setting conditions for the mold closing process and the pressure increase process are set together as a series of setting conditions. For example, the movement speed and position of the crosshead 151 in the mold closing process and the pressure increase process (including the mold closing start position, movement speed switching position, mold closing completion position, and mold clamping position), and the mold clamping force are set together as a series of setting conditions. The mold closing start position, movement speed switching position, mold closing completion position, and mold clamping position are arranged in this order from the rear side to the front, and represent the start and end points of the section for which the movement speed is set. The movement speed is set for each section. There may be one or more movement speed switching positions. The movement speed switching position does not have to be set. Only one of the mold clamping position and the mold clamping force may be set.

[0035] The setting conditions for the depressurization process and mold opening process are also set in a similar manner. For example, the movement speed and position of the crosshead 151 in the depressurization process and mold opening process (mold opening start position, movement speed switching position, and mold opening completion position) are set together as a series of setting conditions. The mold opening start position, movement speed switching position, and mold opening completion position are arranged in this order from the front to the rear, and represent the start and end points of the section for which the movement speed is set. The movement speed is set for each section. There may be one movement speed switching position, or multiple movement speed switching positions. The movement speed switching position does not have to be set. The mold opening start position and the mold closing completion position may be the same position. Furthermore, the mold opening completion position and the mold closing start position may be the same position.

[0036] It should be noted that the moving speed and position of the movable platen 120 may be set instead of the moving speed and position of the crosshead 151. Furthermore, the clamping force may be set instead of the position of the crosshead (e.g., clamping position) or the position of the movable platen.

[0037] The toggle mechanism 150 amplifies the driving force of the mold clamping motor 160 and transmits it to the movable platen 120. The amplification factor is also called the toggle factor. The toggle factor changes depending on the angle between the first link 152 and the second link 153 (hereinafter also referred to as the "link angle"). The link angle is determined from the position of the crosshead 151. When the link angle is 180°, the toggle factor is maximum.

[0038] When the thickness of the mold device 800 changes due to replacement of the mold device 800 or a temperature change in the mold device 800, the mold thickness is adjusted so that a predetermined clamping force is obtained during mold clamping. In mold thickness adjustment, for example, the distance between the fixed platen 110 and the toggle support 130 is adjusted so that the link angle of the toggle mechanism 150 becomes a predetermined angle at the time of mold touch when the movable mold 820 touches the fixed mold 810.

[0039] The mold clamping unit 100 has a mold thickness adjustment mechanism 180 that adjusts the mold thickness by adjusting the distance between the fixed platen 110 and the toggle support 130. The mold thickness adjustment mechanism 180 has, for example, a screw shaft formed at the rear end of the tie bar 140, a screw nut that is rotatably held by the toggle support 130 and cannot move forward or backward, and a mold thickness adjustment motor that rotates the screw nut that is screwed onto the screw shaft.

[0040] A screw shaft and a screw nut are provided for each tie bar 140. The rotational driving force of the mold thickness adjustment motor may be transmitted to multiple screw nuts via a rotational driving force transmission unit. The multiple screw nuts can be rotated synchronously. Note that by changing the transmission path of the rotational driving force transmission unit, it is also possible to rotate the multiple screw nuts individually.

[0041] The rotational drive force transmission unit is composed of, for example, gears. In this case, a passive gear is formed on the outer periphery of each screw nut. A drive gear is attached to the output shaft of the mold thickness adjustment motor. An intermediate gear that meshes with the passive gears and the drive gear is rotatably held in the center of the toggle support 130. Note that the rotational drive force transmission unit may be composed of a belt, pulleys, or the like instead of gears.

[0042] The operation of the mold thickness adjustment mechanism 180 is controlled by the molding machine control device 700. The molding machine control device 700 drives the mold thickness adjustment motor to rotate the screw nut. As a result, the position of the toggle support 130, which holds the screw nut rotatably but immovably, relative to the tie bar 140 is adjusted, and the distance between the fixed platen 110 and the toggle support 130 is adjusted. Note that multiple mold thickness adjustment mechanisms may be used in combination.

[0043] The gap is detected using a mold thickness adjustment motor encoder. The mold thickness adjustment motor encoder detects the amount and direction of rotation of the mold thickness adjustment motor and sends a signal indicating the detection result to the molding machine control device 700. The detection result of the mold thickness adjustment motor encoder is used to monitor and control the position and gap of the toggle support 130. Note that the toggle support position detector that detects the position of the toggle support 130 and the gap detector that detects the gap are not limited to the mold thickness adjustment motor encoder, and general types can be used.

[0044] The mold clamping unit 100 of this embodiment is a horizontal type in which the mold opening and closing direction is horizontal, but it may also be a vertical type in which the mold opening and closing direction is vertical.

[0045] Although the mold clamping unit 100 of this embodiment has a mold clamping motor 160 as a drive source, it may have a hydraulic cylinder instead of the mold clamping motor 160. Also, the mold clamping unit 100 may have a linear motor for opening and closing the mold, and an electromagnet for mold clamping.

[0046] The mold clamping device 100 is covered with a cover 190. The cover 190 is provided with an opening for carrying in and out the mold device 800. Also, a door 195 for opening and closing the opening of the cover 190 is provided. Also, a door opening and closing mechanism 196 for opening and closing the door 195 is provided.

[0047] (Ejector device) An ejector device (not shown) is attached to the movable platen 120 and moves forward and backward together with the movable platen 120. The ejector device (not shown) performs an ejection process under the control of the molding machine control device 700. In the ejection process, an ejector rod (not shown) is advanced from a standby position to an ejection position at a set moving speed, thereby advancing a movable member (not shown) and ejecting a molded product. Thereafter, an ejector motor (not shown) is driven to retract the ejector rod (not shown) at a set moving speed, and the movable member (not shown) is retracted to its original standby position.

[0048] (injection device) The injection unit 300 is disposed so as to be able to move forward and backward relative to the mold unit 800. The injection unit 300 comes into contact with the mold unit 800 and fills a molding material into a cavity space (not shown) within the mold unit 800. The injection unit 300 includes, for example, a cylinder, a nozzle, a screw, a metering motor, an injection motor, and a pressure detector.

[0049] (Mobile device) A moving device (not shown) moves the injection unit 300 forward and backward relative to the mold unit 800. The moving device (not shown) also presses the nozzle against the mold unit 800, generating a nozzle touch pressure.

[0050] (molding machine control device) The molding machine control device 700 is configured, for example, by a computer, and has a CPU (Central Processing Unit), a storage medium such as a memory, an input interface, and an output interface. The molding machine control device 700 performs various controls by causing the CPU to execute programs stored in the storage medium. The molding machine control device 700 also receives signals from the outside via the input interface and transmits signals to the outside via the output interface.

[0051] The injection molding machine 10 also includes an operation device 750 and a display device 760. The operation device 750 accepts input operations by a user and outputs a signal corresponding to the input operation to the molding machine control device 700. The display device 760 displays a display screen corresponding to the input operation on the operation device 750 under the control of the molding machine control device 700. The display device 760 may be configured as a touch panel, and the touch panel may constitute at least a part of the operation device 750.

[0052] <Clamping device> The injection molding machine 10 is also provided with a clamping device 30 for detachably attaching the mold assembly 800 to the mold clamping device 100. The clamping device 30 has a fixed-side clamping device 30a and a movable-side clamping device 30b. The fixed-side clamping device 30a is fixed to the fixed platen 110 and detachably clamps the fixed mold 810. The movable-side clamping device 30b is fixed to the movable platen 120 and detachably clamps the movable mold 820. The clamping device 30 is controlled by the molding machine control device 700 and attaches or detaches the mold assembly 800. The clamping device 30 may be a clamping device having a mechanical locking mechanism that is movable by hydraulic pressure, air pressure, etc., or may be a clamping device that clamps the mold by magnetic force, and is not limited thereto.

[0053] The clamp device 30 may also have a positioning pin (not shown) and a drive unit (not shown) that drives the positioning pin. After inserting the positioning pin into the mold device 800, the clamp device 30 clamps the mold device 800 with the fixed-side clamp device 30a and the movable-side clamp device 30b, thereby clamping the mold device 800 in a positioned state.

[0054] <Auto Coupler> The injection molding machine 10 is also provided with an autocoupler 40. When the mold assembly 800 is attached to the injection molding machine 10, the autocoupler 40 of the injection molding machine 10 connects to a connection portion 860 of the mold assembly 800, which will be described later. Specifically, the autocoupler 40 has a drive unit (not shown) and is configured to be able to connect (advance) and disconnect (retract) with the connection portion 860 of the mold assembly 800. This allows, for example, the injection molding machine 10 to apply electricity to a heater (not shown) of the mold assembly 800, thereby controlling the temperature of the mold assembly 800. Furthermore, for example, the mold assembly 800 may be connected to a temperature regulator (not shown) that supplies a heat medium via the autocoupler 40. This allows the heat medium to be supplied to a flow path (not shown) provided in the mold assembly 800. The autocoupler 40 has a drive unit (not shown) and is configured to be able to connect (advance) and disconnect (retract) with the connection portion 860 of the mold assembly 800.

[0055] <Mold changing device> The die changing device 20 includes a traveling rail 21 , a carriage 22 , a bridge 23 , a driving roller 24 , a changing device control device 26 , and a fence 27 .

[0056] The carriage 22 moves on the traveling rail 21. The movement of the carriage 22 is controlled by the exchange device control device 26. The carriage 22 is provided with a first mounting portion 221A and a second mounting portion 221B on which the mold device 800 is placed. The carriage 22 reciprocates between a reference position (standby position) shown in FIG. 1 and a transfer position P at which the mold device 800 is handed over to the bridge 23.

[0057] A conveyor unit 222A is provided on the upper surface of the first placement portion 221A. The conveyor unit 222A is, for example, a drive roller conveyor, and is controlled by the exchange device control device 26. The conveyor unit 222A is used when carrying the mold device 800 into or out of the first placement portion 221A.

[0058] An auto-coupler 223A is also provided on the first placement section 221A. When the mold device 800 is placed on the first placement section 221A, the auto-coupler 223A connects to a connection section 860 of the mold device 800, which will be described later. This allows, for example, the mold device 800 to have a heater (not shown) of the mold device 800 energized from the carriage 22, thereby pre-regulating the temperature of the mold device 800.

[0059] Similar to the first placement section 221A, the second placement section 221B is provided with a conveyor section 222B and an auto-coupler 223B.

[0060] The bridge 23 is disposed between the carriage 22 and the injection molding machine 10, and is used to transport the mold device 800. A conveyor is provided on the upper surface of the bridge 23, and is controlled by the exchange device control device 26.

[0061] The drive rollers 24 are disposed below the fixed platen 110 and the movable platen 120 within the injection molding machine 10. The drive rollers 24 are used when transporting the mold device 800 that has been carried into the injection molding machine 10 to a clamping position, or when transporting the mold device 800 from the injection molding machine 10. In addition, the drive rollers 24 are provided on both the fixed platen 110 and the movable platen 120. The drive rollers 24 place both ends of the mold device 800 on and transport it. The molded product ejected by the ejector device can pass between the drive rollers 24. The drive rollers 24 are controlled by an exchange device control device 26.

[0062] In addition, a fence 27 is provided around the traveling rail 21 and the carriage 22 to prevent workers from entering the range within which the carriage 22 moves.

[0063] <Molding equipment> The mold device 800 includes a fixed mold 810 , a movable mold 820 , and a connection portion 860 .

[0064] The connection part 860 is connected to the auto-coupler 40 of the injection molding machine 10 or the auto-couplers 223A, 223B of the carriage 22.

[0065] FIG. 2 is a block diagram of the injection molding system S according to this embodiment.

[0066] The molding machine control device 700 of the injection molding machine 10 includes a storage unit 701 and a communication port 702.

[0067] A plurality of molding conditions are stored in the memory unit 701. The molding conditions include information on the mold device 800 (such as the "mold thickness" of the mold device 800 and the "mold pressure position where mold clamping force is generated" described later), measurement conditions for the injection unit 300, and operating conditions for each mode selected by the automatic shutdown setting unit 773 described later. Each molding condition is assigned an identification code.

[0068] The communication port 702 is connected to a communication port 711 of a sequencer 710 .

[0069] The sequencer 710 includes a communication port 711, a communication port 712, and an I / O port 713. The communication port 711 is communicably connected to the communication port 702 of the molding machine control device 700. The sequencer 710 is a device that converts an input signal based on a preset logic and outputs the converted signal.

[0070] The communication port 712 is connected to a communication port 721 of the exchange device control device 26 provided in the mold exchange device 20. With this configuration, the molding machine control device 700 can issue operation commands to the mold exchange device 20 via the sequencer 710. In addition, the operating status of the mold exchange device 20 is input to the molding machine control device 700 via the sequencer 710.

[0071] The I / O port 713 is connected to an I / O port 722 of the clamping device 30. With this configuration, the molding machine control device 700 can issue operation commands to the clamping device 30 via the sequencer 710. In addition, the operating status of the clamping device 30 is input to the molding machine control device 700 via the sequencer 710.

[0072] Furthermore, the I / O port 713 is connected to an I / O port 723 of the auto-coupler 40. With this configuration, the molding machine control device 700 can issue operation commands to the auto-coupler 40 via the sequencer 710. Furthermore, the operating status of the auto-coupler 40 is input to the molding machine control device 700 via the sequencer 710.

[0073] In this way, the molding machine control device 700 of the injection molding machine 10 can control the peripheral devices (mold exchange device 20, clamp device 30, auto-coupler 40) and can obtain the operating status of the peripheral devices.

[0074] Fig. 3 is an example of a display screen displayed on display device 760. The display screen shown in Fig. 3 is an example of a display screen that displays settings and performance values ​​(operating status) related to setup work. Here, setup work refers to work that enables mass production of molded products by injection molding machine 10, and includes, for example, mold replacement (mold mounting), adjusting the clamping force of mold device 800, adjusting the temperature of mold device 800, measuring the molding material by injection device 300, purging the molding material from injection device 300, etc.

[0075] The display screen has a display section 761 that displays the operating status of the injection molding machine 10. The display screen also has a display section 762 that displays information about the mold exchange device 20. The display section 762 has an operating status display section 762a that displays the operating status of the mold exchange device 20 and a command display section 762b that displays commands to the mold exchange device 20. Similarly, the display screen has a display section 763 that displays information about the clamping device 30. The display section 763 has an operating status display section 763a that displays the operating status of the clamping device 30 and a command display section 763b that displays commands to the clamping device 30. The display screen also has a display section 764 that displays information about the auto-coupler 40. The display section 764 has an operating status display section 764a that displays the operating status of the auto-coupler 40 and a command display section 764b that displays commands to the auto-coupler 40. In this way, the display screen displays the progress of the setup work.

[0076] The display screen has a condition call setting section 771. Here, identification codes and molding conditions are stored in association with each other in the storage section 701. The condition call setting section 771 is configured to allow input of an identification code for calling molding conditions required for production of a molded product by the next mold device 800B before production of a molded product by the current mold device 800A is completed. This allows production of a molded product by the next mold device 800B to be reserved before production of a molded product by the current mold device 800A is completed. In the example shown in FIG. 3, by inputting an identification number as an identification code in an input field (not shown), the condition call setting section 771 displays the name of the molding condition, the folder number in which the molding condition is stored, and the file number.

[0077] The display screen has a temperature regulator interlock setting section 772, an automatic shutdown setting section 773, and a next-mold operation setting section 774. Here, during final molding of the production of a molded product using the current mold apparatus 800A, the injection molding machine 10 is determined to have finished production when the filling operation required for final molding is completed. The temperature regulator interlock setting section 772 is configured to allow the user to select whether or not to stop the temperature regulator at this time. The automatic shutdown setting section 773 is also configured to allow the user to select whether or not to retract the injection unit 300, which serves as the plasticizing unit, at this time. The next-mold operation setting section 774 allows the user to set whether or not to perform a metering operation of the injection unit 300 at this time. The display screen also has a next-mold measurement condition display section 775. The next-mold measurement condition display section 775 displays the measurement conditions for the next mold (mold apparatus 800B) included in the molding conditions corresponding to the identification code entered in the condition call setting section 771.

[0078] The display screen has a next mold thickness condition display section 776. Here, the molding conditions stored in the memory section 701 include a mold thickness position for generating a clamping force. The molding conditions also include the mold thickness of the mold device 800. The next mold thickness condition display section 776 displays the mold thickness position for generating a clamping force and the mold thickness of the next mold (mold device 800B) included in the molding conditions corresponding to the identification code input in the condition call setting section 771.

[0079] The display screen also has a current mold thickness condition display section 777. The current mold thickness condition display section 777 displays the mold thickness position and mold thickness of the current mold (mold device 800A) where the mold clamping force is generated, which are included in the current molding conditions. Also, the adjustment amount (+α) from the molding conditions is displayed. Also, it displays whether or not the adjustment of the mold clamping force has been completed.

[0080] The display screen also has an unclamping mold opening amount setting section 778 and a mold opening / closing speed during mold change setting section 779. The unclamping mold opening amount setting section 778 is configured to allow the user to input the mold opening amount during unclamping. The mold opening / closing speed during mold change setting section 779 is configured to allow the user to input the mold opening / closing speed during mold change.

[0081] FIG. 4 is a Gantt chart illustrating an example of a setup operation in the injection molding system S according to this embodiment. Here, the setup operation will be described using the automatic replacement of the mold apparatus 800 (removal and insertion of the mold apparatus 800) as an example. Other setup operations include adjusting the clamping force of the mold apparatus 800B after replacement, adjusting the temperature of the mold apparatus 800B, measuring the molding material by the injection apparatus 300, and purging the molding material from the injection apparatus 300. In FIG. 4, the injection molding machine 10 is assumed to be producing a molded product using the mold apparatus 800A. The description will be given assuming that the carriage 22 is located at a standby position, the mold apparatus 800A is attached to the injection molding machine 10, the mold apparatus 800B is placed on the first placement section 221A of the carriage 22, and the second placement section 221B is empty.

[0082] The current mold production process S100 includes a current production process S101 and a final production shot process S102. The current production process S101 is a process for producing a molded product using the current mold device 800A. The final production shot process S102 is a process for final production of a molded product using the current mold device 800A.

[0083] Here, if automatic shutdown is set in the automatic shutdown setting unit 773, the injection molding machine 10 determines that production has ended when it has completed the filling operation required for final molding, and performs the next mold measurement step S103. Here, the measurement operation of the injection unit 300 is performed based on the next mold measurement conditions in the next mold measurement condition display unit 775 (molding conditions corresponding to the identification code set in the condition call setting unit 771). In other words, setup work for the next mold mold device 800B is performed while a molded product is being produced by the current mold mold device 800A.

[0084] Furthermore, if the temperature regulator interlock setting unit 772 has set the temperature regulator to interlock, a temperature regulator stop step S104 is executed. This ends the temperature control of the mold device 800A. Furthermore, if the automatic shutdown setting unit 773 has set the plasticizer to retreat, a plasticizer retreat step S105 is executed. This causes the injection device 300 to retreat by a moving device (not shown). Furthermore, the mold exchange device 20 executes step S106 of starting the temperature control of the mold device 800B, which is the next mold. Here, a heat medium is supplied to the mold device 800B placed on the cart 22 via the auto-coupler 223A and the connection unit 860, and the mold device 800B is subjected to preliminary temperature control. Note that when the preliminary temperature control of the mold device 800B is completed, step S202 of stopping the temperature control of the mold device 800B, which is the next mold, is executed.

[0085] In the preparation step S200, an operator performs work (S201). For example, the operator checks the mold device 800B to be carried in. The operator also checks whether the mold devices 800A and 800B are open. The operator also checks whether the preliminary temperature adjustment of the mold device 800B has been completed. After completing these checks, the operator operates a switch provided on the operation device 750 to execute automatic replacement of the mold device 800.

[0086] Here, the automatic mold change includes a mold removal process S300 in which mold device 800A is removed from injection molding machine 10, a mold removal process S400 in which mold device 800A is removed from injection molding machine 10, a carry-in preparation process S500 before mold device 800B is carried into injection molding machine 10, a mold carry-in process S600 in which mold device 800B is carried into injection molding machine 10, and a mold attachment process S700 in which mold device 800B is attached to injection molding machine 10.

[0087] The mold removal process S300 includes a coupler retreat process S301, a mold removal (unclamping) process S302, a mold opening process S303, a positioning pin return process S304, and a carriage movement process S305. The coupler retreat process S301, the mold removal (unclamping) process S302, and the mold opening process S303 are executed sequentially.

[0088] In the coupler retraction step S301, the auto-coupler 40 is retracted and the connection between the auto-coupler 40 and the connection part 860 of the mold device 800 is released. Specifically, the molding machine control device 700 transmits a command to retract to the auto-coupler 40 via the sequencer 710. When the auto-coupler 40 retracts, the auto-coupler 40 transmits an operating status to the molding machine control device 700 via the sequencer 710.

[0089] In the mold removal (unclamping) process S302, the clamping device 30 releases the clamping of the mold device 800A. Specifically, the molding machine control device 700 transmits an unclamping command to the clamping device 30 via the sequencer 710. When the clamping of the clamping device 30 is released, the clamping device 30 transmits an operating status to the molding machine control device 700 via the sequencer 710.

[0090] In the mold opening step S303, the mold device 800A is brought into a state in which it can be carried out by widening the gap between the fixed platen 110 and the movable platen 120. Specifically, the molding machine control device 700 controls the mold clamping motor 160 of the mold clamping unit 100 to move the movable platen 120 backward by the mold opening amount set by the unclamping mold opening amount setting unit 778, thereby widening the gap between the fixed platen 110 and the movable platen 120.

[0091] In the positioning pin return process S304, the positioning pin is removed from the mold device 800A. Specifically, the molding machine control device 700 transmits a positioning pin return command to the clamp device 30 via the sequencer 710. When the positioning pin is removed, the clamp device 30 transmits an operation status to the molding machine control device 700 via the sequencer 710. The positioning pin return process S304 may be executed so as to overlap with the mold opening process S303.

[0092] In the carriage moving step S305, the carriage 22 is moved so that the second placement section 221B moves to the transfer position P. Specifically, the molding machine control device 700 transmits a command to the exchange device control device 26 of the mold exchange device 20. The exchange device control device 26 moves the carriage 22 based on the command. When the movement of the carriage 22 is completed, the exchange device control device 26 transmits an operation status to the molding machine control device 700. The carriage moving step S305 may be executed so as to overlap with the coupler retreating step S301 to the mold opening step S303.

[0093] The mold carrying-out step S400 includes a door opening step S401, a mold carrying-out operation step S402, a door closing step S403, and a cart moving step S404. The door opening step S401, the mold carrying-out operation step S402, and the door closing step S403 are executed sequentially.

[0094] The door opening step S401 opens the door 195. Specifically, the molding machine control device 700 controls the door opening / closing mechanism 196 to open the door 195.

[0095] In the mold carrying-out operation step S402, the mold device 800A is carried out. Specifically, the molding machine control device 700 transmits a command to carry out the mold device to the mold exchange device 20 (exchange device control device 26) via the sequencer 710. The exchange device control device 26 controls the drive roller 24 and the conveyor unit 222B to place the mold device 800A on the second placement unit 221B. When the carrying-out of the mold device 800A is completed, the exchange device control device 26 transmits an operation status to the molding machine control device 700.

[0096] The door closing step S403 closes the door 195. Specifically, the molding machine control device 700 controls the door opening / closing mechanism 196 to close the door 195.

[0097] In the cart moving step S404, the cart 22 is moved so that the first placement section 221A moves to the transfer position P. Specifically, the molding machine control device 700 transmits a command to the exchange device control device 26 of the mold exchange device 20. The exchange device control device 26 moves the cart 22 based on the command. When the movement of the cart 22 is completed, the exchange device control device 26 transmits an operation status to the molding machine control device 700. The cart moving step S404 only needs to be executed after the mold unloading operation step S402, and may be executed in an overlapping manner with the door closing step S403 and the carry-in preparation step S500.

[0098] The carry-in preparation process S500 is followed by the carriage movement process S404, which is part of the mold exchange work. Also, during the mold exchange, another setup work is performed, which is to adjust the mold clamping force of the mold device 800B, which is the next mold. Here, the carry-in preparation process S500 includes a next mold condition call process S501 and a mold thickness adjustment process S502. The next mold condition call process S501 and the mold thickness adjustment process S502 are executed sequentially.

[0099] The next mold condition calling process S501 calls the conditions of the mold device 800B that will be next carried into the injection molding machine 10. Specifically, the molding machine control device 700 calls, from the storage unit 701, the molding conditions that correspond to the identification code set in the condition call setting unit 771.

[0100] The mold thickness adjustment step S502 adjusts the mold clamping unit 100 based on the molding conditions of the mold device 800B called up in the next mold condition calling step S501. Specifically, the molding machine control device 700 controls the mold thickness adjustment mechanism 180 of the mold clamping unit 100 to adjust the distance between the fixed platen 110 and the toggle support 130 based on the mold clamping force generation mold thickness position on the mold thickness condition display section 776 for the next mold.

[0101] The mold loading step S600 includes a door opening step S601, a mold loading operation step S602, a door closing step S603, a positioning pin insertion step S604, and a cart movement step S605. The door opening step S601, the mold loading operation step S602, and the door closing step S603 are executed sequentially.

[0102] The door opening step S601 opens the door 195. Specifically, the molding machine control device 700 controls the door opening / closing mechanism 196 to open the door 195.

[0103] In the mold carrying-in operation step S602, the mold device 800B is carried in. Specifically, the molding machine control device 700 transmits a command to carry in the mold device to the mold exchange device 20 (exchange device control device 26) via the sequencer 710. The exchange device control device 26 controls the drive roller 24 and the conveyor unit 222A to carry in the mold device 800B from the first placement unit 221A into the mold clamping unit 100. When the carrying-in of the mold device 800B is completed, the exchange device control device 26 transmits an operation status to the molding machine control device 700.

[0104] The door closing step S603 closes the door 195. Specifically, the molding machine control device 700 controls the door opening / closing mechanism 196 to close the door 195.

[0105] In the positioning pin inserting step S604, a positioning pin is inserted into the mold device 800B. Specifically, the molding machine control device 700 transmits a positioning pin inserting command to the clamp device 30 via the sequencer 710. Once the positioning pin is inserted, the clamp device 30 transmits an operation status to the molding machine control device 700 via the sequencer 710. The positioning pin inserting step S604 may be executed so as to overlap with the mold loading operation step S602.

[0106] In the carriage moving step S605, the carriage 22 is moved to the standby position (see FIG. 1). Specifically, the molding machine control device 700 transmits a command to the exchange device control device 26 of the mold exchange device 20. The exchange device control device 26 moves the carriage 22 based on the command. When the movement of the carriage 22 is completed, the exchange device control device 26 transmits an operation status to the molding machine control device 700. The carriage moving step S605 only needs to be executed after the mold carrying-in operation step S602, and may be executed in an overlapping manner with the door closing step S603 and the mold mounting step S700.

[0107] The mold mounting step S700 includes a mold closing step S701, a mold mounting (clamping) step S702, a coupler advancing step S703, a standby step S704, a temperature regulator activation step S705, and a purging step S706. The mold closing step S701 to the standby step S704 are executed sequentially.

[0108] In the mold closing step S701, the mold device 800B is sandwiched between the fixed platen 110 and the movable platen 120 by narrowing the gap between them. Specifically, the molding machine control device 700 controls the mold clamping motor 160 of the mold clamping unit 100 to move the movable platen 120 forward, thereby narrowing the gap between the fixed platen 110 and the movable platen 120.

[0109] In the mold attachment (clamping) process S702, the mold device 800B is clamped by the clamp device 30. Specifically, the molding machine control device 700 transmits a clamping command to the clamp device 30 via the sequencer 710. When the mold device 800B is clamped by the clamp device 30, the clamp device 30 transmits an operating status to the molding machine control device 700 via the sequencer 710.

[0110] In the coupler advance step S703, the auto-coupler 40 is advanced and connected to the connection portion 860 of the mold device 800. Specifically, the molding machine control device 700 transmits a command to advance to the auto-coupler 40 via the sequencer 710. When the auto-coupler 40 advances, the auto-coupler 40 transmits an operating status to the molding machine control device 700 via the sequencer 710.

[0111] In the waiting step S704, after the die change is completed, the process waits until all the setup work is completed.

[0112] During the mold change, another setup operation is to adjust the temperature of the mold apparatus 800B. The temperature regulator activation step S705 is a step of activating a temperature regulator (not shown) to regulate the temperature of the mold apparatus 800B. Specifically, the molding machine control device 700 transmits an activation command to the temperature regulator (not shown) via the sequencer 710. The temperature regulator supplies a temperature-adjusted fluid to the mold apparatus 800B via the autocoupler 40 and the connection unit 860. The temperature regulator activation step S705 may be executed after the coupler advancement step S703, and may be executed overlapping with the standby step S704.

[0113] During the mold change, another setup operation is performed, which is to purge the injection unit 300. In the purging step S706, the molding material inside the injection unit 300 is purged. Specifically, the molding machine control device 700 controls the injection unit 300 to purge the molding material. The purging step S706 only needs to be performed after the coupler advancing step S703, and may be performed overlapping with the standby step S704.

[0114] As described above, according to the injection molding machine 10 of this embodiment, other setup work can be performed while a mold is being changed. This shortens the time required for setup work, shortens the downtime of the injection molding machine 10, and improves the productivity of the injection molding machine 10.

[0115] Specifically, in the injection molding machine 10 according to this embodiment, during mold change, after the previous mold apparatus 800A is removed and before the next mold apparatus 800B is loaded, the mold clamping force of the mold apparatus 800B is adjusted in advance. The position for generating the mold clamping force is stored in advance together with the molding conditions. The molding conditions for the next mold are also input in advance. This allows the setup work time to be shortened compared to when the mold clamping force is adjusted after the mold change. Furthermore, since the mold clamping force can be adjusted based on the molding conditions for the next mold that are preset in the condition call setting unit 771, the time required for the mold clamping force adjustment can be shortened.

[0116] The mold clamping force may be adjusted after the mold device 800B is attached to the mold clamping device 100. This allows the mold clamping force to be adjusted with high precision. Also, since the mold clamping force is adjusted in advance in the mold thickness adjustment step S502, the time required for the mold clamping force adjustment can be shortened.

[0117] Furthermore, the temperature regulator startup step S705 and the automatic purging step S706 are started in an overlapping manner with the carriage movement step S605, thereby shortening the setup work time.

[0118] The above describes embodiments of the injection molding system S, but the present invention is not limited to the above embodiments, and various modifications and improvements are possible within the scope of the gist of the present invention described in the claims.

[0119] In the above description, other setup work is started and finished before the mold change, and other setup work is started during the mold change, thereby overlapping the other setup work, but this is not limited to this. Other setup work may be started before the mold change and finished during the mold change, thereby overlapping the other setup work during the mold change. For example, automatic replacement of the unloader chuck plate (not shown; the unloader is a device that automatically unloads molded products, and the unloader chuck plate is a part attached to the tip of the unloader that clamps the product) may be performed. This shortens the working time for setup work.

[0120] In addition, other setup operations that are performed in conjunction with mold changes are not limited to those described above, and operations that automatically change the operations and conditions of peripheral devices required for molding and setup operations may also be performed. [Explanation of symbols]

[0121] S Injection Molding System 100 Mold clamping device 10 injection molding machine 20. Die change device 22 Cart 26 Switching Equipment Control Unit 30 Clamping device 40 Auto Coupler 30a, 30b Clamping device 195 doors 196 Door opening and closing mechanism 700 Molding machine control device (control unit) 701 Storage section 750 Operating device 760 Display device 800 mold equipment P replacement position

Claims

1. A control device for controlling an injection molding machine having a mold clamping device to which a mold device is attached and a setup device that performs setup work for the mold device, The setup device is a mold changing device including a carriage having a first placement portion and a second placement portion on which the mold device is placed; a temperature control device that controls the temperature of the mold device placed on the first placement section and / or the second placement section, a production process of a molded product by a next mold device is carried out after a production process of a molded product by a current mold device, and in the setup work of the next mold device, the setup work of the next mold device is carried out while the molded product is being produced by the current mold device, and the setup work of the next mold device is started according to the progress of the production process of the current mold, The setup work of the mold device for the next mold is a temperature adjustment work of the mold device for the next mold, the carriage is placed at a standby position, the next mold device is placed on the first placement section, and a temperature control operation of the next mold device is started during production of a molded product by the current mold device; Continue the temperature control operation of the next mold device until the production of the molded product by the current mold device is completed, Before the carriage is moved from the standby position to the delivery position, the temperature control operation of the mold device for the next mold is completed. The second placement portion of the carriage is moved to the delivery position, the current mold unit is moved from the mold clamping unit to the second placement unit; The first placement portion of the carriage is moved to the transfer position, The mold device for the next mold is carried into the mold clamping device. Control device.

2. The control device controls the temperature adjustment device, During the final production shot process by the current mold device, a step of activating temperature control of the next mold device is carried out. The control device according to claim 1 .

3. A method for setting up a mold device in an injection molding machine having a mold clamping device to which a mold device is attached and a setup device that performs setup work for the mold device, comprising: The setup device is a mold changing device including a carriage having a first placement portion and a second placement portion on which the mold device is placed; a temperature control device that controls the temperature of the mold device placed on the first placement section and / or the second placement section, a mold production process for producing molded products using a mold device; a next mold temperature control initiation step for initiating temperature control of a temperature controller of a next mold device to be used in a production step after the production step of a molded product by the current mold during production of the molded product by the current mold device, The setup work of the mold device for the next mold is a temperature adjustment work of the mold device for the next mold, the carriage is placed at a standby position, the next mold device is placed on the first placement section, and a temperature control operation of the next mold device is started during production of a molded product by the current mold device; Continue the temperature control operation of the next mold device until the production of the molded product by the current mold device is completed, Before the carriage is moved from the standby position to the delivery position, the temperature control operation of the mold device for the next mold is completed. The second placement portion of the carriage is moved to the delivery position, the current mold unit is moved from the mold clamping unit to the second placement unit; The first placement portion of the carriage is moved to the transfer position, The mold device for the next mold is carried into the mold clamping device. A method for setting up a mold device.

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