Substrate processing apparatus and substrate processing method

JP7766526B2Active Publication Date: 2025-11-10TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2022038101
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-03-11
Publication Date
2025-11-10
Estimated Expiration
2042-03-11
Patent Text Reader

Abstract

To provide a technique capable of suppressing occurrence of particles by reverse sputtering of a drive part of a shield member provided in a processing container when a substrate is processed by the reverse sputtering.SOLUTION: A substrate processing apparatus for making ions in a plasma act on a substrate, and processing the substrate has: a processing container which has a substrate to be processed arranged therein and generates the plasma therein; a stage which is provided in the processing container and is mounted with the substrate; a high frequency power source for applying, to the stage, high frequency power for making the ions in the plasma act on the substrate; a shield member which is provided in the processing container and has a drive part; a drive mechanism for driving the drive part of the shield member; and a conductive connection plate which connects the drive part of the shield member to a grounded grounding part, and has such flexibility as to be deformed following driving of the drive part.SELECTED DRAWING: Figure 1
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Citation Information

Patent Citations

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