Resin composition, molded body, pellet manufacturing method, and light transmittance improver

Abstract

To provide a resin composition that can provide a molding having high light transmittance, a molding formed from the resin composition, and a method for producing a pellet, and to provide a light transmittance improver for improving the light transmittance of thermoplastic resin.SOLUTION: A resin composition comprises a thermoplastic resin 100 pts.mass and a non-aromatic organic metal complex 0.08-8.00 mass ppm.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition, a molded article, a method for producing pellets, and a light transmittance improver. [Background technology]

[0002] Thermoplastic resins such as polycarbonate resins have been widely used in a variety of applications due to their excellent performance. Among these, thermoplastic resins, particularly polycarbonate resins, are actively used in components that require transparency, such as power covers, lighting lenses, lighting covers, and light guide components. For example, Patent Document 1 discloses an aromatic polycarbonate resin composition containing an aromatic polycarbonate resin (A), a phosphorus-based antioxidant (B), a fatty acid ester (C), and a specific aromatic compound (D), characterized in that the aromatic polycarbonate resin composition contains 0.01 to 0.1 parts by weight of the phosphorus-based antioxidant (B), 0.01 to 0.5 parts by weight of the fatty acid ester (C), and 0.0001 to 0.05 parts by weight of the specific aromatic compound (D) per 100 parts by weight of the aromatic polycarbonate resin (A). It also discloses that molded articles obtained from such resin compositions have high light transmittance. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-120458 Summary of the Invention [Problem to be solved by the invention]

[0004] As described above, resin compositions with high light transmittance are known, but as the use of thermoplastic resins increases, new resin compositions with high light transmittance are in demand. The present invention aims to solve the above problems and relates to a resin composition capable of providing a molded article having high light transmittance, a molded article formed from the resin composition, and a method for producing pellets thereof. The present invention also relates to a light transmittance improver for improving the light transmittance of a thermoplastic resin. [Means for solving the problem]

[0005] In view of the above-mentioned problems, the present inventors have conducted research and found that it is possible to improve light transmittance by blending a small amount of a non-aromatic organometallic complex into a thermoplastic resin. Specifically, the above-mentioned problems have been solved by the following means. <1> A resin composition comprising a non-aromatic organometallic complex in an amount of 0.08 to 8.00 ppm by mass relative to 100 parts by mass of a thermoplastic resin. <2> the non-aromatic organometallic complex comprises a non-aromatic organocopper complex; <1> The resin composition according to claim 1. <3> The non-aromatic organometallic complex comprises an acetylacetonate metal complex. <1> or <2> The resin composition according to claim 1. <4> The thermoplastic resin includes an amorphous thermoplastic resin. <1> ~ <3> The resin composition according to any one of the above. <5> The thermoplastic resin includes an aromatic polycarbonate resin. <1> ~ <3> The resin composition according to any one of the above. <6> <1> ~ <5> A molded article formed from the resin composition according to any one of the above. <7> A method for producing pellets, comprising melt-kneading a composition containing 0.08 to 8.00 ppm by mass of a non-aromatic organometallic complex relative to 100 parts by mass of a thermoplastic resin. <8> A resin additive for improving the light transmittance of a thermoplastic resin, the light transmittance improver comprising a non-aromatic organometallic complex. <9> The non-aromatic organometallic complex is a non-aromatic organocopper complex. <8> The light transmittance improver according to claim 1. <10> The non-aromatic organometallic complex is an acetylacetonate metal complex. <8> or <9> The light transmittance improver according to claim 1. <11> The thermoplastic resin is an amorphous thermoplastic resin. <8> ~ <10> 10. The light transmittance improver according to claim 9, wherein the light transmittance improver is a light transmittance improver. <12> The thermoplastic resin is an aromatic polycarbonate resin. <8> ~ <10> 10. The light transmittance improver according to claim 9, wherein the light transmittance improver is a light transmittance improver. [Effects of the Invention]

[0006] The present invention provides a resin composition capable of providing a molded article having high light transmittance, a molded article formed from the resin composition, and a method for producing pellets. It also provides a light transmittance improver for improving the light transmittance of a thermoplastic resin. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, an embodiment for carrying out the present invention (hereinafter simply referred to as "the present embodiment") will be described in detail. Note that the present embodiment is an example for explaining the present invention, and the present invention is not limited to only this embodiment. In this specification, the symbol "to" is used to mean that the numerical values ​​before and after it are included as the lower limit and upper limit. In this specification, various physical properties and characteristic values ​​are those at 23°C unless otherwise specified. In this specification, the number average molecular weight is a polystyrene equivalent value measured by GPC (gel permeation chromatography). If the standards shown in this specification differ depending on the year and the measurement method, etc., they will be based on the standards as of January 1, 2021, unless otherwise stated.

[0008] The resin composition of this embodiment is characterized by containing 0.08 to 8.00 ppm by mass of a non-aromatic organometallic complex relative to 100 parts by mass of a thermoplastic resin. This configuration can improve the light transmittance (particularly, the total light transmittance) of the thermoplastic resin. Furthermore, this effect can be maintained at a high level even when various resin additives are added. Furthermore, even when a non-aromatic organometallic complex is added, an increase in the YI value can be effectively suppressed.

[0009] <Thermoplastic resin> The resin composition of the present embodiment contains a thermoplastic resin. Examples of thermoplastic resins include polycarbonate resin (PC resin); polystyrene resin (PS resin); acrylic resin; polyolefin resins such as polyethylene resin (PE resin), polypropylene resin (PP resin), cyclic cycloolefin resin (COP resin), and cyclic cycloolefin copolymer (COC) resin; polyamide resin (PA resin); polyimide resin (PI resin); polyetherimide resin (PEI resin); polyurethane resin (PU resin); polyphenylene ether resin (PPE resin); polyphenylene sulfide resin (PPS resin); polysulfone resin (PSU resin); polymethacrylate resin (PMMA resin); and the like, with polycarbonate resin (PC resin), polystyrene resin (PS resin), and acrylic resin being preferred, polycarbonate resin being more preferred, and aromatic polycarbonate resin being even more preferred.

[0010] The thermoplastic resin used in this embodiment may be a crystalline thermoplastic resin or an amorphous thermoplastic resin, but preferably contains an amorphous thermoplastic resin. Amorphous thermoplastic resins are transparent and therefore suitable for applications requiring improved light transmittance. However, even crystalline thermoplastic resins may be used as transparent materials, such as when molding without crystallization. In such cases, crystalline thermoplastic resins are also preferably used as resins contained in the resin composition of this embodiment. Furthermore, this embodiment may be a blend of an amorphous thermoplastic resin and a crystalline thermoplastic resin.

[0011] In the present embodiment, the thermoplastic resin preferably comprises 85% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, and particularly preferably 97% by mass or more of an amorphous thermoplastic resin (preferably an aromatic polycarbonate resin).

[0012] The polycarbonate resin is not particularly limited as long as it contains an -[OR-OC(=O)]- unit (where R is an organic group, preferably a hydrocarbon group, more preferably an aliphatic group, an aromatic group, or one containing both an aliphatic group and an aromatic group, and further one having a linear or branched structure) containing a carbonate bond in the molecular main chain. In this embodiment, the polycarbonate resin is preferably an aromatic polycarbonate resin, and more preferably a polycarbonate resin having a bisphenol skeleton. The use of such a polycarbonate resin achieves better heat resistance and toughness. In this embodiment, the polycarbonate resin having a bisphenol skeleton preferably contains 90 mol % or more of all structural units of structural units having a bisphenol skeleton, and more preferably contains 90 mol % or more of all structural units of structural units derived from bisphenol A.

[0013] The viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 10,000 or more, more preferably 12,000 or more, and even more preferably 15,000 or more. By making the viscosity average molecular weight equal to or greater than the lower limit, the durability of the obtained molded article tends to be further improved. The upper limit of the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 50,000 or less, more preferably 40,000 or less, even more preferably 30,000 or less, and even more preferably 25,000 or less. By making the viscosity average molecular weight equal to or less than the upper limit, the moldability of the molded article tends to be further improved. The viscosity average molecular weight (Mv) was calculated by using methylene chloride as a solvent and an Ubbelohde viscometer to determine the intrinsic viscosity [η] (unit: dL / g) at a temperature of 25°C, and then using the Schnell viscosity formula, i.e., η = 1.23 × 10 -4 ×Mv 0.83 , means the value calculated from When two or more types of polycarbonate resins are used, the viscosity average molecular weight is the viscosity average molecular weight of the mixture.

[0014] The method for producing the polycarbonate resin is not particularly limited, and polycarbonate resins produced by the conventionally known phosgene method (interfacial polymerization method) or melt method (ester interchange method) can be used. When the melt method is used, a polycarbonate resin with an adjusted amount of OH groups at the terminal groups can be used.

[0015] In addition to the above, for details of the polycarbonate resin, please refer to paragraphs 0013 to 0041 of JP 2021-084942 A and paragraphs 0030 to 0035 of JP 2021-119211 A, the contents of which are incorporated herein by reference.

[0016] The content of the thermoplastic resin (preferably polycarbonate resin) in the resin composition of this embodiment is preferably 85% by mass or more of the resin composition, more preferably 90% by mass or more, even more preferably 95% by mass or more, even more preferably 97% by mass or more, and even more preferably 98% by mass or more. The upper limit of the content of the thermoplastic resin in the resin composition is the amount such that the total of the thermoplastic resin (preferably polycarbonate resin) and the non-aromatic organometallic complex is 100% by mass. The resin composition of the present embodiment may contain only one type of thermoplastic resin (preferably a polycarbonate resin), or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0017] <Non-aromatic organometallic complexes> The resin composition of the present embodiment contains a non-aromatic organometallic complex in a predetermined ratio. By containing the non-aromatic organometallic complex in a predetermined ratio, the light transmittance can be improved. A non-aromatic organometallic complex refers to an organometallic complex that does not contain an aromatic ring (aromatic hydrocarbon ring or aromatic heterocycle). Aromatic organometallic complexes containing aromatic rings are used as colorants for thermoplastic resins, but the incorporation of such colorants usually results in a lower total light transmittance. The YI value may also increase. In this embodiment, the incorporation of a very small proportion of a non-aromatic organometallic complex into a thermoplastic resin has succeeded in increasing the light transmittance. This is particularly effective in that this function can be maintained even when other resin additives are incorporated.

[0018] The type of metal constituting the non-aromatic organometallic complex is not particularly limited, but is preferably at least one of iron, copper, aluminum, and zinc, and more preferably contains copper. That is, in this embodiment, the non-aromatic organometallic complex preferably contains a non-aromatic organocopper complex.

[0019] The ligand constituting the non-aromatic organometallic complex is not particularly limited as long as it is non-aromatic and serves as a metal ligand, but a ligand in which the coordination site is an oxygen atom is preferred, and a ligand represented by the following formula (1) is more preferred. Formula (1) [ka] (In formula (1), R 1 ~R 3 are each independently a hydrogen atom or an organic group. * is a coordination site with a metal. R 1 and R 3 are each independently preferably an organic group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an alkoxy group having 2 to 11 carbon atoms, still more preferably an alkyl group having 1 to 10 carbon atoms, still more preferably a methyl group or an ethyl group, and still more preferably a methyl group. R 2is preferably a hydrogen atom or an organic group having 1 to 12 carbon atoms, more preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an alkoxy group having 2 to 11 carbon atoms, even more preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, still more preferably a hydrogen atom, a methyl group, or an ethyl group, even more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom.

[0020] The non-aromatic organometallic complex of this embodiment preferably includes an acetylacetone metal complex. Examples of acetylacetone metal complexes are shown below, but it goes without saying that this embodiment is not limited to these. [ka]

[0021] The acetylacetone metal complex in this embodiment is intended to include not only a metal complex of a single acetylacetone but also a complex of a mixed ligand consisting of acetylacetone and other ligands. However, the acetylacetone metal complex in this embodiment is preferably a metal complex of a single acetylacetone.

[0022] The content of the non-aromatic organometallic complex (preferably an acetylacetone metal complex) in the resin composition of this embodiment is, relative to 100 parts by mass of the thermoplastic resin, 0.08 ppm by mass or more, preferably 0.09 ppm by mass or more, more preferably 0.10 ppm by mass or more, even more preferably 0.50 ppm by mass or more, even more preferably 0.70 ppm by mass or more, even more preferably 0.80 ppm by mass or more, and even more preferably 0.90 ppm by mass or more. By ensuring that the content is equal to or more than the above lower limit, the light transmittance of the obtained molded article tends to be further improved. The upper limit of the content of the non-aromatic organometallic complex (preferably an acetylacetone metal complex) is 8.00 mass ppm or less, preferably 6.90 mass ppm or less, more preferably 6.00 mass ppm or less, even more preferably 4.90 mass ppm or less, even more preferably 4.00 mass ppm or less, even more preferably 3.50 mass ppm or less, even more preferably 3.00 mass ppm or less, particularly more preferably 2.50 mass ppm or less, and even more particularly more preferably 2.00 mass ppm or less, relative to 100 mass parts of the thermoplastic resin. By setting the content below the upper limit, the YI value of the resulting molded article tends to be lower. The resin composition of the present embodiment may contain only one type of non-aromatic organometallic complex (preferably an acetylacetone metal complex), or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0023] <Stabilizer> The stabilizer includes a heat stabilizer and an antioxidant. Examples of stabilizers include phenol-based, amine-based, phosphorus-based, and thioether-based stabilizers. Among these, phosphorus-based heat stabilizers and / or phenol-based antioxidants are preferred in this embodiment.

[0024] Any known phosphorus-based heat stabilizer can be used. Specific examples include phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid; metal acid pyrophosphates such as sodium acid pyrophosphate, potassium acid pyrophosphate, and calcium acid pyrophosphate; phosphates of Group 1 or Group 2B metals such as potassium phosphate, sodium phosphate, cesium phosphate, and zinc phosphate; organic phosphate compounds, organic phosphite compounds, and organic phosphonite compounds, with organic phosphite compounds being particularly preferred.

[0025] Examples of organic phosphite compounds include triphenyl phosphite, tris(mononylphenyl)phosphite, tris(mononyl / dinonylphenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, monooctyldiphenyl phosphite, dioctylmonophenyl phosphite, monodecyldiphenyl phosphite, didecylmonophenyl phosphite, tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, and 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite. Specific examples of such organic phosphite compounds include "ADK STAB (registered trademark; the same applies hereinafter) 1178," "ADK STAB 2112," and "ADK STAB HP-10" manufactured by ADEKA CORPORATION, "JP-351," "JP-360," and "JP-3CP" manufactured by Johoku Chemical Industry Co., Ltd., and "IRGAFOS (registered trademark; the same applies hereinafter) 168" manufactured by BASF.

[0026] As the phenol-based antioxidant, a hindered phenol-based antioxidant is preferably used. Specific examples of hindered phenol antioxidants include pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide], 2,4-dimethyl-6-(1-methylpentadecyl)phenol, diethyl[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphate, 4,6-bis(octyl methylthiomethyl)-o-cresol, ethylene bis(oxyethylene) bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate], hexamethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazin-2-ylamino)phenol, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, and the like.

[0027] Among these, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] and octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate are preferred. Specific examples of such hindered phenol antioxidants include "Irganox (registered trademark; the same applies hereinafter) 1010" and "Irganox 1076" manufactured by BASF, and "ADK STAB AO-50" and "ADK STAB AO-60" manufactured by ADEKA.

[0028] The content of the stabilizer in the resin composition of this embodiment is usually 0.001 part by mass or more, preferably 0.005 part by mass or more, more preferably 0.01 part by mass or more, and usually 1 part by mass or less, preferably 0.5 part by mass or less, more preferably 0.3 part by mass or less, relative to 100 parts by mass of the thermoplastic resin. By setting the content of the stabilizer within this range, the effect of adding the stabilizer can be more effectively exerted. The resin composition of the present embodiment may contain only one stabilizer, or may contain two or more stabilizers. When two or more stabilizers are contained, the total amount is preferably in the above range.

[0029] <Flame retardant> The resin composition of the present embodiment may contain a flame retardant. By containing a flame retardant, the flame retardancy of the resulting molded article can be further improved. Examples of flame retardants include metal salt-based flame retardants, organosilicon-based flame retardants, phosphorus-based flame retardants, inorganic filler-based flame retardants, and halogen-based flame retardants. In this embodiment, when a polycarbonate resin is used as the thermoplastic resin, metal salt-based flame retardants are preferred.

[0030] The type of metal contained in the metal salt flame retardant is preferably an alkali metal or alkaline earth metal, more preferably an alkali metal, and even more preferably sodium, potassium or cesium.

[0031] Examples of metal salt flame retardants include metal organic sulfonates, metal organic sulfonamides, metal organic carboxylates, metal organic borates, metal organic phosphates, etc. Among these, metal organic sulfonates, metal organic sulfonamides, and metal organic phosphates are preferred, and metal organic sulfonates are particularly preferred.

[0032] As the organic sulfonic acid metal salt, reference can be made to the organic sulfonic acid metal salts described in paragraphs 0099 to 0107 of JP-A No. 2014-058660, the contents of which are incorporated herein by reference. Examples of metal salt flame retardants include Megafac F114P (trade name) manufactured by DIC, Biowet C4 (trade name) manufactured by Lanxess, IHT-FR2 (trade name) manufactured by Insight High Technology, and KSS-FR (trade name) manufactured by Arichem.

[0033] As the halogen-based flame retardant, the halogen-based flame retardants described in paragraphs 0095 to 0112 of JP 2020-114674 A can be referred to, the contents of which are incorporated herein by reference.

[0034] As the phosphorus-based flame retardant, reference can be made to the phosphorus-based flame retardants described in paragraphs 0051 to 0072 of JP 2019-059813 A, the contents of which are incorporated herein by reference.

[0035] When the resin composition of this embodiment contains a flame retardant, the content thereof is preferably 0.01 parts by mass or more, and may be 0.1 parts by mass or more, 1 part by mass or more, or 10 parts by mass or more, relative to 100 parts by mass of the thermoplastic resin, depending on the type of flame retardant. The upper limit of the content of the flame retardant is preferably 20 parts by mass or less, and may be 10 parts by mass or less, 5 parts by mass or less, or 3 parts by mass or less, relative to 100 parts by mass of the thermoplastic resin, depending on the type of flame retardant. The resin composition of the present embodiment may contain only one type of flame retardant, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0036] <Release agent> The resin composition of the present embodiment may contain a release agent. Examples of the release agent include aliphatic carboxylic acids, salts of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15,000, polysiloxane-based silicone oils, ketone waxes, and light amides. Of these, aliphatic carboxylic acids, salts of aliphatic carboxylic acids, and esters of aliphatic carboxylic acids and alcohols are preferred, and salts of aliphatic carboxylic acids are more preferred. For details about the release agent, please refer to paragraphs 0055 to 0061 of JP 2018-095706 A, the contents of which are incorporated herein by reference. When the resin composition of the present embodiment contains a release agent, the content thereof in the resin composition is preferably 0.05 to 3 mass %, more preferably 0.1 to 0.8 mass %, and even more preferably 0.1 to 0.6 mass %. The resin composition of the present embodiment may contain only one type of release agent, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0037] <UV absorber> The resin composition of the present embodiment may contain an ultraviolet absorber. By containing an ultraviolet absorber, the weather resistance of the resin composition can be improved, and the improved weather resistance can prevent a decrease in transparency.

[0038] Examples of ultraviolet absorbers include inorganic ultraviolet absorbers such as cerium oxide and zinc oxide; and organic ultraviolet absorbers such as benzotriazole compounds, benzophenone compounds, salicylate compounds, cyanoacrylate compounds, triazine compounds, oxanilide compounds, malonic acid ester compounds, and hindered amine compounds. Among these, organic ultraviolet absorbers are preferred, and benzotriazole compounds are more preferred. By selecting an organic ultraviolet absorber, the transparency and mechanical properties of the thermoplastic resin composition of the present invention can be improved.

[0039] Specific examples of the benzotriazole compound include 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-[2'-hydroxy-3',5'-bis(α,α-dimethylbenzyl)phenyl]-benzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butyl-phenyl)-benzotriazole, 2-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butyl-phenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butyl-phenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butyl-phenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tert -amyl)benzotriazole, 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole, 2,2'-methylenebis[4-(1,1,3,3-tetramethylbutyl)-6-(2N-benzotriazol-2-yl)phenol], etc., among which 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole and 2,2'-methylenebis[4-(1,1,3,3-tetramethylbutyl)-6-(2N-benzotriazol-2-yl)phenol] are preferred, and 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole is particularly preferred. Specific examples of such benzotriazole compounds include "Seesorb 701 (S-701)", "Seesorb 705 (S-705)", "Seesorb 703 (S-703)", "Seesorb 702 (S-702)", "Seesorb 704 (S-704)", and "Seesorb 709 (S-709)" manufactured by Shipro Chemical Co., Ltd.; "Biosorb 520", "Biosorb 582", and "Biosorb 583" manufactured by Kyodo Pharmaceutical Co., Ltd. 580," "Biosorb 583," "Chemisorb 71," and "Chemisorb 72" manufactured by Chemipro Chemicals, "Cyasorb UV5411" manufactured by Cytec Industries, "LA-32," "LA-38," "LA-36," "LA-34," and "LA-31" manufactured by ADEKA, and "Tinuvin P," "Tinuvin 234," "Tinuvin 326," "Tinuvin 327," and "Tinuvin 328" manufactured by BASF.

[0040] For details of the benzophenone compounds, salicylate compounds, cyanoacrylate compounds, oxanilide compounds, and malonic acid ester compounds, please refer to paragraphs 0089 to 0093 of Japanese Patent Application Laid-Open No. 2021-001309, the contents of which are incorporated herein by reference.

[0041] When the resin composition of this embodiment contains an ultraviolet absorber, the content thereof is preferably 0.001 parts by mass or more, more preferably 0.01 parts by mass or more, and even more preferably 0.1 parts by mass or more, relative to 100 parts by mass of the thermoplastic resin. By setting the content at or above the lower limit, the effect of adding the ultraviolet absorber tends to be effectively exhibited. Furthermore, the upper limit of the content of the ultraviolet absorber is preferably 3 parts by mass or less, more preferably 1 part by mass or less, even more preferably 0.5 parts by mass or less, and even more preferably 0.4 parts by mass or less, relative to 100 parts by mass of the thermoplastic resin. By setting the content at or below the upper limit, mold contamination due to mold deposits and the like can be effectively prevented. The resin composition of the present embodiment may contain only one type of ultraviolet absorber, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0042] <Other ingredients> The resin composition of the present embodiment may contain other components as needed, as long as the desired physical properties are not significantly impaired. Examples of the other components include various resin additives. Examples of resin additives include colorants (dyes, pigments), antistatic agents, flame retardant assistants, anti-dripping agents, anti-fogging agents, anti-blocking agents, flow improvers, plasticizers, dispersants, antibacterial agents, etc. One type of resin additive may be contained, or two or more types may be contained in any combination and ratio. The resin composition of this embodiment may be configured to be substantially free of coloring agents. "Substantially free" means that the content of coloring agents in the resin composition is less than 0.1% by mass, preferably less than 0.01% by mass, and more preferably less than 0.001% by mass. Furthermore, the content of coloring agents per 100 parts by mass of the thermoplastic resin contained in the resin composition is more preferably less than 1 ppm by mass, even more preferably less than 0.1 ppm by mass, even more preferably less than 0.08 ppm by mass, particularly more preferably less than 0.01 ppm by mass, and even more particularly more preferably less than 0.001 ppm by mass. The lower limit may be 0, but will be substantially below the detection limit.

[0043] <Physical properties of resin composition> The resin composition of this embodiment has a high improvement rate in total light transmittance (light transmittance improvement ratio). Specifically, the resin composition of this embodiment has a higher total light transmittance when molded to a thickness of 12 mm than the total light transmittance when composition A, which is the resin composition of this embodiment minus the non-aromatic organometallic complex, is molded to a thickness of 12 mm. More specifically, the ratio (total light transmittance of a 12 mm thick test piece molded from the resin composition of this embodiment) / (total light transmittance of a 12 mm thick test piece molded from composition A) is greater than 1.000, preferably 1.001 or greater, more preferably 1.005 or greater, and even more preferably 1.008 or greater. The higher the upper limit of this value, the more desirable it is. However, even if it is, for example, 1.100 or less, it is still sufficiently practically useful. The resin composition of this embodiment can have a low YI value. For example, when the resin composition of this embodiment is molded into a thickness of 12 mm, the YI value can be 6.0 or less, 5.0 or less, 3.5 or less, or even 3.0 or less. Although the lower limit of the YI value is ideally 0, a value of 0.1 or more sufficiently satisfies the required performance. The light transmittance improvement ratio and YI value are measured according to the description in the examples below.

[0044] <Production of Resin Composition> The method for producing the resin composition of this embodiment is not limited, and a wide variety of known methods for producing resin compositions can be used, including a method in which the thermoplastic resin, the non-aromatic organometallic complex, and other components added as needed are premixed using a mixer such as a tumbler or a Henschel mixer, and then melt-kneaded using a mixer such as a Banbury mixer, a roll, a Brabender, a single-screw kneading extruder, a twin-screw kneading extruder, or a kneader. The melt-kneading temperature is not particularly limited, but is usually in the range of 240 to 320°C. In this embodiment, a method for producing pellets is preferably disclosed, which comprises melt-kneading a composition containing 0.08 to 8 ppm by mass of a non-aromatic organometallic complex relative to 100 parts by mass of a thermoplastic resin. The preferred ranges of the thermoplastic resin and non-aromatic metal organic complex contained in the composition, as well as their contents, are the same as those of the thermoplastic resin and non-aromatic metal organic complex contained in the resin composition of this embodiment. The composition may also contain other components as described in the description of the resin composition of this embodiment.

[0045] <Molded body> The molded article of this embodiment is formed from the resin composition of this embodiment. The resin composition (e.g., pellets) is molded into a molded article by various molding methods. The shape of the molded article is not particularly limited and can be appropriately selected depending on the use and purpose of the molded article. Examples of the shape of the molded article include film-like, rod-like, cylindrical, ring-like, circular, elliptical, polygonal, irregular, hollow, frame-like, box-like, panel-like, and button-like shapes.

[0046] The method for molding the molded article is not particularly limited, and conventionally known molding methods can be used, such as injection molding, injection compression molding, extrusion molding, profile extrusion, transfer molding, blow molding, gas-assisted blow molding, blow molding, extrusion blow molding, IMC (in-mold coating) molding, rotational molding, multilayer molding, two-color molding, insert molding, sandwich molding, foam molding, and pressure molding. The resin composition of this embodiment is particularly suitable for molded articles obtained by injection molding, injection compression molding, and extrusion molding. However, it goes without saying that the resin composition of this embodiment is not limited to molded articles obtained by these methods.

[0047] The molded article of this embodiment can be widely used for molded articles containing thermoplastic resins, particularly for applications requiring transparency. Specifically, it is preferably used in electrical and electronic equipment / components, office automation equipment / components, information terminal equipment / components, machine parts, home appliances, vehicle parts, building materials, various containers, leisure goods and miscellaneous goods, lighting equipment, etc., and more specifically, it is preferably used in power covers, lighting lenses, lighting covers, light-guiding components, etc.

[0048] <Light transmittance improver> In the present embodiment, a resin additive for improving the light transmittance of a thermoplastic resin is disclosed, which includes a non-aromatic organometallic complex. Such a resin additive is particularly used as an agent for improving total light transmittance. The non-aromatic organometallic complex is preferably a non-aromatic organocopper complex, more preferably an acetylacetone metal complex, and the details of the non-aromatic organometallic complex are the same as those of the non-aromatic organometallic complex described above in the description of the resin composition of this embodiment.

[0049] The light transmittance improver of this embodiment improves the light transmittance of a thermoplastic resin, and is particularly preferably used as a resin additive for improving the light transmittance of an amorphous thermoplastic resin, more preferably a polycarbonate resin. Details of the thermoplastic resin are the same as those of the thermoplastic resin described above in the description of the resin composition of this embodiment. The light transmittance improver of this embodiment is preferably used in a proportion of 0.08 to 8.00 ppm by mass relative to 100 parts by mass of the thermoplastic resin, and the more preferred range is the same as the preferred range of the content of the non-aromatic organometallic complex in the resin composition of this embodiment described above. The light transmittance improver of the present embodiment is preferably used by generally blending it with a thermoplastic resin and melt-kneading it. [Example]

[0050] The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, processing details, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. If the measuring instruments used in the examples are difficult to obtain due to discontinuation or the like, measurements can be made using other instruments with equivalent performance.

[0051] 1.Raw materials The raw materials shown in Table 1 below were used. [Table 1]

[0052] 2. Examples 1 to 5 and Comparative Examples 1 to 4 <Compound> Each component described in Table 1 was blended so as to be in the ratios described in Table 2 (all expressed in parts by mass, except for (B1) which is expressed in mass ppm), and uniformly mixed using a tumbler mixer to obtain a mixture. This mixture was supplied to a twin-screw extruder ("TEX26SX" manufactured by Shibaura Machine Co., Ltd.), kneaded under the conditions of a screw rotation speed of 150 rpm, a discharge rate of 20 kg / h, and a barrel temperature of 280°C, and extruded in a strand form from the tip of the extrusion nozzle. The extrudate was rapidly cooled in a water tank and cut using a pelletizer to be pelletized, thereby obtaining pellets of the resin composition.

[0053] <Light transmittance improvement ratio> For each of the resin compositions obtained above, injection molding was performed using an injection molding machine, J85AD, manufactured by Japan Steel Works, Ltd., under the conditions of a resin temperature of 280°C and a mold temperature of 80°C to obtain block pieces having a length of 50 × 50 mm and a thickness of 12 mm. Using these block pieces as test pieces, the total light transmittance of the 12-mm-thick test pieces was measured using a haze meter (NDH4000) manufactured by Nippon Denshoku Industries Co., Ltd. with a D65 light source in accordance with ASTM-D1003. Furthermore, the total light transmittance of a test piece not containing a non-aromatic organometallic complex (light transmittance improver) was measured, and the ratio with the total light transmittance of the test piece to which the non-aromatic organometallic complex was added was calculated as the light transmittance improvement ratio. That is, for Comparative Examples 1 to 3 and Examples 1 to 4, the light transmittance improvement ratio was calculated based on Comparative Example 1, and for Comparative Example 4 and Example 5, the light transmittance improvement ratio was calculated based on Comparative Example 4.

[0054] <YI value> Using the block pieces having a length of 50 × 50 mm and a thickness of 12 mm obtained above as test pieces, the YI (Yellow Index) value was measured using a spectroscopic color difference meter (SE6000) manufactured by Nippon Denshoku Industries Co., Ltd. by the transmission method with a C light source and a 2° field of view.

[0055]

Table 2

[0056] As is clear from the above results, the resin composition of the present invention, when blended with a non-aromatic organometallic complex in a predetermined ratio, exhibited improved light transmittance and effectively suppressed an increase in the YI value (comparison of Examples 1 to 4 and Comparative Examples 1 to 3). Furthermore, the improvement in light transmittance did not change even when additives were blended, and a similar tendency was observed (Example 5, Comparative Example 4).

Claims

1. For 100 parts by mass of thermoplastic resin, containing 0.08 to 8.00 ppm by mass of a non-aromatic organometallic complex; the thermoplastic resin includes an amorphous thermoplastic resin, The non-aromatic organometallic complex comprises a non-aromatic organocopper complex. The non-aromatic organometallic complex comprises an acetylacetonate metal complex. Resin composition.

2. The resin composition according to claim 1 , wherein the thermoplastic resin comprises an aromatic polycarbonate resin.

3. A molded article formed from the resin composition according to claim 1 or 2.

4. The method includes melt-kneading a composition containing a non-aromatic organometallic complex in an amount of 0.08 to 8.00 ppm by mass relative to 100 parts by mass of a thermoplastic resin, the thermoplastic resin includes an amorphous thermoplastic resin, the non-aromatic organometallic complex comprises a non-aromatic organocopper complex; The non-aromatic organometallic complex comprises an acetylacetonate metal complex. Pellets manufacturing method.

5. A resin additive for improving the light transmittance of a thermoplastic resin, comprising a non-aromatic organometallic complex, the non-aromatic organometallic complex is a non-aromatic organocopper complex, the non-aromatic organometallic complex is an acetylacetone metal complex, The light transmittance improver, wherein the thermoplastic resin is an amorphous thermoplastic resin.

6. The light transmittance improver according to claim 5 , wherein the thermoplastic resin is an aromatic polycarbonate resin.

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