Component Mounting Equipment
JP7785612B2Active Publication Date: 2025-12-15FUJI CORP
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Patent Information
- Application Number
- JP2022087648
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-05-30
- Publication Date
- 2025-12-15
- Estimated Expiration
- 2042-05-30
Abstract
To appropriately adsorb a component and a nozzle while preventing an increase in the size of a device.SOLUTION: A component mounting device uses a nozzle that uses negative pressure to adsorb a component to a holding portion of a head using negative pressure, and includes a nozzle flow path capable of supplying negative pressure generated by the operation of a vacuum pump to the nozzle, a positive pressure flow path that supplies positive pressure, an ejector that generates negative pressure by using the positive pressure in the positive pressure flow path, and a holding portion flow path that can supply the negative pressure generated by the ejector operation to the holding portion.SELECTED DRAWING: Figure 3
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