Photosensitive resin composition, cured product, display device, and electronic component

JP7789294B1Active Publication Date: 2025-12-22TORAY INDUSTRIES INC
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Patent Information

Application Number
JP2025503361
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2024-06-19
Filing Date
2025-01-16
Publication Date
2025-12-22
Estimated Expiration
2045-01-16

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Abstract

The present invention aims to provide a photosensitive resin composition that has good solubility in thinner, that can suppress contamination of openings after curing, that can suppress foaming during lamination, and that has good luminescence properties even after a reliability test when cured, a cured product obtained by curing the photosensitive resin composition, and a display device and an electronic component that include a cured product of the resin composition. The photosensitive resin composition of the present invention contains a resin (A) containing a specific structural unit (hereinafter referred to as resin (A)), a photosensitizer (B), and a solvent (C), and when the total amount of diamine residues in the resin (A) is taken as 100 mol %, the total content of the specific diamine residues is 30 to 100 mol %.
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Citation Information

Patent Citations

  • Photosensitive resin composition, cured product and organic el display

    JP2023134943A

  • Heat-resistant resin precursor and photosensitive resin composition using the same

    JP5498170B2

  • Photosensitive resin composition

    WO2023106104A1

  • Preparation of heat sink for microwave tube

    JP1979098170A

  • Display device

    JP2002091343A