Electronic component covering sheet, laminated sheet, and electronic component mounting substrate

Abstract

Provided are an electronic component covering sheet, a laminated sheet, and an electronic component mounting substrate having the covering layer, which are capable of forming a covering layer that has excellent reworkability and adhesion at room temperature. [Solution] In an electronic component mounting substrate (10) comprising a substrate (1), an electronic component (2), and a covering layer (3) covering at least a portion of the electronic component (2) and the substrate (1), an electronic component covering sheet for forming the covering layer (3) has an adhesive strength of 2.0 N / cm or more, measured by 180-degree peel peeling at 25°C after bonding the electronic component covering sheet to a polyimide substrate, and (ii) an adhesive strength of 0.15 N / cm or more, where A [N / cm] is the adhesive strength of A [N / cm] and B [N / cm] is the adhesive strength of B [N / cm].

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