Substrate processing apparatus and substrate processing method

Abstract

To provide a technique capable of reducing contamination caused by a processing solution thermally affected by plasma processing.SOLUTION: A substrate processing apparatus 132 includes a holding unit 1 that holds a substrate W, a processing liquid supply unit that supplies processing liquid to the substrate W held by the holding unit 1, a plasma irradiation unit 31 that irradiates the substrate W held by the holding unit 1 with plasma, a moving mechanism 33 that moves the plasma irradiation unit 31 between a standby position where the substrate W held by the holding unit 1 is not irradiated with plasma and a plasma processing position where the substrate W held by the holding unit 1 is irradiated with plasma, and a gas flow forming unit 4 that forms a gas flow along a facing surface 310 facing the substrate W in the plasma irradiation unit 31.SELECTED DRAWING: Figure 3

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