Resin sealing metal type

Abstract

To provide a resin sealing mold capable of appropriately supporting a molded product.SOLUTION: A resin sealing mold comprises: a plurality of support pins for supporting a molded product within a cavity that is a space formed by clamping a first mold and a second mold; and a holding portion for holding the plurality of support pins. The holding portion holds a first support pin among the plurality of support pins so as to be movable in a clamping direction in which the first mold and the second mold are clamped together; and in a resin sealing step of the molded product, the first support pin comes into contact with the molded product, and then a second support pin other than the first support pin among the plurality of support pins comes into contact with the molded product.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The disclosed embodiments relate to a resin-sealed mold. [Background technology]

[0002] Resin sealing dies for sealing molded parts with resin have been known. In such resin sealing dies, it is important that the molded part is properly supported to prevent displacement of the molded part during the process of filling the cavity in which the molded part is placed with resin material.

[0003] Patent Document 1 discloses a technology in which, when clamping the mold, multiple support pins enter the cavity from above and below to support the molded product, and before resin sealing is completed, the multiple support pins retract from the cavity, allowing resin to fill the space created by this retraction. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-209193 Summary of the Invention [Problem to be solved by the invention]

[0005] However, with the above-described conventional technology, for example, if the heights (positions in the mold clamping direction) of multiple portions of the molded product supported by different support pins are different, the variations in height of these multiple portions may result in the formation of gaps between the support pins and the molded product, making it impossible to properly support the molded product. This is not limited to cases where the heights of multiple portions of the molded product supported by different support pins are different, but may also occur when the support pins are different in length.

[0006] One aspect of the embodiment has been made in view of the above, and aims to provide a resin sealing mold that can appropriately support a molded product. [Means for solving the problem]

[0007] A resin sealing mold according to one aspect of the embodiment includes a plurality of support pins for supporting a molded product in a cavity, which is a space formed by clamping a first mold and a second mold, and a holding portion for holding the plurality of support pins. The holding portion holds a first support pin among the plurality of support pins so that the first support pin is movable in a clamping direction in which the first mold and the second mold are clamped, and in a resin sealing step of the molded product, after the first support pin abuts against the molded product, a second support pin other than the first support pin among the plurality of support pins abuts against the molded product. [Effects of the Invention]

[0008] According to one aspect of the embodiment, the workpiece can be appropriately supported. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing an example of the configuration of a resin sealing apparatus according to the first embodiment. [Figure 2] FIG. 2 is a side view showing an example of a workpiece and a molded product according to the first embodiment. [Figure 3] FIG. 3 is a diagram (part 1) showing an example of a resin sealing process using a resin sealing mold of the resin sealing apparatus according to the first embodiment. [Figure 4] FIG. 4 is a diagram (part 2) showing an example of a resin sealing step using a resin sealing mold of the resin sealing apparatus according to the first embodiment. [Figure 5] FIG. 5 is a diagram (part 3) showing an example of a resin sealing step using a resin sealing mold of the resin sealing apparatus according to the first embodiment. [Figure 6] FIG. 6 is a diagram (part 4) showing an example of a resin sealing step using a resin sealing mold of the resin sealing apparatus according to the first embodiment. [Figure 7]FIG. 7 is a diagram (part 5) showing an example of a resin sealing step using a resin sealing mold of the resin sealing apparatus according to the first embodiment. [Figure 8] FIG. 8 is a diagram (part 6) showing an example of a resin sealing step using a resin sealing mold of the resin sealing apparatus according to the first embodiment. [Figure 9] FIG. 9 is a diagram (part 7) showing an example of a resin sealing step using a resin sealing mold of the resin sealing apparatus according to the first embodiment. [Figure 10] FIG. 10 is a diagram showing another example of the configuration of the resin sealing mold of the resin sealing apparatus according to the first embodiment. [Figure 11] FIG. 11 is a side view showing an example of a workpiece and a molded product according to the second embodiment. [Figure 12] FIG. 12 is a diagram (part 1) showing another example of the resin sealing process using the resin sealing mold of the resin sealing apparatus according to the second embodiment. [Figure 13] FIG. 13 is a diagram (part 2) showing another example of the resin sealing process using the resin sealing mold of the resin sealing apparatus according to the second embodiment. [Figure 14] FIG. 14 is a view (part 3) showing another example of the resin sealing step using the resin sealing mold of the resin sealing apparatus according to the second embodiment. [Figure 15] FIG. 15 is a view (part 4) showing another example of the resin sealing process using the resin sealing mold of the resin sealing apparatus according to the second embodiment. [Figure 16] FIG. 16 is a diagram (part 5) showing another example of the resin sealing process using the resin sealing mold of the resin sealing apparatus according to the second embodiment. [Figure 17] FIG. 17 is a diagram (part 6) showing another example of the resin sealing step using the resin sealing mold of the resin sealing apparatus according to the second embodiment. [Figure 18] FIG. 18 is a view (part 7) showing another example of the resin sealing step using the resin sealing mold of the resin sealing apparatus according to the second embodiment. [Figure 19] FIG. 19 is a diagram (part 8) showing another example of the resin sealing step using the resin sealing mold of the resin sealing apparatus according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the resin-sealed mold disclosed in the present application will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments.

[0011] 1. First Embodiment <1.1. Structure of resin sealing mold> 1, the resin sealing apparatus 100 according to the first embodiment includes a resin sealing mold 1, a plurality of dies 90, a fixed platen 91, a movable platen 92, and a transfer unit 93. To facilitate understanding of the positional relationship, the drawings including FIG. 1 show axes of an XYZ coordinate system including an X-axis, a Y-axis, and a Z-axis that are orthogonal to one another, and the Z-axis is the up-down direction.

[0012] The multiple divers 90 extend parallel to one another in the vertical direction and are supported on a base (not shown). A fixed platen 91 is fixed to the upper end of each diver 90, and a movable platen 92 is attached to each diver 90 so as to be movable in the vertical direction (Z-axis direction).

[0013] The resin sealing mold 1 includes an upper mold 2 and a lower mold 3. The upper mold 2 is an example of a first mold, and the lower mold 3 is an example of a second mold. The upper mold 2 is attached to a fixed platen 91, and the lower mold 3 is attached to a movable platen 92.

[0014] The movable platen 92 is driven by a drive mechanism (not shown) to move up and down. The upper mold 2 includes an upper chess piece 4 and an upper die set 5 that supports the upper chess piece 4. The lower mold 3 includes a lower chess piece 6 and a lower die set 7 that supports the lower chess piece 6.

[0015] In the resin sealing apparatus 100, the movable platen 92 moves upward, causing the lower mold 3 to come into contact with the upper mold 2 and clamping the upper mold 2 and the lower mold 3. In the example shown in Fig. 1, the resin sealing apparatus 100 is configured so that the lower mold 3 moves upward (positive direction of the Z axis), but it may also be configured so that the upper mold 2 moves downward (negative direction of the Z axis), or so that the lower mold 3 moves upward and the upper mold 2 moves downward.

[0016] In the resin sealing device 100, the upper mold 2 and the lower mold 3 come into contact with each other and are clamped together, thereby forming a cull, a runner, and a cavity 50 (see Figure 6) in the space between the upper mold 2 and the lower mold 3, and the molded product 60 is resin sealed within the cavity 50 (see Figure 6).

[0017] 2(a), the molded product 60 includes a plurality of members 61 to 67. The members 61 and 67 are, for example, lead frames, the members 62 and 66 are, for example, spacers, the member 63 is, for example, a circuit board on which a plurality of electronic components are mounted, and the members 64 and 65 are, for example, metal members, and have different heights (positions in the Z-axis direction, which is the mold clamping direction). Note that the plurality of members 61 to 67 in the molded product 60 are not limited to the example described above, and the configuration of the molded product 60 is also not limited to the example described above.

[0018] 2(b), a molded product 80 is produced in which resin 68 is integrally molded with the molded product 60. The resin 68 is, for example, a thermoplastic resin or a thermosetting resin, but is not limited to these examples.

[0019] 1 is configured to resin-seal one molded article 60, but is not limited to this example and may be configured to resin-seal a plurality of molded articles 60 simultaneously. Below, the configuration of the resin sealing mold 1 of the resin sealing apparatus 100 and each of the resin sealing steps for resin-sealing the molded article 60 with the resin sealing mold 1 of the resin sealing apparatus 100 will be described in detail in order.

[0020] <1.2. Configuration of resin sealing mold 1> 3, in the resin sealing mold 1 of the resin sealing apparatus 100, an upper mold 2 including an upper die chest 4 and a lower mold 3 including a lower die chest 6 are positioned apart from each other in the mold clamping direction (Z-axis direction). In the resin sealing process for the molded product 60, the lower mold 3 is moved in a direction toward the upper mold 2 (positive direction of the Z-axis) and comes into contact with the upper mold 2 for mold clamping.

[0021] As described above, the upper mold 2 includes the upper chess piece 4. The upper chess piece 4 includes a first upper chess piece 10 and a second upper chess piece 20. The first upper chess piece 10 is also called a cavity plate, and includes a cavity forming portion 11 that forms a cavity 50 (see FIG. 6), a runner forming portion (not shown) that forms a runner (not shown), and a cull forming portion (not shown) that forms a cull. Each of the cavity 50 (see FIG. 6), the cull (not shown), and the runner (not shown) is a space formed by clamping the upper mold 2 and the lower mold 3 together.

[0022] The second upper die chess section 20 includes a plurality of support pins 21, 22 for supporting the workpiece 60 in the cavity 50 (see FIG. 6), and a holding section 23 for holding the plurality of support pins 21, 22. The plurality of support pins 21, 22 have the same shape, and in the state shown in FIG. 3, the heights (positions in the Z-axis direction) of the tips closest to the lower die 3 are the same, but this is not limited to this example.

[0023] The holding portion 23 holds the plurality of support pins 21, 22 movably in the mold clamping direction (Z-axis direction). The support pin 21 is an example of a first support pin, and the support pin 22 is an example of a second support pin.

[0024] The holding portion 23 includes a base portion 231 and a cover portion 232. Recesses 2311 and 2312 are formed in the base portion 231, and elastic members 2313 and 2314 are housed in the recesses 2311 and 2312. The recesses 2311 and 2312 are covered by the cover portion 232 with the elastic members 2313 and 2314 housed therein.

[0025] The holding portion 23 holds the multiple support pins 21, 22 movably in the mold clamping direction (Z-axis direction) by means of elastic members 2313, 2314. The elastic members 2313, 2314 are, for example, springs, but may also be rubber, cushioning material, or other elastic members.

[0026] The first upper chess piece 10 has a plurality of through holes 12, 13 through which a plurality of support pins 21, 22 are inserted. Therefore, the plurality of support pins 21, 22 are movable relative to the first upper chess piece 10.

[0027] The support pin 21 includes a support portion 211 that is inserted into the through hole 12 and abuts against the molded product 60 to support the molded product 60, a locking portion 212 that is respectively arranged in the recess 2311, and a guide portion 213 that is arranged inside the elastic member 2313 and restricts movement of the elastic member 2313 in a direction perpendicular to the mold clamping direction (Z-axis direction).

[0028] The support pin 22 also includes a support portion 221 that is inserted into the through hole 13 and abuts against the molded product 60 to support the molded product 60, a locking portion 222 that is respectively arranged in the recess 2312, and a guide portion 223 that is arranged inside the elastic member 2314 and restricts movement of the elastic member 2314 in a direction perpendicular to the mold clamping direction (Z-axis direction).

[0029] 3, the locking portion 212 is biased downward (negative direction of the Z axis) by the elastic member 2313 and abuts against the bottom surface of the recess 2311, thereby restricting the downward movement of the support pin 21 (negative direction of the Z axis). At this time, the relative position of the support pin 21 with respect to the holding portion 23 is at the lowest position (negative direction of the Z axis).

[0030] Furthermore, the locking portion 222 is biased downward (negative Z-axis direction) by the elastic member 2314 and comes into contact with the bottom surface of the recess 2312, thereby restricting the downward movement of the support pin 22 (negative Z-axis direction). At this time, the relative position of the support pin 22 with respect to the holding portion 23 is at the lowest position (negative Z-axis direction).

[0031] The lower die set 6 includes a cavity forming portion 31 that forms a cavity 50 (see FIG. 6), a runner forming portion (not shown) that forms a runner (not shown), a cull forming portion (not shown) that forms a cull (not shown), etc. Note that in FIG. 3, the upper die set 5 and the lower die set 7 of the resin sealing mold 1 are omitted.

[0032] <1.3. Resin sealing process using the resin sealing apparatus 100> With the resin sealing mold 1 in the state shown in Fig. 3, a transfer device (not shown) places a molded article 60 between the upper mold 2 and the lower mold 3. In the example shown in Fig. 4, the molded article 60 is placed between the upper mold 2 and the lower mold 3, on the cavity forming portion 31 of the lower mold chest 6 of the lower mold 3. In the state shown in Fig. 4, the distance between the support pin 21 and the molded article 60 in the mold clamping direction (Z-axis direction) is shorter than the distance between the support pin 22 and the molded article 60 in the mold clamping direction (Z-axis direction). Therefore, as will be described later, during mold clamping, the support pin 21 abuts against the molded article 60 before the support pin 22.

[0033] Thereafter, the movable platen 92 (see FIG. 1) moves upward (positive direction of the Z axis), causing the lower mold 3 to move upward (positive direction of the Z axis) toward the upper mold 2. When the lower mold 3 moves upward (positive direction of the Z axis), as shown in FIG. 5, of the multiple support pins 21, 22, the support pin 21 comes into contact with the molded product 60 first. In the example shown in FIG. 5, the support pin 21 comes into contact with the member 64 of the molded product 60. As a result, the molded product 60 is sandwiched between the support pin 21 and the cavity forming portion 31.

[0034] Thereafter, the lower mold 3 moves further upward (positive direction of the Z axis), and the support pin 21 is pushed upward by the member 64. Because the support pin 21 is held by the holding portion 23 so as to be movable upward, it moves upward while holding the molded product 60 between itself and the cavity forming portion 31, as shown in FIG.

[0035] Furthermore, of the multiple support pins 21, 22, the support pin 22 also abuts against the molded article 60. In the example shown in Fig. 6, the support pin 22 abuts against a member 65 of the molded article 60. As a result, the molded article 60 is clamped not only between the support pin 21 and the cavity forming portion 31, but also between the support pin 22 and the cavity forming portion 31.

[0036] Thereafter, the lower mold 3 moves further upward (positive direction of the Z axis), and the support pin 22 is pushed upward by the member 65, similar to the support pin 21. Because the support pin 22 is held by the holder 23 so as to be movable upward, it moves upward while holding the molded article 60 between itself and the cavity forming part 31, as shown in Fig. 6. This allows the molded article 60 to be properly supported even if there is variation in the heights (positions in the Z axis direction) of the multiple members 64, 65 within the cavity 50 (see Fig. 6).

[0037] The workpiece 60 includes a plurality of members 64, 65, which are supported by different support pins from the plurality of support pins 21, 22 at different positions in the mold clamping direction (Z-axis direction).

[0038] In conventional resin sealing molds, when multiple components of a molded product that are at different positions in the mold clamping direction are supported by different support pins, there is a risk that gaps will form between the support pins and the molded product due to variations in the heights (positions in the Z-axis direction) of the multiple components of the molded product, making it impossible to properly support the molded product, or that the support pins will crush part of the molded product 70, causing damage to the molded product 70.

[0039] In the resin sealing mold 1 according to the first embodiment, the support pins 21, 22 are held by the holding portion 23 so as to be movable in the mold clamping direction (Z-axis direction). Therefore, the resin sealing mold 1 can appropriately support the molded product 60 even if there is variation in the heights (positions in the Z-axis direction) of the multiple members 64, 65 in the molded product 60.

[0040] Thereafter, the resin tablet placed in the pot 94 (see FIG. 1) melts, and as shown in FIG. 7, the molten resin 68 fills the cavity 50 via the cull and runner (not shown).

[0041] 8, in the resin sealing mold 1, the holding portion 23 is moved upward (in the positive direction of the Z axis) by a moving mechanism (not shown). When the holding portion 23 moves upward, the support pins 21 and 22 are pressed by the elastic members 2313 and 2314, and move downward (in the negative direction of the Z axis) relative to the holding portion 23, and come into contact with the bottom surfaces of the recesses 2311 and 2312 in the holding portion 23. Thereafter, the holding portion 23 moves further upward, and the support pins 21 and 22 move to positions away from the molded product 60.

[0042] Therefore, the support pins 21, 22 are moved to positions away from the members 64, 65 of the workpiece 60, and some of the support pins 21, 22 are retracted from the cavity 50, whereby the space created by this retraction is filled with resin 68. As a result, the members 64, 65 of the workpiece 60 are also sealed with resin 68.

[0043] Thereafter, in the resin sealing apparatus 100, the movable platen 92 (see FIG. 1) moves downward (in the negative Z-axis direction), thereby moving the lower mold 3 downward (in the negative Z-axis direction). This releases the clamping between the upper mold 2 and the lower mold 3. Then, as shown in FIG. 9, the molded product 80 is removed from the resin sealing mold 1 by a conveying device (not shown). After the molded product 80 has been removed, the holding part 23 moves downward (in the negative Z-axis direction) by a moving mechanism (not shown). In conjunction with this movement, the support pins 21 and 22 move downward.

[0044] The resin sealing mold 1 may be configured to include locking pins that lock the support pins 21, 22 to the holding portions 23 before the support pins 21, 22 are separated from the members 64, 65 of the molded product 60. For example, in the example shown in FIG. 10 , the upper mold 2 includes locking pins 26, 27 that lock the support pins 21, 22 to the holding portions 23.

[0045] 10(a), the support pin 21 has a recess 2111 recessed in the left-right direction (X-axis direction), and the support pin 22 has a recess 2211 recessed in the left-right direction (X-axis direction). In the resin sealing mold 1, before the multiple support pins 21, 22 are separated from the members 64, 65 of the molded product 60, the locking pin 26 is inserted into the recess 2111 of the support pin 21, and the locking pin 27 is inserted into the recess 2211 of the support pin 22.

[0046] As a result, the support pins 21 and 22 are locked to the holding portion 23 by the locking pins 26 and 27. Thereafter, in the resin sealing mold 1, the holding portion 23 is moved upward (in the positive direction of the Z axis) by a moving mechanism (not shown), as shown in FIG.

[0047] Therefore, in the example shown in FIG. 10(b), the support pins 21 and 22 can be moved to positions farther away from the members 64 and 65 of the workpiece 60, and the movement amount of the holding portion 23 can be reduced.

[0048] 2. Second Embodiment <2.1. Structure of resin sealing mold> 11, the resin sealing apparatus according to the second embodiment differs from the resin sealing apparatus 100 according to the first embodiment in that it includes a resin sealing mold 1A instead of the resin sealing mold 1. Note that the same components as those in the resin sealing mold 1 according to the first embodiment are denoted by the same reference numerals, and the description thereof may be omitted.

[0049] The resin sealing mold 1A comprises an upper mold 2A and a lower mold 3A. The upper chess piece 4A of the upper mold 2A differs from the upper chess piece 4 of the upper mold 2 in that it comprises a first upper chess piece 10A instead of the first upper chess piece 10. The first upper chess piece 10A is the same as the first upper chess piece 10 except that the shape of the cavity forming portion 11A differs from the cavity forming portion 11 of the first upper chess piece 10. The cavity forming portion 11A, i.e., the wall surface forming the cavity 50, comprises a protrusion 111 that abuts against the back surface of the surface that abuts against the support pin 42 of the molded product 70 (see FIG. 12), which will be described later.

[0050] In addition, the second upper mold chess portion 20 in the resin sealing mold 1A is different from the second upper mold chess portion 20 in the resin sealing mold 1 in that the length of the support pin 21 in the mold clamping direction (Z-axis direction) is longer than the length of the support pin 22 in the mold clamping direction (Z-axis direction), and in the state shown in Figure 11, the position of the tip of the support pin 21 closest to the lower mold 3 is closer to the lower mold 3 than the support pin 22.

[0051] The lower die chess piece 6A of the lower die 3A includes a first lower die chess piece 30A and a second lower die chess piece 40A. The first lower die chess piece 30A differs from the lower die chess piece 6 in that it includes a cavity forming portion 31A having a different shape from the cavity forming portion 31 and in that it includes through holes 32 and 33.

[0052] The second lower die chest section 40A includes a plurality of support pins 41, 42 for supporting the workpiece 70 (see FIG. 12) in a cavity 50A (see FIG. 16), which is a space formed by clamping the upper die 2A and the lower die 3A, and a holding section 43 for holding the plurality of support pins 41, 42. The holding section 43 is an example of a second holding section, and the holding section 23 is an example of a first holding section.

[0053] The holding portion 43 holds the multiple support pins 41, 42 so that they can move in a direction (negative Z-axis direction) away from the cavity 50A (see FIG. 16). The support pin 41 is an example of a first support pin, and the support pin 42 is an example of a second support pin. The multiple support pins 41, 42 are inserted into multiple through holes 32, 33 formed in the first lower chess portion 30A, and are movable relative to the first lower chess portion 30A.

[0054] The holding portion 43 includes a base portion 431 and a cover portion 432. Recesses 4311 and 4312 are formed in the base portion 431, and elastic members 4313 and 4314 are housed in the recesses 4311 and 4312. The recesses 4311 and 4312 are covered by the cover portion 432 with the elastic members 4313 and 4314 housed therein.

[0055] The holding portion 43 holds the multiple support pins 41 and 42 movably in a direction (negative direction of the Z axis) away from the cavity 50A (see FIG. 16) by means of elastic members 4313 and 4314. The elastic members 4313 and 4314 are, for example, springs, but may also be rubber, cushioning material, or other elastic members.

[0056] The support pin 41 is inserted into the through hole 32 and includes a support portion 411 for abutting against the molded product 70 (see Figure 12) to support the molded product 70, a locking portion 412 each arranged in the recess 4311, and a guide portion 413 arranged inside the elastic member 4313 to restrict movement of the elastic member 4313 in a direction perpendicular to the mold clamping direction (Z-axis direction).

[0057] The support pin 42 also includes a support portion 421 that is inserted into the through hole 33 and abuts against the molded product 70 to support the molded product 70, a locking portion 422 that is respectively arranged in the recess 4312, and a guide portion 423 that is arranged inside the elastic member 4314 and restricts movement of the elastic member 4314 in a direction perpendicular to the mold clamping direction (Z-axis direction).

[0058] 11, the locking portion 412 is biased upward (in the positive direction of the Z axis) by the elastic member 4313 and abuts against the bottom surface of the recess 4311, thereby restricting the upward movement of the support pin 41 (in the positive direction of the Z axis). At this time, the position of the support pin 41 relative to the holding portion 43 is at the uppermost position (in the positive direction of the Z axis).

[0059] Furthermore, the locking portion 422 is biased upward (in the positive direction of the Z axis) by the elastic member 4314 and comes into contact with the bottom surface of the recess 4312, thereby restricting the upward movement of the support pin 42 (in the positive direction of the Z axis). At this time, the relative position of the support pin 42 with respect to the holding portion 43 is at the uppermost position (in the positive direction of the Z axis).

[0060] The support pins 41 and 42 have the same shape, and in the state shown in FIG. 11, the heights (positions in the Z-axis direction) of the tips closest to the upper mold 2A are the same, but this is not limiting.

[0061] 12(a) includes a plurality of members 71 to 76. The member 71 is, for example, a lead frame, the members 72 and 75 are, for example, spacers, the member 73 is, for example, a circuit board on which a plurality of electronic components are mounted, and the members 74 and 76 are, for example, metal members. Note that the plurality of members 71 to 76 in the molded workpiece 70 are not limited to the above-mentioned examples, and the configuration of the molded workpiece 70 is not limited to the above-mentioned examples.

[0062] By resin-sealing the molded product 70 using the resin-sealing mold 1A, a molded product 81 is produced in which the resin 78 is integrally molded with the molded product 70, as shown in Fig. 12(b). The resin 78 is, for example, a thermoplastic resin or a thermosetting resin, but is not limited to these examples.

[0063] 11 is configured to resin-seal one molded article 70, but is not limited to this example, and the resin-sealing mold 1A may be configured to simultaneously resin-seal a plurality of molded articles 70. The resin-sealing step of resin-sealing the molded article 70 using the resin-sealing mold 1A will be described in detail below.

[0064] <2.2. Resin sealing process using the resin sealing apparatus 100> With the upper mold 2A and the lower mold 3A of the resin sealing mold 1A positioned apart from each other in the vertical direction (Z-axis direction), a transfer device (not shown) places a molded article 70 between the upper mold 2A and the lower mold 3A as shown in Fig. 13. In the example shown in Fig. 13, the molded article 70 is in contact with the support pins 41 of the lower mold 3A.

[0065] Furthermore, in the state shown in Figure 13, the distance between support pin 21 and molded product 70 in the mold clamping direction (Z-axis direction) is shorter than the distance between support pin 22 and molded product 70 in the mold clamping direction (Z-axis direction), so as will be described later, support pin 21 abuts against molded product 70 before support pin 22 when the mold is clamped.

[0066] Thereafter, the movable platen 92 (see FIG. 1) moves upward (positive direction of the Z axis), causing the lower mold 3A to move upward (positive direction of the Z axis) toward the upper mold 2A. When the lower mold 3A moves upward (positive direction of the Z axis), as shown in FIG. 14, of the multiple support pins 21, 22, the support pin 21 first comes into contact with the workpiece 70. In the example shown in FIG. 14, the support pin 21 comes into contact with the member 73 of the workpiece 70.

[0067] Thereafter, the lower mold 3A moves further upward (positive direction of the Z axis), and the support pin 21 is pushed upward by the member 73. Because the support pin 21 is held by the holder 23 so as to be movable upward, it moves upward while holding the molded product 70 between itself and the cavity forming portion 31A, as shown in FIG.

[0068] 15, of the multiple support pins 21 and 22, the support pin 22 abuts against the molded product 70. In the example shown in FIG. 15, the support pin 22 abuts against a member 74 of the molded product 70. As a result, the molded product 70 is sandwiched between the support pin 22 and the support pin 41.

[0069] Thereafter, the lower mold 3A moves further upward (in the positive direction of the Z axis), and as shown in Fig. 16, of the multiple support pins 41, 42, the support pin 42 comes into contact with the molded product 70. In the example shown in Fig. 16, the support pin 42 comes into contact with the member 76 of the molded product 70 and pushes the member 76 upward. The surface of the member 76 that comes into contact with the support pin 42 is an example of a first surface.

[0070] As a result, member 71 of workpiece 70 is pressed against protrusion 111 of cavity forming portion 11A by support pin 42 via member 76, and workpiece 70 is clamped not only between support pin 22 and support pin 41 and between support pin 21 and cavity forming portion 31A, but also between support pin 42 and cavity forming portion 11A. The contact surface of member 71 with protrusion 111 is an example of a second surface.

[0071] Furthermore, as the lower mold 3A moves upward (in the positive direction of the Z axis), the support pins 21 and 22 are pushed upward by the lower mold 3A via the members 73 and 74. Because the support pins 21 and 22 are held by the holder 23 so as to be movable upward, they move upward while holding the molded product 70 between them and the cavity forming portion 31A.

[0072] Furthermore, as the lower mold 3A moves upward (positive direction of the Z axis), the support pin 42 is pushed downward (negative direction of the Z axis) by the upper mold 2A via the member 76. Because the support pin 42 is held by the holding portion 43 so as to be movable downward, the support pin 42 moves downward relative to the holding portion 43 while maintaining a state in which the molded product 70 is sandwiched between the support pin 42 and the protrusion 111 of the cavity forming portion 11A.

[0073] Furthermore, the elastic modulus of the elastic member 2314 is greater than that of the elastic member 4313. Therefore, when the lower mold 3A moves upward (positive direction of the Z axis), the support pin 41 is pressed by the support pin 22 via the member 74, so that its upward movement is restricted, and the support pin 41 moves downward (negative direction of the Z axis) relative to the holding part 43. The elastic modulus of the elastic members 2314, 4313 is set to a value that will not damage the molded product 70. Note that the elastic modulus of the elastic member 2314 may be smaller than that of the elastic member 4313.

[0074] The molded product 70 includes a plurality of members 73, 74, which are supported at different positions in the mold clamping direction (Z-axis direction) by different support pins from the plurality of support pins 21, 22. The molded product 70 also includes a plurality of members 74, 76, which are supported at different positions in the mold clamping direction (Z-axis direction) by different support pins from the plurality of support pins 41, 42.

[0075] In conventional resin sealing molds, when multiple components of a molded product that are located at different positions in the mold clamping direction are supported by different support pins, variations in the heights (positions in the Z-axis direction) of the multiple components of the molded product can result in gaps being formed between the support pins and the molded product, making it impossible to properly support the molded product.

[0076] In the resin sealing mold 1A according to the second embodiment, the support pins 21 and 22 are held by the holding portion 23 so as to be movable in the mold clamping direction (Z-axis direction), and the support pins 41 and 42 are held by the holding portion 43 so as to be movable in the mold clamping direction (Z-axis direction). Therefore, the resin sealing mold 1A can appropriately support the molded product 70 even if there is variation in the heights (positions in the Z-axis direction) of the multiple members 73, 74, and 76 in the molded product 70.

[0077] Furthermore, the cavity forming portion 11A (wall surface forming the cavity 50) of the resin sealing mold 1A has a protrusion 111 that abuts against the back surface (an example of a second surface) of the surface (an example of a first surface) that abuts against the support pin 42 of the molded product 70. Therefore, the resin sealing mold 1A can appropriately support the molded product 70 even if there is variation in the heights (positions in the Z-axis direction) of the multiple members 74, 76 of the molded product 70.

[0078] Thereafter, the resin tablet placed in the pot 94 (see FIG. 1) melts, and as shown in FIG. 17, the molten resin 78 fills the cavity 50A via the cull and runner (not shown).

[0079] Then, in the resin sealing mold 1A, as shown in Figure 18, the holding portion 23 is moved upward (positive direction of the Z axis) by a moving mechanism not shown, and the holding portion 43 is moved downward (negative direction of the Z axis) by a moving mechanism not shown.

[0080] When the holding part 23 moves upward (positive direction of the Z axis), the support pins 21 and 22 are pressed by the elastic members 2313 and 2314, and move downward (negative direction of the Z axis) relative to the holding part 23, and come into contact with the bottom surfaces of the recesses 2311 and 2312 in the holding part 23. Thereafter, the holding part 23 moves further upward, and the support pins 21 and 22 move to positions away from the molded product 70.

[0081] Furthermore, when the holding portion 43 moves downward (negative direction of the Z axis), the support pins 41 and 42 are pressed by the elastic members 4313 and 4314, and move upward (positive direction of the Z axis) relative to the holding portion 43, and come into contact with the bottom surfaces of the recesses 4311 and 4312 in the holding portion 43. Thereafter, the holding portion 43 moves further downward, and the support pins 41 and 42 move to positions away from the molded product 70.

[0082] In this way, the support pins 21, 22, 41, 42 move to positions away from the components 73, 74, 76 of the molded product 70, and some of the support pins 21, 22, 41, 42 retreat from the cavity 50A, thereby filling the space created by this retreat with resin 78. As a result, the components 73, 74, 76 of the molded product 70 are also sealed with resin 78.

[0083] Thereafter, in the resin sealing apparatus according to the second embodiment, the movable platen 92 (see FIG. 1) moves downward (in the negative Z-axis direction), thereby moving the lower mold 3A downward (in the negative Z-axis direction). This releases the clamping between the upper mold 2A and the lower mold 3A. Then, as shown in FIG. 19, the molded product 81 is removed from the resin sealing mold 1A by a conveying device (not shown).

[0084] After the molded product 81 is removed, the holding unit 23 is moved downward (negative direction of the Z axis) by a movement mechanism (not shown). As a result of this movement, the support pins 21 and 22 move downward. Furthermore, after the molded product 81 is removed, the holding unit 43 is moved upward (positive direction of the Z axis) by a movement mechanism (not shown). As a result of this movement, the support pins 41 and 42 move upward.

[0085] In the above example, the resin sealing mold 1A is configured so that the lower mold 3A moves toward the upper mold 2A, but it may also be configured so that the upper mold 2A moves toward the lower mold 3A, or so that the upper mold 2A and the lower mold 3A move in directions approaching each other.

[0086] Furthermore, similar to the resin sealing mold 1, the resin sealing mold 1A may be configured to include a plurality of locking pins 26, 27 that lock the plurality of support pins 21, 22, and may further be configured to include a plurality of locking pins that lock the plurality of support pins 41, 42. This makes it possible to move the plurality of support pins 21, 22, 41, 42 to positions farther away from the members 73, 74, 76 of the molded product 70, and to reduce the amount of movement of the holding portions 23, 43.

[0087] Furthermore, the support pins 22, 42 that come into contact with the molded product 70 after the support pins 21, 41 do not have to be movably held by the holding portion 23, and even in this case, the molded product 70 can be properly supported. Furthermore, in the above example, the upper molds 2, 2A are provided with two support pins 21, 22, but the number of support pins may be three or more. Similarly, the lower mold 3A is provided with two support pins 41, 42, but the number of support pins may be three or more.

[0088] As described above, the resin sealing mold 1, 1A according to the embodiment includes a plurality of support pins 21, 22 for supporting the molded product 60, 70 in the cavity 50, 50A, which is a space formed by clamping the upper mold 2, 2A and the lower mold 3, 3A, and a holding portion 23 for holding the plurality of support pins 21, 22. The upper mold 2, 2A is an example of a first mold, and the lower mold 3, 3A is an example of a second mold. The holding portion 23 holds the support pin 21 of the plurality of support pins 21, 22 so that it can move in the clamping direction in which the upper mold 2, 2A and the lower mold 3, 3A are clamped together. During the resin sealing process for the molded product 60, 70, after the support pin 21 abuts against the molded product 60, 70, the support pins 22 other than the support pin 21 of the plurality of support pins 21, 22 abut against the molded product 60, 70. The support pin 21 is an example of a first support pin, and the support pin 22 is an example of a second support pin. This allows the resin sealing molds 1, 1A to properly support the molded products 60, .

[0089] The holding portion 23 holds the support pin 21 via the elastic member 2313. This allows the resin sealing molds 1, 1A to support the molded products 60, 70 more appropriately.

[0090] Furthermore, in the resin sealing mold 1A, the wall surface that forms the cavity 50A, i.e., the cavity forming portion 11A, has a protrusion 111 that abuts against a second surface that is the backside of the first surface that abuts against one of the support pins 21 and 22 in the molded product 70. This allows the resin sealing mold 1A to properly support the molded product 70 even if there is variation in the heights (positions in the Z-axis direction) of the multiple members 73, 74 in the molded product 70.

[0091] Furthermore, the resin sealing mold 1, 1A includes a locking pin 26 that locks the support pin 21 in the holding portion 23 before the support pin 21 moves away from the molded product 60, 70. This allows the resin sealing mold 1, 1A to move the multiple support pins 21, 22, 41, 42 to positions farther away from the members 64, 65, 73, 74, 76 of the molded product 60, 70, and to reduce the amount of movement of the holding portion 23, 43.

[0092] The resin sealing mold 1A also has a plurality of holding portions that hold a plurality of support pins. The plurality of holding portions include a holding portion 23 provided on the upper mold 2A and a holding portion 43 provided on the lower mold 3A, and at least one of the holding portion 23 and the holding portion 43 moves in the mold clamping direction. The holding portion 23 is an example of a first holding portion, and the holding portion 43 is an example of a second holding portion. This allows the resin sealing mold 1A to more appropriately support the molded products 60, 70.

[0093] Furthermore, the molded product 60 includes a plurality of members 64, 65, which are supported at different positions in the mold clamping direction by different support pins from the plurality of support pins 21, 22. The molded product 70 includes a plurality of members 73, 74, which are supported at different positions in the mold clamping direction by different support pins from the plurality of support pins 21, 22. The molded product 70 includes a plurality of members 74, 76, which are supported at different positions in the mold clamping direction by different support pins from the plurality of support pins 41, 42. This allows the resin sealing molds 1, 1A to properly support the molded products 60, 70 even if there is variation in the heights (positions in the Z-axis direction) of the plurality of members 64, 65, 73, 74 in the molded products 60, 70.

[0094] Further advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. [Explanation of symbols]

[0095] 1,1A resin sealing mold 2,2A upper mold 3,3A lower mold 21, 22, 41, 42 Support pins 23,43 Holding part 2313,2314,4313,4314 Elastic member 26,27 Locking pin 50,50A cavity 68,78 Resin 60,70 Molded product 61~67,71~76 Parts 80,81 Molded products 100 Resin sealing equipment 111 Convex part

Claims

1. a plurality of support pins for supporting the molded product from the same direction within a cavity, which is a space formed by clamping the first mold and the second mold; a holding portion that holds the plurality of support pins, the plurality of support pins include a first support pin and a second support pin, the holding portion holds the plurality of support pins movably in a mold clamping direction in which the first mold and the second mold are clamped together, In the resin sealing step of the molded product, after the first support pin abuts against the molded product, the second support pin abuts against the molded product, a plurality of the holding portions for holding the plurality of support pins; the plurality of holding portions include a first holding portion provided in the first mold and a second holding portion provided in the second mold; At least one of the first holding portion and the second holding portion moves in the mold clamping direction. A resin sealing mold characterized by:

2. a plurality of support pins for supporting the molded article in a cavity, which is a space formed by clamping the first mold and the second mold; a holding portion that holds the plurality of support pins, the holding portion holds a first support pin among the plurality of support pins so as to be movable in a mold clamping direction in which the first mold and the second mold are clamped together, In the resin sealing step of the molded product, after the first support pin abuts against the molded product, a second support pin other than the first support pin among the plurality of support pins abuts against the molded product, a wall surface forming the cavity includes a convex portion that abuts against a second surface that is the reverse side of a first surface that abuts against one of the first support pin and the second support pin of the workpiece, The one of the first support pin and the second support pin and the convex portion face each other across the molded product in the mold clamping direction. A resin sealing mold characterized by:

3. a plurality of support pins for supporting the molded article in a cavity, which is a space formed by clamping the first mold and the second mold; a holding portion that holds the plurality of support pins, the holding portion holds a first support pin among the plurality of support pins so as to be movable in a mold clamping direction in which the first mold and the second mold are clamped together, In the resin sealing step of the molded product, after the first support pin abuts against the molded product, a second support pin other than the first support pin among the plurality of support pins abuts against the molded product, a locking pin that locks the first support pin to the holding portion before the first support pin separates from the workpiece; A resin sealing mold characterized by:

4. a plurality of support pins for supporting the molded article in a cavity, which is a space formed by clamping the first mold and the second mold; a holding portion that holds the plurality of support pins, the holding portion holds a first support pin among the plurality of support pins so as to be movable in a mold clamping direction in which the first mold and the second mold are clamped together, In the resin sealing step of the molded product, after the first support pin abuts against the molded product, a second support pin other than the first support pin among the plurality of support pins abuts against the molded product, The workpiece includes a plurality of members, the plurality of members are supported at different positions in the mold clamping direction by different support pins among the plurality of support pins, a plurality of the holding portions for holding the plurality of support pins; the plurality of holding portions include a first holding portion provided in the first mold and a second holding portion provided in the second mold; At least one of the first holding portion and the second holding portion moves in the mold clamping direction. A resin sealing mold characterized by:

5. The holding portion holds the first support pin via an elastic member.

5. The resin-sealing mold according to claim 1, wherein the resin-sealing mold is a mold for molding a resin.

6. a plurality of the holding portions for holding the plurality of support pins; the plurality of holding portions include a first holding portion provided in the first mold and a second holding portion provided in the second mold; At least one of the first holding portion and the second holding portion moves in the mold clamping direction.

4. The resin-sealing mold according to claim 2 or 3.

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