resin composition

Abstract

To provide a resin composition which enables manufacture of a resin molding that exhibits sufficient heat resistance and is excellent in hardness stability even under high temperature environment.SOLUTION: A resin composition contains (A) a crosslinkable silyl group-containing vinyl-based polymer, (B) diazabicycloundecene, diazabicyclononene and / or their salts, and (C) water.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition. [Background technology]

[0002] Resin molded products have traditionally been used as parts for electronic products and automobiles. These parts are sometimes used in high-temperature environments due to heat generation from the product itself or weather, so the resin molded products must be heat-resistant.

[0003] As a resin composition for producing a resin molded product having the above-mentioned heat resistance, a highly heat-resistant gel composition has been proposed which contains (A) a crosslinkable silyl group-containing organic polymer containing 50% by mass or more and 100% by mass or less of a crosslinkable silyl group-containing vinyl polymer, and (B) a curing catalyst, and which exhibits a specific consistency (see Patent Document 1).

[0004] The gelling composition described in Patent Document 1 is also an excellent gelling composition, but a tin-based curing catalyst is used as the catalyst for the crosslinkable silyl group-containing vinyl polymer catalyst, and since it is used in a high-temperature environment, there is room for further study on a composition for producing a resin molded product that exhibits better heat resistance.

[0005] Furthermore, resin molded products used in electronic products, automobiles, and the like, which require the above-mentioned heat resistance, are required to have stable hardness even in high temperature environments, that is, hardness stability.

[0006] Therefore, there is a need for the development of a resin composition that exhibits sufficient heat resistance and allows the production of resin molded articles that have excellent hardness stability even in high-temperature environments. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Patent No. 2006-188632 Summary of the Invention [Problem to be solved by the invention]

[0008] An object of the present invention is to provide a resin composition that exhibits sufficient heat resistance and allows the production of resin molded articles that have excellent hardness stability even in high-temperature environments. [Means for solving the problem]

[0009] As a result of extensive research, the present inventors have found that the above-mentioned object can be achieved by a resin composition comprising (A) a crosslinkable silyl group-containing vinyl polymer, (B) diazabicycloundecene and / or a salt thereof, and (C) water, and have thus completed the present invention.

[0010] That is, the present invention relates to the following resin composition. 1. A resin composition comprising (A) a crosslinkable silyl group-containing vinyl polymer, (B) diazabicycloundecene, diazabicyclononene, and / or a salt thereof, and (C) water. 2. The resin composition according to Item 1, wherein the (A) crosslinkable silyl group-containing vinyl polymer is a crosslinkable silyl group-containing (meth)acrylic polymer. 3. The resin composition according to item 1 or 2, wherein the content of the (A) crosslinkable silyl group-containing vinyl polymer is 35 to 99.5% by mass, with the resin composition being 100% by mass. 4. The resin composition according to any one of items 1 to 3, wherein the (B) diazabicycloundecene, diazabicyclononene, and / or a salt thereof contains an ethyl hexane salt of diazabicycloundecene and / or diazabicyclononene. 5. The resin composition according to any one of items 1 to 4, wherein the content of (B) diazabicycloundecene, diazabicyclononene, and / or a salt thereof is 0.01 to 0.5% by mass, with the resin composition being 100% by mass. 6. The resin composition according to any one of items 1 to 5, wherein the content of the (C) water is 0.05 to 5% by mass, with the resin composition being 100% by mass. 7. The resin composition according to any one of items 1 to 6, further comprising (D) a plasticizer, wherein the (D) plasticizer is at least one selected from the group consisting of trimellitic acid esters, phthalic acid esters, and adipic acid esters. 8. The resin composition according to item 7, wherein the content of the (D) plasticizer is 60% by mass or less, based on 100% by mass of the resin composition. [Effects of the Invention]

[0011] The resin composition of the present invention exhibits sufficient heat resistance and can be used to produce resin molded articles that have excellent hardness stability even in high-temperature environments. DETAILED DESCRIPTION OF THE INVENTION

[0012] 1.Resin composition The resin composition of the present invention is a resin composition containing (A) a crosslinkable silyl group-containing vinyl polymer, (B) diazabicycloundecene, diazabicyclononene, and / or a salt thereof, and (C) water (hereinafter, these are also referred to as "component (A)," "component (B)," and "component (C)," respectively). The resin composition of the present invention, having the above characteristics, can be used in combination with component (A) and a specific catalyst, component (B), to produce a resin molded article exhibiting sufficient heat resistance, suitable for applications requiring high heat resistance. Furthermore, by mixing components (A) and (B) in the presence of component (C), the resin composition of the present invention suppresses changes in hardness of the resin composition, allowing for the production of a resin molded article with excellent hardness stability even in high-temperature environments. That is, the resin composition of the present invention, which contains components (A) to (C), exhibits sufficient heat resistance and allows the production of a resin molded article with excellent hardness stability even in high-temperature environments. Furthermore, resin molded articles produced using the resin composition can also exhibit excellent moisture resistance.

[0013] Each component contained in the resin composition of the present invention will be described below.

[0014] ((A) Crosslinkable Silyl Group-Containing Vinyl Polymer) The component (A) is not particularly limited as long as it is a vinyl polymer containing a silyl group that crosslinks by forming a siloxane bond within the molecule. Specific examples of such crosslinkable silyl group-containing vinyl polymers include vinyl polymers, vinyl-modified polyoxyalkylene polymers, polyoxyalkylene polymers, polyester polymers, acrylic ester polymers, methacrylic ester polymers, copolymers thereof, and mixtures thereof, each of which contains a crosslinkable silyl group within the molecule and whose main chain may contain an organosiloxane. The component (A) is preferably a crosslinkable silyl group-containing (meth)acrylic polymer.

[0015] The component (A) preferably contains 1 to 6 of the crosslinkable silyl groups in the molecule. The location of the crosslinkable silyl group in the component (A) molecule is not particularly limited, and the group may be located at the end of the organic polymer molecular chain, inside the organic polymer molecular chain, or both, but is preferably located at the end of the molecular chain.

[0016] When component (A) contains a plurality of crosslinkable silyl groups, these may be the same or different, and two or more organic polymers containing different crosslinkable silyl groups may be used.

[0017] The vinyl monomer constituting the main chain of the (A) crosslinkable silyl group-containing vinyl polymer is not particularly limited, and examples thereof include (meth)acrylic acid, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, cyclohexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, phenyl (meth)acrylate, tolyl (meth)acrylate, benzyl (meth)acrylate, 2-methoxyethyl (meth)acrylate ...methyl (meth)acrylate, ethyl (meth)acrylate, methyl (meth)acrylate, ethyl (meth)acrylate, methyl (meth)acrylate, ethyl (meth)acrylate, methyl (meth)acrylate, ethyl (meth)acrylate, ethyl (meth)acrylate, ethyl (meth)acrylate, ethyl (meth)acrylate, ethyl (meth)acrylate, ethyl (meth)acrylate, ethyl (meth)acrylate, ethyl (meth)acrylate, ethyl (meth)acrylate, ethyl (meth)acrylate, ethyl (meth) 3-Methoxybutyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, stearyl (meth)acrylate, glycidyl (meth)acrylate, 2-aminoethyl (meth)acrylate, γ-(methacryloyloxypropyl)trimethoxysilane, ethylene oxide adduct of (meth)acrylic acid, trifluoromethylmethyl (meth)acrylate, 2-trifluoromethylethyl (meth)acrylate, perfluoroethylmethyl (meth)acrylate, 2-perfluoroethylethyl (meth)acrylate, perfluoroethylperfluorobutylmethyl (meth)acrylate, 2-perfluoroethyl-2-perfluorobutylethyl (meth)acrylate, perfluoroethyl (meth)acrylate, perfluoromethyl (meth)acrylate, diperfluoromethylmethyl (meth)acrylate, 2,(Meth)acrylic monomers such as 2-diperfluoromethylethyl, perfluoromethylperfluoroethylmethyl (meth)acrylate, 2-perfluoromethyl-2-perfluoroethylethyl (meth)acrylate, 2-perfluorohexylmethyl (meth)acrylate, 2-perfluorohexylethyl (meth)acrylate, 2-perfluorodecylmethyl (meth)acrylate, 2-perfluorodecylethyl (meth)acrylate, 2-perfluorohexadecylmethyl (meth)acrylate, and 2-perfluorohexadecylethyl (meth)acrylate; aromatic vinyl monomers such as styrene, vinyltoluene, α-methylstyrene, chlorostyrene, and styrenesulfonic acid and its salts; fluorine-containing vinyl monomers such as perfluoroethylene, perfluoropropylene, and vinylidene fluoride; silicon-containing vinyl monomers such as vinyltrimethoxysilane and vinyltriethoxysilane; Examples of suitable monomers include acrylic monomers; maleic anhydride, maleic acid, monoalkyl and dialkyl esters of maleic acid; fumaric acid, monoalkyl and dialkyl esters of fumaric acid; maleimide monomers such as maleimide, methylmaleimide, ethylmaleimide, propylmaleimide, butylmaleimide, hexylmaleimide, octylmaleimide, dodecylmaleimide, stearylmaleimide, phenylmaleimide, and cyclohexylmaleimide; acrylonitrile monomers such as acrylonitrile and methacrylonitrile; amide group-containing vinyl monomers such as acrylamide and methacrylamide; vinyl esters such as vinyl acetate, vinyl propionate, vinyl pivalate, vinyl benzoate, and vinyl cinnamate; alkenes such as ethylene and propylene; conjugated dienes such as butadiene and isoprene; vinyl chloride, vinylidene chloride, allyl chloride, and allyl alcohol. Among these, (meth)acrylic monomers are preferred.

[0018] The component (A) can be used either individually or in combination of two or more.

[0019] The content of component (A) in the resin composition is preferably 35 to 99.6% by mass, and more preferably 40 to 99.0% by mass, based on 100% by mass of the resin composition. When the lower limit of the content of component (A) is within the above range, the heat resistance of a resin molded product produced using the resin composition is further improved. When the upper limit of the content of component (A) is within the above range, when the resin composition of the present invention is made into a two-component resin composition, an increase in the viscosity of each of the first and second components can be suppressed, thereby further improving workability.

[0020] As the component (A), commercially available products can be used, such as XMAP SA120S, manufactured by Kaneka Corporation.

[0021] ((B) Diazabicycloundecene, diazabicyclononene, and / or salts thereof) Component (B) is diazabicycloundecene, diazabicyclononene, and / or a salt thereof. That is, component (B) is at least one selected from the group consisting of diazabicycloundecene, diazabicyclononene, and a salt thereof.

[0022] There are no particular restrictions on the component (B), and known diazabicycloundecene, diazabicyclononene, and / or salts thereof can be used.

[0023] The diazabicycloundecene is not particularly limited, and 1,8-diazabicyclo[5,4,0]undec-7-ene, etc. can be used. Among these, 1,8-diazabicyclo[5,4,0]undec-7-ene is preferred from the viewpoints of suppressing an increase in the viscosity of each of the first and second components and further improving workability when the resin composition of the present invention is made into a two-component resin composition.

[0024] The diazabicyclononene is not particularly limited, and 1,5-diazabicyclo[4,3,0]-5-nonene, etc. can be used. Among these, 1,5-diazabicyclo[4,3,0]-5-nonene is preferred from the viewpoints of being able to suppress an increase in viscosity of each of the first and second components and further improving workability when the resin composition of the present invention is made into a two-component resin composition.

[0025] Examples of the salt with diazabicycloundecene or diazabicyclononene include organic compound salts. Examples of organic compounds for forming the organic compound salts include organic acids and tetraorganoborate compounds. Specific examples include carboxylic acids such as 2-ethylhexanoic acid (octylic acid), formic acid, and orthophthalic acid; phenol; p-toluenesulfonic acid; phenolic resins such as phenol novolac resin; and tetraphenylborate. Among these, 2-ethylhexanoic acid and phenolic resins are preferred because they are liquid at room temperature (23°C) and easy to handle, exhibit excellent pot life and curing acceleration effects, and further improve the heat resistance of the resulting resin molded product.

[0026] The component (B) can be used either individually or in combination of two or more.

[0027] The content of component (B) in the resin composition is preferably 0.01 to 0.5% by mass, and more preferably 0.10 to 0.3% by mass, based on 100% by mass of the resin composition. By ensuring that the lower limit of the content of component (B) is within the above range, the hardness and heat resistance of a resin molded product produced using the resin composition are further improved. By ensuring that the upper limit of the content of component (B) is within the above range, the heat resistance and storage stability of component (B) in a resin molded product produced using the resin composition are further improved.

[0028] As the component (B), commercially available products can be used, such as U-CAT SA102 and U-CAT 1102, both manufactured by San-Apro Co., Ltd.

[0029] ((C)Water) The resin composition of the present invention contains (C) water as an essential component. By containing water in the resin composition of the present invention, the hardness of a resin molded article produced using the resin composition can be stabilized, and a good resin molded article can be produced.

[0030] The water is not particularly limited, and tap water, industrial water, groundwater, ion-exchanged water, ultrapure water, distilled water, ultrafiltered water, etc. can be used, with tap water, ion-exchanged water, and distilled water being preferred.

[0031] The content of component (C) in the resin composition is preferably 0.05 to 5% by mass, and more preferably 0.50 to 3% by mass, based on 100% by mass of the resin composition. By ensuring that the lower limit of the content of component (B) is within the above range, changes in hardness of a resin molded product produced using the resin composition are further suppressed, and the hardness stability of the resin molded product is further improved even in high-temperature environments. Furthermore, by ensuring that the upper limit of the content of component (C) is within the above range, the reactivity of the resin composition is further improved, allowing for the production of a good resin composition.

[0032] ((D) Plasticizer) The resin composition of the present invention may further contain (D) a plasticizer (hereinafter also referred to as "component (D)").

[0033] The component (D) is not particularly limited, and a known plasticizer can be used. Examples of such plasticizers include trimellitic esters, phthalic esters, adipic esters, pyromellitic esters, and castor oil ester-based plasticizers. Among these, trimellitic esters are preferred from the viewpoint of further improving the heat resistance of resin molded products produced using the resin composition.

[0034] The component (D) can be used either individually or in combination of two or more.

[0035] The content of component (D) in the resin composition is preferably 60% by mass or less, and more preferably 40% by mass or less, based on 100% by mass of the resin composition. By limiting the content of component (D) within the above range, the reactivity of the resin composition is further improved, and the bleed-out resistance of a resin molded product produced using the resin composition is further improved. The lower limit of the content of component (D) is not particularly limited, and can be 5% by mass or more, 10% by mass or more, for example.

[0036] (Other ingredients) The resin composition of the present invention may contain other components in addition to the above components (A) to (C) and the optional component (D), such as a silane coupling agent, an antioxidant, an inorganic filler, an antifoaming agent, an ultraviolet absorber, a curing catalyst, etc.

[0037] The silane coupling agent is not particularly limited, and any silane coupling agent that is used in combination with a crosslinkable silyl group-containing vinyl polymer in a resin composition can be used. Examples of such silane coupling agents include silane coupling agents having a methacryl group as an organic functional group, and silane coupling agents having an ethylenediamine structure as an organic functional group.

[0038] The silane coupling agent is preferably a silane coupling agent having no active hydrogen group. By using such a silane coupling agent, the storage stability of the resin composition of the present invention is further improved.

[0039] The content of the silane coupling agent in the resin composition is not particularly limited, and is preferably 0.05 to 2% by mass, and more preferably 0.1 to 1% by mass, based on 100% by mass of the resin composition.

[0040] The antioxidant is not particularly limited, and any antioxidant used in a resin composition can be used. Examples of such antioxidants include amine-based antioxidants, phenol-based antioxidants, sulfur-based antioxidants, and phosphorus-based antioxidants. Among these, amine-based antioxidants are preferably used from the viewpoint of further improving the heat resistance of the resin composition.

[0041] The content of the antioxidant in the resin composition is not particularly limited, and is preferably 0.05 to 5 mass%, more preferably 0.1 to 2 mass%, and even more preferably 0.2 to 1 mass%, based on 100 mass% of the resin composition. By setting the content of the antioxidant within the above range, the long-term stability and initial hardness of the resin molded product obtained by curing the resin composition become more stable.

[0042] The inorganic filler is not particularly limited, and any inorganic filler used in a resin composition can be used. Examples of such inorganic fillers include aluminum oxide, aluminum hydroxide, calcium carbonate, carbon black, clay, talc, mica, kaolin, bentonite, silica, titania, etc. Aluminum oxide and aluminum hydroxide are preferred from the viewpoint of improving the heat dissipation properties of a resin molded product obtained by curing the resin composition.

[0043] The content of the inorganic filler in the resin composition is not particularly limited, and is preferably 40 to 95% by mass, and more preferably 50 to 85% by mass, with the resin composition being 100% by mass.

[0044] (Resin composition) The resin composition of the present invention may be either a one-component type or a two-component type, but the resin composition of the present invention containing components (A), (B), and (C) is usually a two-component type resin composition. In the production method described below, a two-component type resin composition will be described.

[0045] 2. Manufacturing method of resin composition The method for producing the resin composition of the present invention is not particularly limited, and it can be produced by any conventionally known method used for producing a resin composition containing a crosslinkable silyl group-containing vinyl polymer.

[0046] As described above, the resin composition of the present invention is usually a two-component resin composition. Examples of a method for producing such a resin composition of the present invention include a method in which a component containing (A) and (C) is prepared as a first component, a component containing (A) and (B) is prepared as a second component, and the first and second components are mixed and reacted to produce the resin composition.

[0047] Specific examples of the first and second components include a first component containing components (A) and (C), and a second component containing components (A) and (B). Alternatively, the first component may contain components (A) and (C), and optionally contain component (D) and an antioxidant, and the second component may contain components (A) and (B), and optionally contain component (D), an antioxidant, and a coupling agent.

[0048] The method for preparing the first component and the second component is not particularly limited, and for example, they can be prepared by a preparation method including step 1 of mixing and stirring the components that respectively constitute the first component and the second component in a kneader.

[0049] In the above step 1, the temperature for mixing and stirring is preferably 60° C. or higher and 120° C. or lower, and the stirring time may be about 30 minutes to 3 hours.

[0050] The first component and the second component are prepared by the above-described step 1.

[0051] The resin composition of the present invention is produced in step 2 by mixing the first and second components prepared in step 1. The mixing temperature is not particularly limited and is preferably 23° C. or higher and 60° C. or lower. The mixing time is not particularly limited and may be set appropriately depending on the pot life of the resin composition.

[0052] The resin composition of the present invention is produced by the step 2 described above.

[0053] (Resin molded product) The resin composition of the present invention can be cured to obtain a resin molded product. The resin composition can be cured by, for example, mixing the first and second components to produce a resin composition, followed by curing over time. Alternatively, the resin composition can be cured by heating. In this case, the heating temperature is preferably about 60 to 100°C, and the heating time is preferably about 1 to 24 hours.

[0054] The hardness change rate of the resin molded article after 20 days at 170°C is preferably 50% or less, more preferably 35% or less. When the upper limit of the hardness change rate is within the above range, the stability of parts used in electronic products and automobiles is further improved.

[0055] The hardness change rate of the resin molded article after 20 days at 170° C. was measured by the method described in the Examples below.

[0056] The resin molded articles produced by curing the resin composition of the present invention exhibit sufficient heat resistance and excellent hardness stability even in high-temperature environments, and are therefore suitable for use as parts for electronic products and automobiles. The resin molded articles produced by curing the resin composition of the present invention can also be used as sealants for electronic products. [Example]

[0057] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples.

[0058] The raw materials used in the examples and comparative examples are shown in Table 1 below.

[0059] [Table 1]

[0060] Examples and Comparative Examples The above-mentioned raw materials were charged into a stirring kneader in the amounts of the first and second components shown in Table 2, and kneaded at 60°C for 30 minutes to prepare the first and second components. The prepared first and second components were stirred and mixed in a mixing tank to produce a resin composition.

[0061] (Evaluation method) For the examples and comparative examples, test pieces were prepared by the following methods and evaluated as follows.

[0062] Preparation of test piece 1 The prepared resin composition was poured into a molding die with an inner diameter of 30 mm and a height of 10 mm. The resin composition was then heated at 60°C for 16 hours and then left at room temperature for one day to harden, yielding a test piece (inner diameter 30 mm, height 10 mm). The hardness, hardness change rate at 170°C, and bleeding properties were evaluated.

[0063] Preparation of test piece 2 200 g of the second component was poured into a 225 cc mayonnaise bottle to prepare a test piece 2.

[0064] hardness Using test piece 1 (inner diameter 30 mm, height 10 mm), hardness (Type C) was measured with a hardness tester (Asker Rubber Hardness Tester Type C, manufactured by Kobunshi Keiki Co., Ltd.) at a temperature of 23° C. according to the measurement method in accordance with JIS K 7312. The hardness measured was defined as the initial hardness.

[0065] Hardness change rate Test piece 1 (inner diameter 30 mm, height 10 mm) was left at 170°C for 20 days, and then the hardness was measured in the same manner as the hardness measurement method described above. The hardness was taken as the hardness after the heat resistance test, and the hardness change rate was calculated according to the following formula and evaluated according to the following evaluation criteria. (Formula) Hardness change rate (%) = [(Hardness after heat resistance test - Initial hardness) / Initial hardness] x 100 ◎: Hardness change rate less than 20% ○: Hardness change rate is 20% or more but less than 35% △: Hardness change rate 35% to 50% ×: Hardness change rate exceeds 50%

[0066] Bleeding Test piece 1 (inner diameter 30 mm, height 10 mm) was left at 170°C for 7 days and then returned to room temperature (23°C), and the presence or absence of bleeding was visually observed and evaluated according to the following evaluation criteria. 〇: No bleeding △: Slight bleeding ×: Bleeding

[0067] Viscosity of the second component The second component was prepared and used as a sample. The sample temperature was adjusted to 23±0.5°C, and the viscosity was measured after 60 seconds of rotation using a BH-type viscometer with a specified rotor and rotation speed, and evaluated according to the following evaluation criteria. The viscosity was also used as the initial viscosity of the second component. ○: Viscosity is 30,000 mPa·s or less △: Viscosity exceeds 30,000 mPa·s

[0068] Thickening rate of the second component A second component was prepared and used as a sample. The sample temperature was adjusted to 40°C, and after leaving it for 30 days, it was returned to room temperature (23°C), and the viscosity was measured using the same method as the viscosity measurement method for the second component described above. The measured value was taken as the viscosity after the test, and the viscosity increase rate of the second component was calculated according to the following formula, and evaluated according to the following evaluation criteria. (Formula) Viscosity increase rate of second component (%) = [(viscosity after test - initial viscosity) / initial viscosity] x 100 ◎: Viscosity increase rate is less than 80% 〇: Viscosity increase rate is 80-110% ×: Viscosity increase rate exceeds 110%

[0069] The results are shown in Tables 2 to 4. In each table, the numerical values ​​for the compositions indicate parts by mass.

[0070] [Table 2]

[0071] Table 3

[0072] Table 4

Claims

1. A resin composition comprising (A) a crosslinkable silyl group-containing vinyl polymer, (B) diazabicycloundecene, diazabicyclononene, and / or a salt thereof, and (C) water, The resin composition characterized in that the content of the water (C) is 0.05 to 5% by mass, with the resin composition being 100% by mass.

2. The resin composition according to claim 1, wherein the crosslinkable silyl group-containing vinyl polymer (A) is a crosslinkable silyl group-containing (meth)acrylic polymer.

3. 2. The resin composition according to claim 1, wherein the content of the crosslinkable silyl group-containing vinyl polymer (A) is 35 to 99.6% by mass, with the resin composition being 100% by mass.

4. The resin composition according to claim 1, wherein (B) diazabicycloundecene, diazabicyclononene, and / or a salt thereof comprises an ethyl hexanoate of diazabicycloundecene and / or diazabicyclononene.

5. The resin composition according to claim 1, wherein the content of (B) diazabicycloundecene, diazabicyclononene, and / or salts thereof is 0.01 to 0.5 mass% based on 100 mass% of the resin composition.

6. 2. The resin composition according to claim 1, further comprising a plasticizer (D), wherein the plasticizer (D) is at least one selected from the group consisting of trimellitic acid esters, phthalic acid esters, and adipic acid esters.

7. The resin composition according to claim 6, wherein the content of the plasticizer (D) is 60% by mass or less, based on 100% by mass of the resin composition.

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