Thermoelectric Module

Abstract

The present invention comprises a support substrate, thermoelectric elements, and wiring conductors. The support substrate has a first substrate and a second substrate which are located facing each other. The wiring conductors are respectively located on the first substrate and the second substrate. The thermoelectric elements are located respectively in contact with the facing wiring conductors. The first substrate has a first region in which the thermoelectric element is located. The first substrate has a second region located continuous to the first region. The wiring conductors each have an extension section over the second region. A connector is further provided, and the support substrate-facing surface of the connector is in surface contact with the extension section.

Description

[Technical Field]

[0001] The present disclosure relates to a thermoelectric module used for temperature control, for example, in automobile seat coolers or in temperature control of fuel cells, lithium ion batteries, and the like. [Background technology]

[0002] Known examples of thermoelectric modules include a thermoelectric power generation module described in Patent Document 1. The thermoelectric power generation module described in Patent Document 1 includes a pair of substrates arranged opposite each other, electrodes located on the opposing surfaces of the pair of substrates, a plurality of thermoelectric elements arranged between the opposing surfaces of the pair of substrates so as to be electrically connected by the electrodes, and lead wires for electrical connection to the thermistor, with the electrodes and lead wires being connected via a conductive bonding material. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2021-113636 Summary of the Invention

[0004] of the present disclosure Thermoelectric Module The device comprises a support substrate, a thermoelectric element, and a wiring conductor. The support substrate has a first substrate and a second substrate positioned opposite each other. The wiring conductors are positioned on the first substrate and the second substrate, respectively. The thermoelectric element is positioned in contact with each of the opposing wiring conductors. The first substrate has a first region in which the thermoelectric element is positioned. The first substrate has a second region positioned adjacent to the first region. The wiring conductor has an extension portion that extends over the second region. The device further comprises a connector, and the surface of the connector facing the support substrate is surface-connected to the extension portion. [Brief explanation of the drawings]

[0005] [Figure 1] FIG. 1 is a perspective view showing an example of a thermoelectric module. [Figure 2] FIG. 2 is a side view of the thermoelectric module shown in FIG. [Figure 3] FIG. 3 is a side view showing another example of a thermoelectric module. [Figure 4] FIG. 4 is a side view showing another example of a thermoelectric module. [Figure 5] FIG. 5 is an enlarged plan view of the thermoelectric module shown in FIG. [Figure 6] FIG. 6 is a bottom view and a cross-sectional view showing another example of a thermoelectric module. [Figure 7] FIG. 7 is a perspective view showing another example of a thermoelectric module. [Figure 8] FIG. 8 is a side view of another example of a thermoelectric module as seen from the lead member side. [Figure 9] FIG. 9 is a plan view showing another example of a thermoelectric module. [Figure 10] FIG. 10 is a perspective view showing another example of a thermoelectric module. [Figure 11] FIG. 11 is a side view showing another example of a thermoelectric module. [Figure 12] FIG. 12 is a side view showing another example of a thermoelectric module. DETAILED DESCRIPTION OF THE INVENTION

[0006] The thermoelectric module 100 will now be described in detail.

[0007] FIG. 1 is a perspective view showing an example of a thermoelectric module 100, and FIG. 2 is a side view of the thermoelectric module 100 shown in FIG. 1. As shown in FIG. 1, the thermoelectric module 100 includes a support substrate 1, a thermoelectric element 2, a wiring conductor 3, a connector 4, and a lead member 5. Specifically, the support substrate 1 has a first substrate 11 and a second substrate 12 that face each other, and a wiring conductor 3 is located on each of the facing surfaces of the first substrate 11 and the second substrate 12. In addition, the thermoelectric element 2 includes a wiring conductor 3. 3 The conductors are positioned in contact with each other so as to be electrically connected to each other.

[0008] 2, the first substrate 11 and the second substrate 12 have a first region 111 where the thermoelectric elements 2 are located, and the first substrate 11 has a second region 112 located next to the first region 111. Furthermore, the wiring conductor 3 has an extension portion 31 that extends over the second region 112. The connector 4 is further provided, and the surface of the connector 4 facing the support substrate 1 is surface-connected to the extension portion 31.

[0009] Next, we will explain the functions and features of the components that make up the thermoelectric module 100. In explaining the components, as shown in Figures 1 and 2, the direction from the first region 111 toward the second region 112 is defined as a first direction (X), and the direction perpendicular to the first direction is defined as a second direction (Y).

[0010] Support substrate 1 is a member for cooling or heating external devices, etc., through conduction between thermoelectric elements 2 and wiring conductors 3. In Figures 1 and 2, the substrate located at the bottom is first substrate 11, and the substrate located at the top is second substrate 12. For ease of understanding, all figures include a virtual line (two-dot chain line) at the boundary A between first region 111 and second region 112.

[0011] The first substrate 11 and the second substrate 12 are, for example, rectangular in shape. The first substrate 11 and the second substrate 12 are made of, for example, an insulating substrate body made of an epoxy resin material with added alumina filler or a ceramic material such as alumina or aluminum nitride, with a metal plate made of copper or the like attached to the outer main surface. Alternatively, the first substrate 11 and the second substrate 12 may be made of a conductive material such as silver or copper, with an insulating material provided on the inner main surface.

[0012] The support substrate 1 can cause the first substrate 11 to absorb heat (cool) and the second substrate 12 to generate heat (heat) due to the Peltier effect, or can cause the first substrate 11 to generate heat (heat) and the second substrate 12 to absorb heat (cool).

[0013] A plurality of thermoelectric elements 2 are arranged so as to be electrically connected by wiring conductors 3. The plurality of thermoelectric elements 2 are p-type thermoelectric elements and n-type thermoelectric elements. The thermoelectric elements 2 are arranged in rows and columns at intervals of, for example, 0.1 to 2 times the diameter of the thermoelectric elements 2, and are joined to the wiring conductors 3 with solder. The thermoelectric elements 2 are arranged so that p-type thermoelectric elements and n-type thermoelectric elements are adjacent to each other and alternately arranged. The shape of the thermoelectric elements 2 is, for example, cylindrical. Other shapes include a prismatic shape.

[0014] The wiring conductors 3 are located in contact with the opposing portions of the first substrate 11 and the second substrate 12. The shape of the wiring conductors 3 can be adjusted appropriately depending on the arrangement of the thermoelectric elements 2. The material of the wiring conductors 3 is not limited to copper, and may be, for example, silver, silver-palladium, or the like.

[0015] The connector 4 can prevent the warping of the support substrate 1 while maintaining electrical continuity with the wiring conductor 3. The connector 4 has, for example, a rectangular shape. As shown in FIG. 2, the surface of the connector 4 facing the support substrate 1 is surface-connected to the extension portion 31 of the wiring conductor 3. The connector 4 is made of a resin material such as PBT (polybutylene terephthalate), PC (polycarbonate), PPS (polyphenylene sulfite), LCP (liquid crystal polymer), nylon, PEEK (polyether ether ketone), or PA (polyamide).

[0016] The lead member 5 is electrically connected to an external power source via the connector 4. The lead member 5 is made of a metal material such as copper, iron, or aluminum. The lead member 5 has a cylindrical rod shape in FIG. 1, but various other shapes such as a plate shape can be adopted from a design perspective. The lead member 5 is joined by solder.

[0017] As another example, in order to improve insulation, the conductor wires are covered with a resin material and formed into a band shape.

[0018] The thermoelectric module 100 of this embodiment includes a connector 4, as shown in FIGS.

[0019] When a current flows through the thermoelectric module 100, stress is applied to the connection between the wiring conductor 3 and the connector 4. However, in the thermoelectric module 100 of the present disclosure, this stress is small because the connector 4 is surface-connected. As a result, cracks rarely occur in the connection. As a result, the thermoelectric module 100 of the present disclosure has excellent durability.

[0020] 3, the connector 4 may be fixed to the support substrate 1 via a fixing member 6. This allows the parallelism of the connector 4 to be maintained better than when the connector 4 is fixed without the fixing member 6. Furthermore, the use of the fixing member 6 reduces the risk of the connector 4 peeling off during repeated use. As a result, the thermoelectric module 100 of the present disclosure has excellent durability.

[0021] The fixing member 6 is located between the wiring conductor 3 and the connector 4. The fixing member 6 is made of a material consisting of epoxy resin. In FIG. 3, the fixing member 6 has a frame-like shape to match the second region 112, but various other shapes such as a plate shape can be adopted from a design perspective.

[0022] 3, a conductive bonding material 7 may be used to establish electrical continuity between the wiring conductor 3 and the connector 4. This allows the difference in height between the connector 4 and the wiring conductor 3 to be adjusted when connecting the connector 4. As a result, the thermoelectric module 100 of the present disclosure has excellent durability. Furthermore, as shown in FIG. 3, when the wiring conductor 3 and the connector 4 are joined by the conductive bonding material 7 with a fixed surface, this also means that they are "surface-connected."

[0023] 3 or 4, the fixing member 6 may have a surrounding portion 61 that surrounds the conductive bonding material 7, and the connector 4 may be placed on the surrounding portion 61. Specifically, the fixing member 6 may be positioned so as to surround at least the outer edge of the connector 4 when viewed from above. This allows the surrounding portion 61 to more stably place the connector 4. Furthermore, the surrounding portion 61 can form a fixed area onto which the conductive bonding material 7 is discharged. This allows the amount of conductive bonding material 7 to be constant, and reduces variations in the bonding strength of the thermoelectric module 100 between products. As a result, the thermoelectric module 100 of the present disclosure has excellent reliability.

[0024] 5, the width (line C) of the extension portion 31 may be smaller than the width (line B) of the wiring conductor 3 located in the first region 111. When the thermoelectric module 100 is electrically connected, the wiring conductor 3 may become heated. Therefore, when the thermoelectric module 100 is connected to the wiring conductor 3, thermal stress may occur, potentially resulting in cracks. Therefore, when the width (line C) of the extension portion 31 is smaller than the width (line B) of the wiring conductor 3 located in the first region 111, even if thermal stress occurs, the thermal stress is small, and cracks are unlikely to occur at the connection portion. As a result, the thermoelectric module 100 of the present disclosure has excellent durability. Furthermore, reducing the width increases the degree of freedom in the position of the wiring conductor 3 in the second region 112. As a result, the thermoelectric module 100 of the present disclosure has excellent reliability because it can be adjusted to fit the dimensions of the connector 4 and the support substrate 1. In the case shown in FIG. 5, the width of the wiring conductor 3 located in the first region 111 and the width of the extension portion 31 are considered to be 1 to 45 mm and 0.6 to 15 mm, respectively. For ease of understanding, the connector 4 and the lead member 5 are shown by dashed lines in FIG.

[0025] 4 and 5, the extending portion 31 is covered with resin 8 in a portion close to the first region 111 other than the portion overlapping with the connector 4 in a planar perspective view, and the resin 8 may cover the portion facing the connector 4 between the first substrate 11 and the second substrate 12. 2This reduces the risk of cracks occurring due to oxidation, resulting in excellent durability of the thermoelectric module 100 of the present disclosure.

[0026] 6, the first substrate 11 may have lattice-shaped slits 9 at a position opposite the second region 112. By having the slits 9, the second region 112 becomes more easily deformable, and the stress applied to the boundary A becomes smaller. As a result, the thermoelectric module 100 of the present disclosure has excellent durability.

[0027] The slit here means a thin cut as shown in FIG.

[0028] An example of the pattern of the slits 9 is described below. As shown in Fig. 6, two slits 9 extending in the Y direction are provided on the opposite side of the second region 112, and slits 9 extending in a lattice pattern are provided between the two slits 9. In this case, if the slits 9 are provided so as to be oriented at 45 degrees with respect to the X direction and the Y direction, the stress acting on the boundary A tends to be smaller.

[0029] Furthermore, by positioning the ends of the lattice-shaped slits 9 at two slits 9 extending in the Y direction and connecting the slits 9, it is possible to most effectively alleviate the stress generated at the boundary A. If the lattice spacing is equal, the stress acting on the boundary A tends to be smaller.

[0030] The slit 9 may be located inside the second region 112, as shown in Fig. 6. For ease of understanding, Fig. 6 also shows cross-sectional views of two portions of the first substrate 11: a portion (DD') that does not have the slit 9, and a portion (EE') that has the slit 9.

[0031] 7, the second region 112 may include a mating portion 1121 for the connector 4, and the mating portion 1121 may have side walls 10 positioned along the direction in which the extending portion extends, sandwiching a mating region 1122 into which the connector 4 is mated. As a result, the connector 4 is sandwiched between the side walls 10, which can reduce movement in a direction parallel to the second direction (Y) during use. As a result, the thermoelectric module 100 of the present disclosure has excellent durability. In FIG. 7, the mating portion 1121 is indicated by a dashed line.

[0032] The side walls 10 are made of a resin material such as epoxy, acrylic, silicone, etc. As shown in Fig. 7, the side walls 10 face each other in the second direction (Y), contact the first substrate 11 and the second substrate 12, respectively, and at least a portion of each is located from the first region 111 to the second region 112.

[0033] FIG. 8 shows another example of a side view of the thermoelectric module 100 as viewed from the lead member 5. As shown by the portion F in FIG. 8, the side wall 10 may be located in contact with the upper surface of the first substrate 11. This allows for a gap to be formed between the side wall 10 of the first substrate 11 and the outer periphery of the first substrate 11, compared to when the side wall 10 is located in contact with the side surface of the first substrate 11. This gap reduces the risk of heat transfer and influence between adjacent thermoelectric modules 100 when multiple thermoelectric modules 100 are mounted side by side. As a result, the thermoelectric module 100 of the present disclosure has excellent reliability.

[0034] Furthermore, as shown in part G in FIG. 8 , the sidewall 10 may be positioned in contact with the side surface of the second substrate 12. This allows heating and absorbing heat from the side surface as well as the top surface of the second substrate 12. This allows heating and absorbing heat from external components over a greater number of areas. As a result, the thermoelectric module 100 of the present disclosure has excellent reliability.

[0035] 8, the sidewall 10 may have rounded edges that contact the side surfaces of the second substrate 12. This allows for more stress distribution and reduces the occurrence of cracks at the edges compared to corners that are not rounded. As a result, the thermoelectric module 100 of the present disclosure maintains high durability.

[0036] 9, the sidewalls 10 may be located inside the respective ends of the first substrate 11 in the second direction (Y). Here, "inside" means that, when the thermoelectric module 100 is viewed from above, there is an exposed portion of the first substrate 11 between the edge of the first substrate 11 and the sidewalls 10. This allows the above-described gap to be made larger. This reduces the risk of adjacent thermoelectric modules 100 affecting each other due to heat transfer.

[0037] 10, the side walls 10 are arranged in a first direction of the first region 111 facing each other. (X) The second direction (Y) may also be blocked. This allows the thermoelectric elements 2 to be surrounded, making them less likely to come into contact with the outside air and reducing the risk of cracks occurring due to oxidation. As a result, the thermoelectric module 100 has excellent durability.

[0038] 11, the height of the sidewall 10 may decrease from the boundary A between the first region 111 and the second region 112 in a direction away from the first region 111. This eliminates corners compared to when the height of the sidewall 10 does not change from the boundary A between the first region 111 and the second region 112 in a direction away from the first region 111, thereby preventing cracks from occurring. As a result, the thermoelectric module 100 of the present disclosure has excellent durability. Note that in FIG. 11, two virtual lines (dotted lines) extending parallel to each other are added to the first substrate 11 to make it easier to understand that the height of the sidewall 10 decreases.

[0039] 12, the side wall 10 may have a wavy shape in a side view on the second region 112. The "wavy" here refers to a shape that appears when the thermoelectric module 100 is viewed from the side. 12 This means that the contour of the side wall 10 is wavy, as shown in the figure. This allows the contour of the side wall 10 to change in the direction away from the boundary A and away from the first region 111, compared to when the height of the side wall 10 remains constant, thereby increasing the surface area and providing high heat dissipation. This reduces deterioration of the side wall 10 due to repeated temperature changes of heating and cooling over a long period of time. As a result, the thermoelectric module 100 of the present disclosure has excellent durability. Note that in FIG. 12, two virtual lines (dotted lines) extending parallel to the first substrate 11 are added to make it easier to understand that the contour is wavy.

[0040] 12, the sidewalls 10 may be located over the side surfaces of the second region 112 of the first substrate 11. This allows the sidewalls 10 to cover a larger area on the first substrate 11 compared to when the sidewalls 10 are located only in the portion of the first substrate 11 facing the second substrate 12, making it easier to alleviate stress even if it occurs over a wider area in the support substrate 1. As a result, the thermoelectric module 100 of the present disclosure has excellent durability.

[0041] Furthermore, the sidewalls 10 may be located over the side surfaces of the first substrate 11. This allows the sidewalls 10 to cover a larger area on the first substrate 11 compared to when the sidewalls 10 are located only in the area of ​​the first substrate 11 facing the second substrate 12, making it easier to alleviate stress even if it occurs over a wider area in the support substrate 1. As a result, the thermoelectric module 100 of the present disclosure has excellent durability.

[0042] Next, the dimensions of the members that make up the thermoelectric module 100 will be described.

[0043] The range in which the first region 111 of the first substrate 11 and the second substrate 12 is located has a vertical length extending in the first direction (X) of 4 to 200 mm and a horizontal length extending in the second direction (Y) of 4 to 200 mm.

[0044] The first substrate 11 has a second region 112 following the first region 111. The range in which the second region 112 is located has a vertical length extending in the first direction (X) of 1 to 30 mm and a horizontal length extending in the second direction (Y) of 4 to 200 mm. The thickness of the first substrate 11 and the second substrate 12 is 0.1 to 5 mm.

[0045] When the thermoelectric elements 2 are formed in a cylindrical shape, the dimensions of the thermoelectric elements 2 are set to, for example, a diameter of 0.2 mm to 5 mm and a height of 0.1 mm to 10 mm.

[0046] The wiring conductors 3 are located on the first substrate 1111 and the second substrate 12, and are therefore arranged over the entire length of the support substrate 1 in the range of 4 to 200 mm, and have a thickness of 0.01 to 0.5 mm.

[0047] The connector 4 has a vertical length extending in the first direction (X) of 0.9 to 24 mm, a horizontal length extending in the second direction (Y) of 1 to 48 mm, and a thickness of 0.2 to 5 mm.

[0048] If the lead member 5 is in the shape of a circular rod, the dimensions of the lead member 5 are a diameter of 0.1 to 3 mm and a length of 20 to 500 mm.

[0049] In the case of a band shape, the dimensions are such that the vertical length extending in the first direction (X) is 6 to 300 mm, the horizontal length extending in the second direction (Y) is 2 to 50 mm, and the thickness is 0.2 to 5 mm.

[0050] The dimensions of the fixing member 6 are a vertical length extending in the first direction (X) of 1 to 30 mm and a horizontal length extending in the second direction (Y) of 1 to 34 mm. The thickness of the connector 4 is 0.2 to 5 mm. The length of the inner periphery of the surrounding portion 61 as shown in FIG. 5 is 0.8 to 36 mm.

[0051] The resin 8 has a vertical length extending in the first direction (X) of 0.3 to 8 mm and a horizontal length extending in the second direction (Y) of 4 to 200 mm. The height of the resin 8 shown in Fig. 4 is 0.1 to 7 mm.

[0052] The dimensions of the fitting portion 1121 are such that the vertical length extending in the first direction (X) is 1 to 35 mm and the horizontal length extending in the second direction (Y) is 8 to 200 mm.

[0053] The dimensions of the fitting region 1122 are such that the vertical length extending in the first direction (X) is 1 to 30 mm, and the horizontal length extending in the second direction (Y) is 1 to 35 mm.

[0054] The side wall 10 has a vertical length extending in the first direction (X) of 4 to 200 mm and a horizontal length extending in the second direction (Y) of 0.3 to 8 mm. The height of the side wall 10 shown in Fig. 7 is 0.1 to 7 mm.

[0055] Next, a method for fixing and manufacturing the connector 4 of the thermoelectric module 100 of this embodiment will be described.

[0056] Rod-shaped p-type and n-type thermoelectric materials are cut to the specified height using a wire saw to produce p-type and n-type thermoelectric elements. A nickel layer is formed on the cut surfaces of the p-type and n-type thermoelectric elements using electrolytic plating.

[0057] Next, metal plates that will become the wiring conductors 3 are attached to the opposing surfaces of the first substrate 11 and the second substrate 12, and after masking, the areas other than those that will become the wiring conductors 3 are removed by etching to form the wiring conductors 3.

[0058] Solder paste was then printed on the wiring conductor 3. Then, a mounter was used to arrange the p-type and n-type thermoelectric elements on top of the solder paste so that they were electrically connected in series. The p-type and n-type thermoelectric elements arranged as described above were sandwiched between a pair of support substrates 1, and heated in a reflow furnace while applying pressure to the top and bottom surfaces, joining the wiring conductor 3 and the thermoelectric elements 2 with solder.

[0059] A connector 4 for passing a current through the obtained thermoelectric module 100 was joined with a conductive joining material 7 made of solder.

[0060] By the above method, the thermoelectric module 100 of this embodiment is fabricated.

[0061] Next, a method for arranging the thermoelectric elements 2 will be described.

[0062] The thermoelectric elements 2 each have a main body made of a thermoelectric material of A2B3 type crystal (A is Bi and / or Sb, and B is Te and / or Se), preferably a Bi (bismuth) and Te (tellurium) based thermoelectric material. Specifically, the p-type thermoelectric element is made of a thermoelectric material made of a solid solution of Bi2Te3 (bismuth telluride) and Sb2Te3 (antimony telluride). The n-type thermoelectric element is made of a thermoelectric material made of a solid solution of Bi2Te3 (bismuth telluride) and Bi2Se3 (bismuth selenide).

[0063] The thermoelectric material for p-type thermoelectric elements is a p-type thermoelectric material made primarily of Bi, Sb, and Te that has been melted and solidified, then solidified in one direction by the Bridgman method to form a rod-shaped body with a circular cross section. Similarly to the p-type thermoelectric elements, the thermoelectric material for n-type thermoelectric elements is an n-type thermoelectric material made primarily of Bi, Te, and Se that has been melted and solidified in one direction by the Bridgman method to form a rod-shaped body with a circular cross section.

[0064] The method for forming the slits 9 will now be described. Any method may be used, such as dicing with a diamond grindstone, chemical etching, or dry etching such as sputtering. For example, the slits 9 can be formed by etching a copper-clad substrate, but in this case, it is desirable that the slits 9 are also formed in the substrate portion that serves as the base material for the copper-clad substrate. [Explanation of symbols]

[0065] 1: Support substrate 11: First board 111:First area 112:Second area 1121: Fitting part 1122: Mating area 12: Second board 2: Thermoelectric element 3: Wiring conductor 31: Extension part 4: Connector 5: Lead material 6: Fixing member 61: Surrounding area 7: Conductive bonding material 8: Resin 9:Slit 10: Side wall 100: Thermoelectric module

Claims

1. A support substrate; A wiring conductor; a thermoelectric element; the support substrate has a first substrate and a second substrate positioned opposite to each other; the wiring conductors are located on the first substrate and the second substrate, respectively; the thermoelectric elements are positioned in contact with the opposing wiring conductors, the first substrate has a first region in which the thermoelectric element is located and a second region located adjacent to the first region; the wiring conductor has an extension portion that extends across the second region, It also has a connector, the connector has a surface facing the support substrate that is surface-connected to the extension portion, is fixed to the support substrate via a fixing member, and is connected to the wiring conductor via a conductive bonding material; the fixing member has a surrounding portion that surrounds the conductive bonding material, The connector is placed on the surrounding portion. Thermoelectric module.

2. The width of the extension portion is smaller than the width of the wiring conductor located in the first region. The thermoelectric module according to claim 1 .

3. a portion of the extension portion that is close to the first region and that does not overlap with the connector is covered with resin in a planar perspective view; The resin is located between the first substrate and the second substrate and covers a portion facing the connector. The thermoelectric module according to claim 1 .

4. A support substrate; A wiring conductor; a thermoelectric element; the support substrate has a first substrate and a second substrate positioned opposite to each other; the wiring conductors are located on the first substrate and the second substrate, respectively; the thermoelectric elements are positioned in contact with the opposing wiring conductors, the first substrate has a first region in which the thermoelectric element is located and a second region located adjacent to the first region; the wiring conductor has an extension portion that extends across the second region, It also has a connector, The connector has a surface facing the support substrate that is surface-connected to the extension portion, the first substrate has lattice-shaped slits in the second region on a surface opposite to a surface on which the wiring conductor is located; Thermoelectric module.

5. A support substrate; A wiring conductor; a thermoelectric element; the support substrate has a first substrate and a second substrate positioned opposite to each other; the wiring conductors are located on the first substrate and the second substrate, respectively; the thermoelectric elements are positioned in contact with the opposing wiring conductors, the first substrate has a first region in which the thermoelectric element is located and a second region located adjacent to the first region; the wiring conductor has an extension portion that extends across the second region, It also has a connector, The connector has a surface facing the support substrate that is surface-connected to the extension portion, The second region includes a fitting portion of the connector, The mating portion has side walls positioned along the direction in which the extension portion extends, with a mating region in which the connector is mated sandwiched therebetween. Thermoelectric module.

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