Negative photosensitive resin composition, cured film and compound

JP7809168B2Active Publication Date: 2026-01-30ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information

Application Number
JP2024097648
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-06-17
Publication Date
2026-01-30
Estimated Expiration
2040-09-17

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Patent Text Reader

Abstract

To provide a compound which exhibits excellent lithography performance in a short development time.SOLUTION: The present invention provides a compound represented by (B) chemical formula (b1) (where R1 represents a hydrogen atom, or a monovalent organic group of an alkyl group with 1 to 12 carbon atoms, and n represents an integer of 1-10).SELECTED DRAWING: None
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Citation Information

Patent Citations

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  • Positive photosensitive resin composition

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