Semiconductor Module
JP7809181B2Active Publication Date: 2026-01-30SUNCALL CORP
Patent Information
- Application Number
- JP2024177020
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2040-10-06
Smart Images
Figure 0007809181000001 
Figure 0007809181000002 
Figure 0007809181000003
Abstract
To provide a bus bar assembly that acts as an anode and cathode for semiconductor elements and other electrical elements to be attached, and that has a frame for sealing resin to protect the electrical elements, while also being able to be miniaturized in the planar and thickness directions.SOLUTION: The bus bar assembly includes a planar conductive bus bar, an insulating resin film provided on the top surface of the bus bar, and a conductive frame mechanically fixed to the top surface of the bus bar via the insulating resin film in an electrically insulated state so as to form a housing space that opens upwards in the center of the top surface of the bus bar. The insulating resin film is provided with an opening that exposes at least part of the housing space on the top surface of the bus bar, forming an element mounting area in which electrical elements can be mechanically mounted in an electrically connected state. The bus bar and frame have their entire outer surfaces exposed.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Manufacture of sputtering target material for forming ta-si-o thin resistance film
JP1989087769A
Package for semiconductor light emitting element and semiconductor light emitting device using the same
JP2006012868A
Light-emitting diode array with improved light extraction
JP2007533082A
LED assembly with improved light collimation
JP2009534864A
Manufacturing method of bus bar assembly
JP2019042678A