Substrate holder, plating apparatus, and method for holding a substrate with a substrate holder

Abstract

Improves film thickness uniformity within the substrate surface. A substrate holder is proposed, comprising: a first holding member; a second holding member for sandwiching and holding a substrate together with the first holding member, the second holding member defining an opening for exposing the surface of the substrate; and a shielding member attached to the second holding member and configured to protrude inward from the opening and shield a portion of the opening, wherein at least one of the second holding member and the shielding member has a magnet that attracts the second holding member and the shielding member to each other, and the second holding member and the shielding member are detachably attached to each other.

Description

[Technical Field]

[0001] The present invention relates to a substrate holder, a plating apparatus, and a method for holding a substrate in a substrate holder. [Background technology]

[0002] Conventionally, wiring has been formed in minute wiring grooves, holes, or resist openings provided on the surface of a semiconductor wafer, etc., and bumps (protruding electrodes) that electrically connect to package electrodes, etc. have been formed on the surface of a semiconductor wafer, etc. Known methods for forming these wiring and bumps include, for example, electrolytic plating, vapor deposition, printing, and ball bump methods. However, with the increase in the number of I / Os on semiconductor chips and the trend toward finer pitches, electrolytic plating, which allows for finer wiring and has relatively stable performance, has come to be widely used.

[0003] On a substrate on which a plating film is formed by electroplating, recesses are formed by forming a pattern in the resist applied to the surface of the substrate. These recesses are arranged in a grid pattern on the substrate, and each of these grids is called a die. Because the dies are formed in a grid pattern on a circular substrate, the dies are not arranged evenly. In other words, there are areas near the periphery of the substrate where no dies are formed. Furthermore, if an identification number for identifying the substrate is printed on the substrate, no pattern (die) is formed in the area where this identification number is printed (in other words, the area where the identification number is printed is covered with resist).

[0004] When forming bumps or other structures by depositing metal in recesses in a resist pattern using electroplating, bumps are not formed in areas of the substrate that are completely covered with resist, and metal ions are directed toward the periphery. Therefore, dies adjacent to areas where the resist pattern is not formed tend to attract metal ions in the plating solution more easily than other dies (e.g., dies located in the center of the substrate), resulting in higher bump heights than the other dies. This leads to poor film thickness uniformity across the substrate.

[0005] In order to suppress the bump height and wiring thickness of the die adjacent to the area where no pattern is formed in the resist, a shielding plate has been proposed that protrudes inside the opening in the substrate holder and is configured to be movable along the opening. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-127069 Summary of the Invention [Problem to be solved by the invention]

[0007] The in-plane film thickness uniformity of a substrate varies depending on the resist pattern of the substrate being processed, the plating recipe, and the use of the plating solution. Therefore, it is desirable to be able to change the shielding amount of the substrate holder for each substrate or depending on the plating process conditions. While the shielding plate described in Patent Document 1 is configured to be movable along the opening, it may be desirable to change the shielding amount in the radial or circumferential direction in addition to movement. Furthermore, the in-plane film thickness uniformity of a substrate is also affected by the distance from the electrical contacts connected to the substrate. For circular substrates, the distance from the center of the circular substrate to the periphery of the substrate and the distance between adjacent electrical contacts are the same around the entire circumference of the substrate. However, for polygonal substrates such as squares, the substrate itself has low symmetry, so the plating film thickness distribution tendency differs near the corners and the center of the sides (the center between the vertices). Therefore, it is desirable to have a mechanism or method that can easily change the shielding amount of the substrate holder for each substrate or depending on the plating process conditions.

[0008] The present invention has been made in view of at least one of the above problems, and one of its objects is to improve film thickness uniformity within the substrate surface. [Means for solving the problem]

[0009] According to one embodiment of the present invention, a substrate holder is proposed, comprising: a first holding member; a second holding member for sandwiching and holding a substrate together with the first holding member, the second holding member defining an opening for exposing the plate surface of the substrate; and a shielding member attached to the second holding member and configured to protrude inward from the opening and shield a portion of the opening, wherein at least one of the second holding member and the shielding member has a magnet that attracts the second holding member and the shielding member to each other, and the second holding member and the shielding member are detachably attached to each other.

[0010] According to one embodiment of the present invention, there is proposed a method for holding a substrate with a substrate holder, the method including the steps of: sandwiching and holding the substrate between a first holding member and a second holding member of the substrate holder; and attaching the shielding member to the second holding member using a magnet provided on at least one of the second holding member and the shielding member, and shielding a portion of an opening in the second holding member for exposing the plate surface of the substrate with the shielding member. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic diagram showing the overall layout of a plating apparatus equipped with a substrate holder according to an embodiment of the present invention. [Figure 2] 2 is a schematic cross-sectional side view (longitudinal cross-sectional view) of a plating module provided in the plating apparatus shown in FIG. 1. FIG. [Figure 3] FIG. 2 is a perspective view showing a substrate holder according to the present embodiment used in a plating apparatus. [Figure 4] 4 is an enlarged view of the dashed line portion in FIG. 3, showing the shielding member and the second holding member of the present embodiment. FIG. [Figure 5] FIG. 4 is a perspective view showing the shielding member from below. [Figure 6] 1 shows the shielding member and the second holding member attached to each other. [Figure 7] FIG. 10 is a diagram showing a first modified example of the shielding member. [Figure 8]FIG. 10 is a diagram showing a first modified example of the shielding member. [Figure 9] FIG. 10 is a diagram showing a second modified example of the shielding member. [Figure 10] FIG. 10 is a diagram showing a second modified example of the shielding member. [Figure 11] 10A and 10B are diagrams showing a third modified example of the shielding member and the second holding member. [Figure 12] FIG. 10 is a perspective view showing a substrate holder according to a second embodiment. [Figure 13] FIG. 10 is a diagram showing a first modified example of the substrate holder of the second embodiment. [Figure 14] FIG. 10 is a diagram showing a second modified example of the substrate holder of the second embodiment. [Figure 15] FIG. 10 is a diagram showing a second modified example of the substrate holder of the second embodiment. [Figure 16] FIG. 2 is a diagram illustrating a fixing stage 120 according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, identical or corresponding components are designated by the same reference numerals, and redundant description will be omitted.

[0013] Figure 1 is a schematic diagram showing the overall layout of a plating apparatus equipped with a substrate holder according to this embodiment. As shown in Figure 1, this plating apparatus has two cassette tables 102 on which cassettes 100 containing substrates such as semiconductor wafers are mounted, an aligner 104 that aligns the positions of the substrates in a predetermined direction, and a rinse dryer 106 that dries the substrates after plating. Near the rinse dryer 106, a fixing stage 120 is provided on which the substrate holder 60 is placed for mounting and removing the substrates. At the center of these units 100, 104, 106, and 120, a substrate transfer device 122 consisting of a transfer robot that transfers substrates between these units is located.

[0014] The fixing stage 120, the stocker 124 for storing and temporarily placing the substrate holders 60, the pre-wet tank 126 for immersing the substrates in pure water, the pre-soak tank 128 for etching away the oxide film on the surface of the conductive layer such as a seed layer formed on the surface of the substrate, the first cleaning tank 130a for cleaning the substrates together with the substrate holders 60 with a cleaning liquid (pure water, etc.) after pre-soaking, the blow tank 132 for draining the substrates after cleaning, the second cleaning tank 130b for cleaning the substrates together with the substrate holders 60 with a cleaning liquid after plating, and the plating module 10 are arranged in this order.

[0015] The plating module 10 is configured by accommodating multiple plating tanks 50 inside an overflow tank 54. Each plating tank 50 accommodates one substrate inside, and the substrate is immersed in the plating solution held inside to perform plating such as copper plating on the surface of the substrate.

[0016] The plating apparatus includes a substrate holder transfer device 140, which is positioned to the side of each of these devices and which transfers the substrate holder 60 together with the substrate between these devices, and which employs, for example, a linear motor system. This substrate holder transfer device 140 includes a first transporter 142 which transfers substrates between the fixing stage 120, the stocker 124, the pre-wet tank 126, the pre-soak tank 128, the first cleaning tank 130a, and the blow tank 132, and a second transporter 144 which transfers substrates between the first cleaning tank 130a, the second cleaning tank 130b, the blow tank 132, and the plating module 10. The plating apparatus may include only the first transporter 142, without including the second transporter 144.

[0017] On the opposite side of the overflow tank 54 from this substrate holder transport device 140, a paddle drive device 19 is arranged which drives a paddle 18 (see Figure 2) which is located inside each plating tank 50 and acts as a stirring rod to agitate the plating solution in the plating tank 50.

[0018] The fixing stage 120 is provided with a flat loading plate 152 that can slide laterally along rails 150. The two substrate holders 60 are placed in parallel and horizontally on this loading plate 152, and after a substrate is transferred between one substrate holder 60 and the substrate transfer device 122, the loading plate 152 is slid laterally, and a substrate is transferred between the other substrate holder 60 and the substrate transfer device 122.

[0019] The plating apparatus also includes a control device 17 for controlling the entire apparatus. The control device 17 can be configured, for example, from a general computer or a dedicated computer that has an input / output interface with an operator.

[0020] Fig. 2 is a schematic side cross-sectional view (longitudinal cross-sectional view) of a plating module 10 provided in the plating apparatus shown in Fig. 1. As shown in Fig. 2, the plating module 10 has a plating tank 50 configured to accommodate a plating solution Q, a substrate holder 60, and an anode holder 20. The substrate holder 60 is configured to hold a substrate Wf, and the anode holder 20 is configured to hold an anode 21 having a metal surface. The polygonal substrate Wf and the anode 21 are electrically connected via a plating power supply 90, and a plating film is formed on the surface of the substrate Wf by passing a current between the substrate Wf and the anode 21.

[0021] The plating solution Q is supplied from a plating solution supply port 56 provided at the bottom of the plating tank 50, overflows from the plating tank 50, and flows into the overflow tank 54. The plating solution Q that has flowed into the overflow tank 54 is discharged from a plating solution discharge port 57 provided at the bottom of the overflow tank 54, and impurities are removed by a filter or the like provided in a plating solution circulation device 58. The plating solution Q from which the impurities have been removed is supplied to the plating tank 50 via the plating solution supply port 56 by the plating solution circulation device 58.

[0022] The anode holder 20 has an anode mask 25 for adjusting the electric field between the anode 21 and the substrate Wf. The anode mask 25 is a substantially plate-shaped member made of, for example, a dielectric material, and is provided on the front surface of the anode holder 20. Here, the front surface of the anode holder 20 refers to the surface facing the substrate holder 60. In other words, the anode mask 25 is disposed between the anode 21 and the substrate holder 60. The anode mask 25 has an opening 25a in the approximate center through which a current flows between the anode 21 and the substrate Wf.

[0023] The plating module 10 has a regulation plate (adjustment plate) 30 for adjusting the electric field between the substrate Wf and the anode 21. The regulation plate 30 is disposed between the substrate holder 60 and the anode 21. The regulation plate 30 has an opening 30a through which a current flows between the anode 21 and the substrate Wf. A paddle 18 for stirring the plating solution Q near the plating surface W1 of the substrate Wf is provided between the regulation plate 30 and the substrate holder 60. The paddle 18 is a substantially rod-shaped member, and one end of the paddle 18 is fixed to a paddle drive device 19. For example, the paddle 18 is moved horizontally along the plating surface W1 of the substrate Wf by the paddle drive device 19, thereby stirring the plating solution Q.

[0024] <Substrate holder> FIG. 3 is a perspective view of a substrate holder 60 according to this embodiment, which is used in a plating apparatus. In the example shown in FIG. 3, the substrate holder 60 is configured to hold a rectangular substrate. As shown, the substrate holder 60 includes a first holding member 64, made of, for example, vinyl chloride, and a second holding member 66 that is attached to the first holding member 64 in an openable and closable manner. The first holding member 64 defines a holding surface 65 on which the substrate is placed and held. In other words, the holding surface 65 covers the surface of the substrate opposite the surface to be plated. The second holding member 66 has an edge 682 that defines a rectangular opening 68 through which the substrate placed on the holding surface 65 is exposed. The substrate holder 60 includes a power supply terminal (not shown) for supplying power to a conductive film formed on the surface of the substrate, and a sealing member for sealing the power supply terminal and the outer periphery of the substrate from the plating solution.

[0025] A pair of roughly T-shaped hands 62 are connected to the upper end of the substrate holder 60, and serve as supports for transporting and suspending the substrate holder 60. In the stocker 124 shown in FIG. 1, the hands 62 are hooked onto the upper surface of the peripheral wall of the stocker 124, thereby vertically supporting the substrate holder 60 in a suspended state. The substrate holder 60 is transported by gripping the hands 62 of the suspended substrate holder 60 with a substrate holder transport device 140. In the pre-wet tank 126, the pre-soak tank 128, the water-rinsing tanks 130a and 130b, the blow tank 132, and the plating module 10, the substrate holder 60 is also suspended and supported by the peripheral wall of each tank via the hands 62.

[0026] When holding a substrate, first, with the second holding member 66 open relative to the first holding member 64, the substrate is placed on the holding surface 65 of the first holding member 64, and the second holding member 66 is then closed. Next, a clamper (not shown) is engaged to lock the second holding member 66 relative to the first holding member 64. Once the first holding member 64 and the second holding member 66 are locked together, the second holding member 66 presses the outer periphery of the substrate placed on the holding surface 65 against the holding surface 65, thereby holding the substrate.

[0027] The substrate holder 60 also includes a shielding member 70 that protrudes inward from an opening 68 defined by the second holding member 66 and shields a portion of the substrate placed on the holding surface 65. The shielding member 70 is detachably attached to the second holding member 66. FIG. 4 is an enlarged view of the dashed line portion in FIG. 3 showing the shielding member 70 and the second holding member 66 of this embodiment, and FIG. 5 is a perspective view of the shielding member 70 from below. FIG. 6 shows the shielding member 70 and the second holding member 66 attached to each other. The shielding member 70 is made of a synthetic resin, such as vinyl chloride, resin, or VITON (registered trademark). Note that the material of the shielding member 70 is not limited to synthetic resin, and other dielectric materials can also be used. The shielding member 70 can be manufactured by, for example, injection molding or additive manufacturing using an AM device.

[0028] The shielding member 70 has a first side 72 that extends along and abuts against the edge 682 of the second holding member 66, and a second side 74 that is continuous with the first side 72 and protrudes inward of the opening 68. By protruding inward of the opening 68, the second side 74 shields a portion of the plating surface W1 of the substrate Wf and reduces the thickness of the plating film formed in that portion. The dimensions of the second side 74 are preferably designed based on the resist pattern of the substrate Wf, the plating process recipe, testing, or the like, so as to improve the in-plane uniformity of the plating film thickness on the substrate Wf. Furthermore, multiple shielding members with different dimensions or shapes of the second side 74 may be prepared as the shielding member 70 so that the amount of shielding of the opening 68 can be changed depending on the substrate Wf.

[0029] In the example shown in FIGS. 4 to 6, two notches (slits) 722 are formed in the first side 72 of the shielding member 70 on the side opposite to the side where the second side 74 is continuous. In the example shown in FIGS. 4 to 6, the notches 722 have a depth direction perpendicular to the holding surface 65 (the surface W1 to be plated of the substrate Wf). Furthermore, two protrusions 684 corresponding to the notches 722 are provided on the edge 682 of the second holding member 66 of the substrate holder 60. Here, the protrusions 684 have a shaft portion 686 having a shaft width La narrower than the notch width Ls, and a flange portion 688 having a flange width Lf wider than the notch width Ls. With this configuration, the shielding member 70 can be attached by sliding it onto the edge 682 of the second holding member 66 so that the shaft portion 686 of the protrusion 684 of the second holding member 66 is positioned in the notch 722. When the shielding member 70 is attached to the second holding member 66, the flange portion 688 of the protrusion 684 prevents the shielding member 70 from coming off inside the opening 68. In addition, in this embodiment, two notches 722 are formed in the shielding member 70, which can prevent the shielding member 70 from moving, such as rotating, relative to the edge 682 of the second holding member 66. However, the shielding member 70 may be formed with only one notch 722, or with two or more notches 722. In addition, in this embodiment, the shielding member 70 is attached to the second holding member 66 by the notch 722 engaging with the protrusion 684, but the present invention is not limited to this example, and the shielding member 70 may not be formed with the notch 722.

[0030] In this embodiment, a magnet 728 is provided on the first side 72 of the shielding member 70. When the shielding member 70 is attached to the second holding member 66, the magnet 728 attracts the shielding member 70 and the second holding member 66 to each other. For this purpose, a magnet or a magnetic material is preferably provided at least in a portion of the second holding member 66 corresponding to the magnet 728. Furthermore, the magnet 728 of the shielding member 70 is preferably covered on its outer surface with a coating that is chemically resistant to the plating solution Q. Examples of chemically resistant coatings include, but are not limited to, PTFE (polytetrafluoroethylene), PFA (polyethylene fluoride), and PEEK (polyether ether ketone). With this configuration, in this embodiment, when the shielding member 70 is attached to the second holding member 66, the shielding member 70 and the second holding member 66 are attracted to each other by the magnet 728. This allows the shielding member 70 to be easily attached to the second holding member 66. In this embodiment, the magnet 728 is provided on the shielding member 70, but instead, a magnet may be provided on the second holding member 66, and a magnetic body that is attracted to the magnet may be provided on the shielding member 70. However, without being limited to this example, the shielding member 70 and the second holding member 66 may not be provided with a magnet.

[0031] As described above, the shielding member 70 of this embodiment is configured to be easily attached to and detached from the second holding member 66. When the shielding member 70 is attached to the second holding member 66, the second edge 74 of the shielding member 70 protrudes inside the opening 68 of the second holding member 66. The second edge 74 shields a portion of the substrate Wf, thereby shielding a portion of the electric field applied to the substrate Wf during electrolytic plating, thereby reducing the thickness of the plating film formed compared to other portions. This allows the amount of shielding of the electric field applied to the substrate Wf during electrolytic plating to be adjusted, thereby adjusting the area on the substrate Wf where the plating film is to be thinned, thereby appropriately adjusting the plating film thickness depending on the substrate Wf. Furthermore, because the shielding member 70 of this embodiment is configured to be easily attached to and detached from the second holding member 66, plating can be performed without attaching the shielding member 70. Furthermore, a shielding member 70 having a desired size or shape can be selected and attached to the second holding member 66 for plating. Although one shielding member 70 is provided on the substrate holder 60 shown in FIG. 2, two or more shielding members 70 may be provided on the substrate holder 60.

[0032] Next, modified examples of the shielding member 70 provided in the substrate holder 60 according to this embodiment will be described. FIGS. 7 and 8 are diagrams showing a first modified example of the shielding member. In FIG. 7, the shielding member 70A and the second holding member 66 are shown separately, while in FIG. 8, the shielding member 70A and the second holding member 66 are shown attached to each other. The shielding member 70A shown in FIGS. 7 and 8 is identical to the shielding member 70 shown in FIGS. 4 to 6 except for the shape of the notches. Each of the two notches 722A of the shielding member 70A includes a first slit 723 extending from the end of the first side portion 72 in a direction perpendicular to the holding surface 65 (the surface W1 to be plated of the substrate Wf) and a second slit 724 extending along the edge 682, continuing from the first slit 723. By forming the notch 722A in this manner, the shielding member 70 can be attached to the second holding member 66 by sliding it through the first slit 723 and then sliding it through the second slit 724. As a result, when the shielding member 70 is attached to the second holding member 66, the protrusion 684 of the second holding member 66 is positioned in the second slit 724, preventing the shielding member 70 from moving in a direction perpendicular to the holding surface 65 (the surface W1 to be plated of the substrate Wf). This makes it possible to prevent the shielding member 70 from unintentionally coming off the second holding member 66 and also to prevent the attachment position of the shielding member 70 from shifting.

[0033] 9 and 10 are diagrams illustrating a second modified example of a shielding member. In FIG. 9, the shielding member 70B and the second holding member 66 are shown separately, while in FIG. 10, the shielding member 70B and the second holding member 66 are shown attached to each other. In the example illustrated in FIGS. 9 and 10, the shielding member 70B includes a first member 702 and a second member 704. For ease of viewing, the second member 704 is hatched in FIGS. 9 and 10. The first member 702 has substantially the same configuration as the shielding member 70A described above, except that it has a receiving portion 703 that receives the inserting portion 705 of the second member 704. The second member 704 also has substantially the same configuration as the shielding member 70A described above, except that it has an inserting portion 705 that can be inserted into the receiving portion 703 of the first member 702 and is configured to be movable along the edge 682 relative to the first member 702. The receiving portion 703 of the first member 702 extends along the edge 682 so that the insertion portion 705 of the second member 704 can move along the edge 682. The first member 702 and the second member 704 each have second sides 702a, 704a that protrude inside the opening 68. In the shielding member 70B, the amount of overlap between the second sides 702a, 704a changes as the second member 704 moves relative to the first member 702. Changing the amount of overlap between the second sides 702a, 704a when viewed in a direction perpendicular to the holding surface 65 allows the amount of shielding of the substrate Wf to be changed.

[0034] FIG. 11 illustrates a third modified example of a shielding member and a second holding member. Instead of notches, the shielding member 70C illustrated in FIG. 11 has two protrusions 722C that protrude toward an edge 682C of a second holding member 66C. The second holding member 66C also has two notches (slits) 684C that correspond to the protrusions 722C. In the example illustrated in FIG. 11, the protrusions 722C include a shaft 723C and a flange 724C. The notches 684C extend in a direction perpendicular to the holding surface 65 (the surface W1 to be plated of the substrate Wf) and have a shape that corresponds to the shape of the protrusions 722C. Even in this example, the shielding member 70C can be attached by aligning the protrusions 722C with the notches 684C and sliding them onto the edge 682C of the second holding member 66C. 7 and 8, notch 684C of second holding member 66C may include a first slit extending in a direction perpendicular to holding surface 65 and a second slit extending continuous with the first slit along edge 682C. Also, shielding member 70C may be provided with both a notch and a protrusion.

[0035] Next, a substrate holder according to a second embodiment will be described. FIG. 12 is a perspective view showing a substrate holder according to the second embodiment. In the example shown in FIG. 12, a substrate holder 160 is configured to hold a circular substrate. This substrate holder 160 has a first holding member 164 made of, for example, vinyl chloride, and a second holding member 166 attached to the first holding member 164 so as to be able to open and close freely. The first holding member 164 forms a holding surface 165 on which a substrate is placed and held. The second holding member 166 has an edge 1682 that defines a circular opening 168 through which the substrate placed on the holding surface 165 is exposed. Regarding the substrate holder 160 according to the second embodiment, detailed description of the same features as the substrate holder 60 described above will be omitted.

[0036] The substrate holder 160 has a shielding member 170 that protrudes inward from an opening 168 defined by the second holding member 166 and shields a portion of the substrate placed on the holding surface 165. In the example shown in FIG. 12, the shielding member 170 has a protrusion (protrusion) 1722 that protrudes in a direction perpendicular to the holding surface 165 (the surface W1 to be plated of the substrate Wf). In the example shown in FIG. 12, the shielding member 170 is provided with four protrusions 1722 along the circumferential direction of the substrate Wf, but one to three, or five or more protrusions 1722 may be provided. In addition, the second holding member 166 is formed with recesses (slits) 1684 that correspond to the protrusions 1722. With this configuration, when attaching the shielding member 170 to the second holding member 166, mutual alignment can be easily performed. Instead of or in addition to providing a convex portion 1722 on the shielding member 170 and a concave portion 1684 on the second holding member 166, a concave portion may be formed on the shielding member 170 and a convex portion may be formed on the second holding member 166.

[0037] In the present embodiment, a magnet 169 is provided on the second holding member 166. In the example shown in FIG. 12 , the magnet 169 is provided along the edge 1682. When the shielding member 170 is attached to the second holding member 166, the magnet 169 attracts the shielding member 170 and the second holding member 166 to each other. This configuration allows the shielding member 170 to be easily attached to and detached from the second holding member 166. For this purpose, a magnet or a magnetic material may be provided on at least a portion of the shielding member 170 corresponding to the magnet 169. As described in the first embodiment, the outer surface of the magnet 169 of the second holding member 166 is preferably covered with a coating that is chemically resistant to the plating solution Q. In the present embodiment, the magnet 169 is provided on the second holding member 166. However, instead, a magnet may be provided on the shielding member 170 and a magnetic material that is attracted to the magnet may be provided on the second holding member 166. However, the present invention is not limited to this example, and the shielding member 170 and the second holding member 166 do not necessarily have to include a magnet.

[0038] As described above, the substrate holder 160 of this embodiment is configured to be easily attached to and detached from the second holding member 166. The shielding member 170 is configured to protrude inside the opening 168 of the second holding member 166 when attached to the second holding member 166. According to the shielding member 170 of the second embodiment, a shielding member 170 having a desired size or shape can be selected and attached to the second holding member 166 for plating. In the example shown in FIG. 12 , multiple shielding members 170 are attached in the circumferential direction, and a perfect circular opening is defined inside the opening 168 by the inner periphery of each shielding member 170. However, this is not limited to this example, and the shielding members 170 may be formed so that the amount of protrusion (shielding amount) inside the opening 168 varies in the circumferential direction. As an example, the shape of the shielding member 170 may be determined based on the resist pattern of the substrate Wf, particularly the area where the resist pattern (die) is not formed.

[0039] Next, modified examples of the substrate holder 160 according to the second embodiment will be described. FIG. 13 is a diagram illustrating a first modified example of the substrate holder according to the second embodiment. In the example illustrated in FIG. 13, the recesses 1684 of the second holding member 166 are elongated holes extending along the radial direction, allowing the protrusions 1722 of the shielding member 170 to move radially within the recesses 1684. This allows the shielding member 170 to move radially while attached to the second holding member 166. The radial movement of the shielding member 170 can change the amount of protrusion (shielding amount) of the shielding member 170 that protrudes inward from the opening 168. In other words, the shielding member 170 is configured to be movable between a first position on the radially outer side and a second position on the radially inner side where the shielding amount of the opening 168 is greater than that at the first position. Here, to allow the shielding member 170 to move smoothly radially, the recesses 1684 and the circumferential end portions of the shielding member 170 are preferably formed parallel to each other. 13, second holding member 166 is formed with recess 1684 that is long in the radial direction. However, the present invention is not limited to this example, and second holding member 166 may be formed with a plurality of recesses 1684 that are spaced apart in the radial direction, and shielding member 170 may be configured to be attachable to second holding member 166 at a plurality of attachment positions along the radial direction.

[0040] 14 and 15 are diagrams showing a second modified example of the substrate holder of the second embodiment. Here, FIG. 14 shows a state in which the shielding member covers the opening to a relatively small extent, and FIG. 15 shows a state in which the shielding member covers the opening to a relatively large extent. In the example shown in FIGS. 14 and 15, the shielding member 270 is configured to be detachable from the second holding member 266. The shielding member 270 is configured to be rotatable around a fulcrum 278 relative to the second holding member 266. In the example shown in FIGS. 14 and 15, the fulcrum 278 is provided near one end of the shielding member 270 in the circumferential direction. For example, the fulcrum 278 can be configured by forming a convex portion (protrusion) that protrudes in a direction perpendicular to the holding surface 165 on one of the shielding member 270 and the second holding member 266, and forming a concave portion (slit portion) corresponding to the convex portion on the other. 14 and 15, no magnets are provided on the shielding member 270 or the second holding member 266. However, at least one of the shielding member 270 and the second holding member 266 may be provided with a magnet that attracts the shielding member 270 and the second holding member 266 to each other.

[0041] 14 and 15, the amount of shielding of the opening 268 by the shielding member 270 can be changed by rotating the shielding member 270 about a fulcrum 278 while it is attached to the second holding member 266. Specifically, by rotating the shielding member 270 about the fulcrum 278, an end 279 away from the fulcrum 278 moves between an outer peripheral position as shown in Fig. 14 and an inner peripheral position as shown in Fig. 15, and the amount of protrusion (amount of shielding) by which the shielding member 270 protrudes inward from the opening 268 changes. This makes it possible to adjust the amount of shielding of the opening 268 by the shielding member 270 for each substrate Wf.

[0042] The substrate holder of this embodiment described above allows a desired shielding member to be selected for each substrate, and the shielding member can be manually attached to the second holding member to perform plating. The plating apparatus may also include a shielding member attachment module for attaching the shielding member to the second holding member. For example, the shielding member attachment module may be configured to grasp and move the shielding member 70, align the shielding member 70 with the second holding member, and attach the shielding member 70 to the second holding member. For example, the shielding member attachment module may be provided on the fixing stage 120 of the plating apparatus. FIG. 15 is a schematic diagram illustrating the fixing stage 120 in one embodiment. In the example shown in FIG. 15, the shielding member attachment module 121 is configured as a robot hand and can automatically attach the shielding member 70 to the second holding member 66 placed on the fixing stage 120. The shielding member mounting module 121 may be a mechanism for gripping the first holding member 64, the second holding member 66, or the substrate Wf on the fixing stage 120, or a substrate transport device 122. Instead of or in addition to a robot hand for gripping the shielding member 70, the shielding member mounting module 121 may be a mechanism for holding the shielding member 70 by vacuum suction or magnetic force. The shielding member mounting module 121 may be configured to mount the shielding member 70 on the second holding member 66 when the second holding member 66 is holding the substrate Wf, or may be configured to mount the shielding member 70 on the second holding member 66 when the second holding member 66 is not holding the substrate Wf. The shielding member mounting module 121 is not limited to being mounted on the fixing stage 120, but may be mounted on any mechanism in the plating apparatus.

[0043] The substrate holder 60 shown in FIGS. 3 to 11 is configured to hold a rectangular substrate Wf. The substrate holder 160 shown in FIGS. 12 to 14 is configured to hold a circular substrate Wf. However, the present invention is not limited to these examples, and the substrate holder may be configured to hold a substrate of any shape. For example, the substrate holder may hold a polygonal substrate such as a hexagonal or octagonal shape. In such a case, an opening corresponding to the shape of the substrate may be formed in the second holding member of the substrate holder.

[0044] In the plating apparatus described above, the substrate Wf is disposed in the plating tank 50 so that the surface W1 of the substrate Wf and the anode 21 face each other in the horizontal direction. However, the present invention is not limited to this example, and as one example, the substrate may be disposed so that the surface W1 faces downward during plating.

[0045] The present invention can also be described in the following aspects. [Mode 1] According to Mode 1, a substrate holder is proposed, comprising: a first holding member; a second holding member for sandwiching and holding a substrate together with the first holding member, the second holding member defining an opening for exposing the surface of the substrate; and a shielding member attached to the second holding member and configured to protrude inward from the opening to shield a portion of the opening, wherein at least one of the second holding member and the shielding member has a magnet that attracts the second holding member and the shielding member to each other, and the second holding member and the shielding member are detachably attached to each other. According to Mode 1, it is possible to improve film thickness uniformity within the substrate surface.

[0046] [Mode 2] According to Mode 2, in Mode 1, one of the second holding member and the shielding member has a protrusion, and the other of the second holding member and the shielding member has a slit that engages with the protrusion. According to Mode 2, the shielding member can be attached to the second holding member by engaging the protrusion with the slit.

[0047] [Mode 3] According to Mode 3, in Mode 1 or Mode 2, the protrusion comprises a shaft portion having a shaft width and a flange portion having a flange width larger than the shaft width, and the slit portion has a slit width larger than the shaft width and smaller than the flange width. According to Mode 3, it is possible to prevent the protrusion and the slit portion from coming off.

[0048] [Mode 4] According to Mode 4, in Modes 1 to 3, the slit portion includes a first slit extending in a direction perpendicular to the plate surface of the substrate, and a second slit extending continuously from the first slit along the outer periphery of the opening. According to Mode 4, it is possible to prevent the position of the shielding member from shifting, and also to prevent the shielding member and the second holding member from unintentionally coming off from each other.

[0049] [Mode 5] According to Mode 5, in any of Modes 1 to 4, the magnet is covered with a coating that is chemically resistant to the plating solution. According to Mode 5, deterioration of the magnet can be suppressed.

[0050] [Mode 6] According to Mode 6, in Modes 1 to 5, the shielding member can be attached to the second holding member at a first position and a second position where the shielding member shields the opening to a greater extent than the first position. According to Mode 6, the attachment position of the shielding member can be changed to adjust the shielding amount of the opening.

[0051] [Mode 7] According to Mode 7, in Mode 6, the shielding member is configured to be movable between the first position and the second position while attached to the second holding member. According to Mode 7, while the shielding member is attached to the second holding member, the attachment position of the shielding member can be changed to adjust the amount of shielding of the opening.

[0052] [Mode 8] According to Mode 8, in Mode 6 or 7, the shielding member is configured to be movable between the first position and the second position by rotating about a fulcrum relative to the second holding member while attached to the second holding member. According to Mode 8, the attachment position of the shielding member can be changed by rotating the shielding member about a fulcrum.

[0053] [Mode 9] According to Mode 9, there is proposed a plating apparatus including the substrate holder of Modes 1 to 8, further including a shielding member mounting module for mounting the shielding member to the second holding member. According to Mode 9, the shielding member can be mounted to the second holding member by the shielding member mounting module.

[0054] [Mode 10] According to Mode 10, there is proposed a method for holding a substrate with a substrate holder, the method including the steps of: sandwiching and holding the substrate between a first holding member and a second holding member of the substrate holder; and attaching the shielding member to the second holding member using a magnet provided on at least one of the second holding member and the shielding member, and shielding a portion of an opening in the second holding member for exposing the plate surface of the substrate with the shielding member. According to Mode 10, it is possible to improve film thickness uniformity within the substrate surface.

[0055] Although the embodiments of the present invention have been described above, the above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination or omission of the components described in the claims and specification is possible within the scope of solving at least part of the above-described problems or achieving at least part of the effects. [Explanation of symbols]

[0056] Wf...Substrate W1: Surface to be plated Q...Plating solution 10... Plating module 17...Control device 20...Anode holder 21...Anode 30...Regulation plate 50...Plating tank 60...Substrate holder 64...First holding member 65…Holding surface 66...Second holding member 68...Opening 70, 70A, 70B, 70C...Shielding members 72...First side 74...Second side 120...Fixing stage 160...Substrate holder 164...First holding member 165…Holding surface 166...Second holding member 168...Opening 170...Shielding member 266...Second holding member 268...Opening 270...Shielding member 278…Fulcrum 682…Connection 684...Protrusion 686...shaft 688...Flange 723...First slit 724...Second slit 728...Magnet

Claims

1. A first holding member; a second holding member for sandwiching and holding the substrate together with the first holding member, the second holding member defining an opening for exposing a surface of the substrate; a shielding member attached to the second holding member and configured to protrude inward from the opening to shield a portion of the opening; Equipped with At least one of the second holding member and the shielding member includes a magnet that attracts the second holding member and the shielding member to each other, and the second holding member and the shielding member are detachably attached to each other. Substrate holder.

2. one of the second holding member and the shielding member includes a protrusion, the other of the second holding member and the shielding member includes a slit portion that engages with the protrusion. The substrate holder of claim 1 .

3. The protrusion includes a shaft portion having a shaft width and a flange portion having a flange width larger than the shaft width, The slit portion has a slit width that is larger than the shaft width and smaller than the flange width. The substrate holder of claim 2 .

4. The substrate holder according to claim 2 , wherein the slit portion includes a first slit extending in a direction perpendicular to the surface of the substrate, and a second slit extending along the outer periphery of the opening, continuous with the first slit.

5. 2. The substrate holder according to claim 1, wherein the magnet is covered with a coating that is chemically resistant to a plating solution.

6. The substrate holder according to claim 1 , wherein the shielding member is attachable to the second holding member at a first position and a second position at which the shielding member shields the opening to a greater extent than the first position.

7. The substrate holder according to claim 6 , wherein the shielding member is configured to be movable between the first position and the second position while attached to the second holding member.

8. The shielding member comprises a first member attached to the second holding member, and a second member configured to be movable relative to the first member along the outer periphery of the opening; the second member has an insertion portion, The first member has a receiving portion into which the insertion portion is inserted and which guides the insertion portion along the outer periphery of the opening. The substrate holder of claim 6 .

9. The substrate holder according to claim 6, wherein the shielding member is configured to be movable between the first position and the second position by rotating around a fulcrum relative to the second holding member while attached to the second holding member.

10. A plating apparatus comprising the substrate holder according to any one of claims 1 to 9, A plating apparatus comprising a shield member attachment module for attaching the shield member to the second holding member.

11. 1. A method of holding a substrate with a substrate holder, comprising: a step of sandwiching and holding the substrate between a first holding member and a second holding member of the substrate holder; a step of attaching the shielding member to the second holding member using a magnet provided in at least one of the second holding member and the shielding member, and shielding a part of an opening in the second holding member for exposing a plate surface of the substrate with the shielding member; A method for holding a substrate with a substrate holder, comprising:

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