Laser position confirmation cleaning device

Abstract

To provide a laser position confirmation cleaning device capable of more easily confirming a cleaning position. [Solution] A laser position confirmation cleaning device suitable for cleaning wafers (9) comprising: a base unit (1) for restricting the position of the wafer; a drive unit (2) including left and right slide rails (23), left and right sliders (24) mounted on the left and right slide rails, upper and lower slide rails (25) fixed to the left and right sliders, upper and lower sliders (26) mounted on the upper and lower slide rails, and a carrier plate (27) fixed to the upper and lower sliders; a nozzle seat unit (3) including a nozzle seat body and at least one nozzle for spraying chemicals toward the wafer; and a laser unit (4) connected to the left and right slide rails and having a laser emitter (42) that emits laser light toward the wafer, the point at which the emitted laser light is irradiated onto the wafer overlapping with the point at which the chemicals sprayed from the nozzle are on the wafer.

Description

[Technical Field]

[0001] The present invention relates to cleaning devices, and more particularly to laser location checking cleaning devices. [Background technology]

[0002] As wafer packaging processes improve, the electronic components on the wafer surface become more precise, and these components can easily be damaged by contaminants such as tiny dust, dirt, and particles.

[0003] Therefore, cleaning the wafer with chemicals, as in the processing apparatus and processing method disclosed in Patent Document 1, is a necessary step.

[0004] However, since many of the chemicals used to clean wafers are transparent, it is difficult for operators to confirm whether the chemicals are being applied to the wafers in the intended path when cleaning the wafers using conventional cleaning equipment.

[0005] This makes it difficult for an operator to check the process of cleaning wafers in the conventional cleaning equipment, which can lead to doubts as to whether the cleaning has been properly performed. Therefore, there is room for improvement in the conventional cleaning equipment. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Taiwan Patent Application Publication No. 202401539 Summary of the Invention [Problem to be solved by the invention]

[0007] SUMMARY OF THE INVENTION An object of the present invention is to provide a laser location and cleaning device that overcomes the above drawbacks. [Means for solving the problem]

[0008] The present invention is suitable for cleaning wafers, Suitable for cleaning wafers, The apparatus includes a base unit, a drive unit, a nozzle unit, and a laser unit, the base unit is for restricting the position of the wafer; the drive unit includes a left-right slide rail, a left-right slider installed on the left-right slide rail so as to be slidable along a left-right direction, a vertical slide rail fixed to the left-right slider, a vertical slider installed on the vertical slide rail so as to be slidable along a vertical direction perpendicular to the left-right direction, and a carrier plate fixed to the vertical slider, The nozzle unit is connected to the bottom side of the carrier plate, and includes: a nozzle seat body; and at least one nozzle connected to the nozzle seat body for spraying a chemical agent toward the wafer; The laser unit is connected to the left and right slide rails and emits laser light toward the wafer, and the point where the emitted laser light is irradiated onto the wafer overlaps with the point where the chemical sprayed from the nozzle is on the wafer. [Effects of the Invention]

[0009] According to the present invention, the area where the laser light emitted by the laser unit is irradiated onto the wafer overlaps with the area where the chemical sprayed from the nozzle is on the wafer, making it easier to check the wafer cleaning process. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view showing an embodiment of a laser position checking and cleaning device of the present invention. [Figure 2] 3 is a perspective view showing the embodiment of the laser positioning and cleaning apparatus from another angle and showing a wafer. FIG. [Figure 3]FIG. 2 is a partially enlarged view showing the embodiment of the laser position checking and cleaning device. [Figure 4] FIG. 2 is a top view of the embodiment of the laser position confirmation and cleaning apparatus and a wafer. [Figure 5] FIG. 5 is a cross-sectional view taken along line VV in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] The present invention will be described in detail below.

[0012] As shown in Figures 1 and 2, an embodiment of the laser position confirmation cleaning device of the present invention is suitable for cleaning a wafer 9 and includes a base unit 1, a drive unit 2, a nozzle unit 3, a laser unit 4, and a photographing unit 5.

[0013] The base unit 1 includes a base body 11 defining six holes 111 and six vacuum suction parts 12 respectively installed in the six holes 111 .

[0014] The base unit 1 restricts the position of the wafer 9 by vacuum suctioning the wafer 9 with the vacuum suction section 12 .

[0015] The number of holes 111 and vacuum suction parts 12 is not limited to six and can be adjusted as needed.

[0016] The drive unit 2 includes a front-rear slide rail 21 connected to a base frame (not shown), a front-rear slider set 22 mounted on the front-rear slide rail 21 so as to be slidable along the front-rear direction D1, a left-right slide rail 23 fixed to the front-rear slider set 22, a left-right slider 24 mounted on the left-right slide rail 23 so as to be slidable along the left-right direction D2 perpendicular to the front-rear direction D1, an up-down slide rail 25 fixed to the left-right slider 24, an up-down slider 26 mounted on the up-down slide rail 25 so as to be slidable along the up-down direction D3 perpendicular to the front-rear direction D1 and the left-right direction D2, and a carrier plate 27 fixed to the up-down slider 26.

[0017] As shown in Figures 1 and 2, the front-rear slide rail 21 has two rails 211 that are spaced apart in the left-right direction D2, and the front-rear slider set 22 has two sliders 221 that are installed on each rail 211 so that each can slide along the front-rear direction D1.

[0018] As shown in FIG. 3, the carrier plate 27 includes a main plate 271, a bottom plate 272 connected to the bottom side of the main plate 271, and two extension plates 273 connected to the bottom side of the bottom plate 272.

[0019] In this embodiment, the bottom plate 272 is a plate that extends horizontally from the bottom side of the main plate 271, and each extension plate 273 is a plate that extends downward from the bottom side of the bottom plate 272.

[0020] The nozzle unit 3 is connected to the bottom side of the carrier plate 27. The nozzle unit 3 includes a nozzle seat body 31, two nozzles 32, and two auxiliary nozzles 33 fixed to the bottom plate 272.

[0021] In this embodiment, each nozzle 32 and each auxiliary nozzle 33 is a fan nozzle.

[0022] In variations of this embodiment, each nozzle 32 and each auxiliary nozzle 33 can be an empty cone nozzle, a full cone nozzle, a straight nozzle or an atomizing nozzle.

[0023] In this embodiment, each auxiliary nozzle 33 sprays liquid downwards, which may be the same liquid as that sprayed by nozzle 32 or a different liquid.

[0024] The nozzle seat body 31 is rotatably mounted between two extension plates 273 and receives the drug via a soft tube (not shown).

[0025] Each nozzle 32 is connected to the nozzle seat body 31 so as to communicate with the interior of the nozzle seat body 31. Each nozzle 32 receives a chemical agent through the nozzle seat body 31 and ejects the chemical agent toward the wafer 9.

[0026] In this embodiment, the agent is SC-1 solution (Standard Clean 1), SC-2 solution (Standard Clean 2), or other cleaning solution.

[0027] 4 and 5, each nozzle 32 is configured to surround and define an axis L1, which is the central axis of the nozzle 32. The axis L1 defines an included angle θ with the wafer 9. The included angle θ is greater than 0 degrees and less than 90 degrees, and corresponds to the rotation of the nozzle seat body 31 relative to the carrier plate 27, as shown in FIG.

[0028] Specifically, the nozzle seat body 31 is rotated relative to the carrier plate 27 by operation, and after each axis L1 defines an included angle θ with the wafer 9, the nozzle seat body 31 is fixed to the carrier plate 27 by operation again.

[0029] By defining the included angle θ, the nozzle 32 cleans the wafer 9 at an angle, making it easier to clean gaps in the wafer 9 .

[0030] The number of nozzles 32 and auxiliary nozzles 33 is not limited to two and can be adjusted as needed. In a variation of this embodiment, the number of nozzles 32 and auxiliary nozzles 33 can be one or three or more.

[0031] 2, 4, and 5, the laser unit 4 is connected to the left and right slide rails 23, and therefore, in this embodiment, can move in the forward and backward direction D1 in unison with the nozzle unit 3. The laser unit 4 also includes a laser mounting base 41 connected to the left and right slide rails 23, and a laser emitter 42 fixed to the laser mounting base 41.

[0032] The laser mounting base 41 has a fixed plate 411 fixed to the left and right slide rails 23, two connecting plates 412 rotatably connected to the fixed plate 411, and an attachment portion 413 rotatably connected to the connecting plates 412 on the side opposite to the fixed plate 411 side.

[0033] The mounting portion 413 is configured to define a mounting hole 414. Specifically, the mounting portion 413 is operated to swing to a predetermined position relative to the fixed plate 411 via the connecting plate 412, and then operated again to fix the fixed plate 411 to the left and right slide rails 23.

[0034] The laser emitter 42 is inserted into the mounting hole 414 and fixed to the mounting portion 413. In this embodiment, the laser emitter 42 is a red laser diode (semiconductor laser).

[0035] The laser unit 4 is for emitting laser light toward the wafer 9, and in order for an operator to inspect on-site, the point where the emitted laser light is irradiated on the wafer 9 overlaps with the point where the chemical sprayed from the nozzle 32 is on the wafer 9.

[0036] Since the laser unit 4 can move in the front-rear direction D1 in unison with the nozzle unit 3, the position of the nozzle unit 3 on the cleaning path in the front-rear direction D1 can be easily observed.

[0037] Explaining the cleaning process in more detail, as shown in FIG. 4, when a straight line parallel to the front-to-back direction D1 passes through the center of the carrier plate 27 and the laser unit 4, the laser light emitted from the laser unit 4 overlaps with the chemical agent just sprayed from the nozzle 32. Then, the carrier plate 27 moves along the left-to-right direction D2 together with the nozzle unit 3 to clean the wafer 9. When the nozzle unit 3 moves away from the straight line, the laser unit 4 does not move, so the laser light emitted from the laser unit 4 overlaps with the chemical agent just sprayed from the nozzle 32. After completing cleaning along the left-to-right direction D2, the nozzle unit 3 returns to the position on the straight line. The nozzle unit 3 then moves along the front-to-back direction D1 to the next cleaning position. At this time, the laser unit 4 can move in tandem with the nozzle unit 3 in the front-to-back direction D1, so that the area irradiated with the laser light during movement overlaps with the chemical agent just sprayed from the nozzle 32. Finally, when the nozzle unit 3 arrives at the next cleaning position, it again moves along the left-to-right direction D2 to clean the wafer 9. By repeating the above procedure, the wafer 9 can be cleaned gradually along the forward and backward direction D1, and the cleaning path can be easily observed because the laser unit 4 indicates the current position of the nozzle unit 3 in the forward and backward direction D1. In this embodiment, the straight line passes through the center of the wafer 9.

[0038] The photographing unit 5 is fixed to the nozzle unit 3 and is used to take photographs of the wafer 9 to generate multiple images. These images show the overlapping of the area where the laser light emitted from the laser unit 4 is irradiated onto the wafer 9 and the area where the chemical sprayed from the nozzle 32 is on the wafer 9, allowing the operator to check the cleaning process after cleaning.

[0039] In this embodiment, the images can form a moving image, that is, the photographing unit 5 can photograph a moving image.

[0040] In addition, when the nozzle unit 3 moves along the left-right direction D2, the photographing unit 5 can photograph the laser light emitted from the laser unit 4 as the nozzle unit 3 passes through the straight line, so that the operator can easily check the cleaning process after cleaning.

[0041] Therefore, whether inspecting on-site or checking after cleaning, the laser light emitted from the laser unit 4 indicates the position in the forward / backward direction D1 of the chemical sprayed from the nozzle 32, so the operator can more easily check the cleaning process of the wafer 9 using the laser light emitted from the laser unit 4.

[0042] According to the above configuration, this embodiment has the following advantages.

[0043] 1. The laser unit 4 is connected to the left and right slide rails 23, and the nozzle unit 3 is connected to the bottom side of the carrier plate 27. The laser unit 4 and the nozzle unit 3 move simultaneously in the forward and backward direction D1, and the laser light emitted from the laser unit 4 indicates the position of the chemical sprayed from the nozzle 32 in the forward and backward direction D1, making it easier to check the cleaning process of the wafer 9.

[0044] 2. The installation of the photographing unit 5 for photographing the wafer 9 and generating multiple images allows the operator to check the cleaning process of the wafer 9 after cleaning.

[0045] Therefore, the laser position checking and cleaning device of the present invention can more easily check the cleaning process of the wafer 9, and the object of the present invention can be reliably achieved.

[0046] The above-described embodiments are illustrative for explaining the principles and effects of the present invention, and are not intended to limit the present invention. Those skilled in the art may make slight changes or modifications to the above-described embodiments without departing from the spirit and scope of the present invention. Therefore, all changes and modifications made by those skilled in the art without departing from the gist of the present invention should be considered to fall within the scope of protection of the present invention. [Industrial Applicability]

[0047] The laser position confirmation and cleaning device of the present invention is suitable for cleaning wafers. [Explanation of symbols]

[0048] 1 base unit 11 Base body 111 holes 12 Vacuum suction section 2 Drive Unit 21 Front and rear slide rails 211 Rail 22 Front and rear slider set 221 Slider 23 Left and right slide rails 24 Left and right sliders 25 Up and down slide rail 26 Up and down slider 27 Carrier board 271 Main plate 272 Bottom plate 273 Stretched plate 3 nozzle unit 31 Nozzle seat body 32 nozzles 33 Auxiliary nozzle 4 laser unit 41 Laser installation seat 411 Fixed plate 412 Connecting plate 413 Mounting part 414 Mounting hole 42 Laser Launcher 5 Filming Unit 9 wafers D1 Forward and backward directions D2 Left and right directions D3 up and down direction L1 axis θ (angle)

Claims

1. Suitable for cleaning wafers, The apparatus includes a base unit, a drive unit, a nozzle unit, and a laser unit, the base unit is for restricting the position of the wafer; the drive unit includes a left-right slide rail, a left-right slider installed on the left-right slide rail so as to be slidable along a left-right direction, a vertical slide rail fixed to the left-right slider, a vertical slider installed on the vertical slide rail so as to be slidable along a vertical direction perpendicular to the left-right direction, and a carrier plate fixed to the vertical slider, The nozzle unit is connected to the bottom side of the carrier plate, and includes: a nozzle seat body; and at least one nozzle connected to the nozzle seat body for spraying a chemical toward the wafer; The laser unit is connected to the left and right slide rails and is used to emit laser light toward the wafer, and the point at which the emitted laser light is irradiated onto the wafer overlaps with the point at which the chemical sprayed from the nozzle is on the wafer. This laser position confirmation cleaning device is characterized by this.

2. 2. The laser position confirmation and cleaning apparatus according to claim 1, further comprising a photographing unit fixed to the nozzle unit and adapted to photograph the wafer and generate a plurality of images.

3. The laser locating and cleaning device of claim 1 , wherein the base unit includes a base body defining a plurality of holes, and a plurality of vacuum suction portions, each vacuum suction portion being disposed in one of the plurality of holes.

4. the drive unit further includes a front-rear slide rail and a front-rear slider set installed on the front-rear slide rail so as to be slidable along a front-rear direction perpendicular to the left-right direction and the up-down direction, 2. The laser position checking and cleaning device according to claim 1, wherein the left and right slide rails are fixed to the front and rear slider sets.

5. The carrier plate includes a main plate, a bottom plate connected to the bottom side of the main plate, and two extension plates connected to the bottom side of the bottom plate; The nozzle seat body is rotatably installed between the two extension plates, The nozzle is configured to surround and define an axis that is the axis center of the nozzle, 2. The laser location and cleaning apparatus of claim 1, wherein said axis defines an included angle with said wafer.

6. The nozzle unit further includes at least one auxiliary nozzle fixed to the bottom plate, 6. The laser position confirmation and cleaning apparatus according to claim 5, wherein the auxiliary nozzle is for spraying a chemical toward the wafer.

7. The laser unit includes a laser mounting base connected to the left and right slide rails, and a laser emitter fixed to the laser mounting base, The laser installation seat has a fixed plate fixed to the left and right slide rails, two connecting plates rotatably connected to the fixed plate, and an attachment portion rotatably connected to the connecting plates on the opposite side of the fixed plate side, the mounting portion is configured to define a mounting hole; 2. The laser position confirmation and cleaning device according to claim 1, wherein said laser emitter is inserted into said mounting hole and fixed to said mounting portion.

Images