Resin sealing device and resin sealing method

Abstract

To improve quality of a resin-molded molded article.SOLUTION: A resin sealing device (1) includes: a resin-sealing mold (21) having an upper mold (23) for holding workpiece (W), and a lower mold (22) having a cavity recess (25) opened toward the upper mold (23); a holding tool (78) for holding a functional member (H); a resin supply part (41) for supplying a liquid, granular or powdery resin (R) onto the functional member (H) held by the holding tool (78); a heating part (80) for heating the functional member (H), and the resin (R) supplied onto the functional member (H); and a loader hand (71) for conveying the resin (R) and the functional member (H) heated by the heating part (80) to the resin-sealing mold (21) through the holding tool (78), and setting the resin (R) and the functional member (H) on a film (F) arranged in the region including the cavity recess (25) of the lower mold (22).SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a resin sealing apparatus and a resin sealing method. [Background technology]

[0002] Resin sealing devices that resin-seal electronic components mounted on a substrate are known. Patent Document 1, for example, discloses an example of a resin sealing device, which includes a molding die that receives a film and a molding resin and performs molding, a dispenser that dispenses the molding resin onto the film, a loader that holds the film and the molding resin at a predetermined holding position and transports them to the molding die, and a heating unit that heats the molding resin dispensed onto the film between the predetermined holding position held by the loader and the dispenser. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-166720 Summary of the Invention [Problem to be solved by the invention]

[0004] According to the configuration of Patent Document 1, the molding resin dropped onto the film is preheated before being transported to the molding die, so the elongation rate of the film due to preheating differs between the resin contact area and the resin non-contact area of ​​the film, which can cause wrinkles in the film. Generally, if wrinkles occur in the film placed on the molding die, the resin can get into the wrinkled area, which can damage the reliability of the resin-sealed molded product.

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a resin sealing apparatus and a resin sealing method that can improve the quality of resin-sealed molded products. [Means for solving the problem]

[0006] A resin sealing apparatus according to one embodiment of the present invention is a resin sealing apparatus for resin sealing electronic components of a workpiece including a substrate and electronic components, and is equipped with a resin sealing mold having an upper mold for holding the workpiece and a lower mold having a cavity recess that opens toward the upper mold, a holding tool for holding a functional component, a resin supply unit for supplying liquid, granular, or powdered resin onto the functional component held by the holding tool, a heating unit for heating the functional component and the resin supplied onto the functional component, and a loader hand for transporting the resin and functional component heated by the heating unit to the resin sealing mold via the holding tool and setting them on a film arranged in an area including the cavity recess of the lower mold.

[0007] According to this embodiment, the resin and functional component can be heated before being placed on the film, and then transferred to the resin-sealing mold via the holding tool, thereby preventing defects such as wrinkles in the film and improving the quality of the resin-sealed molded product.

[0008] A resin sealing method according to another aspect of the present invention is a resin sealing method for resin-sealing electronic components of a workpiece including a substrate and electronic components, and includes supplying liquid, granular, or powdered resin onto a functional component held by a holding tool, heating the functional component and the resin supplied onto the functional component, transporting the resin and functional component to a resin sealing mold via the holding tool and setting them on a film arranged in an area including a cavity recess of the lower mold of the resin sealing mold, and resin-sealing the electronic component using the upper mold of the resin sealing mold that holds the workpiece and the lower mold on which the functional component and resin are provided on the film.

[0009] According to this embodiment, the resin and functional component can be heated before being placed on the film, and then transferred to the resin-sealing mold via the holding tool, thereby preventing defects such as wrinkles in the film and improving the quality of the resin-sealed molded product. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a resin sealing apparatus and a resin sealing method that can improve the quality of resin-sealed molded products. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a plan view schematically illustrating a configuration of a resin sealing apparatus according to an embodiment. [Figure 2] FIG. 2 is a plan view schematically showing a more detailed configuration of a first loader and a second loader. [Figure 3] 1 is a cross-sectional view schematically showing the configuration of a resin-sealing mold and a molded product. [Figure 4] FIG. 3 is a cross-sectional view schematically showing the configuration of a second loader hand. [Figure 5A] 1 is a flowchart showing an example of a resin sealing method using the resin sealing apparatus according to the present embodiment. [Figure 5B] 10 is a flowchart showing an example of a conveying process of a functional member H according to the present embodiment. [Figure 6] 10A and 10B are diagrams showing a process of adsorbing a film onto a molding surface. [Figure 7] FIG. 10 is a diagram showing a process of setting a workpiece on an upper die. [Figure 8] 10A and 10B are diagrams showing a process of setting a resin guard on a functional component. [Figure 9] 10A and 10B are diagrams illustrating a process of supplying resin onto a functional member. [Figure 10] 10A and 10B are diagrams showing a process of heating the resin with a resin heater and a process of removing the resin guard. [Figure 11] 10A to 10C are diagrams showing a process of transporting resin and functional components to a resin sealing mold; [Figure 12] 10A and 10B are diagrams showing a process of setting a resin and a functional component in a resin sealing mold. [Figure 13] FIG. 10 is a diagram showing a mold clamping process. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of each embodiment are merely examples, and the dimensions and shapes of each part are schematic, so the technical scope of the present invention should not be interpreted as being limited to the embodiment.

[0013] <Resin sealing equipment> The configuration of a resin sealing apparatus 1 according to an embodiment of the present invention will be described with reference to Figs. 1 to 4. Fig. 1 is a plan view schematically showing the configuration of a resin sealing apparatus according to one embodiment. Fig. 2 is a plan view schematically showing a more detailed configuration of a loader hand. Fig. 3 is a cross-sectional view schematically showing the configuration of a resin sealing mold and a molded product. Fig. 4 is a cross-sectional view schematically showing the configuration of a second loader hand.

[0014] 1 and 2 show the layout as viewed from above. Each drawing is conveniently labeled with directions (front, back, left, right, top, bottom) to clarify the relationship between the drawings and to help understand the positional relationship of each component.

[0015] The resin sealing apparatus 1 is a manufacturing device that melts resin R onto a workpiece W including a substrate S and electronic components P to resin-encapsulate the electronic components P and produce a molded product M. The resin sealing apparatus 1 also molds resin R onto a functional component H along with the workpiece W. The functional component H is, for example, a plate-shaped component and is exposed on the side opposite to the side on which the substrate S of the molded product M is exposed. The substrate S may be, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, a semiconductor substrate, etc. The electronic component P may be, for example, a semiconductor element such as an IC chip, but is not limited thereto, and may also be various active elements, passive elements, MEMS devices, etc. The functional component H may be, for example, a heat dissipation component that dissipates heat generated by the electronic component P or a shielding component that blocks electromagnetic waves, but is not limited thereto. The resin R may be, for example, a granular thermosetting resin. The form of the resin R is not limited to the above and may be liquid or powder.

[0016] The resin sealing apparatus 1 according to this embodiment is a compression type resin sealing apparatus. Alternatively, the resin sealing apparatus according to one embodiment of the present invention is not limited to the above, and may be a transfer type resin sealing apparatus.

[0017] 1, the resin sealing apparatus 1 includes a workpiece supply unit 10, a resin supply unit 40, a functional material supply unit 50, resin molding units 20 and 30, a molded product recovery unit 90, a first loader 60, and a second loader 70. The workpiece supply unit 10, the resin supply unit 40, the resin molding units 20 and 30, and the molded product recovery unit 90 are arranged side by side in the left-right direction. The resin supply unit 40 and the functional material supply unit 50 are arranged side by side in the front-rear direction.

[0018] The work supply unit 10 supplies the work W to the first loader hand 61 of the first loader 60. The work supply unit 10 includes a work storage section 11, a work transfer section 13, a work preheating section 15, and a work supply control panel 19. When viewed from above as shown in FIG. 1 , the work supply unit 10 is disposed at the left end of the resin sealing apparatus 1, for example.

[0019] The work storage unit 11 stores a plurality of workpieces W and delivers the workpieces W sequentially. For example, the work storage unit 11 is equipped with a plurality of workpiece magazines and a workpiece elevation. The workpiece magazine set in the work storage unit 11 stores a plurality of workpieces W stacked vertically. The workpiece elevation adjusts the position of the workpiece magazine in order to deliver the workpieces W to the workpiece delivery unit 13.

[0020] The workpiece transfer section 13 transfers the workpiece W received from the workpiece storage section 11 to the workpiece preheating section 15. For example, the workpiece transfer section 13 is provided with a workpiece index that receives and aligns the workpiece W sent out by the workpiece storage section 11, and a workpiece pick and place that transfers the workpiece W aligned by the workpiece index to the workpiece preheating section 15.

[0021] The workpiece preheating section 15 preheats the workpiece W received from the workpiece transfer section 13 and transfers it to the first loader hand 61 of the first loader 60. Preheating the workpiece W before it is transported to the resin molding units 20, 30 suppresses deformation of the workpiece W due to a sudden temperature change inside the resin sealing molds 21, 31. For example, the workpiece preheating section 15 is provided with a preheat rail that heats the workpiece W from its end. The workpiece preheating section 15 may also be provided with a hot plate that heats the entire surface of the workpiece W. Alternatively, the workpiece preheating section 15 may not be provided, and a configuration in which preheating is not performed may be adopted.

[0022] The work supply control panel 19 is a control panel for controlling the operation of the work supply unit 10. When viewed from above as shown in FIG. 1, the work supply control panel 19 is disposed on the front side of the work supply unit 10. For example, the work supply control panel 19 is provided with a display unit that displays the control parameters of the work supply unit 10, and an input unit for inputting the control parameters of the work supply unit 10.

[0023] The work supply unit 10 may further include a volume measuring unit that measures the volume of the work W, an appearance inspection unit that inspects the appearance of the work W, and the like.

[0024] The molded product recovery unit 90 recovers the molded products M from the first loader hand 61 of the first loader 60. The molded product recovery unit 90 includes a molded product receiving section 91, a molded product delivery section 93, and a molded product storage section 95. When viewed from above as shown in FIG. 1 , the molded product recovery unit 90 is disposed, for example, at the right end of the resin sealing apparatus 1. The molded product recovery unit 90 is disposed on the opposite side of the resin molding units 20 and 30 from the workpiece supply unit 10 in the left-right direction, but this is not limitative. The molded product recovery unit 90 may also be disposed on the same side of the resin molding units 20 and 30 as the workpiece supply unit 10 in the left-right direction.

[0025] The molded product receiving section 91 delivers the molded product M received from the first loader hand 61 of the first loader 60 to the molded product delivery section 93. For example, the molded product receiving section 91 is provided with a cooling pallet for cooling the molded product M. Alternatively, a configuration may be adopted in which no cooling pallet is provided and no cooling is performed.

[0026] The molded product delivery section 93 delivers the molded products M received from the molded product receiving section 91 to the molded product storage section 95. For example, the molded product delivery section 93 is provided with a molded product index that receives and aligns the molded products M sent out by the molded product receiving section 91, and a molded product pick and place that delivers the molded products M aligned by the molded product index to the molded product storage section 95.

[0027] The molded product storage section 95 receives and stores the molded products M. For example, the molded product storage section 95 is provided with a plurality of molded product magazines and a molded product elevation. The molded product magazine set in the molded product storage section 95 stores a plurality of molded products M stacked vertically. The molded product elevation adjusts the position of the molded product magazine in order to receive the molded products M from the molded product delivery section 93.

[0028] The molded product recovery unit 90 may further include a volume measurement unit that measures the volume of the molded product M, an appearance inspection unit that inspects the appearance of the molded product M, etc. When the resin sealing apparatus according to one embodiment of the present invention is a transfer type resin sealing apparatus, the molded product recovery unit may include a degating unit that separates unnecessary resin called cull or liner from the molded product M, a scrap box for collecting the separated unnecessary resin, etc.

[0029] The resin molding unit 20 molds a resin R onto the workpiece W and the functional component H. The resin molding unit 20 includes a resin sealing mold 21, a film handler 27, and a resin molding control panel 29. When viewed from above as shown in FIG. 1, the resin molding unit 20 is connected to the right side of the workpiece supply unit 10, for example.

[0030] The resin sealing mold 21 is a pair of openable and closable molds that fill an internal cavity 25 with resin R to form a mold. The resin sealing mold 21 comprises a lower mold 22 and an upper mold 23. The surface of the upper mold 23 facing the lower mold 22 is flat, and the cavity 25 is formed on the surface of the lower mold 22 facing the upper mold 23 (hereinafter referred to as the "molding surface"). In other words, the resin sealing mold 21 is a compression molding mold with a so-called movable lower cavity structure. The cavity 25 is a recess that opens toward the upper mold 23, and corresponds to an example of a "cavity recess" according to the present invention.

[0031] The lower mold 22 includes a lower plate 22A, a cavity piece 22B, a clamper 22C, and an urging member 22D. The cavity piece 22B is fixedly attached to the upper surface of the lower plate 22A (the surface facing the upper mold 23). The clamper 22C is configured in a frame shape to surround the cavity piece 22B. The clamper 22C is attached to the lower plate 22A via the urging member 22D so as to be movable up and down. The cavity piece 22B forms the bottom surface of the cavity 25, and the clamper 22C forms the side surface of the cavity 25. The lower mold 22 is provided with suction holes 22E and 22F that penetrate the clamper 22C, and a suction hole 22G that penetrates the lower plate 22A and the cavity piece 22B. The suction hole 22E opens to the upper surface of the clamper 22C. Suction hole 22F opens on the inner surface of clamper 22C facing cavity piece 22B. A seal member (not shown) is inserted below suction hole 22F. Suction hole 22G opens on the upper surface of cavity piece 22B, i.e., the bottom surface of cavity 25. Suction holes 22E, 22F, and 22G are suction holes for sucking film F set in lower mold 22.

[0032] The upper mold 23 includes an upper plate 23A and a cavity plate 23B. The cavity plate 23B is fixedly assembled to the lower surface (the surface on the lower mold 22 side) of the upper plate 23A. The upper mold 23 is provided with suction holes 23C that penetrate the upper plate 23A and the cavity plate 23B. The suction holes 23C open to the lower surface of the cavity plate 23B. The suction holes 23C are suction holes for sucking the workpiece W set in the upper mold 23.

[0033] The film handler 27 supplies film F to the resin sealing mold 21. Film F is a release film that prevents resin R from penetrating into the gaps in the lower mold 22 and facilitates the release of the molded product M from the lower mold 22. The film handler 27 includes an unwinding section that supplies unused film F and a winding section that collects used film F. The film handler 27 corresponds to an example of a film supplying section. Suitable materials for film F include polymeric materials with excellent heat resistance, ease of release, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene-ethylene copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), PET (polyethylene terephthalate), PP (polypropylene), and PVDC (polyvinylidine chloride). The material for film F is not limited to the above, and may be, for example, fluorine-impregnated glass cloth. The thickness of film F is appropriately selected depending on the physical properties of the material, and is, for example, approximately 50 μm. The shape of the film F is not limited to a roll, but may be a strip.

[0034] The resin molding control panel 29 is a control panel for controlling the operation of the resin molding unit 20. When viewed from above as shown in FIG. 1, the resin molding control panel 29 is disposed in front of the resin molding unit 20. For example, the resin molding control panel 29 is provided with a display unit that displays the control parameters of the resin molding unit 20 and an input unit that inputs the control parameters of the resin molding unit 20.

[0035] The resin molding unit 30 includes a resin sealing mold 31, a film handler 37, and a resin molding control panel 39. When viewed from above as shown in Fig. 1, the resin molding unit 30 is connected to, for example, the left side of the molded product recovery unit 90. Note that the configuration of the resin molding unit 30 is the same as the configuration of the resin molding unit 20, so a description of the resin sealing mold 31, the film handler 37, and the resin molding control panel 39 will be omitted.

[0036] At least some of the functions of the resin molding control panels 29, 39 may be integrated into the workpiece supply control panel 19. For example, the control parameters of the resin molding units 20, 30 may be displayed on the display unit of the workpiece supply control panel 19, and the control parameters of the resin molding units 20, 30 may be input into the input unit of the workpiece supply control panel 19. When all of the functions of the control panels of the respective units are integrated into the workpiece supply control panel 19, the resin molding control panels 29, 39 may be omitted.

[0037] The functional component supply unit 50 supplies the functional component H to the holding tool 78. The functional component supply unit 50 includes a functional component storage section 51 and a functional component delivery section 53. In plan view as shown in FIG. 1, the functional component supply unit 50 is connected to the front side of the resin supply unit 40. In other words, the functional component supply unit 50 is disposed on the front side of the resin sealing apparatus 1. Here, the front side of the resin sealing apparatus 1 is the side on which the workpiece supply control panel 19 and the resin molding control panels 29, 39 are disposed in the front-rear direction. The functional component supply unit 50 is disposed alongside the workpiece supply control panel 19 and the resin molding control panels 29, 39 in the left-right direction. The functional component supply unit 50 is disposed on the opposite side of the resin supply section 41 when viewed from a first guide section 60R described later.

[0038] The functional component storage section 51 stores a plurality of functional components H and sequentially delivers the functional components H. For example, the functional component storage section 51 is equipped with a plurality of functional component magazines and a functional component elevation. The functional component magazine set in the functional component storage section 51 stores a plurality of functional components H stacked vertically. The functional component elevation adjusts the position of the functional component magazine in order to deliver the functional components H to the functional component delivery section 53.

[0039] The functional component delivery section 53 delivers the functional component H received from the functional component storage section 51 to the holding tool 78. For example, the functional component delivery section 53 receives the functional component H sent out by the functional component storage section 51, aligns it, and delivers it to the holding tool 78. At this time, the functional component H may be picked up by a chucking function provided in the holding tool 78. Also, the holding tool 78 does not need to directly pick up the functional component H; the second loader hand 71 may be provided with a suction or chucking function to pick up the functional component H and then deliver it to the holding tool 78.

[0040] The functional member supply unit 50 may further include a volume measuring section for measuring the volume of the functional member H, an appearance inspection section for inspecting the appearance of the functional member H, a functional member preheating section for preheating the functional member H, and the like.

[0041] The resin supply unit 40 supplies granular resin R onto the functional member H. When viewed from above as shown in FIG. 1, the resin supply unit 40 is connected to the right side of the resin molding unit 20 and to the left side of the resin molding unit 30. The resin supply unit 40 includes a resin supply section 41 and a resin heater 80.

[0042] The resin supply unit 41 supplies the resin R onto the functional component H held by the holding tool 78. The resin supply unit 41 includes a hopper 42 and a feeder 43, as will be described later with reference to FIG. 9, for example. The hopper 42 corresponds to an example of a resin storage unit that stores the resin R. The feeder 43 corresponds to an example of a resin supply unit that feeds the resin R received from the hopper 42. When the resin is liquid, the resin supply unit may include a syringe that stores the resin, a piston that pushes out the resin, and a pinch valve that opens and closes the tip of the syringe.

[0043] The resin heater 80 heats the functional member H and the resin R supplied onto the functional member H. The resin heater 80 corresponds to an example of a "heating unit" according to the present invention. The resin heater 80 is, for example, a supply stage on which the holding tool 78 transported by the second loader hand 71 is placed, and corresponds to an example of a support unit that supports the holding tool 78 after the resin supply unit 41 supplies the resin R onto the functional member H. In other words, the resin heater 80 is configured as both a heating unit and a support unit, for example. As a heat source for the resin heater 80, for example, a known heating mechanism such as an electric wire heater or an infrared heater is used.

[0044] In the resin supply unit 40, a resin guard 44 (described later) is preferably disposed inside the holding tool 78. Alternatively, the resin guard 44 does not necessarily have to be disposed inside the holding tool 78. The resin guard 44 is configured in a frame shape along the outer shape of the functional component H and is used as a frame that defines the area in which the resin R is dispersed. The resin guard 44 corresponds to an example of a "resin guide portion" according to the present invention. For example, the resin guard 44 is attached to the holding tool 78 before the resin R is supplied and removed from the holding tool 78 after the resin R is heated. Since the resin guard 44 functions as a guide for dropping the resin, it is mounted overlapping along the outer edge of the functional component H. Therefore, it is preferable that the frame portion of the resin guard 44 be thin. By using such a resin guard 44, the resin can be distributed up to the area near the edge of the functional component H. In other words, by thinning the resin guard 44, the resin R can be supplied to almost the entire surface of the functional component H. This makes it possible to make the thickness of the resin R on the functional component H uniform and minimize resin flow during molding, thereby further improving the quality of the molded product. However, if the holding tool 78 can be used as a frame that defines the area in which the resin R is dispersed, the resin guard 44 may be omitted.

[0045] The resin supply unit 40 may further include a weight measuring unit that measures the weight of the resin R, a vibration unit that disperses the resin R by vibration, and an inspection unit that inspects the degree of dispersion of the resin R.

[0046] The first loader 60 transports the workpiece W from the workpiece supply unit 10 to the resin molding units 20 and 30. The first loader 60 is configured to be movable along a first guide portion 60R. The first guide portion 60R extends in the left-right direction across the workpiece supply unit 10, the resin molding units 20 and 30, the resin supply unit 40, and the molded product recovery unit 90. When viewed from above as shown in FIG. 1, the first guide portion 60R is provided, for example, behind the resin sealing molds 21 and 31 and in front of the resin supply portion 41. In the configuration example shown in FIG. 1, the first loader 60 transports the molded product M from the resin molding units 20 and 30 to the molded product recovery unit 90. However, a molded product recovery loader other than the first loader 60 may be provided to transport the molded product M.

[0047] As shown in FIG. 2, the first loader 60 includes a first loader hand 61, a first base 62, and a first guide rod 63.

[0048] The first loader hand 61 is configured to be able to advance and retreat from the rear of the resin sealing mold 21. The first loader hand 61 holds the workpiece W or the molded product M. The first loader hand 61 has, for example, an L-shaped opening and closing claw that supports the underside of the workpiece W or the molded product M, but is not limited to this. The first loader hand 61 may adsorb the workpiece W or the molded product M by electrostatic force, or may adsorb the workpiece W or the molded product M by suction and exhaust.

[0049] As shown in FIG. 2, the first base 62 is connected to the first guide portion 60R so as to be movable in the left-right direction, but movement in the front-rear direction is restricted.

[0050] 2, the first guide rod 63 is connected to the first base 62 and supports the first loader hand 61. The first guide rod 63 is configured to be extendable and contractible in the front-rear direction, and moves the first loader hand 61 in the front-rear direction.

[0051] As an example, after receiving the workpiece W at the workpiece transfer section 13, the first loader hand 61 is transported rightward by the first base 62 and moves to a position facing the resin sealing mold 21 in the front-to-rear direction. Next, while holding the workpiece W, the first loader hand 61 advances into the resin sealing mold 21 from the rear by extending the first guide rod 63. That is, the first loader hand 61 loads the workpiece W into the resin sealing mold 21. After delivering the workpiece W to the upper mold 23 of the resin sealing mold 21, the first loader hand 61 moves rearward of the resin sealing mold 21 by contracting the first guide rod 63. After the molded product M is molded and the resin sealing mold 21 is opened, the first loader hand 61 unloads the molded product M from the resin sealing mold 21 by performing the same operation as when the workpiece W was loaded. Then, the first loader hand 61 is transported rightward by the first base 62 and delivers the molded product M at the molded product receiving section 91.

[0052] The second loader 70 transports the resin R and the functional component H. The second loader 70 is configured to be movable along a second guide portion 70R. The second guide portion 70R is provided, for example, in the resin supply unit 40 and extends in the front-rear direction. When viewed from above as shown in FIG. 1, the second guide portion 70R intersects, for example, with the first guide portion 60R.

[0053] As shown in FIG. 2, the second loader 70 includes a second loader hand 71, a second base 72, and a second guide rod 73.

[0054] The second loader hand 71 is configured to be able to advance and retreat from the right side relative to the resin sealing mold 21. As shown in FIG. 4, the second loader hand 71 includes a pressing member 75 and an expandable member 76, such as a cylinder or a linear motor. The second loader hand 71 is also configured to be able to detachably mount a holding tool 78. As shown in FIG. 4, the holding tool 78 is, for example, connected to the second loader hand 71 at one end and has a chuck portion 79 at the other end that holds at least a portion of the outer edge of the functional component H. The chuck portion 79 is, for example, an opening / closing claw that supports the underside of the functional component H. For example, the holding tool 78 is configured in a frame shape that conforms to the outer shape of the functional component H, and the chuck portion 79 is configured to hold the entire outer periphery of the functional component H. The pressing member 75 may be omitted.

[0055] When transferring the resin R and the functional component H to the lower mold 22, the pressing member 75 presses the resin R and the functional component H against the film F adsorbed in the cavity recess of the lower mold 22. The expandable member 76 is configured to be expandable and contractible in the vertical direction, and moves the pressing member 75 in the vertical direction. As a modified example, the second loader hand 71 may be configured without the pressing member 75 and the expandable member 76.

[0056] As shown in FIG. 2, the second base 72 is configured to be movable in the front-to-rear direction relative to the second guide portion 70R, but it is not limited to movement in the front-to-rear direction and may be configured to be movable in the left-to-right direction.

[0057] 2, the second guide rod 73 is connected to the second base 72 and supports the second loader hand 71. The second guide rod 73 is configured to be extendable and rotatable from the point where it is connected to the second base 72. As a result, the second guide rod 73 moves the second loader hand 71 in the front-to-back or left-to-right directions, and also rotates the second loader hand 71 around the second base 72.

[0058] As an example, the second loader hand 71 transports the holding tool 78 to the functional component delivery section 53. After receiving the functional component H by the holding tool 78 at the functional component delivery section 53, the second loader hand 71 is transported backward by the second base 72 and transports the functional component H via the holding tool 78 to position P2 behind the functional component delivery section 53. Next, the second loader hand 71 moves to position P1 in front of the resin supply section 41 by rotating the second guide rod 73. Next, the second loader hand 71 moves to the resin supply section 41 by extending the second guide rod 73. At the resin supply section 41, the second loader hand 71 releases the holding tool 78. A resin guard 44 is set inside the released holding tool 78. Then, after receiving the resin R on the functional component H and inside the resin guard 44, the functional component H and the resin R are heated, and the resin guard 44 is removed after heating. Thereafter, the second loader hand 71 picks up the holding tool 78 again and returns to position P1 by contracting the second guide rod 73. Next, the second loader hand 71 moves to position P3 to the right of the resin sealing mold 21 by pivoting the second guide rod 73. Next, while holding the resin R and the functional component H via the holding tool 78, the second loader hand 71 advances into the resin sealing mold 21 from the right by extending the second guide rod 73. That is, the second loader hand 71 delivers the resin R and the functional component H into the resin sealing mold 21 via the holding tool 78. After delivering the resin R and the functional component H to the resin sealing mold 21, the second loader hand 71 moves to the right of the resin sealing mold 21 by contracting the second guide rod 73.

[0059] In this way, if the second loader hand 71 can move from the resin supply unit 40 to the functional component delivery section 53 by extending and contracting the second guide rod 73, the functional component supply unit 50 can be added without extending the second guide section 70R to the functional component supply unit 50.

[0060] It should be noted that the mechanism for rotating the second guide rod 73 may be omitted from the second loader 70. In this case, for example, the second guide portion 70R may extend in the front-rear direction from the resin supply unit 40 to the functional component supply unit 50, and the second loader hand 71 may move between the resin supply portion 41 and the functional component delivery portion 53 by the second base 72.

[0061] The first loader 60 and the second loader 70 operate in the same manner with respect to the resin sealing mold 31 of the resin molding unit 30 as they do with respect to the resin sealing mold 21 of the resin molding unit 20. Therefore, a description of the operations of the first loader 60 and the second loader 70 with respect to the resin sealing mold 31 will be omitted. However, the operation of the second loader 70 with respect to the resin sealing mold 31 is the left-right reverse of the operation of the second loader 70 with respect to the resin sealing mold 21.

[0062] Note that either the resin molding unit 20 or the resin molding unit 30 may be omitted. That is, only one resin molding unit may be provided, and one resin supply unit may supply resin to one resin molding unit. Also, three or more resin molding units may be provided. In this case, two or more resin supply units may be provided. For example, two resin molding units and a resin supply unit provided between the two resin molding units to supply resin to the two resin molding units may be considered as one unit group, and multiple unit groups may be arranged side by side in the left-right direction.

[0063] The first loader 60 according to this embodiment functions as a work loader that loads the workpiece W into the resin sealing molds 21, 31, and also functions as a molded product unloader that unloads the molded product M from the resin sealing molds 21, 31; however, the function of the first loader 60 may be limited to that of a work loader. That is, the resin sealing apparatus may further include a third loader as a molded product unloader. Such a third loader may share a transport path with the first loader and be configured to be movable along the first guide unit, for example. The resin sealing apparatus may also include a third guide unit for transporting the third loader.

[0064] In this embodiment, the workpiece W and the molded product M are transported between the units by the first loader 60, but this is not limited to this. For example, the workpiece preheating unit and the molded product receiving unit may be configured to be movable left and right along the first guide unit. Specifically, the workpiece preheating unit may transport the workpiece from the workpiece supply unit to the resin molding unit and hand over the workpiece to a loader provided in the resin molding unit. Alternatively, the molded product receiving unit may receive the molded product from the loader in the resin supply unit and transport the molded product from the resin molding unit to the molded product recovery unit. If the resin sealing apparatus includes multiple resin molding units, such a loader may be provided in each of the multiple resin molding units.

[0065] In this embodiment, the resin heater 80 serves both as a support unit that supports the holding tool 78 after supplying the resin R and as a heating unit that heats the supplied resin R. However, the heating unit may be provided separately from the support unit. In this case, the heating unit may be provided below or above the support unit. The holding tool may be configured to be movable relative to the heating unit, or the heating unit may be configured to be movable relative to the holding tool. In this case, the support unit may be, for example, a guide rail that slidably supports the holding tool, or a movable stage. For example, in a planar layout, the heating unit may be provided between the resin supply unit and the position where the second loader hand picks up the holding tool.

[0066] In addition, the resin sealing device 1 heats the resin R and functional component H in the holding tool 78 with the resin heater 80, then removes the resin guard 44 and picks up the holding tool 78 with the second loader hand 71, but this is not limited to this.

[0067] In this embodiment, the second loader hand 71 and the holding tool 78 are configured to be separable, and an example will be described in which the second loader hand 71 transports the resin R and the functional component H together with the holding tool 78 to the resin sealing mold 21, but this is not limiting. For example, the second loader hand may transport the functional component H, on which the resin R is placed, to the resin sealing mold while directly holding it. In this case, the second loader hand itself may have a chuck for holding the functional component H.

[0068] <Resin sealing method> Next, a resin sealing method will be described with reference to FIGS. 5 to 13. FIG. 5A is a flowchart illustrating an example of a resin sealing method using the resin sealing apparatus according to this embodiment. FIG. 5B is a flowchart illustrating an example of a process for transporting a functional component H according to this embodiment. FIG. 6 is a diagram illustrating a process for setting a film F on a molding surface. FIG. 7 is a diagram illustrating a process for setting a workpiece W on the upper mold 23. FIG. 8 is a diagram illustrating a process for providing a resin guard 44 on the functional component H. FIG. 9 is a diagram illustrating a process for supplying resin R onto the functional component H. FIG. 10 is a diagram illustrating a process for heating resin R with a resin heater 80 and a process for removing the resin guard 44. FIG. 11 is a diagram illustrating a process for transporting resin R and functional component H to the resin sealing mold 21. FIG. 12 is a diagram illustrating a process for setting resin R and functional component H in the resin sealing mold 21. FIG. 13 is a diagram illustrating a mold clamping process. Note that the resin sealing mold 21 of the resin molding unit 20 will be described as an example, and a description of the resin sealing mold 31 of the resin molding unit 30, which operates in a similar manner, will be omitted.

[0069] First, the film F is set on the molding surface (S10).

[0070] 6, film F is supplied to lower mold 22 by film handler 27. Next, film F is sucked onto the molding surface by suction through suction holes 22E, 22F, and 22G of lower mold 22. Film F continuously covers the area from cavity piece 22B to clamper 22C, closing the gap between cavity piece 22B and clamper 22C.

[0071] Next, the workpiece W is set on the upper die 23 (S20).

[0072] As shown in FIG. 7, first, the first loader hand 61 holding the workpiece W is advanced into the resin sealing mold 21. Next, the workpiece W is handed over to the upper mold 23. At this time, the workpiece is held by suction through the suction holes 23C provided in the upper mold 23. In addition, to prevent poor suction due to warping of the workpiece W, a chucking function (not shown) provided in the upper mold 23 may be used to clamp the workpiece between the upper mold and the suction of the workpiece W. Furthermore, the first loader hand 61 has the function of moving the workpiece W upward from the bottom surface and pressing it against the bottom surface of the upper mold (not shown).

[0073] Next, the resin and the functional member are heated (S30). Details of step S30 include steps S31 to S36 as follows (see FIG. 5B).

[0074] First, a functional component H is set on a holding tool 78 (S31). At this time, the chuck portion 79 at the bottom of the holding tool 78 is closed, so the functional component H is held. Next, the holding tool 78 holding the functional component H is transported to the resin supply unit 41. Thereafter, as shown in FIG. 8, the holding tool 78 is set on a vibration table 77 (vibration is not activated at this point). Then, a resin guard 44 is set on the functional component H inside the set holding tool 78 (S32). Then, as shown in FIG. 9, resin R is supplied via a hopper 42 and a feeder 43 into the recess surrounded by the resin guard 44 and the functional component H (S33). Thereafter, the resin R is vibrated by the vibration table 77 and leveled to a substantially uniform resin height (S34). Note that, although the vibration table 77 has a vibration function in the examples shown in FIGS. 8 and 9, a vibration unit may be provided separately from the table. Alternatively, the step of vibrating the resin R may be omitted. Thereafter, the resin R is heated by the resin heater 80 (S35). The resin heater 80 may heat the resin R from above. In this case, the resin may be heated on the vibration table 77. The heating temperature of the resin is preferably 90°C or less. After the resin is heated, the resin guard 44 is removed (S36), as shown in FIG. 10.

[0075] Next, the resin R and the functional member H are set in the lower mold 22 (S40).

[0076] Specifically, as shown in FIG. 11 , the second loader hand 71 transports and sets the functional component H and resin R held by the holding tool 78 to the resin sealing mold 21. After transporting them to the resin sealing mold 21, as shown in FIG. 12 , the expandable member 76 provided on the second loader hand 71 is extended, and the pressing member 75 presses the functional component H and resin R against the cavity recesses of the lower mold 22. At this time, the chuck portion 79 provided on the holding tool 78 may be configured to open in response to the pressure from the pressing member 75, or the chuck portion 79 may be opened and closed by a separately driven opening and closing mechanism. Alternatively, after the chuck portion 79 opens and delivers the functional component H and resin R to the lower mold 22, the expandable member 76 may expand and contract, and the pressing member 75 may press the functional component H and resin R against the cavity recesses of the lower mold 22. After the resin R and functional component H are delivered to the lower mold 22, the expandable member 76 is contracted, and the pressing member 75 is separated from the lower mold 22. The expandable member 76 and the pressing member 75 are not necessarily required, and may fall naturally under their own weight. When the pressing member 75 returns to its original position, the second loader hand 71 retreats from the resin sealing mold 21.

[0077] Finally, the resin R is molded (S50). 13, the resin sealing mold 21 is clamped, and the resin R is heated while being pressed by the lower mold 22 and the upper mold 23. Once the resin R has hardened, the mold is opened, and the molded product M is carried out by the first loader hand 61.

[0078] As described above, according to the resin sealing apparatus 1 of one embodiment of the present invention, the resin sealing apparatus seals electronic components of a workpiece including a substrate and electronic components with resin, and includes a resin sealing mold having an upper mold for holding the workpiece and a lower mold having a cavity recess that opens toward the upper mold, a holding tool for holding a functional component, a resin supply unit for supplying liquid, granular, or powdered resin onto the functional component held by the holding tool, a heating unit for heating the functional component and the resin supplied onto the functional component, and a loader hand for transporting the resin and functional component heated by the heating unit to the resin sealing mold via the holding tool and setting them on a film arranged in an area including the cavity recess of the lower mold.

[0079] This allows the resin and functional components to be heated before being placed on the film, and then transported to the resin-sealing mold via a holding tool, thereby preventing problems such as wrinkles in the film and the risk of dust flying around, and ultimately improving the quality of the resin-sealed molded product.

[0080] In the above aspect, a vibrating unit that vibrates the functional member and the resin supplied onto the functional member may be further provided.

[0081] In the above aspect, the holding tool may further include a resin guard (resin guide portion) that is configured in a frame shape along the outer shape of the functional component, is positioned inside the holding tool, and regulates the supply area of ​​the resin supplied onto the functional component.

[0082] In the above aspect, the resin guard (resin guide portion) may be configured to be detachable from the holding tool.

[0083] According to this aspect, the resin guide portion limits the resin supply range, thereby preventing the resin from adhering to the holding tool, and the resin and functional component can be smoothly transported into the resin sealing mold when the pressing member is pressed.

[0084] In the above aspect, the holding tool may have a chuck portion that holds at least a part of the outer edge of the functional component.

[0085] According to this aspect, it is possible to prevent the load from falling.

[0086] In the above aspect, the chuck portion may hold the entire periphery of the outer edge portion of the functional member.

[0087] In the above aspect, the functional member may be a heat dissipation member or a shielding member.

[0088] A resin sealing method according to another aspect of the present invention is a resin sealing method for resin-sealing electronic components of a workpiece including a substrate and electronic components, and includes supplying liquid, granular, or powdered resin onto a functional component held by a holding tool, heating the functional component and the resin supplied onto the functional component, transporting the resin and functional component to a resin sealing mold via the holding tool and setting them on a film arranged in an area including a cavity recess of the lower mold of the resin sealing mold, and resin-sealing the electronic component using the upper mold of the resin sealing mold that holds the workpiece and the lower mold on which the functional component and resin are provided on the film.

[0089] According to this embodiment, the resin and functional component can be heated before being placed on the film, and then transferred to the resin-sealing mold via the holding tool, thereby preventing defects such as wrinkles in the film and improving the quality of the resin-sealed molded product.

[0090] In the above aspect, the method may further include, after supplying the resin, vibrating the functional member and the resin supplied onto the functional member.

[0091] In the above aspect, heating the functional member and the resin supplied onto the functional member may include setting a resin guide portion before heating and removing the resin guide portion after heating.

[0092] The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangement, materials, conditions, shapes, sizes, etc., are not limited to those illustrated and can be modified as appropriate. Furthermore, configurations shown in different embodiments can be partially substituted or combined with each other. [Explanation of symbols]

[0093] 1...Resin sealing equipment 10...Work supply unit 20, 30...Resin molding unit 21,31…Resin sealing mold 25,35…cavity 27,37...Film handler 40...Resin supply unit 44...Resin guard 50...Functional component supply unit 60...First loader 61...1st Loader Hand 66...Expandable member 67...Pressing member 68...Protrusion 70...Second loader 71...2nd Loader Hand 75...Pressing member 76...Expandable member 80...Resin heater 90...Molded product recovery unit W…Work P…Electronic parts S...Base material R…Resin H...functional components F...Film

Claims

1. A resin sealing apparatus for sealing electronic components in a workpiece including a substrate and electronic components with resin, a resin sealing mold having an upper mold for holding the workpiece and a lower mold having a cavity recess that opens toward the upper mold; a holding tool for holding a functional member on which no electronic component is mounted; a resin supply unit that supplies a liquid, granular, or powdered resin onto the functional component held by the holding tool; a heating unit that heats the functional member and the resin supplied onto the functional member; a loader hand that transports the resin and the functional component heated by the heating unit to the resin sealing mold via the holding tool and sets them on a film arranged in an area including the cavity recess of the lower mold; A resin sealing device comprising:

2. The present invention further includes a vibration unit that vibrates the functional member and the resin supplied onto the functional member. The resin sealing apparatus according to claim 1

3. The holding tool is configured in a frame shape along the outer shape of the functional component, a resin guide portion disposed inside the holding tool and regulating a supply area of ​​the resin supplied onto the functional component; The resin sealing device according to claim 1 .

4. The resin guide portion is configured to be detachable from the holding tool. The resin sealing apparatus according to claim 3 .

5. The holding tool has a chuck portion that holds at least a part of the outer edge of the functional member. The resin sealing device according to claim 1 .

6. The chuck portion holds the entire periphery of the outer edge portion of the functional member. The resin sealing device according to claim 5 .

7. The functional member is a heat dissipation member or a shielding member. The resin sealing device according to claim 1 .

8. A resin sealing method for resin-sealing an electronic component in a workpiece including a substrate and the electronic component, comprising: supplying a liquid, granular, or powdered resin onto a functional component held by a holding tool, the functional component having no electronic components mounted thereon; heating the functional member and the resin supplied onto the functional member; conveying the resin and the functional component to a resin-sealing mold via the holding tool and setting the resin and the functional component on a film arranged in an area including a cavity recess of a lower mold of the resin-sealing mold; and The upper mold of the resin sealing mold that holds the workpiece and the lower mold that has the functional member and the resin provided on the film are closed to seal the electronic component with resin. A resin sealing method comprising:

9. The method further includes vibrating the functional member and the resin supplied onto the functional member after the resin is supplied. The resin sealing method according to claim 8.

10. heating the functional member and the resin supplied onto the functional member includes setting a resin guide portion before heating and removing the resin guide portion after heating. The resin sealing method according to claim 8 or 9.

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