Grooved die peeling apparatus and method

Abstract

To provide a grooved die peeling device that relatively gently separates a die from a die mounting area of a carrier film.SOLUTION: A groove-shaped die peeling device includes a main body and a vacuum device, the main body 10 includes a film peeling groove 11 arranged on the upper surface, a comb-shaped structure 12 arranged at a first end of the film peeling groove, and a groove 122 formed between a tooth portion 121 and two adjacent teeth portions, a passage arranged inside, and a through hole 14 each connected to the passage, at least one of which is connected to the first end of the film peeling groove. The vacuum device is connected to the passage. As a result, the groove-shaped die peeling device can separate the target die from the carrier film relatively gently by combining the negative pressure between the film peeling groove and the comb-shaped structure, and there is no problem of stress concentration, and it is possible to avoid the target die being damaged or the carrier film being damaged and remaining on the surface of the target die.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a die stripping apparatus and method, and more particularly to a groove die stripping apparatus and method. [Background technology]

[0002] After the wafer is divided into multiple dies, the dies are transferred from the carrier film onto the substrate. During the transfer process, a support device first supports the die mounting area of ​​the carrier film. Next, ideally, multiple lifting members rise from inside the support device to outside the support device and push and lift the target die through the die mounting area of ​​the carrier film, separating the periphery of the target die from the periphery of the die mounting area of ​​the carrier film and separating the center of the target die from the center of the die mounting area of ​​the carrier film. During the target die lifting process, the target die comes into contact with a die fixing device, which then adsorbs the target die. Finally, the lifting members descend into the support device, and the die fixing device simultaneously moves the target die onto the substrate.

[0003] However, when these lifting members push and lift the target die through the die mounting area of ​​the carrier film, the tips of these lifting members are relatively sharp and tend to concentrate excessive stress, often resulting in damage to the target die or damage to the carrier film that remains on the surface of the target die. Summary of the Invention [Problem to be solved by the invention]

[0004] SUMMARY OF THE INVENTION A primary object of the present invention is to provide a groove die release apparatus and method that allows for a relatively gentle separation of a target die from a die mounting area of ​​a carrier film. [Means for solving the problem]

[0005] To achieve the above object, the present invention provides a tank-shaped die peeling device comprising a main body and a vacuum device. The main body comprises a film peeling groove disposed on an upper surface thereof, a comb-shaped structure disposed at a first end of the film peeling groove and having a plurality of teeth and a plurality of grooves formed between each two adjacent teeth, a passage disposed therein, and a plurality of through holes each connected to the passage, at least one of which is connected to the first end of the film peeling groove. The vacuum device is connected to the passage.

[0006] In some embodiments, the bottom of the film peeling groove has a slope extending upward in a direction from the first end of the film peeling groove to the second end of the film peeling groove, and the width of the film peeling groove is greater than the width of the die.

[0007] In some embodiments, the slope is planar.

[0008] In some embodiments, at least two of the plurality of through holes are located on either side of at least two of the plurality of tines.

[0009] In some embodiments, the groove die peeling apparatus further comprises an image capturing unit and a processing unit, wherein the image capturing unit is disposed above a center of the body and electrically connected to the processing unit.

[0010] In order to achieve the above-mentioned object, the present invention provides a die peeling device, comprising: (a) a step of moving a carrier film onto a groove-shaped main body of a die peeling device; (b) a step of moving the main body so that a first end of a target die on a die mounting area of ​​the carrier film protrudes from a plurality of teeth of a comb-shaped structure of the main body; (c) a step of evacuating a passage of the main body by a vacuum device to generate a vacuum state and supply negative pressure, the negative pressure passing through the passage of the main body, a plurality of through holes, and a plurality of grooves of the comb-shaped structure in order to adsorb the die mounting area of ​​the carrier film and fix the target die, and at the same time, another die mounting area of ​​the carrier film is bent and inserted into the film peeling groove of the main body, thereby separating the first end of the target die from the die mounting area of ​​the carrier film; and (d) a step of stopping the evacuation of the passage by the vacuum device to stop the supply of negative pressure, and returning the other die mounting area of ​​the carrier film to its original state by atmospheric pressure and separating it from the film peeling groove. (e) repeating steps (b) to (d) to gradually separate the target die from the die mounting area of ​​the carrier film in a direction from the first end to the second end thereof; (f) when the second end of the target die is positioned above the plurality of teeth, evacuating the passage with the vacuum device to generate a vacuum and supply negative pressure, which passes through the passage, at least one of the plurality of through holes, and the plurality of grooves to adsorb the die mounting area of ​​the carrier film and fix the second end of the target die; and (g) moving the body so that the second end of the target die protrudes from the plurality of teeth, and simultaneously stopping the evacuating of the passage with the vacuum device to stop the supply of negative pressure, thereby completely separating the target die from the die mounting area of ​​the carrier film.

[0011] In some embodiments, step (c) further comprises: the other die mounting area of ​​the carrier film abutting against a slope at the bottom of the film peeling groove, the slope extending upward in a direction from the first end of the film peeling groove to the second end of the film peeling groove; the width of the film peeling groove being greater than the width of the die; and another die on the other die mounting area of ​​the carrier film being positioned in the film peeling groove.

[0012] In some embodiments, step (c) further comprises flatly attaching a bottom surface of the other die mounting area of ​​the carrier film to the slope and flatly attaching a bottom surface of the other die to the other die mounting area of ​​the carrier film.

[0013] In some embodiments, step (c) further includes: at least two of the plurality of through holes are respectively positioned on one side of at least two of the plurality of tooth portions; and the negative pressure passes through at least two of the plurality of through holes to uniformly adsorb the die mounting area of ​​the carrier film, and completely separate the first end of the target die from the die mounting area of ​​the carrier film.

[0014] In some embodiments, between step (a) and step (b), the method further includes the steps of: (h) capturing an image of the target die by an image capture unit of the groove-shaped die peeling device; receiving the image of the target die by a processing unit of the groove-shaped die peeling device; calculating a distance between the target die and the center of the body based on the image of the target die; and controlling the carrier film by the processing unit based on the distance between the target die and the center of the body to move the target die to the center of the body and align the target die with the film peeling groove. [Effects of the Invention]

[0015] The advantage of the present invention is that the film peeling groove and the comb-shaped structure combine to create negative pressure, allowing the target die to be separated from the carrier film relatively gently, eliminating the problem of stress concentration and preventing the target die from being damaged or the carrier film from being damaged and remaining on the surface of the target die. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a perspective view of a groove die peeling device according to the present invention; FIG. [Figure 2] FIG. 1 is a plan view of a groove die peeling device according to the present invention. [Figure 3] 1 is a cross-sectional view of a groove die peeling device according to the present invention. [Figure 4A] FIG. 2 is a schematic diagram showing the connection relationship between the vacuum device and the passage of the present invention. [Figure 4B] FIG. 2 is a schematic diagram showing the connection relationship between the image capture unit and the processing unit of the present invention. [Figure 5] 3 is a flow chart of a groove die peeling method according to the present invention. [Figure 6A] FIG. 2 is a plan view of step S10 of the groove die peeling method according to the present invention. [Figure 6B] FIG. 1 is a cross-sectional view of step S10 of the groove die peeling method according to the present invention. [Figure 7A] FIG. 10 is a plan view of step S20 of the groove die peeling method according to the present invention. [Figure 7B] FIG. 10 is a cross-sectional view of step S20 of the groove die peeling method according to the present invention. [Figure 8A] FIG. 10 is a plan view of step S30 of the groove die peeling method according to the present invention. [Figure 8B] FIG. 10 is a cross-sectional view of step S30 of the groove die peeling method according to the present invention. [Figure 9] FIG. 10 is a cross-sectional view of step S40 of the groove die peeling method according to the present invention. [Figure 10] FIG. 10 is a cross-sectional view of step S50 of the groove die peeling method according to the present invention. [Figure 11]FIG. 10 is a cross-sectional view of step S60 of the groove die peeling method according to the present invention. [Figure 12A] FIG. 10 is a plan view of step S70 of the groove die peeling method according to the present invention. [Figure 12B] FIG. 10 is a cross-sectional view of step S70 of the groove die peeling method according to the present invention. [Figure 13A] FIG. 10 is a plan view of step S80 of the groove die peeling method according to the present invention. [Figure 13B] FIG. 10 is a cross-sectional view of step S80 of the groove die peeling method according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0017] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the embodiments of the present invention will be described in more detail with reference to the drawings and reference numerals, so that those skilled in the art can practice the present invention after reading the specification.

[0018] FIG. 1 is a perspective view of a groove-shaped die peeling apparatus according to the present invention. FIG. 2 is a plan view of a groove-shaped die peeling apparatus according to the present invention. FIG. 3 is a cross-sectional view of a groove-shaped die peeling apparatus according to the present invention. FIG. 4A is a schematic diagram of the connection between a vacuum device 20 and a passage 13 according to the present invention. FIG. 4B is a schematic diagram of the connection between an image capture unit 30 and a processing unit 40 according to the present invention. As shown in FIGS. 1 to 4B, the present invention provides a tank-shaped die peeling apparatus including a main body 10, a vacuum device 20, an image capture unit 30, and a processing unit 40.

[0019] The main body 10 includes a film peeling groove 11, a comb structure 12, a passage 13, and a plurality of through holes 14. The film peeling groove 11 is disposed on the upper surface of the main body 10. The comb structure 12 is located at a first end of the film peeling groove 11 and includes a plurality of teeth 121 and a plurality of grooves 122 formed between each two adjacent teeth 121. The passages 13 are disposed inside the main body 10. These through holes 14 are each connected to the passage 13, and three of these through holes 14 are connected to the first end of the film peeling groove 11. The vacuum device 20 is connected to the passage 13. The image capture unit 30 is disposed above the center of the main body 10 and is electrically connected to the processing unit 40.

[0020] FIG. 5 is a flowchart of a groove die peeling method according to the present invention. FIG. 6A is a plan view of step S10 of the groove die peeling method according to the present invention. FIG. 6B is a cross-sectional view of step S10 of the groove die peeling method according to the present invention. FIG. 7A is a plan view of step S20 of the groove die peeling method according to the present invention. FIG. 7B is a cross-sectional view of step S20 of the groove die peeling method according to the present invention. FIG. 8A is a plan view of step S30 of the groove die peeling method according to the present invention. FIG. 8B is a cross-sectional view of step S30 of the groove die peeling method according to the present invention. FIG. 9 is a cross-sectional view of step S40 of the groove die peeling method according to the present invention. FIG. 10 is a cross-sectional view of step S50 of the groove die peeling method according to the present invention. FIG. 11 is a cross-sectional view of step S60 of the groove die peeling method according to the present invention. FIG. 12A is a plan view of step S70 of the groove die peeling method according to the present invention. FIG. 12B is a cross-sectional view of step S70 of the groove die peeling method according to the present invention. FIG. 13A is a plan view of step S80 of the groove die peeling method according to the present invention. 13B is a cross-sectional view of step S80 of the groove die peeling method according to the present invention. The groove die peeling method according to the present invention includes the following steps.

[0021] In step S10, as shown in FIGS. 5, 6A, and 6B, the carrier film 50 is moved onto the main body 10.

[0022] In step S20, as shown in Figures 5, 7A and 7B, the image capture unit 30 captures an image of the target die 60 on the die mounting area 51 of the carrier film 50, the processing unit 40 (see Figure 4B) receives the image of the target die 60, calculates the distance between the target die 60 and the center of the main body 10 based on the image of the target die 60, and controls the carrier film 50 based on the distance between the target die 60 and the center of the main body 10 to move the target die 60 to the center of the main body 10 and align the target die 60 with the film peeling groove 11.

[0023] In step S30, as shown in FIGS. 5, 8A, and 8B, the main body 10 is moved so that the first end of the target die 60 protrudes from these tooth portions 121.

[0024] In step S40, as shown in Figures 5 and 9, the vacuum device 20 evacuates the passage 13, creating a vacuum and supplying negative pressure 21, which passes through the passage 13, these through holes 14, and these grooves 122 in sequence, adsorbing the die mounting area 51 of the carrier film 50 and fixing the target die 60; at the same time, the other die mounting area 52 of the carrier film 50 is bent and enters the film peeling groove 11, causing the first end of the target die 60 to separate from the die mounting area 51 of the carrier film 50.

[0025] In step S50, as shown in Figures 5 and 10, the vacuum device 20 stops extracting air from the passage 13 to stop the supply of negative pressure, causing the other die mounting area 52 of the carrier film 50 to return to its original position by atmospheric pressure and move away from the film peeling groove 11, while maintaining the first end of the target die 60 separated from the die mounting area 51 of the carrier film 50.

[0026] 5 and 11, in step S60, steps S30, S40, and S50 are repeated to gradually separate the target die 60 from the die mounting area 51 of the carrier film 50 in a direction from its first end to its second end. Specifically, steps S30, S40, and S50 are repeated every 15 milliseconds. In each cycle, the carrier film 50 moves for 5 milliseconds over a distance of 0.2 centimeters, and the negative pressure 21 has a switching time of 3 milliseconds.

[0027] In step S70, as shown in Figures 5, 12A and 12B, when the second end of the target die 60 is positioned above these tooth portions 121, the vacuum device 20 evacuates the passage 13 to generate a vacuum and supplies negative pressure 21, which passes through the passage 13, three of these through holes 14 and these grooves 122, adsorbs the die mounting area 51 of the carrier film 50 and fixes the second end of the target die 60.

[0028] In step S80, as shown in Figures 5, 13A and 13B, the main body 10 is moved so that the second end of the target die 60 protrudes from these tooth portions 121, and at the same time, the vacuum device 20 stops extracting air from the passage 13 to stop the supply of negative pressure 21, and the target die 60 is completely removed from the die mounting area 51 of the carrier film 50.

[0029] As a result, the present invention allows the film peeling groove 11 and the comb-shaped structure 12 to combine to create a negative pressure 21, thereby allowing the target die 60 to be separated relatively gently from the carrier film 50, eliminating the problem of stress concentration and preventing the target die 60 from being damaged or the carrier film 50 from being damaged and remaining on the surface of the target die 60.

[0030] Furthermore, the cooperation between the image capture unit 30 and the processing unit 40 can ensure that the target die 60 is aligned with the film peeling groove 11, and prevent one side of the target die 60 from shifting out of the film peeling groove 11, which would prevent the target die 60 from being separated from the carrier film 50.

[0031] 1 and 3, in a preferred embodiment, the bottom of the film peeling groove 11 has a slope 111 extending upward from the first end of the film peeling groove 11 to the second end of the film peeling groove 11, and the width of the film peeling groove 11 is greater than the width of the die. In other words, the first end of the film peeling groove 11 is the lowest point of the slope 111, and the second end is the highest point of the slope 111. In step S40, as shown in FIG. 9, in a preferred embodiment, the other die mounting area 52 of the carrier film 50 is abutted on the slope 111, and the other die 61 on the other die mounting area 52 of the carrier film 50 is positioned within the film peeling groove 11 to prevent the other die 61 from being folded.

[0032] Preferably, the width of the film peeling groove 11 is about 240 to 260 μm larger than the width of the die, and within this width range, it is possible to ensure that the other die 61 will not break. Preferably, the difference in width is 250 μm.

[0033] Preferably, the slope 111 is flat. In other words, there is no protrusion on the slope 111. Step S40 further includes: attaching the bottom surface of the other die mounting area 52 of the carrier film 50 flat to the slope 111, and attaching the bottom surface of the other die 61 flat to the other die mounting area 52 of the carrier film 50.

[0034] 1, 2, and 3, in a preferred embodiment, three of the through holes 14 are located on one side of three of the tooth portions 121. As shown in FIG. 9, in a preferred embodiment, step S40 further includes applying negative pressure 21 through three of the through holes 14 to uniformly suction the die mounting area 51 of the carrier film 50, thereby allowing the first end of the target die 60 to be completely separated from the die mounting area 51 of the carrier film 50. More specifically, the folding surface of the other die mounting area 52 of the carrier film 50 is fairly flat and does not have any unevenness, so that the first end of the target die 60 can be completely separated from the die mounting area 51 of the carrier film 50, and there is no problem that the first end of the target die 60 is only partially separated from the die mounting area 51 of the carrier film 50 while the other part of the first end of the target die 60 is attached to the die mounting area 51 of the carrier film 50.

[0035] The above-mentioned are only preferred embodiments for illustrating the present invention, and are not intended to limit the present invention in any way. Therefore, any modifications or changes made to the present invention within the scope of the same invention should be included in the intended scope of protection of the present invention. [Explanation of symbols]

[0036] 10 Main Unit 11 Film peeling groove 111 Slope 12 Comb structure 121 Tooth 122 Groove 13 Passage 14 Through Hole 20 Vacuum equipment 21 Negative pressure 30 Image Capture Unit 40 processing units 50 Carrier Film 51 Die placement area 52 Other die placement areas 60 target dies 61 Other Dies S10~S80 process

Claims

1. a main body including: a film peeling groove disposed on an upper surface, the film peeling groove having a slope formed at its bottom; a comb structure disposed at a first end of the film peeling groove, the comb structure including a plurality of teeth and a plurality of grooves formed between each two adjacent teeth; a passage disposed therein; and a plurality of through holes each communicating with the passage, at least one of which communicates with the first end of the film peeling groove; a vacuum device connected to the passageway; the first end is an end of the film peeling groove that is closer to the center of the body; Grooved die peeling device.

2. The slope extends upward in a direction from the first end of the film peeling groove to the second end of the film peeling groove, and the width of the film peeling groove is greater than the width of the die; the second end is an end of the film peeling groove that is closer to the outside of the body; The groove die peeling apparatus of claim 1 .

3. The slope is a plane. The groove die peeling apparatus of claim 2 .

4. At least three of the plurality of through holes are respectively positioned at locations in the film peeling groove close to the plurality of tooth portions. The groove die peeling apparatus of claim 1 .

5. further comprising an image capture unit and a processing unit, the image capture unit being disposed above the center of the body and electrically connected to the processing unit; The groove die peeling apparatus of claim 1 .

6. (a) moving a carrier film onto the body of the groove die peeling device of claim 1; (b) moving the body so that a first end of a target die on the die mounting area of ​​the carrier film protrudes from the plurality of teeth of the comb structure of the body; (c) evacuating the passage of the main body with a vacuum device to generate a vacuum state and supply negative pressure, which passes through the passage of the main body, the plurality of through holes, and the plurality of grooves of the comb-shaped structure in order to adsorb the die mounting area of ​​the carrier film and fix the target die, and at the same time, other die mounting areas of the carrier film are bent and inserted into the film peeling grooves of the main body, so that the first end of the target die is separated from the die mounting area of ​​the carrier film; (d) stopping the supply of negative pressure by stopping the bleed of air from the passage by the vacuum device, and returning the other die mounting area of ​​the carrier film to its original position by atmospheric pressure and away from the film peeling groove, and maintaining the first end of the target die separated from the die mounting area of ​​the carrier film; (e) repeating steps (b) to (d) to gradually remove the target die from the die-mounting area of ​​the carrier film in a direction from the first end of the target die to the second end of the target die; (f) when the second end of the target die is positioned above the plurality of teeth, evacuating the passage with the vacuum device to generate a vacuum and supply a negative pressure, the negative pressure passing through the passage, at least one of the plurality of through holes, and the plurality of grooves to suction the die mounting area of ​​the carrier film and fix the second end of the target die; (g) moving the body so that the second end of the target die protrudes from the plurality of teeth, and simultaneously stopping the supply of negative pressure by stopping the bleed of air from the passage using the vacuum device, thereby completely removing the target die from the die mounting area of ​​the carrier film. Grooved die release method.

7. step (c) further comprises: the other die mounting area of ​​the carrier film abutting against a slope at the bottom of the film peeling groove, the slope extending upward in a direction from the first end of the film peeling groove to the second end of the film peeling groove; the width of the film peeling groove being greater than the width of the die; and the other die on the other die mounting area of ​​the carrier film being positioned in the film peeling groove. The die peeling method according to claim 6.

8. Step (c) further comprises: attaching a bottom surface of the other die mounting region of the carrier film flatly to the slope; and attaching a bottom surface of the other die flatly to the other die mounting region of the carrier film. The die peeling method according to claim 7.

9. Step (c) further includes: at least two of the plurality of through holes are respectively positioned on one side of at least two of the plurality of tooth portions; and the negative pressure passes through at least two of the plurality of through holes to uniformly suction the die mounting area of ​​the carrier film, thereby completely separating the first end of the target die from the die mounting area of ​​the carrier film. The die peeling method according to claim 6.

10. Between step (a) and step (b), the method further includes the steps of: (h) capturing an image of the target die by an image capture unit of the groove-shaped die peeling device; receiving the image of the target die by a processing unit of the groove-shaped die peeling device; calculating a distance between the target die and the center of the body based on the image of the target die; and controlling the carrier film by the processing unit based on the distance between the target die and the center of the body to move the target die to the center of the body and align the target die with the film peeling groove. The die peeling method according to claim 6.

Images