SUBSTRATE PROCESSING MODULE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING UNIT

Abstract

A substrate processing module (7) comprises a housing (20), two processing tanks (34, 32) which are arranged in a first direction inside the housing (20), and in each of which a substrate (4) can be disposed, and leveling mechanisms (91, 90) which are for leveling the processing tanks (34, 32). The leveling mechanisms (91, 90) have a contact parts (96, 93) which are provided to the processing tanks (34, 32), support parts (97, 94) which contact the contact part (96, 93) and support the contact parts (96, 93), and at least two height adjustment parts (95, 92) which are for changing the height of the processing tanks (34, 32).

Description

[Technical Field]

[0001] The present invention relates to a substrate processing module, a substrate processing apparatus, and a substrate processing unit for processing a substrate. [Background technology]

[0002] Substrate processing equipment includes cleaning equipment that processes various types of substrates (hereinafter referred to as "substrates") such as semiconductor wafers with a predetermined chemical solution, then cleans them with a cleaning solution such as pure water to remove foreign matter adhering to the surface of the substrate.Cleaning equipment includes wet-type cleaning equipment that performs the cleaning process by immersing the substrate in a chemical solution and a cleaning solution.

[0003] Patent Document 1 discloses a substrate processing apparatus having multiple pairs of chemical tanks and cleaning tanks arranged in the longitudinal direction of the apparatus, as well as a main transport mechanism and an auxiliary transport mechanism. The main transport mechanism moves multiple substrates in the longitudinal direction from one end of the apparatus to the other. The auxiliary transport mechanism moves the multiple substrates in the longitudinal direction and up and down within the range of the pair of chemical tanks and cleaning tanks. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-56158 Summary of the Invention [Problem to be solved by the invention]

[0005] In Patent Document 1, multiple pairs of chemical tanks and cleaning tanks are arranged adjacent to each other in the longitudinal direction of the apparatus, which can lead to contamination of another adjacent chemical tank and cleaning tank by the atmosphere of a certain chemical tank stored in one chemical tank (i.e., chemical contamination). Furthermore, since the main transport mechanism and the auxiliary transport mechanism face the chemical tanks and cleaning tanks, contamination by particles can occur. Furthermore, since multiple pairs of chemical tanks and cleaning tanks are arranged in the longitudinal direction, the apparatus is long in the longitudinal direction. Furthermore, since the multiple pairs of chemical tanks and cleaning tanks are fixedly installed within the apparatus, it is not possible to flexibly respond to changes in the processing process, and maintenance can be difficult.

[0006] Therefore, it is desirable to be able to suppress contamination by chemicals and particles, miniaturize the device, configure it with high scalability through flexible response, and improve maintainability.

[0007] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a substrate processing module, a substrate processing apparatus, and a substrate processing unit that can improve maintainability. [Means for solving the problem]

[0008] In order to solve the above problem, a substrate processing module according to one embodiment of the present invention comprises a housing, two processing tanks arranged in a first direction within the housing and each capable of placing a substrate, and a leveling mechanism for leveling the processing tanks, wherein the leveling mechanism has a contact portion provided in the processing tank, a support portion that contacts the contact portion and supports the contact portion, and at least two height change portions for changing the height of the processing tanks.

[0009] A substrate processing apparatus according to one aspect of the present invention includes the substrate processing module and the other module.

[0010] Furthermore, a substrate processing unit according to one embodiment of the present invention comprises two processing tanks in each of which a substrate can be placed, a sink tank that stores the processing tanks arranged in a first direction, and a leveling mechanism for leveling the processing tanks, wherein the leveling mechanism has a contact portion provided on the processing tank, a support portion that contacts the contact portion and supports the contact portion, and at least two height change portions for changing the height of the processing tanks. [Effects of the Invention]

[0011] According to the present invention, it is possible to improve maintainability. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view illustrating a substrate processing apparatus according to an embodiment. [Figure 2] FIG. 2 is a perspective view illustrating components of the substrate processing apparatus shown in FIG. 1; [Figure 3] FIG. 2 is a perspective view illustrating a chemical module in the substrate processing apparatus shown in FIG. 1; [Figure 4] FIG. 2 is a perspective view illustrating a second transfer mechanism in the substrate processing apparatus shown in FIG. 1; [Figure 5] FIG. 4 is a perspective view illustrating a main part of the chemical module shown in FIG. 3. [Figure 6] FIG. 2 is a perspective view illustrating an unloading module in the substrate processing apparatus shown in FIG. 1; [Figure 7] FIG. 2 is a perspective view illustrating a loading module in the substrate processing apparatus shown in FIG. 1; [Figure 8] FIG. 4 is a diagram illustrating the movement of the upper and lower conveying sections in the chemical module shown in FIG. 3. [Figure 9] FIG. 4 is a diagram illustrating the movement of the first transfer unit in the chemical module shown in FIG. 3; [Figure 10] A diagram illustrating a carrier for holding a substrate. [Figure 11] FIG. 2 is a perspective view illustrating a drying module in the substrate processing apparatus shown in FIG. 1. [Figure 12] Schematic diagram of a second transport mechanism when viewed from above [Figure 13] Schematic perspective view showing a chemical module [Figure 14] FIG. 1 is a diagram illustrating the movement of the first transfer unit in the chemical module. [Figure 15] FIG. 10 is a schematic plan view showing a processing space according to a modified example. [Figure 16A] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 16B] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 16C] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 16D] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 16E] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 16F] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 16G] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 16H] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 16I] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 16J] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 16K] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 16L] FIG. 1 is a schematic diagram illustrating an example of an operation of the substrate processing apparatus; [Figure 17] A schematic plan view showing an example of operation when processing substrates in one batch. [Figure 18] 1 is a schematic plan view showing an example of an operation when processing substrates in multiple batches; [Figure 19] Schematic plan view showing variations of the first and second tanks [Figure 20] A perspective view of multiple chemical modules viewed from the front side of the housing [Figure 21]A perspective view of multiple chemical modules seen from the rear of the housing (with the sink tank pulled out to the front) [Figure 22] A perspective view of multiple chemical modules seen from the rear of the housing (with the sink retracted to the rear). [Figure 23] FIG. 1 is a schematic side view of a substrate processing unit including a leveling mechanism; [Figure 24A] Schematic diagram of the chemical tank viewed from the front [Figure 24B] Schematic diagram of the cleaning tank viewed from the front [Figure 25] Schematic enlarged view of the height change section from the side [Figure 26] Schematic enlarged view showing the vertical cross section of the ball section and ball receiving section [Figure 27] Schematic plan view of the sink tank (with the chemical tank and cleaning tank arranged) [Figure 28] Schematic plan view of the sink tank (without the chemical tank and cleaning tank) [Figure 29] FIG. 10 is a schematic enlarged view showing a vertical cross section of a ball portion and a ball receiving portion according to a modified example. [Figure 30] FIG. 10 is a schematic side view of a substrate processing unit including a leveling mechanism according to a modified example. [Figure 31] FIG. 10 is a schematic side view of a substrate processing unit including a leveling mechanism according to a modified example. [Figure 32A] FIG. 10 is a schematic side view of a substrate processing unit including a leveling mechanism according to a modified example. [Figure 32B] FIG. 10 is a schematic front view of a substrate processing unit including a leveling mechanism according to a modified example; [Figure 33] Schematic plan view of a sink tank according to a modified example DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, an embodiment of a substrate processing apparatus 1 according to the present invention will be described with reference to the drawings.

[0014] In this specification, a "module" refers to a standardized, detachable (replaceable) component that is treated as a single structural unit when used. The "first direction" refers to the direction in which a pair of chemical tanks and a cleaning tank are arranged, i.e., the short-side direction of the substrate processing apparatus 1 (e.g., the front-to-back direction or the vertical direction). The "second direction" refers to the direction in which multiple modules are arranged, intersecting the first direction and the vertical direction, i.e., the long-side direction of the substrate processing apparatus 1 (e.g., the left-to-right direction or the horizontal direction). The first direction may also be referred to as the transverse direction (TD), and the second direction may also be referred to as the machine direction (MD). In the drawings, the "first direction" is shown as the Y-axis direction, the "second direction" as the X-axis direction, and the "vertical direction" as the Z-axis direction. The first direction, the second direction, and the vertical direction intersect with each other (e.g., perpendicular to each other).

[0015] [Embodiment] A substrate processing apparatus 1 according to one embodiment will be described with reference to FIGS. 1 to 10. FIG. 1 is a perspective view illustrating the substrate processing apparatus 1 according to one embodiment. FIG. 2 is a perspective view illustrating components of the substrate processing apparatus 1 shown in FIG. 1. FIG. 3 is a perspective view illustrating a chemical module 7 in the substrate processing apparatus 1 shown in FIG. 1. FIG. 4 is a perspective view illustrating a second transfer mechanism 9 in the substrate processing apparatus 1 shown in FIG. 1. FIG. 5 is a perspective view illustrating a main part of the chemical module 7 shown in FIG. 3. FIG. 6 is a perspective view illustrating an unloading module 8 in the substrate processing apparatus 1 shown in FIG. 1. FIG. 7 is a perspective view illustrating a loading module 5 in the substrate processing apparatus 1 shown in FIG. 1. FIG. 8 is a view illustrating the movement of the vertical transfer unit 13 in the chemical module 7 shown in FIG. 3. FIG. 9 is a view illustrating the movement of the first transfer unit 11 in the chemical module 7 shown in FIG. 3. FIG. 10 is a view illustrating a carrier 2 holding a substrate 4. FIG. 11 is a perspective view illustrating a drying module 6 in the substrate processing apparatus 1 shown in FIG. 1.

[0016] The substrate processing apparatus 1 includes at least one module for performing various processes on multiple substrates 4 held by a carrier 2. The substrates 4 are, for example, semiconductor substrates, glass substrates for liquid crystal displays, glass substrates for photomasks, substrates for optical disks, MEMS sensor substrates, and solar cell panels. The module has a standardized housing 20 and is configured to be detachable (replaceable) in a second direction (the X-axis direction, the longitudinal direction of the substrate processing apparatus 1; hereinafter, referred to as the "second direction"). A fan filter unit 24 is disposed on top of the module. The fan filter unit 24 includes a fan and a filter for taking in air from a clean room and sending it into the module. The fan filter unit 24 creates a downflow of clean air in the processing space within the module. Instead of providing the fan filter unit 24, a different configuration for taking in clean air from a clean room may be used.

[0017] 1 and 2, the substrate processing apparatus 1 includes, for example, a load module 5, a drying module 6, a chemical module 7 (substrate processing module), an unload module 8, and a second transfer mechanism 9. The load module 5, the chemical module 7, the drying module 6, and the unload module 8 are disposed adjacent to each other along the second direction. The load module 5, the chemical module 7, the drying module 6, and the unload module 8 are configured to be detachably connected in the second direction. This allows for flexible response to changes in the processing process, and increases scalability.

[0018] The second transport mechanism 9 extends in the second direction and transports the carrier 2 holding the plurality of substrates 4 shown in Fig. 10 in the second direction. The second transport mechanism 9 is disposed at the rear upper part of the load module 5, the chemical module 7, the drying module 6, and the unload module 8 in the first direction (Y-axis direction, the short side direction of the substrate processing apparatus 1, hereinafter referred to as "first direction").

[0019] The substrate processing apparatus 1 has a control unit (not shown). The control unit, for example, controls the operation of each element of the substrate processing apparatus 1 and performs data calculations. The control unit, for example, has a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory). The CPU executes control (for example, control of the transport operation of the carrier 2 by the first transport unit 11, the upper and lower transport units 13, and the second transport unit 48) in accordance with a program stored in the ROM.

[0020] In the loading module 5, unprocessed substrates 4 are loaded into the apparatus on a single carrier 2. In the drying module 6, vapor drying of the substrates 4 using, for example, IPA (isopropyl alcohol) is performed on each carrier 2. In the chemical module 7, cleaning processing of the substrates 4 is performed on each carrier 2. In the unloading module 8, the cleaned substrates 4 are unloaded from the apparatus on a single carrier 2.

[0021] The carry-in module 5, also referred to as a loader unit, is disposed on the upstream side of the substrate processing apparatus 1 in the second direction. As shown in FIG. 7 , the carry-in module 5 has an openable and closable carry-in unit 26 on the side of its housing 20 on the upstream side in the second direction. The carrier 2 is carried into the carry-in module 5 via the carry-in unit 26. The carrier 2 carried into the carry-in module 5 is placed on the mounting table 22. Inside the carry-in module 5, the carrier 2 is transported in the first direction by the first transport unit 11 via the arm 16, and the carrier 2 is transported in the vertical direction by the vertical transport unit 13 via the arm 16. The first actuator 12 of the first transport unit 11 is disposed below and to the side of the mounting surface of the mounting table 22. The vertical actuator 14 of the vertical transport unit 13 is also disposed below and to the side of the mounting surface of the mounting table 22. That is, the downflow from the fan filter unit 24 and the arm length of the arm 16 isolate the carrier 2 placed on the mounting table 22 from the influence of the first actuator 12 and the upper and lower actuators 14. This makes it possible to prevent contamination of the carrier 2 in the carry-in module 5 by particles generated from the first actuator 12 and the upper and lower actuators 14.

[0022] The unloading module 8, also referred to as an unloader unit, is disposed downstream in the second direction of the substrate processing apparatus 1. As shown in FIG. 6, the carrier 2 loaded into the unloading module 8 is placed on the mounting table 22. Inside the unloading module 8, the carrier 2 is transported in the first direction by the first transport unit 11 via the arm 16, and the carrier 2 is transported in the vertical direction by the vertical transport unit 13 via the arm 16. The first actuator 12 of the first transport unit 11 is disposed below and to the side of the mounting surface of the mounting table 22. The vertical actuator 14 of the vertical transport unit 13 is also disposed below and to the side of the mounting surface of the mounting table 22. That is, due to the downflow from the fan filter unit 24 and the arm length of the arm 16, the carrier 2 placed on the mounting table 22 is isolated from the influence of the first actuator 12 and the vertical actuator 14. This makes it possible to prevent contamination of the carrier 2 in the unloading module 8 due to particles generated from the first actuator 12 and the upper and lower actuators 14. The unloading module 8 has an unloading section 27 that is configured to be openable and closable on the downstream side in the second direction of its housing 20. The carrier 2 is unloaded to the outside of the unloading module 8, i.e., to the outside of the substrate processing apparatus 1, via the unloading section 27.

[0023] In the above embodiment, the carrier 2 is transported in one direction along the second direction from the load module 5 to the unload module 8, but other embodiments are also possible. For example, the substrate processing apparatus 1 may include only either the load module 5 or the unload module 8, and the load module 5 may have the functions of both a loader and an unloader, or the unload module 8 may have the functions of both a loader and an unloader. In this case, the carrier 2 is transported in both directions along the second direction (i.e., transported back and forth along the second direction).

[0024] The substrate processing apparatus 1 includes at least one drying module 6. The drying module 6 is installed, for example, between the chemical module 7 and the unloading module 8, as shown in FIG.

[0025] 11, the drying module 6, like the other modules 5, 7, and 8, has a first conveying unit 11 that conveys the carrier 2 in a first direction and a vertical conveying unit 13 that conveys the carrier 2 in a vertical direction. The first conveying unit 11 has a first actuator 12, and the vertical conveying unit 13 has a vertical actuator 14.

[0026] The drying module 6 has a drying chamber 31. The drying chamber 31 is disposed, for example, on the front side of the drying module 6 in the first direction. A drying process is performed in the drying chamber 31 to dry the substrate 4 after the chemical module 7 has performed various chemical processes such as various chemical cleanings, etching, and resist stripping. In the drying module 6, the carrier 2 holding the substrate 4 is transported in the vertical direction relative to the drying chamber 31 by the vertical transport unit 13 via the arm 16. The first actuator 12 and the vertical actuator 14 are disposed at a distance from the drying chamber 31 at the lower side thereof. Therefore, the drying chamber 31 is isolated from the first actuator 12 and the vertical actuator 14 so as not to be affected by them.

[0027] This drying process can be performed using a commonly known drying method. Specifically, for example, a drying method using the Marangoni effect, called IMD (IPA Mist Dryer), can be used. This drying method utilizes the difference in surface tension that occurs on the surface of the substrate 4 as it passes over the water surface when the carrier 2 holding the substrate 4 is immersed in a pure water tank provided in the drying chamber 31, a mist of IPA or vaporized IPA is continuously supplied to the water surface, and the substrate 4 is raised or lowered or the water surface is overflowed or downflowed.

[0028] Another drying method that can be used is a method using centrifugal force called a spin dryer. This drying method uses centrifugal force generated by setting the carrier 2 holding the substrate 4 on a rotating rotor provided in the drying chamber 31, fixing the carrier 2 and the substrate 4 with a holding device called a retainer, and then rotating the rotating rotor.

[0029] Another drying method that can be used is drying by vapor cleaning, known as a vapor dryer. In this drying method, saturated vapor created by heating a solvent with a small latent heat of vaporization (e.g., IPA) is filled into the drying chamber 31, and the carrier 2 holding the substrate 4, whose temperature is lower than the vapor temperature, is placed in the drying chamber 31. The surfaces of the carrier 2 and substrate 4 are cleaned with the IPA, which condenses and liquefies on the surface of the substrate 4. When the carrier 2 and substrate 4 have warmed to the same temperature as the IPA vapor, the condensation and liquefaction of the IPA on the surfaces of the carrier 2 and substrate 4 is stopped, and the carrier 2 and substrate 4 are dried.

[0030] As another drying method, N2 blow drying using N2 can also be used. In either drying method, the drying chamber 31 is isolated so as not to be affected by the vertical actuator 14 and the first actuator 12 that transport the carrier 2 holding the substrate 4. This makes it possible to suppress contamination within the drying module 6 due to particles generated from the vertical actuator 14 and the first actuator 12. Note that the first actuator 12 and the vertical actuator 14 can also be disposed at a lower part on the rear side of the drying chamber 31 in the first direction, separated from the drying chamber 31. Furthermore, if only vertical transport is required, the drying module 6 does not need to include the first transport unit 11.

[0031] The chemical module 7 includes at least one module. As shown in FIGS. 1 and 2, the chemical module 7 includes, for example, a first chemical module 7a, a second chemical module 7b, a third chemical module 7c, and a fourth chemical module 7d. The chemical module 7 performs various chemical cleaning processes, such as APM (ammonium hydroxide-hydrogen peroxide mixture) cleaning, SPM (sulfuric acid-hydrogen peroxide mixture) cleaning, HPM (hydrochloric acid-hydrogen peroxide mixture), and DHF (diluted hydrofluoric acid) cleaning, as well as various chemical processes, such as etching and resist stripping. These chemical processes can be combined as desired depending on the type of chemical process performed on the substrate 4. The chemical modules 7a, 7b, 7c, and 7d are configured to be detachably connected in the second direction. This allows for flexible response to changes in the processing process and increases scalability.

[0032] As shown in FIGS. 3, 5, and 9, the chemical module 7 includes a chemical tank 32 (second tank) for chemical cleaning and a cleaning tank 34 (first tank) for pure water cleaning (rinsing). The chemical tank 32 is disposed on the rear side in the first direction, and the cleaning tank 34 is disposed on the front side in the first direction. That is, the chemical tank 32 and the cleaning tank 34 are arranged in the first direction. This narrows the width of the chemical module 7 in the second direction, thereby enabling the substrate processing apparatus 1 to be miniaturized. Alternatively, the chemical tank 32 may be disposed on the front side in the first direction, and the cleaning tank 34 may be disposed on the rear side in the first direction. Furthermore, a common exhaust duct 29 for exhausting chemical vapor generated from the chemical tank 32 can be disposed on the rear side in the first direction, facilitating maintenance of the substrate processing apparatus 1. The chemical tank 32 stores the various chemicals described above. The cleaning tank 34 stores pure water. The chemical tank 32 has, for example, an inner tank in which the carrier 2 is immersed in the chemical solution, and an outer tank that collects the chemical solution that overflows from the upper end of the inner tank. At times that are not related to the transport operation of the carrier 2, the opening of the chemical tank 32 is closed by a lid.

[0033] Two side walls 37, 37 are provided on the sides of the chemical tank 32 in the second direction. That is, the sides of the chemical tank 32 in the second direction are partitioned by the side walls 37. This makes it possible to suppress contamination of the chemical tank 32 stored in the chemical tank 32 of the adjacent chemical module 7 due to the atmosphere. At the same time, a rear wall 38 is provided behind the chemical tank 32 in the first direction. The chemical tank 32 is surrounded by the two side walls 37, 37 and the rear wall 38 in a U-shape when viewed from the top and bottom.

[0034] For example, two side exhaust ducts 36, 36 each having a side exhaust port 36a can be disposed on the upper side of the chemical tank 32. The two side exhaust ports 36a, 36a are located at approximately the same height, but slightly lower, than the opening of the chemical tank 32. A rear exhaust port 39a of a rear exhaust duct 39 (shown in FIG. 9) is disposed on the rear wall 38. The two side exhaust ducts 36, 36 and the rear exhaust duct 39 branch off from and are connected to the common exhaust duct 29. The rear exhaust port 39a is located above the opening of the chemical tank 32. In this way, the side exhaust ports 36a and the rear exhaust port 39a that exhaust chemical vapor evaporating from the chemical tank 32 are disposed around the chemical tank 32. This makes it possible to prevent chemical vapor generated from the chemical tank 32 from diffusing into the processing space in the chemical module 7, thereby preventing contamination of the substrate 4 being transported in the processing space in the chemical module 7.

[0035] Each chemical module 7 has a first transport unit 11 that transports the carrier 2 in a first direction, and a vertical transport unit 13 that transports the carrier 2 in a vertical direction. The vertical transport unit 13 has a vertical actuator 14. The carrier 2 is supported by a receiving base 18 provided on one end of an inverted U-shaped arm 16. The carrier 2 has a flange 3 on its upper part, which allows a chuck 44 of the second transport unit 48 to grip the flange 3 in a freely engageable and disengageable manner, as will be described later. Alternatively, the flange 3 of the carrier 2 may be configured to be supported by the receiving base 18. The arm 16 may also have a D-shape.

[0036] The other end of the arm 16 is attached to the vertical actuator 14. The vertical actuator 14 is an electric linear actuator and includes, for example, a screw shaft that moves the arm 16, a motor that rotates the screw shaft, a power source, and a controller that controls the motor. When the vertical actuator 14 moves the arm 16 downward while the carrier 2 is positioned directly above the chemical tank 32 or the cleaning tank 34, the carrier 2 holding the multiple substrates 4 is immersed in the chemical solution in the chemical tank 32 or the cleaning solution in the cleaning tank 34. When the vertical actuator 14 moves the arm 16 upward while the carrier 2 is immersed in the chemical solution or cleaning solution, the carrier 2 holding the multiple substrates 4 is lifted up from the chemical solution or cleaning solution. Therefore, when the vertical actuator 14 moves the arm 16 up or down while the carrier 2 is positioned directly above the chemical tank 32 or the cleaning tank 34, the carrier 2 holding the multiple substrates 4 is lifted up or immersed in the chemical solution in the chemical tank 32 or the cleaning solution in the cleaning tank 34.

[0037] The first transfer unit 11 has a first actuator 12. The vertical actuator 14 is attached to the first actuator 12. The first actuator 12 is an electric linear actuator and has, for example, a screw shaft that moves the vertical actuator 14, a motor that rotates the screw shaft, a power source, and a controller that controls the motor. When the arm 16 moves upward and the first actuator 12 moves the arm 16 backward in the first direction, the carrier 2 holding the multiple substrates 4 is transported to directly above the chemical bath 32. When the arm 16 is positioned at the lifted position and the first actuator 12 moves the arm 16 forward in the first direction, the carrier 2 holding the multiple substrates 4 is transported to directly above the cleaning bath 34. Therefore, when the arm 16 moves in the first direction and the arm 16 is positioned at the lifted position, the carrier 2 holding the multiple substrates 4 is transported between directly above the chemical bath 32 and directly above the cleaning bath 34.

[0038] The first actuator 12 and the upper and lower actuators 14 are disposed outside and below the opening of the chemical tank 32, with the side exhaust duct 36 sandwiched between them. That is, the downflow from the fan filter unit 24 and the exhaust through the side exhaust duct 36 isolate the chemical tank 32 and the cleaning tank 34 from being affected by the first actuator 12 and the upper and lower actuators 14. This ensures a large distance between the first actuator 12 and the upper and lower actuators 14 and the opening of the chemical tank 32, thereby suppressing contamination within the chemical module 7 due to particles generated from the first actuator 12 and the upper and lower actuators 14. Note that it is also possible to eliminate the two side exhaust ducts 36, 36 and configure exhaust to be performed only through the rear exhaust duct 39.

[0039] Next, the second transport mechanism 9 will be described with reference to FIGS. 1, 2, 4, 8 and 9. FIG.

[0040] As shown in FIG. 1 , the second transport mechanism 9 is disposed at the upper rear of the loading module 5, the chemical module 7, the drying module 6, and the unloading module 8 in the first direction. As shown in FIG. 4 , the second transport mechanism 9 has, for example, a configuration in which a plurality of second transport housings 40 and a second actuator 41 are connected in the second direction. Each of the second transport housings 40 is configured, for example, as part of the housing 20 of the loading module 5, the chemical module 7, the drying module 6, and the unloading module 8. That is, the second transport housing 40 is configured integrally with the housing 20. Alternatively, the second transport housing 40 can be configured as a separate box-shaped member. While FIGS. 2 and 4 illustrate the second transport housing 40 as being separate from the housing 20 to facilitate understanding of the configuration of the second transport housing 40, the second transport housing 40 may be configured as an integrated part that forms part of the housing 20, or as a separate member. The second transporting and accommodating section 40 and the second actuator 41 are configured to be detachably connected in the second direction.

[0041] As shown in FIG. 4, the second transport mechanism 9 has a plurality of second transport accommodation units 40 and at least one second transport unit 48. The number of second transport units 48 arranged in the second transport mechanism 9 is increased or decreased as appropriate depending on the number of second transport accommodation units 40 to be connected. The second transport unit 48 has a second actuator 41. The second actuator 41 is accommodated in the second transport accommodation unit 40. The first actuator 12 and the upper and lower actuators 14 are accommodated in the chemical module 7, and the second actuator 41 is accommodated in the second transport accommodation unit 40. As a result, the first actuator 12 and the upper and lower actuators 14 and the second actuator 41 are accommodated separately, thereby suppressing contamination within the chemical module 7.

[0042] The second actuator 41 is, for example, an electric linear actuator. The second actuator 41 is, for example, a rack-and-pinion mechanism, and includes a flat guide portion having a toothed rack, a circular gear called a pinion, a motor for rotating the circular gear, a power source, and a control portion for controlling the motor. The flat guide portion can have multiple guide pieces, and the multiple guide pieces can be configured to be detachably connected in the second direction.

[0043] As shown in FIG. 9 , the second transport unit 48 has a rotary actuator 42 connected to the second actuator 41 via a link unit 46. The rotary actuator 42 is, for example, an electric rotary actuator, and has a motor that rotates two pivoting arms 43, 43, a power source, and a control unit that controls the motor. The rotary actuator 42 can also be an actuator driven by hydraulic pressure or air pressure. The second actuator 41 and the chemical solution tank 32 are separated by a rear wall 38. This makes it possible to suppress contamination within the chemical module 7 caused by the second actuator 41.

[0044] The pivoting arm 43 extends in a first direction through an opening 38a formed in the rear wall 38. The pivoting arm 43 is movable in a second direction through a gap 37a formed in the side wall 37. A chuck 44 is disposed in front of the pivoting arm 43. The chuck 44 is configured to be positioned directly above the cleaning tank 34. This makes it possible to prevent contamination within the chemical module 7 caused by the carrier 2 gripped by the chuck 44 being transported over different types of chemical tanks 32.

[0045] The chuck portion 44 has a U-shape in side view (i.e., when viewed from the second direction). The two chuck portions 44, 44 grip the flange portion 3 of the carrier 2 by sandwiching the flange portion 3 of the carrier 2 from both sides as the rotating arm portion 43 rotates. The two chuck portions 44, 44 rotate in directions away from each other, thereby releasing the grip on the flange portion 3 of the carrier 2. Therefore, the two chuck portions 44, 44 can be engaged with and disengaged from the flange portion 3 of the carrier 2.

[0046] Since the second actuator 41 is accommodated in the second transport accommodation unit 40, the chemical tank 32 and the cleaning tank 34 are isolated so as not to be affected by the second actuator 41. In other words, the second actuator 41 is isolated from the chemical tank 32 and the cleaning tank 34. This makes it possible to suppress contamination by particles generated from the second actuator 41.

[0047] Although specific embodiments and numerical values ​​of the present invention have been described, the present invention is not limited to the above-described embodiments and can be practiced with various modifications within the scope of the present invention.

[0048] For example, in the above-described embodiment, the first actuator 12 and the vertical actuator 14 are arranged at the lateral lower part (lower part in the second direction), but they may be arranged on the first direction side as necessary.

[0049] The number and combination of modules in the substrate processing apparatus 1 can be designed appropriately as needed, and for example, the chemical modules 7 and the drying modules 6 can be arranged alternately.

[0050] The present invention and its embodiments can be summarized as follows.

[0051] A substrate processing apparatus 1 according to one aspect of the present invention includes: a chemical module (7) having a chemical bath (32) for treating the substrate (4) held on the carrier (2) with a chemical solution and a cleaning bath (34) for cleaning the substrate (4) held on the carrier (2); The chemical module 7 includes: a first transport unit that transports the carrier in a first direction in which the chemical tank and the cleaning tank are arranged; a vertical transport unit 13 that transports the carrier 2 in a vertical direction intersecting the first direction; a second transport unit 48 that transports the carrier 2 in a second direction that intersects the first direction and the vertical direction, The first conveying unit 11, the second conveying unit 48, and the vertical conveying unit 13 are driven by a first actuator 12, a second actuator 41, and a vertical actuator 14, respectively. The first actuator 12, the second actuator 41 and the vertical actuator 14 are characterized by being isolated from the chemical tank 32 and the cleaning tank 34.

[0052] According to the above configuration, the transport in the first direction by the first transport unit 11 and the transport in the second direction by the second transport unit 48 isolates adjacent chemical tanks 32 and cleaning tanks 34 from the chemical liquid adhering to the transported carriers 2, thereby suppressing contamination by chemical liquid. Furthermore, the actuators 12, 41, and 14 for driving the transport units 11, 48, and 13 that transport the carriers 2 are isolated from the chemical tanks 32 and cleaning tanks 34 so as not to be affected by the chemical liquid. This prevents contamination of the carriers 2 within the chemical module 7 by particles. Furthermore, arranging the chemical tanks 32 and cleaning tanks 34 in the first direction reduces the width of the chemical module 7 in the second direction, thereby enabling the substrate processing apparatus 1 to be miniaturized. Furthermore, because the equipment for performing each process is modularized, connecting other modules 5, 6, and 8 to the chemical module 7 allows for flexible response to changing needs.

[0053] In addition, in the substrate processing apparatus 1 according to one embodiment, The chemical module 7 is configured to be detachably coupled in the second direction.

[0054] According to the above embodiment, it is possible to flexibly respond to the need for changes in the treatment process, and the expandability is high.

[0055] In addition, in the substrate processing apparatus 1 according to one embodiment, The first actuator 12 and the vertical actuator 14 are disposed below the openings of the chemical tank 32 and the cleaning tank 34, respectively.

[0056] According to the above embodiment, contamination within the chemical module 7 due to particles generated from the first actuator 12 and the upper and lower actuators 14 can be suppressed.

[0057] In addition, in the substrate processing apparatus 1 according to one embodiment, The apparatus further includes a carry-in module 5 that carries in the carrier 2 that holds the substrate 4, a drying module 6 that dries the substrate 4 held by the carrier 2, or an unloading module 8 that unloads the carrier 2 that holds the substrate 4, The loading module 5, the drying module 6 and the unloading module 8 are configured to be detachably connected in the second direction.

[0058] According to the above embodiment, it is possible to flexibly respond to the need for changes in the treatment process, and the expandability is high.

[0059] In addition, in the substrate processing apparatus 1 according to one embodiment, The second actuator 41 and the chemical solution tank 32 are separated by a rear wall 38 .

[0060] According to the above embodiment, contamination in the chemical module 7 due to particles generated from the second actuator 41 can be suppressed.

[0061] In addition, in the substrate processing apparatus 1 according to one embodiment, The chemical solution tank 32 is partitioned on its sides in the second direction by a side wall 37 .

[0062] According to the above embodiment, contamination of the chemical liquid stored in the chemical liquid tanks 32 of the adjacent chemical modules 7 due to the atmosphere can be suppressed.

[0063] In addition, in the substrate processing apparatus 1 according to one embodiment, The chemical tank 32 is disposed on the rear side in the first direction, and the cleaning tank 34 is disposed on the front side in the first direction.

[0064] According to the above embodiment, the exhaust duct 39 for exhausting the chemical vapor generated from the chemical tank 32 can be disposed on the rear side in the first direction, which makes maintenance of the substrate processing apparatus 1 easier.

[0065] In the above embodiment, the case where the plurality of substrates 4 are held by the carrier 2 has been described, but the present invention is not limited to this case and may be a carrier-less system. For example, the plurality of substrates 4 may be held directly by the chuck portion 44 or the receiving table 18.

[0066] The second actuator 41 shown in Fig. 4 will now be described with reference to Fig. 12. Fig. 12 is a schematic plan view of the second transport mechanism 9. In Fig. 12, the second transport storage section 40 is not shown.

[0067] As shown in Fig. 12, the second actuator 41 includes an actuator main body 41A and a plurality of rails 41B. The actuator main body 41A is a drive unit that moves in the left-right direction (second direction) along the rails 41B. The rails 41B are members that movably support the actuator main body 41A, and are provided for each module. The plurality of rails 41B are lined up in the second direction to form a continuous path, thereby connecting the plurality of modules.

[0068] When the second actuator 41 is a rack and pinion, the actuator body 41A is a drive unit having a motor, a reduction unit, a pinion gear, etc., and the rail 41B is a rack.

[0069] 12, only one actuator body 41A is provided for each of the rails 41B, and is shared among multiple modules. This reduces the cost of connecting multiple modules. Note that the number of actuator bodies 41A is not limited to one. For example, multiple actuator bodies 41A may be provided when the loading module 5 (loader) and the unloading module 8 (unloader) are arranged separately on the left and right, as in the embodiment.

[0070] In FIG. 4, a plurality of reference numerals 41 are given, and the second actuator 41 has a plurality of rails 41B.

[0071] Next, the relationship between the drive space in which the actuators 12, 14, 41, and 42 are arranged and the processing space in which the substrate 4 is processed will be described with reference to FIGS.

[0072] FIG. 13 is a perspective view showing the chemical module 7, and FIG. 14 is a diagram illustrating the movement of the first transfer section 11 in the chemical module 7. As shown in FIG.

[0073] 13 and 14, the housing 20 forms a processing space A for processing the substrates 4. The processing space A is a space that faces the chemical tank 32 and the cleaning tank 34, and multiple substrates 4 are transported in a front-to-rear direction (first direction) and a lateral direction (second direction). The processing space A is surrounded by a pair of side walls 37 and a rear wall 38.

[0074] 13 and 14, the housing 20 forms a first driving space B1. The first driving space B1 is a space for arranging the first actuator 12 and the vertical actuator 14. The first driving space B1 is formed to the side and below the openings of the chemical tank 32 and the cleaning tank 34 in the second direction.

[0075] 14, the housing 20 forms a second driving space B2. The second driving space B2 is a space for arranging the second actuator 41 and the rotation actuator 42. The second driving space B2 is formed rearward of the processing space A in the first direction, i.e., rearward of the rear wall 38.

[0076] By arranging the actuators 12, 14, 41, and 42 in the driving spaces B1 and B2, the actuators 12, 14, 41, and 42 can be isolated from the processing space A. This makes it possible to prevent foreign matter generated from the actuators 12, 14, 41, and 42 from entering the processing space A, thereby suppressing contamination within the chemical module 7.

[0077] 13 and 14, the second driving space B2 and the processing space A are separated by a rear wall 38, whereas the first driving space B1 and the processing space A are separated by a side exhaust duct 36, as shown in FIG. 13. This is not the only possible case, and for example, the first driving space B1 and the processing space A may be separated by providing a wall that separates them. An example of this will be described with reference to FIG. 15.

[0078] FIG. 15 is a schematic plan view showing a processing space A according to a modified example. As shown in FIG. 15, a bottom wall 50 is provided to surround the periphery of the chemical tank 32 and the cleaning tank 34. The bottom wall 50 is a wall that forms the bottom of the processing space A. An opening 51 is formed in a portion of the bottom wall 50, and a movable wall 52 is provided below the opening 51. The movable wall 52 is disposed to cover the opening 51 and moves in the front-rear direction integrally with the arm 16 that supports the pedestal 18 (arrows L1 and L2). The movable wall 52 is elongated in the front-rear direction and has a length that always covers the entire opening 51 within the range of movement of the arm 16. The arm 16 extends downward to penetrate the movable wall 52 and is connected to the vertical actuator 14. The arm 16 is disposed in close proximity to the through-hole of the movable wall 52 through which the arm 16 penetrates. In the example shown in FIG. 15, a side exhaust duct 36 is not provided.

[0079] 15, by providing a movable wall 52 through which the arm 16 is inserted, the processing space A and the first drive space B1 can be physically separated while allowing the arm 16 to move in the front-rear direction. This makes it possible to more reliably suppress contamination within the chemical module 7.

[0080] Similarly, the rear wall 38 may also be provided with a movable wall through which the pivot arm portion 43 passes.

[0081] In the example shown in FIG. 15 , the receiving table 18 has an upper stage 18A and a lower stage 18B in an outer frame portion that defines a space for accommodating the carrier 2. The upper stage 18A protrudes upward from the lower stage 18B and functions to support the flange 3 of the carrier 2 from below. The lower stage 18B is located below the upper stage 18A and forms a gap for locating the tip of the chuck 44 (claw-shaped) of the second transfer unit 48. By providing the lower stage 18B, even when the flange 3 of the carrier 2 is supported by the upper stage 18A, the chuck 44 of the second transfer unit 48 can support the flange 3 of the carrier 2 at a position different from that of the upper stage 18A. This allows the chuck 44 and the receiving table 18 to hold the carrier 2 without interfering with each other, and allows the carrier 2 to be easily transferred between the chuck 44 and the receiving table 18.

[0082] Next, an example of the operation of the substrate processing apparatus 1 will be described with reference to FIGS. 16A to 16L.

[0083] 16A to 16L are schematic diagrams for explaining an example of the operation of the substrate processing apparatus 1, where (a) shows a plan view of the processing space A, and (b) is a side view showing the peripheral configuration of the receiving table 18 and the substrate 4.

[0084] 16A, first, in the processing space A, the receiving table 18 is on standby above the cleaning tank 34. As shown in (b), the receiving table 18 is disposed at an intermediate position H1, which is above the cleaning tank 34 and at a height position where it does not interfere with the chuck unit 44 of the second transfer unit 48. With the receiving table 18 on standby, as shown in (a), the second transfer unit 48 moves the carrier 2 holding the plurality of substrates 4 laterally (arrow M1).

[0085] 16B, the second transport unit 48 moves the carrier 2 holding the substrate 4 to above the receiving table 18. Thereafter, the receiving table 18 is raised from the intermediate position H1 (arrow M2) so that the carrier 2 is held by the receiving table 18.

[0086] As shown in Fig. 16C, the upper portion 18A of the receiving table 18 is brought into contact with the flange 3 of the carrier 2 to support it from below. As described with reference to Fig. 15, the chuck portion 44 supports the flange 3 of the carrier 2 at a position different from that of the upper portion 18A of the receiving table 18, and does not interfere with the receiving table 18. Thereafter, the chuck portion 44 is rotated in the opening direction (arrow M3) to release the grip on the substrate 4. As a result, the carrier 2 is transferred from the chuck portion 44 to the receiving table 18, as shown in Fig. 16D.

[0087] The receiving base 18 holds the carrier 2 at a raised position H2, which is higher than the intermediate position H1. In this state, the receiving base 18 holding the carrier 2 is moved rearward toward the chemical tank 32 (arrow M4). The chuck portion 44 opens in a direction away from the receiving base 18, and therefore does not interfere with the movement of the carrier 2 and receiving base 18.

[0088] 16E, the carrier 2 and the receiving table 18 move to above the chemical tank 32 and stop there. In this state, the carrier 2 and the receiving table 18 are lowered (arrow M5) to immerse the substrate 4 in the chemical stored in the chemical tank 32. At this time, the chuck portion 44 of the second transport unit 48 is above the cleaning tank 34 and does not interfere with the carrier 2 and the receiving table 18, so it can be retracted laterally (arrow M6). It is also possible to keep the second transport unit 48 on standby above the cleaning tank 34 without retracting it.

[0089] 16F, the cradle 18 is lowered to a lowered position H3, which is a height position at which the plurality of substrates 4 are immersed in the chemical solution. By immersing the substrates 4 in the chemical solution, the surfaces of the substrates 4 can be subjected to a process such as etching.

[0090] Any liquid may be used as the chemical liquid in the chemical liquid tank 32 as long as it can treat the surface of the substrate 4. For example, in the case of an organic chemical liquid, an amine solution such as NMP or monoethanolamine, or acetone may be used, and in the case of an inorganic chemical liquid, SC1 (APM), SC2 (HPM), SPM, HF (hydrofluoric acid), BHF (buffered hydrofluoric acid), etc. may be used. Furthermore, one type of liquid may be used alone, or two or more types of liquids may be combined.

[0091] When the chemical treatment of the substrate 4 is complete, the carrier 2 and the receiving table 18 are raised (arrow M7) to lift the substrate 4. As shown in Figure 16G, the receiving table 18 is raised to the intermediate position H1. In this state, the carrier 2 and the receiving table 18 are moved forward toward the cleaning tank 34 (arrow M8).

[0092] 16H, the carrier 2 and the receiving table 18 move to and stop above the cleaning tank 34. Thereafter, the carrier 2 and the receiving table 18 are lowered (arrow M9) to place the substrate 4 inside the cleaning tank 34.

[0093] As shown in FIG. 16I, with the pedestal 18 lowered to the lowered position H3, the substrate 4 is immersed in cleaning water such as pure water stored in the cleaning tank 34. This allows the surface of the substrate 4 to be rinsed from the chemical solution. The substrate 4 is not limited to being immersed in cleaning water; the cleaning water may also be sprayed onto the substrate 4. Any liquid or method may be used for the rinse process as long as it can replace the chemical solution adhering to the surface of the substrate 4 to a state where it does not cause any problems in the next process. For example, a protic solvent, water, an alcohol such as IPA or ethanol, or an amine solution such as NMP or monoethanolamine may be used. Furthermore, one type of liquid may be used alone, or two or more types of liquids may be combined.

[0094] While the substrates 4 are being rinsed, the retracted second transport unit 48 can be returned to above the cleaning tank 34 (arrow M10). After the chuck unit 44 of the second transport unit 48 is positioned above the cleaning tank 34, the carrier 2 and receiving table 18 holding the substrates 4 for which rinsing has been completed are raised (arrow M11).

[0095] 16J, the receiving table 18 rises to a raised position H2, which is a position for transferring the carrier 2 to the chuck portion 44. In this state, the chuck portion 44 is rotated in the closing direction (arrow M12), and the chuck portion 44 grips the plurality of substrates 4. The chuck portion 44 is inserted into the gap between the lower portion 18B of the receiving table 18 and the flange portion 3 of the carrier 2, and supports the flange portion 3 from below.

[0096] 16K, the receiving base 18 is lowered (arrow M13) while the carrier 2 is held by the chuck portion 44. This releases the carrier 2 from the receiving base 18, and the carrier 2 is transferred from the receiving base 18 to the chuck portion 44.

[0097] 16L, the receiving table 18 retreats to an intermediate position H1 where it does not interfere with the carrier 2 and the chuck portion 44. As a result, the second transfer portion 48 having the chuck portion 44 holding the carrier 2 can move toward the next chemical module 7 (arrow M14).

[0098] 16A to 16L, the chemical tanks 32 and cleaning tanks 34 arranged in the front-to-back direction (first direction) in the processing space A of the chemical module 7 are used to transport the substrate 4 in the front-to-back direction (first transport step), perform chemical processing and rinsing processing on the substrate 4, and once both processes are completed, the substrate 4 can be transported in the sideways direction (second direction) toward the next chemical module 7 (second transport step). By performing the first transport step and the second transport step, a substrate 4 that has been processed by etching or the like can be manufactured.

[0099] When processing substrates 4 in one batch, the operations shown in Figures 16A to 16L can be performed for each batch of substrates 4 for each module. As shown in the schematic plan view of Figure 17, after processing of substrates 4 in chemical module 7A is performed (1), substrates 4 are transported to the next chemical module 7B to perform another process (2), and then substrates 4 are transported to the next chemical module 7C to perform another process (3). The order of operations (1) to (3) is not particularly limited and may be random. In other words, it is not necessary to transport substrates 4 to chemical modules 7A, 7B, and 7C in the order they are lined up and perform processing in each module.

[0100] When processing substrates 4 in multiple batches, as shown in the schematic plan view of FIG. 18, it is possible to process substrate 4A in chemical module 7A (4), while processing another substrate 4B in another chemical module 7B (5), and then process another substrate 4C in yet another chemical module 7C (6). Because modules 7A, 7B, and 7C each have a first transport unit 11 and an upper and lower transport unit 13, substrates can be transported and processed in parallel in each module 7A, 7B, and 7C. The order of operations (4) to (6) is not particularly limited and may be random. For example, substrate 4C may be transported to chemical module 7C, then substrate 4A may be transported to chemical module 7A, and then substrate 4B may be transported to chemical module 7B, and substrates 4A, 4B, and 4C may be processed in each module 7A, 7B, and 7C, respectively.

[0101] As shown in Figure 18, when substrates 4A and 4B are positioned away from above the cleaning tank 34, the chuck unit 44 (not shown) of the second transfer unit 48 can move laterally past the chemical modules 7A and 7B without interfering with the substrates 4A and 4B, the carrier 2 (not shown in Figures 17 and 18), or the receiving table 18 (7). After moving to chemical module 7C, the second transfer unit 48 can receive the processed substrate 4C and transfer it to the next chemical module 7 (8). After delivering the substrate 4C to the next chemical module 7, the second transfer unit 48 moves to the chemical module 7A or 7B where processing of substrates 4A and 4B has been completed (9), receive the processed substrate, and transfer it to the next chemical module 7.

[0102] According to the above operation, multiple batches of substrates 4A, 4B, and 4C can be processed in parallel in each module, and the second transport unit 48, which straddles the modules, can be moved laterally during the processing. This makes it possible to achieve operations that could not be achieved with a configuration in which multiple tanks are arranged in a row in the horizontal direction, as in conventional substrate processing apparatuses, and significantly improves processing efficiency.

[0103] (Action / Effect 1)

[0104] As described above, the chemical module 7 (substrate processing module) of the embodiment includes a cleaning tank 34 (first tank) and a chemical tank 32 (second tank) arranged in a first direction and capable of placing a substrate 4, a first transport unit 11 that moves the substrate 4 in the first direction, and a second transport unit 48 that moves the substrate 4 in a second direction intersecting the first direction.

[0105] According to this configuration, by arranging the cleaning tanks 34 and the chemical tanks 32 in a first direction and providing a first transport unit 11 that transports the substrates 4 in the first direction and a second transport unit 48 that transports the substrates 4 in a second direction, the substrates 4 can be transported in different directions (MD and TD). This allows the installation area of ​​the entire apparatus to be smaller than in conventional substrate processing apparatuses in which multiple tanks are arranged in only one direction. Furthermore, by providing the first transport unit 11 and the second transport unit 48 separately, different substrates 4 can be transported and processed by the first transport unit 11 and the second transport unit 48, thereby improving processing efficiency.

[0106] Furthermore, the chemical module 7 of the embodiment further includes a vertical transport unit 13 that moves the substrate 4 up and down, and the vertical transport unit 13 is connected to the first transport unit 11, which moves the vertical transport unit 13 in the first direction. With this configuration, the second transport unit 48 can omit the function of moving the substrate 4 up and down and the function of moving it in the first direction, thereby simplifying the movement of the substrate 4.

[0107] Furthermore, the chemical module 7 of the embodiment can be connected to another module (the load module 5, the drying module 6, the chemical module 7, or the unload module 8) in the second direction. This allows the substrate 4 to be transported between multiple modules using the second transport unit 48.

[0108] Furthermore, in the chemical module 7 of the embodiment, the second actuator 41 of the second transport unit 48 is shared with another module. With this configuration, it is possible to reduce the cost of connecting the chemical module 7 to another module.

[0109] Furthermore, in the chemical module 7 of the embodiment, the second transport section 48 includes rails 41B extending in the second direction, and the rails 41B are arranged to be aligned with the rails 41B of other modules in the second direction. With this configuration, the modules can be connected to each other using a simple structure.

[0110] Moreover, the chemical module 7 of the embodiment further includes a pair of side walls 37 that sandwich the cleaning tank 34 and the chemical tank 32 in the second direction, and the side walls 37 form a gap 37a that allows the second transport unit 48 to pass through. With this configuration, movement between modules by the second transport unit 48 can be achieved with a simple configuration. Furthermore, the size of the gap 37a can be kept to a size that allows the second transport unit 48 to pass through, thereby suppressing contamination between modules.

[0111] Furthermore, in the chemical module 7 of the embodiment, the cleaning tank 34 is disposed on the front side in the first direction, the chemical tank 32 is disposed on the rear side in the first direction, and the second transport unit 48 moves the substrate 4 above the cleaning tank 34. With this configuration, it is possible to reduce contamination between the chemical tanks 32 between modules. Furthermore, when an operator checks the inside of the chemical module 7 from the front, the substrate 4 being transported by the second transport unit 48 can be easily seen.

[0112] In addition, in the chemical module 7 of the embodiment, the other module connected to the chemical module 7 in the second direction is any one of the load module 5, the unload module 8, the drying module 6, and the chemical module 7. With this configuration, modules with various functions can be connected as other modules.

[0113] Furthermore, the substrate processing apparatus 1 of the embodiment includes the chemical module 7 and another module (the load module 5, the drying module 6, the chemical module 7, or the unload module 8) connected in the second direction to the chemical module 7. With this configuration, it is possible to realize a substrate processing apparatus 1 with a small installation area and high processing efficiency.

[0114] Furthermore, the substrate manufacturing method (substrate processing method) of the embodiment includes a first transport process of transporting the substrate 4 in a first direction in a chemical module 7 (substrate processing module) so as to move between a cleaning tank 34 (first tank) and a chemical tank 32 (second tank) arranged in the first direction, and a second transport process of transporting the substrate 4 in a second direction intersecting the first direction.

[0115] According to this method, the substrate 4 can be transported in different directions (MD and TD) in the chemical module 7. This makes it possible to reduce the installation area of ​​the entire apparatus and improve processing efficiency compared to conventional substrate processing apparatuses in which multiple tanks are arranged in only one direction. Note that the second transport step may be performed manually by an operator.

[0116] (Action / Effect 2)

[0117] As described above, the chemical module 7 (substrate processing module) of the embodiment includes a cleaning tank 34 (first tank) and a chemical tank 32 (second tank) arranged in a first direction and capable of accommodating a substrate 4, a first transport unit 11 that moves the substrate 4 in the first direction, a second transport unit 48 that moves the substrate 4 in a second direction intersecting the first direction, and a vertical transport unit 13 that is connected to the first transport unit 11 and moves the substrate 4 up and down. The first actuator 12 of the first transport unit 11 and the second actuator 41 of the second transport unit 48 are disposed in drive spaces B1 and B2, respectively, which are isolated from the processing space A accessible to the cleaning tank 34 and the chemical tank 32.

[0118] According to this configuration, by arranging the cleaning tanks 34 and the chemical tanks 32 in a first direction and providing a first transport unit 11 that transports the substrates 4 in the first direction and a second transport unit that transports the substrates 4 in a second direction, the substrates 4 can be transported in different directions (MD and TD). This allows the installation area of ​​the entire apparatus to be smaller than when multiple tanks are arranged in only one direction as in conventional substrate processing apparatuses. Furthermore, by arranging the two actuators 12 and 41 in drive spaces B1 and B2 isolated from the processing space A, foreign matter generated by the actuators 12 and 41 is less likely to enter the processing space A, and contamination within the chemical module 7 can be suppressed.

[0119] In the chemical module 7 of the embodiment, the first actuator 12 is disposed in the first driving space B1, and the second actuator 41 is disposed in the second driving space B2. With this configuration, by disposing the first actuator 12 and the second actuator 41 in the driving spaces B1 and B2, respectively, the space within the module can be used effectively.

[0120] In the chemical module 7 of the embodiment, the first driving space B1 is provided to the side and below the openings of the cleaning tank 34 and the chemical tank 32, and the second driving space B2 is provided behind the processing space A in the first direction. This configuration allows the space within the chemical module 7 to be used effectively.

[0121] Moreover, the chemical module 7 of the embodiment further includes a rear wall 38 provided behind the processing space A, and the second driving space B2 is provided behind the rear wall 38. With this configuration, by separating the processing space A and the first driving space B1 with the rear wall 38, foreign matter generated from the first actuator arranged in the first driving space B1 is less likely to enter the processing space A, thereby suppressing contamination.

[0122] In addition, in the chemical module 7 of the embodiment, the rear wall 38 forms an exhaust port 39a for exhausting the atmosphere in the processing space A to the outside. With this configuration, even if a foreign object enters the processing space A, the foreign object can be exhausted to the outside through the exhaust port 39a.

[0123] Furthermore, in the chemical module 7 of the embodiment, the second transport unit 48 includes a pivoting arm unit 43 (arm) that extends forward from the second drive space B2 and passes through an opening 38a provided in the rear wall 38, and a chuck unit 44 that is connected to the pivoting arm unit 43 and is disposed above the cleaning tank 34. With this configuration, the second transport unit 48 can be realized using a simple structure. Furthermore, the opening 38a in the rear wall 38 only needs to have an area large enough to allow the pivoting arm unit 43 to pass through. Therefore, by minimizing the area of ​​the opening 38a, it is possible to make it difficult for foreign matter generated by the second actuator 41 to enter the processing space A.

[0124] Furthermore, in the chemical module 7 of the embodiment, the second driving space B2 can be connected to another module. With this configuration, by making the second driving space B2 connectable, modules can be easily connected to each other.

[0125] Furthermore, in the chemical module 7 of the embodiment, the second transport unit 48 further includes a rotary actuator 42 that rotates the chuck unit 44 for gripping the substrate 4, and the rotary actuator 42 is disposed in the second driving space B2. According to this configuration, by disposing the rotary actuator 42 in the second driving space B2 together with the second actuator 41, it is possible to prevent foreign matter generated by the rotary actuator 42 from entering the processing space A, thereby suppressing contamination.

[0126] In the chemical module 7 of the embodiment, the vertical actuators 14 of the vertical transfer unit 13 are arranged in the first driving space B1. According to this configuration, by arranging the vertical actuators 14 together with the first actuator 12 in the first driving space B1, it is possible to prevent foreign matter generated by the vertical actuators 14 from entering the processing space A, thereby suppressing contamination.

[0127] In the embodiment, a cleaning tank 34 and a chemical tank 32 are provided as two tanks (first tank and second tank), but this is not a limitation. For example, as shown in the schematic plan view of FIG. 19, different combinations of tanks may be used in each of chemical modules 7A, 7B, and 7C. In the example shown in FIG. 19, the first tank 34A of chemical module 7A is a cleaning tank and the second tank 32A is a chemical tank, while both the first tank 34B and the second tank 32B of chemical module 7B are chemical tanks, and both the first tank 34C and the second tank 32C of chemical module 7C are one-bath treatment tanks. A one-bath treatment tank is a tank that performs both chemical treatment and cleaning treatment, and has the function of supplying and draining chemical liquid and the function of supplying and draining cleaning liquid.

[0128] The chemical solutions used in the first tank 34B and the second tank 32B of the chemical module 7B may be the same or different, and the chemical solutions used in the first tank 34C and the second tank 32C of the chemical module 7C may also be the same or different.

[0129] 19, the combination of the first tank and the second tank is not limited to the cleaning tank 34 and the chemical tank 32, and various other combinations can be used. The first tank and the second tank may be any of a chemical tank, a cleaning tank, or a single-bath treatment tank, and any combination may be used.

[0130] As described above, in the chemical module 7 of the embodiment, each of the first tank and the second tank is either a chemical tank for treating the substrate 4 with a chemical solution, a cleaning tank for cleaning the substrate 4, or a one-bath treatment tank that has the functions of both chemically treating and cleaning the substrate 4. With this configuration, the first tank and the second tank can be combined in various ways.

[0131] (Sink drawer) In order to improve the maintainability of the chemical tank 32, the cleaning tank 34, and their peripheral members, the chemical module 7 of the embodiment is further provided with a substrate processing unit 45 that is configured to be removable from the housing 20. The configuration of the substrate processing unit 45 will be described with reference to FIGS. 20 to 22.

[0132] Fig. 20 is a perspective view of the plurality of chemical modules 7A, 7B, and 7C as seen from the front side of the housing 20. Figs. 21 and 22 are perspective views of the plurality of chemical modules 7A, 7B, and 7C as seen from the rear side of the housing 20.

[0133] 20 , the chemical module 7 has a substrate processing unit 45 that is separate from the housing 20 and can be pulled out relative to the housing 20. The substrate processing unit 45 has a sink tank 47 that houses the chemical tank 32 and the cleaning tank 34. The sink tank 47, including the chemical tank 32 and the cleaning tank 34, is separate from the housing 20 and can be pulled out as a unit. The substrate processing unit 45 of this embodiment can be pulled out to the front side N1 of the housing 20 and pulled back to the rear side N2 through an opening 49 provided in the front side N1 of the housing 20.

[0134] In addition to the chemical tank 32 and the cleaning tank 34, the sink tank 47 is provided with multiple pipes 56, 57 (FIGS. 21 and 22) and other piping-related components (pumps, filters, heaters, valves, concentration meters, etc.), and these components can also be pulled out together with the sink tank 47. This allows maintenance of the chemical tank 32, the cleaning tank 34, and their surrounding components to be performed with the sink tank 47 pulled out to the outside of the housing 20. The other piping-related components are themselves unitized and can be pulled out together with the sink tank 47, or can be pulled out as individual units separately from the sink tank 47. In other words, the other unitized piping-related components can also be pulled out on their own.

[0135] According to the above configuration, unlike conventional configurations in which the chemical tank and the cleaning tank are fixed to the housing, there is no need for an operator to enter the housing 20 to perform maintenance work, and maintenance work can be performed outside the housing 20, thereby achieving high maintainability. Furthermore, when changing the treatment process of the chemical module 7, the substrate treatment unit 45 of the chemical module 7 can be replaced with another unit, so that changes to the treatment process can be handled flexibly and quickly.

[0136] 20 illustrates a state in which the sink tank 47 of the central chemical module 7B among the three chemical modules 7A, 7B, and 7C is pulled out to the front side N1, and the openings 49 of the adjacent chemical modules 7A and 7C are closed by panels 54. The panels 54 are detachable from the housing 20, and by removing the panels 54 of the chemical modules 7A and 7C, the internal sink tanks 47 can be pulled out.

[0137] The sink 47 further has a first storage space S1 and a second storage space S2 as spaces for storing various components.

[0138] The first storage space S1 is a space that stores the chemical tank 32, the cleaning tank 34, etc. The first storage space S1 is provided above the sink tank 47, opens upward, and is surrounded on all four sides by walls.

[0139] The second storage space S2 is a space that stores the piping 56 and the like. The second storage space S2 extends below the first storage space S1 along the Y-axis direction (first direction), and extends from the front surface 58 of the sink tank 47 to the rear surface 78 (FIGS. 21 and 22). The piping 56 is a piping for supplying and disposing of a cleaning liquid (e.g., pure water) used in the cleaning tank 34. The piping 56 is inserted through an opening 60 provided in the front surface 58 of the sink tank 47 and connected to the cleaning tank 34. The piping 56, which extends from the cleaning tank 34 and is stored in the second storage space S2, extends toward the rear surface N2 of the sink tank 47.

[0140] An opening 62 different from opening 49 is provided above opening 49. Opening 62 is an opening that allows visibility and access to cleaning tank 34, chemical tank 32, etc., arranged inside housing 20, and is closed by panel 64. In the example shown in Fig. 20, opening 62 of chemical module 7A is closed by panel 64, and openings 62 of chemical modules 7B and 7C are in an open state.

[0141] 20 , two tank openings 66, 68 provided inside the housing 20 are visible and accessible through the opening 62. The tank openings 66, 68 are openings fixedly formed in the housing 20 so as to expose the chemical tank 32 and cleaning tank 34 described above, respectively. When a sink tank 47 containing the chemical tank 32 and the cleaning tank 34 is placed inside the housing 20, as in chemical module 7C, the chemical tank 32 is exposed at the tank opening 66, and the cleaning tank 34 is exposed at the tank opening 68.

[0142] The chemical tank 32 and the cleaning tank 34 are separated from the housing 20 via the tank openings 66, 68. By separating the chemical tank 32 and the cleaning tank 34 from the housing 20 and by separating the sink tank 47 from the housing 20, it is possible to configure a substrate processing unit 45 that can be pulled out with respect to the housing 20. Furthermore, by separating the substrate processing unit 45 from the housing 20, the chemical liquid and cleaning liquid generated in the chemical tank 32 and the cleaning tank 34 are less likely to adhere to the housing 20, which can suppress corrosion of the housing 20 and improve the durability of the chemical module 7.

[0143] As shown in FIGS. 21 and 22, the rear side N2 of the housing 20 is provided with two types of openings 70 and 72 and two types of panels 74 and 76.

[0144] The upper opening 70 is an opening that allows visibility and access to the aforementioned tank openings 66, 68, etc., and can be opened and closed by a panel 74. The lower opening 72 is an opening that allows visibility and access to the aforementioned sink tank 47, etc., and can be opened and closed by a panel 76.

[0145] 21 and 22, the upper row illustrates a state in which openings 70 of chemical modules 7A and 7B are open, and opening 70 of chemical module 7C is closed by panel 74. The lower row illustrates a state in which opening 72 of chemical module 7B is open, and openings 72 of chemical modules 7A and 7C are closed by panel 76.

[0146] A pipe 57 is provided on the rear surface 78 of the sink tank 47. The pipe 57 is a pipe separate from the pipe 56 described above, and is connected to the chemical tank 32. The pipe 57 is a pipe for supplying and disposing of the chemical liquid used in the chemical tank 32, and is inserted through an opening 80 provided on the rear surface 78 of the sink tank 47 and connected to the chemical tank 32. The pipe 57 is not disposed in the second storage space S2, but extends from the rear surface 78 of the sink tank 47 toward the rear side N2.

[0147] An exhaust duct 82 is also connected to the rear surface 78 of the sink tank 47. The exhaust duct 82 is a duct for exhausting gas generated inside the sink tank 47 to the outside of the housing 20. The exhaust duct 82 can be attached to an exhaust port 84 that is fixedly provided in the housing 20. A connection pipe 85 is connected to the exhaust port 84 for connecting the exhaust duct 82 to the outside.

[0148] A plurality of couplers 86 are further provided on the rear side N2 of the housing 20. The couplers 86 are connection parts (e.g., one-touch couplers) for connecting pipes such as the pipes 56 and 57 to the outside. The plurality of couplers 86 are attached to a plate part 87 fixed to the housing 20.

[0149] FIG. 21 shows the sink 47 pulled out to the front side N1, and FIG. 22 shows the sink 47 pulled back to the rear side N2 (the sink 47 is installed inside the housing 20).

[0150] 22, when the sink tank 47 is pulled back to the rear side N2, both pipes 56, 57 are in a position that can reach the coupler 86, and when an operator attaches the ends of the pipes 56, 57 to the coupler 86, the pipes 56, 57 are connected to an external supply source, a waste outlet, etc. The same applies to the exhaust duct 82; when an operator attaches the exhaust duct 82 to the exhaust outlet 84, the exhaust duct 82 is connected to the outside.

[0151] Rails 88 that enable the sink tub 47 to be pulled out are further provided inside the housing 20. The rails 88 are members that extend along the Y-axis direction (first direction), and in this embodiment are made up of three rails 88A, 88B, and 88C. The rails 88A and 88B at both ends have, for example, an L-shaped shape that stands up so as to sandwich the left and right corners of the sink tub 47, and allow the sink tub 47 to travel while being positioned in the X-axis direction (second direction).

[0152] In the above configuration, to transition from the operating state shown in Fig. 22 to the maintenance state shown in Fig. 21, an operator manually detaches the pipes 56 and 57 from the coupler 86 and removes the exhaust duct 82 from the exhaust port 84. After disconnecting the other components as needed, the operator pushes the sink tank 47 to the front side N1, causing the sink tank 47 to move along the rails 88. This allows the substrate processing unit 45 including the sink tank 47 to be pulled out of the housing 20. In this way, the substrate processing unit 45 can be easily pulled out.

[0153] According to the above configuration, by separating the chemical tank 32, the cleaning tank 34, and the sink tank 47 from the housing 20 and configuring the sink tank 47 to be removable from the housing 20, workers can easily perform maintenance, thereby realizing a chemical module 7 and a substrate processing unit 45 with improved maintainability.

[0154] Furthermore, by configuring the sink tank 47 to be removable along the Y-axis direction (first direction) while the chemical tank 32 and the cleaning tank 34 are aligned in the Y-axis direction (first direction), it is possible to reduce the dimension (width) of the chemical module 7 in the X-axis direction while ensuring high maintainability. As a result, even when multiple chemical modules 7 are connected in the X-axis direction, the substrate processing apparatus 1 is unlikely to become large, and space-saving of the substrate processing apparatus 1 can be achieved.

[0155] (Actions and Effects)

[0156] As described above, the chemical module 7 (substrate processing module) of the embodiment includes a housing 20 and a sink tank 47 that houses two chemical tanks 32 and two cleaning tanks 34 (processing tanks) in which substrates 4 can each be placed, arranged in the Y-axis direction (first direction), and the sink tank 47 is arranged inside the housing 20, while the sink tank 47, the chemical tank 32, and the cleaning tank 34 are separated from the housing 20.

[0157] With this configuration, the sink tank 47 can be configured to be removable from the housing 20, and the chemical tank 32, cleaning tank 34, and other components housed in the sink tank 47 can be maintained while they are removed from the housing 20. This allows for high maintainability. In this specification, the tanks that perform any processing (including chemical processing and cleaning processing) on ​​the substrates 4, including the chemical tank 32 and cleaning tank 34, are referred to as "processing tanks."

[0158] Furthermore, in the chemical module 7 of the embodiment, the sink tank 47 can be pulled out along the Y-axis direction (first direction) relative to the housing 20. With this configuration, the dimension of the chemical module 7 in the X-axis direction can be reduced, thereby achieving space savings.

[0159] Furthermore, in the chemical module 7 of the embodiment, the sink tank 47 can be pulled out to the front side N1 of the housing 20. With this configuration, maintenance work can be performed on the front side N1 of the sink tank 47, and other work (including work to attach and detach the pipes 56, 57 and the exhaust duct 82) can be performed on the rear side N2 of the housing 20.

[0160] Moreover, the chemical module 7 of the embodiment further includes a pipe 56 connected to the cleaning tank 34 (treatment tank), and the sink tank 47 forms a first storage space S1 that stores the cleaning tank 34 and a second storage space S2 that stores the pipe 56 extending from the cleaning tank 34. With this configuration, in addition to the chemical tank 32 and the cleaning tank 34, other components such as the pipe 56 can be pulled out as a unit for maintenance.

[0161] In addition, in the chemical module 7 of the embodiment, the second storage space S2 is provided below the first storage space S1. With this configuration, the spaces above and below the sink tank 47 can be effectively utilized, and the dimensions of the sink tank 47 in the X-axis direction can be reduced, thereby saving space.

[0162] Moreover, the chemical module 7 of the embodiment further includes a coupler 86 that detachably connects the piping 56 extending from the second storage space S2. With this configuration, the sink tank 47 can be easily pulled out by removing the piping 56 from the coupler 86.

[0163] Furthermore, in the chemical module 7 of the embodiment, the housing 20 has rails 88 along which the sink 47 runs. With this configuration, the sink 47 can be made removable using a simple mechanism.

[0164] Furthermore, the chemical module 7 of the embodiment is connectable to another chemical module 7 in the X-axis direction (second direction) that intersects with the Y-axis direction (first direction), and further includes a first transport unit 11 that moves the substrate 4 in the Y-axis direction and a second transport unit 48 that moves the substrate 4 in the X-axis direction. With this configuration, the chemical modules 7 can be connected in the X-axis direction, while the sink tank 47 in each chemical module 7 can be pulled out.

[0165] Moreover, the substrate processing apparatus 1 of the embodiment includes a chemical module 7 (substrate processing module) and another chemical module 7 connected to the chemical module 7 in an X-axis direction (second direction) that intersects with the Y-axis direction (first direction). With this configuration, it is possible to realize a substrate processing apparatus 1 that is easy to maintain while allowing a plurality of chemical modules 7 to be connected.

[0166] Furthermore, the substrate processing unit 45 of the embodiment includes a chemical tank 32 and a cleaning tank 34 (two processing tanks) in which substrates 4 can be placed, and a sink tank 47 that houses the chemical tank 32 and the cleaning tank 34 arranged in the Y-axis direction (first direction), and the sink tank 47, the chemical tank 32, and the cleaning tank 34 are separated from the housing 20 of the chemical module 7 in which the sink tank 47 is placed. With this configuration, it is possible to achieve the same effects as the chemical module 7 of the embodiment (see paragraph 0157).

[0167] Furthermore, in the substrate processing unit 45 of the embodiment, the sink tank 47 can be pulled out along the Y-axis direction (first direction) relative to the housing 20 of the chemical module 7. With this configuration, the dimension of the substrate processing unit 45 in the X-axis direction can be reduced, thereby saving space.

[0168] (Leveling mechanism) The chemical module 7 of the embodiment is further provided with a leveling mechanism for leveling the chemical tank 32 and the cleaning tank 34 in order to improve the efficiency of overflow treatment in the chemical tank 32 and the cleaning tank 34. The leveling mechanism will be described with reference to Figs. 23 to 28.

[0169] FIG. 23 is a schematic diagram of the substrate processing unit 45 including the leveling mechanisms 90 and 91 as seen from the side, and FIGS. 24A and 24B are schematic diagrams of the chemical tank 32 and the cleaning tank 34 as seen from the front, respectively.

[0170] 23, leveling mechanisms 90 and 91 are provided inside the sink tank 47 of the substrate processing unit 45. The leveling mechanism 90 is a mechanism for leveling the chemical tank 32, and the leveling mechanism 91 is a mechanism for leveling the cleaning tank 34.

[0171] Leveling mechanism 90 includes a height changing portion 92, a contact portion 93, and a support portion 94. Similarly, leveling mechanism 91 includes a height changing portion 95, a contact portion 96, and a support portion 97. The individual components of leveling mechanisms 90 and 91 have similar structures, and the following description will mainly focus on leveling mechanism 90.

[0172] The height changer 92 of the leveling mechanism 90 is a member for changing the height of a specific location in the chemical tank 32. The height changer 92 of this embodiment is provided on the rear side N2 of the chemical tank 32.

[0173] 24A, the height adjustment unit 92 has two height adjustment units 92A and 92B spaced apart in the X-axis direction. The height adjustment unit 92A abuts against the corner 32A of the chemical solution tank 32 on the left side of the figure, and the height adjustment unit 92B abuts against the corner 32B of the chemical solution tank 32 on the right side of the figure. The height adjustment unit 92A is provided on an inner wall surface 47A on one side of the sink tank 47, and the height adjustment unit 92B is provided on the inner wall surface 47A on the other side of the sink tank 47. The heights of the height adjustment units 92A and 92B can be changed independently.

[0174] The contact portion 93 is a member provided in the chemical liquid tank 32, and comes into contact with the support portion 94. In this embodiment, the contact portion 93 has a convex spherical surface, and is also referred to as a "ball portion." The support portion 94 is a member that comes into contact with the contact portion 93 and supports the contact portion 93. In this embodiment, the support portion 94 has a concave spherical surface that receives the contact portion 93, which is a ball portion, and is also referred to as a "ball receiving portion."

[0175] The attitude of the chemical tank 32 can be freely adjusted by receiving and supporting the contact portion 93 provided on the chemical tank 32 with the support portion 94. By changing the height of the chemical tank 32 at two locations using the height adjustment portions 92A and 92B described above, the attitude of the chemical tank 32 can be adjusted in any direction, and the parallelism of the chemical tank 32 can be maintained with high precision. This makes it easier to make the chemical tank 32 overflow evenly from the four sides when processing substrates 4 by causing the chemical tank 32 to overflow, thereby improving the processing efficiency of the substrates 4.

[0176] Furthermore, compared to providing height-adjusting sections at each of the four corners of the chemical tank 32, it is only necessary to change the height of two corners, so leveling work can be done easily and in a short time, achieving high maintainability.

[0177] The same is true for leveling mechanism 91, where height changing portion 95 has the same structure as height changing portion 92, contact portion 96 has the same structure (ball portion) as contact portion 93, and support portion 97 has the same structure (ball receiving portion) as support portion 94. As shown in FIG. 24B, contact portion 96 provided on cleaning tank 34 is received and supported by support portion 97, and the height of cleaning tank 34 is changed using two height changing portions 95A and 95B, allowing the attitude of cleaning tank 34 to be freely adjusted. This makes it easier for cleaning liquid to overflow evenly from the four sides of cleaning tank 34, improving the processing efficiency of substrates 4.

[0178] 23, in the leveling mechanism 90 of the chemical tank 32, the height changing unit 92 is provided on the rear side N2, and the contact unit 93 and the support unit 94 are provided on the front side N1. In contrast, in the leveling mechanism 91 of the cleaning tank 34, the height changing unit 95 is provided on the front side N1, and the contact unit 96 and the support unit 97 are provided on the rear side N2.

[0179] According to the above arrangement, when leveling the chemical tank 32, the worker need only access the height adjustment unit 92 from the rear surface 78 of the sink tank 47, and when leveling the cleaning tank 34, the worker need only access the height adjustment unit 95 from the front surface 58 of the sink tank 47. Therefore, there is no need to access the center of the sink tank 47, and the height adjustment units 92, 95 can be easily accessed from outside the sink tank 47, making leveling work easy.

[0180] Here, the specific configuration of the height changers 92, 95 will be described with reference to Figure 25. Figure 25 is a schematic enlarged view of the height changer 92 (95) as viewed from the side.

[0181] As shown in FIG. 25, the height adjusting section 92 (95) includes a receiving base 100, an adjustment bolt 102, and a guide section 104.

[0182] The receiving base 100 is a plate-shaped portion for receiving the corners 32A and 32B of the chemical tank 32. The receiving base 100 is supported from below by an adjustment bolt 102. The adjustment bolt 102 is a member for raising and lowering the receiving base 100, and is positioned with its head 103 facing downward. When an operator rotates the head 103 of the adjustment bolt 102 (arrow R), the adjustment bolt 102 and the receiving base 100 supported by the adjustment bolt 102 move up and down together (arrow Z1). This allows the heights of the corners 32A and 32B of the chemical tank 32 to be individually adjusted.

[0183] The adjustment bolt 102 is threadedly engaged with a guide portion 104. The guide portion 104 supports the bolt 102 in a threaded state and guides the up and down movement of the receiving base 100. The guide portion 104 has a substantially L-shaped cross section and is inserted into a through-hole 106 formed in the receiving base 100. The receiving base 100 supported by the adjustment bolt 102 moves up and down while maintaining an engagement relationship with a portion of the guide portion 104 that rises in the vertical direction, thereby moving up and down while maintaining a generally horizontal state.

[0184] Guide portion 104 is fixed to inner wall surfaces 47A, 47B (FIG. 24A) of sink tank 47. In contrast, pedestal 100 and adjustment bolt 102 are separated from inner wall surfaces 47A, 47B, and pedestal 100 with chemical solution tank 32 placed on it can move up and down relative to guide portion 104 and sink tank 47.

[0185] Next, the specific configuration of the contact portion 93 and the support portion 94 will be described with reference to Fig. 26. Fig. 26 is a schematic enlarged view of the vertical cross section of the contact portion 93 (96) and the support portion 94 (97).

[0186] 26, the chemical liquid tank 32 is provided with an attachment portion 107 for attaching the contact portion 93. The contact portion 93 is attached to the lower surface of the attachment portion 107.

[0187] Contact portion 93 is a ball portion having a convex spherical surface 108, and support portion 94 that receives contact portion 93 is a ball receiving portion having a concave spherical surface 110. In this embodiment, the radii of curvature of spherical surfaces 108 and 110 are different. Specifically, radius of curvature D1 of spherical surface 108 is set shorter than radius of curvature D2 of spherical surface 110. Setting the radii of curvature in this manner ensures that when convex spherical surface 108 contacts concave spherical surface 110, contact point 112 is approximately a single point, resulting in so-called point contact. By establishing point contact between contact portion 93 and support portion 94, spherical surface 108 can move smoothly along spherical surface 110, facilitating adjustment of the attitude of chemical solution tank 32. Note that as long as contact portion 93 and support portion 94 are in point contact, radii of curvature D1 and D2 may be any length, including, for example, a rod-shaped or cone-shaped structure with a minute spherical tip.

[0188] The relative positions of the leveling mechanisms 90, 91 having the above-described configuration will be described with reference to Figures 27 and 28. Figures 27 and 28 are schematic plan views of a sink tank 47 that includes the chemical tank 32, the cleaning tank 34, and the leveling mechanisms 90, 91. Figure 27 shows the state in which the chemical tank 32 and the cleaning tank 34 are placed in the sink tank 47, while Figure 28 shows the state in which the chemical tank 32 and the cleaning tank 34 have been removed from the sink tank 47.

[0189] As shown in Figure 27, the chemical liquid tank 32 further has two rod-shaped portions 114. The rod-shaped portions 114 are fixed to the side surfaces of the chemical liquid tank 32 and extend in a rod-like shape along the Y-axis direction. One end of each of the rod-shaped portions 114 is supported by a receiving base 100 of the height adjustment units 92A, 92B. By supporting one end of the rod-shaped portions 114 on the receiving base 100, the height of the receiving base 100 can be changed, thereby adjusting the posture of the chemical liquid tank 32.

[0190] Similarly, the cleaning tank 34 has two rod-shaped portions 116. The rod-shaped portions 116 are supported by pedestals 100 of the height-adjusting portions 95A and 95B, respectively, and the posture of the cleaning tank 34 can be adjusted by changing the height of the pedestals 100.

[0191] 27, the mounting part 107 to which the contact parts 93, 96 are integrally attached is provided on the front side N1 of the chemical tank 32, whereas it is provided on the rear side N2 of the cleaning tank 34. As a result, the mounting part 107 of the chemical tank 32 and the mounting part 107 of the cleaning tank 34 are disposed adjacent to each other in the center of the sink tank 47. By disposing the two mounting parts 107 together in the center of the sink tank 47, height adjustment can be performed at the end of the sink tank 47, eliminating the need to access the center of the sink tank 47, making it possible to effectively utilize the space in the sink tank 47 and facilitating posture adjustment.

[0192] 28, when the chemical tank 32 and the cleaning tank 34 are removed from the sink tank 47, the support parts 94 and 97 are provided on the bottom surface 51C of the sink tank 47, and the guide part 104 is provided on the inner wall surfaces 47A and 47B of the sink tank 47. Although not shown, the receiving base 100 and the adjustment bolt 102 are also engaged with the guide part 104, and the height adjustment parts 92A, 92B, 95A, and 95B are all provided on the sink tank 47.

[0193] In this embodiment, support portions 94, 97, which are ball receiving portions, and height adjusting portions 92, 95 are provided in sink tank 47, and contact portions 93, 96, which are ball portions, are provided in chemical tank 32 and cleaning tank 34 (treatment tank). In this way, leveling mechanisms 90, 91 can be easily installed at the contact points between sink tank 47 and chemical tank 32 and cleaning tank 34.

[0194] According to the above configuration, the leveling mechanism 90 for leveling the chemical tank 32 has two height change units 92, a contact unit 93, and a support unit 94, and the leveling mechanism 91 for leveling the cleaning tank 34 similarly has two height change units 95, a contact unit 96, and a support unit 97. This makes it easier to level the chemical tank 32 and the cleaning tank 34 than in the conventional configuration, where the height is changed at the four corners of the processing tank, and achieves high maintainability.

[0195] (Actions and Effects) As described above, the chemical module 7 (substrate processing module) of the embodiment comprises a housing 20, a cleaning tank 34 and a chemical tank 32 (processing tanks) arranged in the Y-axis direction (first direction) within the housing 20 and capable of placing substrates 4, respectively, and leveling mechanisms 91, 90 for leveling the cleaning tank 34 and the chemical tank 32, and the leveling mechanisms 91, 90 each have contact portions 96, 93 provided in the cleaning tank 34 and the chemical tank 32, support portions 97, 94 that contact and receive the contact portions 96, 93, and at least two height change portions 95A, 95B, 92A, 92B for changing the height of the cleaning tank 34 and the chemical tank 32, respectively.

[0196] According to this configuration, in a chemical module 7 in which two treatment tanks are arranged, the treatment tanks can be easily leveled using a simple configuration, thereby realizing a chemical module 7 that is easy to maintain. Note that the contact portions 96, 93 only need to be at least partially spherical, and may be entirely spherical, for example. Furthermore, there is no particular limitation on the size of the sphere.

[0197] In the chemical module 7 of the embodiment, the processing tank includes a cleaning tank 34 (first tank) and a chemical tank 32 (second tank), and the leveling mechanisms 91 and 90 include a leveling mechanism 91 (first leveling mechanism) for leveling the cleaning tank 34 and a leveling mechanism 90 (second leveling mechanism) for leveling the chemical tank 32. The leveling mechanism 91 includes a contact portion 96, a support portion 97, and two height change portions 95A and 95B for changing the height of the cleaning tank 34, and the leveling mechanism 90 includes a contact portion 93, a support portion 94, and two height change portions 92A and 92B for changing the height of the chemical tank 32. This configuration allows the cleaning tank 34 and the chemical tank 32 to be leveled with high precision.

[0198] Furthermore, in the chemical module 7 of the embodiment, the cleaning tank 34 is disposed on the front side N1 of the housing 20 with respect to the chemical tank 32, the height changer 95 of the leveling mechanism 91 is provided on the front side N1 of the cleaning tank 34, and the height changer 92 of the leveling mechanism 90 is provided on the rear side N2 of the chemical tank 32. With this configuration, the leveling of the cleaning tank 34 can be adjusted by accessing it from the front side N1 of the housing 20, and the leveling of the chemical tank 32 can be adjusted by accessing it from the rear side N2 of the housing 20. This allows for space savings by shortening the dimension (width) of the chemical module 7 in the X-axis direction while achieving high maintainability.

[0199] Furthermore, the chemical module 7 of the embodiment is connectable to another chemical module 7 in the X-axis direction (second direction) that intersects with the Y-axis direction (first direction), and further includes a first transport unit 11 that moves the substrate 4 in the Y-axis direction and a second transport unit 48 that moves the substrate 4 in the X-axis direction. With this configuration, while the chemical modules 7 are connectable in the X-axis direction, leveling of the processing tanks can be easily performed in each chemical module 7 using leveling mechanisms 90, 91.

[0200] Moreover, the chemical module 7 of the embodiment further includes a sink tank 47 that houses the cleaning tank 34 and the chemical tank 32, and is configured to be separated from the housing 20 and be removable along the Y-axis direction (first direction) relative to the housing 20. With this configuration, the sink tank 47 can be removable, thereby further improving maintainability.

[0201] Furthermore, in the chemical module 7 of the embodiment, leveling mechanisms 91 and 90 are provided at contact points between the sink tank 47 and the cleaning tank 34 and chemical tank 32 (treatment tank). With this configuration, the leveling mechanisms 91 and 90 can be easily installed.

[0202] In addition, in the chemical module 7 of the embodiment, the support units 97, 94 and the height change units 95, 92 are provided in the sink tank 47, and the contact units 96, 93 are provided in the cleaning tank 34 and the chemical tank 32 (treatment tank). With this configuration, the leveling mechanisms 91, 90 can be easily installed.

[0203] Furthermore, in the chemical module 7 of the embodiment, the contact portions 96, 93 are partially spherical ball portions, and the support portions 97, 94 are ball receiving portions that receive the contact portions 96, 93. With this configuration, the leveling mechanisms 91, 90 can be easily installed.

[0204] Moreover, the substrate processing apparatus 1 of the embodiment includes a chemical module 7 (substrate processing module) and another chemical module 7 connected to the chemical module 7 in an X-axis direction (second direction) that intersects with the Y-axis direction (first direction). With this configuration, it is possible to realize a substrate processing apparatus 1 that is easy to maintain while allowing a plurality of chemical modules 7 to be connected.

[0205] Furthermore, the substrate processing unit 45 of the embodiment includes a cleaning tank 34 and a chemical tank 32 (processing tanks) in which a substrate 4 can be placed, a sink tank 47 that accommodates the cleaning tank 34 and the chemical tank 32 arranged in the Y-axis direction (first direction), and leveling mechanisms 91, 90 for leveling the cleaning tank 34 and the chemical tank 32, the leveling mechanisms 91, 90 having contact portions 96, 93 provided in the cleaning tank 34 and the chemical tank 32, support portions 97, 94 that contact and receive the contact portions 96, 93, and at least two height adjustment portions 95A, 95B, 92A, 92B for adjusting the heights of the cleaning tank 34 and the chemical tank 32. This configuration can achieve the same effects as the chemical module 7 of the embodiment (see paragraph 0196).

[0206] Furthermore, in the substrate processing unit 45 of the embodiment, the sink tank 47 is separate from the housing 20 of the chemical module 7 and can be pulled out relative to the housing 20. This configuration contributes to realizing a substrate processing module that is easy to maintain.

[0207] In the embodiment, the case where the support portions 94, 97 have the concave spherical surface 110 as shown in Fig. 26 has been described, but the shape of the support portions 94, 97 is not limited to this and may be any shape that can receive the convex spherical surface 108. For example, as shown in the modified example of Fig. 29, instead of the concave spherical surface, the ball receiving portion may have a concave polyhedral shape 210. The vertical cross section of the polyhedral shape 210 shown in Fig. 29 is composed of a plurality of straight lines.

[0208] Furthermore, in the embodiment, the support portions 94, 97 provided in the sink tank 47 are concave ball receivers, and the contact portions 93, 96 provided in the treatment tank are convex ball portions. However, this is not a limitation, and the relationship between the ball receivers and the ball portions may be reversed. For example, as shown in a modified example in FIG. 30, the support portions 304, 307 provided in the sink tank 47 may be convex ball portions, and the contact portions 303, 306 provided in the treatment tank may be concave ball portions. In the example shown in FIG. 30, the contact portion 303 provided in the chemical tank 32 receives the support portion 304, and the contact portion 306 provided in the cleaning tank 34 receives the support portion 307. In this way, it is sufficient that either the contact portion or the support portion is an at least partially spherical ball portion, and the other is a ball receiver that receives the ball portion.

[0209] 30 further illustrates a configuration in which the above-described attachment portion 107 is omitted, and contact portions 303 and 306 also serve as attachment portion 107. However, the present invention is not limited to this, and attachment portion 107 may be provided as in the embodiment, and contact portions 303 and 306 may be attached to attachment portion 107.

[0210] Another modified example in which the mounting portion 107 is omitted is shown in Fig. 31. In the example shown in Fig. 31, the contact portion 393 is attached directly to the lower surface of the chemical tank 32, and the contact portion 396 is attached directly to the lower surface of the cleaning tank .

[0211] Furthermore, although the embodiment has been described with reference to a case where two leveling mechanisms 91, 90 are provided, this is not a limitation. As shown in a modified example in FIGS. 32A and 32B, the chemical tank 432 and the cleaning tank 434 may be integrally configured, and one leveling mechanism 490 may simultaneously level the two processing tanks. In the example shown in FIGS. 32A and 32B, the chemical tank 432 and the cleaning tank 434 are integrally configured, and the leveling mechanism 490 includes a height adjustment unit 492, a contact unit 493, and a support unit 494. The height adjustment unit 492 is provided on the rear side N2 of the chemical tank 432 so as to support one corner of the chemical tank 432, and the contact unit 493 and the support unit 494 are provided on the front side N1 of the cleaning tank 434. As shown in FIG. 32B, two height adjusting sections 492 (height adjusting sections 492A and 492B) are provided to support two corners of the chemical solution tank 432.

[0212] 32A and 32B, by changing the height using two height change units 492A and 492B, it is possible to simultaneously level two processing tanks, namely, chemical tank 432 and cleaning tank 434. Access is only required from rear surface 78 of sink tank 47, and there is no need to access from front surface 58 of sink tank 47. This allows the leveling work to be easily performed using a simple configuration.

[0213] It is not limited to providing height adjustment section 492 in chemical tank 432 and contact section 493 and support section 494 in cleaning tank 434; the arrangement may be reversed, and a contact section and support section may be provided in chemical tank 432, and two height adjustment sections may be provided in cleaning tank 434.

[0214] In the embodiment, as shown in Fig. 27, the height change units 92A and 92B are provided at one end of the chemical tank 32 in the Y-axis direction (opposite the contact unit 93), and the height change units 95A and 95B are provided at one end of the cleaning tank 34 in the Y-axis direction (opposite the contact unit 96). However, the present invention is not limited to this. For example, as shown in Fig. 33, the height change unit 500 may be provided between both ends of the chemical tank 32 in the Y-axis direction, and the height change unit 501 may be provided between both ends of the cleaning tank 34 in the Y-axis direction. In the example shown in Fig. 33, the height change units 500 are provided at one end and the other end of the chemical tank 32 in the X-axis direction, and the height change units 501 are provided at one end and the other end of the cleaning tank 34 in the X-axis direction. The height change unit 500 may be disposed on the opposite side of the contact unit 93 (upper side of the drawing) with respect to the center line X1, which is the center position of the chemical tank 32 in the Y-axis direction, and the height change unit 501 may be disposed on the opposite side of the contact unit 96 (lower side of the drawing) with respect to the center line X2, which is the center position of the cleaning tank 34 in the Y-axis direction. Even in such a case, the attitude of the chemical tank 32 can be adjusted by changing the height of two locations of the chemical tank 32 using the height change unit 500, and the attitude of the cleaning tank 34 can be adjusted by changing the height of two locations of the cleaning tank 34 using the height change unit 501. [Explanation of symbols]

[0215] 1...Substrate processing equipment 2. Career 3...Flange 4...Substrate 5. Loading module 6...Drying module 7...Chemical module (substrate processing module) 7a...First chemical module 7b...Second chemical module 7c...Third Chemical Module 7d...4th Chemical Module 8...Export module 9...Second transport mechanism 11...First conveying section 12...First actuator 13...Upper and lower conveying section 14...Up / down actuator 16...Arm 18...Cradle 20…Housing 22...Placement table 24...Fan filter unit 26...Loading area 27...Export section 29...Common exhaust duct 31...Drying chamber 32...Chemical tank (treatment tank, second tank) 34...Cleaning tank (treatment tank, first tank) 36...Side exhaust duct (exhaust duct) 36a...Side exhaust port (exhaust port) 37…Side wall 37a...Gap 38…Back wall 38a…Aperture 39...Rear exhaust duct (exhaust duct) 39a...Rear exhaust port (exhaust port) 40...Second transport storage section 41...Second actuator 42...Rotational actuator 43... Rotating arm part 44...Chuck part 46...Link section 48...Second conveying section 45...Substrate processing unit 47...Sink 90...Leveling mechanism (second leveling mechanism) 91...Leveling mechanism (first leveling mechanism) 92, 95...Height change section 93, 96...Contact part (ball part) 94, 97...Support part (ball receiving part)

Claims

1. The housing and two processing tanks arranged in a first direction within the housing, each capable of receiving a substrate; a leveling mechanism for leveling the treatment tank, the leveling mechanism includes a contact portion provided on the treatment tank, a support portion that contacts the contact portion and supports the contact portion, and at least two height change portions that change the height of the treatment tank; A substrate processing module, wherein one of the contact portion and the support portion is an at least partially spherical ball portion, and the other is a ball receiving portion that receives the ball portion.

2. The treatment tank includes a first tank and a second tank, the leveling mechanism includes a first leveling mechanism for leveling the first tank and a second leveling mechanism for leveling the second tank; 2. The substrate processing module of claim 1, wherein each of the first leveling mechanism and the second leveling mechanism has the contact portion, the support portion, and two height changing portions for changing the height of the corresponding processing tank.

3. the first tank is disposed on the front side of the housing relative to the second tank, 3. The substrate processing module according to claim 2, wherein the height changing portion of the first leveling mechanism is provided on the front side of the first tank, and the height changing portion of the second leveling mechanism is provided on the rear side of the second tank.

4. Another module can be connected in a second direction intersecting the first direction, a first transport unit that moves the substrate in the first direction; The substrate processing module of claim 1 , further comprising: a second transport unit that moves the substrate in the second direction.

5. A substrate processing module described in any one of claims 1 to 4, further comprising a sink tank that houses two of the processing tanks and is separated from the housing and configured to be able to be pulled out along the first direction relative to the housing.

6. The substrate processing module according to claim 5 , wherein the leveling mechanism is provided at a contact point between the sink tank and the processing tank.

7. The substrate processing module according to claim 6 , wherein the support portion and the height changing portion are provided in the sink tank, and the contact portion is provided in the processing tank.

8. The substrate processing module according to claim 1 , wherein the contact portion is the ball portion, and the support portion is the ball receiving portion.

9. A substrate processing apparatus comprising: the substrate processing module according to claim 1; and another module coupled to the substrate processing module in a second direction intersecting the first direction.

10. two processing tanks each capable of accommodating a substrate; a sink tank that accommodates the treatment tanks arranged in a first direction; a leveling mechanism for leveling the treatment tank, the leveling mechanism includes a contact portion provided on the treatment tank, a support portion that contacts the contact portion and supports the contact portion, and at least two height change portions that change the height of the treatment tank; In the substrate processing unit, one of the contact portion and the support portion is an at least partially spherical ball portion, and the other is a ball receiving portion that receives the ball portion.

11. The substrate processing unit according to claim 10 , wherein the sink tank is separated from a housing of the substrate processing module and is removable from the housing.

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