Light-emitting device

Abstract

To provide a light emitting device with better reliability.SOLUTION: A light emitting device 100 includes: a light emitting element 1; a first substrate 10 having an element placement region 13 on which the light emitting element 1 is disposed; a light-transmissive member 5 with a sheet-like shape that covers the light emitting element 1, an outer edge of a lower surface of the light-transmissive member 5 contacting an outer side of the upper surface of the element placement region 13 of the first substrate 10; and a first protrusion portion 41 disposed along an outer edge of an upper surface of the light-transmissive member 5 and extending across an upper surface of the first substrate 10 and the upper surface of the light-transmissive member 5, the first protrusion portion having a top portion located higher than an upper surface of the light emitting element.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a light emitting device. [Background technology]

[0002] Conventionally, light emitting devices using a plurality of light emitting elements have been used as light sources for vehicles and projectors. When a light emitting device is used as a light source, for example, a configuration is adopted in which light is emitted from the light source to the outside through a lens. As such a light emitting device, a configuration is known in which a plurality of light emitting elements are arranged on a submount, the submount is further mounted on a wiring board, and the submount and the wiring board are connected by wires (for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-009898 [Patent Document 2] Japanese Patent Application Publication No. 2017-212301 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of an embodiment of the present disclosure is to provide a light emitting device with improved reliability. [Means for solving the problem]

[0005] A light emitting device according to an embodiment of the present disclosure comprises a light emitting element, a first substrate having an element mounting area on an upper surface of which the light emitting element is mounted, a sheet-like translucent member covering the light emitting element, the outer edge of the lower surface of the translucent member being in contact with the upper surface outside the element mounting area of ​​the first substrate, and a first convex portion extending across the upper surface of the first substrate and the upper surface of the translucent member, arranged along the outer edge of the upper surface of the translucent member, and having a top higher than the upper surface of the light emitting element. [Effects of the Invention]

[0006] According to the embodiment of the present disclosure, a light emitting device with improved reliability can be provided. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a perspective view schematically showing a light emitting device according to a first embodiment. [Figure 2] FIG. 1 is a plan view schematically showing a light emitting device according to a first embodiment. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] FIG. 4 is a cross-sectional view of a portion taken along line IV-IV in FIG. 2. [Figure 5] FIG. 3 is a cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] FIG. 2 is a plan view schematically showing a first convex portion, a second convex portion, a light-transmitting member, and a wire in the light-emitting device according to the first embodiment. [Figure 8] 4 is a flowchart illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 9A] 2A to 2C are plan views schematically showing a method for manufacturing the light emitting device according to the first embodiment. [Figure 9B] 2A to 2C are plan views schematically showing a method for manufacturing the light emitting device according to the first embodiment. [Figure 9C] 2A to 2C are enlarged plan views schematically illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 9D] 2A to 2C are plan views schematically showing a method for manufacturing the light emitting device according to the first embodiment. [Figure 9E] 2A to 2C are plan views schematically showing a method for manufacturing the light emitting device according to the first embodiment. [Figure 9F] 2A to 2C are plan views schematically showing a method for manufacturing the light emitting device according to the first embodiment. [Figure 9G] 2A to 2C are plan views schematically showing a method for manufacturing the light emitting device according to the first embodiment. [Figure 9H] 2A to 2C are plan views schematically showing a method for manufacturing the light emitting device according to the first embodiment. [Figure 10A] FIG. 10 is a plan view schematically showing a light emitting device according to a second embodiment. [Figure 10B] FIG. 10B is a cross-sectional view taken along line XB-XB in FIG. 10A. [Figure 10C] FIG. 10C is a partially enlarged cross-sectional view of a portion of FIG. 10B. [Figure 11] 10 is a flowchart illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 12A] 5A to 5C are cross-sectional views schematically illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 12B] 5A to 5C are cross-sectional views schematically illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 12C] 5A to 5C are cross-sectional views schematically illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 12D] 5A to 5C are cross-sectional views schematically illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 13] FIG. 4 is a cross-sectional view schematically showing a modified example of the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] The light-emitting device according to the embodiment will be described below with reference to the drawings. Note that the size and positional relationship of components shown in each drawing may be exaggerated for clarity. Furthermore, the dimensions and positions of components may not strictly match between the plan view and the corresponding cross-sectional view. To avoid overly complex drawings, some elements may be omitted, or end views showing only the cut surface may be used as cross-sectional views. Furthermore, in the following description, up, down, left, right, front, and back are relative and do not indicate absolute directions. Furthermore, identical names and symbols generally indicate identical or similar components, and detailed descriptions may be omitted as appropriate. Furthermore, in the embodiments, "covering" and "covering" are not limited to direct contact, but also include indirect covering, for example, via another component. In this specification, a plan view refers to observation from the light extraction surface side of the light-emitting device.

[0009] First Embodiment [Configuration of the Light-Emitting Device According to the First Embodiment] The configuration of the light emitting device according to the first embodiment will be described with reference to FIGS. Fig. 1 is a perspective view schematically showing the entire light emitting device according to an embodiment. Fig. 2 is a plan view schematically showing the entire light emitting device according to the first embodiment. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 2. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 2. Fig. 5 is a cross-sectional view taken along line VV in Fig. 2. Fig. 6 is a cross-sectional view taken along line VI-VI in Fig. 2. Fig. 7 is a plan view schematically showing first and second convex portions, a light-transmitting member, and wires in the light emitting device according to the first embodiment.

[0010] The light emitting device 100 includes a light emitting element 1, a first substrate 10 having an element mounting region 13 on its upper surface for mounting the light emitting element 1, a light-transmitting member 5 covering the light emitting element 1, the outer edge of the lower surface of the light-transmitting member 5 being in contact with the upper surface of the first substrate 10 outside the element mounting region 13, and a first convex portion 41 extending across the upper surface of the first substrate 10 and the upper surface of the light-transmitting member 5 and arranged along the outer edge of the upper surface of the light-transmitting member 5. The first convex portion 41 may be arranged in the shape of a single continuous frame covering the entire outer edge of the upper surface of the light-transmitting member 5, or multiple first convex portions may be arranged discontinuously along the outer edge of the upper surface of the light-transmitting member 5. Alternatively, the first convex portion 41 may be arranged in a shape in which part of the frame is interrupted. Here, the first convex portion 41 is arranged in the shape of a rectangular frame surrounding the element mounting region 13. The light emitting device 100 includes multiple light emitting elements 1. The multiple light emitting elements 1 are arranged in an aligned manner in the element mounting region 13. Furthermore, the light emitting device 100 may include a second substrate 20 having a substrate mounting area 23 on which the first substrate 10 is mounted, a first terminal 110 arranged on the upper surface of the first substrate 10 outside the element mounting area 13, a wire 130 connecting the first terminal 110 arranged on the upper surface of the first substrate 10 outside the substrate mounting area 23, and a covering member 40 that covers the wire 130. In this case, the covering member 40 contacts the first protrusion 41 and covers the upper surface of the first substrate 10 outside the first protrusion 41.

[0011] The light emitting device 100 may include a reflective member 7 that exposes the top surface of the light emitting element 1 and covers the side surface in the element mounting region 13 on the first substrate 10. Furthermore, the light emitting device 100 may include a second protrusion 42 on the top surface of the second substrate 20, which is disposed outside the second terminal 120 and contacts the covering member 40. Each component will be described below.

[0012] (First board) The first substrate 10 includes a flat support member and wiring arranged on the upper surface of the support member. The first substrate 10 has an element mounting region 13 on its upper surface where multiple light-emitting elements 1 are mounted. Wiring connected to the light-emitting elements 1 is arranged in the element mounting region 13. The first substrate 10 has multiple first terminals 110 as wiring arranged on its upper surface outside the element mounting region 13. The first terminals 110 are electrically connected to the wiring arranged in the element mounting region 13. The first substrate 10 is a semiconductor substrate made of, for example, silicon, and an area on its upper surface where no wiring is arranged is covered with an insulating film. Wiring may also be arranged inside or on the lower surface of the support member. For example, the first substrate 10 can be an integrated circuit (IC) substrate on which circuits for driving and controlling the multiple light-emitting elements 1 are integrated. A plurality of light-emitting elements 1 are mounted in a matrix in the element mounting region 13. As an example, the element mounting region 13 in a plan view may be a rectangular region. In this example, the element mounting region 13 is rectangular, and the first terminals 110 are arranged in rows along opposing long sides of the rectangle so as to sandwich the element mounting region 13 therebetween.

[0013] The first terminal 110 is, for example, a power supply terminal of the first substrate, and here, one end of a wire 130 is connected thereto, and the first substrate 10 is electrically connected to the second substrate via the wire 130. Here, as an example, the plurality of first terminals 110 are each substantially rectangular, and are arranged in a row on the upper surface of the first substrate 10, spaced apart from each other, along the long side of the element mounting region 13.

[0014] The plurality of light-emitting elements 1 are placed in a matrix on the first substrate 10 and are electrically connected to any of the first terminals. The plurality of light-emitting elements 1 may be grouped into a predetermined number of groups and connected in series or parallel to the first terminals. The wiring can be formed using, for example, a metal such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, or Ni, or an alloy thereof, etc. Such wiring can be formed by electroplating, electroless plating, vapor deposition, sputtering, etc.

[0015] (Second board) The second substrate 20 includes a flat base material and wiring arranged on at least the upper surface of the base material. The second substrate 20 has a substrate mounting area 23 on its upper surface for mounting the first substrate 10, and further includes second terminals 120 on its upper surface outside the substrate mounting area 23. The substrate mounting area 23 is an area where the first substrate 10 is placed. The substrate mounting area 23 is set to have an area equivalent to the shape of the first substrate 10 in a plan view. Here, "equivalent" includes, as an allowable range, errors caused by component tolerances and mounting tolerances. If the first substrate 10 is rectangular in a plan view, the substrate mounting area 23 can also be rectangular.

[0016] A plurality of second terminals 120 are arranged in rows outside the substrate mounting area 23 along opposing long sides of the rectangular substrate mounting area 23. The second terminals 120 are terminals to which one end of a wire 130, the other end of which is connected to the first terminal 110, is connected. Here, as an example, the second terminals 120 are each approximately rectangular, and are arranged spaced apart from each other on the upper surface of the second substrate 20 in a row along the substrate mounting area 23. The second terminal 120 can be formed, for example, using the same material and method as the wiring of the first substrate 10 already described.

[0017] The substrate is preferably made of a material with high heat dissipation properties, and more preferably a material with high light-shielding properties and substrate strength. Specific examples include ceramics such as alumina, aluminum nitride, and mullite; resins such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), and polyphthalamide (PPA); and composite materials composed of resin and metal or ceramic. The substrate may be flat, or may have a cavity on its upper surface. In this case, the bottom of the cavity serves as a substrate mounting area for the second substrate 20, and the first substrate 10 can be mounted within the cavity. The second substrate 20 may have wiring on the surface of the substrate mounting area 23 for mounting the first substrate 10. The first substrate 10 and the second substrate 20 can be bonded via a bonding material such as an Ag sintered body, solder, or adhesive resin.

[0018] (wire) Examples of the wire 130 include conductive wires made of metals such as Au, Cu, Pt, and Al and / or alloys containing at least these metals. It is particularly preferable to use Au, which has excellent thermal resistance. Examples of the wire diameter include 15 μm or more and 50 μm or less. Here, the wire 130 includes a first wire 31, a second wire 32, and a third wire 33, each having a different length. The first wire 31, the second wire 32, and the third wire 33 can each be formed from the same material. The wires 130 can be arranged to straddle the long sides of the first substrate 10, which is substantially rectangular in plan view, and to be, for example, substantially perpendicular to the long sides.

[0019] (light-emitting element) The light-emitting element 1 has, for example, a substantially rectangular shape in plan view and includes a semiconductor laminate and positive and negative electrodes disposed on the surface of the semiconductor laminate. The light-emitting element 1 includes the positive and negative electrodes on the same side, and is mounted on the first substrate 10 with the electrode-equipped surface facing the upper surface of the first substrate 10 as the lower surface. In this case, the upper surface opposite the surface on which the electrodes are disposed serves as the main light extraction surface of the light-emitting element 1. In the light-emitting device 100, the light-emitting elements 1 are mounted on the first substrate 10 in a matrix arrangement with a predetermined spacing between them. The size and number of light-emitting elements 1 to be used can be appropriately selected depending on the desired configuration of the light-emitting device. In particular, it is preferable to mount a larger number of smaller light-emitting elements 1 at a higher density. This allows the illumination range to be controlled with a larger number of divisions, making it suitable for use as a light source for a high-resolution lighting system. For example, a configuration may be used in which 1,000 to 20,000 rectangular light-emitting elements 1, each 40 to 100 μm on a side in plan view, are mounted in a matrix arrangement to form a rectangle as a whole.

[0020] The light emitting element 1 can be selected from those with any wavelength. For example, blue and green light emitting elements 1 can be made of ZnSe or nitride semiconductors (In X Al Y Ga 1-X-Y N, 0≦X, 0≦Y, X+Y≦1), or GaP can be selected. As the red light emitting element 1, semiconductors represented by GaAlAs and AlInGaP can be suitably used. Furthermore, semiconductor light emitting elements made of materials other than these can also be used. The composition and emitted color of the light emitting element 1 to be used can be appropriately selected depending on the purpose.

[0021] (jointing material) As shown in FIG. 6, the light-emitting element 1 is bonded to wiring arranged in the element mounting region 13 of the first substrate 10 by a conductive bonding material. When flip-chip mounting the light-emitting element 1 on the first substrate 10, bumps made of a metal material such as Au, Ag, Cu, or Al can be used as the bonding material. Alternatively, solder such as an AuSn-based alloy or Sn-based lead-free solder can be used as the bonding material. In this case, the light-emitting element 1 can be bonded to the first substrate 10 by a reflow method. Alternatively, a conductive adhesive material in which conductive particles are contained in resin can be used as the bonding material. The light-emitting element 1 and the first substrate 10 may be bonded by a plating method. An example of a plating material is Cu. Furthermore, the light emitting element 1 and the first substrate 10 may be bonded together by directly bonding the electrodes of the light emitting element 1 to the wiring of the first substrate 10 without using a bonding member.

[0022] (reflective material) As shown in FIG. 6 , the reflective member 7 is a member that covers the upper surface of the first substrate 10 and the side surface of the light-emitting element 1. The upper surface of the light-emitting element 1 is exposed from the reflective member 7. The reflective member 7 may also cover the area between the lower surface of the light-emitting element 1 and the first substrate 10. The reflective member 7 reflects light emitted from the side surface of the light-emitting element 1 and allows it to exit from the upper surface of the light-transmitting member 5, which is the light-emitting surface of the light-emitting device 100. This improves the light extraction efficiency of the light-emitting device 100. Furthermore, when the light-emitting elements 1 are individually lit, the boundary between the light-emitting area and the non-light-emitting area can be clearly defined. This improves the contrast ratio between the light-emitting area and the non-light-emitting area. The reflective member 7 may be disposed apart from the first protrusion 41 or in contact with the first protrusion 41.

[0023] The reflective member 7 is preferably made of a soft resin with relatively low elasticity and excellent shape conformability. Specifically, the reflective member 7 is preferably made of a white resin containing particles of a light-reflecting material in a translucent resin base material. Examples of the translucent resin include silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, and hybrid resins containing at least one of these resins. Silicone resin, which has excellent heat resistance and light resistance, is preferred, and dimethylsilicone resin is more preferred. Dimethylsilicone resin is suitable for use in automotive applications due to its excellent reliability, including high-temperature resistance. Examples of the light-reflecting material that can be used include titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, and glass filler. The reflective member 7 may also contain a light-absorbing material such as carbon black or graphite.

[0024] (Translucent member) The light-transmitting member 5 is light-transmitting and covers the upper surfaces of the plurality of light-emitting elements 1. The light-transmitting member 5 collectively covers the upper surfaces of the plurality of light-emitting elements 1 and the upper and side surfaces of the reflective member 7. The upper surface of the light-transmitting member 5 constitutes the light-emitting surface of the light-emitting device 100. The light-transmitting member 5 contains at least a light-transmitting resin as a base material, and the base material may contain a wavelength conversion material. Here, as an example, the light-transmitting member 5 contains a wavelength conversion material, and at least a portion of the light emitted from the light-emitting element 1 is wavelength-converted and extracted to the outside.

[0025] The light-transmitting member 5 has a substantially rectangular sheet shape in a plan view and is disposed so as to enclose a plurality of light-emitting elements 1. The outer edge 51 of the lower surface of the light-transmitting member 5 is disposed so as to contact the upper surface of the first substrate 10 outside the element mounting region 13. As an example, such a light-transmitting member 5 can be obtained in a manufacturing process described below by arranging an uncured light-transmitting member 5 processed into a sheet shape so as to cover the light-emitting elements 1 and the reflective member 7, and then softening the light-transmitting member 5 by heating or the like, and deforming the light-transmitting member 5 along the reflective member 7 so that the outer edge of the lower surface of the light-transmitting member 5 contacts the upper surface of the first substrate 10. The light-transmitting member 5 is then cured while contacting the upper surface of the light-emitting element 1, the upper surface and outer side of the reflective member, and the upper surface of the first substrate 10. The sheet-like light-transmitting member 5 is disposed along the upper surface of the light-emitting element 1 and the upper surface of the first substrate 10. Therefore, in the light emitting device 100, the upper surface of the light-transmitting member 5 has a step caused by the difference in height between the upper surface of the first substrate 10 and the upper surface of the light emitting element 1.

[0026] The light-transmitting member 5 may be processed into a sheet or plate shape and placed on the light-emitting element 1, or may be applied in the form of a layer on the light-emitting element 1 and the reflective member 7 by spraying or the like. Alternatively, the light-transmitting member 5 may be formed into a sheet shape on the light-emitting element 1 by injection molding using a mold or the like, transfer molding, compression molding or the like. The light-transmitting member 5 has improved adhesion to the first substrate 10 by placing the outer edge 51 of the lower surface in contact with the upper surface of the first substrate 10. An example of the light-transmitting member 5 containing a wavelength conversion member is a light-transmitting resin base material containing phosphor powder. The base material may be the same resin as the resin exemplified as the base material of the reflective member 7. The thickness of the light-transmitting member 5 may be, for example, approximately 20 μm to 100 μm. The light-transmitting member 5 is formed to a size that covers all of the upper surfaces of the light-emitting elements 1 and the reflective member 7, and that allows the outer edge 51 of the lower surface to contact the first substrate 10. Specifically, the outer edge of the light-transmitting member 5 may be sized to be at least twice the thickness of the light-emitting elements 1 from the outer edge of the reflective member 7, and at least twice the thickness of the light-transmitting member 5 from the outer edge of the reflective member 7. The light-transmitting member 5 is provided on the first substrate 10, extending to a position covered by a first protrusion 41, which will be described later.

[0027] The phosphor is an yttrium-aluminum-garnet phosphor (e.g., Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate phosphors (e.g., Ca8MgSiO 16 Cl2:Eu), β-sialon phosphors (e.g., (Si,Al)3(O,N)4:Eu), α-sialon phosphors (e.g., Ca(Si,Al) 12 (O,N) 16: nitride-based phosphors such as (Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu), or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu); fluoride-based phosphors such as KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si,Al)F6:Mn), or MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn); phosphors having a perovskite structure (e.g., CsPb(F,Cl,Br,I)3); or quantum dot phosphors (e.g., CdSe, InP, AgInS2, or AgInSe2) can be used.

[0028] The KSAF-based phosphor may have a composition represented by the following formula (I). M2[Si p Al q Mn r F s (I)

[0029] In formula (I), M represents an alkali metal and may contain at least K. Mn may be tetravalent Mn ions. p, q, r, and s may satisfy 0.9 ≦ p + q + r ≦ 1.1, 0 < q ≦ 0.1, 0 < r ≦ 0.2, and 5.9 ≦ s ≦ 6.1. Preferably, 0.95 ≦ p + q + r ≦ 1.05 or 0.97 ≦ p + q + r ≦ 1.03, 0 < q ≦ 0.03, 0.002 ≦ q ≦ 0.02 or 0.003 ≦ q ≦ 0.015, 0.005 ≦ r ≦ 0.15, 0.01 ≦ r ≦ 0.12 or 0.015 ≦ r ≦ 0.1, and 5.92 ≦ s ≦ 6.05 or 5.95 ≦ s ≦ 6.025. For example, K2[Si 0.946 Al 0.005 Mn 0.049 F 5.995 , K2[Si 0.942 Al 0.008 Mn 0.050 F 5.992 , K2[Si 0.939 Al 0.014 Mn 0.047 F 5.986Such a KSAF-based phosphor can provide red light emission with high brightness and a narrow half-width of the emission peak wavelength.

[0030] (Covering material) The covering member 40 is a light-blocking resin that covers the wires 130 outside the element mounting region 13. As an example, the covering member 40 is arranged in a frame shape in a plan view so as to cover the wires 130 and surround the element mounting region 13. The covering member 40 is arranged so as to contact a first convex portion, which will be described later. The covering member 40, which is arranged in a frame shape, has a width greater on the long side of the rectangle of the first substrate 10, which is generally rectangular in plan view, than on the short side. Furthermore, the covering member 40 is arranged so that its height (i.e., the distance from the upper surface of the second substrate 20 to the upper surface of the covering member 40) is greatest directly above the top 130a of the wire 130 (here, the loop top of the wire). In other words, the covering member 40 is arranged so that the top 40a of the covering member 40 overlaps the top 130a of the wire 130. The top 40a of the covering member 40 is arranged to be located higher than the top 41a of the first protrusion 41, which will be described later.

[0031] Examples of the light-blocking covering member 40 include resins containing a filler with light-blocking properties. Examples of the base resin that can be used include silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, and acrylic resin. Examples of the light-blocking filler include light-absorbing substances such as pigments, carbon black, and graphite, as well as light-reflecting substances similar to the light-reflecting substances contained in the reflective member described above. Specific examples include white resins with excellent light reflectivity, black resins with excellent light absorption, and gray resins with both light reflectivity and light absorption. Furthermore, the covering member 40 may be formed by laminating multiple layers of these resins. In particular, in consideration of deterioration of the resin due to light absorption, it is preferable that the covering member 40 uses a white resin having light reflectivity at least on the outermost surface.

[0032] The covering member 40 has light-blocking properties and is disposed in contact with the first convex portion 41 described below. Because the covering member 40 contains a light-reflecting substance and / or a light-absorbing substance as a filler for providing the light-blocking properties, the amount of resin in the covering member 40 can be reduced compared to when a translucent resin that does not contain these fillers is used. This makes it possible to suppress the load on the wires due to thermal expansion of the resin. Because the wires are less affected by heat, wire connectivity is improved, resulting in a light-emitting device with excellent reliability.

[0033] (First convex part, second convex part) The light-emitting device 100 includes a first convex portion 41 that extends across the upper surface of the first substrate 10 and the upper surface of the light-transmitting member 5 and is arranged along the outer edge of the upper surface of the light-transmitting member 5. The first convex portion 41 is arranged in a frame shape in a plan view so as to surround the element mounting region 13. Specifically, the first convex portion 41 is arranged on the first substrate 10 between the element mounting region 13 and the first terminal 110, along the outer edge of the upper surface of the light-transmitting member 5, covering the outer edge 51 of the upper surface of the light-transmitting member 5 and being in contact with the upper surface of the first substrate 10. This improves the adhesion between the light-transmitting member 5 and the first substrate 10 in the light-emitting device 100, resulting in a highly reliable light-emitting device 100. Furthermore, because the upper surface of the first substrate 10 is not exposed in the region surrounded by the first convex portion 41 on the upper surface of the light-emitting device 100, wiring and the like arranged in the element mounting region 13 can be protected from dust, moisture, external forces, and the like. This makes it possible to provide a light emitting device 100 with improved reliability.

[0034] In the light emitting device 100, the first convex portion 41 can be arranged so that its apex 41a is located higher than the upper surface of the light emitting element 1. This allows light emitted laterally from the light emitting element 1 to be reflected upward, resulting in a light emitting device 100 with higher front brightness. Furthermore, the apex 41a of the first convex portion 41 is preferably arranged at a position higher than the apex of the light-transmitting member 5 located in the element mounting region 13. This allows light emitted laterally via the light-transmitting member 5 to be reflected.

[0035] Furthermore, the light-emitting device 100 may have a second convex portion 42 on the upper surface of the second substrate 20 that contacts the covering member 40. In this case, the second convex portion 42 is arranged in a frame shape to surround the first substrate 10, and the covering member 40 is arranged between the first convex portion 41 and the second convex portion 42, spanning from the upper surface of the first substrate 10 to the upper surface of the second substrate 20. That is, the covering member 40 is arranged between the first convex portion 41 that is arranged to surround the element mounting region 13 on the first substrate 10 and the second convex portion 42 that is arranged to surround the substrate mounting region 23 on the second substrate 20. Such an arrangement of the covering member 40 can be formed by supplying uncured resin that constitutes the covering member 40 into a frame surrounded by the first convex portion 41 and the second convex portion 42. In other words, the first convex portion 41 and the second convex portion 42 can be used as a dam to block the flow of uncured resin when the covering member 40 is supplied. As an example, the covering member 40 is disposed so as to contact the tops of the first protrusions 41 and the second protrusions 42, respectively.

[0036] The first convex portion 41 and the second convex portion 42 can be formed to a predetermined height by providing a plurality of layers of uncured resin in the height direction. For example, the first convex portion 41 and the second convex portion 42 are formed by disposing resin adjusted to a predetermined viscosity from a nozzle in one layer on the substrate, and repeating this process to form the first convex portion 41 and the second convex portion 42 to the predetermined height. The first convex portions 41 and the second convex portions 42 may be translucent or light-blocking to the light emitted from the light-emitting element 1 and the light-transmitting member 5, respectively. The first convex portions 41 and the second convex portions 42 can be made of the materials exemplified for the covering member 40 described above. It is preferable that the resin constituting the first convex portions 41 and the second convex portions 42 has a higher viscosity than the resin constituting the covering member 40. The viscosity of the resin can be adjusted, for example, by the amount of viscosity-adjusting filler contained in the resin.

[0037] The first convex portions 41 are arranged so as to cover the outer edge of the upper surface of the light-transmissive member 5 in a plan view and to be in contact with the upper surface of the light-transmissive member 5 and the upper surface of the first substrate 10. Specifically, the first convex portions 41 are arranged so as to be in contact with the upper surface of the first substrate 10 and an upper surface corresponding to the lower surface of the light-transmissive member 5 that is in contact with the upper surface of the first substrate 10. In this way, by arranging the end portion including the outer edge of the light-transmissive member 5 between the lower surface of the first convex portions 41 and the upper surface of the first substrate 10, peeling of the light-transmissive member 5 from the first substrate 10 is suppressed, and adhesion between the light-transmissive member 5 and the first substrate 10 is improved. In other words, by providing the first convex portions 41, peeling of the light-transmissive member 5 from the upper surface of the first substrate 10 is suppressed, resulting in a light-emitting device with excellent reliability.

[0038] The first convex portions 41 are arranged so as not to overlap the light emitting elements 1 in a plan view so as not to block the light emitted upward from the light emitting elements 1 through the light-transmitting member 5. Furthermore, the first convex portions 41 are preferably arranged in the shape of a frame surrounding the element mounting region 13, and in this case, the first convex portions 41 are preferably arranged so that the inner edge of the frame is positioned above the light-transmitting member 5 that contacts the upper surface of the first substrate 10. Furthermore, it is more preferable that the first convex portions 41 are arranged apart from the above-mentioned step on the upper surface of the light-transmitting member 5 (i.e., do not cover the step). This makes the thickness of the light-transmitting member 5 arranged between the first convex portions 41 and the first substrate 10 constant, further improving the adhesion between the first convex portions 41 and the first substrate 10. Furthermore, since the light-transmitting member 5 has a step between the upper surface of the light-transmitting member 5 placed in the element mounting region 13 and the upper surface of the light-transmitting member 5 covered by the first convex portion 41, that is, since the upper surface of the light-transmitting member 5 has an area along the first convex portion 41 that is lower than the element mounting region 13, it is possible to prevent resin components that seep out from the first convex portion 41 made of resin from wetting and spreading into the element mounting region 13.

[0039] The light emitting device 100 having the above configuration can be used as a light source for a vehicle headlight, for example. In this case, for example, a configuration is adopted in which light is emitted from the light source to the outside through a lens. In the light emitting device 100, the light emitting elements 1 are turned on by an external power switch. Note that the light emitting device 100 is configured so that some or all of the preset light emitting elements 1 can be individually driven.

[0040] [Method for manufacturing the light emitting device according to the first embodiment] Next, a method for manufacturing a light emitting device will be described with reference to FIG. 8 and FIGS. 9A to 9H. Fig. 8 is a flowchart illustrating a method for manufacturing the light emitting device according to the first embodiment. Figs. 9A to 9H are plan views schematically illustrating the method for manufacturing the light emitting device according to the first embodiment. Note that the light emitting elements 1 are placed at predetermined intervals, but the intervals are omitted in the drawings except for the enlarged plan view of Fig. 9C.

[0041] The method for manufacturing a light emitting device includes an element placement process S11 in which a light emitting element is placed in an element placement area on the upper surface of a first substrate; a reflective member placement process S12 in which a reflective member that exposes the upper surface of the light emitting element and covers the side surfaces is placed on the first substrate; a light-transmitting member placement process S15 in which a translucent member is placed so that it covers the upper surfaces of the light emitting element and the reflective member and the outer edge of its lower surface is in contact with the first substrate; and a first convex portion placement process S16 in which a first convex portion is placed along the outer edge of the upper surface of the light-transmitting member, extending over the upper surface of the first substrate and the outer edge of the upper surface of the light-transmitting member. The method for manufacturing a light-emitting device may further include a substrate placement step S13 in which the first substrate is placed on the substrate placement area of ​​the upper surface of the second substrate, a wire connection step S14 in which a first terminal arranged on the upper surface of the first substrate outside the element placement area and a second terminal arranged on the second substrate outside the substrate placement area are connected by a wire, a second convex portion placement step S17 in which a second convex portion is arranged on the second substrate outside the second terminal, and a covering member placement step S18 in which a light-shielding covering member is arranged outside the first convex portion, in contact with the first convex portion, to cover the wire. Note that the first convex portion placement step S16 and the second convex portion placement step S17 may be performed in either order, or may be performed simultaneously. Each step will be described below.

[0042] The element mounting step S11 is a step of mounting a plurality of light-emitting elements 1 on the element mounting region 13 of the first substrate 10. Before performing the element mounting step S11, it is preferable to prepare the first substrate 10 on which wiring such as the first terminals 110 is arranged in advance. The light-emitting elements 1 can be flip-chip mounted on the element mounting region 13 on the first substrate 10 via a conductive bonding material such as eutectic solder, conductive paste, bumps, or plating. The light-emitting elements 1 are mounted in the element mounting region 13 aligned in rows and columns at predetermined intervals. The light-emitting elements 1 can be prepared by undergoing some or all of a manufacturing process, such as a semiconductor growth process. Alternatively, they may be purchased.

[0043] The reflective member arrangement step S12 is a step of covering the side surfaces of the light emitting element 1 with a reflective member after the light emitting element 1 is mounted on the element mounting region 13 of the first substrate 10. Here, after the light emitting element 1 is mounted on the first substrate 10, a reflective member, such as a white resin, is arranged between the light emitting elements 1 on the side surfaces of the light emitting element 1. The reflective member can be formed by a method such as compression molding, transfer molding, potting, printing, or spraying.

[0044] The substrate placement step S13 is a step of placing the first substrate 10 on the substrate placement area 23 of the second substrate 20. Here, the first substrate 10 on which the light-emitting element 1 is placed is placed on the substrate placement area 23 of the second substrate 20 and bonded via a bonding material such as sintered Ag. Note that, before performing the substrate placement step S13, it is preferable to prepare the second substrate 20 on which wiring such as the second terminal 120 is arranged in advance.

[0045] In the wire connection step S14, the first terminal 110 of the first substrate 10 and the second terminal 120 of the second substrate 20 are connected with the wire 130. It is preferable that the wire 130 is first connected to the first terminal 110 on the first substrate 10, and then connected to the second terminal 120 on the second substrate. By connecting the wire 130 in this order, the top of the wire 130 can be positioned closer to the first terminal 110. In other words, the wire 130 can be formed along the step between the first substrate 10 and the second substrate 20, which reduces the amount of resin placed below the wire 130 in the covering member placement step S18 described below, making it possible to prevent breakage of the wire 130 due to thermal expansion of the covering member.

[0046] The light-transmitting member arrangement step S15 is a step of arranging a light-transmitting member 5 that covers the multiple light-emitting elements 1 and the reflective member 7 and has the outer edge of its lower surface in contact with the upper surface of the first substrate 10. In this step, first, an uncured or semi-cured light-transmitting member 5 containing a wavelength conversion member and previously processed into a sheet of a predetermined size is prepared and arranged on the light-emitting elements 1 and the reflective member 7. At this time, the outer edge of the lower surface of the light-transmitting member 5 may be spaced apart from the upper surface of the first substrate 10. The light-transmitting member 5 may be arranged on the light-emitting elements 1 via a light-transmitting bonding member such as resin, or may be arranged without a bonding member by utilizing the tackiness of the light-transmitting member. Then, a curing step is performed in which the uncured or semi-cured light-transmitting member 5 is heated to harden. In the curing step, the light-transmitting member 5 is heated using a heating means such as an oven. In the curing process, the uncured or semi-cured sheet-like translucent member is first softened by heating, and then deformed by its own weight along the light-emitting element 1 and the reflective member 7, and is cured with the outer edge 51 of the lower surface in contact with the upper surface of the first substrate 10.

[0047] The first convex portion arranging step S16 is a step of arranging a light-transmitting first convex portion 41 on the upper surface of the first substrate 10, between the element mounting region 13 and the first terminal 110, across the upper surface of the light-transmitting member 5 and the upper surface of the first substrate 10. In the first convex portion arranging step S16, the first convex portion 41 is arranged by dispensing uncured resin that forms the first convex portion 41 from the nozzle of a dispenser and moving the nozzle along the element mounting region 13 of the light-transmitting member 5. Note that the height from the upper surface of the first substrate 10 to the upper surface of the light-transmitting member 5 is lower at the outer edge of the upper surface (i.e., the region in contact with the upper surface of the first substrate) than at the center of the upper surface of the light-transmitting member 5 (i.e., the region directly above the light-emitting element 1). The first convex portion 41 covers this lower region. This prevents the uncured resin forming the first convex portion 41 from creeping up onto the upper surface of the translucent member 5 covering the light-emitting element 1 (i.e., the light-emitting surface of the light-emitting device 100) when the first convex portion 41 is supplied.

[0048] In the second convex portion arranging step S17, the second convex portion 42 is arranged on the upper surface of the second substrate 20 outside the second terminal 120. It is preferable that the first convex portion 41 and the second convex portion 42 are made of the same material, which allows the first convex portion arranging step S16 and the second convex portion arranging step S17 to be performed as the same step. In the first convex portion arranging step S16 and the second convex portion arranging step S17, the second convex portion 42 may be arranged first in the second convex portion arranging step S17, and then the first convex portion 41 may be arranged in the first convex portion arranging step S16. Furthermore, the first convex portion arranging step S16 may be performed simultaneously with the second convex portion arranging step S17, so that the first convex portion 41 and the second convex portion 42 are arranged substantially simultaneously.

[0049] The covering member placement step S18 is a step of placing a light-shielding covering member 40 that contacts the first protrusion 41 and covers the wire 130 outside the first protrusion 41. Specifically, this is a step of placing the light-shielding covering member 40 between the first protrusion 41 and the second protrusion 42. The covering member 40 is made of a resin whose base material has a lower viscosity than the first protrusion 41 and the second protrusion 42. The covering member 40 is placed across the first substrate 10 and the second substrate 20. Therefore, the covering member 40 also covers the side surface of the first substrate 10. Note that the top 40a of the covering member 40 placed in the covering member placement step S18 is formed so as to be higher than the top 41a of the first protrusion 41. To position the top 40a of the covering member 40 higher than the top 41a of the first protrusion 41, for example, it is preferable to repeatedly supply resin multiple times before the supplied resin hardens. It is preferable to supply the coating material 40 from directly above the top of the wire, so that the top of the wire can be easily coated with the coating material 40.

[0050] In the first convex portion arranging step S16, the second convex portion arranging step S17, and the covering member arranging step S18, for example, the first convex portion 41 and the second convex portion 42 are made of a silicone resin, and the covering member 40 is also made of a silicone resin. The viscosity of the uncured resin that forms the covering member 40 can be adjusted by adjusting the physical properties of the resin used in the resin or by adding a filler for adjusting viscosity. Furthermore, in these steps, arranging the first convex portion 41 and the second convex portion 42 includes the case of arranging a resin material that is uncured or, preferably, in a partially cured state, and is not limited to the case of completing full curing.

[0051] Second Embodiment [Configuration of the Light-Emitting Device According to the Second Embodiment] Next, a light emitting device according to a second embodiment will be described with reference to Figs. 10A to 10C. Fig. 10A is a plan view schematically showing a light emitting device 101 according to the second embodiment. Fig. 10B is a cross-sectional view taken along line XB-XB in Fig. 10A. Fig. 10C is a partially enlarged cross-sectional view showing a portion of Fig. 10B. Note that components with the same configuration as those already described will be designated by the same reference numerals followed by the letter H, and their description will be omitted where appropriate. The light emitting device 101 comprises a light emitting element 1H, a first substrate 10H having an element mounting area 13H on whose upper surface the light emitting element 1H is mounted, a light-transmitting member 5H covering the light emitting element 1H, the outer edge 51 of the lower surface of the light-transmitting member 5H being in contact with the upper surface outside the element mounting area 13H of the first substrate 10H, and a first convex portion 41H extending across the upper surface of the first substrate 10H and the upper surface of the light-transmitting member 5H and arranged along the outer edge 51 of the upper surface of the light-transmitting member 5H.

[0052] The first substrate 10H has an element mounting region 13H on its upper surface, and wiring connected to the light emitting element 1H is arranged in the element mounting region 13H. In addition, the first substrate 10H has wiring for electrical connection to a second substrate or the outside arranged in at least one location on the lower surface, side surface, or outer edge of the upper surface of the substrate. The light-transmitting member 5H is disposed so as to extend from the upper surface of the light-emitting element 1H to the upper surface of the first substrate 10H outside the element mounting region, so that the outer edge 51 of its lower surface is in contact with the upper surface of the first substrate 10H. As described in the first embodiment, the light-transmitting member 5H may be formed of a light-transmitting resin such as a silicone resin. The light-transmitting member 5H may also contain a wavelength conversion member. The light-transmitting member 5H is disposed so as to enclose the upper surface of at least one light-emitting element 1H in a plan view, and extends to the upper surface of the first substrate 10H so that the outer edge of its lower surface is in contact with the upper surface of the first substrate 10H. Note that the outer edge 51 of the light-transmitting member 5H is preferably positioned a distance W1 from the outer edge of the light-emitting element 1H, so that the distance W1 is at least twice the thickness D1 of the light-emitting element 1H.

[0053] The first convex portion 41H is disposed across the outer edge 51 of the upper surface of the light-transmitting member 5H and the upper surface of the first substrate 10H. As an example, as shown in FIG. 10B , the first convex portion 41H is preferably disposed so that, in a cross-sectional view, approximately half of the lower surface of the first convex portion covers the outer edge 51 of the upper surface of the light-transmitting member 5H and approximately the remaining half is in contact with the upper surface of the first substrate 10H. Note that the light-emitting device 101 may be configured such that the light-transmitting member 5H is disposed with a reflective member disposed on the side surface so as to expose the upper surface of the light-emitting element 1H. When a reflective member is disposed, the light-transmitting member 5H is disposed so as to cover the upper surface of the light-emitting element 1H and the upper and side surfaces of the reflective member and to be in contact with the upper surface of the first substrate 10H. In the light emitting device 101, the first convex portion 41H is disposed so as to cover the outer edge 51 of the upper surface of the light-transmitting member 5H, in other words, the end portion of the light-transmitting member 5H is disposed so as to be sandwiched between the first convex portion 41H and the first substrate 10H, thereby improving the adhesion between the light-transmitting member 5H and the first substrate 10H, thereby enabling the light emitting device 101 to have excellent reliability. Note that the first convex portion 41H is preferably disposed at a position away from a step in the light-transmitting member 5H formed when the light-transmitting member 5H covers the light-emitting element 1H.

[0054] [Method for manufacturing a light emitting device according to the second embodiment] Next, a method for manufacturing the light emitting device 101 will be described with reference to Fig. 11 and Fig. 12A to Fig. 12D. Fig. 11 is a flowchart illustrating a method for manufacturing the light emitting device according to the second embodiment. Fig. 12A to Fig. 12D are cross-sectional views schematically showing the method for manufacturing the light emitting device according to the second embodiment. The manufacturing method of the light emitting device 101 includes an element mounting step S21, a light-transmitting member arranging step S22, a light-transmitting member hardening step S23, and a first convex portion arranging step S24. Note that the manufacturing method of the light emitting device 101 may include a reflective member arranging step between the element mounting step S21 and the light-transmitting member arranging step S22. The element mounting step S21 is a step of mounting the light emitting element 1H on the element mounting region 13H of the first substrate 10H. The light emitting element 1H can be flip-chip mounted on the element mounting region 13H on the first substrate 10H via a conductive bonding material such as eutectic solder, conductive paste, bumps, plating, etc.

[0055] The light-transmitting member arrangement step S22 is a step of arranging a light-transmitting member 5H covering the upper surface of the light-emitting element 1H. The light-transmitting member 5H can be, for example, a sheet of resin containing a wavelength conversion material. Specifically, an uncured light-transmitting member 5H processed into a sheet of a predetermined size is prepared in advance and arranged on the light-emitting element 1H. The light-transmitting member 5H may be fixed to the light-emitting element 1H via a light-transmitting bonding material such as resin, or may be fixed without a bonding material by utilizing the tackiness of the light-transmitting member. The light-transmitting member 5H is used to be larger in area than the upper surface of the light-emitting element 1H so that the outer edge of its lower surface will contact the upper surface of the first substrate 10H when it is softened in the next step.

[0056] For example, when the light-emitting element 1H is approximately rectangular in plan view, the light-transmitting member 5H is a sheet-like member that is approximately rectangular in plan view, and when covering the upper surface of the light-emitting element 1H, it is preferable that the light-transmitting member 5H is sized so that the outer edge of the light-emitting element is positioned at a distance W1 from the outer edge of the light-emitting element that is at least twice the height D1 of the side surface of the light-emitting element 1H. The light-transmitting member hardening step S23 is a step of deforming the light-transmitting member 5H arranged on the light-emitting element 1H so that the outer edge 51 of the lower surface is in contact with the first substrate 10H, and hardening the light-transmitting member 5H. In the light-transmitting member hardening step S23, the light-transmitting member 5H is hardened by heating. In the light-transmitting member hardening step S23, the unhardened sheet-like light-transmitting member 5H is softened by heating and deformed along the upper and side surfaces of the light-emitting element 1H, and hardened in a state where the outer edge 51 of the lower surface of the light-transmitting member 5H is in contact with the upper surface of the first substrate 10H.

[0057] The first convex portion arranging step S24 is a step of arranging the first convex portions 41H along the outer edge 51 of the upper surface of the light-transmitting member 5H so as to extend over both the upper surface of the first substrate 10H and the upper surface of the light-transmitting member 5H. In the first convex portion arranging step S24, the uncured resin that forms the first convex portions 41H is supplied from the nozzle of a dispenser, and the nozzle is moved along the outer edge 51 of the upper surface of the light-transmitting member 5H to arrange the first convex portions 41H. Here, the height of the upper surface of the light-transmitting member 5H (i.e., the distance from the upper surface of the first substrate to the upper surface of the light-transmitting member 5H) is lower at the outer edge of the upper surface of the light-transmitting member 5H that contacts the first substrate 10H than at the upper surface of the light-transmitting member 5H located above the light-emitting element 1H. This makes it possible to prevent the uncured resin that forms the first convex portions from creeping up onto the upper surface of the light-transmitting member 5H when arranging the first convex portions 41H. The above steps are carried out to manufacture the light emitting device 101. The light emitting device 101 can also be used by placing the first substrate 10H on the second substrate.

[0058] (Variation) 13, the light emitting device 100D may have a recess 24 on the upper surface of the second substrate 20D, and a substrate mounting area 23D may be provided within the recess 24. FIG. 13 is a cross-sectional view schematically showing a modified example of the first embodiment. The same reference numerals are used for components already described. In this way, the light emitting device 100D can have a reduced overall thickness by having the second substrate 20D have the recess 24 that forms the substrate mounting area 23D. Furthermore, in each of the light-emitting devices already described, the first convex portions may be partially arranged, for example, linearly arranged along opposing sides of the light-transmitting member. In this case, too, the first convex portions are installed so as to extend across the outer edge of the upper surface of the light-transmitting member and the upper surface of the first substrate. While the light-emitting device and the manufacturing method thereof according to the present invention have been specifically described above using the preferred embodiments, the scope of the present invention is not limited to these descriptions and should be broadly interpreted based on the claims. Furthermore, it goes without saying that various changes and modifications based on these descriptions are also included in the scope of the present invention. [Industrial Applicability]

[0059] The light emitting devices 100, 100D, and 101 according to the embodiments of the present disclosure can be used in various light sources such as vehicle headlights, projectors, and lighting. [Explanation of symbols]

[0060] 1 Light-emitting element 5 Translucent material 7 Reflective material 10 First board 110 1st terminal 13 Element mounting area 20,20D Second board 120 2nd terminal 23 Substrate placement area 24 recess 130 wire 130a Top of wire 31 First Wire 32 Second Wire 33 Third Wire 40 Covering material 41 First convex part 42 Second convex part 100, 101, 100D Light-emitting device S11 Element mounting process S12 Reflective material placement process S13 Substrate placement process S14 Wire connection process S15 Light Transmitting Components Configuration Project S16 1st convex part arrangement process S17 2nd convex part arrangement process S18 Covered parts configuration project

Claims

1. A light-emitting element; a first substrate having an element mounting area on an upper surface thereof for mounting the light emitting element; a light-transmitting member covering the light-emitting element and in contact with an upper surface of the first substrate outside the element mounting region; a first convex portion disposed on the first substrate so as to surround the element mounting region, the first convex portion has an inner edge located above the light-transmitting member and a top portion higher than an upper surface of the light-emitting element, the light-transmitting member has a rectangular shape in a plan view, The first protrusion is arranged in a rectangular frame shape in a plan view.

2. A light-emitting element, a first substrate having an element mounting area on an upper surface thereof for mounting the light emitting element; a reflective member disposed on the first substrate, exposing an upper surface of the light emitting element and covering a side surface of the light emitting element; a light-transmitting member covering the light-emitting element and in contact with an upper surface of the first substrate outside the element mounting region; a first convex portion disposed on the first substrate so as to surround the element mounting region, The first convex portion has an inner edge positioned above the light-transmitting member and a top portion higher than an upper surface of the light-emitting element.

3. A light-emitting element, a first substrate having an element mounting area on an upper surface thereof for mounting the light emitting element; a light-transmitting member covering the light-emitting element and in contact with an upper surface of the first substrate outside the element mounting region; a first convex portion disposed on the first substrate so as to surround the element mounting region; a second substrate having a substrate placement area on its upper surface for placing the first substrate thereon; a covering member in contact with the first protrusion and disposed across the first substrate and the second substrate, The first convex portion has an inner edge positioned above the light-transmitting member and a top portion higher than an upper surface of the light-emitting element.

4. 4. The light-emitting device according to claim 1, wherein a height of the upper surface of the light-transmitting member, which is a distance from an upper surface of the first substrate to an upper surface of the light-transmitting member, is lower for the upper surface of the light-transmitting member that is in contact with the first substrate than for the upper surface of the light-transmitting member that is located above the light-emitting element.

5. the light-transmitting member has a rectangular shape in a plan view, The light emitting device according to claim 2 , except when claim 1 is recited, wherein the first convex portion is arranged in a rectangular frame shape in a plan view.

6. The light-emitting element is a semiconductor laminate having a rectangular shape in a plan view, 6. The light emitting device according to claim 1, wherein a plurality of the light emitting elements are arranged in the element mounting region in rows and columns at predetermined intervals.

7. 7. The light emitting device according to claim 1, except when claim 2 is recited, further comprising a reflective member disposed on the first substrate, exposing an upper surface of the light emitting element and covering a side surface thereof.

8. 8. The light emitting device according to claim 1, wherein the top of the first convex portion is positioned higher than the top of the light-transmitting member.

9. 9. The light emitting device according to claim 1, wherein the light-transmitting member is a resin containing phosphor powder.

10. a second substrate having a substrate placement area on its upper surface for placing the first substrate thereon; 10. The light emitting device according to claim 1, except when claim 3 is recited, further comprising a covering member that contacts the first convex portion and is arranged across the first substrate and the second substrate.

11. a first terminal disposed on an upper surface of the first substrate outside the element mounting area; 11. The light emitting device according to claim 3, further comprising: a second terminal disposed on an upper surface of the second substrate outside the substrate mounting area; and a wire connecting the first terminal and the second terminal.

12. the element mounting region is rectangular in plan view, The light emitting device according to claim 11 , wherein the first terminals are arranged along opposing long sides of the rectangle so as to sandwich the element mounting region.

13. The light emitting device according to claim 3 , wherein the second substrate has a recess on an upper surface thereof, and the first substrate is disposed in the recess.

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