In-vehicle electronic control unit

Abstract

To provide an on-vehicle electronic control device using a room temperature curing heat dissipation material whose curing time at 15°C is within 40 hours.SOLUTION: An on-vehicle electronic control device includes a predetermined heat dissipation material interposed between an electronic component and a heat dissipation member, the predetermined heat dissipation material is a material having a silicone resin as a matrix, and when the molar concentration of the vinyl group structure [-Si-CH=CH2] and the molar concentration of the main chain structure [-Si-CH2CH2-Si-] in the silicone resin are quantitatively analyzed using a nuclear magnetic resonance device, the relationship of "[-Si-CH=CH2] / [-Si-CH2CH2-Si-]≤0.85" is satisfied.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an on-vehicle electronic control unit in which a heat dissipating material is interposed between an electronic component and a heat dissipating member. [Background technology]

[0002] The technologies of advanced driver assistance systems (ADAS) and autonomous driving (AD) for driving automobiles and other vehicles have made great progress in recent years, and further development is expected in the future. In ADAS and AD, electronic control units (ECUs) play a very important role, and many ECUs are installed depending on various applications and purposes. In this specification, the various ECUs installed in automobiles and other vehicles are collectively referred to as on-board ECUs.

[0003] In-vehicle ECUs perform complex and advanced calculations, and generate a lot of heat from electronic components such as integrated circuits (ICs), so they require heat dissipation using heat dissipation materials such as heat sinks and heat spreaders to prevent thermal runaway.In this case, to improve heat dissipation efficiency, thermal dissipation materials (TIMs, also known as thermal conductive materials or thermal interface materials) are often placed between the electronic components and the heat dissipation materials.

[0004] For example, Patent Document 1 (JP 2018-198335 A) describes a method for manufacturing an electronic control device that includes a housing formed by joining two components, a circuit board on which electronic components are mounted and housed in the housing, a waterproof sealant that seals the joints of the components, and a heat-conductive material that thermally connects the electronic components and the housing, The method for manufacturing an electronic control device is taught, in which a thermosetting material is used for the waterproof sealant, a material whose viscosity increases when heated is used for the thermally conductive material, the circuit board and the thermally conductive material are housed in a housing, and the housing is heated with the waterproof sealant before hardening placed at the joints of each of the components, and the heating process hardens the waterproof sealant and increases the viscosity of the thermally conductive material.

[0005] According to Patent Document 1, the use of thermosetting thermal grease as a heat dissipation material can improve the ease of application, and then by thermally curing the thermal grease, it is possible to provide an electronic control device that can suppress deformation and spillage due to thermal deformation and vibration. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2018-198335 Summary of the Invention [Problem to be solved by the invention]

[0007] Meanwhile, in recent years, there has been a strong demand to reduce greenhouse gas (e.g., CO2) emissions from the perspective of protecting the global environment, and efforts to achieve carbon neutrality have become an urgent issue for manufacturers of machinery and equipment. The technology in Patent Document 1 requires heat treatment, and the CO2 gas emissions resulting from the heat treatment pose an obstacle to achieving carbon neutrality. Furthermore, when it comes to achieving carbon neutrality, even if the heat treatment itself is performed using electricity, it is necessary to consider the CO2 gas generated when generating that electricity.

[0008] As part of efforts to become carbon neutral, the inventors investigated replacing conventional thermosetting TIM with room-temperature curing TIM, which would eliminate the need for heat treatment in the manufacture of automotive ECUs.

[0009] Because room-temperature curing TIM does not require heat treatment, the curing time is strongly affected by the temperature of the working environment, which varies depending on the season and region, but is expected to fall to a minimum of around 15°C.

[0010] The inventors investigated the curing time of room-temperature-curing TIM at 15°C. As a result, they found that conventional two-component room-temperature-curing TIM takes approximately 72 hours to cure at 15°C, which creates other problems in the manufacture of automotive ECUs: increased work time and reduced throughput (resulting in increased costs).

[0011] Considering both the perspectives of carbon neutrality and work time / throughput, 40 hours is considered the upper limit of the allowable curing time at 15°C. Therefore, an object of the present invention is to provide an in-vehicle ECU that uses a room-temperature-curable TIM that has a curing time of 40 hours or less at 15°C. [Means for solving the problem]

[0012] One aspect of the present invention is an on-vehicle electronic control device in which a predetermined heat dissipation material is interposed between an electronic component and a heat dissipation member, the predetermined heat dissipation material is a material having a silicone resin matrix, The silicone resin is characterized in that, when the molar concentration of the vinyl group structure [-Si-CH=CH2] and the molar concentration of the main chain structure [-Si-CH2CH2-Si-] in the silicone resin are quantitatively analyzed using a nuclear magnetic resonance (NMR) spectrometer, the relationship "[-Si-CH=CH2] / [-Si-CH2CH2-Si-]≦0.85" is satisfied. [Effects of the Invention]

[0013] According to the present invention, by using a room-temperature curing TIM that cures in 40 hours or less even when the working environment temperature is 15°C, it is possible to provide an in-vehicle ECU that contributes to carbon neutrality without significantly sacrificing productivity (e.g., throughput). Note that other issues, configurations, and effects will become clear from the description of the embodiments below. [Brief explanation of the drawings]

[0014] [Figure 1A] 1 is an exploded perspective view showing an example of an in-vehicle electronic control unit (in-vehicle ECU) according to the present invention; [Figure 1B] 1B is a schematic exploded perspective view of the exploded perspective view shown in FIG. 1A, viewed from the opposite side of the top and bottom. [Figure 1C] 1C is a schematic cross-sectional view of a part of the in-vehicle ECU shown in FIG. 1B. [Figure 2] 1 is an example of a graph showing the relationship between storage modulus and time in a two-component mixed addition reaction type silicone resin. [Figure 3] 1 is a graph showing the relationship between the ratio of the molar concentration of vinyl group structures [-Si-CH=CH] to the molar concentration of main chain structures [-Si-CHCH-Si-] in a cured silicone resin, ie, "[-Si-CH=CH] / [-Si-CHCH-Si-]," and the curing time at 15°C. DETAILED DESCRIPTION OF THE INVENTION

[0015] [Basic concept of the present invention] As mentioned above, the present inventors investigated the curing time of room-temperature-curable TIM at 15° C. A two-component mixed addition reaction type room-temperature-curable silicone resin was selected as the room-temperature-curable TIM, and the inventors focused on the chemical structure that constitutes the silicone resin and conducted extensive research and studies into the relationship between the chemical structure and the curing time.

[0016] As a result, they discovered that by controlling the molar concentration of vinyl group structures [-Si-CH=CH2], the molar concentration of main chain structures [-Si-CH2CH2-Si-], and the molar concentration of main skeleton structures [-O-Si-(CH3)2-] in a room-temperature curable silicone resin so that they have a specific relationship, it is possible to control the curing time at 15°C to within 40 hours. The present invention was completed based on this finding.

[0017] The present invention allows the following improvements and modifications to be made to the above-described on-vehicle electronic control unit according to the present invention. (i) When the molar concentration of the vinyl group structure [-Si-CH=CH2] and the molar concentration of the main skeleton structure [-O-Si-(CH3)2-] in the silicone resin are quantitatively analyzed using a nuclear magnetic resonance spectrometer, the relationship "[-Si-CH=CH2] / [-O-Si-(CH3)2-]≦0.95" is satisfied. (ii) In the silicone resin, the molar concentration of the vinyl group structure [—Si—CH═CH] and the molar concentration of the main chain structure [—Si—CH═CH—Si—] satisfy the relationship "[—Si—CH═CH] / [—Si—CH═CH—Si—]≦0.60." (iii) The silicone resin has a molar concentration of the vinyl group structure [-Si-CH=CH2] and a molar concentration of the main skeleton structure [-O-Si-(CH3)2-] that satisfy the relationship "[-Si-CH=CH2] / [-O-Si-(CH3)2-] ≦ 0.65". (iv) The silicone resin has a molar concentration of the vinyl group structure [—Si—CH═CH] and a molar concentration of the main chain structure [—Si—CH═CH—Si—] that satisfy the relationship "[—Si—CH═CH] / [—Si—CH═CH—Si—]≦0.40." (v) The silicone resin has a molar concentration of the vinyl group structure [-Si-CH=CH2] and a molar concentration of the main skeleton structure [-O-Si-(CH3)2-] that satisfy the relationship "[-Si-CH=CH2] / [-O-Si-(CH3)2-] ≦ 0.45". (vi) The silicone resin has a storage modulus of greater than 0.1 MPa. (vii) The silicone resin has a storage modulus of 0.15 MPa or more. (viii) The silicone resin has a storage modulus of 0.2 MPa or more. (ix) The silicone resin has a tensile shear bond strength of 0.015 MPa or more. (x) The silicone resin has a tensile shear bond strength of 0.020 MPa or more. (xi) The silicone resin has a tensile shear bond strength of 0.025 MPa or more. (xii) The silicone resin is a two-component mixture addition reaction type room temperature curable silicone resin.

[0018] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, for mechanisms and configurations that have the same meaning (including cases where the differences are small), the same reference numerals will be used and duplicated explanations will be omitted. Furthermore, the present invention is not limited to the embodiments described here, and can be appropriately combined with known technologies or improved based on known technologies within the scope of the technical concept of the invention.

[0019] [Embodiment 1] FIG. 1A is an exploded perspective schematic view showing an example of an in-vehicle electronic control unit (in-vehicle ECU) according to the present invention, FIG. 1B is an exploded perspective schematic view showing the exploded perspective view shown in FIG. 1A from the opposite top and bottom sides, and FIG. 1C is a partial cross-sectional schematic view of the in-vehicle ECU shown in FIG. 1B.

[0020] As described above, an in-vehicle ECU is a type of computer that electronically controls various uses / purposes (e.g., engine, transmission, steering, airbags, etc.) in driving an automobile or the like, and has an internal electronic circuit. As shown in Figures 1A to 1C, in-vehicle ECU 100, of the cover 40, base 50, and fasteners 60 that constitute a housing, the cover 40 also serves as a heat dissipation member, and electronic components 10 and connectors 20 are mounted (electrically connected) on a circuit board 30 to form an electronic circuit, which are then housed in the housing (cover 40, base 50) with heat dissipation material 15 interposed between the electronic components 10 and cover 40.

[0021] Each part will now be described in more detail.

[0022] There are no particular limitations on electronic component 10 as long as it is for in-vehicle use, and examples of such electronic components include semiconductor elements such as a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an SoC (System on a Chip), and a DDR SDRAM (Double-Data-Rate Synchronous Dynamic Random Access Memory). In FIG. 1C, electronic component 10 is depicted as a BGA (Ball Grid Array) package in which IC chip 11 is connected to interposer 12 and connected to circuit board 30 via bumps 13. Naturally, electronic component 10 is not limited to a BGA package, and may also be a lead frame type package.

[0023] The connector 20 is a part that electrically connects the electronic component 10 mounted on the circuit board 30 to an external device. There are no particular limitations on the connector 20, and a conventional connector for use in a vehicle can be used as appropriate.

[0024] The circuit board 30 is a board in which metal wiring is formed on an electrically insulating base material, and a conventional in-vehicle circuit board can be used as appropriate, similar to the electronic components 10 and connectors 20. In the example shown in Figures 1A and 1B, fixing holes are provided in the outer peripheral region, and the circuit board is configured to be fixed to the cover 40 by fasteners 60 (for example, fixing screws).

[0025] The cover 40 and the base 50 are combined with fasteners 60 to form a waterproof and dustproof sealed housing. In the example shown in FIGS. 1A to 1C, the cover 40 also functions as a heat dissipation member, as described above. The thermal interface material (TIM) 15 is disposed between the cover 40 and the electronic component 10 so as to be sandwiched and in contact with the cover 40, and is capable of efficiently transferring heat from the electronic component 10 to the cover 40. The details of the TIM 15 will be described later.

[0026] Although heat dissipation pedestal 45 formed on cover 40 is not an essential component of the present invention, it is preferable to form it from the viewpoints of heat dissipation efficiency and assembly efficiency. 1A and 1B show an example in which two heat dissipation pedestals 45 are formed to respectively correspond to two electronic components 10, but a configuration in which one heat dissipation pedestal 45 corresponds to two electronic components 10 may also be used.

[0027] There are no particular limitations on the materials for the cover 40 and the base 50 as long as they have the heat resistance, waterproofness, dustproofness, and thermal conductivity required for in-vehicle use, and metal materials (e.g., aluminum alloys, magnesium alloys, steel materials) and highly thermally conductive resin materials (e.g., polybutylene terephthalate resin (PBT), polyphenylene sulfide resin (PPS), and polyamide resin (PA6) containing thermally conductive fillers) can be used as appropriate. The heat dissipation member is not limited to the cover 40, and the base 50 may also function as a heat dissipation member, or both the cover 40 and the base 50 may also function as heat dissipation members.

[0028] In addition to functioning as a thermally conductive material, TIM 15 is also required to function as an adhesive / pressure-sensitive adhesive. Before curing, it is preferable for the material to have fluidity from the viewpoint of ease of application, with a viscosity of, for example, 100 Pa·s or more and 600 Pa·s or less. After curing, it is preferable for the material not to shift or flow out due to vibrations or stresses during vehicle operation, with a storage modulus G' of more than 0.1 MPa and / or a tensile shear adhesive strength of 0.015 MPa or more being preferred. More specifically, it is preferable to use a material with a silicone resin matrix as TIM 15, with room-temperature-curing silicone resins of the two-component addition reaction type being particularly preferred.

[0029] Silicone resin is a synthetic polymer material with a main skeleton made of siloxane bonds (Si-O-Si bonds). Silicone resin has excellent heat resistance (over 200°C) and chemical stability, and its elastic properties mean it can absorb and mitigate vibrations and shocks.

[0030] Two-component addition reaction silicone resins cure through an addition reaction between the vinyl group (-Si-CH=CH2) of the base resin and the -Si-H group of the curing agent in a catalytic environment (usually a platinum catalyst). In this invention, the time until this addition reaction is complete is defined as the cure time. This cure time can be determined from the change in the storage modulus G' of the resin over time.

[0031] FIG. 2 is an example of a graph showing the relationship between storage modulus and time for a two-component mixed addition reaction type silicone resin. When the base resin and curing agent are mixed, as shown in FIG. 2, a gelation initiation region (region where curing begins and progresses) appears in which the storage modulus increases rapidly, followed by a gelation completion region (region where curing completes) in which the storage modulus is nearly saturated. It has been reported that in the addition reaction of silicone resins, a basic skeleton is formed in the gelation completion region, and the curing time is defined as the time at the intersection of the tangent to the gelation initiation region and the tangent to the gelation completion region. This definition is also adopted in the present invention.

[0032] Cured silicone resin contains the following chemical structures: a main skeleton structure "-O-Si-(CH3)2-", a main chain structure "-Si-CH2CH2-Si-", and a vinyl group structure "-Si-CH=CH2". The inventors have conducted extensive research into the relationship between these chemical structures and curing time, and have found that by controlling the molar concentrations of these chemical structures to have a specific relationship, the curing time at 15°C can be controlled to within 40 hours. The molar concentrations of each chemical structure can be measured by quantitative analysis using a nuclear magnetic resonance (NMR) spectrometer.

[0033] The ratio of the molar concentration of the vinyl group structure [-Si-CH=CH] to the molar concentration of the main chain structure [-Si-CHCH-Si-] in the cured silicone resin is preferably controlled to "[-Si-CH=CH] / [-Si-CHCH-Si-]" ≦0.85, which allows for a curing time of 40 hours or less at 15°C. It is more preferable to control it to "[-Si-CH=CH] / [-Si-CHCH-Si-] ≦0.60, which allows for a curing time of 30 hours or less at 15°C. It is even more preferable to control it to "[-Si-CH=CH] / [-Si-CHCH-Si-] ≦0.40, which allows for a curing time of 24 hours or less at 15°C.

[0034] Similarly, the ratio of the molar concentration of the vinyl group structure [-Si-CH=CH] to the molar concentration of the main skeleton structure [-O-Si-(CH3)2-] in the cured silicone resin is preferably controlled to "[-Si-CH=CH2] / [-O-Si-(CH3)2-] ≤ 0.95," which allows for a curing time of 40 hours or less at 15°C. It is more preferable to control it to "[-Si-CH=CH2] / [-O-Si-(CH3)2-] ≤ 0.65," which allows for a curing time of 30 hours or less at 15°C. It is even more preferable to control it to "[-Si-CH=CH2] / [-O-Si-(CH3)2-] ≤ 0.45," which allows for a curing time of 24 hours or less at 15°C.

[0035] The molar concentration of vinyl group structures [—Si—CH═CH 2 ] in the cured silicone resin is preferably 0.3 mol % or less, more preferably 0.25 mol % or less, and even more preferably 0.2 mol % or less.

[0036] As long as the molar concentration relationship of the above-mentioned chemical structure in the cured silicone resin can be finally achieved, there is no particular limitation to the manufacturing method, but the method for controlling the molar concentration of the vinyl group structure remaining after curing can be, for example, controlling the molar concentration of the main chain structure "-Si-CH2CH2-Si-" and the vinyl group "-Si-CH=CH2" in the main agent before mixing, controlling the mixing ratio of the curing agent, or controlling the amount and chemical activity of the platinum catalyst.As an example, if the molar concentration of the main chain structure "-Si-CH2CH2-Si-" in the main agent before mixing is 99.09 mol%, the molar concentration of the vinyl group "-Si-CH=CH2" is 0.58 mol%, and the molar concentration of the -Si-H group in the curing agent is 0.38 mol%, then a silicone resin with a curing time of 24 hours at 15 ° C can be obtained.

[0037] To improve the heat dissipation efficiency between the electronic component and the heat dissipation member, the TIM preferably has a thermal conductivity of 1.5 W / m·K or higher, and more preferably 2 W / m·K or higher. To ensure such thermal conductivity, the TIM preferably has a silicone resin matrix in which a thermally conductive filler is dispersed and mixed. There are no particular limitations on the thermally conductive filler, as long as it is an electrically insulating material with good thermal conductivity (e.g., 2 W / m·K or higher). Suitable examples of the thermally conductive filler include aluminum oxide, zinc oxide, magnesium oxide, silicon oxide, aluminum nitride, and boron nitride.

[0038] To increase the adhesive strength and holding power of the TIM, it is preferable that the storage modulus G' of the cured silicone resin is high. However, if the storage modulus G' is too high, the adhesiveness will decrease and the vibration and stress absorption and relaxation properties will decrease. If the storage modulus G' is too low, sufficient holding power will not be ensured. In the present invention, the storage modulus G' of the cured silicone resin is preferably more than 0.1 MPa and not more than 20 MPa, more preferably 0.15 MPa to 10 MPa, and even more preferably 0.2 MPa to 5 MPa.

[0039] Furthermore, from the viewpoint of preventing misalignment, the adhesive strength of the TIM after curing is preferably a tensile shear adhesive strength of 0.015 MPa or more, more preferably a tensile shear adhesive strength of 0.020 MPa or more, and even more preferably a tensile shear adhesive strength of 0.025 MPa or more. [Example]

[0040] The present invention will be explained in more detail below with reference to various experiments, however, the present invention is not limited to the configurations and structures described in these experiments.

[0041] [Experiment 1] (Preparation of Comparative Example 1 and Examples 1 to 4) A commercially available two-component addition reaction type room-temperature curable silicone resin (Comparative Example 1) was prepared. Separately, by controlling the molar concentrations of the main chain structure "-Si-CH2CH2-Si-" and vinyl group "-Si-CH=CH2" in the base resin before mixing and controlling the mixing ratio of the curing agent, two-component addition reaction type room-temperature curable silicone resins (Examples 1 to 4) were prepared that had different molar concentrations of vinyl group structures remaining in the silicone resin after curing.

[0042] [Experiment 2] (Measurement of the curing time of room temperature curing silicone resin) The two-component mixture addition reaction type room-temperature curable silicone resins prepared in Experiment 1 (Comparative Example 1 and Examples 1-4) were used to measure the cure time at 15°C. Using a rheometer (Anton Paar Japan, Model: MCR 502) under specified measurement conditions (sample thickness: 3 mm, jig diameter: 25 mm, temperature: 15°C, vibration frequency: 1 Hz, strain: 0.01%), the change in storage modulus over time was measured, and the cure time was calculated based on the same definition as in Figure 2. The storage modulus G' at the cure time was also calculated. The results are shown in Table 1 below.

[0043] [Experiment 3] (Measurement of the molar concentration of chemical structures in cured silicone resin) For each cured silicone resin (Comparative Example 1 and Examples 1-4), quantitative analysis was performed on the molar concentration of the main backbone structure [-O-Si-(CH3)2-], the molar concentration of the main chain structure [-Si-CH2CH2-Si-], and the molar concentration of the vinyl group structure [-Si-CH=CH2] remaining in the resin. Using an NMR device (JEOL Ltd., Model: ECA-500FT-NMR), the molar concentration of each chemical structure was measured under specified measurement conditions (measurement nuclide: 1H, magnetic field strength: 11.7 T (500 MHz for 1H nuclei), observation frequency range: -2.5 ppm to 12.5 ppm (45° pulse), number of data points: 16,384, measurement mode: 13C decoupling, repetition time: 30 s, number of accumulations: 256, measurement solvent: deuterated chloroform, measurement temperature: room temperature), and the molar concentration ratio of each chemical structure was calculated. The results are also shown in Table 1.

[0044] [Experiment 4] (Measurement of tensile shear adhesive strength of cured silicone resin) The two-component mixture addition reaction type room temperature curable silicone resins prepared in Experiment 1 (Comparative Example 1 and Examples 1-4) were used to measure tensile shear bond strength in accordance with JIS K6850. Using a precision universal testing machine (Shimadzu Corporation, model: AGS-H 500N), the maximum load was measured at a tensile speed of 5 mm / min, and the tensile shear bond strength was calculated by dividing the load by the shear area. The results are also shown in Table 1.

[0045] [Table 1]

[0046] To investigate the relationship between "curing time at 15°C" and "[-Si-CH=CH2] / [-Si-CH2CH2-Si-]", the experimental results shown in Table 1 were plotted on a graph. Figure 3 is a graph showing the relationship between "curing time at 15°C", and "[-Si-CH=CH2] / [-Si-CH2CH2-Si-]", the ratio of the molar concentration of vinyl group structures [-Si-CH=CH2] to the molar concentration of main chain structures [-Si-CH2CH2-Si-] in the cured silicone resin.

[0047] As shown in Figure 3, it can be seen that the "curing time at 15°C" shortens as the ratio "[-Si-CH=CH2] / [-Si-CH2CH2-Si-]" decreases. Furthermore, the "curing time at 15°C" of Comparative Example 1 is significantly larger than the slope of the plots of Examples 1 to 4. Therefore, an approximation curve was calculated for the five plots, a tangent to the approximation curve was calculated for Comparative Example 1, and an approximation line / regression line was calculated for the plots of Examples 1 to 4.

[0048] As a result, it was found that the intersection of the two lines was "[-Si-CH=CH2] / [-Si-CH2CH2-Si-]=0.85" and "cure time at 15°C: 40 hours." It is thought that the mode of the addition reaction related to the cure time changes somehow at the boundary of "[-Si-CH=CH2] / [-Si-CH2CH2-Si-]=0.85." These results revealed that by controlling "[-Si-CH=CH2] / [-Si-CH2CH2-Si-]≦0.85," the cure time at 15°C can be kept to within 40 hours.

[0049] Although not shown in the figure, it has been separately confirmed that the same results as those in Figure 3 are obtained in the relationship between "curing time at 15°C" and "[-Si-CH=CH2] / [-O-Si-(CH3)2-]".

[0050] Furthermore, the results in Table 1 show that the tensile shear bond strength increases as the storage modulus of the cured silicone resin increases. By controlling the storage modulus of the cured silicone resin to greater than 0.1 MPa, the tensile shear bond strength can be made 0.015 MPa or greater.

[0051] The above-described embodiments and experiments have been described to aid in understanding the present invention, and the present invention is not limited to the specific configurations described. For example, it is possible to replace part of the configuration of the embodiments with configurations within the technical common sense of those skilled in the art, or to add configurations within the technical common sense of those skilled in the art to the configuration of the embodiments. In other words, it is possible to delete, replace, or add part of the configurations of the embodiments and experiments in this specification without departing from the technical spirit of the invention. For example, the heat dissipation material used in the present invention is not limited to use in automotive ECUs, but can also be used as a heat dissipation material for inverters, converters, and other devices other than those on automotive systems. [Explanation of symbols]

[0052] 100...In-vehicle electronic control device, 10...electronic component, 11...chip, 12...interposer, 13...bump, 15...heat dissipation material, 20...connector, 30...circuit board, 40...Cover, 45...Heat dissipation base, 50...Base, 60...Fastener.

Claims

1. An in-vehicle electronic control device in which a predetermined heat dissipation material is interposed between an electronic component and a heat dissipation member, the predetermined heat dissipation material is a material having a silicone resin matrix, The molar concentration of the vinyl group structure in the silicone resin [-Si-CH=CH 2 ] and the molar concentration of the main chain structure [-Si-CH 2 CH 2 -Si-] and [-Si-CH=CH 2 ] / [-Si-CH 2 CH 2 -Si-]≦0.85

2. 2. The on-vehicle electronic control device according to claim 1, The vinyl group structure [—Si—CH═CH 2 ] and the molar concentration of the main skeleton structure [-O-Si-(CH 3 ) 2 -] and when quantitatively analyzed using a nuclear magnetic resonance spectrometer, "[-Si-CH=CH 2 ] / [-O-Si-(CH 3 ) 2 - ]≦0.95」。

3. 2. The on-vehicle electronic control device according to claim 1, The silicone resin has a molar concentration of the vinyl group structure [—Si—CH═CH 2 ] and the molar concentration of the main chain structure [—Si—CH 2 CH 2 -Si-] and "[-Si-CH=CH 2 ] / [-Si-CH 2 CH 2 -Si-]≦0.60

4. 3. The on-vehicle electronic control device according to claim 2, The silicone resin has a molar concentration of the vinyl group structure [—Si—CH═CH 2 ] and the molar concentration of the main skeleton structure [—O—Si—(CH 3 ) 2 -] and "[-Si-CH=CH 2 ] / [-O-Si-(CH 3 ) 2 An in-vehicle electronic control device characterized by satisfying the relationship "-]≦0.65".

5. 4. The on-vehicle electronic control device according to claim 3, The silicone resin has a molar concentration of the vinyl group structure [—Si—CH═CH 2 ] and the molar concentration of the main chain structure [—Si—CH 2 CH 2 -Si-] and "[-Si-CH=CH 2 ] / [-Si-CH 2 CH 2 -Si-]≦0.

40.

6. 5. The on-vehicle electronic control device according to claim 4, The silicone resin has a molar concentration of the vinyl group structure [—Si—CH═CH 2 ] and the molar concentration of the main skeleton structure [—O—Si—(CH 3 ) 2 -] and "[-Si-CH=CH 2 ] / [-O-Si-(CH 3 ) 2 An in-vehicle electronic control device characterized by satisfying the relationship "-]≦0.45".

7. The on-vehicle electronic control device according to any one of claims 1 to 6, The in-vehicle electronic control device is characterized in that the silicone resin has a storage modulus of more than 0.1 MPa.

8. The on-vehicle electronic control device according to any one of claims 1 to 6, The in-vehicle electronic control device is characterized in that the silicone resin has a storage modulus of 0.15 MPa or more.

9. The on-vehicle electronic control device according to any one of claims 1 to 6, The in-vehicle electronic control device is characterized in that the silicone resin has a storage modulus of 0.2 MPa or more.

10. The on-vehicle electronic control device according to any one of claims 1 to 6, The in-vehicle electronic control device is characterized in that the silicone resin has a tensile shear adhesive strength of 0.015 MPa or more.

11. The on-vehicle electronic control device according to any one of claims 1 to 6, The in-vehicle electronic control device is characterized in that the silicone resin has a tensile shear adhesive strength of 0.020 MPa or more.

12. The on-vehicle electronic control device according to any one of claims 1 to 6, The in-vehicle electronic control device is characterized in that the silicone resin has a tensile shear adhesive strength of 0.025 MPa or more.

13. The on-vehicle electronic control device according to any one of claims 1 to 6, The in-vehicle electronic control device is characterized in that the silicone resin is a two-component mixture addition reaction type room temperature curing silicone resin.

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