Thermally conductive silicone composition

Abstract

The present invention relates to a method for producing an organopolysiloxane having at least one alkenyl group; (B) at least one organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms in the molecule; (C1) a polysiloxane having a D of at least 0.01 μm or more and 5 μm or less; 50 (C2) one or more silane surface-treated alumina particles having a particle size of D greater than 5 μm; 50 A thermally conductive silicone composition comprising: one or more silane surface-treated alumina particles having a particle size; (D) at least one silane coupling agent; and (E) at least one platinum-based cure catalyst; wherein component (C1) is present in an amount of less than 62 weight % based on the weight of the composition and said component (C2) is present in an amount of less than 80 weight % based on the weight of the composition, the composition being characterized by a favorable combination of properties such as good flowability and high thermal conductivity and good lap shear strength upon cure.

Description

[Technical Field]

[0001] The present invention relates to a thermally conductive silicone composition, and in particular to a thermally conductive silicone composition that exhibits good flowability, as well as high thermal conductivity and good lap shear strength upon curing, as well as a method for preparing and using the same. [Background technology]

[0002] Currently, there is a growing demand in the design of printed wiring boards and hybrid ICs for electronic elements such as transistors, integrated circuits, and memory elements for thermally conductive silicone compositions that exhibit good flowability as well as high thermal conductivity and good lap shear strength upon curing.

[0003] Examples of such thermally conductive silicone compositions include those containing a vinyl-containing organopolysiloxane, an organohydrogenpolysiloxane, a thermally conductive filler, an adhesion promoter selected from aminosilanes, epoxysilanes, or alkyl titanates, and a platinum catalyst. To improve the thermal conductivity of the cured product obtained from such a thermally conductive silicone composition, a large amount of thermally conductive filler must be added to the composition. However, increasing the amount of such filler not only impairs the flowability and moldability of the composition, but also reduces the physical properties of the cured product obtained from such a composition. Another drawback is the low adhesive strength of the cured product to various types of substrates.

[0004] In European Patent Application Publication No. 1726622, Formula (A): [ka] (In the formula, R 1 represents a monovalent hydrocarbon group, and R 2 represents an oxygen atom or a divalent hydrocarbon group, and R 3represents an alkyl group, an alkoxyalkyl group, an alkenyl group, or an acyl group; L and o represent numbers from 1 to 10; m represents a number from 0 to 10; n represents a number from 5 to 100; a represents an integer from 1 to 3; when m=0, L+o=2; and R 2 is a divalent hydrocarbon group.), (B) a thermally conductive filler, and (C) an organopolysiloxane other than component (A). Component (B) is preferably D 50 The particle size is in the range of 0.1 to 100 μm, and even more preferably in the range of 0.1 to 50 μm. The composition exhibits good handling and moldability, and the cured product of the composition is characterized by high thermal conductivity. However, the cured product of this thermally conductive silicone composition has relatively low adhesive strength (1.5 MPa or less), making it unsuitable for permanent bonding in electrical and electronic applications.

[0005] European Patent Application Publication No. 1,331,248 discloses a thermally conductive silicone composition comprising (A) an organopolysiloxane having an average of at least 0.1 alkenyl group bonded to a silicon atom in each molecule, (B) an organopolysiloxane having an average of at least two hydrogen atoms bonded to a silicon atom in each molecule, (C) a thermally conductive filler, (D) a platinum catalyst, and (E) a methylpolysiloxane having a hydrolyzable group and a vinyl group represented by a specific structural formula. However, the cured product of this thermally conductive silicone composition also has a relatively low adhesive strength (1.4 MPa or less).

[0006] Chinese Patent Application Publication No. 105916957 discloses a thermally conductive silicone composition containing (A) an addition reaction curable silicone resin composition having a viscosity of 100 Pa·s or less at 25°C, (B) a thermally conductive filler having an average particle size of 0.1 μm or more and less than 1 μm, and (C) a solvent having a boiling point of 250°C or more and less than 350°C. The blend amount of component (B) is 100 to 500 parts by mass per 100 parts by mass of component (A). The blend amount of component (C) is 5 to 20 parts by mass per 100 parts by mass of component (A). A cured product of this thermally conductive silicone composition has a desired adhesive strength but low thermal conductivity (1.2 W / (m·K) or less).

[0007] European Patent Application Publication No. 3666781 discloses a thermally conductive silicone composition comprising: (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms per molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms per molecule in an amount such that the number of moles of hydrogen atoms directly bonded to silicon atoms is 0.1 to 5.0 times the number of moles of alkenyl groups derived from component (A); (C) 200 to 3000 parts by mass of a thermally conductive filler; (D) a platinum-based curing catalyst in an amount equivalent to 0.1 to 1000 ppm, calculated as platinum group element mass, relative to component (A); (E) an effective amount of an addition reaction inhibitor; and (F-1) 0.01 to 200 parts by mass of the organosilicon compound according to claim 1. However, although the cured product of this thermally conductive silicone composition has the desired adhesive strength, the viscosity of the composition is relatively high (greater than 300 Pa·s), making it unsuitable for ease of handling and moldability. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] European Patent Application Publication No. 1726622 [Patent Document 2] European Patent Application Publication No. 1331248 [Patent Document 3] Chinese Patent Application Publication No. 105916957 [Patent Document 4] European Patent Application Publication No. 3666781 Summary of the Invention [Problem to be solved by the invention]

[0009] In view of the above, it is an object of the present invention to provide a thermally conductive silicone composition that has a favorable combination of properties, such as good flowability (less than 100 Pa·s at 25°C) as well as high thermal conductivity (1.6 W / (m·K) or greater) and good lap shear strength (1.6 MPa or greater) upon curing. [Means for solving the problem]

[0010] Disclosed herein is a method for producing a medicament for the treatment of a pulmonary arthritis. (A) at least one alkenyl group-containing organopolysiloxane; (B) at least one organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms in the molecule; (C1) D of at least 0.01 μm or more and 5 μm or less 50 alumina particles surface-treated with one or more silanes having a particle size; (C2) D exceeding 5 μm 50 alumina particles surface-treated with one or more silanes having a particle size; (D) at least one silane coupling agent; and (E) at least one platinum-based curing catalyst; A thermally conductive silicone composition comprising: A composition wherein component (C1) is present in an amount of less than 62 wt % based on the weight of the composition, and component (C2) is present in an amount of less than 80 wt % based on the weight of the composition.

[0011] Also disclosed herein is a method for preparing the thermally conductive silicone composition of the present invention.

[0012] This specification also discloses a cured product of the thermally conductive silicone composition of the present invention.

[0013] Also disclosed herein is the use of the thermally conductive silicone composition and the cured product of the thermally conductive silicone composition of the present invention in the manufacture of electronic devices. DETAILED DESCRIPTION OF THE INVENTION

[0014] Other features and aspects of the subject matter are described in detail below.

[0015] Those skilled in the art will appreciate that the present invention is a description of exemplary embodiments only and is not intended to limit the broad aspects of the present invention. Each aspect so described can be combined with any other aspect unless expressly indicated to the contrary. In particular, any feature indicated as being preferred or advantageous can be combined with any other feature or features indicated as being preferred or advantageous.

[0016] In the context of the present invention, unless otherwise specified, the terms used shall be construed in accordance with the following definitions.

[0017] Unless otherwise specified, as used herein, the terms "a," "an," and "the" include singular and plural referents.

[0018] As used herein, the terms "comprising" and "comprises" are synonymous with "including," "includes," or "containing," "contains," and are inclusive or open-ended and do not exclude additional, unrecited members, elements, or process steps.

[0019] As used herein, the term "room temperature" refers to a temperature of about 20°C to about 25°C, preferably about 25°C.

[0020] Unless otherwise specified, the recitation of numerical endpoints includes all numbers and fractions subsumed within the respective ranges, as well as the recited endpoints.

[0021] All references cited herein are incorporated by reference in their entirety.

[0022] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the meaning commonly understood by one of ordinary skill in the art to which this invention belongs.

[0023] In one aspect, the present disclosure generally comprises: (A) at least one alkenyl group-containing organopolysiloxane; (B) at least one organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms in the molecule; (C1) D of at least 0.01 μm or more and 5 μm or less 50 alumina particles surface-treated with one or more silanes having a particle size; (C2) D exceeding 5 μm 50 alumina particles surface-treated with one or more silanes having a particle size; (D) at least one silane coupling agent; and (E) at least one platinum-based curing catalyst; A thermally conductive silicone composition comprising: The composition wherein component (C1) is present in an amount of less than 62 wt. % based on the weight of the composition, and component (C2) is present in an amount of less than 80 wt. % based on the weight of the composition.

[0024] [(A) Alkenyl Group-Containing Organopolysiloxane] According to the present invention, the thermally conductive silicone composition comprises (A) at least one alkenyl group-containing organopolysiloxane.

[0025] As used herein, "alkenyl" refers to the radical of a straight-chain or branched hydrocarbon group having 2 to 40 carbon atoms and one or more carbon-carbon double bonds (e.g., 1, 2, 3, or 4 double bonds) ("C 2-40 In some embodiments, an alkenyl group has 2 to 30 carbon atoms ("C 2-30 In some embodiments, an alkenyl group has 2 to 20 carbon atoms ("C 2-20 In some embodiments, an alkenyl group has 2 to 10 carbon atoms ("C 2-10 In some embodiments, an alkenyl group has 2 to 9 carbon atoms ("C 2-9 In some embodiments, an alkenyl group has 2 to 8 carbon atoms ("C 2-8 In some embodiments, an alkenyl group has 2 to 7 carbon atoms ("C 2-7 In some embodiments, an alkenyl group has 2 to 6 carbon atoms ("C 2-6 In some embodiments, an alkenyl group has 2 to 5 carbon atoms ("C 2-5 In some embodiments, an alkenyl group has 2 to 4 carbon atoms ("C 2-4 In some embodiments, an alkenyl group has 2 to 3 carbon atoms ("C 2-3 In some embodiments, the alkenyl group has two carbon atoms ("C2 alkenyl"). The one or more carbon-carbon double bonds may be internal (such as in 2-butenyl) or terminal (such as in 1-butenyl). C 2-4 Examples of alkenyl groups include ethenyl (C2), 1-propenyl (C3), 2-propenyl (C3), 1-butenyl (C4), 2-butenyl (C4), butadienyl (C4), and the like. 2-6 Examples of alkenyl groups include the above-mentioned C 2-4Alkenyl groups include pentenyl (C5), pentadienyl (C5), hexenyl (C6), and the like. Additional examples of alkenyl include heptenyl (C7), octenyl (C8), octatrienyl (C8), and the like. Unless otherwise specified, each instance of an alkenyl group is independently unsubstituted ("unsubstituted alkenyl") or substituted with one or more substituents ("substituted alkenyl"). In certain embodiments, an alkenyl group is an unsubstituted C 2-30 In certain embodiments, the alkenyl group is a substituted C 2-30 It is alkenyl.

[0026] In some embodiments, component (A) has the general formula (1): [ka] (R in the formula 1 , R 2 , R 3 , R 4 and R 5 each independently represents an unsubstituted or substituted monovalent hydrocarbon group, M represents a number greater than 0 and less than 1, and D, T, and Q each independently represent a number from 0 to less than 1, with the proviso that the sum of M, D, T, and Q is 1. It can be expressed as:

[0027] In some embodiments, the unsubstituted or substituted monovalent hydrocarbon group in general formula (1) is preferably a straight-chain alkyl group selected from methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl, n-tetradecyl, n-pentadecyl, n-hexadecyl, n-heptadecyl, n-octadecyl, n-nonadecyl, and n-eicosyl; preferably a branched-chain alkyl group selected from isopropyl, t-butyl, isobutyl, 2-methylundecyl, and 1-hexylheptyl; preferably a cyclopentyl group, cyclic alkyl groups selected from cyclohexyl and cyclododecyl groups; alkenyl groups preferably selected from vinyl, allyl, butenyl, pentenyl, and hexenyl groups; aryl groups preferably selected from phenyl, tolyl, and xylyl groups; aralkyl groups preferably selected from benzyl, phenethyl, and 2-(2,4,6-trimethylphenyl)propyl groups; and halogenated alkyl groups preferably selected from 3,3,3-trifluoropropyl and 3-chloropropyl groups; preferably selected from straight-chain alkyl groups, alkenyl groups, and aryl groups; and more preferably selected from methyl, ethyl, vinyl, and phenyl groups.

[0028] In a preferred embodiment, in the above general formula (1), T and Q are both 0, M and D are not 0, and the sum of M and D is 1.

[0029] In a more preferred embodiment, in the above general formula (1), M is in the range of 0.01 to 0.05, D is in the range of 0.95 to 0.99, T and Q are 0, and the sum of M and D is 1.

[0030] Specific examples of component (A) include those having the following formula: [ka] Examples of the alkenyl group-containing organopolysiloxane include those represented by the following formula:

[0031] The content of alkenyl functional groups in component (A) is preferably in the range of 0.1 to 1.0 mmol / g, more preferably 0.1 to 0.6 mmol / g.

[0032] The viscosity of component (A) at 25°C is preferably in the range of 50 to 100,000 mPa·s, and more preferably 100 to 50,000 mPa·s.

[0033] There are no particular restrictions on the molecular weight of component (A), but it is preferably in the range of 3000 to 20,000 g / mol.

[0034] Component (A) can be used alone or in combination of two or more different compounds.

[0035] Such alkenyl-containing organopolysiloxanes can be produced by conventional methods, typically by equilibration of an organocyclooligosiloxane with a hexaorganodisiloxane in the presence of an alkali or acid catalyst.

[0036] Commercially available examples of component (A) include RH-Vi500E, RH-Vi70E, and RH-Vi100E available from Zhejiang Runhe Organicsilicone New Material Co., Ltd., and Andisil® VS 200 available from AB Specialty Silicones.

[0037] According to the present invention, component (A) is present in an amount of from 1% to 20% by weight, preferably from 2% to 15% by weight, based on the total weight of the composition.

[0038] [(B) Organohydrogenpolysiloxane] According to the present invention, the thermally conductive silicone composition also contains (B) at least one organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms in the molecule, which acts as a crosslinker for component (A).

[0039] In one embodiment, the organohydrogenpolysiloxane has two or more -Si-H groups per molecule, and the -Si-H groups in component (B) and the alkenyl groups in component (A) undergo addition via a hydrosilylation reaction promoted by a platinum-based curing catalyst (E) described below, to form a three-dimensional network structure with a crosslinked structure.

[0040] Component (B) may have at least two, and preferably three or more -Si-H groups per molecule, and these -Si-H groups may be located at terminal, non-terminal positions, or both positions on the molecular chain.

[0041] In a preferred embodiment, component (B) has the general formula (2): [ka] (R in the formula 6 , R 7 , R 8 , R 9 , R 10 and R 11 each independently represents an unsubstituted or substituted monovalent hydrocarbon group or hydrogen, provided that R 6 , R 7 , R 8 , R 9 , R 10 and R 11 At least two of are hydrogen atoms directly bonded to silicon atoms in the molecule, and M', D', T' and Q' each represent a number ranging from 0 to less than 1, with the proviso that the sum of M', D', T' and Q' is 1. It can be expressed as:

[0042] Suitable examples of unsubstituted or substituted monovalent hydrocarbon groups in general formula (2) are preferably straight-chain alkyl groups selected from methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl, n-tetradecyl, n-pentadecyl, n-hexadecyl, n-heptadecyl, n-octadecyl, n-nonadecyl, and n-eicosyl; branched-chain alkyl groups preferably selected from isopropyl, t-butyl, isobutyl, 2-methylundecyl, and 1-hexylheptyl; and preferably cyclopentyl, cyclohexyl, and cyclohexyl. an alkenyl group preferably selected from vinyl, allyl, butenyl, pentenyl, and hexenyl; an aryl group preferably selected from phenyl, tolyl, and xylyl; an aralkyl group preferably selected from benzyl, phenethyl, and 2-(2,4,6-trimethylphenyl)propyl; and a halogenated alkyl group preferably selected from 3,3,3-trifluoropropyl and 3-chloropropyl; preferably selected from straight-chain alkyl, alkenyl, and aryl groups; and more preferably selected from methyl, ethyl, vinyl, and phenyl groups.

[0043] The content of functional groups of -Si-H groups in component (B) is preferably in the range of 0.1 to 10.0 mmol / g, more preferably 0.1 to 5 mmol / g.

[0044] In a preferred embodiment, the number of moles of -Si-H groups contained in component (B) is preferably 0.1 to 5.0 times the number of moles of alkenyl groups derived from component (A).

[0045] The viscosity of component (B) at 25°C is preferably in the range of 1 to 100,000 mPa·s, and more preferably 1 to 5,000 mPa·s.

[0046] There are no particular restrictions on the molecular weight of component (B), but it is preferably in the range of 2000 to 20,000 g / mol.

[0047] Component (B) may be a single compound or a combination of two or more different compounds.

[0048] In a preferred embodiment, in the above general formula (2), T' and Q' are both 0, M' and D' are not 0, and the sum of M' and D' is 1.

[0049] In a more preferred embodiment, in the above general formula (2), M' is in the range of 0.01 to 0.05, D' is in the range of 0.95 to 0.99, T' and Q' are 0, and the sum of M and D is 1.

[0050] Specific examples of component (B) include compounds of the formula: [ka] Examples of organopolysiloxanes include those represented by the following formula:

[0051] Component (B) can be produced by a conventionally known method. Commercially available products can also be used. Examples of commercially available products of component (B) include Crosslinker 210 and Crosslinker 101 available from Evonik.

[0052] According to the present invention, component (B) is present in an amount of 0.5% to 20% by weight, preferably 1% to 10% by weight, based on the total weight of the composition.

[0053] (C) Silane-surface-treated alumina particles According to the present invention, the thermally conductive silicone composition comprises (C1) a D 50 (C2) one or more silane surface-treated alumina particles having a particle size of D greater than 5 μm; 50 and one or more silane surface-treated alumina particles having a particle size.

[0054] In this specification, the "D 50 The term "particle size" refers to the median diameter in a volume-based particle size distribution curve obtained by measurement using a laser diffraction particle size analyzer.

[0055] In a preferred embodiment, component (C1) has a D of at least 0.1 μm to 2 μm, more preferably at least 0.1 μm to 1 μm. 50 It has a particle size.

[0056] In a preferred embodiment, component (C2) has a D of more than 7 μm, more preferably more than 20 μm, even more preferably more than 50 μm. 50 It has a particle size.

[0057] The shapes of components (C1) and (C2) used in the present invention are not particularly limited. They may be spherical, rod-like, needle-like, disc-like, or amorphous, with spherical shapes being preferred. As used herein, the term "spherical" refers to a shape whose entire surface is formed by a convex, smooth surface. The term "rod-like" refers to a shape that is elongated along one axis and has a substantially constant thickness along the long axis. The term "needle-like" is similar to "rod-like" in that the shape is elongated along one axis, but also refers to a shape that includes portions where the thickness narrows toward both ends of the shape, while the thickness within the remaining portion is substantially constant along the long axis, with both ends pointed. The term "disc-like" refers to a flat shape that has a thickness in addition to the long and short axis lengths. The term "amorphous" refers to a shape that cannot be classified into a specific shape.

[0058] According to the present invention, components (C1) and (C2) should be surface-treated with silane. The silane-surface-treated alumina particles used in the present invention can be prepared by a dry method in a solvent-free system or a wet method in a solvent. Most preferably, the surface treatment is performed in a solvent such as water or alcohol to ensure complete surface treatment. When a solvent is used, the organopolysiloxane and solvent are mixed in a container and then sprayed onto untreated alumina powder. The alumina powder is then heated and dried to remove the solvent. Agglomeration of the alumina powder may occur during drying, and preparing a thermally conductive silicone composition from the agglomerated alumina powder can result in reduced flowability. For this reason, it is preferable to use a silane-surface-treated alumina powder prepared by a wet method in a solvent.

[0059] Suitable commercially available examples of component (C1) are NSM-1H20 and NSM-1SH20 manufactured by Bestry Performance Materials Co., Ltd.

[0060] Suitable commercially available examples of component (C2) are BAH7H19, BAH5H1, BAH70H12, BAH20H4 manufactured by Bestry Performance Materials Co., Ltd., and HT-DAM07 manufactured by Bergquist Company Zhuhai Limited.

[0061] According to the present invention, component (C1) is present in an amount of less than 62 wt. % based on the total weight of the composition. If component (C1) exceeds the upper limit, the viscosity of the thermally conductive silicone composition becomes too high, affecting the flowability of the composition. Preferably, component (C1) is present in an amount of 5 wt. % to 55 wt. %, more preferably 10 wt. % to 50 wt. %, and even more preferably 10 wt. % to 45 wt. % based on the total weight of the composition.

[0062] According to the present invention, component (C2) is present in an amount of less than 80 wt. % based on the total weight of the composition. If component (C2) exceeds this limit, the lap shear strength of the cured product obtained from the composition will be significantly reduced. Preferably, component (C2) is present in an amount of 10 wt. % to 72 wt. % based on the total weight of the composition, more preferably 10 wt. % to 60 wt. %, and even more preferably 10 wt. % to 45 wt. %.

[0063] In a preferred embodiment, the mixing ratio of components (C1) and (C2) by mass is 0.2 to 5, preferably 0.2 to 1.2.

[0064] [(D) Silane Coupling Agent] According to the present invention, the thermally conductive silicone composition contains (D) at least one silane coupling agent.

[0065] Suitable silane coupling agents that can be used in the present invention include, but are not limited to, 3-methacryloxypropyltrimethoxysilane, methyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, tetraethoxysilane, vinyltriethoxysilane, methyltris(methylethylketoxime)silane, vinyltriacetoxysilane, ethyl orthosilicate, and the like.

[0066] Commercially available examples of silane coupling agents include 3-methacryloxypropyltrimethoxysilane, methyltrimethoxysilane, and 3-glycidoxypropyltrimethoxysilane manufactured by Sinopharm.

[0067] According to the present invention, component (D) is present in an amount of 0.1 to 5% by weight, preferably 0.1 to 3% by weight, based on the total weight of the composition. This range of amount makes it easier to maintain the adhesive strength of the cured product obtained from the composition.

[0068] [(E) Platinum-based curing catalyst] According to the present invention, the thermally conductive silicone composition comprises (E) at least one platinum-based curing catalyst for accelerating the curing process.

[0069] Component (E) is a catalyst for promoting the addition reaction between the alkenyl group derived from component (A) and the -Si-H group derived from component (B), and any known catalyst for hydrosilylation reactions can be used. Specific examples include platinum group metals such as platinum (including platinum black), rhodium, and palladium; platinum chloride, chloroplatinic acid, and chloroplatinic acid salts such as HPtCl.sub.4·nH.sub.2O, HPtCl.sub.6·nH.sub.2O, NaHPtCl.sub.6·nH.sub.2O, KaHPtCl.sub.6·nH.sub.2O, NaPtCl.sub.6·H.sub.2O, KPtCl.sub.4·nH.sub.2O, PtCl.sub.4·nH.sub.2O, PtCl.sub.2, and NaHPtCl.sub.4·nH.sub.2O (wherein n is an integer of 0 to 6, preferably 100). Examples of suitable catalysts include complexes of chloroplatinic acid with olefins, platinum black, and catalysts obtained by supporting a platinum group metal such as palladium on a support such as alumina, silica, or carbon, rhodium-olefin complexes, and chlorotris(triphenylphosphine)rhodium (Wilkinson's catalyst), and complexes of platinum chloride, chloroplatinic acid, or chloroplatinate with vinyl group-containing siloxanes, and vinyl group-containing cyclic siloxanes are particularly useful.

[0070] A suitable commercially available example of a platinum-based cure catalyst is CAT-50 available from Avantor.

[0071] According to the present invention, component (E) is present in an amount of from 1 ppm to 1000 ppm by weight, preferably from 1 ppm to 500 ppm by weight, based on the total weight of the composition.

[0072] [(F) Other conductive fillers] In some embodiments, the thermally conductive silicone composition may further comprise at least one conductive filler different from component (C), including, but not limited to, fumed silica, precipitated silica, fumed titanium oxide, conductive fillers that have not been surface-treated, and combinations thereof.

[0073] In a preferred embodiment, component (F) has a D of at least 0.1 μm to 100 μm, more preferably 1 μm to 50 μm, and even more preferably 1 μm to 20 μm. 50 It has a particle size.

[0074] The shape of component (F) used in the present invention is not particularly limited and may be spherical, rod-like, needle-like, disc-like, or amorphous, with spherical shape being preferred.

[0075] Suitable commercially available examples of component (F) include NSM-1, BA 2 manufactured by Bestry Performance Materials Co., Ltd., DAM 07 manufactured by Denka Co., Ltd., SFADW-20 manufactured by China Mineral Processing Limited, SJR 20 manufactured by AnHui Estone Materials Technology Co., Ltd., and HDK® 20 manufactured by Wacker Chemicals (Zhangjiagang) Co., Ltd.

[0076] In a preferred embodiment, the thermally conductive silicone composition may be free of component (F), which, when present, is present in an amount of less than 40% by weight, preferably 30% by weight or less, based on the total weight of the composition.

[0077] [(G) Additives] In some embodiments, the thermally conductive silicone composition may further contain an additive, particularly a curing reaction inhibitor, selected from a curing reaction inhibitor, a pigment, a dye, a fluorescent dye, a heat resistance additive, a flame retardant, a plasticizer, an adhesion promoter, and combinations thereof, provided that the inclusion of such an additive does not impair the objectives of the present invention.

[0078] Suitable examples of cure reaction inhibitors that can be used in the present invention to control the cure rate of the composition and thereby improve flow and processability properties include, but are not limited to, acetylene compounds such as 2-methyl-3-butyn-2-ol, 2-phenyl-3-butyn-2-ol, or 1-ethynyl-1-cyclohexanol; enyne compounds such as 3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexen-1-yne; hydrazine compounds; phosphine compounds; or mercaptan compounds.

[0079] A suitable commercially available example of a cure inhibitor is 3,5-dimethyl-1-hexyn-3-ol, available from Sigma-Aldrich.

[0080] When the composition of the present invention contains a curing reaction inhibitor, the amount of the inhibitor is not particularly limited, but an amount in the range of 0.0001 to 1.0% by weight based on the total weight of the composition is preferred.

[0081] In a particularly preferred embodiment, the thermally conductive silicone composition comprises, based on the total weight of the composition: (A) 1% by weight to 20% by weight, preferably 2% by weight to 15% by weight, of at least one alkenyl group-containing organopolysiloxane; (B) 0.5% to 20% by weight, preferably 1% to 10% by weight, of at least one organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon in the molecule; (C1) More than 0 and less than 62% by weight, preferably 5% to 55% by weight, more preferably 10% to 50% by weight, and even more preferably 10% to 45% by weight of D 50 an alumina powder surface-treated with at least one silane having a particle size; (C2) More than 0 and less than 80% by weight, preferably 10% to 72% by weight, more preferably 10% to 60% by weight, and even more preferably 10% to 45% by weight of D greater than 5 μm 50an alumina powder surface-treated with at least one silane having a particle size; (D) 0.1% to 5% by weight, preferably 0.1% to 3% by weight, of at least one silane coupling agent; and (E) 1 ppm by weight to 1000 ppm by weight, preferably 1 ppm by weight to 500 ppm by weight, of at least one platinum-based curing catalyst; (F) 0 to less than 40% by weight, preferably 30% by weight or less, of at least one thermally conductive filler other than component (C); (G) 0 to 1.0 wt% of additives Includes:

[0082] A further aspect of the present invention relates to a method for preparing a thermally conductive silicone composition by mixing the above ingredients simultaneously at room temperature, for example for at least 1 hour, preferably at least 2 hours.

[0083] The thermally conductive silicone composition of the present invention has good fluidity even when the thermally conductive filler loading is greater than 80%, and has, for example, a viscosity of less than 100 Pa·s, preferably less than 80 Pa·s, more preferably less than 50 Pa·s, and even more preferably less than 30 Pa·s.

[0084] In a preferred embodiment, the thermally conductive silicone composition can be cured at room temperature for 2 to 7 days. Curing can be accelerated by applying heat, for example, by heating at 60°C to 200°C for 30 minutes to 2 hours.

[0085] In the present invention, the thermally conductive silicone composition can be applied to the desired substrate by any convenient technique. It can be applied cold or warm, as needed. It can be applied by extrusion or pasting onto the substrate, or by a mechanical application method such as a caulking gun. Generally, the thermally conductive silicone composition of the present invention is applied to one surface of a pair of substrates, and then the substrates are brought into contact with each other to bond them together. After application, the adhesive composition of the present invention is cured at room temperature, and optionally subsequently cured at an elevated temperature.

[0086] In another aspect of the present invention, there is provided an article comprising a first substrate, a cured adhesive, and a second substrate adhered to the first substrate via a curable adhesive comprising a cured product obtained from the curable adhesive composition of any one of the claims.

[0087] The first substrate and / or the second substrate may be a single material and a single layer, or may include multiple layers of the same or different materials. The layers may be continuous or discontinuous.

[0088] The substrate of the articles described herein can have a variety of properties, such as rigid (e.g., a rigid substrate (i.e., a person cannot bend the substrate using both hands, or the substrate breaks when attempting to bend it using both hands), flexible (e.g., a flexible substrate (i.e., the substrate can be bent with the strength of two hands or less), porous, conductive, non-conductive, and combinations thereof.

[0089] The substrate of the article may be in a variety of forms, such as, for example, a fiber, a thread, a yarn, a woven fabric, a nonwoven fabric, a film (e.g., a polymeric film, a metalized polymeric film, a continuous film, a discontinuous film, and combinations thereof), a foil (e.g., a metal foil), a sheet (e.g., a metal sheet, a polymeric sheet, a continuous sheet, a discontinuous sheet, and combinations thereof), and combinations thereof.

[0090] Useful substrates for use in the present invention include, for example, polymers (e.g., polycarbonate, ABS resin (acrylonitrile-butadiene-styrene resin), liquid crystal polymers, polyolefins (e.g., polypropylene, polyethylene, low-density polyethylene, linear low-density polyethylene, high-density polyethylene, polypropylene, and oriented polypropylene, copolymers of polyolefins with other comonomers), polyether terephthalate, ethylene-vinyl acetate, ethylene-methacrylic acid ionomer, ethylene-vinyl alcohol, polyesters such as polyethylene terephthalate, polycarbonate, polyamides such as nylon-6 and nylon-6,6, polyvinyl chloride, polyvinylidene chloride, cellulosics, and the like. Examples of suitable composite materials include cellulose derivatives, polystyrene, and epoxy), polymer composites (e.g., polymers and metals, cellulose, glass, polymers, and combinations thereof), metals (aluminum, copper, zinc, lead, gold, silver, platinum, and magnesium, and metal alloys such as steel (e.g., stainless steel), tin, brass, magnesium and aluminum alloys), carbon fiber composites, other fiber-based composites, graphene, fillers, glass (e.g., alkali aluminosilicate reinforced glass and borosilicate glass), quartz, boron nitride, gallium nitride, sapphire, silicon, carbide, ceramics, and combinations thereof, preferably liquid crystal polymers, glass, and combinations thereof.

[0091] The cured thermally conductive silicone composition has a lap shear strength in 100% cohesive failure mode on an aluminum substrate in accordance with ASTM D1002-05 of greater than 1.6 MPa, preferably greater than 1.8 MPa, and even more preferably greater than 2.0 MPa, and a thermal conductivity measured in accordance with ASTM 1461 of greater than 1.6 W / (m·K), preferably greater than 1.8 W / (m·K), and even more preferably greater than 2.0 W / (m·K).

[0092] As referred to herein, a "cohesive failure mode" refers to a failure mode in which the adhesive tears, leaving a portion of the adhesive attached to each bonded surface. A failure mode in which the adhesive peels cleanly from the substrate is referred to as an "adhesive failure mode." Adhesives with a cohesive failure mode are considered to be more robust than adhesives with an adhesive failure mode.

[0093] A further related aspect of the present invention relates to the use of the thermally conductive silicone composition and the cured product of the thermally conductive silicone composition of the present invention in the manufacture of electronic devices.

[0094] Exemplary electronic devices include computers and computer equipment such as printers, fax machines, scanners, keyboards, etc.; medical sensors; automotive sensors, etc.; wearable electronic devices (e.g., watches and eyeglasses), handheld electronic devices (e.g., phones (e.g., cell phones and cellular smartphones), cameras, tablets, e-readers, monitors (e.g., monitors used in hospitals and by medical professionals, athletes, and individuals), watches, calculators, mice, touchpads, and joysticks), computers (e.g., desktop and laptop computers), computer monitors, televisions, media players, home appliances (e.g., refrigerators, washers, dryers, ovens, microwaves), light bulbs (e.g., incandescent, light emitting diode, and fluorescent), and articles containing visibly transparent or transparent components, glass housing structures, protective transparent covers for displays or other optical components.

[0095] Preferred according to the present invention is the use of the embodiments previously identified above as preferred or more preferred for the thermally conductive silicone composition of the present invention, where preferably two or more of the aspects or corresponding features described for the thermally conductive silicone composition are combined with one another. [Example]

[0096] The following examples are intended to assist those skilled in the art in better understanding and practicing the present invention. The scope of the present invention is not limited by the examples, but is defined by the appended claims. Unless otherwise specified, all parts and percentages are by weight.

[0097] [Raw materials] Component (A) Ingredient a-1: RH-Vi500E [ka] The vinyl-terminated polydimethylsiloxane is manufactured by Zhejiang Runhe Chemical New Material Co., Ltd. and has the structure:

[0098] Ingredient a-2: RH-Vi100E [ka] The vinyl-terminated polydimethylsiloxane is manufactured by Zhejiang Runhe Chemical New Material Co., Ltd. and has the structure:

[0099] Ingredient a-3: RH-Vi70E [ka] The vinyl-terminated polydimethylsiloxane is manufactured by Zhejiang Runhe Chemical New Material Co., Ltd. and has the structure:

[0100] Component a-4: Andisil (registered trademark) VS 200 [ka] is a vinyl-terminated polydimethylsiloxane manufactured by AB Specialty Silicone Company having the structure:

[0101] Ingredient (B) Component b-1: Crosslinker 101 [ka] is a silicon hydride terminated polydimethylsiloxane manufactured by Evonik Chemical Specialties (Shanghai) Co, Ltd. having the structure:

[0102] Component b-2: Crosslinker 201 [ka] is a silicon hydride terminated polydimethylsiloxane manufactured by Evonik Chemical Specialties (Shanghai) Co, Ltd. having the structure:

[0103] Component (C1) Component c1-1: NSM-1H20 is a silane-surface-treated alumina (D 50 =0.89 μm).

[0104] Component c1-2: NSM-1SH20 is a silane-surface-treated alumina (D 50 =0.73 μm). Component (C2)

[0105] Component c2-1: BAH-7H19 is a silane-surface-treated alumina (D 50 =7.57 μm).

[0106] Component c2-2: HT-DAM07 is a silane-surface-treated alumina (D 50 =7μm).

[0107] Component c2-3: BAH-5H1 is a silane-surface-treated alumina (D 50 =5.45 μm).

[0108] Component c2-4: BAH-70H12 is a silane-surface-treated alumina (D 50 =71.80μm).

[0109] Component c2-5: BAH-20H4 is a silane-surface-treated alumina (D 50 =21.56 μm).

[0110] Ingredients (D) Component d-1: 3-methacryloxypropyltrimethoxysilane was manufactured by Sinopharm Chemical Reagent Co., Ltd.

[0111] Component d-2: Methyltrimethoxysilane was manufactured by Sinopharm Chemical Reagent Co., Ltd.

[0112] Component d-3: 3-glycidoxypropyltrimethoxysilane was manufactured by Sinopharm Chemical Reagent Co., Ltd.

[0113] Ingredients (E) Component e-1: CAT 50 is a platinum-divinyltetramethylsiloxane complex manufactured by Avantor containing 2.5% by weight platinum.

[0114] Ingredient (F) Component f-1: NSM-1 is a non-surface-treated alumina powder (D 50 =1.24 μm).

[0115] Component f-2: DAM07 is a non-surface-treated alumina powder (D 50 =8.2 μm).

[0116] Component f-3: SFADW-20, alumina powder without surface treatment manufactured by China Mineral Processing Limited (D 50 =20μm).

[0117] Component f-4: BA 2 is alumina powder (D) manufactured by Bestry Performance Materials Co., Ltd. that has not been subjected to surface treatment. 50 =1.64 μm).

[0118] Component f-5: SJR 20 is a crystalline silica powder (D 50 = 20 μm).

[0119] Component f-6: HDK 20 is a fumed silica manufactured by Wacker Chemicals (Zhangjiagang) Co, Ltd.

[0120] Ingredients (G) Component g-1: 3,5-dimethyl-1-hexyn-3-ol was manufactured by Sigma-Aldrich Company.

[0121] [Test method:] (viscosity:) The thermally conductive silicone composition of the present invention and the comparative example samples were placed in a constant temperature bath at 25°C for 24 hours, after which the viscosity was measured at 25°C and 5 rpm using a PP25 cone and plate viscometer (product name: MCR301, manufactured by Anton-Paar Co., Ltd.).

[0122] The results are shown in Tables 1 and 2. The lower the viscosity value, the greater the fluidity of the thermally conductive silicone composition, indicating superior handling characteristics. A viscosity of less than 100 Pa·s is acceptable.

[0123] (Lap shear strength:) The lap shear strength of the cured samples of the invention and comparative examples was measured according to ASTM D1002-05 with an Instron tensile tester (Model 5996) at a crosshead speed of 10 mm / min, and test results were recorded in MPa.

[0124] This thermally conductive silicone composition was sandwiched between a pair of aluminum plates (Al6063, manufactured by Donguang Baiside Company Limited) and cured by heating at 160°C for 30 minutes. The adhesive surface area was 25.4 mm × 12.7 mm, and the adhesive layer thickness was 0.127 mm.

[0125] Hardened specimens with a lap shear strength of 1.6 MPa or more in 100% cohesive failure mode are acceptable.

[0126] (thermal conductivity) The thermally conductive silicone compositions of the present invention and the comparative examples were cured for 0.5 hours at 160° C. The cured samples were cut into circular pieces 2 mm thick and 12.7 mm in diameter.

[0127] The thermal conductivity of cured samples of the present invention was tested with a Laser Flash LFA447 (manufactured by the NETZSCH Group) according to ASTM 1461. A thermal conductivity of 1.6 W / (m·K) or greater is acceptable.

[0128] [Examples 1 to 13 (Ex. 1 to Ex. 13) and Comparative Examples 1 to 7 (CEx. 1 to CEx. 7)] The thermally conductive silicone adhesive compositions of the present invention and comparative examples were prepared by mixing the components in the weight percentages shown in Tables 1 and 2 in a 2-liter planetary mixer (manufactured by PC Laborsystem Co., Ltd.) at room temperature for 2 hours, then cooled to room temperature. The properties were tested using the methods described above. The evaluation results are shown in Tables 1 and 2.

[0129] [Table 1-1]

[0130] [Table 1-2]

[0131] [Table 2]

[0132] As can be seen from Table 1, the thermally conductive silicone adhesive of the present invention exhibited good flowability, as well as high thermal conductivity and good lap shear strength upon curing.

[0133] However, as can be seen from Table 2, when the components of the present invention were not used, as in Comparative Examples 1 to 7 (CEx1 to CEx7), one or more unsatisfactory properties were exhibited compared to the thermally conductive silicone composition of the present invention.

[0134] While several preferred embodiments have been described, many modifications and variations thereto are possible in light of the above teachings, and it is therefore to be understood that the invention may be practiced otherwise than as specifically described without departing from the scope of the appended claims. Preferred aspects of the present invention include the following. [1] (A) at least one alkenyl group-containing organopolysiloxane; (B) at least one organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms in the molecule; (C1) D of at least 0.01 μm or more and 5 μm or less 50 alumina particles surface-treated with one or more silanes having a particle size; (C2) D exceeding 5 μm50 alumina particles surface-treated with one or more silanes having a particle size; (D) at least one silane coupling agent; and (E) at least one platinum-based curing catalyst; A thermally conductive silicone composition comprising: A composition wherein component (C1) is present in an amount of less than 62 wt. % based on the weight of the composition, and component (C2) is present in an amount of less than 80 wt. % based on the weight of the composition. [2] The component (A) is a compound represented by the general formula (1): TIFF0007819213000015.tif8134 (R in the formula 1 、R 2 、R 3 、R 4 and R 5 each independently represents an unsubstituted or substituted monovalent hydrocarbon group, M represents a number greater than 0 and less than 1, and D, T, and Q each independently represent a number from 0 to less than 1, with the proviso that the sum of M, D, T, and Q is 1. The thermally conductive silicone composition according to [1], wherein [3] The unsubstituted or substituted monovalent hydrocarbon group in the general formula (1) is preferably a linear alkyl group selected from methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl, n-tetradecyl, n-pentadecyl, n-hexadecyl, n-heptadecyl, n-octadecyl, n-nonadecyl, and n-eicosyl; preferably a branched alkyl group selected from isopropyl, t-butyl, isobutyl, 2-methylundecyl, and 1-hexylheptyl; and preferably a cyclopentyl, cyclohexyl, and cyclododecyl group. an alkenyl group preferably selected from vinyl, allyl, butenyl, pentenyl, and hexenyl; an aryl group preferably selected from phenyl, tolyl, and xylyl; an aralkyl group preferably selected from benzyl, phenethyl, and 2-(2,4,6-trimethylphenyl)propyl; and a halogenated alkyl group preferably selected from 3,3,3-trifluoropropyl and 3-chloropropyl; preferably selected from linear alkyl, alkenyl, and aryl groups; and more preferably selected from methyl, ethyl, vinyl, and phenyl groups. [4] The component (B) is represented by the general formula (2): TIFF0007819213000016.tif8139 (R in the formula 6 、R 7 、R 8 、R 9 、R 10 and R 11 each independently represents an unsubstituted or substituted monovalent hydrocarbon group or hydrogen, provided that R 6 、R 7 、R 8 、R 9 、R 10 and R 11 At least two of are hydrogen atoms directly bonded to silicon atoms in the molecule, and M', D', T' and Q' each represent a number ranging from 0 to less than 1, with the proviso that the sum of M', D', T' and Q' is 1. The thermally conductive silicone composition according to any one of [1] to [3], represented by the following formula: [5] The component (C1) has a D of at least 0.1 μm or more and 2 μm or less, more preferably at least 0.1 μm or more and 1 μm or less. 50 The thermally conductive silicone composition according to any one of [1] to [4], having a particle size. [6] The component (C2) has a D of more than 7 μm, more preferably more than 20 μm, and even more preferably more than 50 μm. 50 The thermally conductive silicone composition according to any one of [1] to [5], having a particle size. [7] The thermally conductive silicone composition according to any one of [1] to [6], wherein component (A) is present in an amount of 1% by weight to 20% by weight, preferably 2% by weight to 15% by weight, based on the total weight of the composition. [8] The thermally conductive silicone composition according to any one of [1] to [7], wherein component (B) is present in an amount of 0.5% by weight to 20% by weight, preferably 1% by weight to 10% by weight, based on the total weight of the composition. [9] The thermally conductive silicone composition according to any one of [1] to [8], wherein component (C1) is present in an amount of 5% by weight to 55% by weight, more preferably 10% by weight to 50% by weight, and even more preferably 10% by weight to 45% by weight, based on the total weight of the composition.

[10] The thermally conductive silicone composition according to any one of [1] to [9], wherein component (C2) is present in an amount of 10% by weight to 72% by weight, more preferably 10% by weight to 60% by weight, and even more preferably 10% by weight to 45% by weight, based on the total weight of the composition.

[11] The thermally conductive silicone composition according to any one of [1] to

[10] , wherein component (D) is present in an amount of 0.1 to 5% by weight, preferably 0.1 to 3% by weight, based on the total weight of the composition.

[12] The thermally conductive silicone composition according to any one of [1] to

[11] , wherein component (E) is present in an amount of 1 ppm by weight to 1000 ppm by weight, preferably 1 ppm by weight to 500 ppm by weight, based on the total weight of the composition.

[13] The thermally conductive silicone composition according to any one of [1] to

[12] , wherein the composition further comprises component (F) other than component (C1) and component (C2), that is at least one thermally conductive filler, in an amount of less than 40 wt %, preferably 30 wt % or less, based on the total weight of the composition.

[14] The thermally conductive silicone composition according to any one of [1] to

[13] , wherein the composition further comprises component (G) at least one additive selected from a curing reaction inhibitor, a pigment, a dye, a fluorescent dye, a heat resistance additive, a flame retardant, a plasticizer, an adhesion promoter, and combinations thereof.

[15] A method for preparing the thermally conductive silicone composition according to any one of [1] to

[14] , comprising the step of simultaneously mixing the components at room temperature.

[16] A cured product of the thermally conductive silicone composition according to any one of [1] to

[14] .

[17] Use of the thermally conductive silicone composition according to any one of [1] to

[14] or the cured product according to

[16] in the manufacture of an electronic device.

Claims

1. (A) at least one alkenyl group-containing organopolysiloxane; (B) at least one organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms in the molecule; (C1) D of at least 0.01 μm or more and 1 μm or less ５０ alumina particles surface-treated with one or more silanes having a particle size; (C2) D greater than 5 μm ５０ alumina particles surface-treated with one or more silanes having a particle size; (D) at least one silane coupling agent; and (E) at least one platinum-based curing catalyst; A thermally conductive silicone composition comprising: said component (C1) being present in an amount of less than 62 wt. % based on the weight of said composition, and said component (C2) being present in an amount of less than 80 wt. % based on the weight of said composition; the mixing ratio of the component (C1) to the component (C2) in parts by mass is 0.2 to 5; The thermally conductive silicone composition has a viscosity of less than 100 Pa·s at 25°C.

2. The component (A) is represented by the general formula (1): (In the formula R １ , R ２ , R ３ , R ４ and R ５ each independently represents an unsubstituted or substituted monovalent hydrocarbon group, M represents a number greater than 0 and less than 1, and D, T, and Q each independently represent a number from 0 to less than 1, with the proviso that the sum of M, D, T, and Q is 1. The thermally conductive silicone composition according to claim 1 , wherein the formula is

3. 3. The thermally conductive silicone composition according to claim 1, wherein the unsubstituted or substituted monovalent hydrocarbon group in general formula (1) is selected from a straight-chain alkyl group; a branched-chain alkyl group; a cyclic alkyl group; an alkenyl group; an aryl group; an aralkyl group; and a halogenated alkyl group.

4. The component (B) is represented by the general formula (2): (In the formula R ６ , R ７ , R ８ , R ９ , R １０ and R １１ each independently represents an unsubstituted or substituted monovalent hydrocarbon group or hydrogen, provided that R ６ , R ７ , R ８ , R ９ , R １０ and R １１ are hydrogen atoms directly bonded to silicon atoms in the molecule, and M', D', T' and Q' each represent a number ranging from 0 to less than 1, with the proviso that the sum of M', D', T' and Q' is 1. The thermally conductive silicone composition according to claim 1 or 2, wherein

5. The component (C1) has a D of at least 0.1 μm or more and 1 μm or less. ５０ The thermally conductive silicone composition according to claim 1 or 2, having a particle size.

6. The component (C2) has a D of more than 7 μm ５０ The thermally conductive silicone composition according to claim 1 or 2, having a particle size.

7. 3. The thermally conductive silicone composition according to claim 1, wherein component (A) is present in an amount of 1% to 20% by weight, based on the total weight of the composition.

8. 3. The thermally conductive silicone composition according to claim 1, wherein component (B) is present in an amount of 0.5% to 20% by weight, based on the total weight of the composition.

9. 3. The thermally conductive silicone composition according to claim 1, wherein component (C1) is present in an amount of 5% to 55% by weight, based on the total weight of the composition.

10. 3. The thermally conductive silicone composition according to claim 1, wherein component (C2) is present in an amount of 10% to 72% by weight, based on the total weight of the composition.

11. 3. The thermally conductive silicone composition according to claim 1, wherein component (D) is present in an amount of 0.1% to 5% by weight, based on the total weight of the composition.

12. 3. The thermally conductive silicone composition according to claim 1, wherein component (E) is present in an amount of 1 ppm to 1000 ppm by weight, based on the total weight of the composition.

13. 3. The thermally conductive silicone composition according to claim 1 or 2, wherein the composition further comprises component (F) at least one thermally conductive filler other than component (C1) and component (C2), in an amount of less than 40 wt%, based on the total weight of the composition.

14. 3. The thermally conductive silicone composition according to claim 1 or 2, wherein the composition further comprises component (G) at least one additive selected from the group consisting of a curing reaction inhibitor, a pigment, a dye, a fluorescent dye, a heat resistance additive, a flame retardant, a plasticizer, an adhesion promoter that is not a silane coupling agent, and combinations thereof.

15. 15. A method for preparing the thermally conductive silicone composition of claim 1, comprising the step of simultaneously mixing the ingredients at room temperature.

16. A cured product of the thermally conductive silicone composition according to any one of claims 1 to 14.

17. Use of the thermally conductive silicone composition according to any one of claims 1 to 14 or the cured product according to claim 16 in the manufacture of an electronic device.

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