Negative resist composition for gradation exposure
JP7819801B2Active Publication Date: 2026-02-25DAI NIPPON PRINTING CO LTD
Patent Information
- Application Number
- JP2025062228
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-04-04
- Publication Date
- 2026-02-25
- Estimated Expiration
- 2041-03-16
Smart Images
Figure 0007819801000013 
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Abstract
To provide a negative resist composition for gradation exposure which allows alkaline development in pattern formation by irradiation with an electron beam, an ion beam, or EUV, is suitable for gradation exposure because the height of the convex portions can be easily controlled according to the amount of exposure, and is capable of forming a three-dimensional pattern with excellent resolution.SOLUTION: A chemical amplification type negative resist composition for gradation exposure comprises a phenolic compound (A) having a molecular weight of 400 to 2500, which has two or more phenolic hydroxyl groups per molecule and has two or more substituents of one or more kinds per molecule selected from the group consisting of hydroxymethyl groups and alkoxymethyl groups at the ortho-positions of the phenolic hydroxyl groups, and an organic basic compound (B), wherein the content of the phenolic compound (A) in the total solid content of the negative resist composition is 70 wt.% or more. The composition is substantially free of an acid generator.SELECTED DRAWING: None
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Citation Information
Patent Citations
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