Image capturing module and portable electronic device

Abstract

To provide an image capturing module and a portable electronic device for reducing overall thickness.SOLUTION: An image capturing module includes a circuit substrate, an image sensing chip, an insulating connection structure and a lens assembly. The image sensing chip is disposed in the through opening of the circuit substrate and electrically connected to the circuit substrate through a plurality of metal wires. The insulating connection structure is disposed in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate. The lens assembly includes a lens carrier disposed on the circuit substrate and a lens module carried by the lens carrier. The image sensing chip can still be firmly fixed in the through opening of the circuit substrate through the insulating connection structure without contacting the circuit substrate, thereby reducing the overall thickness of the image capturing module.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an image capturing module, and in particular to an image capturing module for reducing the overall thickness and a method for manufacturing the image capturing module. Prepare Related to portable electronic devices. [Background technology]

[0002] In existing technologies, the image sensing chip of an image imaging module may be mounted on the top edge of a circuit board without an opening by wire bonding, or on the bottom edge of a circuit board with an opening by flip-chip bonding. However, there is still room for improvement in existing image imaging modules. Summary of the Invention [Problem to be solved by the invention]

[0003] The present invention aims to improve or solve the shortcomings of the existing technology, and provides an image pickup module that reduces the overall thickness and a method for manufacturing the image pickup module. Prepare A portable electronic device is provided. [Means for solving the problem]

[0004] To improve or solve the above-mentioned problems, one technical solution adopted by the present invention is to provide an image capture module with a reduced overall thickness. The image capture module includes a circuit board, an image sensing chip, an insulating connecting structure, and a lens assembly. The circuit board has an upper surface, a lower surface, and a through-hole connecting the upper and lower surfaces. The image sensing chip is disposed in the through-hole of the circuit board and electrically connected to the circuit board via multiple metal wires. The insulating connecting structure is disposed in the through-hole of the circuit board and connects the image sensing chip and the circuit board. The lens assembly includes a lens carrier mounted on the circuit board and a lens module carried by the lens carrier. Here, an image sensing area corresponding to the lens module is formed on the upper surface of the image sensing chip. The lower surface of the image sensing chip is exposed to the outside and is not covered by the insulating connecting structure. The image capture module further includes a filter element, which is mounted above the image sensing chip by multiple supports or surrounding supports and surrounded by multiple metal wires.

[0005] To improve or solve the above-mentioned problems, another technical solution adopted by the present invention is to provide an image capture module for reducing the overall thickness. The image capture module includes a circuit board, an image sensing chip, an insulating connecting structure, and a lens assembly. The circuit board has an upper surface, a lower surface, and a through-hole connecting the upper and lower surfaces. The image sensing chip is disposed in the through-hole of the circuit board and electrically connected to the circuit board via a plurality of metal wires. The insulating connecting structure is disposed in the through-hole of the circuit board and connects between the image sensing chip and the circuit board. The lens assembly includes a lens carrier mounted on the circuit board and a lens module carried by the lens carrier. Here, an image sensing area corresponding to the lens module is formed on the upper surface of the image sensing chip, and the lower surface of the image sensing chip is exposed to the outside and is not covered by the insulating connecting structure.

[0006] In order to improve or solve the above problems, another technical means adopted by the present invention is to provide a portable electronic device, which includes an image capturing module: PrepareThe image capturing module includes a circuit board, an image sensing chip, an insulating connecting structure, and a lens assembly. The circuit board has an upper surface, a lower surface, and a through-hole connecting the upper and lower surfaces. The image sensing chip is disposed in the through-hole of the circuit board and electrically connected to the circuit board via a plurality of metal wires. The insulating connecting structure is disposed in the through-hole of the circuit board and connected between the image sensing chip and the circuit board. The lens assembly includes a lens carrier mounted on the circuit board and a lens module carried by the lens carrier. An image sensing area corresponding to the lens module is formed on the upper surface of the image sensing chip, and the lower surface of the image sensing chip is exposed to the outside and is not covered by the insulating connecting structure. [Effects of the Invention]

[0007] One beneficial effect of the present invention relates to an image pickup module provided to reduce the overall thickness. This technical solution includes: "the circuit board has an upper surface, a lower surface, and a through-hole connecting the upper surface and the lower surface," "the image sensing chip is disposed in the through-hole of the circuit board and electrically connected to the circuit board via a plurality of metal wires," and "the insulating connection structure is disposed in the through-hole of the circuit board and connected between the image sensing chip and the circuit board." This allows the image sensing chip to be stably fixed in the through-hole of the circuit board by connection of the insulating connection structure without contacting the circuit board, thereby reducing the overall thickness of the image pickup module.

[0008] In order to better understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the drawings, which are for reference and explanation purposes only and are not intended to limit the present invention. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a flowchart of a manufacturing method for an image capturing module for reducing the overall thickness provided by the present invention. [Figure 2]FIG. 2 is a schematic diagram of step S100 in the manufacturing method of an image capturing module for reducing the overall thickness provided by the first embodiment of the present invention. [Figure 3] FIG. 2 is a schematic diagram of steps S102 and S104 in the manufacturing method of the image capturing module for reducing the overall thickness provided by the first embodiment of the present invention. [Figure 4] FIG. 10 is a schematic diagram of step S106 in the manufacturing method of the image capturing module for reducing the overall thickness provided by the first embodiment of the present invention. [Figure 5] FIG. 2 is a schematic diagram of step S108 in the manufacturing method of the image capturing module for reducing the overall thickness provided by the first embodiment of the present invention. [Figure 6] FIG. 1 is a schematic diagram of an image capturing module for reducing the overall thickness provided by a first embodiment of the present invention; [Figure 7] FIG. 1 is a schematic diagram of one possible embodiment of a method for manufacturing an image capturing module to reduce the overall thickness provided by the first embodiment of the present invention (a step of removing the temporary carrier substrate from the circuit board after electrically connecting the image sensing chip to the circuit board). [Figure 8] FIG. 10 is a schematic diagram of another possible embodiment of the manufacturing method for the image capturing module provided by the first embodiment of the present invention to reduce the overall thickness (a step of removing the temporary carrier substrate from the circuit board after placing the lens assembly on the circuit board). [Figure 9] FIG. 10 is a schematic diagram of a possible embodiment of a method for manufacturing an image capturing module to reduce the overall thickness provided by the second embodiment of the present invention. [Figure 10] FIG. 10 is a schematic diagram of an image capturing module for reducing the overall thickness provided by a second embodiment of the present invention; [Figure 11] FIG. 10 is a schematic diagram of an image capturing module for reducing the overall thickness provided by a third embodiment of the present invention. [Figure 12]FIG. 10 is a schematic diagram of steps S200 and S202 in a manufacturing method of an image capturing module for reducing the overall thickness provided by a fourth embodiment of the present invention. [Figure 13] FIG. 10 is a schematic diagram of step S204 in the manufacturing method of an image capturing module for reducing the overall thickness provided by the fourth embodiment of the present invention. [Figure 14] FIG. 10 is a schematic diagram of step S206 in the manufacturing method of an image capturing module for reducing the overall thickness provided by the fourth embodiment of the present invention. [Figure 15] FIG. 10 is a functional block diagram of a portable electronic device provided by a fifth embodiment of the present invention, which includes an image capturing module. DETAILED DESCRIPTION OF THE INVENTION

[0010] The following specific examples will explain the embodiments of the "image capturing module and portable electronic device" disclosed in the present invention. Those skilled in the art can understand the merits and advantages of the present invention from the disclosure of this specification. The present invention can be implemented or applied in other different embodiments. Each detail in this specification can also be modified and changed equivalently based on various aspects or applications without departing from the spirit of the present invention. In addition, the drawings of the present invention are for simple and schematic illustration only and do not represent actual dimensions. The following embodiments will further explain the technical matters related to the present invention, but the disclosed contents do not limit the present invention. In addition, the term "or" used in this specification may include any one or more combinations of related items according to actual circumstances.

[0011] [First embodiment] As shown in Figures 1 to 6, a first embodiment of the present invention provides a method for manufacturing an image pickup module with reduced overall thickness. The method includes the following steps. First, in step 100, as shown in Figures 1 and 2, the circuit board 1 and a temporary carrier board C (also called a movable board, a separable board, or a removable board) are brought close to each other so that the circuit board 1 is placed on the temporary carrier board C (or until the circuit board 1 and the temporary carrier board C are in complete contact). Here, the circuit board 1 has an upper surface 1001, a lower surface 1002, and a through hole 1003 (or a through hole 1003 penetrating the circuit board 1) connected between the upper surface 1001 and the lower surface 1002, and the bottom end of the through hole 1003 of the circuit board 1 is sealed by the temporary carrier board C (step S100). Next, in step S102, as shown in FIGS. 1 and 3, the image sensing chip 2 is placed on a temporary carrier substrate C so as to be accommodated in the through-hole 1003 of the circuit board 1 (step S102). Thereafter, in step S104, an insulating connection structure 3 is formed in the through-hole 1003 of the circuit board 1 so as to connect between the image sensing chip 2 and the circuit board 1 (step S104). Subsequently, in step S106, as shown in FIGS. 1 and 4, the temporary carrier substrate C is removed from the circuit board 1 (step S106). Thereafter, in step S108, as shown in FIGS. 1 and 5, the image sensing chip 2 is electrically connected to the circuit board 1 using a plurality of metal wires W (any conductive metal material can be used, such as gold, silver, or copper) (step S108). Finally, in step 110, as shown in FIGS. 1 and 6, the lens assembly 4 is placed on the circuit board 1. Here, the lens assembly 4 includes a lens carrier 41 installed on the circuit board 1 and a lens module 42 supported by the lens carrier 41 (step S110). However, the above example is merely one possible embodiment and does not limit the present invention.

[0012] 1 and 2, in step S100 of bringing the circuit board 1 and the temporary carrier board C close to each other and disposing the circuit board 1 on the temporary carrier board C, the present invention can perform this by operating a processing machine to bring the circuit board 1 close to the temporary carrier board C, or bring the temporary carrier board C close to the circuit board 1, until they are in complete contact with each other. In other words, any method for achieving "bringing the circuit board 1 and the temporary carrier board C close to each other and disposing the circuit board 1 on the temporary carrier board C" is applicable to the manufacturing method for an image pickup module that reduces the overall thickness provided in the first embodiment of the present invention. However, the above example is merely one possible embodiment and does not limit the present invention.

[0013] 1 and 3 , in step S102 of placing the image-sensing chip 2 in the through-hole 1003 of the circuit board 1 and placing it on the temporary carrier substrate C, the present invention uses an image capture module (not shown) to first confirm the position of the through-hole 1003 of the circuit board 1, and then accurately places the image-sensing chip 2 in the through-hole 1003 of the circuit board 1 and places it on the temporary carrier substrate C, thereby improving the accuracy of optical alignment of the image-sensing chip 2. It is noteworthy that the image-sensing chip 2 can be directly placed on the temporary carrier substrate C without any medium, or the image-sensing chip 2 can be placed on the temporary carrier substrate C via an adhesive layer with low adhesiveness. However, the above example is merely one possible embodiment and is not intended to limit the present invention.

[0014] 1 and 3, in step S104 of forming an insulating connection structure 3 in the through hole 1003 of the circuit board 1 to connect the image sensing chip 2 and the circuit board 1, the present invention uses an image sensing module (not shown) to first identify an empty space located between the image sensing chip 2 and the circuit board 1 (i.e., the space in the through hole 1003 that is not occupied by the image sensing chip 2). After that, an insulating material (e.g., silicone gel or epoxy resin) is filled into the through hole 1003, and then a heating module (not shown) is used to bake the insulating material (or allow it to harden naturally at room temperature), thereby completing the fabrication of the insulating connection structure 3. However, the above example is merely one possible embodiment and is not intended to limit the present invention.

[0015] 1 and 4 , in step S106 of removing the temporary carrier substrate C from the circuit board 1, the circuit board 1 can be fixed in advance, so that the temporary carrier substrate C can move directly downward relative to the circuit board 1, thereby directly separating the temporary carrier substrate C from the circuit board 1. In another embodiment, the bonding or adhesive force between the insulating connection structure 3 and the temporary carrier substrate C can be weakened or reduced by direct irradiation with a laser light (heat source) generated by a laser generator (not shown) or indirect heating with a heat source generated by a heater (not shown), thereby allowing the temporary carrier substrate C to be separated from the circuit board 1 in a more labor-saving manner and reducing the placement position (or optical alignment) of the image sensing chip 2 from being affected by the separation of the temporary carrier substrate C. It is particularly noteworthy that when the temporary carrier substrate C moves directly downward to separate from the circuit board 1, the lower surrounding surface 3000 of the insulating connection structure 3 generates a gel separation mark T1 that is formed "after separation from the temporary carrier substrate C." Furthermore, when the temporary carrier substrate C is separated from the circuit board 1 by direct irradiation with a laser beam generated by a laser generator or indirect heating by a heat source generated by a heater, a gel deformation trace (not shown) is generated on the lower enclosing surface 3000 of the insulating connection structure 3 "after heating by a heat source generated by a laser generator or a heater." However, the above example is merely one possible embodiment and does not limit the present invention.

[0016] For example, as shown in FIGS. 1, 3 and 5, in step S108, the image sensing chip 2 is electrically connected to the circuit board 1 through a plurality of metal wires W, and the upper surface 1001 of the circuit board 1 has a plurality of substrate conductive pads 10P, and the upper surface 2001 of the image sensing chip 2 has a plurality of chip conductive pads 20P. The vertical projection of the image sensing chip 2 is not projected onto the circuit board 1 (in other words, the vertical projection of each chip conductive pad 20P of the image sensing chip 2 is not projected onto the circuit board 1, and each chip conductive pad 20P of the image sensing chip 2 faces the lens assembly 4);The plurality of chip conductive pads 20P of the image sensing chip 2 can be electrically connected to the plurality of board conductive pads 10P of the circuit board 1 via a plurality of metal wires W (for example, bridged metal lead wires as shown in FIG. 5, or continuous metal traces simultaneously formed on the surface of the image sensing chip 2, the surface of the insulating connection structure 3, and the surface of the circuit board 1). However, the above example is merely one embodiment and does not limit the present invention.

[0017] 5 , the manufacturing method for an image capturing module for reducing the overall thickness provided by the first embodiment of the present invention further includes installing the filter element 5 above the image sensing chip 2, supported by a plurality of supports (not numbered) or surrounding supports (not numbered). That is, in step S108 of electrically connecting the image sensing chip 2 to the circuit board 1 via a plurality of metal wires W, the filter element 5 can be installed at a predetermined position above the image sensing chip 2, supported by a plurality of supports (not numbered) or surrounding supports (not numbered). However, the above example is merely one embodiment and is not intended to limit the present invention.

[0018] It should be noted that, for example, as shown in Fig. 7 , in an embodiment, after step S104 of forming the insulating connection structure 3 in the through hole 1003 of the circuit board 1, the temporary carrier substrate C does not need to be immediately removed from the circuit board 1, but can be removed from the circuit board 1 after the step of electrically connecting the image sensing chip 2 to the circuit board 1 via a plurality of metal wires W (or after the step of installing the filter element 5 above the image sensing chip 2 via a plurality of supports or surrounding supports), as shown in Fig. 7 . Also, as shown in Fig. 8 , in an embodiment, after step S104 of forming the insulating connection structure 3 in the through hole 1003 of the circuit board 1, the temporary carrier substrate C does not need to be immediately removed from the circuit board 1, but can be removed from the circuit board 1 after the step of installing the lens assembly 4 on the circuit board 1, as shown in Fig. 8 . That is, according to different processing needs, the temporary carrier substrate C can be removed from the circuit board 1 after "the step of forming the insulating connection structure 3 in the through hole 1003 of the circuit board 1", or after "the step of electrically connecting the image sensing chip 2 to the circuit board 1 via the plurality of metal wires W", or after "the step of installing the lens assembly 4 on the circuit board 1". However, the above example is merely one embodiment and is not intended to limit the present invention.

[0019] Furthermore, as shown in Figures 2 to 6, the first embodiment of the present invention provides an image imaging module M (or image sensing module, image capture module) for reducing the overall thickness, where the image imaging module M includes a circuit board 1, an image sensing chip 2, an insulating connection structure 3, and a lens assembly 4.

[0020] 5 and 6, the circuit board 1 has an upper surface 1001, a lower surface 1002, and a through hole 1003 connecting the upper surface 1001 and the lower surface 1002, and the image sensing chip 2 is installed in the through hole 1003 of the circuit board 1 and electrically connected to the circuit board 1 via a plurality of metal wires W. For example, the upper surface 1001 of the circuit board 1 has a plurality of substrate conductive pads 10P, and the upper surface 2001 of the image sensing chip 2 has a plurality of chip conductive pads 20P, The vertical projection of the image sensing chip 2 is not projected onto the circuit board 1 (in other words, the vertical projection of each chip conductive pad 20P of the image sensing chip 2 is not projected onto the circuit board 1, and each chip conductive pad 20P of the image sensing chip 2 faces the lens assembly 4); The plurality of chip conductive pads 20P of the image sensing chip 2 are electrically connected to the plurality of substrate conductive pads 10P of the circuit board 1 via a plurality of metal wires W. In addition, according to different application needs, the image sensing chip 2 can be a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). However, the above example is merely one embodiment and is not intended to limit the present invention.

[0021] 5 and 6, the insulating connection structure 3 is installed in the through-hole 1003 of the circuit board 1 and is connected between the image sensing chip 2 and the circuit board 1. Furthermore, the lens assembly 4 includes a lens carrier 41 installed on the circuit board 1 and a lens module 42 (e.g., composed of multiple optical lenses) held by the lens carrier 41, and the upper surface 2001 of the image sensing chip 2 has an image sensing area 20S corresponding to the lens module 42. It should be noted that the lower surface 2002 of the image sensing chip 2 is exposed to the outside and is not covered by the insulating connection structure 3. The insulating connection structure 3 has a lower peripheral surface 3000 exposed to the outside, and the lower peripheral surface 3000, the lower surface 1002 of the circuit board 1, and the lower surface 2002 of the image sensing chip 2 can be completely or almost (substantially) flush with each other. However, the above example is merely one embodiment and does not limit the present invention.

[0022] 5 and 6 , the thickness of the insulating connection structure 3 may be “equal to or less than the thickness of the image sensing chip 2” and “equal to or less than the thickness of the circuit board 1,” and the insulating connection structure 3 may be tightly connected between the outer peripheral surface 2000 of the image sensing chip 2 and the inner peripheral surface 1004 of the through hole 1003 of the circuit board 1. In a specific embodiment, when the inner peripheral surface 1004 of the through hole 1003 of the circuit board 1 is configured as a roughened peripheral surface, the roughened peripheral surface is used to increase the adhesion or contact area between the insulating connection structure 3 and the circuit board 1. In a specific embodiment, all or part of the outer peripheral surface 2000 of the image sensing chip 2 is covered with the insulating connection structure 3, thereby adjusting the adhesion or contact area between the insulating connection structure 3 and the image sensing chip 2 (i.e., the larger the area of ​​the outer peripheral surface 2000 of the image sensing chip 2 that is covered with the insulating connection structure 3, the greater the adhesion or contact area between the insulating connection structure 3 and the image sensing chip 2). However, the above example is merely one embodiment and does not limit the present invention.

[0023] 4 and 6, the lower enclosure surface 3000 of the insulating connection structure 3 has gel body separation traces T1 that are formed after separation from the temporary carrier substrate C. In one embodiment, when the temporary carrier substrate C is peeled off from the circuit board 1 by "direct irradiation with laser light generated by a laser generator" or "indirect heating with a heat source generated by a heater," gel body deformation traces that are formed "after heating by a laser generator or a heater" are generated on the lower enclosure surface 3000 of the insulating connection structure 3 (not shown). However, the above example is merely one example of a possible embodiment, and does not limit the present invention.

[0024] 5 and 6, the image capturing module M further includes a filter element 5. The filter element 5 is supported by a plurality of supports (not numbered) or surrounding supports (not numbered) and is installed above the image sensing chip 2. The filter element 5 is also surrounded by a plurality of metal wires W, and the height of the filter element 5 may be higher or lower than the height of the plurality of metal wires W relative to the image sensing chip 2. However, the above example is merely one possible embodiment and does not limit the present invention.

[0025] For example, in one embodiment, the insulating connection structure 3 can have an extended connection portion (not shown) that extends onto the upper surface 1001 of the circuit board 1. This can increase the adhesive strength or contact area between the insulating connection structure 3 and the circuit board 1. That is, the insulating connection structure 3 is arranged so as to overlap the upper surface 1001 of the circuit board 1 through the extension of the extended connection portion, thereby increasing the contact area between the insulating connection structure 3 and the circuit board 1 (or the insulating connection structure 3 receives more support from the circuit board 1). This prevents the insulating connection structure 3 from easily falling off from the through-hole 1003 of the circuit board 1 due to external forces (for example, external forces generated when removing the temporary carrier substrate C from the circuit board 1, as shown in FIG. 4). However, the above example is merely one possible embodiment and does not limit the present invention.

[0026] [Second embodiment] As shown in FIGS. 1, 9, and 10, a second embodiment of the present invention provides a method for manufacturing an image imaging module M with reduced overall thickness, and an image imaging module using the same. Comparing FIGS. 9 and 3, and comparing FIGS. 10 and 6, the main difference between the second embodiment and the first embodiment of the present invention is that after step S100 of bringing the circuit board 1 and the temporary carrier substrate C close to each other and placing the circuit board 1 on the temporary carrier substrate C, the method for manufacturing an image imaging module with reduced overall thickness further includes the following steps: In step S104(A), a bottom-surrounding insulating layer 31 is formed in the through-hole 1003 of the circuit board 1 to connect between the image sensing chip 2 and the circuit board 1; and in step S104(B), a top-surrounding insulating layer 32 is formed in the through-hole 1003 of the circuit board 1 to connect between the image sensing chip 2 and the circuit board 1.

[0027] 9 and 10 , the bottom surrounding insulating layer 31 and the top surrounding insulating layer 32 can be connected to each other, and the bottom surrounding insulating layer 31 and the top surrounding insulating layer 32 can be received in the through-hole 1003 of the circuit board 1 to tightly connect the image sensing chip 2 and the circuit board 1. It is noteworthy that the bottom surrounding insulating layer 31 of the insulating connection structure 3 is exposed and has an uncovered lower surrounding surface 3000. The lower surrounding surface 3000 of the bottom surrounding insulating layer 31 of the insulating connection structure 3, the lower surface 1002 of the circuit board 1, and the lower surface 2002 of the image sensing chip 2 can be completely or almost (substantially) flush with each other. However, the above example is merely one embodiment and does not limit the present invention.

[0028] For example, as shown in FIGS. 9 and 10 , in some embodiments, the thickness of the bottom surrounding insulating layer 31 can be thinner than the thickness of the top surrounding insulating layer 32. Alternatively, the viscosity of the bottom surrounding insulating layer 31 can be lower than the viscosity of the top surrounding insulating layer 32. Alternatively, the melting point of the bottom surrounding insulating layer 31 can be lower than the melting point of the top surrounding insulating layer 32. Therefore, the adhesive strength between the bottom surrounding insulating layer 31 and the image sensing chip 2 is weaker than the adhesive strength between the top surrounding insulating layer 32 and the image sensing chip 2. Also, the adhesive strength between the bottom surrounding insulating layer 31 and the circuit board 1 is weaker than the adhesive strength between the top surrounding insulating layer 32 and the circuit board 1. This allows the temporary carrier substrate C to be more easily detached from the circuit board 1. However, the above example is merely one embodiment and is not intended to limit the present invention.

[0029] 9 and 10, in one embodiment, when the inner surface 1004 of the through hole 1003 of the circuit board 1 is arranged to contact the roughened surface of the top surrounding insulating layer 32, the roughened surface can be used to increase the adhesive strength or contact area between the top surrounding insulating layer 32 and the circuit board 1. However, the above example is merely one embodiment and is not intended to limit the present invention.

[0030] For example, as shown in FIGS. 9 and 10 , when the temporary carrier substrate C is detached from the circuit board 1 by "direct irradiation of laser light generated by a laser generator (or by direct irradiation of the bottom end surrounding insulating layer 31 with laser light generated by a laser generator)" or "indirect heating of a heat source generated by a heater (or by indirect heating of the bottom end surrounding insulating layer 31 with a heat source generated by a heater)," the lower surrounding surface 3000 of the bottom end surrounding insulating layer 31 of the insulating connection structure 3 generates a gel body deformation trace T2 formed "after being heated by a heat source generated by a heating module L (e.g., a laser generator or heater)." In one embodiment, when the temporary carrier substrate C moves directly downward to detach from the circuit board 1, the lower surrounding surface 3000 of the bottom end surrounding insulating layer 31 of the insulating connection structure 3 generates a gel body separation trace (not shown) formed "after being separated from the temporary carrier substrate C." However, the above example is merely one embodiment and is not intended to limit the present invention.

[0031] For example, in one embodiment, the top-surrounding insulating layer 32 of the insulating connection structure 3 has an extended connection portion (not shown) that extends to the upper surface 1001 of the circuit board 1, thereby increasing the adhesive strength or contact area between the top-surrounding insulating layer 32 of the insulating connection structure 3 and the circuit board 1. That is, the top-surrounding insulating layer 32 of the insulating connection structure 3 overlaps the upper surface 1001 of the circuit board 1 due to the extension of the extended connection portion, thereby creating a larger contact area between the top-surrounding insulating layer 32 of the insulating connection structure 3 and the circuit board 1 (or allowing the top-surrounding insulating layer 32 of the insulating connection structure 3 to obtain more support from the circuit board 1). This makes it less likely that the insulating connection structure 3 will detach from the through-hole 1003 of the circuit board 1 due to an external force (for example, an external force generated when removing the temporary carrier substrate C from the circuit board 1, as shown in FIG. 4). However, the above example is merely one embodiment and does not limit the present invention.

[0032] [Third embodiment] As shown in Fig. 11, the third embodiment of the present invention provides an image capturing module M for reducing the overall thickness. As can be seen from comparing Fig. 11 with Fig. 10, the main differences between the third embodiment and the second embodiment of the present invention are as follows: the top surrounding insulating layer 32 of the insulating connection structure 3 has an exposed, uncovered lower surrounding surface 3000, and a predetermined vertical height is provided between the lower surrounding surface 3000 of the top surrounding insulating layer 32 of the insulating connection structure 3 and the lower surface 1002 of the circuit board 1. This allows a surrounding free space S to be formed between the circuit board 1, the image sensing chip 2, and the insulating connection structure 3.

[0033] For example, the surrounding empty space S is formed by removing part of the bottom material of the insulating connection structure 3 (for example, it can be removed using a laser generator or a heater). Therefore, the lower surrounding surface 3000 of the top surrounding insulating layer 32 of the insulating connection structure 3, part of the inner surrounding surface 1004 of the through hole 1003 of the circuit board 1, and part of the outer surrounding surface 2000 of the image sensing chip 2 can be exposed from the bottom end of the through hole 1003 of the circuit board 1. However, the above example is merely one embodiment and does not limit the present invention.

[0034] [Fourth embodiment] As shown in Figures 1 and 12 to 14, a fourth embodiment of the present invention provides a method for fabricating an image capturing module to reduce its overall thickness. The method includes the following steps. First, as shown in Figures 1 and 12, a circuit board 1 and a temporary carrier board C (or a movable board, a separable board, or a removable board) are brought close to each other, and the circuit board 1 is placed on the temporary carrier board C (or until the circuit board 1 and the temporary carrier board C are in complete contact). The circuit board 1 has an upper surface 1001, a lower surface 1002, and a through-hole 1003 (or a through-hole 1003 penetrating the circuit board 1) connecting the upper surface 1001 and the lower surface 1002, and the bottom end of the through-hole 1003 of the circuit board 1 is closed by the temporary carrier board C (step S200). Next, as shown in FIGS. 1 and 12, the image-sensing chip 2 is accommodated in the through-hole 1003 of the circuit board 1 via an adhesive gel layer C100 (e.g., double-sided tape or any type of adhesive layer) and placed on a temporary carrier substrate C (step S202). Then, as shown in FIGS. 1 and 13, the image-sensing chip 2 is electrically connected to the circuit board 1 via a plurality of metal wires W (made of any conductive metal material, such as gold, silver, or copper) (alternatively, a filter element 5 may be placed above the image-sensing chip 2 via a plurality of supports or surrounding supports) (step S204). Next, as shown in FIGS. 1 and 14, an insulating connection structure 3 is formed in the through-hole 1003 of the circuit board 1 to connect the image-sensing chip 2 and the circuit board 1 (step S206). Then, as shown in FIG. 1, the temporary carrier substrate C is removed from the circuit board 1 (step S208). Next, as shown in FIG. 1, a lens assembly 4 is placed on the circuit board 1. The lens assembly 4 includes a lens carrier 41 mounted on the circuit board 1 and a lens module 42 supported by the lens carrier 41 (step S210). Note that steps S208 and S210 can be performed inversely according to different requirements. For example, in one embodiment, the adhesive gel layer C100 may be disposed only between the image sensing chip 2 and the temporary carrier substrate C.In another embodiment, the adhesive gel layer C100 may be distributed over the entire temporary carrier substrate C, so that the adhesive gel layer C100 may also be disposed between the circuit board 1 and the temporary carrier substrate C, and the adhesive gel layer C100 may also be disposed between the insulating connection structure 3 and the temporary carrier substrate C. However, the above example is merely one embodiment and is not intended to limit the present invention.

[0035] That is, as shown in Figures 3, 5, 12, 13 and 14, the "wiring step (or chip electrical connection step)" of electrically connecting the image sensing chip 2 to the circuit board 1 via multiple metal wires W and the "filling step (chip limiting step)" of forming an insulating connection structure 3 in the through hole 1003 of the circuit board 1 and connecting it between the image sensing chip 2 and the circuit board 1 can be two steps performed in order (as shown in Figures 3 and 5, the filling step is performed first and then the wiring step is performed) or two steps performed in the reverse order (as shown in Figures 12, 13 and 14, the wiring step is performed first and then the filling step is performed).

[0036] [Fifth embodiment] As shown in FIG. 15, the fifth embodiment of the present invention provides a portable electronic device P. The portable electronic device P includes an image capturing module M provided by any one of the first to third embodiments. Prepare For example, the portable electronic device P can be a smartphone, a desktop computer, a laptop computer, a tablet computer, or any other type of electronic device. However, the above example is merely one embodiment and is not intended to limit the present invention.

[0037] One beneficial effect of the present invention is the image capturing module M provided by the present invention for reducing the overall thickness. This module employs the following technical solutions: "circuit board 1 has upper surface 1001, lower surface 1002, and through-hole 1003 connecting upper surface 1001 and lower surface 1002," "image sensing chip 2 is disposed in through-hole 1003 of circuit board 1 and electrically connected to circuit board 1 via a plurality of metal wires W," and "insulating connection structure 3 is disposed in through-hole 1003 of circuit board 1 and connected between image sensing chip 2 and circuit board 1." This allows image sensing chip 2 to be firmly fixed in through-hole 1003 of circuit board 1 through connection with insulating connection structure 3 without the image sensing chip 2 coming into contact with circuit board 1. This reduces the overall thickness of the image capturing module M.

[0038] Another beneficial effect of the present invention lies in a method for manufacturing an image pickup module M for reducing its overall thickness. This method includes the following technical solutions: placing a circuit board 1 and a temporary carrier board C close to each other, and placing the circuit board 1 on the temporary carrier board C. The circuit board 1 has an upper surface 1001, a lower surface 1002, and a through hole 1003 connecting the upper surface 1001 and the lower surface 1002; placing the image sensing chip 2 in the through hole 1003 of the circuit board 1 and placing it on the temporary carrier board C; and forming an insulating connection structure 3 in the through hole 1003 of the circuit board 1 to connect the image sensing chip 2 to the circuit board 1. This allows the image sensing chip 2 to be firmly fixed in the through hole 1003 of the circuit board 1 through the connection of the insulating connection structure 3 without the image sensing chip 2 contacting the circuit board 1. This reduces the overall thickness of the image pickup module M.

[0039] The contents disclosed above are merely preferred and possible embodiments of the present invention, and do not limit the scope of the claims of the present invention. Therefore, all equivalent technical modifications made based on the contents of the specification and accompanying drawings of the present invention are intended to be included in the scope of the claims of the present invention. [Explanation of symbols]

[0040] P Portable electronic devices M image capture module 1 circuit board 1001 Top surface 1002 Bottom surface 1003 Through hole 1004 Inner surface 10P PCB conductive pad 2. Image sensing chip 2000 outer surface 2001 Top 2002 Bottom 20P Chip Conductive Pads 20S image detection area 3. Insulating connection structure 31 Bottom end surrounding insulation layer 32 Top-end surrounding insulation layer 3000 bottom surface 4 Lens Assembly 41 Lens Carrier 42 Lens Module 5 Filter elements T1 Gel separation traces T2 Gel body deformation traces S Surrounding empty space W Metal Wire C Temporary carrier board C100 adhesive gel layer L Heating Module

Claims

1. a circuit board having an upper surface, a lower surface, and a through hole connecting the upper surface and the lower surface; an image sensing chip disposed in the through-hole of the circuit board and electrically connected to the circuit board via a plurality of metal wires; an insulating connection structure disposed in the through-hole of the circuit board and connected to the image sensing chip and the circuit board; a lens assembly including a lens carrier disposed on the circuit board and a lens module supported by the lens carrier; An image capturing module for reducing an overall thickness, comprising: an upper surface of the image sensing chip having an image sensing area corresponding to the lens module; The bottom surface of the image sensing chip is exposed to the outside and is not covered by the insulating connection structure; the image capturing module further includes a filter element, the filter element being supported by a plurality of supports or surrounding supports and disposed above the image sensing chip, the filter element being surrounded by a plurality of the metal wires; a vertical projection of the image sensing chip is not projected onto the circuit board; An image capturing module comprising:

2. the top surface of the circuit board has a plurality of substrate conductive pads, the top surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are electrically connected to the plurality of substrate conductive pads of the circuit board respectively via the plurality of metal wires; a vertical projection of each of the chip conductive pads of the image sensing chip is not projected onto the circuit board, and each of the chip conductive pads of the image sensing chip faces the lens assembly; the insulating connection structure is tightly connected to an outer peripheral surface of the image sensing chip and an inner peripheral surface of the through hole of the circuit board; The inner surface of the through hole in the circuit board is roughened to increase the adhesive strength or contact area between the insulating connection structure and the circuit board; The entire or part of the outer surface of the image sensing chip is covered by the insulating connecting structure, thereby adjusting the adhesive strength or contact area between the insulating connecting structure and the image sensing chip; the thickness of the insulating connection structure is equal to or less than the thickness of the image sensing chip and equal to or less than the thickness of the circuit board; the insulating connection structure has an exposed and unshielded lower surface, and the lower surface of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip are configured to be aligned with each other; the lower surface of the insulating connection structure has a gel body separation trace formed after separation from the temporary carrier substrate; the lower surface of the insulating connection structure has a gel deformation trace generated after heating with a heat source generated by a heating module; the lower surrounding surface of the insulating connection structure has gel deformation traces formed after being heated by a heat source generated by a heating module; The image capturing module of claim 1 , wherein the insulating connection structure has an extended connection portion that extends to the top surface of the circuit board, thereby increasing the adhesive strength or contact area between the insulating connection structure and the circuit board.

3. the insulating connection structure includes a bottom surrounding insulating layer and a top surrounding insulating layer connected to the bottom surrounding insulating layer, and the bottom surrounding insulating layer and the top surrounding insulating layer are both disposed in the through hole of the circuit board and connected between the image sensing chip and the circuit board; The thickness of the bottom surrounding insulating layer is thinner than the thickness of the top surrounding insulating layer, the viscosity of the bottom surrounding insulating layer is lower than the viscosity of the top surrounding insulating layer, and the melting point of the bottom surrounding insulating layer is lower than the melting point of the top surrounding insulating layer; an adhesive force between the bottom surrounding insulating layer and the image sensing chip is weaker than an adhesive force between the top surrounding insulating layer and the image sensing chip, and an adhesive force between the bottom surrounding insulating layer and the circuit board is weaker than an adhesive force between the top surrounding insulating layer and the circuit board; an inner peripheral surface of the through hole of the circuit board is arranged to contact the roughened peripheral surface of the top-end surrounding insulating layer, thereby increasing the adhesive strength or contact area between the top-end surrounding insulating layer and the circuit board; the insulating connection structure has an exposed and unshielded lower surface, and the lower surface of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip are configured to be trimmed to align with each other; the bottom end surrounding insulating layer has a gel separation mark formed on the bottom surface thereof after being separated from the temporary carrier substrate; the bottom surface of the bottom end surrounding insulating layer has gel deformation marks formed after being heated by a heat source generated by a heating module; 2. The image capturing module of claim 1, wherein the top-end surrounding insulating layer of the insulating connection structure has an extended connection portion extending to the top surface of the circuit board, thereby increasing the adhesion strength or contact area between the insulating connection structure and the circuit board.

4. the insulating connection structure has an exposed, unshielded lower surface, and a predetermined vertical height is provided between the lower surface of the insulating connection structure and the lower surface of the circuit board, thereby forming an enclosed free space between the circuit board, the image sensing chip, and the insulating connection structure; the insulating connection structure is tightly connected between the outer peripheral surface of the image sensing chip and the inner peripheral surface of the through-hole of the circuit board, and the bottom peripheral surface of the insulating connection structure, a portion of the inner peripheral surface of the through-hole of the circuit board, and a portion of the outer peripheral surface of the image sensing chip are exposed from a bottom end of the through-hole of the circuit board; The image capturing module of claim 1 , wherein the insulating connection structure has an extended connection portion that extends to the top surface of the circuit board, thereby increasing the adhesive strength or contact area between the insulating connection structure and the circuit board.

5. a circuit board having an upper surface, a lower surface, and a through hole connected between the upper surface and the lower surface; an image sensing chip disposed in the through-hole of the circuit board and electrically connected to the circuit board via a plurality of metal wires; an insulating connection structure disposed in the through-hole of the circuit board and connected between the image sensing chip and the circuit board; a lens assembly including a lens carrier mounted on the circuit board and a lens module mounted on the lens carrier; An image capturing module for reducing an overall thickness, comprising: a top surface of the image sensing chip having an image sensing area corresponding to the lens module; a lower surface of the image sensing chip is exposed and is not covered by the insulating connection structure; a vertical projection of the image sensing chip is not projected onto the circuit board; An image capturing module characterized by:

6. the top surface of the circuit board has a plurality of substrate conductive pads, the top surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are electrically connected to the plurality of substrate conductive pads of the circuit board respectively via the plurality of metal wires; a vertical projection of each of the chip conductive pads of the image sensing chip is not projected onto the circuit board, and each of the chip conductive pads of the image sensing chip faces the lens assembly; the insulating connection structure is tightly connected between an outer surface of the image sensing chip and an inner surface of the through hole of the circuit board; The inner surface of the through hole of the circuit board is configured as a roughened surface, thereby increasing the adhesive strength or contact area between the insulating connection structure and the circuit board; The entire or part of the outer surface of the image sensing chip is covered by the insulating connecting structure, thereby adjusting the adhesive strength or contact area between the insulating connecting structure and the image sensing chip; the thickness of the insulating connection structure is equal to or less than the thickness of the image sensing chip and equal to or less than the thickness of the circuit board; The insulating connection structure has an exposed and unshielded lower surface, and the lower surface of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip are aligned with each other; the lower surface of the insulating connection structure has a gel separation trace formed after separation from the temporary carrier substrate; the lower surrounding surface of the insulating connection structure has gel deformation traces formed after being heated by a heat source generated by a heating module; The image capturing module of claim 5 , wherein the insulating connection structure has an extended connection portion that extends to the top surface of the circuit board, thereby increasing the adhesive strength or contact area between the insulating connection structure and the circuit board.

7. the insulating connection structure includes a bottom surrounding insulating layer and a top surrounding insulating layer connected to the bottom surrounding insulating layer, and the bottom surrounding insulating layer and the top surrounding insulating layer are disposed in the through-hole of the circuit board and connected between the image sensing chip and the circuit board; The thickness of the bottom surrounding insulating layer is smaller than the thickness of the top surrounding insulating layer, the viscosity of the bottom surrounding insulating layer is smaller than the viscosity of the top surrounding insulating layer, and the melting point of the bottom surrounding insulating layer is lower than the melting point of the top surrounding insulating layer; an adhesive force between the bottom surrounding insulating layer and the image sensing chip is smaller than an adhesive force between the top surrounding insulating layer and the image sensing chip, and an adhesive force between the bottom surrounding insulating layer and the circuit board is smaller than an adhesive force between the top surrounding insulating layer and the circuit board; an inner peripheral surface of the through hole of the circuit board is configured to contact the roughened peripheral surface of the top surrounding insulating layer, thereby increasing the adhesive strength or contact area between the top surrounding insulating layer and the circuit board; the insulating connection structure has an exposed, unshielded lower surface, and the lower surface of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip are configured to be aligned with each other; the bottom end surrounding insulating layer has a gel separation trace formed on the bottom surrounding surface after being separated from the temporary carrier substrate; the bottom end surrounding insulating layer has a gel deformation trace formed on the bottom surface thereof by heating with a heat source generated by a heating module; 6. The image capturing module of claim 5, wherein the top-end surrounding insulating layer of the insulating connection structure has an extended connection portion extending to the top surface of the circuit board, thereby increasing the adhesion strength or contact area between the insulating connection structure and the circuit board.

8. the insulating connection structure has an exposed, unshielded lower surface, and a predetermined vertical height is provided between the lower surface of the insulating connection structure and the lower surface of the circuit board, thereby forming an enclosed space between the circuit board, the image sensing chip, and the insulating connection structure; the insulating connection structure is tightly connected between the outer peripheral surface of the image sensing chip and the inner peripheral surface of the through-hole of the circuit board, and the bottom peripheral surface of the insulating connection structure, a portion of the inner peripheral surface of the through-hole of the circuit board, and a portion of the outer peripheral surface of the image sensing chip are exposed from a bottom end of the through-hole of the circuit board; The image capturing module of claim 5 , wherein the insulating connection structure has an extended connection portion that extends to the top surface of the circuit board, thereby increasing the adhesive strength or contact area between the insulating connection structure and the circuit board.

9. 1. A portable electronic device comprising an image capture module, The image capturing module includes: a circuit board having an upper surface, a lower surface, and a through hole connecting the upper surface and the lower surface; an image sensing chip disposed in the through-hole of the circuit board and electrically connected to the circuit board through a plurality of metal wires; an insulating connection structure disposed in the through-hole of the circuit board and connected between the image sensing chip and the circuit board; a lens assembly including a lens carrier mounted on the circuit board and a lens module supported by the lens carrier; Equipped with a top surface of the image sensing chip having an image sensing area corresponding to the lens module; a lower surface of the image sensing chip is exposed and is not covered by the insulating connection structure; a vertical projection of the image sensing chip is not projected onto the circuit board; A portable electronic device.

10. the top surface of the circuit board has a plurality of substrate conductive pads, the top surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are electrically connected to the plurality of substrate conductive pads of the circuit board respectively via the plurality of metal wires; a vertical projection of each of the chip conductive pads of the image sensing chip is not projected onto the circuit board, and each of the chip conductive pads of the image sensing chip faces the lens assembly; the insulating connection structure is tightly connected between an outer surface of the image sensing chip and an inner surface of the through hole of the circuit board; The inner surface of the through hole of the circuit board is configured as a roughened surface, thereby increasing the adhesive strength or contact area between the insulating connection structure and the circuit board; The entire or part of the outer surface of the image sensing chip is covered by the insulating connecting structure, thereby adjusting the adhesive strength or contact area between the insulating connecting structure and the image sensing chip; the thickness of the insulating connection structure is equal to or less than the thickness of the image sensing chip and equal to or less than the thickness of the circuit board; The insulating connection structure has an exposed and unshielded lower surface, and the lower surface of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip are aligned with each other; the lower surface of the insulating connection structure has a gel separation trace formed after separation from the temporary carrier substrate; the lower surrounding surface of the insulating connection structure has gel deformation traces formed after being heated by a heat source generated by a heating module; the insulating connection structure has an extended connection portion extending to the upper surface of the circuit board, thereby increasing the adhesive strength or contact area between the insulating connection structure and the circuit board; the image capturing module further includes a filter element, the filter element being supported by a plurality of supports or surrounding supports and disposed above the image sensing chip, and the filter element being surrounded by a plurality of the metal wires; 10. The portable electronic device of claim 9.

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