Thermoplastic polymer composition

Abstract

The present invention relates to a polymer composition comprising a thermoplastic polymer, glass fibers, and hollow glass beads, wherein the ratio of the concentration of the hollow glass beads to the total concentration of the glass fibers and hollow glass beads is in the range of 0.2 to 0.49.

Description

[Technical Field]

[0001] The present invention relates to a thermoplastic polymer composition, particularly a thermoplastic polymer composition having excellent dielectric and mechanical properties, and a method for making said thermoplastic polymer composition. Furthermore, the present invention relates to a portable electronic device component comprising said thermoplastic polymer composition. [Background technology]

[0002] Due to their reduced weight, high mechanical performance, and excellent design options, thermoplastic polymer compositions are attractive as metal replacements for portable electronic components.

[0003] In particular, thermoplastic polymer compositions containing glass fibers as a reinforcing filler have been widely used in portable electronic devices due to their high stiffness, high strength, and high impact performance. However, such compositions generally have poor dielectric properties, i.e., high dielectric constant (D k ) and high dielectric loss tangent (D f ) is shown.

[0004] Thus, a need is felt for thermoplastic polymer compositions that effectively address the appropriate balance of properties required for portable electronic components, and in particular, a need is felt for thermoplastic polymer compositions that have satisfactory dielectric properties in terms of dielectric constant and dissipation factor, while maintaining good mechanical properties. Summary of the Invention

[0005] In a first aspect, the present invention provides a method for producing a medicament for the treatment of a pulmonary arthritis, comprising: a thermoplastic polymer selected from the group consisting of poly(arylene sulfide) (PAS), poly(aryl ether sulfone) (PAES), poly(aryl ether ketone) (PAEK), polyester (PE), polyamide (PA), and combinations thereof; -glass fiber, -Hollow glass beads, Regarding the polymer composition [composition (C)] comprising: In this case, the ratio of the concentration of hollow glass beads to the total concentration of glass fibers and hollow glass beads is in the range of 0.2 to 0.49.

[0006] In another aspect, the present invention relates to a part of a portable electronic device comprising the composition (C) defined above.

[0007] Advantageously, the composition (C) according to the present invention exhibits good mechanical properties such as strength and ductility, while exhibiting excellent dielectric performance, i.e., low dielectric constant (D k ) and low dielectric loss tangent (D f Due to its high dielectric and mechanical performance, the composition (C) according to the invention can be desirably incorporated into portable electronic equipment parts. DETAILED DESCRIPTION OF THE INVENTION

[0008] Described herein is a polymer composition [Composition (C)] comprising a thermoplastic polymer, glass fibers, and hollow glass beads, wherein the ratio of the concentration of the hollow glass beads to the total concentration of the glass fibers and hollow glass beads is in the range of 0.2 to 0.49. The thermoplastic polymer is selected from the group consisting of poly(arylene sulfide) (PAS), poly(aryl ether sulfone) (PAES), poly(aryl ether ketone) (PAEK), polyester (PE), polyamide (PA), and combinations thereof.

[0009] Surprisingly, by incorporating hollow glass beads in the claimed ratio, the resulting composition (C) exhibits a dielectric constant (D) that is higher than that of a similar composition both without hollow glass beads and with different ratios of hollow glass beads. k ) and dielectric loss tangent (D f It has been found that this composition offers a very good compromise between reducing the tensile strain and maintaining good mechanical properties, especially high tensile strain. More specifically, it has been unexpectedly found that composition (C) according to the invention exhibits significantly higher tensile strain compared to similar compositions incorporating a higher proportion of hollow glass beads.

[0010] The ratio of the concentration of hollow glass beads to the total concentration of glass fibers and hollow glass beads in composition (C) is calculated by the formula:

number

[0011] As used herein, unless otherwise indicated, the following terms shall have the following meanings.

[0012] As used herein, the term "alkyl," as well as derivative terms such as "alkoxy," "acyl," and "alkylthio," include within their scope straight-chain, branched-chain, and cyclic moieties. Examples of alkyl groups are methyl, ethyl, 1-methylethyl, propyl, 1,1-dimethylethyl, and cyclopropyl.

[0013] The term "aryl" refers to a phenyl, indanyl, or naphthyl group. An aryl group can contain one or more alkyl groups, in which case it is sometimes referred to as an "alkylaryl," and can be composed, for example, of an aromatic group and two C1-C6 groups (e.g., methyl or ethyl). An aryl group can also contain one or more heteroatoms, such as N, O, or S, in which case it is sometimes referred to as a "heteroaryl" group, and these heteroaromatic rings can be fused with other aromatic systems. Such heteroaromatic rings include, but are not limited to, furanyl, thienyl, pyrrolyl, pyrazolyl, imidazolyl, triazolyl, isoxazolyl, oxazolyl, thiazolyl, isothiazolyl, pyridyl, pyridazyl, pyrimidyl, pyrazinyl, and triazinyl ring structures. An aryl or heteroaryl substituent can be unsubstituted or can be selected from the group consisting of halogen, hydroxy, C1-C6 alkoxy, sulfo, C1-C6 alkylthio, C1-C6 acyl, formyl, cyano, C6-C6 alkyl, and the like. 15Aryloxy or C6-C 15 It may be substituted with one or more substituents selected from, but not limited to, aryl, provided that the substituents are sterically compatible and chemical bonding and strain energy rules are satisfied.

[0014] Unless otherwise specifically stated, each alkyl and aryl group may be unsubstituted or substituted with halogen, hydroxy, sulfo, C1-C6 alkoxy, C1-C6 alkylthio, C1-C6 acyl, formyl, cyano, C6-C 15 Aryloxy or C6-C 15 It may be substituted with one or more substituents selected from, but not limited to, aryl, provided that the substituents are sterically compatible and chemical bonding and strain energy rules are satisfied. The term "halogen" or "halo" includes fluorine, chlorine, bromine and iodine, with fluorine being preferred.

[0015] According to a preferred embodiment of the present invention, composition (C) consists or consists essentially of a thermoplastic polymer, glass fibers, and hollow glass beads. The expression "consisting essentially of" is intended to mean that composition (C) comprises a thermoplastic polymer, glass fibers, hollow glass beads, and not more than 15% by weight, preferably not more than 10% by weight, preferably not more than 5% by weight, even more preferably not more than 3% by weight, and most preferably not more than 1% by weight of other components.

[0016] In some embodiments, the ratio of the concentration of hollow glass beads to the total concentration of glass fiber and hollow glass beads is in the range of 0.2 to 0.48, 0.2 to 0.45, 0.2 to 0.4, 0.22 to 0.49, 0.22 to 0.48, 0.22 to 0.45, 0.22 to 0.4, 0.25 to 0.49, 0.25 to 0.48, 0.25 to 0.45, or 0.25 to 0.4.

[0017] Regarding dielectric performance, the dielectric constant (D k ") and dielectric loss tangent ("D fThe dielectric constant of a material is important in determining the suitability of a material in application settings where wireless communication is present. For example, in portable electronic devices, the dielectric properties of materials forming various components and housings can significantly impair wireless radio signals (e.g., frequencies of 1 MHz, 1 GHz, 2.4 GHz, and 5.0 GHz) transmitted and received by the portable electronic device through one or more antennas. The dielectric constant of a material represents, in part, the material's ability to interact with electromagnetic radiation and correspondingly disrupt electromagnetic signals (e.g., radio signals) traveling through that material. Thus, the lower the material's dielectric constant at a given frequency, the less the material disrupts electromagnetic signals at that frequency. Similarly, the dissipation factor is proportional to the dielectric loss of a material; the lower the dissipation factor, the lower the material's dielectric loss.

[0018] The composition (C) according to the present invention has excellent dielectric performance (relatively low D k and D f )

[0019] In some embodiments, composition (C) has a dielectric constant (D) at 1 MHz of 3.3 or less, 3.2 or less, 3.1 or less, 3.0 or less, 2.9 or less, or 2.8 or less. k Additionally or alternatively, in some embodiments, composition (C) has a D at 1 MHz of at least 2.7. k In some embodiments, composition (C) has a D at 1 MHz in the range of 2.7 to 3.3, 2.7 to 3.2, 2.7 to 3.1, 2.7 to 3.0, 2.7 to 2.9, or 2.7 to 2.8. k It has.

[0020] In some embodiments, composition (C) has a dielectric loss tangent (D) at 1 MHz of 0.015 or less, 0.014 or less, 0.013 or less, 0.012 or less, or 0.010 or less. f Additionally or alternatively, in some embodiments, composition (C) has a D at 1 MHz of at least 0.003 or at least 0.004. fIn some embodiments, composition (C) has a D at 1 MHz in the range of 0.003 to 0.015, 0.003 to 0.014, 0.003 to 0.013, 0.003 to 0.012, 0.003 to 0.011, 0.003 to 0.010, 0.004 to 0.015, 0.004 to 0.014, 0.004 to 0.013, 0.004 to 0.012, 0.004 to 0.011, or 0.004 to 0.010. f It has.

[0021] D at 1MHz f and D k can be measured according to ASTM D150. In some embodiments, composition (C) has a D in the above range at a frequency of 2.4 GHz. f and D k It can have 2.4GHz D f and D k can be measured according to ASTM D2520 or ASTM D150.

[0022] Furthermore, as mentioned above, the composition (C) according to the invention has good mechanical performance in terms of impact strength (notched and unnotched), tensile strength, tensile modulus and especially tensile strain.

[0023] In some embodiments, composition (C) has a tensile strain of at least 2.5%, at least 2.6%, or at least 2.8%. Additionally or alternatively, in some embodiments, composition (C) has a tensile strain of 4.0% or less, 3.8% or less, or 3.5% or less. In some embodiments, composition (C) has a tensile strain in the range of 2.5% to 4.0%, 2.5% to 3.8%, 2.5% to 3.5%, 2.6% to 4.0%, 2.6% to 3.8%, 2.6% to 3.5%, 2.8% to 4.0%, 2.8% to 3.8%, or 2.8% to 3.5%.

[0024] In some embodiments, composition (C) has a tensile strength of at least 80 megapascals ("MPa"), at least 85 MPa, or at least 90 MPa. Additionally or alternatively, in some embodiments, said composition (C) has a tensile strength of 160 MPa or less, 150 MPa or less, or 145 MPa or less. In some embodiments, said composition (C) has a tensile strength in the range of 80 MPa to 160 MPa, 80 MPa to 150 MPa, 80 MPa to 145 MPa, 85 MPa to 160 MPa, 85 MPa to 150 MPa, 85 MPa to 145 MPa, 90 MPa to 160 MPa, 90 MPa to 150 MPa, or 90 MPa to 145 MPa.

[0025] In some embodiments, composition (C) has a tensile modulus of at least 6.5 gigapascals ("GPa"), at least 7.0 GPa, or at least 7.8 GPa. Additionally or alternatively, in some embodiments, composition (C) has a tensile modulus of 11.8 GPa or less, 11.0 GPa or less, or 10.0 GPa or less. In some embodiments, composition (C) has a tensile modulus in the range of 6.5 GPa to 11.8 GPa, 6.5 GPa to 11.0 GPa, 6.5 GPa to 10.0 GPa, 7.0 GPa to 11.8 GPa, 7.0 GPa to 11.0 GPa, 7.0 GPa to 10.0 GPa, 7.8 to 11.8 GPa, 7.8 GPa to 11.0 GPa, or 7.8 GPa to 10.0 GPa.

[0026] In some embodiments, the composition (C) has a solubility of at least 6.8 kilojoules per square meter (kJ / m 2 "), at least 9.4kJ / m 2 , or at least 11.6 kJ / m 2 Additionally or alternatively, in some embodiments, the composition (C) has a notched impact strength of 16 kJ / m 2 Below, 15kJ / m 2 Below, 14kJ / m 2 Below, 13kJ / m 2In some embodiments, the composition (C) has a notched impact strength of 6.8 kJ / m or less. 2 ~16kJ / m 2、 6.8kJ / m 2 ~15kJ / m 2 , 6.8kJ / m 2 ~14kJ / m 2 , 6.8kJ / m 2 ~13kJ / m 2 , 9.4kJ / m 2 ~16kJ / m 2 , 9.4kJ / m 2 ~15kJ / m 2 , 9.4kJ / m 2 ~14kJ / m 2 , 9.4kJ / m 2 ~13kJ / m 2 , 11.6kJ / m 2 ~16kJ / m 2 , 11.6kJ / m 2 ~15kJ / m 2 , 11.6kJ / m 2 ~14kJ / m 2 , or 11.6 kJ / m 2 ~13kJ / m 2 It has a notched impact strength in the range of

[0027] In some embodiments, the composition (C) has a viscosity of at least 24 kJ / m 2 , at least 35 kJ / m 2 , or at least 49 kJ / m 2 Additionally or alternatively, in some embodiments, the composition (C) has an unnotched impact strength of 70 kJ / m 2 Below, 60kJ / m 2 or less, or 55kJ / m 2 In some embodiments, the composition (C) has an unnotched impact strength of 24 kJ / m or less. 2 ~70kJ / m 2 , 24kJ / m 2 ~60kJ / m 2 , 24kJ / m 2 ~55kJ / m 2 , 35kJ / m 2 ~70kJ / m2 , 35kJ / m 2 ~60kJ / m 2 , 35kJ / m 2 ~55kJ / m 2 , 49kJ / m 2 ~70kJ / m 2 , 49kJ / m 2 ~60kJ / m 2 , or 49 kJ / m 2 ~55kJ / m 2 It has an unnotched impact strength of

[0028] Tensile strength, tensile strain, tensile modulus, and notched and unnotched impact strength can be measured as described in the Examples.

[0029] thermoplastic polymer The term "thermoplastic" is intended to mean a polymer that softens when heated and hardens when cooled at room temperature, and that exists at room temperature below its glass transition temperature if completely amorphous, or below its melting point if semi-crystalline. Nevertheless, it is generally preferred that said polymers are semi-crystalline, i.e., have a well-defined melting point; preferred polymers have a heat of fusion (ΔH), as measured according to ASTM D3418, of at least 10 J / g, preferably at least 25 J / g, more preferably at least 30 J / g. f It is understood that the upper limit for the heat of fusion is not critical, but nevertheless, the aforementioned polymers will generally have a heat of fusion of at most 80 J / g, preferably at most 60 J / g, and more preferably at most 40 J / g.

[0030] According to the present invention, the thermoplastic polymer is selected from the group consisting of poly(arylene sulfide) (PAS), poly(aryl ether sulfone) (PAES), poly(aryl ether ketone) (PAEK), polyester (PE), polyamide (PA), and combinations thereof.

[0031] Poly(arylene sulfide) (PAS) According to one embodiment, the thermoplastic polymer is poly(arylene sulfide) (PAS).

[0032] As used herein, "poly(arylene sulfide) (PAS)" refers to a PAS having repeating units of the formula -(Ar-S)- (R PAS ), where Ar is an arylene group. The arylene group can be substituted or unsubstituted. Furthermore, poly(arylene sulfides) (PAS) can include any isomeric relationship of the sulfide linkages within the polymer; for example, when the arylene group is a phenylene group, the sulfide linkages can be ortho, meta, para, or combinations thereof.

[0033] In some embodiments, the poly(arylene sulfide) (PAS) comprises at least 5 mol%, at least 10 mol%, at least 20 mol%, at least 30 mol%, at least 40 mol%, at least 50 mol%, at least 60 mol%, at least 70 mol%, at least 80 mol%, at least 90 mol%, at least 95 mol%, at least 99 mol%, at least 99.5 mol%, or at least 99.9 mol% of repeat units (R PAS As used herein, mole % is based on the total moles of repeat units of the poly(arylene sulfide) (PAS).

[0034] Preferably, the poly(arylene sulfide) (PAS) is selected from the group consisting of poly(2,4-toluene sulfide), poly(4,4'-biphenylene sulfide), poly(para-phenylene sulfide), poly(ortho-phenylene sulfide), poly(meta-phenylene sulfide), poly(xylene sulfide), poly(ethyl isopropyl phenylene sulfide), poly(tetramethylphenylene sulfide), poly(butylcyclohexylphenylene sulfide), poly(hexyldodecylphenylene sulfide), poly(octadecylphenylene sulfide), poly(phenylphenylene sulfide), poly-(tolylphenylene sulfide), poly(benzylphenylene sulfide), and poly(octyl-4-(3-methylcyclopentyl)phenylene sulfide).

[0035] In one embodiment, the poly(arylene sulfide) (PAS) is poly(phenylene sulfide) (PPS) and has the formula (I): [ka] (In the formula, R 1 , R 2 , R 3 , and R 4 are equal to or different from each other and are hydrogen atoms or C1 to C 12 Alkyl groups, C7-C 24 Alkylaryl group, C7-C 24 Aralkyl groups, C6-C 24 Arylene groups, C1-C 12 Alkoxy groups and C6-C 18 The repeating unit (RPPS) may be a substituent selected from the group consisting of aryloxy groups.

[0036] Thus, in its broadest definition, the poly(phenylene sulfide) (PPS) of the present invention can be made from substituted and / or unsubstituted phenylene sulfide groups.

[0037] In one embodiment, the polyphenylene sulfide (PPS) has the following formula (II): [ka] The repeating unit (R PPS ), In particular, it is commercially available as RYTON® PPS from Solvay Specialty Polymers USA, LLC.

[0038] In some embodiments, the polyphenylene sulfide (PPS) comprises at least 50 mole % of repeat units (R PPS For example, at least about 60 mol%, at least about 70 mol%, at least about 80 mol%, at least about 90 mol%, at least about 95 mol%, at least about 99 mol% of the repeat units of the polyphenylene sulfide (PPS) comprise repeat units (R PPS )

[0039] According to one embodiment, composition (C) comprises a plurality of distinct poly(arylene sulfide) polymers, each poly(arylene sulfide) polymer comprising a distinct repeat unit (R PAS )

[0040] Poly(aryl ether sulfone) (PAES) According to one embodiment, the thermoplastic polymer is poly(aryl ether sulfone) (PAES).

[0041] As used herein, a "poly(aryl ether sulfone) (PAES)" refers to a poly(aryl ether sulfone) in which at least 50 mole percent of the repeating units are of formula (III): [ka] (In the formula: (i) each R is equal to or different from one another and is selected from halogen, alkyl, alkenyl, alkynyl, aryl, ether, thioether, carboxylic acid, ester, amide, imide, alkali or alkaline earth metal sulfonate, alkyl sulfonate, alkali or alkaline earth metal phosphonate, alkyl phosphonate, amine, and quaternary ammonium; (ii) each h is equal to or different from one another and is an integer ranging from 0 to 4; (iii) T is selected from the group consisting of a bond, a sulfone group [—S(═O)—], and a group —C(Rj)(Rk)—, where Rj and Rk are equal to or different from each other and are selected from hydrogen, halogen, alkyl, alkenyl, alkynyl, ether, thioether, carboxylic acid, ester, amide, imide, alkali or alkaline earth metal sulfonate, alkyl sulfonate, alkali or alkaline earth metal phosphonate, alkyl phosphonate, amine, and quaternary ammonium. PAES ) Rj and Rk are preferably methyl groups.

[0042] Preferably, at least 60 mol%, 70 mol%, 80 mol%, 90 mol%, 95 mol%, 99 mol%, and most preferably, all of the repeat units of the poly(aryl ether sulfone) (PAES) are repeat units of formula (III) (R PAES As used herein, mole % is based on the total moles of repeat units of poly(aryl ether sulfone) (PAES).

[0043] In one embodiment, the poly(aryl ether sulfone) (PAES) is poly(biphenyl ether sulfone). Poly(biphenyl ether sulfone) polymers are poly(aryl ether sulfones) containing biphenyl moieties. Poly(biphenyl ether sulfone), also known as polyphenylsulfone (PPSU), is formed, for example, by the condensation of 4,4'-dihydroxybiphenyl (biphenol) with 4,4'-dichlorodiphenyl sulfone.

[0044] As used herein, "poly(biphenyl ether sulfone) (PPSU)" refers to a polymer in which more than 50 mole % of the repeating units are repeating units of formula (III-A) (R PPSU ) means any polymer in which : [ka]

[0045] Preferably, at least 60 mol%, 70 mol%, 80 mol%, 90 mol%, 95 mol%, 99 mol%, and most preferably, all of the repeat units of the poly(biphenyl ether sulfone) (PPSU) are repeat units of formula (III-A).

[0046] Poly(biphenyl ether sulfone) (PPSU) can be prepared by known methods and is available, inter alia, as RADEL® PPSU from Solvay Specialty Polymers USA, LLC.

[0047] In one embodiment, the poly(aryl ether sulfone) (PAES) is a polyether sulfone (PES).

[0048] As used herein, “poly(ether sulfone) (PES)” means any polymer in which at least 50 mole % of the repeat units are repeat units of formula (III-B): [ka]

[0049] Preferably, at least 60 mol%, 70 mol%, 80 mol%, 90 mol%, 95 mol%, 99 mol%, and most preferably, all of the poly(ether sulfone) repeat units (PES) are repeat units of formula (III-B).

[0050] Poly(ether sulfone) (PES) can be prepared by known methods and is available, inter alia, as VERADEL® PESU from Solvay Specialty Polymers USA, LLC.

[0051] In one embodiment, the poly(aryl ether sulfone) (PAES) is polysulfone (PSU).

[0052] As used herein, "polysulfone (PSU)" means any polymer in which at least 50 mole % of the repeating units are repeating units of formula (III-C). [ka]

[0053] Preferably, at least 60 mol%, 70 mol%, 80 mol%, 90 mol%, 95 mol%, 99 mol%, and most preferably, all of the repeat units of the PSU are repeat units of formula (III-C).

[0054] Polysulfone (PSU) can be prepared by known methods and is available as UDEL® PSU from Solvay Specialty Polymers USA, LLC.

[0055] According to one embodiment, composition (C) comprises a plurality of distinct poly(aryl ether sulfone) polymers, the poly(aryl ether sulfone) polymers preferably being selected from the group consisting of polyphenylsulfone (PPSU), poly(ether sulfone) (PES), and polysulfone (PSU).

[0056] Poly(aryl ether ketone) (PAEK) According to one embodiment, the thermoplastic polymer is poly(aryl ether ketone) (PAEK).

[0057] As used herein, a "poly(aryl ether ketone) (PAEK)" refers to a polymer having more than 50 mole percent repeat units (R PAEK ), in which case the repeating unit (R PAEK ) includes the group Ar-C(O)-Ar', where Ar and Ar' are equal or different and are aromatic groups.

[0058] In some embodiments, the poly(aryl ether ketone) (PAEK) comprises at least 60 mol%, at least 70 mol%, at least 80 mol%, at least 90 mol%, at least 95 mol%, or at least 99 mol%, at least 99.5 mol%, or at least 99.9 mol% of repeat units (R PAEK As used herein, mole % is based on the total moles of repeat units of poly(aryl ether ketone) (PAEK).

[0059] In some embodiments, the repeating unit (R PAEK ) are herein represented by the following formulae (JA) to (JO): [ka] [ka] [ka] (In the formula: each -R' is equal to or different from one another and is selected from the group consisting of halogen, alkyl, alkenyl, alkynyl, aryl, ether, thioether, carboxylic acid, ester, amide, imide, alkali or alkaline earth metal sulfonate, alkyl sulfonate, alkali or alkaline earth metal phosphonate, alkyl phosphonate, amine, and quaternary ammonium; -j is an integer from 0 to 4.

[0060] Repeating unit (R PAEKIn R', each phenylene moiety may independently have a 1,2-, 1,4-, or 1,3-bond to other moieties in the repeat unit that are different from R'. Preferably, the phenylene moieties have a 1,3- or 1,4-bond, and more preferably, they have a 1,4-bond.

[0061] In some embodiments, the repeating unit (R PAEK ) is zero in each occurrence, i.e., the phenylene moiety has no other substituents other than those that allow for bonding in the main chain of the polymer.

[0062] Preferred repeating units (R PAEK ) are therefore selected herein from the following formulae (J'-A) to (J'-O): [ka] [ka]

[0063] In a preferred embodiment, the polyaryletherketone (PAEK) is polyetheretherketone (PEEK). In this embodiment, the polyetheretherketone (PEEK) comprises repeating units (R PEEK ), preferably having a repeating unit (R PEEK ) is represented by the formula (J'-A).

[0064] According to one embodiment, composition (C) comprises a plurality of distinct poly(aryl ether ketone) polymers, each poly(aryl ether ketone) polymer comprising a distinct repeat unit (R PAEK )

[0065] Polyester (PE) According to one embodiment, the thermoplastic polymer is polyester (PE).

[0066] As used herein, "polyester (PE)" refers to a polymer containing at least 50 mol %, preferably at least 85 mol %, of repeat units containing at least one ester moiety (generally described by the formula: R-(C=O)-OR'). Polyester (PE) is a polymer containing a cyclic monomer (M A ) to give a monomer (M) containing at least one hydroxyl group and at least one carboxylic acid group. B ) or by polycondensation of at least one monomer (M C ) and at least one monomer (M D As used herein, the term dicarboxylic acid is intended to include dicarboxylic acids and any derivatives of dicarboxylic acids, including halides, esters, half esters, salts, half salts, anhydrides, mixed anhydrides, or mixtures thereof, of these related acids.

[0067] In one embodiment, the polyester (PE) is selected from the group consisting of aromatic polyesters and polyalkylene esters.

[0068] Examples of aromatic polyesters include poly(isophthalate-terephthalate-resorcinol) ester, poly(isophthalate-terephthalate-bisphenol A) ester, poly[(isophthalate-terephthalate-resorcinol) ester-co-(isophthalate-terephthalate-bisphenol A)] ester, and combinations thereof.

[0069] The polyalkylene ester includes polyalkylene arylates, such as polyalkylene terephthalates and polyalkylene naphthalates. Examples of polyalkylene terephthalates include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polypropylene terephthalate (PPT). Examples of polyalkylene naphthalates include polyethylene naphthalate (PEN) and polybutylene naphthalate (PBN).

[0070] In one embodiment, the polyester (PE) comprises at least 50 mol%, preferably at least 60 mol%, more preferably at least 70 mol%, even more preferably at least 80 mol%, and most preferably at least 90 mol% of repeat units comprising at least one cycloaliphatic group in addition to at least one ester moiety. In one embodiment, the polyester (PE) consists essentially of repeat units comprising at least one ester moiety and at least one cycloaliphatic group. The cycloaliphatic group is formed by the addition of a monomer (M A ), monomer (M B ), monomer (M C ) or monomer (M D ) can be derived from

[0071] Monomer (M A Non-limiting examples of ) include lactide and caprolactone.

[0072] Monomer (M B Non-limiting examples of hydroxybenzoic acid include glycolic acid, 4-hydroxybenzoic acid, and 6-hydroxynaphthalene-2-carboxylic acid.

[0073] Monomer (M CNon-limiting examples of alkyl esters include 1,4-cyclohexanedimethanol, ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,10-decanediol, 2,2,4-trimethyl-1,3-pentanediol, 2,2,4,4-tetramethyl-1,3-cyclobutanediol, and neopentyl glycol, with 1,4-cyclohexanedimethanol and neopentyl glycol being preferred.

[0074] Monomer (M D Non-limiting examples of carboxylic acids include terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, succinic acid, sebacic acid, and adipic acid, with terephthalic acid and 1,4-cyclohexanedicarboxylic acid being preferred.

[0075] When polyester (PE) is a copolymer, the monomer (M C ) and (M D In such a case, the monomer (M C ) is preferably 1,4-cyclohexanedimethanol, and the monomer (M D ) is preferably a mixture of terephthalic acid and 1,6-naphthalenedicarboxylic acid.

[0076] When the polyester is a homopolymer, it may be selected from poly(cyclohexylene dimethylene terephthalate) (PCT) and poly(cyclohexylene dimethylene naphthalate) (PCN).

[0077] According to one embodiment, composition (C) comprises a plurality of distinct polyesters.

[0078] Polyamide (PA) According to one embodiment, the thermoplastic polymer is polyamide (PA).

[0079] As used herein, "polyamide (PA)" refers to a polyamide having repeating units (R PA ), which are typically derived from the polycondensation of at least one dicarboxylic acid component (or a derivative thereof) with at least one diamine component, and / or from the polycondensation of aminocarboxylic acids and / or lactams.

[0080] The expression "derivatives thereof" when used in combination with the expression "carboxylic acid" is intended to mean derivatives susceptible to reaction under polycondensation conditions to form amide bonds, such as acyl groups.

[0081] Preferably, the polyamide (PA) is selected from the group consisting of aliphatic, cycloaliphatic and semi-aromatic polyamides.

[0082] According to a preferred embodiment, the thermoplastic polymer is an aliphatic polyamide.

[0083] As used herein, an aliphatic polyamide is one that contains at least 50 mole percent repeat units R PA which has an amide bond (—NH—CO—) and does not contain any aromatic or alicyclic groups. In other words, both the formation of diamines and diacids by polycondensation involves the formation of repeating units (R PA ) does not contain any aromatic or alicyclic groups. In some embodiments, the aliphatic polyamides have at least 60 mol%, at least 70 mol%, at least 80 mol%, at least 90 mol%, at least 95 mol%, at least 95 mol%, at least 99 mol%, or at least 99.9 mol% of repeat units (R PA )

[0084] Preferably, the repeating unit (R PA ) is represented by the following formula (IV): [ka] (In the formula: R1-R4 are independently selected at each position from the group consisting of hydrogen, alkyl, aryl, alkali or alkaline earth metal sulfonate, alkyl sulfonate, and quaternary ammonium; p is an integer from 4 to 10; and p' is an integer of 4 to 12.

[0085] Preferably, R1 to R4 are hydrogen at each position. Preferably, p is 4 to 6. Preferably, p' is 6 to 12.

[0086] Preferably, the aliphatic polyamide is selected from the group consisting of PA4,6, PA5,6, PA5,10, PA6,10, PA10,10, and PA10,12. More preferably, the aliphatic polyamide is PA6,10.

[0087] Preferably, the aliphatic polyamide has an intrinsic viscosity of 0.7 to 1.4 deciliters / gram ("dL / g"), measured according to ASTM D5336.

[0088] According to one embodiment, composition (C) comprises a plurality of distinct aliphatic polyamides according to the above description, each aliphatic polyamide having a distinct repeating unit R PA It has.

[0089] According to one embodiment, composition (C) comprises a plurality of distinct thermoplastic polymers. Preferably, at least one of said distinct thermoplastic polymers is selected from the group consisting of aliphatic, cycloaliphatic and semi-aromatic polyamides. Even more preferably, at least one of said distinct thermoplastic polymers is an aliphatic polyamide.

[0090] According to one embodiment, composition (C) comprises one or more distinct polyamides, preferably one or more distinct aliphatic polyamides, and does not comprise any other thermoplastic polymer.

[0091] In some embodiments, composition (C) comprises the aforementioned thermoplastic polymer or the aforementioned plurality of distinct thermoplastic polymers in a concentration of at least 30 wt%, at least 40 wt%, at least 45 wt%, or at least 50 wt%, relative to the total weight of composition (C). Additionally or alternatively, in some embodiments, composition (C) comprises the aforementioned thermoplastic polymer or the aforementioned plurality of distinct thermoplastic polymers in a concentration of at most 80 wt%, at most 70 wt%, at most 65 wt%, or at most 60 wt%, relative to the total weight of composition (C). In some embodiments, the concentration of said thermoplastic polymer or said plurality of distinct thermoplastic polymers is 30% to 80% by weight, 30% to 70% by weight, 30% to 65% by weight, 30% to 60% by weight, 40% to 80% by weight, 40% to 70% by weight, 40% to 65% by weight, 40% to 60% by weight, 45% to 80% by weight, 45% to 70% by weight, 45% to 65% by weight, 45% to 60% by weight, 50% to 80% by weight, 50% to 70% by weight, 50% to 65% by weight, or 50% to 60% by weight, based on the total weight of composition (C).

[0092] In some embodiments, composition (C) comprises an aliphatic polyamide or multiple distinct aliphatic polyamides according to the above description in a concentration of at least 30 wt%, at least 40 wt%, at least 45 wt%, or at least 50 wt%, based on the total weight of composition (C). Additionally or alternatively, in some embodiments, composition (C) comprises an aliphatic polyamide or multiple distinct aliphatic polyamides according to the above description in a concentration of at most 80 wt%, at most 70 wt%, at most 65 wt%, or at most 60 wt%, based on the total weight of composition (C). In some embodiments, composition (C) according to the present invention comprises an aliphatic polyamide or a plurality of distinct aliphatic polyamides according to the above description in a concentration of 30 wt% to 80 wt%, 30 wt% to 70 wt%, 30 wt% to 65 wt%, 30 wt% to 60 wt%, 40 wt% to 80 wt%, 40 wt% to 70 wt%, 40 wt% to 65 wt%, 40 wt% to 60 wt%, 45 wt% to 80 wt%, 45 wt% to 70 wt%, 45 wt% to 65 wt%, 45 wt% to 60 wt%, 50 wt% to 80 wt%, 50 wt% to 70 wt%, 50 wt% to 65 wt%, or 50 wt% to 60 wt%, based on the total weight of composition (C).

[0093] Glass fiber Glass fibers are silica-based glass compounds containing several metal oxides that can be tailored to produce various types of glass. The primary oxide is silica in the form of silica sand, while other oxides, such as calcium, sodium, and aluminum, are incorporated to lower the melting temperature and prevent crystallization. Glass fibers can be added as endless fibers or chopped glass fibers. Glass fibers generally have an equivalent diameter of 5 to 20 μm, preferably 5 to 15 μm, and more preferably 5 to 10 μm. All glass fiber types, including A, C, D, E, M, R, S, and T glass fibers (described in Additives for Plastics Handbook, 2nd ed., John Murphy, chapter 5.2.3, pages 43-48), and any mixtures thereof, can be used.

[0094] E-, R-, S-, and T-glass fibers are well known in the art. They are described, inter alia, in Fiberglass and Glass Technology, Wallenberger, Frederick T.; Bingham, Paul A. (Eds.), 2010, XIV, chapter 5, pages 197-225. R-, S-, and T-glass fibers consist essentially of oxides of silicon, aluminum, and magnesium. In particular, these glass fibers typically contain 62-75 wt. % SiO2, 16-28 wt. % Al2O3, and 5-14 wt. % MgO. On the other hand, R-, S-, and T-glass fibers contain less than 10 wt. % CaO.

[0095] In some embodiments, the glass fiber is a high-modulus glass fiber. High-modulus glass fiber has a modulus of elasticity, measured according to ASTM D2343, of at least 76, preferably at least 78, more preferably at least 80, and most preferably at least 82 GPa. Examples of high-modulus glass fibers include, but are not limited to, S-, R-, and T-glass fibers. For example, commercially available high-modulus glass fibers are Taishan and AGY's S-1 and S-2 glass fibers, respectively.

[0096] In some embodiments, the glass fibers are low D k Glass fiber. Low D k The dielectric constant of the glass fiber is in the range of 4.0 to 5.5, 4.0 to 5.4, 4.0 to 5.3, 4.0 to 5.2, 4.0 to 5.1, or 4.0 to 5.0 at frequencies of 1 MHz, 600 MHz, 1 GHz, and 2.4 GHz. k Glass fiber has low D f (“Low D k / D f Such glass fibers have a D of 0.0005 to 0.001 at frequencies of 1 MHz, 1 GHz, 600 MHz, and 2.4 GHz. f Glass fiber D f and D kcan be measured according to ASTM D150 (1.0 MHz) and ASTM D2520 (600 MHz, 1.0 Ghz, and 2.4 GHz). In some embodiments, the glass fibers have high modulus and low D k It is glass fiber.

[0097] The morphology of the glass fiber is not particularly limited. The glass fiber can have a circular cross-section ("circular glass fiber") or a non-circular cross-section ("flat glass fiber"). The cross-section is taken in a plane perpendicular to the length of the glass fiber. A non-circular cross-section has a major dimension corresponding to the longest dimension of the cross-section and a minor dimension perpendicular to both the major dimension and the length of the glass fiber. A non-circular cross-section can be, but is not limited to, oval, elliptical, or rectangular.

[0098] In some embodiments where composition (C) comprises flat glass fibers, the major dimension of the non-circular cross-section is preferably at least 15 μm, more preferably at least 20 μm, even more preferably at least 22 μm, and most preferably at least 25 μm, preferably at most 40 μm, more preferably at most 35 μm, even more preferably at most 32 μm, and most preferably at most 30 μm. In some embodiments, the major dimension of the non-circular cross-section is in the range of 15 to 35 μm, preferably 20 to 30 μm, and more preferably 25 to 29 μm.

[0099] In some embodiments where composition (C) comprises flat glass fibers, the minor dimension of the non-circular cross-section is preferably at least 4 μm, more preferably at least 5 μm, even more preferably at least 6 μm, most preferably at least 7 μm, preferably at most 25 μm, more preferably at most 20 μm, even more preferably at most 17 μm, and most preferably at most 15 μm. In some embodiments, the minor dimension of the non-circular cross-section is in the range of 5 to 20 μm, preferably 5 to 15 μm, and more preferably 7 to 11 μm.

[0100] In some embodiments where composition (C) comprises flat glass fibers, the flat glass fibers preferably have an aspect ratio of at least 2, more preferably at least 2.2, even more preferably at least 2.4, and most preferably at least 3, preferably at most 8, more preferably at most 6, and even more preferably at most 4. In some embodiments, the flat glass fibers have an aspect ratio in the range of 2 to 6, preferably 2.2 to 4. The aspect ratio is defined as the ratio of the major dimension of the cross section of a flat glass fiber to the minor dimension of the same cross section. The aspect ratio can be measured according to ISO 1888.

[0101] In some embodiments in which composition (C) comprises round glass fibers, said round glass fibers preferably have an aspect ratio of less than 2, more preferably less than 1.5, even more preferably less than 1.2, even more preferably less than 1.1, and most preferably less than 1.05. Of course, those skilled in the art will understand that, regardless of the morphology of the glass fiber (e.g., round or flat), by definition, the aspect ratio cannot be less than 1.

[0102] In some embodiments, the composition (C) includes glass fibers at a concentration of at least 10 wt%, at least 15 wt%, at least 20 wt%, at least 25 wt%, or at least 30 wt%. Additionally or alternatively, in some embodiments, the composition (C) includes glass fibers at a concentration of at most 45 wt%, or at most 40 wt%, based on the total weight of the composition (C). In some embodiments, the concentration of the glass fibers is 10 wt% to 45 wt%, 10 wt% to 40 wt%, 15 wt% to 45 wt%, 15 wt% to 40 wt%, 20 wt% to 45 wt%, 20 wt% to 40 wt%, 25 wt% to 45 wt%, 25 wt% to 40 wt%, 30 wt% to 45 wt%, or 30 wt% to 40 wt%, based on the total weight of the composition (C).

[0103] hollow glass beads Hollow glass beads (also known as hollow glass microspheres or bubbles) are well known and are described, inter alia, in Plastics Additives Handbook, Hanser, 4th edition, pages 537-538.

[0104] In some embodiments, the hollow glass beads included in composition (C) have a crush strength of at least 16,000 psi, at least 18,000 psi, at least 20,000 psi, or at least 30,000 psi. Crush strength can be measured according to ASTM D3102-72. Preferably, the hollow glass beads have a crush strength of about 28,000 psi. Preferably, the hollow glass beads are iM30K glass bubbles available from 3M Specialty Materials Co.

[0105] In some embodiments, the hollow glass beads included in composition (C) have an average diameter of 5 to 50 μm, 10 to 40 μm, 15 to 30 μm, or 20 to 25 μm. Preferably, the hollow glass beads have an average diameter of about 18 μm. The average diameter can be measured by microscopy, preferably scanning electron microscopy (SEM).

[0106] In some embodiments, the hollow glass beads contained in composition (C) have a density of 0.2 to 1.5 g / cm 3 , 0.3~1.4g / cm 3 , 0.4~1.3g / cm 3 , 0.5~1.2g / cm 3 , 0.6~1.1g / cm 3 , 0.7~1.0g / cm 3 , or 0.8 to 0.9 g / cm 3 Preferably, the hollow glass beads have a density of about 0.65 g / cm 3 The density can be measured according to ASTM D2840-69.

[0107] In some embodiments, composition (C) comprises hollow glass beads at a concentration of at least 10 wt.%, or at least 12 wt.%, based on the total weight of composition (C). Additionally or alternatively, in some embodiments, composition (C) comprises hollow glass beads at a concentration of at most 25 wt.%, at most 22 wt.%, or at most 20 wt.%, based on the total weight of composition (C). In some embodiments, the concentration of hollow glass beads is 10 wt.% to 25 wt.%, 10 wt.% to 22 wt.%, 10 wt.% to 20 wt.%, 12 wt.% to 25 wt.%, 12 wt.% to 22 wt.%, or 12 wt.% to 20 wt.%, based on the total weight of composition (C).

[0108] Optional Additives In some embodiments, composition (C) according to the present invention comprises an additive selected from the group consisting of ultraviolet (“UV”) stabilizers, heat stabilizers, pigments, dyes, flame retardants, impact modifiers, lubricants, and any combination of one or more of these.

[0109] In some embodiments where composition (C) includes optional additives, the total concentration of the additives is 15 wt.% or less, 10 wt.% or less, 5 wt.% or less, 1 wt.% or less, 0.5 wt.% or less, 0.4 wt.% or less, 0.3 wt.% or less, 0.2 wt.% or less, or 0.1 wt.% or less.

[0110] method Composition (C) according to the present invention can be prepared using methods well known in the art.

[0111] For example, in one embodiment, composition (C) is made by melt blending a thermoplastic polymer, glass fibers, hollow glass beads, and any optional additives. Any suitable melt blending method can be used to combine the components of composition (C).

[0112] For example, in one embodiment, all of the components of composition (C) (i.e., the thermoplastic polymer, the glass fibers, the hollow glass beads, and any optional additives) are fed into a melt mixer, such as a single- or twin-screw extruder, a stirrer, a single- or twin-screw kneader, or a Banbury mixer. The components can be added to the melt mixer all at once, or they can be added gradually in batches. When the aforementioned components are added gradually in batches, a portion of the components is added first, then melt-mixed with the remaining portion of the components, and thereafter added until a properly mixed composition is obtained.

[0113] When the glass fibers exhibit a long physical form (eg, long glass fibers), stretch extrusion can be used to prepare the reinforced composition.

[0114] Portable electronic devices Due to its surprisingly improved dielectric performance and good mechanical performance, the above polymer composition (C) may desirably be incorporated into portable electronic device components.

[0115] The term "portable electronic device" is intended to mean an electronic device designed to be conveniently carried and used in a variety of locations. Representative examples of portable electronic devices may be selected from the group consisting of portable electronic telephones, personal digital assistants, laptop computers, tablet computers, radios, cameras and camera accessories, watches, calculators, music players, global positioning system receivers, portable game consoles, hard drives, and other electronic storage devices. Preferred portable electronic devices include laptop computers, tablet computers, portable electronic telephones, and watches.

[0116] Parts of portable electronic devices of interest herein include, but are not limited to, attachment parts, snap-fit ​​parts, inter-movable parts, functional elements, actuation elements, tracking elements, adjustment elements, carrier elements, frame elements, switches, connectors, cables, housings, and any other structural parts other than housings as used in portable electronic devices, such as speaker parts, etc. The aforementioned portable electronic device parts can be made by injection molding, extrusion molding, or other molding techniques, among others.

[0117] A "housing of a portable electronic device" refers to one or more of the back cover, front cover, antenna housing, frame, and / or skeleton of a portable electronic device. The housing can be a single item or can include two or more components. A "skeleton" refers to a structural component to which other components of the device, such as electronics, a microprocessor, a screen, a keyboard and keypad, an antenna, a battery socket, etc., are attached. The skeleton can be an internal component that is not visible or only partially visible from the exterior of the portable electronic device. The housing can provide protection for the internal components of the device from impact and contamination and / or damage by environmental agents (such as liquids, dust, etc.). Housing components, such as a cover, can also provide substantial or primary structural support for and impact protection for certain components exposed to the exterior of the device, such as the screen and / or antenna.

[0118] In a preferred embodiment, the housing of the portable electronic device is selected from the group consisting of a mobile phone housing, an antenna housing, a tablet housing, a laptop computer housing, a tablet computer housing or a watch housing.

[0119] The portable electronic device component can be made from the polymer composition using any suitable melt processing method. For example, the portable electronic device component can be made by injection molding or extrusion of the polymer composition. Injection molding is the preferred method.

[0120] The present invention will now be described with reference to the following examples, which are for illustrative purposes only and are not intended to limit the scope of the invention.

[0121] Experimental section material Radipol® DC40 is a PA 6,10 (aliphatic polyamide polymer) commercially available from Radici.

[0122] CS(HL)301HP is a low-D k / D f It is glass fiber.

[0123] iM160K and iM30k are hollow glass beads commercially available from 3M with crush strengths of 16,000 psi and 28,000 psi, respectively.

[0124] Calcium stearate is a lubricant commercially available from BASF.

[0125] Irganox® 1098 is a heat stabilizer commercially available from BASF.

[0126] method combination Mixtures containing Radipol® DC40, CS(HL)301HP, iM16K or iM30K, calcium stearate, and Irganox® were melt blended in the amounts set out in Table 1 below using a Coperion® ZSK-26 co-rotating twin-screw extruder (L / D ratio 48:1, 200 rpm, 13-18 kg / hr, and barrel temperature settings of 280°C, and die temperature settings of 245°C) and subsequently molded according to ASTM D3641 at melt temperatures of 240°C-260°C and mold temperatures of 90°C-120°C to form ten test specimens, namely, CE1, E2, E3, CE4-CE6, E7, CE8, E9, and CE10.

[0127] test D k and D f was measured according to ASTM D150 at 1 MHz. k and D f Measurements were made on injection molded discs measuring 50.8 mm in diameter and 4.0 mm thick.

[0128] Tensile modulus, tensile strength, and tensile strain were measured according to ISO 527-2 on five injection-molded ISO tensile bars (length 80±2 mm, width 10±0.2 mm, thickness 4±0.2 mm) using a test speed of 1 mm / min to measure tensile modulus, followed by tensile strength and tensile strain using a test speed of 5 mm / min.

[0129] Notched Izod impact strength was measured according to ISO180 on 10 injection molded ISO bars (length 80±2 mm, width 10±0.2 mm, thickness 4±0.2 mm).

[0130] Unnotched Izod impact strength was measured according to ISO180 on 10 injection molded ISO bars (length 80±2 mm, width 10±0.2 mm, thickness 4±0.2 mm).

[0131] result Table 1 shows the components and their amounts contained in test pieces CE1, E2, E3, CE4 to CE6, E7, CE8, E9, and CE10.

[0132] Table 1 also shows the ratio of the concentration of hollow glass beads to the total concentration of glass fibers and hollow glass beads in the test specimen (the "hollow glass bead concentration ratio"), which is expressed as follows:

number

[0133] Test pieces CE1, E2, E3, CE4, and CE5 each contained 50 wt % of glass fibers and hollow glass beads in total based on the total weight of the test piece.

[0134] Test pieces CE6, E7, and CE8 contained 40 wt % of glass fibers and hollow glass beads in total based on the total weight of the test piece.

[0135] Specimens E2, E3, CE4, CE5, E7, and CE8 contained iM30K as hollow glass beads.

[0136] Specimens E9 and CE10 contained iM16K as hollow glass beads.

[0137] As used herein, specimens labeled with an "E" are examples according to the present invention, and specimens labeled with a "CE" are counterexamples.

[0138] [Table 1]

[0139] Table 2 shows the results of the dielectric performance tests and mechanical performance tests carried out on the composition (C) of specimens CE1, E2 to E4, CE5 to CE7, E8, E9, CE10, E11, E12, and CE13.

[0140] [Table 2]

[0141] As is clear from Table 2, specimens E2, E3, E7, and E9, which are the subject of the present invention, have lower dielectric properties (i.e., lower D) than specimens CE1 and CE6, which do not contain hollow glass beads, and than specimens CE4, CE5, CE8, and CE10, which have a higher ratio of the concentration of hollow glass beads to the total concentration of glass fibers and hollow glass beads. k and D f) and mechanical properties.

[0142] Specimens CE1 and CE6 (without hollow glass beads) have excellent mechanical properties in terms of high tensile modulus, tensile strength, tensile strain, notched and unnotched impact strength, but exhibit poor dielectric properties (i.e., high D k and D f ).

[0143] Specimens CE4, CE5, CE8, and CE10 (high concentration ratio of hollow glass beads) were D k and D f It has sufficient dielectric properties in that it has low dielectric constant, but poor mechanical properties.

[0144] Specimens E2, E3, E7 and E9 (subject of the present invention) exhibited low D k and D f It exhibits sufficient mechanical properties and effectively addresses the appropriate balance of properties.

[0145] The tensile modulus, tensile strength, notched and unnotched impact strength decrease linearly with increasing hollow glass bead concentration ratio, whereas the tensile strain unexpectedly exhibits a plateau-like behavior as the hollow glass bead concentration ratio increases from 0.2 (specimen E2) to 0.4 (specimen E3). On the other hand, the tensile strain decreases linearly as the hollow glass bead concentration increases beyond the claimed ratio.

[0146] Further inventive concepts Concept of the Invention 1. A polymer composition [composition (C)], a thermoplastic polymer selected from the group consisting of poly(arylene sulfide) (PAS), poly(aryl ether sulfone) (PAES), poly(aryl ether ketone) (PAEK), polyamide (PA), and combinations thereof; -glass fiber, - hollow glass beads, a polymer composition [composition (C)] comprising A polymer composition [composition (C)], in which the ratio of the concentration of hollow glass beads to the total concentration of glass fibers and hollow glass beads is in the range of 0.2 to 0.6.

[0147] Inventive concept 2. Composition (C) of inventive concept (1), wherein the ratio of the concentration of hollow glass beads to the total concentration of glass fiber and hollow glass beads is in the range of 0.2 to 0.5, 0.2 to 0.45, 0.2 to 0.40, 0.25 to 0.6, 0.25 to 0.5, 0.25 to 0.45, or 0.25 to 0.40.

[0148] Inventive concept 3. Composition (C) of inventive concept (1) or (2), wherein the thermoplastic polymer is selected from the group consisting of aliphatic, alicyclic, and semi-aromatic polyamides, and the thermoplastic polymer is preferably an aliphatic polyamide.

[0149] Inventive concept 4. Composition (C) of inventive concept (3), wherein the polyamide comprises repeating units RPA represented by the following formula (IV): [ka] (In the formula: - R1 to R4 are independently selected at each position from the group consisting of hydrogen, alkyl, aryl, alkali or alkaline earth metal sulfonate, alkyl sulfonate, and quaternary ammonium; -p is an integer from 4 to 10, -p' is an integer from 4 to 12).

[0150] Inventive concept 5. Composition (C) of inventive concept (4), wherein the polyamide is selected from the group consisting of PA4,6, PA5,6, PA5,10, PA6,10, PA10,10, and PA10,12.

[0151] Inventive Concept 6. Composition (C) of any of the preceding inventive concepts, wherein the glass fiber has a dielectric constant of 4.0 to 5.5 at a frequency of 1 MHz.

[0152] Inventive Concept 7. Composition (C) of any of the preceding inventive concepts, wherein the hollow glass beads have a crush strength of at least 16,000 psi.

[0153] Inventive Concept 8. Composition (C) of any of the preceding inventive concepts, comprising hollow glass beads in a concentration of 10 to 35 wt %, preferably 10 to 30 wt %, more preferably 10 to 25 wt %, and even more preferably 10 to 20 wt %, based on the total weight of composition (C).

[0154] Inventive Concept 9. Composition (C) of any of the preceding inventive concepts, comprising glass fibers in a concentration of 10% to 45% by weight, 10% to 40% by weight, 15% to 45% by weight, 15% to 40% by weight, 20% to 45% by weight, 20% to 40% by weight, 25% to 45% by weight, 25% to 40% by weight, 30% to 45% by weight, or 30% to 40% by weight, based on the total weight of composition (C).

[0155] Inventive Concept 10. Composition (C) of any of the preceding inventive concepts, comprising a thermoplastic polymer in a concentration of 30 wt% to 80 wt%, 30 wt% to 70 wt%, 30 wt% to 65 wt%, 30 wt% to 60 wt%, 40 wt% to 80 wt%, 40 wt% to 70 wt%, 40 wt% to 65 wt%, 40 wt% to 60 wt%, 45 wt% to 80 wt%, 45 wt% to 70 wt%, 45 wt% to 65 wt%, 45 wt% to 60 wt%, 50 wt% to 80 wt%, 50 wt% to 70 wt%, 50 wt% to 65 wt%, or 50 wt% to 60 wt%, based on the total weight of composition (C).

[0156] Inventive Concept 11. Composition (C) of any of the preceding inventive concepts, wherein the composition has a tensile strain of at least 2.5%, preferably at least 2.6%, more preferably at least 2.8%.

[0157] Inventive concept 12. Composition (C) of any of the preceding inventive concepts, wherein the composition has a tensile strength of at least 80 MPa, preferably at least 85 MPa, more preferably at least 90 MPa.

[0158] Inventive Concept 13. Composition (C) of any of the preceding inventive concepts, wherein the composition has a tensile modulus of at least 6.5 GPa, preferably at least 7.0 GPa, more preferably at least 7.8 GPa.

[0159] Inventive Concept 14. Composition (C) of any of the preceding inventive concepts, wherein the composition has a dielectric constant at 1 MHz of 3.3 or less, preferably 3.2 or less, more preferably 3.1 or less, and / or a dielectric loss tangent at 1 MHz of 0.015 or less, preferably 0.012 or less, more preferably 0.010 or less.

[0160] Inventive concept 15. A portable electronic device part comprising a composition (C) according to any of the preceding claims, wherein the portable electronic device part is preferably a portable electronic device housing.

[0161] The above-described embodiments are intended to be illustrative, not limiting. Additional embodiments are within the concept of the invention. In addition, while the present invention has been described with reference to specific embodiments, those skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention. Any incorporation by reference of the above-described publications is limited to not incorporating subject matter contrary to the express disclosure herein.

Claims

1. a thermoplastic polymer which is a polyamide (PA) selected from the group consisting of PA4,6, PA5,6, PA5,10, PA6,10, PA10,10 and PA10,12, - glass fibres, - hollow glass beads, a polymer composition [composition (C)] comprising the ratio of the weight percent concentration of the hollow glass beads to the total weight percent concentration of the glass fibers and the hollow glass beads is in the range of 0.2 to 0.49; The glass fibers have a dielectric constant of 4.0 to 5.5 at a frequency of 1 MHz, and the hollow glass beads contained in composition (C) have a density of 0.2 to 1.5 g / cm 3 .

2. 2. The composition (C) according to claim 1, wherein the ratio of the weight percent concentration of the hollow glass beads to the total weight percent concentration of the glass fibers and the hollow glass beads is in the range of 0.2 to 0.

48.

3. 3. The composition (C) of claim 1 or 2, wherein the hollow glass beads have a crush strength of at least 16,000 psi.

4. The composition (C) according to any one of claims 1 to 3, comprising the hollow glass beads at a concentration of 10 to 25 wt% based on the total weight of the composition (C).

5. The composition (C) according to any one of claims 1 to 4, comprising the glass fibers in a concentration of 10 to 45 wt%, based on the total weight of the composition (C).

6. The composition (C) according to any one of claims 1 to 5, comprising the thermoplastic polymer in a concentration of 30 to 80 wt%, based on the total weight of the composition (C).

7. The composition (C) according to any one of claims 1 to 6, wherein the composition has a tensile strain of at least 2.5%.

8. Composition (C) according to any one of claims 1 to 7, wherein the composition has a tensile strength of at least 80 MPa.

9. Composition (C) according to any one of claims 1 to 8, wherein the composition has a tensile modulus of at least 6.5 GPa.

10. The composition (C) according to any one of claims 1 to 9, wherein the composition has a dielectric constant of 3.3 or less at 1 MHz and a dielectric loss tangent of 0.015 or less at 1 MHz.

11. A portable electronic device part comprising the composition (C) according to any one of claims 1 to 10.

12. A portable electronic device part comprising the composition (C) of claim 11, which is a portable electronic device housing.

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