Substrate processing apparatus and substrate processing method

Abstract

To provide a technique of suppressing the generation of defects when removing a peripheral edge part of a substrate.SOLUTION: A substrate processing apparatus comprises a holding part, a contact part, a movement part, and a power application part. The holding part holds a polymerization substrate. The polymerization substrate includes: a first substrate; a second substrate bonded to the first substrate; and a modified layer in a first division line which will divide the first substrate into a center part and a peripheral edge part. The contact part come into contact with the peripheral edge part of the first substrate from a side opposite to the second substrate. The movement part allows the contact part to relatively come into contact and separate with / from the peripheral edge part of the first substrate. The power application part applies a power directed to an outer side of the first division line to the peripheral edge part of the first substrate via the contact part in a state where the contact part is pressed against the peripheral edge part of the first substrate by the movement part.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] The substrate processing system described in Patent Document 1 includes a peripheral edge removing unit that removes peripheral edges of a target substrate in a laminated substrate formed by bonding a target substrate and a support substrate, and a grinding unit that grinds the exposed surface of the target substrate from which the peripheral edge has been removed by the peripheral edge removing unit. Patent Document 2 also describes the peripheral edge removing unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2019 / 013042 [Patent Document 2] International Publication No. 2020 / 105483 Summary of the Invention [Problem to be solved by the invention]

[0004] One aspect of the present disclosure provides a technique for suppressing the occurrence of defects when removing a peripheral edge portion of a substrate. [Means for solving the problem]

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes: The apparatus includes a holding unit that holds a laminated substrate having a first substrate and a second substrate bonded to the first substrate, the laminated substrate having a modified layer along a first dividing line along which the first substrate is to be divided into a central portion and a peripheral portion; a contact unit that contacts the peripheral portion of the first substrate from the side opposite the second substrate; a moving unit that moves the contact unit relatively toward and away from the peripheral portion of the first substrate; a force applying unit that applies a force toward the outside of the first dividing line to the peripheral portion of the first substrate via the contact unit while pressing the contact unit against the peripheral portion of the first substrate using the moving unit; a second rotating unit that rotates the laminated substrate by rotating the holding unit; and a control unit that controls the moving unit, the force applying unit, and the second rotating unit. The first substrate has an opposing surface facing the second substrate and an opposing surface facing away from the opposing surface. The contact unit includes a rotating roller having a rotation axis parallel to the opposing surface of the first substrate. The control unit repeatedly performs the following operations in a desired order: controlling the second rotation unit to rotate the overlapped substrate while the moving unit moves the contact portion away from the peripheral edge portion of the first substrate; and controlling the force application unit to apply the force to the peripheral edge portion of the first substrate while the second rotation unit stops the rotation of the overlapped substrate and the moving unit presses the contact portion against the peripheral edge portion of the first substrate. [Effects of the Invention]

[0006] According to one aspect of the present disclosure, it is possible to suppress the occurrence of defects when removing the peripheral edge portion of a substrate. [Brief explanation of the drawings]

[0007] [Figure 1]FIG. 1 is a plan view showing a laminated substrate to be processed in a substrate processing apparatus according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 3 is a cross-sectional view showing a substrate processing apparatus according to an embodiment. [Figure 4] FIG. 4 is a cross-sectional view showing an example of the operation of the rotating portion. [Figure 5] FIG. 5 is a cross-sectional view showing an example of the operation of the second moving part. [Figure 6] FIG. 6 is a cross-sectional view showing an example of the operation of the endless belt. [Figure 7] FIG. 7 is a plan view showing a first example of a rotating roller. [Figure 8] FIG. 8 is a plan view showing a second example of the rotating roller. [Figure 9] FIG. 9 is a cross-sectional view taken along the direction of arrow IX in FIG. [Figure 10] FIG. 10 is a plan view showing a third example of the rotating roller. [Figure 11] FIG. 11 is a plan view showing a fourth example of the rotating roller. [Figure 12] FIG. 12 is a plan view showing an example of a contact pad. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same reference numerals, and descriptions thereof may be omitted.

[0009] First, a laminated substrate T processed by a substrate processing apparatus according to one embodiment will be described with reference to Figures 1 and 2. As shown in Figure 2, the laminated substrate T has a first substrate W1 and a second substrate W2 bonded to the first substrate W1. The first substrate W1 and the second substrate W2 are, for example, silicon wafers, compound semiconductor wafers, or glass substrates.

[0010] The first substrate W1 has an opposing surface W1a facing the second substrate W2 and an opposite surface W1b facing away from the opposing surface W1a. For example, a first device layer D1 and a first bonding layer F1 are formed in this order on the opposing surface W1a of the first substrate W1. The first device layer D1 includes an electronic circuit. The first bonding layer F1 is, for example, an oxide layer, preferably a silicon oxide layer.

[0011] The oxide layer is formed by a thermal oxidation method, a CVD (Chemical Vapor Depositon) method, an ALD (Atomic Layer Deposition) method, etc. When forming a silicon oxide layer by a CVD method, TEOS (Tetra Ethoxy Silane) or the like is used as a raw material for the silicon oxide layer.

[0012] The second substrate W2 has an opposing surface W2a facing the first substrate W1 and an opposing surface W2b facing away from the opposing surface W2a. For example, a second device layer D2 and a second bonding layer F2 are formed in this order on the opposing surface W2a of the second substrate W2. The second device layer D2 includes an electronic circuit. The second bonding layer F2 is, for example, an oxide layer, preferably a silicon oxide layer.

[0013] The laminated substrate T has, for example, a first substrate W1, a first device layer D1, a first bonding layer F1, a second bonding layer F2, a second device layer D2, and a second substrate W2, in this order. Note that the laminated substrate T only needs to have at least the first substrate W1 and the second substrate W2. For example, the laminated substrate T does not necessarily have to have the second device layer D2.

[0014] In order to reduce the thickness of semiconductor devices, substrates such as silicon wafers are sometimes thinned. If a substrate is thinned while it has a bevel on its periphery, the periphery of the substrate takes on a knife-edge shape, making it prone to chipping. Therefore, techniques for removing the periphery of the substrate before thinning are being investigated.

[0015] As shown in Fig. 1, the laminated substrate T has a modified layer W13 (see Fig. 2) at a first dividing line L1 along which the first substrate W1 is to be divided into a central portion W11 and a peripheral portion W12. The peripheral portion W12 has a bevel. The peripheral portion W12 is annular in plan view. The width of the peripheral portion W12 (the distance between the outer and inner peripheries) in plan view is, for example, 0.5 mm to 3 mm.

[0016] The modified layer W13 (see FIG. 2) is formed, for example, by irradiating the first substrate W1 with a laser beam. The laser beam is formed, for example, by a YAG laser. A plurality of modified layers W13 are formed at intervals in the thickness direction and circumferential direction of the first substrate W1. Adjacent modified layers W13 may be connected by cracks formed during irradiation with the laser beam.

[0017] 5, by applying a force F to the peripheral portion W12 of the first substrate W1, a crack propagates from the modified layer W13, separating the peripheral portion W12 from the central portion W11, and removing the peripheral portion W12. The central portion W11 of the first substrate W1 remains bonded to the second substrate W2.

[0018] As shown in FIG. 2, the laminated substrate T may have a release layer W14. The release layer W14 reduces the bonding strength between the peripheral portion W12 of the first substrate W1 and the second substrate W2 compared to the bonding strength between the central portion W11 of the first substrate W1 and the second substrate W2. The release layer W14 is formed by irradiation with a laser beam. The laser beam is formed by, for example, a CO2 laser. By forming the release layer W14, the peripheral portion W12 can be easily removed.

[0019] The release layer W14 is formed, for example, in a ring shape at the interface between the peripheral edge portion W12 of the first substrate W1 and the first device layer D1. Note that the release layer W14 may be formed inside the laminated substrate T, for example, at the interface between the second substrate W2 and the second device layer D2 or the interface between the first bonding layer F1 and the second bonding layer F2.

[0020] As shown in Fig. 1, the laminated substrate T may have modified layers W13 (see Fig. 2) at a plurality of second division lines L2a-L2h along which the peripheral edge W12 of the first substrate W1 is to be divided into a plurality of fragments in the circumferential direction. The second division lines L2a-L2h are set radially. In this embodiment, the number of second division lines L2a-L2h is eight, but is not particularly limited as long as it is two or more.

[0021] By dividing the annular peripheral portion W12 into multiple pieces in the circumferential direction, the multiple pieces can be removed radially outward from the first substrate W1. This makes it easier to remove the peripheral portion W12 than when the annular peripheral portion W12 is removed in the thickness direction of the first substrate W1 without dividing it into multiple pieces in the circumferential direction.

[0022] Next, a substrate processing apparatus 1 according to one embodiment will be described mainly with reference to Figures 3 and 4. As shown in Figure 3, the substrate processing apparatus 1 includes a holding unit 10, a contact unit 20, a moving unit 30, and a force applying unit 40. The holding unit 10 holds the overlapped substrate T. For example, the holding unit 10 holds the first substrate W1 facing upward and the second substrate W2 horizontally from below.

[0023] The contact portion 20 is disposed on the opposite side of the holding portion 10 with respect to the laminated substrate T, and contacts the peripheral edge portion W12 of the first substrate W1 from the opposite side of the second substrate W2. For example, the contact portion 20 contacts the peripheral edge portion W12 of the first substrate W1 from above. It is preferable that the contact portion 20 contacts only the peripheral edge portion W12 and not the central portion W11 in order to tear the peripheral edge portion W12 and the central portion W11 apart.

[0024] The contact portion 20 includes, for example, a rotating roller 21. The rotating roller 21 contacts the first substrate W1 at its outer circumferential surface. To increase the frictional force between the rotating roller 21 and the first substrate W1, the outer circumferential surface of the rotating roller 21 may be made of rubber or resin. The outer circumferential surface of the rotating roller 21 may be a circumferential surface to reduce fluctuations in frictional force due to the rotation angle. The rotation axis 22 of the rotating roller 21 is arranged parallel to the opposite surface W1b of the first substrate W1.

[0025] The moving unit 30 moves the contact unit 20 relatively toward and away from the peripheral edge W12 of the first substrate W1. The moving unit 30, for example, raises and lowers the contact unit 20, but may also raise and lower the holding unit 10. The moving unit 30 includes, for example, a motor (not shown) and a ball screw that converts the rotational motion of the motor into linear motion. The moving unit 30 may also include a pneumatic cylinder.

[0026] With the contact portion 20 pressed against the peripheral edge W12 of the first substrate W1 by the moving portion 30, the force application portion 40 applies a force F (see FIG. 4) toward the outside of the first dividing line L1 to the peripheral edge W12 via the contact portion 20. By pressing the contact portion 20 against the peripheral edge W12, the frictional force can be increased, and a force F sufficient for dividing can be applied.

[0027] The force F acts in a direction toward the outside of the first parting line L1, tearing the peripheral edge portion W12 and the central portion W11 apart. The force F acts in a direction that separates the parting surfaces of the peripheral edge portion W12 and the central portion W11. By separating the parting surfaces, friction between the parting surfaces can be prevented, and the occurrence of defects such as chipping or shell cracks can be suppressed.

[0028] The force application unit 40 includes, for example, at least one of a rotation unit 41 and a second movement unit 42. As shown in Fig. 4, the rotation unit 41 rotates the rotation roller 21 in a direction (counterclockwise in Fig. 4) that applies a force F to the peripheral edge portion W12 of the first substrate W1. The rotation torque of the rotation roller 21 can tear the peripheral edge portion W12 and the central portion W11 apart.

[0029] As shown in FIG. 5, the second moving unit 42 moves the contact unit 20 in a direction (to the right in FIG. 5) that applies a force F to the peripheral edge portion W12 of the first substrate W1. The movement of the contact unit 20 can tear the peripheral edge portion W12 and the central portion W11 apart. Note that the force applying unit 40 may include, for example, both a rotating unit 41 and a second moving unit 42. Note that the force applying unit 40 only needs to include at least one of the rotating unit 41 and the second moving unit 42, and does not have to include both.

[0030] 6, the contact unit 20 may include a pair of rotating rollers 21 and an endless belt 23 wound around the pair of rotating rollers 21. The endless belt 23 is pressed against the first substrate W1. The endless belt 23 is made of, for example, resin or rubber. The rotating unit 41 rotates at least one rotating roller 21 to circulate the endless belt 23 and apply a force F to the peripheral edge W12 of the first substrate W1.

[0031] The substrate processing apparatus 1 may include a monitoring unit 50, as shown in FIG. 3. The monitoring unit 50 monitors whether the central portion W11 of the first substrate W1 and at least a portion of the peripheral portion W12 of the first substrate W1 have been separated. When the peripheral portion W12 is separated into multiple pieces for removal, all of the pieces can be reliably removed by confirming that one piece has been removed before removing another piece. The control unit 90 may notify the operator of the monitoring results of the monitoring unit 50. The monitoring unit 50 can also be used as a replacement timing detection unit that detects the timing for replacing consumable parts of the substrate processing apparatus 1.

[0032] The monitoring unit 50 includes a torque detection unit 51 that detects the rotational torque of the rotating roller 21, for example, generated by the rotating unit 41. If the center portion W11 and the peripheral portion W12 are not separated, the center portion W11 attempts to hold the peripheral portion W12 together against the rotation of the rotating roller 21, causing the torque of the rotating roller 21 to exceed a threshold value. If the center portion W11 and the peripheral portion W12 are separated, the center portion W11 does not hold the peripheral portion W12 together, causing the rotational torque of the rotating roller 21 to fall below a threshold value. Note that as the rotating roller 21 wears, even if the center portion W11 and the peripheral portion W12 are not separated, the rotating roller 21 will slip on the peripheral portion W12, causing the rotational torque to fall below a preset lower limit. The replacement timing detection unit may detect when the rotating roller 21 needs to be replaced by detecting that the rotational torque falls below a lower limit.

[0033] The monitoring unit 50 may include a load detection unit 52 that detects the load applied by the moving unit 30 to press the contact portion 20 against the peripheral portion W12 of the first substrate W1. The load detection unit 52 detects, for example, distortion caused by the load. If the central portion W11 and the peripheral portion W12 are not separated, the contact portion 20 abuts against the peripheral portion W12, and the peripheral portion W12 pushes back against the contact portion 20, so the load exceeds the threshold. If the central portion W11 and the peripheral portion W12 are separated, the contact portion 20 does not abut against the peripheral portion W12, and the peripheral portion W12 does not push back against the contact portion 20, so the rotation torque of the rotating roller 21 falls below the threshold. Note that as the rotating roller 21 wears, the load may fall below a preset lower limit or exceed a preset upper limit, even if the peripheral portion W12 pushes back against the rotating roller 21. The replacement timing detection unit may detect the timing to replace the rotating roller 21 by detecting whether the load falls below a preset lower limit or exceeds a preset upper limit.

[0034] The substrate processing apparatus 1 may include a second rotating unit 60. The second rotating unit 60 rotates the holder 10 to rotate the superposed substrate T. The superposed substrate T is rotated around the center of the superposed substrate T. By rotating the superposed substrate T, the contact position of the contact unit 20 on the peripheral edge W12 can be changed. This is effective when the number of contact units 20 is small.

[0035] In order to change the contact position of the contact portion 20 on the peripheral edge portion W12, the contact portion 20 may be moved along the peripheral edge portion W12 of the first substrate W1. However, the contact position of the contact portion 20 on the peripheral edge portion W12 can be changed more easily by rotating the overlapping substrate T than by moving the contact portion 20 along the peripheral edge portion W12 of the first substrate W1.

[0036] The substrate processing apparatus 1 may include a control unit 90. The control unit 90 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs that control various processes executed in the substrate processing apparatus 1. The control unit 90 controls the operation of the substrate processing apparatus 1 by causing the CPU 91 to execute the programs stored in the storage medium 92. The control unit 90 controls, for example, the moving unit 30, the force applying unit 40, and the second rotating unit 60.

[0037] For example, the control unit 90 repeatedly performs the following controls (A) and (B) in a desired order: (A) The second rotation unit 60 rotates the overlapped substrate T while the moving unit 30 separates the contact unit 20 from the peripheral edge W12 of the first substrate W1. (B) The force application unit 40 applies a force F to the peripheral edge W12 of the first substrate W1 while the second rotation unit 60 stops the rotation of the overlapped substrate T and the moving unit 30 presses the contact unit 20 against the peripheral edge W12 of the first substrate W1.

[0038] The control unit 90 performs the control (A) above to change the contact position of the contact unit 20 on the peripheral edge portion W12 of the first substrate W1. The contact positions are, for example, each of the second dividing lines L2a to L2h, as shown in Fig. 7. The control unit 90 performs the control (B) above while the moving unit 30 presses the contact unit 20 against each of the second dividing lines L2a to L2h. This allows the peripheral edge portion W12 and the central portion W11 to be divided by each of the second dividing lines L2a to L2h and the first dividing line L1.

[0039] When the control unit 90 repeatedly performs the above controls (A) and (B) in a desired order, the rotation of the superposed substrate T and the rotation of the rotating roller 21 (application of force F) are not performed simultaneously. In this case, as shown in Fig. 7, the rotation axis 22 of the rotating roller 21 may be arranged so as to be perpendicular to the radial direction of the first substrate W1. The force F can be applied to the peripheral edge portion W12 of the first substrate W1 in a direction perpendicular to the first parting line L1.

[0040] The control unit 90 may perform the following control (C) instead of performing the above controls (A) and (B). (C) With the contact unit 20 pressed against the peripheral edge W12 of the first substrate W1 by the movement unit 30, the force application unit 40 applies a force F to the peripheral edge W12 of the first substrate W1, while the second rotation unit 60 rotates the overlapped substrate T. The contact unit 20 can be brought into contact with the entire peripheral edge W12 in the circumferential direction (including each of the second parting lines L2a to L2h), and the force F can be applied to the entire peripheral edge W12 in the circumferential direction.

[0041] When the control unit 90 performs the control (C) above, the rotation of the superposed substrate T and the rotation of the rotating roller 21 (application of force F) are performed simultaneously. In this case, as shown in Fig. 8, the rotation shaft 22 of the rotating roller 21 may be disposed obliquely with respect to the radial direction of the first substrate W1. This allows the rotation of the superposed substrate T and the rotation of the rotating roller 21 to be performed smoothly.

[0042] 9, when the rotation of the superposed substrate T and the rotation of the rotating roller 21 (application of force F) are performed simultaneously, the rotation direction (arrow A1 direction) of the rotating roller 21 at the contact position with the superposed substrate T may be opposite to the rotation direction (arrow A2 direction) of the superposed substrate T when viewed from the axial direction of the rotation shaft 22. By rotating the rotating roller 21 against the rotation of the superposed substrate T, the force F can be increased.

[0043] 10, multiple contact portions 20 may be pressed simultaneously against multiple different locations on the peripheral edge portion W12 of the first substrate W1. For example, the multiple contact portions 20 may be arranged at intervals in the circumferential direction of the first substrate W1. Using the multiple contact portions 20, a force F can be applied simultaneously to multiple locations on the peripheral edge portion W12 of the first substrate W1. For example, the number of contact portions 20 may be the same as the number of second parting lines L2a to L2h, and the force F may be applied simultaneously to all of the second parting lines L2a to L2h. In this case, rotation of the laminated substrate T is not necessary, and the second rotating portion 60 is not required.

[0044] 11, a pair of contact portions 20 may be arranged point-symmetrically about the center of the first substrate W1. Using the pair of contact portions 20, a force F can be applied simultaneously to two locations on the peripheral edge portion W12 of the first substrate W1. If the number of contact portions 20 is smaller than the number of second parting lines L2a to L2h, the contact positions of the contact portions 20 on the peripheral edge portion W12 of the first substrate W1 may be changed by rotating the overlapped substrate T. Note that instead of rotating the overlapped substrate T, the pair of contact portions 20 may be rotated about the center of the first substrate W1.

[0045] As shown in FIG. 12, the contact portion 20 may include a plurality of arc-shaped pads 24 (for example, a pair). The pair of pads 24 are arranged along the first dividing line L1 on the outside of the first dividing line L1. The pads 24 are made of, for example, rubber or resin. The pair of pads 24 are arranged symmetrically around the center of the first substrate W1 and are moved in a direction away from the center of the first substrate W1. This allows a force F to be applied. The number of pads 24 is not limited to two and may be three or more.

[0046] Although not shown, the contact portion 20 may have a multi-layer structure and may further include a reinforcing plate that reinforces the pads 24. Multiple reinforcing plates are used corresponding to multiple pads. While the pads 24 contact the first substrate W1, the reinforcing plate does not contact the first substrate W1. Therefore, when viewed from above, the reinforcing plate may overlap the center portion W11 of the first substrate W1, unlike the pads 24.

[0047] Although the embodiments of the substrate processing apparatus and substrate processing method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure. [Explanation of symbols]

[0048] 1. Substrate processing equipment 10 Holding part 20 Contact area 30 Moving Part 40 Force application section L1 First dividing line T Polymer Substrate W1 First board W11 center part W12 periphery W13 modified layer W2 Second board

Claims

1. a holder for holding a laminated substrate, the laminated substrate having a first substrate and a second substrate bonded to the first substrate, the second substrate having a modified layer along a first dividing line along which the first substrate is to be divided into a central portion and a peripheral portion; a contact portion that contacts the peripheral edge portion of the first substrate from the side opposite to the second substrate; a moving unit that moves the contact unit relatively toward and away from the peripheral edge of the first substrate; a force application unit that applies a force toward an outside of the first dividing line to the peripheral edge portion of the first substrate via the contact unit while the contact unit is pressed against the peripheral edge portion of the first substrate by the moving unit; a second rotating unit that rotates the holding unit to rotate the laminated substrate; a control unit that controls the moving unit, the force applying unit, and the second rotating unit; Equipped with the first substrate has an opposing surface facing the second substrate and an opposite surface facing away from the opposing surface, the contact portion includes a rotating roller having a rotation axis parallel to the opposite surface of the first substrate. The control unit controls the second rotation unit to rotate the overlapped substrate while the moving unit moves the contact portion away from the peripheral edge portion of the first substrate, and controls the force application unit to apply the force to the peripheral edge portion of the first substrate while the second rotation unit stops the rotation of the overlapped substrate and the moving unit presses the contact portion against the peripheral edge portion of the first substrate, in a desired order.

2. the laminated substrate has a modified layer at a second dividing line along which the peripheral edge of the first substrate is to be divided into a plurality of fragments in a circumferential direction; The substrate processing apparatus according to claim 1 , wherein the control unit controls the force application unit to apply the force to the peripheral edge portion of the first substrate while the moving unit presses the contact portion against the second dividing line.

3. a holder for holding a laminated substrate, the laminated substrate having a first substrate and a second substrate bonded to the first substrate, the second substrate having a modified layer along a first dividing line along which the first substrate is to be divided into a central portion and a peripheral portion; a contact portion that contacts the peripheral edge portion of the first substrate from the side opposite to the second substrate; a moving unit that moves the contact unit relatively toward and away from the peripheral edge of the first substrate; a force application unit that applies a force toward an outside of the first dividing line to the peripheral edge portion of the first substrate via the contact unit while the contact unit is pressed against the peripheral edge portion of the first substrate by the moving unit; a second rotating unit that rotates the holding unit to rotate the laminated substrate; a control unit that controls the moving unit, the force applying unit, and the second rotating unit; Equipped with the first substrate has an opposing surface facing the second substrate and an opposite surface facing away from the opposing surface, the contact portion includes a rotating roller having a rotation axis parallel to the opposite surface of the first substrate. the control unit controls the second rotation unit to rotate the overlapped substrate while the force application unit applies the force to the peripheral edge portion of the first substrate in a state in which the movement unit presses the contact unit against the peripheral edge portion of the first substrate; the laminated substrate has a modified layer at a second dividing line along which the peripheral edge of the first substrate is to be divided into a plurality of fragments in a circumferential direction; The control unit controls the force application unit to apply the force to the peripheral edge portion of the first substrate while the movement unit presses the contact portion against the second dividing line.

4. a holder for holding a laminated substrate, the laminated substrate having a first substrate and a second substrate bonded to the first substrate, the second substrate having a modified layer along a first dividing line along which the first substrate is to be divided into a central portion and a peripheral portion; a contact portion that contacts the peripheral edge portion of the first substrate from the side opposite to the second substrate; a moving unit that moves the contact unit relatively toward and away from the peripheral edge of the first substrate; a force application unit that applies a force toward an outside of the first dividing line to the peripheral edge portion of the first substrate via the contact unit while the contact unit is pressed against the peripheral edge portion of the first substrate by the moving unit; Equipped with the first substrate has an opposing surface facing the second substrate and an opposite surface facing away from the opposing surface, the contact portion includes a rotating roller having a rotation axis parallel to the opposite surface of the first substrate. the contact portions are plural, and the plural contact portions are simultaneously pressed against different points on the peripheral edge portion of the first substrate; The force applying unit simultaneously applies the force to a plurality of different locations on the peripheral edge of the first substrate via a plurality of the contact units.

5. a holder for holding a laminated substrate, the laminated substrate having a first substrate and a second substrate bonded to the first substrate, the second substrate having a modified layer along a first dividing line along which the first substrate is to be divided into a central portion and a peripheral portion; a contact portion that contacts the peripheral edge portion of the first substrate from the side opposite to the second substrate; a moving unit that moves the contact unit relatively toward and away from the peripheral edge of the first substrate; a force application unit that applies a force toward an outside of the first dividing line to the peripheral edge portion of the first substrate via the contact unit while the contact unit is pressed against the peripheral edge portion of the first substrate by the moving unit; Equipped with the first substrate has an opposing surface facing the second substrate and an opposite surface facing away from the opposing surface, the contact portion includes a rotating roller having a rotation axis parallel to the opposite surface of the first substrate. a monitoring unit that monitors whether or not the central portion of the first substrate and at least a part of the peripheral edge portion of the first substrate have been separated, The monitoring unit includes a torque detection unit that detects a rotation torque of the rotating roller.

6. a holder for holding a laminated substrate, the laminated substrate having a first substrate and a second substrate bonded to the first substrate, the second substrate having a modified layer along a first dividing line along which the first substrate is to be divided into a central portion and a peripheral portion; a contact portion that contacts the peripheral edge portion of the first substrate from the side opposite to the second substrate; a moving unit that moves the contact unit relatively toward and away from the peripheral edge of the first substrate; a force application unit that applies a force toward an outside of the first dividing line to the peripheral edge portion of the first substrate via the contact unit while the contact unit is pressed against the peripheral edge portion of the first substrate by the moving unit; Equipped with the first substrate has an opposing surface facing the second substrate and an opposite surface facing away from the opposing surface, the contact portion includes a rotating roller having a rotation axis parallel to the opposite surface of the first substrate. a monitoring unit that monitors whether or not the central portion of the first substrate and at least a part of the peripheral edge portion of the first substrate have been separated, The monitoring unit includes a load detection unit that detects a load that presses the contact unit against the peripheral edge portion of the first substrate.

7. 7. The substrate processing apparatus according to claim 1, wherein the rotating roller has an outer circumferential surface that contacts the peripheral edge of the first substrate from an opposite side to the second substrate.

8. 8. The substrate processing apparatus according to claim 1, wherein the force applying section includes a rotating section that rotates the rotating roller in a direction that applies the force to the peripheral edge of the first substrate.

9. 9. The substrate processing apparatus according to claim 1, wherein the force application unit includes a second movement unit that moves the contact unit in a direction in which the force is applied to the peripheral edge of the first substrate.

10. preparing a laminated substrate having a first substrate and a second substrate bonded to the first substrate, the laminated substrate having a modified layer along a first dividing line along which the first substrate is to be divided into a central portion and a peripheral portion; bringing a contact portion into contact with the peripheral edge portion of the first substrate from an opposite side to the second substrate; applying a force toward an outside of the first dividing line to the peripheral edge of the first substrate via the contact portion while pressing the contact portion against the peripheral edge of the first substrate; and the first substrate has an opposing surface facing the second substrate and an opposite surface facing away from the opposing surface, the contact portion includes a rotating roller having a rotation axis parallel to the opposite surface of the first substrate, A substrate processing method, comprising: rotating the superposed substrate with the contact portion spaced apart from the peripheral edge portion of the first substrate; and applying the force to the peripheral edge portion of the first substrate via the contact portion while stopping the rotation of the superposed substrate and pressing the contact portion against the peripheral edge portion of the first substrate.

11. preparing a laminated substrate having a first substrate and a second substrate bonded to the first substrate, the laminated substrate having a modified layer along a first dividing line along which the first substrate is to be divided into a central portion and a peripheral portion; bringing a contact portion into contact with the peripheral edge portion of the first substrate from an opposite side to the second substrate; applying a force toward an outside of the first dividing line to the peripheral edge of the first substrate via the contact portion while pressing the contact portion against the peripheral edge of the first substrate; and the first substrate has an opposing surface facing the second substrate and an opposite surface facing away from the opposing surface, the contact portion includes a rotating roller having a rotation axis parallel to the opposite surface of the first substrate, the laminated substrate has a modified layer at a second dividing line along which the peripheral edge of the first substrate is to be divided into a plurality of fragments in a circumferential direction; a substrate processing method, wherein the force is applied to the peripheral edge portion of the first substrate via the contact portion while the contact portion is pressed against the second dividing line;

12. preparing a laminated substrate having a first substrate and a second substrate bonded to the first substrate, the laminated substrate having a modified layer along a first dividing line along which the first substrate is to be divided into a central portion and a peripheral portion; bringing a contact portion into contact with the peripheral edge portion of the first substrate from an opposite side to the second substrate; applying a force toward an outside of the first dividing line to the peripheral edge of the first substrate via the contact portion while pressing the contact portion against the peripheral edge of the first substrate; and the first substrate has an opposing surface facing the second substrate and an opposite surface facing away from the opposing surface, the contact portion includes a rotating roller having a rotation axis parallel to the opposite surface of the first substrate, the contact portions are plural, and the plural contact portions are simultaneously pressed against different points on the peripheral edge portion of the first substrate; a first substrate processing unit configured to process the first substrate in a predetermined manner, the first substrate being pressed against the first substrate by the first force, the first force being applied to the first substrate at a plurality of different positions on the peripheral edge of the first substrate via a plurality of the contact portions;

13. preparing a laminated substrate having a first substrate and a second substrate bonded to the first substrate, the laminated substrate having a modified layer along a first dividing line along which the first substrate is to be divided into a central portion and a peripheral portion; bringing a contact portion into contact with the peripheral edge portion of the first substrate from an opposite side to the second substrate; applying a force toward an outside of the first dividing line to the peripheral edge of the first substrate via the contact portion while pressing the contact portion against the peripheral edge of the first substrate; and the first substrate has an opposing surface facing the second substrate and an opposite surface facing away from the opposing surface, the contact portion includes a rotating roller having a rotation axis parallel to the opposite surface of the first substrate, A substrate processing method comprising monitoring whether the central portion of the first substrate and at least a portion of the peripheral edge portion of the first substrate have been separated by detecting a rotational torque of the rotating roller or by detecting a load pressing the contact portion against the peripheral edge portion of the first substrate.

14. 14. The substrate processing method according to claim 10, wherein the rotating roller has an outer circumferential surface that contacts the peripheral edge of the first substrate from an opposite side to the second substrate.

15. 15. The substrate processing method according to claim 10, further comprising: moving the contact portion in a direction in which the force is applied to the peripheral edge portion of the first substrate.

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