Semiconductor light-emitting device

Abstract

To provide a light emitting device capable of preventing the misalignment of a lead electrode during solder mounting and the like.SOLUTION: A light-emitting device includes: a lead electrode 12A and a lead electrode 12B; a resin frame that covers outer-side sections and an interstitial section of the lead electrodes 12A, 12B, and that has an opening section exposing the lead electrodes 12A, 12B; and an LED. A protruding section As provided on the lead electrode 12A is fitted in an enclosing section Bt provided on the lead electrode 12B, forming a nested structure. Hollowed sections s4, t4 are provided on the mutually facing adjacent sides s, t of the protruding section As and the enclosing section Bt, and a region surrounded by the hollowed section s4 and the hollowed section t4 is partially filled with a resin, forming an anchor column 11H.SELECTED DRAWING: Figure 6A

Description

[Technical Field]

[0001] The present invention relates to a semiconductor light emitting device, and more particularly to a semiconductor light emitting device in which a lead frame is used as an electrode on which a light emitting element is mounted. [Background technology]

[0002] Conventionally, semiconductor devices have been known in which a semiconductor element is encapsulated inside. Also well known are semiconductor light-emitting devices in which a semiconductor light-emitting element is mounted on a substrate and the semiconductor light-emitting element is hermetically sealed with a light-transmitting member such as resin or glass having a recess.

[0003] The surface-mounted light-emitting device of Patent Document 1 includes a light-emitting element, a first resin molding on which the light-emitting element is mounted, and a second resin molding covering the light-emitting element. The first resin molding is integrally molded including a first lead for mounting the light-emitting element and a second lead electrically connected to the light-emitting element.

[0004] By providing the first and second leads with irregularities, the contact area with the first resin molding body is increased, thereby preventing the first and second leads from coming off the first resin molding body (Patent Document 1 / paragraph 0110, Figure 4). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 4608294 Summary of the Invention [Problem to be solved by the invention]

[0006] However, since a single wire connects the electrode of the light-emitting element placed on the first lead to the second inner lead portion of the second lead, there was a problem in that the wire would break if the first lead and the second lead were to become misaligned in a direction away from each other.

[0007] The present invention has been made in view of the above circumstances, and has as its object to provide a semiconductor light emitting device that can prevent misalignment of lead electrodes during solder mounting or the like. [Means for solving the problem]

[0008] A semiconductor light emitting device according to an embodiment of the present invention comprises: a plurality of plate-shaped lead electrodes arranged side by side in a rectangular shape at predetermined intervals from each other; a frame body made of resin that covers outer sides of the plurality of lead electrodes and spaces between the plurality of lead electrodes and has openings that expose the plurality of lead electrodes; and light emitting elements mounted on the plurality of lead electrodes exposed from the openings, The plurality of lead terminals include one lead terminal having a first adjacent side with a convex portion provided at a portion spaced apart by the predetermined interval, and another lead terminal having a second adjacent side with a concave portion into which the convex portion of the first lead terminal fits, the first lead terminal and the other lead terminal forming a nested structure with the convex portion of the first lead terminal fitting into the concave portion of the other lead terminal, the first adjacent side and the second adjacent side having a recessed portion of a predetermined shape that spans both of the adjacent sides, and the area surrounded by the recessed portion of each of the first lead terminal and the other lead terminal being filled with a portion of the resin that forms the frame body. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view of a light emitting device according to a first embodiment of the present invention. [Figure 2] 1 is a top view of a light emitting device according to a first embodiment of the present invention. [Figure 3] FIG. 2 is a top view of the light emitting device with the covering member removed. [Figure 4] 3 is a cross-sectional view of the light emitting device of FIG. 2 taken along line AA. [Figure 5] FIG. 2 is a rear view of the light emitting device according to the first embodiment of the present invention. [Figure 6A] FIG. 2 is a top view of a lead frame of the light emitting device. [Figure 6B] FIG. 2 is a rear view of the lead frame of the light emitting device. [Figure 7] FIG. 6B is an enlarged view of region R in FIG. 6A. [Figure 8A] FIG. 6B is a cross-sectional view of the lead frame taken along line BB in FIG. 6A. [Figure 8B] FIG. 10 is a cross-sectional view of a flip-chip type light-emitting element (modified form). [Figure 9] 3 is a flowchart showing a method for manufacturing the light emitting device according to the first embodiment of the present invention. [Figure 10A] FIG. 10 is a top view showing step S11 of the manufacturing method. [Figure 10B] FIG. 10 is a top view showing step S12 of the manufacturing method. [Figure 10C] FIG. 10 is a top view showing step S13 of the manufacturing method. [Figure 10D] FIG. 10 is a top view showing step S14 of the manufacturing method. [Figure 10E] FIG. 10 is a top view showing step S15 of the manufacturing method. [Figure 11] FIG. 4 is a top view of a light emitting device according to a second embodiment of the present invention. [Figure 12] FIG. 4 is a rear view of the light emitting device according to the second embodiment of the present invention. [Figure 13] 12 is a cross-sectional view of the light emitting device of FIG. 11 taken along line CC. [Figure 14] FIG. 14 is an enlarged view of an area S in FIG. [Figure 15] 10 is a flowchart showing a method for manufacturing a light emitting device according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] In the following, preferred embodiments of the present invention will be described, but these may be modified and combined as appropriate. In the following description and accompanying drawings, substantially the same or equivalent parts will be denoted by the same reference numerals.

[0011] [First embodiment] Fig. 1 is a perspective view schematically showing a light emitting device 10 according to a first embodiment. Fig. 2 is a view showing the front side of the light emitting device 10. A three-axis coordinate system is added to each drawing to facilitate indicating corresponding directions between drawings. The Z-axis direction corresponds to the up-down direction of the light emitting device 10, and the X-axis and Y-axis directions correspond to the horizontal and vertical directions of the lead frame 12, respectively.

[0012] The light emitting device 10 of this embodiment is a semiconductor light emitting device that includes a substrate 15 consisting of a frame body 11 that forms the main body of the light emitting device 10 and a pair of lead frames 12, an opening 20 in the substrate 15 within which an LED (Light Emitting Diode) 28 that is a semiconductor light emitting element and a phosphor plate 14 are placed, and a reflective covering member 13 that surrounds the LED 28 and the phosphor plate 14.

[0013] 1, light emitting device 10 (semiconductor light emitting device) has a rectangular shape and is composed of substrate 15, which is made up of upper rectangular frame body 11 and lower lead frame 12. Covering member 13 is provided inside frame body 11, and phosphor plate 14 is exposed from approximately the center of covering member 13.

[0014] The frame 11 is formed on the lead frame 12 using a thermosetting resin. The frame 11 is formed from a silicone resin and / or an epoxy resin, and contains light-reflecting particles such as titanium oxide particles (hereinafter referred to as frame resin). It may also contain a light-absorbing material such as carbon black. The frame 11 has an opening 20, which is an inner region of the frame, and an LED 28, which is a semiconductor light-emitting device, is mounted in the opening 20 (below the phosphor plate 14).

[0015] Fig. 3 is a top view schematically showing the inside of the opening 20 with the covering member 13 removed from the top view of the light emitting device 10 shown in Fig. 2. Fig. 4 is a schematic cross-sectional view (free cross-sectional view) of a portion of the light emitting device 10 shown in Fig. 2 taken along line AA (dotted chain line).

[0016] The lead frame 12 is composed of a lead electrode 12A (first electrode) and a lead electrode 12B (second electrode), which are plate-shaped electrodes with a thickness of 0.2 to 0.3 mm. The lead electrodes 12A and 12B are made of copper (Cu), and their surfaces are plated with nickel (Ni) / gold (Au). The surface The notation Ni / Au indicates that Ni is the first layer and Au is the second layer. The lead electrodes 12A and 12B are arranged side by side on approximately the same plane, spaced apart from each other by a slit 39 (the "separating portion" of the present invention).

[0017] The LED 28 in this embodiment is a semiconductor light-emitting element that emits, for example, blue light, but may be another element such as a surface-emitting laser diode. More specifically, the lead electrode 12A is a cathode electrode, the lead electrode 12B is an anode electrode, and the n-electrode of the LED 28 is connected and placed on the lead electrode 12A, and the p-electrode of the LED 28 is connected to the lead electrode 12B with a bonding wire.

[0018] 4, a phosphor plate 14 is provided on the upper surface side of the LED 28. A portion of the blue light emitted upward from the LED 28 is wavelength-converted to, for example, yellow light when passing through the phosphor plate 14. As a result, the light emitted from the light emitting device 10 becomes white light, which is a mixture of the blue light that has not been wavelength-converted by the phosphor plate 14 and the yellow light that has passed through.

[0019] The phosphor plate 14 is not particularly limited, and various phosphors such as YAG (yttrium aluminum garnet), LuAG (lutetium aluminum garnet), GYAG (gadolinium aluminum garnet), α-sialon, β-sialon, SCASN, CASN, and KFS can be used as appropriate. The phosphor plate 14 may also be an optical element such as translucent glass or a light distribution control plate. In this case, the light emitted from the light emitting device 10 has the color of the light emitted by the LED 28.

[0020] In the opening 20 of the frame 11, the space around the LEDs 28 and the phosphor plate 14 is filled with a covering member 13, which is a sealing resin or a coating resin. The surface (top surface) of the phosphor plate 14 is exposed from the covering member 13. An example of the covering member 13 is a light-reflective resin in which titanium oxide particles or the like are contained in a silicone resin, but the present invention is not limited to this.

[0021] An LED 28 and a protection element 41, which is a Zener diode, are provided on the lead electrodes 12A and 12B exposed from the opening 20. The protection element 41 may be any element that can prevent an overcurrent from flowing through the LED 28, and may be a varistor, a capacitor, a resistor, a light-receiving element, or the like.

[0022] 3, anchor posts 11H are provided in positions symmetrical with respect to a center line extending in the Y-axis direction (the "direction of juxtaposition of lead electrodes" according to the present invention) within opening 20 of frame body 11. The anchor posts 11H are formed as columnar resin bodies by filling regions formed by arranging oppositely recessed portions provided on the outer peripheries of lead terminals 12A and 12B with frame resin (details will be described later).

[0023] 3 and 4, the substrate 15 has an opening 20 defined by the frame 11 and the lead electrodes 12A and 12B, and the opening 20 has the shape of an inverted truncated quadrangular pyramid with a rectangular base. Inside the substrate 15, an LED 28 is mounted on the lead electrode 12A, and a phosphor plate 14 is placed on the LED 28. The LED 28 and phosphor plate 14 are surrounded by a covering member 13.

[0024] The upper surface end of the lead frame 12 is filled with a frame resin. The rear surface end of each of the lead terminals 12A and 12B (only the right side in FIG. 4) has a step formed by half-etching (details will be described later). In this specification, the "rear surface side" of the lead terminals 12A and 12B refers to the lower surface side.

[0025] Next, the lead frame 12 will be described in detail. Fig. 5 is a diagram showing the back surface side of the light emitting device 10. Fig. 6A is a diagram showing the top surface side of the lead frame 12, and Fig. 6B is a diagram showing the bottom surface side. Fig. 7 is an enlarged view of a region R surrounded by a dashed line in Fig. 6A.

[0026] The lead frame 12 is composed of a lead electrode 12A (the "first lead electrode" of the present invention) and a lead electrode 12B (the "other lead electrode" of the present invention). , lead electrode 12A and lead electrode 12B The region between them is the slit 39. The width of the slit 39 (the gap in the X-axis direction and the gap in the Y-axis direction) is equal to the thickness of the lead terminals 12A and 12B, and is, for example, about 0.2 to 0.3 mm.

[0027] 5 and 6A, the lead electrode 12A has a protruding portion As (the "convex portion" of the present invention) and the lead electrode 12B has an enclosed portion Bt (the "concave portion" of the present invention) on either side of the slit 39. The protruding portion As is fitted into the enclosed portion Bt to form a nested structure.

[0028] Specifically, the first adjacent side s on the side of the lead electrode 12A adjacent to the lead electrode 12B is defined by two base sides s1 that reach the base of the protrusion As that protrudes from the outside of the lead electrode 12A toward the lead electrode 12B, a top side s2 that forms the top of the protrusion As, and two protrusion sides s3 that connect the base side s1 and the top side s2.

[0029] In addition, the second adjacent side t on the side of the lead electrode 12B adjacent to the lead electrode 12A is defined by two base upper sides t1 that extend from the outside of the lead electrode 12B to the edge of the containing portion Bt that contains the protrusion As of the lead electrode 12A, a bottom side t2 that forms the bottom of the containing portion Bt, and two containing sides t3 that connect the base upper side t1 and the bottom side t2.

[0030] It is preferable that the protruding side s3 and the inclusive side t3 are parallel to the line BB, which is the center line, because this makes the external stress acting on the lead terminals 12A and 12B equivalent. In addition, the base side s1 and the top side s2, and the bottom side t2 and the base top side t1, are perpendicular to the line BB, which makes it easier to form the lead terminals 12A and 12B.

[0031] The shapes of the protrusion As of the lead electrode 12A and the included portion Bt of the lead electrode 12B are not limited to a rectangle, but may include a trapezoid or a partial circle, but it is essential that each side constituting the protrusion As and the included portion Bt extend in the Y-axis (long axis) direction.

[0032] A frame resin is filled in the slit 39. A pair of anchor posts 11H (broken line portions) are provided in the slit 39 symmetrically with respect to line BB, which is a center line extending in the direction in which the lead electrodes 12A and 12B are arranged side by side (Y-axis direction).

[0033] The anchor post 11H is a columnar resin body surrounded by opposing recessed portions s4, t4 provided on the protruding side s3 and the containing side t3 of each of the lead electrodes 12A, 12B. The anchor post 11H arranged in this manner can fix the positions of both the lead electrodes 12A and 12B. Note that it is sufficient to provide one or more pairs of anchor posts 11H, and multiple anchor posts 11H may be provided symmetrically or asymmetrically.

[0034] 6A shows the front surface side of the lead frame 12 (lead electrodes 12A and 12B). and 12B X-axis spacing (slit width) Lead electrodes 12A and 12B The intervals (slit widths) in the Y-axis direction are equal. In addition, the recessed portions s4 and t4 provided on the adjacent sides s and t of the lead terminal 12A and the lead terminal 12B are arranged opposite each other, and the anchor post 11H is formed in the area surrounded by the recessed portions s4 and t4 by the filled frame resin.

[0035] 6B shows the back surface side of the lead frame 12. As shown in the figure, the protruding portion As of the lead electrode 12A and the included portion Bt of the lead electrode 12B have step portions 12M, 12N formed by thinning the thickness of the lead frame 12 along their peripheries (the entire slit 39). The step portions 12M and 12N form grooves that are recessed on the back surface side, and the grooves (12M and 12N) are also filled with frame resin (see FIG. 4).

[0036] 7, in the portion forming the circular anchor post 11H consisting of the recessed portions s4 and t4, the line width of the straight portion (the gap in the X-axis direction) is H1, and the lengths from the straight line to the ends of the circle are H2 and H3. It is preferable that the relationship H1≦H2≈H3 holds. This allows the filled frame resin to integrate the lead terminals 12A and 12B via the anchor post 11H, preventing misalignment.

[0037] Specifically, when a force acts on the lead terminal 12A in the vertical direction (Y-axis direction) to pull it out, a similar force acts on the lead terminal 12B via the anchor post 11H. That is, even if a force acts on one lead terminal (12A or 12B), the force also acts on the other lead terminal (12A or 12B), so one lead terminal will not easily come out. Furthermore, because the anchor post 11H is integrated with both lead terminals (12A and 12B), only one lead terminal (12A or 12B) will not come out. If the anchor post 11H is circular, this is preferable because the force acting from the lead terminal (12A or 12B) to the anchor post 11H is dispersed.

[0038] 8A is a cross-sectional view of the lead frame 12 in FIG. 6A taken along line BB (dash line) near slit 39. LED 28 is mounted on lead electrode 12A via a bonding member 40. LED 28 is connected to lead electrode 12B using two bonding wires 43A (see FIG. 3) via bump 45 provided on the p-electrode of LED 28. Lead electrodes 12A and 12B are the cathode and anode, respectively, of light emitting device 10, and an applied voltage is supplied from outside light emitting device 10.

[0039] 8B shows a cross-sectional view of a light-emitting element that is a flip-chip type (modified form). As shown in the figure, LED 29 is mounted so as to straddle lead terminal 12A and lead terminal 12B via lower electrode 29A. The size and depth of steps 12M and 12N are the same as those of light-emitting device 10 in FIG. 8A, but slit 39 has a narrower width. In the case of a flip-chip type, providing anchor post 11H as described above can prevent misalignment between lead terminal 12A and lead terminal 12B, thereby preventing breakage of the bonding portion.

[0040] (Manufacturing method) The method for manufacturing the light emitting device 10 will be described in detail below with reference to a flowchart and drawings.

[0041] Fig. 9 is a flowchart showing a method for manufacturing the light emitting device 10. Fig. 10A to Fig. 10E are top views showing each step. The method for manufacturing the light emitting device 10 will be described below with reference to Fig. 10A to Fig. 10E.

[0042] Step S11 is a process of half-etching, punching, and plating the lead frame. As shown in Fig. 10A, the lead frame 12 has a plurality of unit sections 12U arranged in a matrix. More specifically, the lead frame 12 is divided into a plurality of unit sections 12U by vertical dicing lines 51 and horizontal dicing lines 52 (both indicated by dashed lines) arranged at equal intervals in the X-axis direction and the Y-axis direction. Each unit section 12U corresponds to the lead frame 12 of one light emitting device 10.

[0043] To prepare such a lead frame 12, first, the back side of the copper plate that will become the lead frame 12 is half-etched to a predetermined width and depth to form step portions 12M, 12N (see FIG. 6B or FIG. 8A). Next, pressing is performed to form slits 39 and notches 12K. Providing a large number of notches 12K in the lead frame 12 facilitates the singulation (dicing) process, which will be described later. Thereafter, Ni / Au plating is applied to the front and back surfaces of the lead frame 12.

[0044] Step S12 is a frame resin insert molding process. As shown in FIG. 10B, the frame resin is insert molded to form a molded resin body 11F. More specifically, the lead frame 12 is sandwiched between an upper mold and a lower mold, and a thermosetting resin made of a silicone resin containing titanium oxide particles is injected to form the molded resin body 11F. The molded resin body 11F is filled into the openings 20, slits 39, and cutouts 12K in the inner region of the frame body 11, corresponding to each unit section 12U.

[0045] Step S13 is a die bonding, wire bonding, and phosphor plate bonding process. As shown in FIG. 10C, the LED 28 (located on the underside of the phosphor plate 14) is mounted (die bonding) on ​​the lead electrode 12A using a bonding member 40 (a gold-tin (AuSn) alloy in this embodiment). Similarly, the protective element 41 is also bonded to the lead electrode 12B. Thereafter, the LED 28 and the protective element 41 are wire bonded to the lead electrode 12B and the lead electrode 12A provided on the upper surfaces thereof, respectively, using gold wires.

[0046] Next, the phosphor plate 14 is adhered onto the LED 28 using a light-transmitting silicone adhesive, and the LED 28, phosphor plate 14, and protective element 41 are placed inside the opening 20.

[0047] Step S14 is a coating material filling and curing step. As shown in Fig. 10D, the opening 20 of the frame 11 is covered with a light-reflective silicone resin containing titanium oxide particles so that the surface of the phosphor plate 14 is exposed, and the resin is heated and cured to form the coating material 13.

[0048] Step S15 is a dicing step. As shown in Fig. 10E, dicing is performed along vertical dicing lines 51 and horizontal dicing lines 52. That is, molded resin body 11F is cut and separated into individual light emitting devices 10.

[0049] Step S16 is a power-on check step. Finally, electrical characteristics tests such as a power-on check are performed on each light-emitting device 10. Through the steps described above, the manufacture of the light-emitting device 10 is completed.

[0050] [Second embodiment] Next, a light emitting device 60 according to a second embodiment of the present invention will be described. The same components as those in the first embodiment are denoted by the same reference numerals. The structure and manufacturing method of the second embodiment are substantially the same as those in the first embodiment, so only the differences will be described.

[0051] Fig. 11 is a top view of light emitting device 60. Fig. 12 is a rear view (bottom view) of light emitting device 60, and Fig. 13 is a cross-sectional view (free cross-sectional view) taken along line CC (chain line) of light emitting device 60 in Fig. 11.

[0052] The light emitting device 60 of the second embodiment differs from the light emitting device 10 of the first embodiment only in the structure of the boundary layer at the portion where the lead electrode 12C (first electrode) and the lead electrode 12D (second electrode) contact the frame body 11. Therefore, the visible portion in the top view of Fig. 11 and the rear view of Fig. 12, as well as the arrangement of the LED 28, protective element 41, and phosphor plate 14 placed in the opening 20, are the same as those of the first embodiment.

[0053] FIG. 14 is an enlarged view of region S in FIG.

[0054] Similar to the lead electrodes 12A and 12B (see FIGS. 4 and 6B), the protruding portion As of the lead electrode 12C and the included portion Bt of the lead electrode 12D have stepped portions 12M and 12N formed by half-etching along their peripheries (the entire slit 39). In addition, grooves (12M and 12N) consisting of the stepped portions 12M and 12N are formed.

[0055] Furthermore, in the light emitting device 60 of the second embodiment, a metal oxide film M, which is a copper oxide film, is provided at the interface between the frame resin and the lead frame 12. The metal oxide film M is an oxide film that continues from the copper material that is the core material of the lead electrodes 12C, 12D, and is integrated with them. This not only improves the fixing effect of the lead frame 12 by the anchor posts 11H, but also improves the adhesive strength between the lead frame 12 and the frame resin, resulting in a substrate 15 that is highly strong against external stress when the frame resin and lead frame 12 are integrated.

[0056] (Manufacturing method) The method for manufacturing the light emitting device 60 will be described in detail below with reference to a flowchart.

[0057] FIG. 15 is a flowchart showing a method for manufacturing the light emitting device 60.

[0058] Step S21 is a process of half-etching, punching, and oxidizing the lead frame. First, the back surface of the copper plate that will become the lead frame 12 is half-etched to a predetermined width and depth to form step portions 12M and 12N (see FIG. 14). Next, punching (pressing) is performed using a press molding machine to form slits 39 and cutout portions 12K.

[0059] Next, an oxidation treatment is performed on the surfaces (upper, lower, and side surfaces) of the punched lead frame 12. Specifically, the punched surface of the lead frame 12 is oxidized in an oxygen and nitrogen gas atmosphere (150°C, 5 minutes) to form a metal oxide film M.

[0060] Step S22 is a frame resin insert molding step, which is the same as the frame resin insert molding step of step S12 in the first embodiment, except that the lead frame 12 provided with the metal oxide film M is used.

[0061] Step S23 is a Ni / Au plating process for the exposed surface. The metal oxide film M made of copper oxide on the surface of the lead frame 12 exposed from the frame 11 of the substrate 15 formed in step S22 is removed using an acid aqueous solution. Next, a Ni / Au layer is formed on the removed portion of the lead frame 12 by electrolytic plating. Note that the metal oxide film M present at the interface between the frame resin and the lead frame 12 remains as it is (see FIG. 14).

[0062] Next, the following steps are carried out, but since they are the same as the manufacturing method of the first embodiment (FIG. 9: steps S13 to S16), detailed explanations will be omitted. Step S24: Die bonding, wire bonding, and phosphor plate adhesion process Step S25: Coating material filling and hardening process Step S26: Dicing process Step S27: Power check process

[0063] The above steps complete the manufacture of the light emitting device 60. As described above, according to the present invention, it is possible to provide a method for manufacturing a light emitting device that can prevent misalignment of the lead electrodes during solder mounting, etc.

[0064] Although the embodiments of the present invention have been described, the present invention is not limited to the above-described embodiments and modifications, and can be embodied in various forms without departing from the spirit of the present invention.

[0065] For example, although the anchor post 11H is illustrated as being circular, it may have an arc shape such as an elliptical cylinder (long cylinder), or a rectangular or polygonal pillar shape such as a square pillar or a hexagonal pillar. A plurality of anchor posts may also be provided in the vertical (Y direction) slit 39. The thickness of the lead frame 12 and the values ​​of the processing temperature in the manufacturing method described above are merely examples and may be changed as appropriate. [Explanation of symbols]

[0066] 10...light-emitting device, 11...frame body, 11H...anchor post, 12...lead frame, 12A, 12B, 12C, 12D...lead electrode, 12K...notch portion, 12M, 12N...step portion, 12U...unit section, 13...covering member, 14...phosphor plate, 15...substrate, 20...opening, 28, 29...LED, 29A...lower electrode, 39...slit, 40...bonding member, 41...protective element, 43A...bonding wire, 45...bump, 51...vertical dicing line, 52...horizontal dicing line.

Claims

1. a plurality of plate-shaped lead electrodes arranged in a rectangular shape at predetermined intervals; a resin frame covering outer portions of the lead terminals and spaces between the lead terminals and having openings through which the lead terminals are exposed; a light emitting element mounted on the plurality of lead electrodes exposed from the opening, the plurality of lead terminals include one lead terminal having a first adjacent side on which a convex portion is provided at a portion spaced apart at the predetermined interval, and another lead terminal having a second adjacent side on which a concave portion into which the convex portion of the one lead terminal fits, the first lead terminal and the second lead terminal have a nested structure in which the convex portion of the first lead terminal is fitted into the concave portion of the second lead terminal, the convex portion is defined by a top side forming the top of the nested structure, two base sides reaching the base of the convex portion, and two protruding sides connecting the top side, the concave portion is defined by a bottom side that forms a bottom of an inclusion portion that inclusions the convex portion, and two inclusion sides that connect two base sides of the concave portion to the bottom side, Each of the two protruding edges and the two inclusive edges is provided with at least a pair of recessed portions of a predetermined shape that straddle both the protruding edge and an edge adjacent to the respective inclusive edge and are arranged opposite each other; a resin body including a columnar resin body portion in a region surrounded by the pair of recessed portions, the columnar resin body portion being filled with a part of the resin forming the frame body, in a spaced portion between the one lead terminal and the other lead terminal; In the pair of cutout portions, a distance from an imaginary line at an end of a portion of the protruding side where the cutout portion is not provided to an imaginary line passing through the end of the cutout portion is substantially the same as a distance from an imaginary line at an end of a portion of the including side where the cutout portion is not provided to an imaginary line passing through the end of the cutout portion, A semiconductor light-emitting device, wherein the top edge, the base edge, the protruding edge, the bottom edge, the base upper edge and the inclusive edge have step portions formed along each edge on the back surface side in at least an area other than the hollowed portion within the separation portion, and the resin is filled in the step portions.

2. 2. The semiconductor light emitting device according to claim 1, wherein the recesses are provided at positions symmetrical with respect to a center line of the frame extending in a direction in which the one lead electrode and the other lead electrode are juxtaposed.

3. 3. The semiconductor light emitting device according to claim 1, further comprising a covering member filled in said opening so as to cover the periphery of said light emitting element.

4. 4. The semiconductor light emitting device according to claim 1, wherein said light emitting element comprises a light emitting diode and an optical member mounted on said light emitting diode.

5. A semiconductor light-emitting device as described in Claim 4, wherein the optical element is either a wavelength conversion plate that converts the wavelength of light emitted from the light-emitting diode as it passes through the optical element, a translucent glass plate, or a light distribution control plate.

6. The semiconductor light emitting device according to claim 3 , wherein the interface between the step portion and the resin is covered with a metal oxide film.

7. 7. The semiconductor light emitting device according to claim 1, wherein said light emitting element is mounted so as to straddle both said first lead terminal and said second lead terminal.

8. 8. The semiconductor light emitting device according to claim 1, wherein the area surrounded by the recess has a circular, elliptical or rectangular shape.

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