Semiconductor Devices

Abstract

To provide a semiconductor device with improved humidity resistance.SOLUTION: A semiconductor device includes a semiconductor chip, a case, a sealing material which is disposed within the case to seal the semiconductor chip, and a lid which adheres to the sealing material. The case includes at least one projection. At least one first hole is provided at the lid. The at least one projection enters one of the at least one first hole to fix the lid to the case.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to semiconductor devices. [Background technology]

[0002] Patent Document 1 discloses a semiconductor device in which a lid is provided inside the case so as to contact the top surface of a sealing material in order to improve moisture resistance. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-111655 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, semiconductor devices have been used in many situations, such as for power generation, power transmission, efficient energy utilization or regeneration, etc. Recently, there has been an increasing demand for moisture resistance of semiconductor devices.

[0005] On the other hand, conventional techniques have the problem that they are unable to sufficiently improve moisture resistance.

[0006] The present disclosure is made to solve the above problems, and has an object to provide a semiconductor device with improved moisture resistance. [Means for solving the problem]

[0007] The semiconductor device of the present disclosure comprises a semiconductor chip, a case, a sealing material disposed within the case to seal the semiconductor chip, and a lid in close contact with the sealing material, wherein the case has at least one protrusion, the lid has at least one first hole, and each of the at least one protrusion is inserted into one of the at least one first hole, thereby fixing the lid to the case. [Effects of the Invention]

[0008] The present disclosure provides a semiconductor device with improved moisture resistance.

Brief Description of the Drawings

[0009] [Figure 1] It is a cross-sectional view of the semiconductor device of Embodiment 1. [Figure 2] It is a plan view of the case of the semiconductor device of Embodiment 1. [Figure 3] It is a cross-sectional view of the lid of the semiconductor device of Embodiment 1. [Figure 4] It is a cross-sectional view of the semiconductor device of Embodiment 2. [Figure 5] It is a plan view of the lid of the semiconductor device of Embodiment 2. [Figure 6] It is a plan view of the lid of the semiconductor device of Embodiment 3. [Figure 7] It is a plan view of the lid of the semiconductor device of Embodiment 4. [Figure 8] It is a plan view of the case of the semiconductor device of Embodiment 5. [Figure 9] It is a plan view of the lid of the semiconductor device of Embodiment 5.

Modes for Carrying Out the Invention

[0010] <A. Embodiment 1> FIG. 1 is a cross-sectional view of a semiconductor device 101 according to Embodiment 1.

[0011] The semiconductor device 101 includes a semiconductor chip 1, an insulating layer 2, a metal pattern 3, a case 4, a base plate 5, a lid 6a, a sealing material 7, and wiring 8.

[0012] The material of the insulating layer 2 is, for example, ceramic or resin. The insulating layer 2 is disposed on the base plate 5.

[0013] The metal pattern 3 is formed on the insulating layer 2.

[0014] The semiconductor chip 1 is disposed on a metal pattern 3. The semiconductor chip 1 is bonded to the metal pattern 3 by, for example, solder (not shown).

[0015] Although two semiconductor chips 1 are shown in FIG. 1, the semiconductor device 101 may include one semiconductor chip or three or more semiconductor chips.

[0016] The two semiconductor chips 1 are connected by wiring 8. The wiring 8 is, for example, a wire.

[0017] 2 is a plan view of the case 4. The case 4 has a protrusion 10. The protrusion 10 is provided on an inner side surface 45 of the case 4, as shown in FIGS.

[0018] The sealing material 7 is, for example, a sealing resin, which is, for example, an epoxy resin.

[0019] The semiconductor chip 1 is covered and protected by a sealing material 7 within the case 4 .

[0020] The lid 6a is in close contact with the sealing material 7. The closer the contact between the lid 6a and the sealing material 7, the more moisture can be prevented from entering the inside of the semiconductor device 101, thereby improving the moisture resistance.

[0021] 1 and 3, the lid 6a has a hole 60. In the semiconductor device 101, the hole 60 is provided on a surface 61 of the lid 6a that is in close contact with the sealing material 7.

[0022] In the semiconductor device 101, the projections 10 are inserted into the holes 60. The lid 6a is fixed to the case 4 by the projections 10 inserted into the holes 60.

[0023] The sealing material 7 and the lid 6a are bonded to each other at the portion where they are in close contact with each other. For example, in the manufacturing process, the sealing material 7 is cured while the sealing material 7 and the lid 6a are in contact with each other, thereby bonding the sealing material 7 and the lid 6a to each other.

[0024] The fixing of the lid 6a by the protrusion 10 may be such that the adhesion between the lid 6a and the sealing material 7 is enhanced by the fixing. In the manufacturing process, the protrusion 10 may be removable after being inserted into the hole 60 again.

[0025] For example, the protrusion 10 spreads in a direction intersecting the depth direction of the hole 60 at the tip, whereby the lid 6a is fixed by the protrusion 10.

[0026] For example, as shown in FIG. 1, the vicinity of the tip of the protrusion 10 has a frustum shape. The narrow side of the frustum shape is narrower than the opening of the hole 60, and the wide side of the frustum shape is wider than the opening of the hole 60. Thereby, when the protrusion 10 is pressed against the hole 60, the protrusion 10 fits into the hole 60.

[0027] In FIG. 1, the case where the hole 60 is filled by the protrusion 10 is shown, but as long as the lid 6a can be fixed by the protrusion 10, the hole 60 does not have to be filled by the protrusion 10.

[0028] By the protrusion 10 entering the hole 60, the lid 6a is fixed to the case 4 with the lid 6a and the sealing material 7 in close contact. Therefore, the semiconductor device 101 has higher moisture resistance than the case where the lid 6a is not fixed by the protrusion 10.

[0029] In the manufacturing process of the semiconductor device 101, for example, after attaching the lid 6a to the case 4, the sealing material 7 is cured. Since the lid 6a is fixed to the case 4 by the protrusion 10, displacement of the lid 6a caused by vibration of the curing furnace is suppressed in the process of curing the sealing material 7.

[0030] <B. Embodiment 2> FIG. 4 is a diagram showing the semiconductor device 102 of Embodiment 2.

[0031] The semiconductor device 102 includes a lid 6b instead of the lid 6a as compared with the semiconductor device 1o1 of Embodiment 1. The semiconductor device 102 is the same as the semiconductor device 101 in other respects.

[0032] Similar to the case of the lid 6a, a hole 60 is provided in the lid 6b.

[0033] Similar to the semiconductor device 101 of Embodiment 1, in the semiconductor device 102, the protrusion 10 is inserted into the hole 60. The lid 6b is fixed to the case 4 in a state where the lid 6b and the sealing material 7 are in close contact with each other by the protrusion 10 inserted into the hole 60. Therefore, the semiconductor device 102 has high moisture resistance.

[0034] ]> As shown in FIG. 4, the surface 61 in close contact with the sealing material 7 of the lid 6b has a convex shape toward the sealing material 7.

[0035] FIG. 5 is a plan view of the lid 6b, and is a view seen from the side of the surface 61 in close contact with the sealing material 7 of the lid 6b. The surface 61 in close contact with the sealing material 7 of the lid 6b is, for example, a quadrangular pyramid shape having the point 62 as the apex, as shown in FIG. 5.

[0036] In the manufacturing process of the semiconductor device 102, for example, after injecting the sealing material 7 into the case 4, the lid 6b is attached to the case 4. Even if bubbles are generated when injecting the sealing material 7 into the case 4, when the lid 6b is attached to the case 4, the convex portion of the surface 61 is pushed into the sealing material 7, making it easy for the bubbles to escape. If bubbles remain between the lid 6b and the sealing material 7, it will become a path for moisture intrusion. Since the surface 61 has a convex shape toward the sealing material 7, it is possible to suppress the remaining of bubbles between the lid 6b and the sealing material 7, and the moisture resistance is improved.

[0037] <C. Embodiment 3> The semiconductor device of Embodiment 3 includes a lid 6c instead of the lid 6b compared to the semiconductor device of Embodiment 2. The semiconductor device of Embodiment 3 is the same as the semiconductor device 102 in other respects.

[0038] FIG. 6 is a plan view of the lid 6c, and is a view seen from the side of the surface 61 in close contact with the sealing material 7 of the lid 6c.

[0039] ]>Similar to the semiconductor device 101 in Embodiment 1, in the semiconductor device of Embodiment 3, the lid 6c is fixed to the case 4 in a state where the lid 6c and the sealing material 7 are in close contact with each other by the protrusion 10 inserted into the hole 60. Thereby, the semiconductor device of Embodiment 3 has high moisture resistance.

[0040] Similar to the lid 6b in Embodiment 2, the surface 61 in close contact with the sealing material 7 of the lid 6c has a convex shape facing the sealing material 7.

[0041] In the lid 6b of Embodiment 2, the portion of the side 63 of the square pyramid shape of the surface 61 (see FIG. 5) was angular, but in the lid 6c, the surface 61 is a smooth curved surface between the apex 64, which is the point located closest to the sealing material 7 side, and the outer periphery of the surface 61. The surface 61 of the lid 6c may be smooth at the apex 64 or may be pointed at the apex 64. Since the lid 6c is a smooth curved surface between the apex 64 and the outer periphery of the surface 61, bubbles generated when injecting the sealing material 7 into the case 4 in the manufacturing process are more likely to escape when attaching the lid 6c to the case 4.

[0042] <D. Embodiment 4> The semiconductor device of Embodiment 4 includes a lid 6d instead of the lid 6a compared to the semiconductor device 101 of Embodiment 1. The semiconductor device of Embodiment 4 is the same as the semiconductor device 101 in other respects.

[0043] FIG. 7 is a plan view of the lid 6d and is a view seen from the side of the surface 62 opposite to the surface in close contact with the sealing material 7.

[0044] Similar to the case of the lid 6a, the lid 6d is provided with a hole 60 in the surface opposite to the surface 62.

[0045] In the semiconductor device of Embodiment 4, the lid 6d is fixed to the case 4 in a state where the lid 6d and the sealing material 7 are in close contact with each other by the protrusion 10 inserted into the hole 60. Thereby, the semiconductor device of Embodiment 4 has high moisture resistance.

[0046] At the end of the lid 6d in plan view, a hole 65 penetrating from the surface in close contact with the sealing material 7 to the opposite surface 62 is provided.

[0047] Since the hole 65 is provided in the lid 6d, in the manufacturing process, the air between the sealing material 7 and the lid 6d can easily escape. As a result, the adhesion between the sealing material 7 and the lid 6d is further enhanced, and the moisture resistance of the semiconductor device of Embodiment 4 is further improved.

[0048] If the position of the hole 65 is at the end of the lid 6d, most of the surface of the sealing material 7 on the lid 6d side is in contact with the lid 6d. Therefore, the degree to which the moisture resistance of the semiconductor device of Embodiment 4 decreases by providing the hole 65 is small.

[0049] The surface of the lid 6d in close contact with the sealing material 7 may have a convex shape facing the sealing material 7, similar to the case of the lid 6b or lid 6c of Embodiment 2 or 3.

[0050] <E. Embodiment 5> Compared with the semiconductor device 101 of Embodiment 1, the semiconductor device of Embodiment 5 includes a case 4e instead of the case 4. Also, compared with the semiconductor device 101 of Embodiment 1, the semiconductor device of Embodiment 5 includes a lid 6e instead of the lid 6a. The semiconductor device of Embodiment 5 is the same as the semiconductor device 101 in other respects.

[0051] FIG. 8 is a plan view of the case 4e.

[0052] The inner side surface 45 of the case 4e has surfaces 41, 42, 43, and 44 separated by sides.

[0053] As shown in FIG. 8, projections 10 are provided on each of the surfaces 41, 42, 43, and 44 of the case 4e.

[0054] 9 is a plan view of lid 6e, as viewed from the side of surface 61 that is in close contact with sealing material 7. Holes 60 are provided in lid 6e in correspondence with protrusions 10 provided on surfaces 41, 42, 43, and 44, respectively.

[0055] In the semiconductor device of the present embodiment, the protrusions 10 provided on the surfaces 41, 42, 43, and 44 are inserted into the holes 60 of the lid 6e, respectively. As a result, the lid 6e is fixed to the case 4e with the lid 6e and the sealing material 7 in close contact with each other.

[0056] Providing protrusions 10 on each of surfaces 41, 42, 43, and 44 of inner side surface 45 of case 4e makes it possible to fix lid 6e more accurately, thereby further preventing misalignment of lid 6e.

[0057] It is possible to freely combine the embodiments, and to modify or omit the embodiments as appropriate.

[0058] Various aspects of the present disclosure are summarized below as appendices.

[0059] (Appendix 1) A semiconductor chip; Case and a sealing material disposed in the case and sealing the semiconductor chip; a lid in close contact with the sealing material; Equipped with the case includes at least one protrusion; The lid has at least one first hole; Each of the at least one protrusions is inserted into one of the at least one first holes, thereby fixing the lid to the case. Semiconductor device.

[0060] (Appendix 2) 10. The semiconductor device according to claim 1, The at least one first hole is provided on a surface of the lid that is in close contact with the sealing material. Semiconductor device.

[0061] (Appendix 3) 3. The semiconductor device according to claim 1, The surface of the lid that is in close contact with the sealing material is convex toward the sealing material. Semiconductor device.

[0062] (Appendix 4) 4. The semiconductor device according to claim 3, The surface of the lid that is in close contact with the sealing material is a smoothly curved surface between the point located closest to the sealing material and the outer periphery of the surface of the lid that is in close contact with the sealing material. Semiconductor device.

[0063] (Appendix 5) 5. The semiconductor device according to any one of claims 1 to 4, A second hole is provided at an end of the lid in a plan view, the second hole penetrating from the surface in close contact with the sealing material to the surface opposite to the surface in close contact with the sealing material. Semiconductor device.

[0064] (Appendix 6) 6. The semiconductor device according to any one of Supplementary Notes 1 to 5, the at least one protrusion is a plurality of protrusions; The inner side surface of the case has a plurality of surfaces separated by edges, Any of the plurality of protrusions is provided on each of the plurality of surfaces. Semiconductor device. [Explanation of symbols]

[0065] 1 semiconductor chip, 2 insulating layer, 3 metal pattern, 4, 4e case, 5 base plate, 6a, 6b, 6c, 6d, 6e lid, 7 sealing material, 8 wiring, 10 protrusion, 45 inner side surface, 60, 65 hole, 101, 102 semiconductor device.

Claims

1. A semiconductor chip; Case and a sealing material disposed in the case and sealing the semiconductor chip; a lid in close contact with the sealing material; Equipped with the case includes at least one protrusion; The lid has at least one first hole; Each of the at least one protrusions is inserted into one of the at least one first holes, thereby fixing the lid to the case. Semiconductor device.

2. 2. The semiconductor device according to claim 1, The at least one first hole is provided on a surface of the lid that is in close contact with the sealing material. Semiconductor device.

3. 3. The semiconductor device according to claim 1, The surface of the lid that is in close contact with the sealing material is convex toward the sealing material. Semiconductor device.

4. 4. The semiconductor device according to claim 3, The surface of the lid that is in close contact with the sealing material is a smoothly curved surface between the point located closest to the sealing material and the outer periphery of the surface of the lid that is in close contact with the sealing material. Semiconductor device.

5. 3. The semiconductor device according to claim 1, a second hole penetrating from a surface in close contact with the sealing material to a surface opposite to the surface in close contact with the sealing material, at an end of the lid in a plan view; Semiconductor device.

6. 3. The semiconductor device according to claim 1, the at least one protrusion is a plurality of protrusions; The inner side surface of the case has a plurality of surfaces separated by edges, Any of the plurality of protrusions is provided on each of the plurality of surfaces. Semiconductor device.

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