Light-emitting device manufacturing method

Abstract

To provide a light emitting device with a reflective layer made of Al, capable of suppressing deterioration of reflective properties of the reflective layer due to contact with substances that react with Al even when being used while being exposed to the outside environment, and a manufacturing method of the light emitting device.SOLUTION: There is provided a light emitting device 1 which includes: a light emitting element 10; a sealing member 11 sealing the light emitting element 10 and comprising a resin material as a base material; an adhesion layer 12 on the sealing member 11; a reflective layer 13 made of an Al film on the adhesion layer 12; and a coating film 15 covering directly or indirectly a side face 131 and an upper face 132 of the reflective layer 13, and comprising a resin material of the same type as the base material of the sealing member 11, as a base material. An outer edge 151 of the coating film 15 is brought into close contact with the sealing member 11, so that the reflective layer 13 is sealed with the coating film 15 and the sealing member 11.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a light emitting device and a method for manufacturing the same. [Background technology]

[0002] Conventionally, light emitting devices having a light reflective layer made of Al are known (see, for example, Patent Document 1). In the light emitting device described in Patent Document 1, a light reflective layer is provided above a light emitting element to reflect light emitted from the light emitting element. In general, a light reflective layer made of Al has excellent reflectivity and can improve the light extraction efficiency of the light emitting device, and can be formed thin, allowing the light emitting device to be made thinner. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-53637 Summary of the Invention [Problem to be solved by the invention]

[0004] However, if the light-emitting device is used in an unsealed state, i.e., exposed to the external environment, the light-reflecting layer may come into contact with salt water, water, alkali, or other substances that react with Al, which may deteriorate the reflective properties of the light-reflecting layer. For example, when salt water comes into contact with the Al light-reflecting layer, corrosion called pitting occurs, in which small, dot-like holes appear, and light leaks through the resulting holes, which can change the light distribution of the light-emitting device.

[0005] The object of the present invention is to provide a light-emitting device having a reflective layer made of Al, which can suppress deterioration of the reflective properties of the reflective layer due to contact with substances that react with Al, even when used in a state exposed to the external environment, and a method for manufacturing the same. [Means for solving the problem]

[0006] In order to achieve the above object, one aspect of the present invention provides the following light-emitting device and method for manufacturing the same.

[0007] [1] A light-emitting device comprising: a light-emitting element; a sealing member having a resin material as a base material for sealing the light-emitting element; an adhesive layer on the sealing member; a reflective layer made of an Al film on the adhesive layer; and a coating film having the same type of resin material as the base material of the sealing member as a base material for covering the side and top surfaces of the reflective layer directly or indirectly; wherein the outer edge of the coating film is in close contact with the sealing member, thereby sealing the reflective layer by the coating film and the sealing member. [2] The light emitting device according to [1] above, wherein the sealing member and the coating film are made of modified silicone as a base material. [3] The light-emitting device according to the above [1] or [2], wherein the thickness of the portion of the coating film that covers the side surface of the reflective layer is 1 μm or more. [4] The light-emitting device according to [1] or [2] above, wherein the coating film is white or black. [5] The light-emitting device according to [1] or [2] above, further comprising a light-shielding layer covering an upper surface of the covering film. [6] A process of arranging a plurality of light-emitting elements on a support substrate; a process of forming a sealing member made of a resin material as a base material on the support substrate to seal the plurality of light-emitting elements; a process of forming an adhesive layer on the sealing member; a process of forming a reflective layer made of an Al film on the adhesive layer; a process of cutting along a dicing line from the reflective layer side to a part of the sealing member using a first dicing blade to form a groove; a process of forming a coating film made of the same resin material as the sealing member so as to cover the upper part of the reflective layer and the inner surface of the groove; and using a second dicing blade having a width smaller than that of the first dicing blade to cut the coating film in the groove and the sealing member below the groove along the dicing lines to separate the light emitting device into a plurality of light emitting devices, each of which includes the light emitting element sealed in the sealing member, the adhesion layer, the reflective layer, and the coating film, wherein in the light emitting device, the coating film directly or indirectly covers the top and side surfaces of the reflective layer, and the outer edge of the coating film adheres to the sealing member, thereby sealing the reflective layer with the coating film and the sealing member. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a light-emitting device having a reflective layer made of Al, which can suppress deterioration of the reflective properties of the reflective layer due to contact with substances that react with Al, even when used in a state exposed to the external environment, and a method for manufacturing the same. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a vertical cross-sectional view of a light emitting device according to an embodiment of the present invention. [Figure 2] 2(a) and 2(b) are enlarged cross-sectional views of the light emitting device according to the embodiment of the present invention, showing the periphery of the outer edge of the coating film. [Figure 3] 3(a) to 3(c) are vertical cross-sectional views showing an example of a manufacturing process for a light emitting device according to an embodiment of the present invention. [Figure 4]4(a) to 4(c) are vertical cross-sectional views showing an example of a manufacturing process for a light emitting device according to an embodiment of the present invention. [Figure 5] FIG. 5 is a vertical cross-sectional view of a modified example of the light emitting device according to the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] (Configuration of light-emitting device) 1 is a vertical cross-sectional view of a light emitting device 1 according to an embodiment of the present invention. The light emitting device 1 includes a light emitting element 10, a sealing member 11 made of a resin material and sealing the light emitting element 10, an adhesion layer 12 made of an SiO2 film or the like on the sealing member 11, a reflective layer 13 made of an Al film on the adhesion layer 12, and a coating film 15 made of the same type of resin material as the sealing member 11 and directly or indirectly covering a side surface 131 and an upper surface 132 of the reflective layer 13.

[0011] In the light emitting device 1, the outer edge portion 151 of the coating film 15 is in close contact with the sealing member 11, so that the reflective layer 13 is sealed by the coating film 15 and the sealing member 11. The close contact portion between the outer edge portion 151 and the sealing member 11 is continuous in a ring shape along the side surface of the sealing member 11.

[0012] The light emitting element 10 is typically an LED chip. The light emitting element 10 is typically a flip-chip type element, but may also be a face-up type element. When the light emitting element 10 is a flip-chip type, a p-side pad electrode 101a and an n-side pad electrode 101b shown in FIG. 1 are connected to electrodes on a mounting target such as a printed circuit board.

[0013] In light emitting device 1, light emitted by light emitting element 10 is reflected by reflective layer 13 and the substrate on which light emitting device 1 is mounted, and is extracted obliquely upward from the side surface of sealing member 11. For this reason, light emitting device 1 has a light distribution characteristic of a so-called batwing shape, in which the emission intensity in the upward direction is relatively low and the emission intensity peaks on the wide-angle side. In other words, in the relationship between the light distribution angle and the emission intensity, the emission intensity peaks in the range where the light distribution angle is greater than 0°.

[0014] The sealing member 11 is made of a resin material such as silicone resin or epoxy resin as a base material, and contains, for example, a phosphor for converting the wavelength of light emitted by the light emitting element 10. For example, if the light emitted by the light emitting element 10 is blue light, e.g., light with a wavelength of 430 to 470 nm, and the sealing member 11 contains a yellow phosphor such as a YAG phosphor, the light emitting device 1 emits white light.

[0015] The sealing member 11 is usually provided to cover the side and top surfaces of the light emitting element 10, and the light emitting element 10 is positioned at the center of the planar direction of the sealing member 11. The shape of the sealing member 11 is not particularly limited, but is typically a rectangular parallelepiped. In this case, the side surfaces of the sealing member 11 are provided so as to be parallel to the side surfaces of the rectangular parallelepiped light emitting element 10.

[0016] The adhesion layer 12 is a film made of SiO2 or the like provided between the sealing member 11 and the reflective layer 13, and by providing the adhesion layer 12, it is possible to suppress a decrease in reflectance due to the occurrence of cracks in the reflective layer 13. The adhesion layer 12 is made of a material whose difference in linear expansion coefficient with respect to Al is smaller than the difference in linear expansion coefficient between the resin material of the base material of the sealing member 11 and Al.

[0017] For example, when the base material of the sealing member 11 is silicone resin, the linear expansion coefficient of silicone resin is approximately 200×10 -6 ~400×10 -6 ppm, and the linear expansion coefficient of Al is approximately 23.6×10 -6 ppm, the difference in the linear expansion coefficient between the reflective layer 13 made of an Al film and the sealing member 11 whose base material is silicone resin is quite large. For this reason, if the reflective layer 13 is formed directly on the sealing member 11, the sealing member 11 and the reflective layer 13 will expand due to the temperature rise when the reflective layer 13 is formed, and will then shrink due to the temperature drop, which will easily cause cracks in the reflective layer 13.

[0018] Therefore, when an SiO2 film is used as the adhesive layer 12, the linear expansion coefficient of Al is approximately 0.5×10 -6Since the difference in the linear expansion coefficient of SiO2 (ppm) is much smaller than the difference in the linear expansion coefficient of Al and the linear expansion coefficient of silicone resin, cracks are less likely to occur in the reflective layer 13 even after the temperature rise during formation of the reflective layer 13 and the subsequent temperature drop.

[0019] Furthermore, the adhesion layer 12 is preferably made of a material that does not react at all or hardly reacts with Al, such as SiO2. In this case, by providing the adhesion layer 12, it is possible to suppress a decrease in the reflectance of the reflective layer 13 due to products generated at the interface between the sealing member 11 and the reflective layer 13.

[0020] When the reflective layer 13 is formed directly on the sealing member 11, a reaction (presumably oxidation of Al) occurs between the resin material such as silicone resin that constitutes the sealing member 11 and the Al that constitutes the reflective layer 13, and a reaction product is generated at the interface between the sealing member 11 and the reflective layer 13. Since the reflectance of this product is lower than that of Al, the generation of this product reduces the reflectance of the reflective layer 13.

[0021] In a light-emitting device 1 in which a reflective layer 13 is formed on a sealing member 11 via an adhesive layer 12 made of SiO2 or the like, the sealing member 11 and the reflective layer 13 are not in contact with each other, so the generation of products caused by a reaction between them is suppressed. Note that when an SiO2 film is used as the adhesive layer 12, no reaction occurs between the reflective layer 13 and the adhesive layer 12, and it has been confirmed that a high-quality reflective layer 13 can be formed on the adhesive layer 12.

[0022] The thickness of the adhesion layer 12 is preferably 10 nm or more to prevent the adhesion layer 12 from being formed in an island shape and causing partial contact between the reflective layer 13 and the sealing member 11. If the adhesion layer 12 is too thick, it will be prone to cracking due to stress, and there is a risk of cracks occurring due to the difference in thermal expansion coefficient between the adhesion layer 12 and the sealing member 11. For this reason, the thickness of the adhesion layer 12 is preferably 300 nm or less. The adhesion layer 12 is formed by, for example, sputtering or vapor deposition.

[0023] Because the reflective layer 13 is formed on the adhesive layer 12, a decrease in reflectance due to the above-mentioned cracks and the generation of products resulting from the reaction with the sealing member 11 is suppressed. For example, it has been experimentally confirmed that the reflectance of the reflective layer 13 formed on the sealing member 11 made of silicone resin via the adhesive layer 12 made of SiO2 and having its surface protected by the protective layer 14 for light having a wavelength of 500 nm is approximately 78%, which is equivalent to the reflectance of an Al film formed on glass without cracks or products resulting from the reaction. On the other hand, the reflectance of the reflective layer 13 formed directly on the sealing member 11 made of silicone resin for light having a wavelength of 500 nm is approximately 37%, showing a significant decrease that is thought to be due to cracks and products resulting from the reaction with the sealing member 11.

[0024] If the reflective layer 13 is too thin, it may transmit part of the light emitted by the light emitting element 10; specifically, transmission begins to occur when the thickness is approximately 90 nm or less. Therefore, in order to suppress light transmission, the thickness of the reflective layer 13 is preferably 50 nm or more, and more preferably 100 nm or more. Furthermore, if the reflective layer 13 is too thick, it is prone to cracking due to stress, and cracks may occur due to the difference in thermal expansion coefficient with the adhesion layer 12. Therefore, the thickness of the reflective layer 13 is preferably 300 nm or less. The reflective layer 13 is formed, for example, by sputtering or vapor deposition.

[0025] The thickness of the reflective layer 13 made of an Al film is significantly smaller than the thickness (e.g., 60 μm or more) of a reflective layer made of a resin film containing a reflective material such as TiO2. Therefore, by using the reflective layer 13, the light emitting device 1 can be made thinner than when a reflective layer made of a resin film is used.

[0026] The protective layer 14 is a layer for protecting the surface of the reflective layer 13. By providing the protective layer 14, it is possible to prevent cracks, scratches, and oxidation from occurring after the formation of the reflective layer 13. The protective layer 14 is made of, for example, a SiO2 film, a Ti film, a Ta film, or a Cr film. The thickness of the protective layer 14 is preferably 10 nm or more to prevent the protective layer 14 from being formed in an island shape and partially exposing the surface of the reflective layer 13. Furthermore, if the protective layer 14 is too thick, it is prone to cracking due to stress, which may cause cracks due to the difference in thermal expansion coefficient between the protective layer 14 and the reflective layer 13. For this reason, the thickness of the protective layer 14 is preferably 300 nm or less. The protective layer 14 is formed by, for example, sputtering or vapor deposition.

[0027] The light emitting device 1 is typically a package called a CSP (chip scale package), the size of which is matched as closely as possible to the size of the light emitting element that is the light source.

[0028] As described above, the coating film 15 directly or indirectly covers the side surface 131 and the top surface 132 of the reflective layer 13, and its outer edge 151 is in close contact with the sealing member 11. Therefore, the reflective layer 13 is sealed by the coating film 15 and the sealing member 11, and it is possible to prevent substances that react with Al, such as salt water, water, and alkali, from coming into contact with the reflective layer 13. This makes it possible to prevent deterioration of the reflective properties of the reflective layer 13, for example, light leakage due to pitting that occurs when the reflective layer 13 comes into contact with salt water.

[0029] When the protective layer 14 is provided on the reflective layer 13, the coating film 15 covers the upper surface of the protective layer 14. That is, the coating film 15 indirectly covers the upper surface 132 of the reflective layer 13. When the protective layer 14 is not provided on the reflective layer 13, the coating film 15 directly covers the upper surface 132 of the reflective layer 13.

[0030] 2(a) and (b) are enlarged cross-sectional views of the light emitting device 1, enlarging the periphery of the outer edge 151 of the coating film 15. The outer edge 151 of the coating film 15 fits into a recess 111 provided in the upper part of the side surface of the sealing member 11, and is in close contact with the sealing member 11. The outer edge 151 of the coating film 15 has a shape corresponding to the recess 111.

[0031] In the example shown in FIG. 2(a), the cross-sectional shape of the recess 111 and the outer edge portion 151 that fits therein is rectangular, and in the example shown in FIG. 2(b), the cross-sectional shape of the recess 111 and the outer edge portion 151 that fits therein is triangular. As will be described later, the recess 111 is formed by dicing using a dicing blade, and the shape of the recess 111 is determined by the shape of the dicing blade. In consideration of dicing accuracy, to stably form the recess 111, it is preferable that the height depth D1 of the recess 111 be, for example, 10 μm or more and 70 μm or less. Furthermore, the lateral depth D2 of the recess 111 shown in FIG. 2(a) is, for example, 1 μm or more and 40 μm or less.

[0032] In order to more effectively prevent the intrusion of salt water or the like from the side surface 131 of the reflective layer 13, it is preferable that the thickness T1 of the portion of the coating film 15 that covers the side surface 131 of the reflective layer 13 be 1 μm or more. Note that, as long as the reflective layer 13 is sealed by the coating film 15 and the sealing member 11, the coating film 15 does not need to be in contact with the side surface 131 of the reflective layer 13. In other words, the side surface 131 of the reflective layer 13 may be indirectly covered by the coating film 15.

[0033] The thickness T2 of the portion of the coating film 15 that covers the upper surface 132 of the reflective layer 13 is not particularly limited as long as it is thick enough to prevent the coating film 15 from being formed in an island shape and the surface of the underlying layer from being partially exposed. For example, when the coating film 15 is formed by spin coating, the thickness T2 is 20 μm or more and 40 μm or less.

[0034] To enhance adhesion to the sealing member 11, the coating film 15 uses the same type of resin material as the sealing member 11 as its base material. Here, "same type of resin material" refers to the same type of resin, such as modified silicone or methyl silicone. For example, modified silicone and modified silicone may have the same or different product part numbers. For example, if modified silicone (SCR-1024NF manufactured by Shin-Etsu Chemical Co., Ltd.) is used as the base material of the sealing member 11, modified silicone with the same part number (SCR-1024NF manufactured by Shin-Etsu Chemical Co., Ltd.) or modified silicone with a different part number (KCR-H2800 manufactured by Shin-Etsu Chemical Co., Ltd.) can be used as the base material of the coating film 15. If the base materials of the sealing member 11 and the coating film 15 are made of different resin materials, adhesion is poor, increasing the possibility of saltwater or the like penetrating through the interface between them.

[0035] It is preferable to use a silicone resin, which is particularly resistant to deterioration due to heat, light (ultraviolet light, blue light), etc., for the base material of the sealing member 11 and the base material of the coating film 15. Among silicone resins, it is preferable to use modified silicone, which has better gas barrier properties than methyl silicone, etc.

[0036] As will be described later, dicing is used to form the coating film 15. Therefore, in order to improve the dicing processability, it is preferable that the coating film 15 has a certain degree of hardness, for example, a Shore hardness of D60 or more and D90 or less.

[0037] When the sealing member 11 contains particles such as phosphors, the linear expansion coefficient is lower than when the sealing member 11 does not contain particles. Therefore, when the sealing member 11 contains particles, it is preferable to also add particles to the coating film 15 to lower the linear expansion coefficient and reduce the difference in the linear expansion coefficient between the sealing member 11 and the coating film 15. This makes it possible to suppress shape changes and misalignment of the sealing member 11 and the coating film 15 that occur during dicing. Examples of particles that can be added to the coating film 15 include dispersants such as silica particles, and colorants such as TiO2 particles and carbon black.

[0038] The coating film 15 may be transparent, translucent, white, or black. For example, the coating film 15 is translucent when it contains silica particles, white when it contains TiO particles and silica particles, and black when it contains carbon black and silica particles.

[0039] When the coating film 15 has a white or black color, the following effects can be achieved. For example, reflection of external light can be suppressed when the light emitting device 1 is turned off, making the light emitting device 1 less noticeable. Furthermore, by making the color of the coating film 15 white or black to match the color of the substrate on which the light emitting device 1 is mounted, the light emitting device 1 can be made less noticeable when turned off. Furthermore, since light is less likely to propagate through the coating film 15, it is possible to prevent light from leaking from an outer region 152 (see FIGS. 2(a) and 2(b)) on the top surface of the coating film 15 through the portions of the coating film 15 that cover the side surfaces of the sealing member 11, the adhesion layer 12, the reflective layer 13, and the protective layer 14.

[0040] The light emitting device 1 typically has a rectangular parallelepiped outer shape, and in this case the thickness is, for example, 50 to 400 μm, and the length of one side of the square or rectangular planar shape is, for example, 150 to 1200 μm.

[0041] (Method of manufacturing a light-emitting device) 3(a) to 3(c) and 4(a) to 4(c) are vertical cross-sectional views showing an example of a manufacturing process for the light emitting device 1 according to the embodiment of the present invention.

[0042] First, as shown in FIG. 3(a), a chip fixing tape 52 is attached to a support substrate 51, and a plurality of light emitting elements 10 are arranged thereon.

[0043] 3(b), a sealing member 11 that seals the plurality of light-emitting elements 10 is formed on the support substrate 51. To form the sealing member 11, for example, a material for the sealing member 11, such as a silicone resin containing a phosphor, is applied and cured.

[0044] 3(c), an adhesive layer 12, a reflective layer 13, and a protective layer 14 are formed in this order on the sealing member 11. At this time, the protective layer 14 does not necessarily have to be formed.

[0045] 4(a), a first dicing blade provided in a dicer is used to cut the upper side, i.e., from the reflective layer 13 side to a part of the sealing member 11, along the dicing line to form a groove 53. Here, the dicing line is a line along which the dicing blade cuts the object when dividing it into individual pieces.

[0046] Next, as shown in FIG. 4(b), the coating film 15 is formed so as to cover the upper part of the reflective layer 13 and the inner surface of the groove 53. To form the coating film 15, for example, a material for the coating film 15, such as a silicone resin, is applied and cured. At this time, if the protective layer 14 is formed, the coating film 15 covers the upper surface of the protective layer 14, and if the protective layer 14 is not formed, the coating film 15 covers the upper surface of the reflective layer 13.

[0047] Next, as shown in Figure 4(c), a second dicing blade provided on the dicer is used to cut the coating film 15 in the groove 53 and the sealing member 11 below the groove 53 along the dicing line, thereby dividing the light-emitting device 1 into multiple individual pieces.

[0048] Here, the width of the second dicing blade is smaller than the width of the first dicing blade. Therefore, the width of groove 54 formed by the second dicing blade is smaller than the width of groove 53 formed by the first dicing blade. As a result, a portion of groove 53 remains as depression 111 in each individual light emitting device 1. For example, if the width of the first dicing blade is 150 μm and the width of the second dicing blade is 100 μm, the depth D of depression 111 is approximately 25 μm.

[0049] Through the above steps, the coating film 15 directly or indirectly covers the top and side surfaces of the reflective layer 13, and the outer edge 151 of the coating film 15 adheres closely to the sealing member 11, thereby obtaining a light emitting device 1 in which the reflective layer 13 is sealed by the coating film 15 and the sealing member 11. Thereafter, the support substrate 51 and the chip fixing tape 52 are peeled off from the individual light emitting devices 1.

[0050] (Evaluation of airtightness of reflective layer) A salt spray test carried out to evaluate the sealing performance of the reflective layer 13 by the coating film 15 and the sealing member 11 will be described below.

[0051] This salt spray test conforms to the JEDEC standard JESD22-A107, and is conducted at a temperature of 35°C, with a mass percent concentration of NaCl in the solution of 5%, and a spray volume of 1-3 ml / 80 cm. 2 The experiment was carried out under the following conditions.

[0052] The samples used in this test were a light emitting device 1 (specimen A) in which the same resin material was used for the base material of the sealing member 11 and the base material of the coating film 15, a light emitting device 1 (specimen B) in which different resin materials were used for the base material of the sealing member 11 and the base material of the coating film 15, and a light emitting device 1 (specimen C) in which the coating film 15 was omitted. In sample A, modified silicone (SCR-1024NF manufactured by Shin-Etsu Chemical Co., Ltd.) was used for the base material of the sealing member 11 and the base material of the coating film 15. In sample B, modified silicone (SCR-1024NF manufactured by Shin-Etsu Chemical Co., Ltd.) and methyl silicone (KER-2600 manufactured by Shin-Etsu Chemical Co., Ltd.) were used for the base material of the sealing member 11 and the base material of the coating film 15, respectively. In sample C, modified silicone (SCR-1024NF manufactured by Shin-Etsu Chemical Co., Ltd.) was used for the base material of the sealing member 11.

[0053] In sample A, no corrosion occurred in coating film 15 even after 192 hours had passed since the start of the test. In sample B, corrosion occurred in coating film 15 after 72 hours had passed since the start of the test, and the corrosion had progressed further after 192 hours had passed. In addition, in sample C, extremely severe corrosion occurred in coating film 15 after 24 hours had passed since the start of the test.

[0054] From the above test results, it was confirmed that by using the same type of resin material for the base material of the sealing member 11 and the base material of the coating film 15, high sealing performance of the reflective layer 13 by the coating film 15 and the sealing member 11 can be obtained.

[0055] (Variation) Fig. 5 is a vertical cross-sectional view of a modified example of the light emitting device 1 according to the embodiment of the present invention. As shown in Fig. 5, a light-shielding layer 16 may be provided to cover the upper surface of the covering film 15 (the surface facing upward in Fig. 5). The light-shielding layer 16 is made of a resin material such as a silicone resin colored in black, white, or the like, and can effectively prevent light leakage from the upper surface of the covering film 15, particularly from an outer region 152 of the upper surface.

[0056] For example, if the light-shielding layer 16 contains TiO2 particles and silica particles, it will be white, and if it contains carbon black and silica particles, it will be black. In order to improve the adhesion between the light-shielding layer 16 and the coating film 15, the base material of the light-shielding layer 16 is preferably the same type of resin material as the base material of the coating film 15.

[0057] When forming the light-shielding layer 16, for example, in the manufacturing process of the light-emitting device 1 described above, after forming the coating film 15 in the step shown in Figure 4(b), the light-shielding layer 16 is formed on the coating film 15, and then in the step shown in Figure 4(b), the coating film 15 is cut together with the coating film 15 and the sealing member 11 using a second dicing blade.

[0058] (Effects of the embodiment) According to the light emitting device 1 of the embodiment of the present invention described above, the reflective layer 13 made of Al is sealed by the coating film 15 and the sealing member 11. Therefore, even when the light emitting device 1 is used in a state exposed to the external environment, deterioration of the reflective properties of the reflective layer 13 due to contact with substances that react with Al, such as salt water, can be suppressed.

[0059] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments and various modifications can be made without departing from the spirit of the invention. Furthermore, the components of the above-described embodiments can be combined in any manner without departing from the spirit of the invention.

[0060] Furthermore, the above-described embodiments do not limit the scope of the invention as claimed, and it should be noted that not all of the combinations of features described in the embodiments are necessarily essential to the means for solving the problems of the invention. [Explanation of symbols]

[0061] 1. Light-emitting device 10 Light-emitting element 11 Sealing member 111 Depression 12 Adhesion layer 13 Reflective layer 131 Side 132 Top surface 14 Protective layer 15 Coating membrane 151 outer edge 16 Light blocking layer 53, 54 groove

Claims

[Claim 1] A step of arranging a plurality of light-emitting elements on a support substrate; forming a sealing member made of a resin material as a base material on the support substrate to seal the plurality of light-emitting elements; forming an adhesive layer on the sealing member; forming a reflective layer made of an Al film on the adhesive layer; a step of cutting a portion of the sealing member from the reflective layer side along a dicing line using a first dicing blade to form a groove; forming a coating film made of the same resin material as the sealing member so as to cover the upper surface of the reflective layer and the inner surface of the groove; a step of cutting the coating film in the groove and the sealing member below the groove along the dicing lines using a second dicing blade having a width smaller than that of the first dicing blade, to separate the light emitting device into a plurality of light emitting devices each including the light emitting element, the adhesion layer, the reflective layer, and the coating film sealed in the sealing member; Including, In the light-emitting device, the coating film directly or indirectly covers an upper surface and a side surface of the reflective layer, and an outer edge of the coating film is in close contact with the sealing member, thereby sealing the reflective layer with the coating film and the sealing member. A method for manufacturing a light-emitting device.

Images