Image sensor and image pickup device

Abstract

To provide an imaging apparatus which is an imaging apparatus for performing focus detection by a pupil division type phase difference system and is for setting a pixel arrangement to be a predetermined arrangement such as a Bayer arrangement.SOLUTION: In an imaging element, a light receiving part includes two first pixels 202-1 which are continuously arranged in a first direction and detect first color light, two second pixels 202-2 which are continuously arranged in a second direction crossing the first direction, are adjacent to the two first pixels, and detect second color light, a plurality of first light receiving areas which are arranged in the first pixel and divided in the first direction where the first color light is received, and a plurality of second light receiving areas which are arranged in the second pixel and divided in the second direction where the second color light is received.SELECTED DRAWING: Figure 15

Description

[Technical Field]

[0001] The present invention relates to an imaging element and an imaging apparatus. [Background technology]

[0002] BACKGROUND ART There is known an imaging device that performs focus detection using a split-pupil phase difference method based on output signals from a plurality of pixels dedicated to focus detection that are arranged in a portion of an image sensor (see, for example, Patent Document 1). Patent Document 1: JP 2011-77770 A Summary of the Invention [Problem to be solved by the invention]

[0003] In the past, focus detection pixels were arranged discretely, resulting in lower focus detection accuracy compared to when focus detection pixels were arranged contiguously. On the other hand, when focus detection pixels corresponding to color filters of specific colors are arranged contiguously, the pixel arrangement differs from a predetermined arrangement such as a Bayer arrangement. In the past, attempting to convert the pixel arrangement to a predetermined arrangement such as a Bayer arrangement by interpolation or the like required complicated calculations. [Means for solving the problem]

[0004] In a first aspect of the present invention, an imaging element is provided, which includes: a plurality of first light receiving units having a plurality of light receiving regions that detect light of a first color arranged in a first direction and that are arranged in the first direction; and a plurality of second light receiving units having a plurality of light receiving regions that detect light of a second color arranged in a second direction different from the first direction and that are arranged at positions different from the plurality of first light receiving units in the first direction and that are arranged in the first direction.

[0005] In a second aspect of the present invention, there is provided an imaging element comprising: a plurality of first light receiving sections arranged in a first direction, each having a plurality of light receiving regions that detect light of a first color; and a plurality of second light receiving sections arranged in the first direction, each having a plurality of light receiving regions that detect light of a second color that is arranged in a second direction different from the first direction, each arranged in the second direction, and intersecting with the plurality of first light receiving sections between two first light receiving sections.

[0006] In a third aspect of the present invention, there is provided an imaging element having a first light receiving unit having a plurality of photoelectric conversion units that detect light of a first color, a second light receiving unit arranged in a first direction of the first light receiving unit and having a plurality of photoelectric conversion units that detect light of a second color, a third light receiving unit arranged in a second direction of the first light receiving unit and having a plurality of photoelectric conversion units that detect light of the second color, and a fourth light receiving unit arranged in the second direction of the second light receiving unit and having a plurality of photoelectric conversion units that detect light of the first color, wherein the plurality of photoelectric conversion units of the first light receiving unit and the plurality of photoelectric conversion units of the fourth light receiving unit are arranged in the direction from the first light receiving unit to the fourth light receiving unit, and the plurality of photoelectric conversion units of the second light receiving unit and the plurality of photoelectric conversion units of the third light receiving unit are arranged in the direction from the second light receiving unit to the third light receiving unit.

[0007] The present invention may also include the following aspects. [Item 1] two first pixels arranged consecutively in a first direction and configured to detect light of a first color; two second pixels that are arranged consecutively in a second direction intersecting the first direction, adjacent to the two first pixels, and detect light of a second color; a plurality of first light receiving regions arranged in the first pixel and divided in the first direction to receive light of the first color; a plurality of second light receiving regions arranged in the second pixel and divided in the second direction to receive light of the second color; An imaging element comprising: [Item 2] The first direction and the second direction are perpendicular to each other. Item 1. The imaging element according to item 1. [Item 3] further comprising a focus detection unit that detects a focus state based on an output signal from the first pixel and an output signal from the second pixel; Item 3. The imaging element according to item 1 or 2. [Item 4] an imaging section in which the first pixel and the second pixel are arranged; a signal processing unit stacked with the imaging unit and processing a signal from the imaging unit; 4. The imaging device according to any one of items 1 to 3, comprising: [Item 5] a plurality of the first pixels; two third pixels that are arranged successively in a third direction intersecting the first direction, adjacent to two first pixels of the plurality of first pixels, and detect light of a third color; a plurality of third light receiving regions disposed in the third pixel and divided in the third direction to receive light of the third color; 5. The imaging device according to any one of items 1 to 4, comprising: [Item 6] The second direction and the third direction are parallel to each other. Item 5. The imaging device according to item 5. [Item 7] a plurality of first pixels arranged along a first direction and a second direction and corresponding to a first color; a plurality of other pixels corresponding to a color different from the first color, the other pixels being provided in respective areas surrounded by four adjacent first pixels; Equipped with an imaging element in which at least some of the plurality of first pixels and the plurality of other pixels have two separated light receiving regions; [Item 8] further comprising a focus detection unit that detects a focus state of the image sensor based on an output signal from each of the light receiving regions of the pixel having the two light receiving regions; Item 7. The imaging device according to item 7. [Item 9] The plurality of other pixels are a plurality of second pixels arranged along the second direction and corresponding to a second color; a plurality of third pixels arranged along the second direction and corresponding to a third color; Including, the second pixel columns and the third pixel columns are alternately arranged in the first direction; an array conversion unit that generates a first converted pixel signal by adding pixel signals of two of the first pixels that are adjacent in the first direction, generates a second converted pixel signal by adding pixel signals of two of the second pixels that are adjacent in the second direction, and generates a third converted pixel signal by adding pixel signals of two of the third pixels that are adjacent in the second direction; Item 9. The imaging device according to item 7 or 8. [Item 10] At least some of the first pixels have a first light receiving region and a second light receiving region arranged side by side in the first direction, At least some of the second pixels and the third pixels have first and second light receiving regions arranged side by side in the second direction. Item 9. The imaging device according to item 9. [Item 11] All the pixels have the two light receiving areas. Item 11. The imaging element according to item 10. [Item 12] The array conversion unit performs the following for each of the pixels: generating a first pixel signal by adding an output signal of the first light receiving region of the pixel and an output signal of the second light receiving region; generating a second pixel signal by adding an output signal of the first light receiving region of the pixel and an output signal of the second light receiving region of a pixel adjacent to the first light receiving region of the pixel; Item 12. The imaging element according to item 11. [Item 13] a global shutter processing unit that delays a reset timing of a second light receiving region of the two light receiving regions with respect to a reset timing of a first light receiving region that resets the charge accumulated therein, simultaneously reads out output signals corresponding to the amounts of charge accumulated in the first light receiving region and the second light receiving region, and subtracts the value of the output signal of the second light receiving region from the value of the output signal of the first light receiving region to generate a pixel signal of the pixel; Item 13. The imaging device according to any one of items 7 to 12. [Item 14] Further provided is a readout unit that simultaneously and independently reads out output signals corresponding to the amounts of charge accumulated in the two light-receiving regions for each pixel. Item 13. The imaging device according to any one of items 7 to 12. [Item 15] The planar shape of each of the pixels is quadrilateral, Each side of the pixel is inclined at 45 degrees with respect to the first direction and the second direction. Item 15. The imaging device according to any one of items 7 to 14. [Item 16] a correction unit that corrects values ​​of output signals output from the two light-receiving areas based on lens data that indicates characteristics of a lens through which light incident on the image sensor passes; Item 16. The imaging device according to any one of items 7 to 15. [Item 17] an imaging chip on which each of the pixels is formed; a signal processing chip stacked on the imaging chip and processing a signal from the imaging chip; 17. The imaging device according to any one of items 7 to 16, comprising: [Item 18] 18. An imaging device comprising the imaging element according to any one of items 1 to 17.

[0008] In a fourth aspect of the present invention, there is provided an imaging device including the imaging element according to any one of the first to third aspects.

[0009] The above summary of the invention does not list all of the necessary features of the present invention, and subcombinations of these features may also constitute inventions. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a diagram showing an overview of an image sensor 100 according to an embodiment. [Figure 2A] FIG. 2 is a diagram showing an example of a first pixel 202-1. [Figure 2B] FIG. 2 is a diagram showing an example of a second pixel 202-2 and a third pixel 202-3. [Figure 3] FIG. 2 is a diagram illustrating an example of a light receiving unit 200. [Figure 4] 10 is a diagram showing an example of array conversion processing in the signal processing unit 210. FIG. [Figure 5] FIG. 10 is a diagram showing an example of an arrangement of first conversion pixels 203-1. [Figure 6] 10 is a diagram showing an example of array conversion processing in the signal processing unit 210. FIG. [Figure 7] FIG. 10 is a diagram showing an example of an arrangement of second conversion pixels 203-2 and third conversion pixels 203-3. [Figure 8] FIG. 2 is a diagram showing an example of an arrangement of a first conversion pixel 203-1, a second conversion pixel 203-2, and a third conversion pixel 203-3. [Figure 9] 10 is a diagram showing another example of the light receiving section 200. FIG. [Figure 10A] FIG. 10 is a diagram illustrating an example of generating a first converted pixel signal G1. [Figure 10B] FIG. 10 is a diagram showing an example of generating a second converted pixel signal G2. [Figure 10C] FIG. 10 is a diagram illustrating an example of generating a third converted pixel signal G3. [Figure 10D] FIG. 10 is a diagram showing an example of generating a fourth converted pixel signal G4. [Figure 11A] FIG. 2 is a perspective view of a microlens 101. [Figure 11B] FIG. 2 is a diagram showing the planar shape of a microlens 101. [Figure 12]10 is a diagram illustrating another example of processing by the signal processing unit 210. FIG. [Figure 13] FIG. 2 is a diagram illustrating an example of the configuration of a light receiving unit 200. [Figure 14] 10 is a diagram showing another example of the configuration of the light receiving section 200. FIG. [Figure 15] 15 is a diagram showing an example of the arrangement of transfer transistors TX and charge detection units in the example shown in FIG. 14. FIG. [Figure 16] 1 is a diagram showing an example of a cross section of an imaging element 100. FIG. [Figure 17] FIG. 2 is a block diagram showing some of the functions of a signal processing unit 210. [Figure 18] 5A and 5B are diagrams illustrating the relationship between lens characteristics and output signals. [Figure 19] FIG. 1 is a block diagram showing an example of the configuration of an imaging device 500 according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention as claimed. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0012] 1 is a diagram showing an overview of an image sensor 100 according to one embodiment. The image sensor 100 includes a light receiving section 200 in which a plurality of pixels 202 are arranged, and a signal processing section 210 that processes signals from the light receiving section 200. Each of the plurality of pixels 202 has a light receiving element such as a photodiode, and accumulates charge in accordance with the amount of light received. The signal processing section 210 in this example reads out signals corresponding to the amount of charge accumulated in each pixel 202, and performs predetermined processing.

[0013] In this example, the plurality of pixels 202 are arranged in a matrix. That is, the plurality of pixels 202 are arranged along a plurality of rows and a plurality of columns. In this specification, the row direction is illustrated as the x-axis direction, and the column direction is illustrated as the y-axis direction. The row direction is an example of a first direction, and the column direction is an example of a second direction.

[0014] The plurality of pixels 202 includes a plurality of first pixels 202-1, a plurality of second pixels 202-2, and a plurality of third pixels 202-3. The first pixel 202-1 corresponds to a color filter of a first color, the second pixel 202-2 corresponds to a color filter of a second color, and the third pixel 202-3 corresponds to a color filter of a third color. In this example, the first color is green, the second color is blue, and the third color is red. In this example, the planar shape of each pixel 202 is quadrangular, and each side of the pixel 202 is inclined at 45 degrees with respect to the first direction and the second direction. In a more specific example, the planar shape of each pixel 202 is square.

[0015] A plurality of first pixels 202-1 are arranged in both the row and column directions. In this example, the first pixels 202-1 are arranged so that their vertices are adjacent to each other. This arrangement creates an area surrounded by four closely arranged first pixels 202-1. The second pixel 202-2 and the third pixel 202-3 are provided in the area surrounded by the four first pixels 202-1. In this example, the shapes of the pixels 202 are the same.

[0016] The second pixels 202-2 are arranged in the column direction. The third pixels 202-3 are also arranged in the column direction. The columns of the second pixels 202-2 and the columns of the third pixels 202-3 are alternately arranged in the row direction. The columns of the second pixels 202-2 and the columns of the third pixels 202-3 are arranged offset by half a pixel in the column direction with respect to the columns of the first pixels 202-1.

[0017] FIG. 2A illustrates an example of a first pixel 202-1. At least a portion of the first pixel 202-1 has two separated light receiving regions 214. The first light receiving region 214a and the second light receiving region 214b of the first pixel 202-1 are arranged side by side in the row direction. In this example, the two light receiving regions 214 are defined by equally dividing the region of the first pixel 202-1 into two by a line extending in the column direction. In this example, this line is the diagonal line of the first pixel 202-1. An element separator is provided between the light receiving regions 214 to prevent charge generated in response to incident light from moving between the light receiving regions 214. Note that in FIG. 2A, the microlens 101 provided corresponding to the first pixel 202-1 is indicated by a dotted line. In this example, the two light receiving regions 214 are provided at different positions in the row direction with respect to the common microlens 101.

[0018] In the light receiving unit 200, a plurality of first pixels 202-1, each having two light receiving regions 214, are arranged adjacent to each other in the row direction. The signal processing unit 210 functions as a focus detection unit that detects the focus state by detecting an image plane phase difference in the row direction between a signal from the first light receiving region 214a of each of the first pixels 202-1 arranged adjacent to each other in the row direction and a signal from the second light receiving region 214b. Because the first pixels 202-1 for detecting image plane phase difference are arranged adjacent to each other in the row direction, the image plane phase difference in the row direction can be detected with high accuracy. Furthermore, light utilization efficiency can be improved compared to a method of detecting image plane phase difference using light blocking.

[0019] 2B is a diagram illustrating an example of the second pixel 202-2 and the third pixel 202-3. At least a portion of the second pixel 202-2 and the third pixel 202-3 has two separated light receiving regions 214. The first light receiving region 214a and the second light receiving region 214b of the second pixel 202-2 and the third pixel 202-3 are arranged side by side in the column direction. In this example, the two light receiving regions 214 are defined by equally dividing the region of the second pixel 202-2 or the third pixel 202-3 into two by a line extending in the row direction. The two light receiving regions 214 of the second pixel 202-2 and the third pixel 202-3 are provided at different positions in the column direction with respect to the common microlens 101.

[0020] In the light receiving unit 200, a plurality of second pixels 202-2 or third pixels 202-3, each having two light receiving regions 214, are arranged adjacent to each other in the column direction. The signal processing unit 210 functions as a focus detection unit that detects the focus state by detecting the image plane phase difference in the column direction between the signal from the first light receiving region 214a of the second pixel 202-2 or the third pixel 202-3 arranged adjacent to each other in the column direction and the signal from the second light receiving region 214b. Because the second pixels 202-2 or the third pixels 202-3 for detecting the image plane phase difference are arranged adjacent to each other in the column direction, the image plane phase difference in the column direction can be detected with high accuracy. Furthermore, light utilization efficiency can be improved compared to a method of detecting the image plane phase difference using light blocking.

[0021] FIG. 3 is a diagram showing an example of the light receiving unit 200. In the light receiving unit 200 of this example, all pixels 202 have two light receiving regions 214. In FIG. 3, the boundary between the light receiving regions 214 in each pixel 202 is indicated by a dotted line. In this example, image data is generated using the outputs of all pixels 202, and the outputs of at least some of the pixels 202 are used for image plane phase difference detection. The signal processing unit 210 can use a pixel 202 at any position as the pixel 202 for image plane phase difference detection.

[0022] The signal processing unit 210 may change the pixel 202 used for image plane phase difference detection as needed. For example, the signal processing unit 210 may select the pixel 202 capturing an image of a specific subject as the pixel 202 for image plane phase difference detection. If the position of the pixel 202 capturing the image of the subject changes over time, the signal processing unit 210 may select the pixel 202 for image plane phase difference detection in accordance with the change. Furthermore, all of the pixels 202 may be used for image signal generation and also for image plane phase difference detection. In this example, since no light blocking is used for image plane phase difference detection, the utilization efficiency of incident light is not reduced even if a structure is adopted in which all of the pixels 202 can be used for image plane phase difference detection.

[0023] The signal processing unit 210 also functions as an array conversion unit that converts image data based on each pixel signal from the light receiving unit 200 into image data of a predetermined pixel array such as a Bayer array. When converting the array, the signal processing unit 210 adds together signals from the two light receiving regions 214 of each pixel 202 to generate a pixel signal from each pixel 202.

[0024] Fig. 4 is a diagram showing an example of the array conversion process in the signal processing unit 210. In Fig. 4, the column numbers of the multiple pixels 202 are m, m+1, m+2, . . ., m+k, . . ., and the row numbers are n, n+1, n+2, . . ., n+l, . . ., where k and l are integers. Fig. 4 illustrates a process for generating a converted pixel signal of the first converted pixel 203-1 after array conversion from the pixel signal of the first pixel 202-1. The first pixel 202-1 in this example is arranged in a column where k is 0 or an even number and in a row where l is 0 or an even number.

[0025] The plurality of first pixels 202-1 includes three or more first pixels 202-1 arranged consecutively in the first direction. For example, three first pixels 202-1 are arranged at positions (m, n+2), (m+2, n+2), and (m+4, n+2). The plurality of second pixels 202-2 (corresponding to pixel "B" in FIG. 4) include two second pixels 202-2 arranged consecutively in a second direction intersecting the first direction, each of which is adjacent to two of the three first pixels 202-1. For example, the second pixels 202-2 arranged at positions (m+3, n+1) and (m+3, n+3) are arranged adjacent to and intersect with the two first pixels 202-1 arranged at positions (m+2, n+2) and (m+4, n+2).

[0026] The plurality of third pixels 202-3 include two third pixels 202-3 arranged consecutively in a third direction intersecting the first direction, each of which is adjacent to two of the three first pixels 202-1. The second and third directions are parallel to each other and refer to directions at different locations. For example, the second direction is the direction from position (m+3, n+1) to position (m+3, n+3), and the third direction is the direction from position (m+1, n+1) to position (m+1, n+3). The two first pixels 202-1 adjacent to the two third pixels 202-3 differ in at least one of the first pixels 202-1 from the two first pixels 202-1 adjacent to the two second pixels 202-2. For example, two third pixels 202-3 arranged at positions (m+1, n+1) and (m+1, n+3) are arranged adjacent to and across two first pixels 202-1 arranged at positions (m, n+2) and (m+2, n+2).

[0027] The signal processing unit 210 adds pixel signals of two first pixels 202-1 adjacent to each other in the row direction to generate a conversion pixel signal of a first conversion pixel 203-1 virtually disposed between the two first pixels 202-1. In Fig. 4, the two first pixels 202-1 whose pixel signals are added together are connected by a double-headed arrow.

[0028] More specifically, the signal processing unit 210 groups the first pixels 202-1 in each row into pairs of two adjacent first pixels 202-1. The signal processing unit 210 adds the pixel signals of the paired two first pixels 202-1 to generate a converted pixel signal of the first conversion pixel 203-1. At this time, the first pixels 202-1 in each row are grouped so that the row-direction positions of the first conversion pixels 203-1 alternate for each row of the first pixels 202-1. For example, in the n+sth row (where s is 0, 4, 8, . . .), the first pixels 202-1 at column positions (m, m+2), (m+4, m+6), and (m+8, m+10) are grouped. On the other hand, in the (n+s+2)th row, the first pixels 202-1 at the column positions (m+2, m+4), (m+6, m+8), and (m+10, m+12) are grouped.

[0029] Fig. 5 is a diagram showing an example of the arrangement of the first conversion pixels 203-1. The first conversion pixels 203-1 are arranged as shown in Fig. 5 by the conversion process described in Fig. 4. That is, the first conversion pixels 203-1 are arranged so that the row-direction positions of the first conversion pixels 203-1 alternate for each row. Specifically, in the (n+s)th row, the first conversion pixels 203-1 are arranged at column positions m+1, m+5, and m+9. Furthermore, in the (n+s+2)th row, the first conversion pixels 203-1 are arranged at column positions m+3, m+7, and m+11.

[0030] 6 is a diagram showing an example of the array conversion process in the signal processing unit 210. In FIG. 6, a process for generating converted pixel signals of the second conversion pixel 203-2 and the third conversion pixel 203-3 after array conversion from the pixel signals of the second pixel 202-2 and the third pixel 202-3 will be described. In this example, the second pixel 202-2 and the third pixel 202-3 are arranged in columns where k is an odd number. In this example, the second pixel 202-2 is arranged in columns m+3, m+7, m+11, . . . The third pixel 202-3 is arranged in columns m+1, m+5, m+9, . . .

[0031] The signal processing unit 210 adds pixel signals of two second pixels 202-2 adjacent in the column direction to generate a conversion pixel signal of a second conversion pixel 203-2 virtually disposed between the two second pixels 202-2. The signal processing unit 210 also adds pixel signals of two third pixels 202-3 adjacent in the column direction to generate a conversion pixel signal of a third conversion pixel 203-3 virtually disposed between the two third pixels 202-3. In Fig. 6, the two pixels 202 whose pixel signals are added are connected by a double-headed arrow.

[0032] Note that the pair of second pixels 202-2 and the pair of third pixels 202-3 whose pixel signals are added together are selected so that the double-headed arrow connecting the two first pixels 202-1 described in Fig. 4 does not overlap with the double-headed arrow connecting the two second pixels 202-2 and the double-headed arrow connecting the two third pixels 202-3 described in Fig. 6. In other words, the pair of second pixels 202-2 and the pair of third pixels 202-3 whose pixel signals are added together are selected so that the positions of the first conversion pixel 203-1, the second conversion pixel 203-2, and the third conversion pixel 203-3 do not overlap.

[0033] More specifically, the second pixels 202-2 are grouped with the second pixels 202-2 at row positions (n+3, n+5), (n+7, n+9), and (n+11, n+13), while the third pixels 202-3 are grouped with the third pixels 202-3 at column positions (n+1, n+3), (n+5, n+7), and (n+9, n+11).

[0034] Fig. 7 is a diagram showing an example of the arrangement of the second conversion pixel 203-2 and the third conversion pixel 203-3. By the conversion process described in Fig. 6, the second conversion pixel 203-2 and the third conversion pixel 203-3 are arranged as shown in Fig. 7. Specifically, in columns m+3, m+7, and m+11, the second conversion pixel 203-2 is arranged at row positions n+4, n+8, and n+12. Furthermore, in rows m+1, m+5, and m+9, the third conversion pixel 203-3 is arranged at row positions n+2, n+6, and n+10.

[0035] Fig. 8 is a diagram showing an example of an arrangement of the first conversion pixel 203-1, the second conversion pixel 203-2, and the third conversion pixel 203-3. The arrangement shown in Fig. 8 is an arrangement in which the arrangements of the conversion pixels 203 shown in Fig. 5 and Fig. 7 are overlapped. By the processing described with reference to Fig. 4 to Fig. 7, the signal processing unit 210 can acquire image data in a Bayer arrangement as shown in Fig. 8.

[0036] According to the image sensor 100 described above, pixels for detecting image plane phase differences can be arranged consecutively in the row and column directions, thereby improving the accuracy of detecting image plane phase differences. Furthermore, image data in a Bayer array can be acquired by a simple calculation of adding pixel signals from adjacent pixels 202. Furthermore, since no light blocking is used for image plane phase difference detection, light utilization efficiency can be improved.

[0037] FIG. 9 is a diagram showing another example of the light receiving unit 200. In the light receiving unit 200 of this example, some of the first pixels 202-1, some of the second pixels 202-2, and some of the third pixels 202-3 each have two light receiving regions 214. However, the first pixels 202-1 having two light receiving regions 214 are arranged consecutively in the row direction. Furthermore, the second pixels 202-2 having two light receiving regions 214 are arranged consecutively in the column direction. Furthermore, the third pixels 202-3 having two light receiving regions 214 are arranged consecutively in the column direction. The other configurations are the same as those of the light receiving unit 200 described with reference to FIGS. 1 to 8.

[0038] Even with this configuration, pixels for detecting image plane phase differences can be arranged consecutively in the row and column directions, improving the accuracy of detecting image plane phase differences. Image data in the Bayer array can be obtained simply by adding pixel signals from adjacent pixels 202. Furthermore, since no light blocking is used for image plane phase difference detection, light utilization efficiency can be improved.

[0039] 10A to 10D are diagrams illustrating another example of processing by the signal processing unit 210. In this example, the signal processing unit 210 generates first to fourth converted pixel signals, each of which is shifted in the row direction, as a converted pixel signal for the first pixel 202-1. FIG. 10A is a diagram illustrating an example of generating a first converted pixel signal G1. The processing in this example is the same as the processing described in FIG. 4. That is, for each first pixel 202-1, the signal processing unit 210 adds the output signals of the first light receiving region 214a and the second light receiving region 214b within the pixel to generate a first pixel signal S1. Then, the signal processing unit 210 adds the first pixel signals S1 of two adjacent first pixels 202-1 to generate a first converted pixel signal G1. In this example, the first converted pixel signal G1 is a signal of a virtual converted pixel at a position m+1, m+5, . . .

[0040] 10B is a diagram showing an example of generating the second conversion pixel signal G2. In this example, the second conversion pixel signal G2 is a signal of a conversion pixel at a position different from the first conversion pixel signal G1. In this example, for each first pixel 202-1, the output signal of the first light receiving region 214a of that pixel is added to the output signal of the second light receiving region 214b of the first pixel 202-1 adjacent to the first light receiving region of that pixel to generate the second pixel signal S2. The signal processing unit 210 then adds the adjacent second pixel signals S2 to generate the second conversion pixel signal G2. In this example, the second conversion pixel signal G2 is a signal of a virtual conversion pixel at positions m+2, m+6, and so on.

[0041] 10C is a diagram showing an example of generating the third conversion pixel signal G3. In this example, the third conversion pixel signal G3 is a signal of a conversion pixel at a position different from the first conversion pixel signal G1 and the second conversion pixel signal G2. First, the third pixel signal S3 is generated by the same process as for the first pixel signal S1. Then, the signal processing unit 210 adds the adjacent third pixel signals S3 to generate the third conversion pixel signal G3. In this example, the third conversion pixel signal G3 is a signal of a virtual conversion pixel at a position m+3, m+7, . . .

[0042] 10D is a diagram showing an example of generating the fourth conversion pixel signal G4. In this example, the fourth conversion pixel signal G4 is a signal of a conversion pixel at a position different from the first conversion pixel signal G1, the second conversion pixel signal G2, and the third conversion pixel signal G3. First, the fourth pixel signal S4 is generated by the same process as for the second pixel signal S2. Then, the signal processing unit 210 adds the adjacent fourth pixel signals S4 to generate the fourth conversion pixel signal G4. In this example, the fourth conversion pixel signal G4 is a signal of a virtual conversion pixel at a position m, m+4, ...

[0043] Through this processing, the signal processing unit 210 can generate multiple types of converted pixel signals G1 to G4 at different positions. The signal processing unit 210 may use multiple types of converted pixel signals as image data for one frame or for different frames. That is, images based on multiple types of converted pixel signals may be displayed substantially simultaneously or at different frame timings. Furthermore, the signal processing unit 210 may generate the above-described multiple types of converted pixel signals from pixel signals captured substantially simultaneously, or may generate multiple types of converted pixel signals from pixel signals acquired at different capture timings. This processing can improve the spatial resolution of the image data. Note that although FIGS. 10A to 10D have been described using the first pixel 202-1 as an example, multiple types of converted pixel signals can also be generated for the second pixel 202-2 and the third pixel 202-3 using similar processing.

[0044] 11A and 11B are diagrams showing an example structure of a microlens 101. FIG. 11A is a perspective view of the microlens 101. Note that curved grid lines indicate a curved surface, and straight grid lines indicate a flat surface. FIG. 11B is a diagram showing the planar shape of the microlens 101. As shown in FIGS. 11A and 11B, the microlens 101 has a shape similar to that of a spherical lens with four sides cut off. This allows the use of spherical lenses with a larger diameter, thereby increasing the effective aperture of the microlens 101. Furthermore, by aligning the positions of the four sides of the microlens 101 with the positions of the four sides of the pixels 202, the microlenses 101 can be efficiently laid out.

[0045] FIG. 12 is a diagram showing another example of processing by the signal processing unit 210. The signal processing unit 210 of this example selects the pixels 202 from which the output signals of the light receiving regions 214 are to be read on a row-by-row basis. The signal processing unit 210 simultaneously reads the output signals of the pixels 202 belonging to the selected row. In this case, the readout timing of the output signals differs for each row, resulting in different charge accumulation times for each row. The signal processing unit 210 of this example compensates for the difference in charge accumulation time by correcting the output signal of the first light receiving region 214a using the output signal of the second light receiving region 214b of each pixel 202. Note that in the light receiving unit 200 of this example, all pixels 202 have two light receiving regions 214.

[0046] In Fig. 12, the charge accumulation time of the first light receiving region 214a of the pixel 202 belonging to the first row is indicated by a1, and the charge accumulation time of the second light receiving region 214b is indicated by b1. Furthermore, the charge accumulation time of the first light receiving region 214a of the pixel 202 belonging to the second row is indicated by a2, and the charge accumulation time of the second light receiving region 214b is indicated by b2. The same applies to the other rows. Furthermore, ADC in Fig. 12 indicates the time required to digitally convert the output signal of each light receiving region 214.

[0047] 12, the signal processing unit 210 delays the reset timing B of the second light receiving region 214b with respect to the reset timing A at which the charge accumulated in the first light receiving region 214a is reset for each pixel 202. For this reason, the light receiving unit 200 has reset lines that independently control the reset timing of the first light receiving region 214a and the second light receiving region 214b of each pixel 202. The reset timing A and reset timing B are common to all pixels 202.

[0048] The signal processing unit 210 then simultaneously reads out output signals corresponding to the amounts of charge accumulated in the first light-receiving region 214a and the second light-receiving region 214b for each pixel 202. To this end, the light-receiving unit 200 has readout lines that transmit the output signals of the first light-receiving region 214a and the second light-receiving region 214b of each pixel 202 in parallel. The signal processing unit 210 also has a processing circuit that processes the output signals of the first light-receiving region 214a and the second light-receiving region 214b of each pixel 202 in parallel.

[0049] The signal processing unit 210 subtracts the value of the output signal of the second light receiving region 214b from the value of the output signal of the first light receiving region 214a for each pixel 202 to generate a pixel signal for each pixel 202. This makes it possible to generate pixel signals corresponding to the charge accumulation time from reset timing A to reset timing B for all pixels 202. This processing makes it possible to generate pseudo pixel signals generated by the global shutter from output signals read out by rolling readout. The signal processing unit 210 also functions as a global shutter processing unit that performs the processing described with reference to FIG. 12.

[0050] FIG. 13 is a diagram showing an example of the configuration of the light receiving unit 200. Although FIG. 13 shows only the configuration of one pixel 202, all pixels 202 in the light receiving unit 200 have the same configuration. As described above, the light receiving unit 200 has a reset line 221-1 that controls the reset timing of the first light receiving region 214a and a reset line 221-2 that controls the reset timing of the second light receiving region 214b. The reset line 221-1 and the reset line 221-2 are provided for each row of pixels 202. The pixels 202 included in the same row are connected to the common reset line 221-1 and reset line 221-2.

[0051] The light receiving unit 200 also has a readout line 224-1 that reads out the output signal of the first light receiving region 214a and a readout line 224-2 that reads out the output signal of the second light receiving region 214b. The readout line 224-1 and the readout line 224-2 are provided for each column of pixels 202. The pixels 202 included in the same column are connected to the common readout line 224-1 and the readout line 224-2. The readout line 224 transmits each output signal to the signal processing unit 210.

[0052] The signal processing unit 210 selects a row from which to read out an output signal using a row selection signal SEL. The signal processing unit 210 also selects a light receiving region 214 to which the output signal should be transferred using transfer signals Tx1 and Tx2.

[0053] With this configuration, the signal processing unit 210 functions as a readout unit that simultaneously and independently reads out output signals corresponding to the amounts of charge accumulated in the first and second light receiving regions 214a and 214b for each pixel 202. Furthermore, the signal processing unit 210 can generate pseudo-pixel signals generated by a global shutter from output signals read out by rolling readout. The signal processing unit 210 may perform array conversion processing using the pixel signals described in FIGS. 11A, 11B, and 12 instead of the pixel signals described in FIGS. 1 to 10D. In other words, the signal processing unit 210 may generate pixel signals by subtracting the output signal of the second light receiving region 214b from the output signal of the first light receiving region 214a, without adding the output signals of the first and second light receiving regions 214a and 214b.

[0054] FIG. 14 is a diagram showing another example of the configuration of the light receiving unit 200. In the configuration of this example, the global shutter process described in FIGS. 12 and 13 is not performed. In this example, each light receiving region 214 is a photodiode. In the light receiving unit 200 of this example, a reset transistor R, a source follower transistor SF, and a selection transistor S are provided in common for four photodiodes. For example, the reset transistor R, etc. are provided in common for four photodiodes included in region 240.

[0055] Further, a transfer transistor TX is provided for each photodiode. Further, the four photodiodes are included in different pixels 202. For example, the four photodiodes sharing the reset transistor R and the like are included in two first pixels 202-1 and two second pixels 202-2.

[0056] The transfer transistor TX switches whether or not to transfer the charge accumulated in the photodiode to the charge detection unit. The charge detection unit is, for example, a capacitor connected between a wiring and a reference potential (not shown). This charge detection unit is also shared by the four photodiodes.

[0057] The reset transistor R switches whether or not to reset the charges transferred to the charge detection unit. The source follower transistor SF outputs an output signal according to the charges accumulated in the charge detection unit. The selection transistor S switches whether or not to output the output signal to the readout line 224.

[0058] FIG. 15 is a diagram showing an example of the arrangement of the transfer transistor TX and the charge detection unit in the example shown in FIG. 14. In this example, the pixel 202 and the transistor are provided in a different layer. This allows the pixel 202 and the transistor to be arranged overlapping each other. As described above, the charge detection unit and the reset transistor R are shared by four photodiodes PD. Each photodiode PD is provided with a transfer transistor TX. In FIG. 15, the gate electrode of the transfer transistor TX is indicated by a shaded area.

[0059] The four photodiodes are included in two first pixels 202-1 and two second pixels 202-2 or three third pixels 202-3. Because the first pixel 202-1, the second pixel 202-2, and the third pixel 202-3 are divided in different directions, an area surrounded by four transfer transistors TX is generated. This area functions as a charge detection unit. Note that although the reset transistor R and the like are omitted in FIG. 15, as shown in FIG. 14, the reset transistor R and the like are also shared by the four photodiodes.

[0060] 16 is a diagram showing an example of a cross section of an image sensor 100. In this example, a back-illuminated image sensor 100 is shown, but the image sensor 100 is not limited to the back-illuminated type. The image sensor 100 in this example includes an image sensor chip 113 that outputs a signal corresponding to incident light, a signal processing chip 111 that processes the signal from the image sensor chip 113, and a memory chip 112 that stores image data processed by the signal processing chip 111. The image sensor chip 113, the signal processing chip 111, and the memory chip 112 are stacked and electrically connected to each other by conductive bumps 109 made of Cu or the like.

[0061] As shown in the figure, incident light is mainly incident in the direction indicated by the white arrow. In this embodiment, the surface of the imaging chip 113 on which incident light is incident is referred to as the back surface. An example of the imaging chip 113 is a back-illuminated MOS image sensor. The imaging chip 113 corresponds to the light receiving unit 200. A PD (photodiode) layer 106 is arranged on the back surface side of the wiring layer 108. The PD layer 106 has a plurality of PD units 104 arranged two-dimensionally and accumulating charges corresponding to the incident light, and transistors 105 provided corresponding to the PD units 104. One PD unit 104 is provided for one pixel 202. That is, the PD unit 104 has a first light receiving region 214a and a second light receiving region 214b.

[0062] A color filter 102 is provided on the incident light side of the PD layer 106 via a passivation film 103. The color filters 102 are of multiple types that transmit different wavelength ranges, and have specific arrangements corresponding to the respective PD sections 104. A set of the color filter 102, the PD section 104, and the multiple transistors 105 forms one pixel. By controlling the on / off of the multiple transistors 105, the read timing, light reception start timing (reset timing), etc. of each light receiving region 214 are controlled.

[0063] A microlens 101 is provided corresponding to each pixel on the incident light side of the color filter 102. The microlens 101 condenses the incident light toward the corresponding PD section 104.

[0064] The wiring layer 108 has wiring 107 that transmits signals from the PD layer 106 to the signal processing chip 111. The wiring 107 corresponds to, for example, the readout line 224 shown in FIG. 12 . Furthermore, the wiring layer 108 may have formed thereon gate electrodes of the transistors shown in FIGS. 13 and 14 . Furthermore, the transistors shown in FIGS. 13 and 14 may be formed in the signal processing chip 111. In this case, the wiring 107 corresponds to wiring that connects the PD layer 106 to the transistors. The wiring 107 may be multi-layered and may include passive and active elements. The signal processing chip 111 of this example includes a signal processing unit 210.

[0065] A plurality of bumps 109 are arranged on the surface of the wiring layer 108. The plurality of bumps 109 are aligned with a plurality of bumps 109 provided on the opposing surface of the signal processing chip 111, and the imaging chip 113 and the signal processing chip 111 are pressed together, whereby the aligned bumps 109 are bonded together and electrically connected.

[0066] Similarly, a plurality of bumps 109 are arranged on the opposing surfaces of the signal processing chip 111 and the memory chip 112. These bumps 109 are aligned with each other, and the signal processing chip 111 and the memory chip 112 are pressed together, whereby the aligned bumps 109 are bonded together and electrically connected.

[0067] The bonding between the bumps 109 is not limited to Cu bump bonding by solid-phase diffusion, and micro-bump bonding by solder melting may also be used. It is sufficient to provide about one bump 109 for each unit block described below. Therefore, the size of the bumps 109 may be larger than the pitch of the PD sections 104. Furthermore, in a peripheral region other than the imaging region where pixels are arranged, bumps larger than the bumps 109 corresponding to the imaging region may also be provided.

[0068] The signal processing chip 111 has through-silicon vias (TSVs) 110 that connect circuits provided on the front and back surfaces of the chip to each other. The TSVs 110 are preferably provided in the peripheral region. The TSVs 110 may also be provided in the peripheral region of the imaging chip 113 and the memory chip 112.

[0069] 17 is a block diagram showing some of the functions of the signal processing unit 210. The signal processing unit 210 of this example has a correction unit 260 and a lookup table 270. As described with reference to FIGS. 1 to 16, the signal processing unit 210 adds or subtracts the output signals of the two light-receiving regions 214 in each pixel 202. However, the output signals of the two light-receiving regions 214 may vary depending on the characteristics of the lens through which the light incident on the image sensor passes.

[0070] For example, the ratio between the output value of the first light receiving region 214a and the output value of the second light receiving region 214b in each pixel 202 varies depending on the EPD value and F-number of the lens. The EPD value is a value indicating the distance from the image plane (the surface of the image sensor 100) to the exit pupil of the lens. The F-number is a value obtained by dividing the focal length of the lens by the effective aperture. The lookup table 270 stores a table that associates correction values ​​for correcting the output value of each light receiving region 214 with lens characteristic values ​​such as the EPD value and F-number. A table of lens characteristic values ​​and correction values ​​may be set for each position of the pixel 202.

[0071] The correction unit 260 receives lens data of the lens through which light incident on the image sensor passes from the imaging device, and receives an output signal from the light receiving unit 200. For example, the imaging device may detect lens characteristics from identification information of the lens unit being used. Alternatively, the imaging device may detect lens characteristics based on an operation of the imaging device by a user or the like. The correction unit 260 also receives information indicating the position of the pixel 202 of the output signal. The position information may be generated by the signal processing unit 210 based on a row selection signal SEL or the like.

[0072] The correction unit 260 extracts a correction value corresponding to the lens data from the lookup table 270. The correction value may be different for each light receiving region 214. The correction unit 260 uses the extracted correction value to generate corrected signals by correcting the output signals of the two light receiving regions 214. The signal processing unit 210 uses the corrected signals to generate pixel signals.

[0073] Fig. 18 is a diagram illustrating the relationship between lens characteristics and output signals. In Fig. 18, the horizontal axis represents the distance of the pixel 202 from the optical axis, and the vertical axis represents the magnitude of the output signal of the light-receiving region 214 in each pixel 202. In Fig. 18, the output signals of the two light-receiving regions 214 are indicated by solid and dotted lines.

[0074] Typically, the microlenses 101 in the image sensor 100 are arranged offset relative to the pixels 202 depending on the position of the pixels 202 relative to the optical axis. By designing in this way, for a lens with a certain EPD value, a light spot is arranged at the center of the pixel 202, regardless of the position of the pixel 202. In this way, the EPD value at which the light spot is at the center of the pixel 202, regardless of the position of the pixel 202, is called EPD just.

[0075] In contrast, with a lens with a shorter or longer EPD than a lens with just the EPD, the light spot will be displaced from the center of the pixel 202 depending on the position of the pixel 202. Because the pixel 202 is divided into two light-receiving regions 214 by the center line, if the light spot is displaced from the center of the pixel 202, a difference in the magnitude of the output signals will occur between the two light-receiving regions 214. For example, at a position away from the optical axis, most of the light spot will be contained in one of the light-receiving regions 214, and the output signal of that light-receiving region 214 will be very large, while the output signal of the other light-receiving region 214 will be very small.

[0076] Furthermore, when the F-number fluctuates, the diameter of the light spot on the image plane changes. For example, a smaller F-number results in a larger spot diameter. In this case, the difference in magnitude of the output signals from the two light-receiving regions 214 becomes smaller. On the other hand, at positions away from the optical axis, the light spot extends outside the region of the pixel 202, reducing the magnitude of the output signal from the entire pixel 202.

[0077] As described above, the magnitude of the output signals from the two light-receiving regions 214 varies depending on the lens characteristics, such as the EPD value and F-number. The signal processing unit 210 of this example is provided with a table in which correction values ​​for correcting this variation are associated with lens characteristic values. This table can be created by changing the lens characteristics and actually detecting the output signals. This configuration allows for more accurate pixel signal generation.

[0078] 19 is a block diagram showing an example of the configuration of an image capturing apparatus 500 according to one embodiment. The image capturing apparatus 500 includes a photographing lens 520 as an image capturing optical system, and the photographing lens 520 guides a subject light beam incident along an optical axis OA to the image capturing element 100. The photographing lens 520 may be an interchangeable lens that can be attached to and detached from the image capturing apparatus 500. The image capturing apparatus 500 mainly includes the image capturing element 100, a system control unit 501, a drive unit 502, a photometry unit 503, a work memory 504, a recording unit 505, a display unit 506, and a drive unit 514.

[0079] The photographing lens 520 is composed of a group of multiple optical lenses, and focuses the subject light beam from the scene near its focal plane. Note that in Figure 19, the photographing lens 520 is represented by a single virtual lens placed near the pupil.

[0080] The driver 514 drives the photographing lens 520. More specifically, the driver 514 moves the optical lens group of the photographing lens 520 to change the focus position, and also drives an iris diaphragm in the photographing lens 520 to control the amount of subject light entering the image sensor 100.

[0081] The drive unit 502 is a control circuit that executes charge accumulation control such as timing control and area control of the image sensor 100 in accordance with instructions from the system control unit 501. The drive unit 502 operates the light receiving unit 200 and signal processing unit 210 of the image sensor 100 as described with reference to Figures 1 to 18. In addition, the operation unit 508 accepts instructions from the photographer using a release button or the like.

[0082] The image sensor 100 is the same as the image sensor 100 described with reference to FIGS. 1 to 18. The image sensor 100 passes pixel signals to an image processing unit 511 of the system control unit 501. The image processing unit 511 performs various image processing using a work memory 504 as a workspace to generate image data. For example, when generating image data in JPEG file format, a color video signal is generated from a signal obtained using a Bayer array, and then compression processing is performed. The image processing unit 511 may include a signal processing unit 210. In this case, the image sensor 100 may not include the signal processing unit 210. The generated image data is recorded in a recording unit 505 and converted into a display signal, which is displayed on a display unit 506 for a predetermined time.

[0083] The photometry unit 503 detects the luminance distribution of a scene prior to a series of shooting sequences for generating image data. The photometry unit 503 includes, for example, an AE sensor with approximately one million pixels. The calculation unit 512 of the system control unit 501 receives the output of the photometry unit 503 and calculates the luminance of each region of the scene. The calculation unit 512 determines the shutter speed, aperture value, and ISO sensitivity according to the calculated luminance distribution. The image sensor 100 may also function as the photometry unit 503. The calculation unit 512 also performs various calculations for operating the imaging device 500. Part or all of the drive unit 502 may be mounted on the signal processing chip 111 of the image sensor 100. Part of the system control unit 501 may be mounted on the signal processing chip 111 of the image sensor 100.

[0084] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the claims that such modifications and improvements can also be included within the technical scope of the present invention.

[0085] It should be noted that the order of execution of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not specifically stated as "before," "prior to," etc., and that the processes can be performed in any order unless the output of a previous process is used in a subsequent process. Even if the operational flow in the claims, specifications, and drawings is described using "first," "next," etc. for convenience, this does not mean that the processes must be performed in this order. [Explanation of symbols]

[0086] 100 imaging element, 101 microlens, 102 color filter, 103 passivation film, 104 PD section, 105 transistor, 106 PD layer, 107 wiring, 108 wiring layer, 109 bump, 110 TSV, 111 signal processing chip, 112 memory chip, 113 imaging chip, 200 light receiving section, 202 pixel, 203 conversion pixel, 210 signal processing section, 214 light receiving area, 214a first light receiving area, 214b second light receiving area, 222-1, 222-2 reset line, 224 readout line, 260 correction section, 270 lookup table, 500 imaging device, 501 system control section, 502 drive section, 503 photometer section, 504 work memory, 505 recording section, 506 display section, 508 Operation unit, 511 image processing unit, 512 calculation unit, 514 drive unit, 520 photographing lens

Claims

1. a first photoelectric conversion unit that converts light transmitted through a first microlens and a first filter having a first spectral characteristic into an electric charge; a second photoelectric conversion unit that converts light that has passed through a second microlens disposed adjacent to the first microlens in the row direction and a second filter having the first spectral characteristic into electric charges; a third photoelectric conversion unit that converts light that has passed through a third microlens and a third filter having a second spectral characteristic different from the first spectral characteristic into an electric charge; a fourth photoelectric conversion unit that converts light that has passed through a fourth microlens disposed adjacent to the third microlens in the column direction and a fourth filter having the second spectral characteristic into electric charges; a fifth photoelectric conversion unit that converts light that has passed through the first microlens and the first filter into electric charges and is disposed adjacent to the first photoelectric conversion unit in the row direction; a sixth photoelectric conversion unit that converts light that has passed through the second microlens and the second filter into electric charges, the sixth photoelectric conversion unit being disposed adjacent to the second photoelectric conversion unit in the row direction; a seventh photoelectric conversion unit that converts light that has passed through the third microlens and the third filter into electric charges and is disposed adjacent to the third photoelectric conversion unit in the column direction; an eighth photoelectric conversion unit that converts light that has passed through the fourth microlens and the fourth filter into electric charges and is disposed adjacent to the fourth photoelectric conversion unit in the column direction; a first transfer unit that transfers the charges converted by the first photoelectric conversion unit; a second transfer unit that transfers the charges converted by the second photoelectric conversion unit; a third transfer unit that transfers the charges converted by the third photoelectric conversion unit; a fourth transfer unit that transfers the charges converted by the fourth photoelectric conversion unit; a first charge detection unit that detects the charges transferred from the first photoelectric conversion unit by the first transfer unit, the charges transferred from the second photoelectric conversion unit by the second transfer unit, the charges transferred from the third photoelectric conversion unit by the third transfer unit, and the charges transferred from the fourth photoelectric conversion unit by the fourth transfer unit; An imaging element comprising:

2. 2. The imaging device according to claim 1, the first charge detection unit is formed by one region shared by the first photoelectric conversion unit, the second photoelectric conversion unit, the third photoelectric conversion unit, and the fourth photoelectric conversion unit; Image sensor.

3. 3. The imaging device according to claim 1, a first transfer control line to which a control signal for controlling the first transfer unit is output; a second transfer control line to which a control signal for controlling the second transfer unit is output; a third transfer control line to which a control signal for controlling the third transfer unit is output; a fourth transfer control line to which a control signal for controlling the fourth transfer unit is output; An imaging element comprising:

4. 4. The imaging device according to claim 3, the first microlens, the second microlens, the third microlens, and the fourth microlens are disposed on a microlens layer; the first photoelectric conversion unit, the second photoelectric conversion unit, the third photoelectric conversion unit, and the fourth photoelectric conversion unit are disposed in a semiconductor layer stacked on the microlens layer, the first transfer control line, the second transfer control line, the third transfer control line, and the fourth transfer control line are arranged in a wiring layer stacked with the microlens layer, the semiconductor layer is disposed between the microlens layer and the wiring layer in a stacking direction in which the microlens layer, the semiconductor layer, and the wiring layer are stacked. Image sensor.

5. 5. The imaging device according to claim 4, The semiconductor layer is a first reset unit for resetting a voltage of the first charge detection unit; a first output section including a transistor having a gate electrically connected to the first charge detection section and outputting a signal based on the charge detected by the first charge detection section; Image sensor.

6. 6. The imaging device according to claim 5, a first reset control line, through which a control signal for controlling the first reset unit is output, is disposed in the wiring layer; Image sensor.

7. 7. The imaging device according to claim 5, a first output control line through which a control signal for controlling the first output unit is output is disposed in the wiring layer; Image sensor.

8. 8. The imaging device according to claim 5, a first signal line that is electrically connected to the first output unit and through which the signal is output; the first signal line is disposed in the wiring layer; Image sensor.

9. 9. The imaging device according to claim 8, a signal processing unit that performs signal processing on the signal output to the first signal line, the semiconductor layer and the wiring layer are disposed on a first semiconductor chip; the signal processing unit is disposed on a second semiconductor chip stacked on the first semiconductor chip; Image sensor.

10. 10. The imaging device according to claim 1, An imaging element including a control unit that controls so that an accumulation time of the electric charges converted by the first photoelectric conversion unit and an accumulation time of the electric charges converted by the second photoelectric conversion unit are different accumulation times.

11. The imaging device according to claim 10, the control unit controls so that an accumulation time of the electric charges converted by the third photoelectric conversion unit and an accumulation time of the electric charges converted by the fourth photoelectric conversion unit are different accumulation times. Image sensor.

12. 10. The imaging device according to claim 9, An imaging element including a third semiconductor chip that is a semiconductor chip stacked on the first semiconductor chip and has a memory section that stores the signal that has been signal-processed by the signal processing section.

13. 13. The imaging device according to claim 1, the first photoelectric conversion unit is disposed between the second photoelectric conversion unit and the fifth photoelectric conversion unit in the row direction; the second photoelectric conversion unit is disposed between the first photoelectric conversion unit and the sixth photoelectric conversion unit in the row direction, the third photoelectric conversion unit is disposed between the fourth photoelectric conversion unit and the seventh photoelectric conversion unit in the column direction; the fourth photoelectric conversion unit is disposed between the third photoelectric conversion unit and the eighth photoelectric conversion unit in the column direction; Image sensor.

14. 14. The imaging device according to claim 1, a fifth transfer unit that transfers the charges converted by the fifth photoelectric conversion unit; a sixth transfer unit that transfers the charges converted by the sixth photoelectric conversion unit; a seventh transfer unit that transfers the charges converted by the seventh photoelectric conversion unit; an eighth transfer unit that transfers the charges converted by the eighth photoelectric conversion unit; a second charge detection unit that detects the charges transferred from the fifth photoelectric conversion unit by the fifth transfer unit; a third charge detection unit that detects the charges transferred from the sixth photoelectric conversion unit by the sixth transfer unit; a fourth charge detection unit that detects the charges transferred from the seventh photoelectric conversion unit by the seventh transfer unit; a fifth charge detection unit that detects the charges transferred from the eighth photoelectric conversion unit by the eighth transfer unit; An imaging element comprising:

15. An imaging device comprising the imaging element according to any one of claims 1 to 14.

16. 16. The imaging device according to claim 15, an imaging device including a focus detection unit that performs focus detection based on a signal output from the imaging element;

17. 17. The imaging device according to claim 15 or 16, An imaging device comprising a generation unit that generates image data from a signal output from the imaging element.

Images