Transfer film and method for manufacturing conductive pattern

Abstract

Provided are a transfer film and applications thereof. The transfer film includes a temporary support body, a transfer layer, and a protection film in this order. The surface of the transfer layer facing the protection film has a surface free energy of 45 mJ / m2 to 65 mJ / m2.

Description

[Technical Field]

[0001] The present disclosure relates to a transfer film and a method for manufacturing a conductive pattern. [Background technology]

[0002] Transfer films are widely used in various pattern formation methods, such as photolithography. Typically, transfer films include a transfer layer. For example, in a pattern formation method using a transfer film, the transfer layer is disposed on an object (e.g., a substrate) by transfer onto the object. The transfer layer disposed on the object can form a pattern, for example, through exposure and development.

[0003] The following Patent Document 1 discloses a transfer film including a support film and a photosensitive resin layer made of a specific photosensitive resin composition provided on the support film. Patent Document 1: Japanese Patent Application Laid-Open No. 2020-086238 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional pattern formation methods using transfer films, resolution may decrease for the following reasons. Transfer of a transfer layer to an object is performed, for example, by laminating the transfer film and the object. However, if the adhesion between the transfer layer and the object is low, for example, a developer may penetrate into the gap between the transfer layer and the object during development, resulting in a decrease in resolution. Furthermore, when a transfer film includes a transfer layer and a protective film, a portion of the transfer layer may adhere to the surface of the peeled protective film during the process of peeling the protective film from the transfer film. In other words, a portion of the transfer layer may be removed by following the protective film. If a portion of the transfer layer is removed by following the protective film, the original properties of the transfer layer may not be expressed, and, for example, resolution may be reduced.

[0005] An object of one embodiment of the present disclosure is to provide a transfer film having excellent resolution.An object of another embodiment of the present disclosure is to provide a method for manufacturing a conductor pattern using a transfer film having excellent resolution. [Means for solving the problem]

[0006] The present disclosure includes the following aspects. <1> A temporary support, a transfer layer, and a protective film are included in this order, and the surface of the transfer layer facing the protective film has a surface free energy of 45 mJ / m 2 ~65mJ / m 2 That is, transfer film. <2> The surface free energy of the surface of the transfer layer facing the temporary support is 65 mJ / m 2 Below is the <1> The transfer film described in <3> The surface roughness Ra of the transfer layer facing the temporary support is 0.1 nm to 15 nm. <1> or <2> The transfer film described in <4> the surface roughness Ra of the temporary support facing the transfer layer is 0.1 nm to 15 nm; <1> ~ <3> 1. A transfer film according to any one of the preceding items. <5> The transfer layer is a photosensitive layer. <1> ~ <4> 1. A transfer film according to any one of the preceding items. <6> the transfer layer includes an intermediate layer and a photosensitive layer; <1> ~ <4> 1. A transfer film according to any one of the preceding items. <7> the intermediate layer contains an alkali-soluble resin and a polymerizable compound, and the ratio of the mass of the polymerizable compound to the mass of the alkali-soluble resin in the intermediate layer is 0.5 or more; <6> The transfer film described in <8> The thickness of the intermediate layer is 10 μm or less. <6> or <7> The transfer film described in <9> The intermediate layer includes a thermoplastic resin layer and a water-soluble resin layer. <6> ~ <8> 1. A transfer film according to any one of the preceding items. <10> the photosensitive layer contains an alkali-soluble resin and a polymerizable compound, and the ratio of the mass of the polymerizable compound to the mass of the alkali-soluble resin in the photosensitive layer is 0.6 or more; <5> ~ <9> 1. A transfer film according to any one of the preceding items. <11> The thickness of the photosensitive layer is 10 μm or less. <5> ~ <10> 1. A transfer film according to any one of the preceding items. <12> <1> ~ <11> peeling off a protective film from a transfer film described in any one of the above, bonding the transfer film to a substrate including a metal layer, and arranging a transfer layer and a temporary support in this order on the metal layer of the substrate, exposing the transfer layer to light, developing the transfer layer to form a resist pattern, etching or plating the metal layer that is not covered by the resist pattern, and peeling off the resist pattern. <13> <1> ~ <11> peeling off a protective film from a transfer film described in any one of the above items; bonding the transfer film to a substrate including a metal layer, and arranging a transfer layer and a temporary support in this order on the metal layer of the substrate; peeling off the temporary support; exposing the transfer layer to light; developing the transfer layer to form a resist pattern; etching or plating the metal layer that is not covered by the resist pattern; and peeling off the resist pattern. <14> The peel strength of the temporary support when peeled off is 0.3 mN / mm to 2.0 mN / mm. <13> A method for manufacturing the conductor pattern according to claim 1. [Effects of the Invention]

[0007] According to one embodiment of the present disclosure, a transfer film having excellent resolution is provided. According to another embodiment of the present disclosure, a method for manufacturing a conductor pattern using a transfer film having excellent resolution is provided. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic diagram illustrating an example of the configuration of a transfer film according to an embodiment. [Figure 2] FIG. 1 is a schematic plan view showing pattern A. [Figure 3] FIG. 10 is a schematic plan view showing pattern B. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present disclosure will be described below with reference to the accompanying drawings, in which reference numerals may be omitted. In the present disclosure, a numerical range expressed using "to" means a range that includes the numerical values ​​before and after "to" as the lower and upper limits. In the present disclosure, "(meth)acrylic" refers to either or both of acrylic and methacrylic, "(meth)acrylate" refers to either or both of acrylate and methacrylate, and "(meth)acryloyl" refers to either or both of acryloyl and methacryloyl. In the present disclosure, the amount of each component in a composition means the total amount of the corresponding substances present in the composition, unless otherwise specified, when multiple substances corresponding to each component are present in the composition. In the present disclosure, the term "process" includes not only an independent process but also a process that cannot be clearly distinguished from other processes as long as the intended purpose of the process is achieved. In the description of groups (atomic groups) in the present disclosure, descriptions that do not specify whether they are substituted or unsubstituted include those that have a substituent as well as those that do not have a substituent. For example, the term "alkyl group" includes not only alkyl groups that do not have a substituent (unsubstituted alkyl groups) but also alkyl groups that have a substituent (substituted alkyl groups). In this disclosure, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. In addition, light used for exposure generally includes the bright line spectrum of a mercury lamp, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, electron beams, and other actinic rays (active energy rays). Chemical structural formulae in the present disclosure may be described as simplified structural formulae in which hydrogen atoms are omitted. In the present disclosure, "% by mass" and "% by weight" are synonymous, and "parts by mass" and "parts by weight" are synonymous. In the present disclosure, a combination of two or more preferred embodiments is a more preferred embodiment. In the present disclosure, "transparent" means that the average transmittance of visible light with a wavelength of 400 nm to 700 nm is 80% or more, and preferably 90% or more. In the present disclosure, the average transmittance of visible light is a value measured using a spectrophotometer, and can be measured using, for example, a spectrophotometer U-3310 manufactured by Hitachi, Ltd. Unless otherwise specified, the weight-average molecular weight (Mw) and number-average molecular weight (Mn) in this disclosure are molecular weights determined by gel permeation chromatography (GPC) using columns of TSKgel GMHxL, TSKgel G4000HxL, or TSKgel G2000HxL (all trade names manufactured by Tosoh Corporation), detection with a differential refractometer using THF (tetrahydrofuran) as a solvent, and conversion using polystyrene as a standard substance. In the present disclosure, unless otherwise specified, the content of metal elements is a value measured using an inductively coupled plasma (ICP) spectroscopic analyzer. In this disclosure, unless otherwise specified, the refractive index is a value measured using an ellipsometer at a wavelength of 550 nm. In this disclosure, unless otherwise specified, the hue is a value measured using a color difference meter (CR-221, manufactured by Minolta Co., Ltd.). In the present disclosure, "alkali-soluble" means that the solubility in 100 g of a 1% by mass aqueous solution of sodium carbonate at a liquid temperature of 22°C is 0.1 g or more. In the present disclosure, "water-soluble" means that the solubility in 100 g of water having a pH of 7.0 and a liquid temperature of 22° C. is 0.1 g or more. Therefore, for example, a water-soluble resin refers to a resin that satisfies the above-mentioned solubility conditions. In this disclosure, "solids" means all components excluding solvent. In the present disclosure, the thickness of each layer of the transfer film is measured by observing a cross section perpendicular to the main surface of the transfer film using a scanning electron microscope (SEM), measuring the thickness of each layer at any five or more points based on the obtained observation image, and calculating the average value.

[0010] <Transfer film> A transfer film according to an embodiment of the present disclosure includes a temporary support, a transfer layer, and a protective film in this order, and has a surface free energy of 45 mJ / m 2 ~65mJ / m 2 The "surface of the transfer layer facing the protective film" specifically refers to the surface of the transfer layer facing the protective film. The surface free energy of the surface of the transfer layer facing the protective film is 45 mJ / m 2 If the surface free energy of the surface of the transfer layer facing the protective film is 65 mJ / m or more, the adhesion between the transfer layer and the object (for example, a substrate) is improved when the transfer layer is transferred to the object, and the resolution is also improved. 2 When the thickness is less than 1 / 2 mm, the transfer layer adheres to the surface of the peeled protective film, and a decrease in resolution is suppressed. Therefore, according to one embodiment of the present disclosure, a transfer film having excellent resolution is provided.

[0011] Each layer in the transfer film may have a single layer structure or a multi-layer structure. Examples of the transfer layer include a photosensitive layer and an intermediate layer. Examples of the intermediate layer include a thermoplastic resin layer and a water-soluble resin layer. Examples of the configuration of the transfer film are shown below. However, the configuration of the transfer film is not limited to the following examples. In each of the following configurations, the photosensitive layer is preferably a negative photosensitive layer. It is also preferable that the photosensitive layer is a colored resin layer.

[0012] (1) "Temporary support / photosensitive layer / protective film" (2) "Temporary support / intermediate layer / photosensitive layer / protective film" (3) "Temporary support / thermoplastic resin layer / water-soluble resin layer / photosensitive layer / protective film"

[0013] The structure of the transfer film will be described with reference to Fig. 1. Fig. 1 is a schematic diagram showing the structure of a transfer film according to an embodiment. The transfer film 100 shown in Fig. 1 includes a temporary support 10, an intermediate layer 20, a photosensitive layer 30, and a protective film 40, in this order.

[0014] From the viewpoint of preventing the generation of bubbles in the lamination process described below, the maximum waviness width of the transfer film is preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 60 μm or less. The maximum waviness width of the transfer film is preferably 0 μm or more, more preferably 0.1 μm or more, and even more preferably 1 μm or more. The maximum waviness width of the transfer film is measured by the following procedure. First, the transfer film is cut in a direction perpendicular to the main surface to a size of 20 cm long x 20 cm wide to prepare a test sample. If the transfer film includes a protective film, the protective film is peeled off. Next, the test sample is placed on a smooth and horizontal stage with the surface of the temporary support facing the stage. After placing it, the surface of the test sample is scanned with a laser microscope (e.g., VK-9700SP manufactured by Keyence Corporation) within a 10 cm square area at the center of the test sample to obtain a three-dimensional surface image, and the minimum concave height is subtracted from the maximum convex height observed in the obtained three-dimensional surface image. The above operation is carried out for 10 test samples, and the arithmetic mean value is taken as the "maximum width of undulation of the transfer film."

[0015] (Constituent elements of transfer film: temporary support) The transfer film according to one embodiment of the present disclosure includes a temporary support. The temporary support is a support that supports the transfer layer and is peelable.

[0016] The surface roughness Ra of the temporary support facing the transfer layer is preferably 0.1 nm to 15 nm, more preferably 0.1 nm to 10 nm, even more preferably 0.1 nm to 6 nm, and particularly preferably 0.1 nm to 2 nm. The "surface of the temporary support facing the transfer layer" specifically refers to the surface of the temporary support facing the transfer layer. Increasing the surface roughness Ra of the temporary support facing the transfer layer improves the releasability of the temporary support, and, for example, inhibits adhesion of the transfer layer to the surface of the peeled temporary support. Reducing the surface roughness Ra of the temporary support facing the transfer layer inhibits an increase in the surface roughness Ra of the transfer layer caused by the temporary support. Furthermore, reducing the surface roughness Ra of the temporary support facing the transfer layer inhibits light scattering during exposure of the transfer layer through the temporary support. These results in improved resolution.

[0017] The roughness Ra of the surface of the temporary support facing the transfer layer is the arithmetic mean roughness Ra measured by the following method. A three-dimensional optical profiler (New View 7300, Zygo) is used to obtain a surface profile of the target surface. The measurement and analysis software used is the "Microscope Application" of "MetroPro ver. 8.3.2." Next, the "Surface Map" screen is displayed using the software, and histogram data is obtained in the "Surface Map" screen. The arithmetic mean roughness Ra of the target surface is calculated from the obtained histogram data. If the target surface is covered by another layer, the target surface is exposed by peeling off the other layer, and then the arithmetic mean roughness Ra of the target surface is measured.

[0018] The temporary support may have a single layer structure or a multi-layer structure. The temporary support is preferably a film, more preferably a resin film. The temporary support is preferably a film that is flexible and does not significantly deform, shrink, or stretch under pressure or under pressure and heat.

[0019] Examples of the film include polyethylene terephthalate (PET) film (e.g., biaxially stretched polyethylene terephthalate film), polymethyl methacrylate film, cellulose triacetate film, polystyrene film, polyimide film, and polycarbonate film. As the temporary support, polyethylene terephthalate film is preferred. The film used as the temporary support is preferably free from deformation such as wrinkles and scratches.

[0020] From the viewpoint of enabling pattern exposure through the temporary support, it is preferable that the temporary support has high transparency. The transmittance of the temporary support at 365 nm is preferably 60% or more, more preferably 70% or more.

[0021] From the viewpoints of pattern formability during pattern exposure through the temporary support and transparency of the temporary support, it is preferable that the haze of the temporary support is small. Specifically, the haze of the temporary support is preferably 2% or less, more preferably 0.5% or less, and even more preferably 0.1% or less.

[0022] From the viewpoint of pattern formability during pattern exposure through the temporary support and the transparency of the temporary support, it is preferable that the number of coarse particles, foreign matter, and defects contained in the temporary support is small. The number of particles, foreign matter, and defects with a diameter of 1 μm or more in the temporary support should be 50 / 10 mm. 2 Preferably, it is 10 pieces / 10 mm or less. 2 It is more preferable that the number of pieces is 3 pieces / 10 mm or less. 2 More preferably, it is 0 pieces / 10 mm or less. 2 It is particularly preferred that:

[0023] The thickness of the temporary support is not particularly limited, but is preferably 5 μm to 200 μm, and from the viewpoint of ease of handling and versatility, more preferably 10 μm to 150 μm, and even more preferably 10 μm to 50 μm.

[0024] Examples of the temporary support include a biaxially oriented polyethylene terephthalate film having a thickness of 16 μm, a biaxially oriented polyethylene terephthalate film having a thickness of 12 μm, and a biaxially oriented polyethylene terephthalate film having a thickness of 9 μm.

[0025] Preferred embodiments of the temporary support are described, for example, in paragraphs 0017 to 0018 of JP-A-2014-85643, paragraphs 0019 to 0026 of JP-A-2016-27363, paragraphs 0041 to 0057 of WO-A-2012 / 081680, paragraphs 0029 to 0040 of WO-A-2018 / 179370, and paragraphs 0012 to 0032 of JP-A-2019-101405, the contents of which are incorporated herein by reference.

[0026] To improve handleability, a layer containing fine particles (also referred to as a "lubricant layer" or "particle-containing layer") may be provided on the surface of the temporary support. The lubricant layer may be provided on one side or both sides of the temporary support. The diameter of the particles contained in the lubricant layer is preferably 0.05 μm to 0.8 μm. The thickness of the lubricant layer is preferably 0.05 μm to 1.0 μm.

[0027] (Component of transfer film: transfer layer) A transfer film according to an embodiment of the present disclosure includes a transfer layer. The surface of the transfer layer facing the protective film has a surface free energy of 45 mJ / m 2 ~65mJ / m 2 The surface free energy of the surface of the transfer layer facing the protective film is 45 mJ / m 2 If the surface free energy of the surface of the transfer layer facing the protective film is 65 mJ / m or more, the adhesion between the transfer layer and the object (for example, a substrate) is improved when the transfer layer is transferred to the object, and the resolution is also improved. 2 When the surface free energy of the transfer layer is 45 mJ / m or less, adhesion of the transfer layer to the surface of the peeled protective film is suppressed, and a decrease in resolution is also suppressed. 2 ~60mJ / m 2 is preferably 45 mJ / m2 ~55mJ / m 2 It is more preferable that:

[0028] The surface free energy of the surface of the transfer layer facing the temporary support is 65 mJ / m 2 It is preferable that the surface free energy of the surface of the transfer layer facing the temporary support is 65 mJ / m or less. 2 When the surface free energy of the transfer layer facing the temporary support is 45 mJ / m or less, adhesion of the transfer layer to the surface of the peeled temporary support is suppressed, and a decrease in resolution is also suppressed. When the surface free energy of the transfer layer facing the temporary support is increased, for example, resolution is improved in an exposure method in which the transfer layer is in contact with a photomask. From the viewpoint of resolution, the surface free energy of the transfer layer facing the temporary support is 45 mJ / m or less. 2 ~65mJ / m 2 is preferably 45 mJ / m 2 ~55mJ / m 2 More preferably, 45 mJ / m 2 ~50mJ / m 2 It is more preferable that:

[0029] In the present disclosure, the surface free energy is calculated by the following method. The contact angles of two types of samples are measured using a contact angle meter CA-A model (manufactured by Kyowa Interface Science Co., Ltd.) in an atmosphere at room temperature of 23°C and relative humidity of 50% to 60%. Specifically, the contact angle of pure water on the target surface and the contact angle of methylene iodide on the target surface are measured. For each contact angle measurement, the average value of three measurements is used as the contact angle. Using the contact angles of the two types of samples, the dispersion force γ d and polar force γ p The surface free energy γ (=γ d +γ p The specific calculation method and the meaning of the symbols are shown below. gamma SL : Surface free energy of the target surface and a known solution gamma S : Surface free energy of the target surface gamma L : surface free energy of known solution gammaS d : Dispersion force component of the surface free energy of the target surface gamma S p : Polar force component of the surface free energy of the target surface gamma L d : Dispersion force component of the surface free energy of a known solution gamma L p : Polar component of the surface free energy of a known solution gamma SL Regarding the tension at the interface between the target surface and the liquid, the following formula (1) holds true. Formula (1): γ SL =γ S +γ L -2(γ S d γ L d ) 1 / 2 -2(γ S p γ L p ) 1 / 2 The state when a droplet is in contact with a smooth surface at a contact angle (θ) is expressed by the following equation (Young's equation). Formula (2): γ S =γ SL +γ L cosθ Combining equations (1) and (2), we obtain: Equation (3):(γ s d γ L d ) 1 / 2 +(γ s p γ L p ) 1 / 2 (=γ L (1+cosθ) / 2 In practice, the contact angle (θ) of two types of samples, pure water and methylene iodide, and the surface free energy γ of a known solution are L And each component (γ L d , γ L p) into equation (3) and solve the simultaneous equations. As a result, the surface free energy (γ S ) is calculated.

[0030] The method for adjusting the surface free energy of the surface of the transfer layer is not limited. Factors that affect the surface free energy of the surface of the transfer layer include, for example, the composition of the transfer layer. As will be described later, the surface free energy of the surface of the transfer layer is adjusted by, for example, the type of alkali-soluble resin, the type of polymerizable compound, the ratio of the mass of the polymerizable compound to the mass of the alkali-soluble resin, and the type of additive.

[0031] From the viewpoint of resolution, the surface roughness Ra of the transfer layer facing the temporary support is preferably 0.1 nm to 15 nm, more preferably 0.1 nm to 10 nm, even more preferably 0.1 nm to 6 nm, and particularly preferably 0.1 nm to 2 nm. The surface roughness Ra of the transfer layer facing the temporary support is measured by a method similar to the method for measuring the surface roughness Ra of the temporary support facing the transfer layer described in the above section "Temporary Support."

[0032] The transfer layer may have a single-layer structure or a multi-layer structure. The transfer layer preferably includes a photosensitive layer. The transfer layer may be a photosensitive layer. The transfer layer may further include layers other than the photosensitive layer. For example, the transfer layer may include an intermediate layer and a photosensitive layer. The intermediate layer improves the lamination properties of the transfer film. The intermediate layer, for example, improves the conformability to the substrate when the transfer film is bonded to the substrate, suppresses the inclusion of air bubbles between the substrate and the transfer film, and improves the adhesion between the substrate and the transfer film. The intermediate layer is preferably disposed between the temporary support and the photosensitive layer. That is, the transfer film preferably includes a temporary support, an intermediate layer, a photosensitive layer, and a protective film in this order. Examples of the intermediate layer include a thermoplastic resin layer and a water-soluble resin layer. Specific embodiments of each layer constituting the transfer layer are described below.

[0033] (Constituent element of transfer layer: photosensitive layer) The photosensitive layer can be transferred onto a substrate, for example, and then exposed and developed to form a pattern. The photosensitive layer may be a negative photosensitive layer or a positive photosensitive layer. The photosensitive layer is preferably a negative photosensitive layer. When the photosensitive layer is a negative photosensitive layer, the formed pattern corresponds to a cured layer. When the photosensitive layer is a negative photosensitive layer, the negative photosensitive layer preferably contains a resin, a polymerizable compound, and a polymerization initiator. When the photosensitive layer is a negative photosensitive layer, it is also preferable that an alkali-soluble resin is contained as part or all of the resin. That is, in one embodiment, the photosensitive layer preferably contains a resin containing an alkali-soluble resin, a polymerizable compound, and a polymerization initiator. The photosensitive layer preferably contains 10% by mass to 90% by mass of an alkali-soluble resin, 5% by mass to 70% by mass of an ethylenically unsaturated compound, and 0.01% by mass to 20% by mass of a photopolymerization initiator, relative to the total mass of the photosensitive layer.

[0034] (Photosensitive layer components: alkali-soluble resin) The photosensitive layer preferably contains an alkali-soluble resin. Suitable examples of the alkali-soluble resin include known alkali-soluble resins used in etching resists. The alkali-soluble resin is preferably a binder polymer. The alkali-soluble resin is preferably an alkali-soluble resin having an acid group. The alkali-soluble resin is preferably a polymer A described below.

[0035] The photosensitive layer preferably contains polymer A as an alkali-soluble resin. To achieve better resolution by suppressing swelling of the photosensitive layer in a developer, the acid value of polymer A is preferably 220 mgKOH / g or less, more preferably less than 200 mgKOH / g, and even more preferably less than 190 mgKOH / g. The lower limit of the acid value of polymer A is not particularly limited. To achieve better developability, the acid value of polymer A is preferably 60 mgKOH / g or more, more preferably 120 mgKOH / g or more, even more preferably 150 mgKOH / g or more, and particularly preferably 170 mgKOH / g or more. The acid value is the mass [mg] of potassium hydroxide required to neutralize 1 g of sample, and in the present disclosure, the unit is expressed as mgKOH / g. The acid value can be calculated, for example, from the average content of acid groups in the compound. The acid value of polymer A can be adjusted by adjusting the type of structural units constituting polymer A and the content of structural units containing acid groups.

[0036] The weight-average molecular weight of polymer A is preferably 5,000 to 500,000. A weight-average molecular weight of 500,000 or less is preferred from the viewpoint of improving resolution and developability. The weight-average molecular weight of polymer A is more preferably 100,000 or less, even more preferably 60,000 or less, and particularly preferably 50,000 or less. On the other hand, a weight-average molecular weight of 5,000 or more is preferred from the viewpoint of controlling the properties of development aggregates and the properties of the unexposed film, such as edge fusing and cut-chip properties of the photosensitive layer. The weight-average molecular weight of polymer A is more preferably 10,000 or more, even more preferably 20,000 or more, and particularly preferably 30,000 or more. Edge fusing refers to the degree to which the photosensitive layer easily protrudes from the edge of a roll when the transfer film is wound into a roll. Cut-chip properties refer to the degree to which chips easily fly off when the unexposed film is cut with a cutter. If these chips adhere to the upper surface of the photosensitive layer, they will be transferred to a mask during a subsequent exposure process, resulting in defective products. The polydispersity of polymer A is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, even more preferably 1.0 to 4.0, and particularly preferably 1.0 to 3.0. In the present disclosure, the weight-average molecular weight (Mw) and number-average molecular weight (Mn) are values ​​measured using gel permeation chromatography. The polydispersity is the ratio of the weight-average molecular weight to the number-average molecular weight (weight-average molecular weight / number-average molecular weight).

[0037] From the viewpoint of suppressing line width thickening and deterioration of resolution when the focal position is shifted during exposure, polymer A preferably has an aromatic hydrocarbon group, and more preferably has a structural unit having an aromatic hydrocarbon group. Examples of aromatic hydrocarbon groups include a substituted or unsubstituted phenyl group and a substituted or unsubstituted aralkyl group. The content of the structural unit having an aromatic hydrocarbon group in polymer A is preferably 20% by mass or more, more preferably 30% by mass or more, even more preferably 40% by mass or more, particularly preferably 45% by mass or more, and most preferably 50% by mass or more, based on the total mass of polymer A. There is no particular upper limit, but it is preferably 95% by mass or less, more preferably 85% by mass or less. When multiple types of polymer A are contained, the content of the structural unit having an aromatic hydrocarbon group is determined as a weight average value.

[0038] Examples of monomers that form structural units having an aromatic hydrocarbon group include monomers having an aralkyl group, styrene, and polymerizable styrene derivatives (e.g., methylstyrene, vinyltoluene, tert-butoxystyrene, acetoxystyrene, 4-vinylbenzoic acid, styrene dimer, styrene trimer, etc.). Among these, monomers having an aralkyl group or styrene are preferred. In one embodiment, when the monomer that forms the structural units having an aromatic hydrocarbon group in polymer A is styrene, the content of styrene-derived structural units is preferably 20% by mass to 50% by mass, more preferably 25% by mass to 45% by mass, even more preferably 30% by mass to 40% by mass, and particularly preferably 30% by mass to 35% by mass, based on the total mass of polymer A.

[0039] The aralkyl group includes a substituted or unsubstituted phenylalkyl group, and a substituted or unsubstituted benzyl group is preferred.

[0040] Examples of the monomer having a substituted or unsubstituted phenylalkyl group other than a benzyl group include phenylethyl (meth)acrylate.

[0041] Examples of the monomer having a substituted or unsubstituted benzyl group include (meth)acrylates having a substituted or unsubstituted benzyl group (e.g., benzyl (meth)acrylate, chlorobenzyl (meth)acrylate, etc.); and vinyl monomers having a benzyl group (e.g., vinylbenzyl chloride, vinylbenzyl alcohol, etc.). Of these, benzyl (meth)acrylate is preferred. In one embodiment, when the monomer forming the structural unit having an aromatic hydrocarbon group in polymer A is benzyl (meth)acrylate, the content of the structural unit derived from benzyl (meth)acrylate is preferably 50% by mass to 95% by mass, more preferably 60% by mass to 90% by mass, even more preferably 70% by mass to 90% by mass, and particularly preferably 75% by mass to 90% by mass, based on the total mass of polymer A.

[0042] The polymer A having a structural unit having an aromatic hydrocarbon group is preferably obtained by polymerizing a monomer having an aromatic hydrocarbon group with at least one type of first monomer described below and / or at least one type of second monomer described below.

[0043] The polymer A having no structural unit having an aromatic hydrocarbon group is preferably obtained by polymerizing at least one type of first monomer described below, and more preferably obtained by copolymerizing at least one type of first monomer with at least one type of second monomer described below.

[0044] The first monomer is a monomer having a carboxy group in the molecule. Examples of the first monomer include (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, 4-vinylbenzoic acid, maleic anhydride, and maleic acid half ester. Among these, (meth)acrylic acid is preferred.

[0045] The content of the structural units derived from the first monomer in polymer A is preferably 5% by mass to 50% by mass, more preferably 10% by mass to 40% by mass, and even more preferably 15% by mass to 30% by mass, based on the total mass of polymer A.

[0046] The content of the structural unit derived from the first monomer is preferably 10% by mass to 50% by mass, based on the total mass of polymer A. A content of 10% by mass or more is preferred from the viewpoints of achieving good developability and controlling edge fusing properties, and is more preferably 15% by mass or more, and even more preferably 20% by mass or more. A content of 50% by mass or less is preferred from the viewpoints of high resolution and foot shape of the resist pattern, and furthermore chemical resistance of the resist pattern, and from these viewpoints, a content of 35% by mass or less is more preferred, more preferably 30% by mass or less, and particularly preferably 27% by mass or less.

[0047] The second monomer is non-acidic and has at least one ethylenically unsaturated group in the molecule. Examples of the second monomer include (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, cyclohexyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate; vinyl alcohol esters such as vinyl acetate; and (meth)acrylonitrile. Among these, methyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and n-butyl (meth)acrylate are preferred, with methyl (meth)acrylate being particularly preferred.

[0048] The content of the structural units derived from the second monomer in polymer A is preferably 5% by mass to 60% by mass, more preferably 15% by mass to 50% by mass, and even more preferably 20% by mass to 45% by mass, based on the total mass of polymer A.

[0049] Furthermore, it is preferable that polymer A contains at least one structural unit selected from the group consisting of structural units having an aralkyl group and structural units derived from styrene, from the viewpoint of suppressing line width increase and deterioration of resolution when the focal position is shifted during exposure. As polymer A, for example, a copolymer containing methacrylic acid, benzyl methacrylate, and styrene, or a copolymer containing methacrylic acid, methyl methacrylate, benzyl methacrylate, and styrene is preferable.

[0050] In one embodiment, polymer A is preferably a polymer containing 25% to 40% by mass of structural units having an aromatic hydrocarbon group, 20% to 35% by mass of structural units derived from the first monomer, and 30% to 45% by mass of structural units derived from the second monomer. In another embodiment, polymer A is preferably a polymer containing 70% to 90% by mass of structural units having an aromatic hydrocarbon group and 10% to 25% by mass of structural units derived from the first monomer.

[0051] Polymer A may have a branched structure and / or an alicyclic structure in its side chain. By using a monomer containing a group having a branched structure in its side chain or a monomer containing a group having an alicyclic structure in its side chain, a branched structure or an alicyclic structure can be introduced into the side chain of polymer A. The alicyclic structure may be a monocyclic structure or a polycyclic structure.

[0052] Specific examples of monomers containing a group having a branched structure in the side chain include i-propyl (meth)acrylate, i-butyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, i-amyl (meth)acrylate, t-amyl (meth)acrylate, isoamyl (meth)acrylate, 2-octyl (meth)acrylate, 3-octyl (meth)acrylate, and t-octyl (meth)acrylate, etc. Among these, i-propyl (meth)acrylate, i-butyl (meth)acrylate, or t-butyl methacrylate is preferred, and i-propyl methacrylate or t-butyl methacrylate is more preferred.

[0053] Specific examples of monomers containing a group having an alicyclic structure in the side chain include monomers having a monocyclic aliphatic hydrocarbon group and monomers having a polycyclic aliphatic hydrocarbon group, as well as (meth)acrylates having an alicyclic hydrocarbon group with 5 to 20 carbon atoms. More specific examples include (bicyclo[2.2.1]heptyl-2)(meth)acrylate, 1-adamantyl (meth)acrylate, 2-adamantyl (meth)acrylate, 3-methyl-1-adamantyl (meth)acrylate, 3,5-dimethyl-1-adamantyl (meth)acrylate, 3-ethyladamantyl (meth)acrylate, 3-methyl-5-ethyl-1-adamantyl (meth)acrylate, 3,5,8-triethyl-1-adamantyl (meth)acrylate, 3,5-dimethyl-8-ethyl-1-adamantyl (meth)acrylate, 2-methyl-2-adamantyl (meth)acrylate, 2-ethyl-2-adamantyl (meth)acrylate, 3-hydroxybenzoate (meth)acrylate, and 2-hydroxybenzoate. Examples of such acrylates include 1-adamantyl (meth)acrylate, octahydro-4,7-menthanoinden-5-yl (meth)acrylate, octahydro-4,7-menthanoinden-1-ylmethyl (meth)acrylate, 1-menthyl (meth)acrylate, tricyclodecane (meth)acrylate, 3-hydroxy-2,6,6-trimethyl-bicyclo[3.1.1]heptyl (meth)acrylate, 3,7,7-trimethyl-4-hydroxy-bicyclo[4.1.0]heptyl (meth)acrylate, (nor)bornyl (meth)acrylate, isobornyl (meth)acrylate, fenchyl (meth)acrylate, 2,2,5-trimethylcyclohexyl (meth)acrylate, and cyclohexyl (meth)acrylate.

[0054] Among these (meth)acrylic acid esters, cyclohexyl (meth)acrylate, (nor)bornyl (meth)acrylate, isobornyl (meth)acrylate, 1-adamantyl (meth)acrylate, 2-adamantyl (meth)acrylate, fenchyl (meth)acrylate, 1-menthyl (meth)acrylate, or tricyclodecane (meth)acrylate is preferred, and cyclohexyl (meth)acrylate, (nor)bornyl (meth)acrylate, isobornyl (meth)acrylate, 2-adamantyl (meth)acrylate, or tricyclodecane (meth)acrylate is more preferred.

[0055] The photosensitive layer may contain one type of polymer A alone, or two or more types. When two or more types are contained, it is preferable to use a mixture of two types of polymer A having an aromatic hydrocarbon group, or to use a mixture of a polymer A having an aromatic hydrocarbon group and a polymer A not having an aromatic hydrocarbon group. In the latter case, the content of the polymer A having an aromatic hydrocarbon group is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, and particularly preferably 90% by mass or more, based on the total mass of the polymer A.

[0056] The synthesis of polymer A is preferably carried out by adding an appropriate amount of a radical polymerization initiator such as benzoyl peroxide or azoisobutyronitrile to a solution prepared by diluting one or more of the monomers described above with a solvent such as acetone, methyl ethyl ketone, or isopropanol, and then heating and stirring the mixture. The synthesis may be carried out while adding a portion of the mixture dropwise to the reaction solution. After the reaction is complete, further solvent may be added to adjust the concentration to the desired level. As a synthesis method, bulk polymerization, suspension polymerization, or emulsion polymerization may be used in addition to solution polymerization.

[0057] The glass transition temperature Tg of the polymer A is preferably 30°C or higher and 135°C or lower. By using a polymer A having a Tg of 135°C or lower in the photosensitive layer, it is possible to suppress line width thickening and deterioration of resolution when the focal position is shifted during exposure. From this viewpoint, the Tg of the polymer A is more preferably 130°C or lower, even more preferably 120°C or lower, and particularly preferably 110°C or lower. Furthermore, using a polymer A having a Tg of 30°C or higher is preferable from the viewpoint of improving edge fuse resistance. From this viewpoint, the Tg of the polymer A is more preferably 40°C or higher, even more preferably 50°C or higher, particularly preferably 60°C or higher, and most preferably 70°C or higher.

[0058] The alkali-soluble resins may be used alone or in combination of two or more. The proportion of the alkali-soluble resin relative to the total mass of the photosensitive layer is preferably 10% by mass to 90% by mass, more preferably 30% by mass to 70% by mass, and even more preferably 40% by mass to 60% by mass. Setting the proportion of the alkali-soluble resin relative to the photosensitive layer to 90% by mass or less is preferred from the viewpoint of controlling the development time. On the other hand, setting the proportion of the alkali-soluble resin relative to the photosensitive layer to 10% by mass or more is preferred from the viewpoint of improving edge fuse resistance.

[0059] The photosensitive layer may contain a resin other than an alkali-soluble resin, as long as the resin has a solubility of less than 0.1 g in 100 g of a 1% by mass aqueous solution of sodium carbonate at a liquid temperature of 22° C., and examples thereof include acrylic resin, styrene-acrylic copolymer (with a styrene content of 40% by mass or less), polyurethane resin, polyvinyl alcohol, polyvinyl formal, polyamide resin, polyester resin, epoxy resin, polyacetal resin, polyhydroxystyrene resin, polyimide resin, polybenzoxazole resin, polysiloxane resin, polyethyleneimine, polyallylamine, and polyalkylene glycol.

[0060] (Photosensitive layer component: polymerizable compound) When the photosensitive layer is a negative-type photosensitive layer, the negative-type photosensitive layer preferably contains a polymerizable compound having a polymerizable group. In the present disclosure, the term "polymerizable compound" refers to a compound that polymerizes under the action of a polymerization initiator and is different from the alkali-soluble resin described above. The molecular weight of the polymerizable compound is preferably 1,500 or less. The molecular weight of the polymerizable compound is preferably 150 or more.

[0061] The type of polymerizable group is not limited as long as it is a group that participates in a polymerization reaction. Examples of the polymerizable group include groups having an ethylenically unsaturated group such as a vinyl group, an acryloyl group, a methacryloyl group, a styryl group, and a maleimide group. Examples of the polymerizable group include groups having a cationic polymerizable group such as an epoxy group and an oxetane group. As the polymerizable group, a group having an ethylenically unsaturated group is preferred, and an acryloyl group or a methacryloyl group is more preferred.

[0062] The polymerizable compound preferably includes a polymerizable compound having two or more polymerizable groups, and more preferably includes a polymerizable compound having two or more polymerizable groups and a polymerizable compound having three or more polymerizable groups.

[0063] As the polymerizable compound, a compound having one or more ethylenically unsaturated groups (i.e., an ethylenically unsaturated compound) is preferred, and a compound having two or more ethylenically unsaturated groups in one molecule (i.e., a polyfunctional ethylenically unsaturated compound) is more preferred, in terms of achieving better resolution and peelability. Furthermore, the number of ethylenically unsaturated groups that the ethylenically unsaturated compound has in one molecule is preferably 6 or less, more preferably 3 or less, and even more preferably 2 or less, in terms of achieving better resolution and peelability.

[0064] In order to achieve a better balance between the photosensitivity, resolution, and peelability of the negative-type photosensitive layer, the photosensitive layer preferably contains a compound having two or three ethylenically unsaturated groups in one molecule (i.e., a bifunctional or trifunctional ethylenically unsaturated compound), and more preferably contains a compound having two ethylenically unsaturated groups in one molecule (i.e., a bifunctional ethylenically unsaturated compound). From the viewpoint of excellent peelability, the content of the bifunctional ethylenically unsaturated compound relative to the total mass of the polymerizable compounds is preferably 20% by mass or more, more preferably more than 40% by mass, and even more preferably 55% by mass or more, relative to the total mass of the negative-type photosensitive layer. The upper limit is not particularly limited and may be 100% by mass. That is, all of the polymerizable compounds may be bifunctional ethylenically unsaturated compounds. Furthermore, the ethylenically unsaturated compound is preferably a (meth)acrylate compound having a (meth)acryloyl group as a polymerizable group.

[0065] The photosensitive layer preferably contains an ethylenically unsaturated compound B1 having an aromatic ring and two ethylenically unsaturated groups. The ethylenically unsaturated compound B1 is a bifunctional ethylenically unsaturated compound having one or more aromatic rings in one molecule, among the above-mentioned ethylenically unsaturated compounds.

[0066] In the photosensitive layer, the mass ratio of the content of the ethylenically unsaturated compound B1 to the content of the ethylenically unsaturated compound is preferably 40% by mass or more, more preferably 50% by mass or more, even more preferably 55% by mass or more, and particularly preferably 60% by mass or more, from the viewpoint of superior resolution. The upper limit is not particularly limited, but from the viewpoint of peelability, it is preferably 99% by mass or less, more preferably 95% by mass or less, even more preferably 90% by mass or less, and particularly preferably 85% by mass or less.

[0067] The aromatic ring of the ethylenically unsaturated compound B1 can be exemplified by aromatic hydrocarbon rings such as benzene ring, naphthalene ring, anthracene ring, etc., aromatic heterocycles such as thiophene ring, furan ring, pyrrole ring, imidazole ring, triazole ring, pyridine ring, etc., and condensed rings thereof. Aromatic hydrocarbon rings are preferred, and benzene rings are more preferred. The aromatic rings may have a substituent. The ethylenically unsaturated compound B1 may have only one aromatic ring, or may have two or more aromatic rings.

[0068] The ethylenically unsaturated compound B1 preferably has a bisphenol structure, since this suppresses swelling of the photosensitive layer due to a developer, thereby improving resolution. Examples of the bisphenol structure include a bisphenol A structure derived from bisphenol A (2,2-bis(4-hydroxyphenyl)propane), a bisphenol F structure derived from bisphenol F (2,2-bis(4-hydroxyphenyl)methane), and a bisphenol B structure derived from bisphenol B (2,2-bis(4-hydroxyphenyl)butane), with the bisphenol A structure being preferred.

[0069] Examples of the ethylenically unsaturated compound B1 having a bisphenol structure include a compound having a bisphenol structure and two polymerizable groups (preferably (meth)acryloyl groups) bonded to both ends of the bisphenol structure. The two polymerizable groups may be bonded directly to both ends of the bisphenol structure or via one or more alkyleneoxy groups. The alkyleneoxy groups attached to both ends of the bisphenol structure are preferably ethyleneoxy groups or propyleneoxy groups, and more preferably ethyleneoxy groups. The number of alkyleneoxy groups attached to the bisphenol structure is not particularly limited, but is preferably 4 to 16, more preferably 6 to 14 per molecule. The ethylenically unsaturated compound B1 having a bisphenol structure is described in paragraphs 0072 to 0080 of JP 2016-224162 A, the contents of which are incorporated herein by reference.

[0070] The ethylenically unsaturated compound B1 is preferably a bifunctional ethylenically unsaturated compound having a bisphenol A structure, and more preferably 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane. Examples of 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane include 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane (FA-324M, manufactured by Hitachi Chemical Co., Ltd.), 2,2-bis(4-(methacryloxyethoxypropoxy)phenyl)propane, 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane (BPE-500, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 2,2-bis(4-(methacryloxydodecaethoxy)phenyl)propane. Examples of suitable ethoxylated bisphenol A diacrylates include 2,2-bis(4-(methacryloxypentadecaethoxy)phenyl)propane (FA-3200MY, manufactured by Hitachi Chemical Co., Ltd.), 2,2-bis(4-(methacryloxypentadecaethoxy)phenyl)propane (BPE-1300, manufactured by Shin-Nakamura Chemical Co., Ltd.), 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane (BPE-200, manufactured by Shin-Nakamura Chemical Co., Ltd.), and ethoxylated (10) bisphenol A diacrylate (NK Ester A-BPE-10, manufactured by Shin-Nakamura Chemical Co., Ltd.).

[0071] As the ethylenically unsaturated compound B1, from the viewpoints of the delay time line width change, the development temperature line width change, and the sensitivity, it is preferable to include a compound represented by the following formula (Bis).

[0072] [ka]

[0073] In formula (Bis), R1 and R2 each independently represent a hydrogen atom or a methyl group; A is C2H4; B is C3H6; n1 and n3 each independently represent an integer from 1 to 39, and n1 + n3 is an integer from 2 to 40; n2 and n4 each independently represent an integer from 0 to 29, and n2 + n4 is an integer from 0 to 30; the arrangement of the -(AO)- and -(BO)- repeating units may be random or block. In the case of a block arrangement, either -(AO)- or -(BO)- may be on the bisphenol structure side. In one embodiment, n1 + n2 + n3 + n4 is preferably an integer from 2 to 20, more preferably an integer from 2 to 16, and even more preferably an integer from 4 to 12. Furthermore, n2 + n4 is preferably an integer from 0 to 10, more preferably an integer from 0 to 4, even more preferably an integer from 0 to 2, and particularly preferably 0.

[0074] The ethylenically unsaturated compound B1 may be used alone or in combination of two or more. The content of the ethylenically unsaturated compound B1 in the photosensitive layer is preferably 10% by mass or more, more preferably 20% by mass or more, based on the total mass of the photosensitive layer, from the viewpoint of better resolution. There is no particular upper limit, but from the viewpoint of transferability and edge fusion (a phenomenon in which components in the photosensitive layer bleed out from the edge of the transfer film), it is preferably 70% by mass or less, more preferably 60% by mass or less.

[0075] The photosensitive layer may contain an ethylenically unsaturated compound other than the above-mentioned ethylenically unsaturated compound B1. The ethylenically unsaturated compound other than the ethylenically unsaturated compound B1 is not particularly limited and can be appropriately selected from known compounds. Examples thereof include a compound having one ethylenically unsaturated group in one molecule (monofunctional ethylenically unsaturated compound), a bifunctional ethylenically unsaturated compound without an aromatic ring, and a trifunctional or higher ethylenically unsaturated compound.

[0076] Examples of monofunctional ethylenically unsaturated compounds include ethyl (meth)acrylate, ethylhexyl (meth)acrylate, 2-(meth)acryloyloxyethyl succinate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, and phenoxyethyl (meth)acrylate.

[0077] Examples of bifunctional ethylenically unsaturated compounds having no aromatic ring include alkylene glycol di(meth)acrylate, polyalkylene glycol di(meth)acrylate, urethane di(meth)acrylate, and trimethylolpropane diacrylate.

[0078] Examples of alkylene glycol di(meth)acrylates include tricyclodecane dimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), tricyclodecane dimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), ethylene glycol dimethacrylate, 1,10-decanediol diacrylate, and neopentyl glycol di(meth)acrylate.

[0079] Examples of polyalkylene glycol di(meth)acrylates include polyethylene glycol di(meth)acrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, and polypropylene glycol di(meth)acrylate.

[0080] Examples of urethane di(meth)acrylates include propylene oxide-modified urethane di(meth)acrylates and ethylene oxide and propylene oxide-modified urethane di(meth)acrylates. Commercially available urethane di(meth)acrylates include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), UA-32P (manufactured by Shin-Nakamura Chemical Co., Ltd.), and UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.).

[0081] Examples of tri- or higher functional ethylenically unsaturated compounds include dipentaerythritol (tri / tetra / penta / hexa)(meth)acrylate, pentaerythritol (tri / tetra)(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, trimethylolethane tri(meth)acrylate, isocyanuric acid tri(meth)acrylate, glycerin tri(meth)acrylate, and alkylene oxide-modified versions thereof. Here, "(tri / tetra / penta / hexa)(meth)acrylate" is a concept that encompasses tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate, and "(tri / tetra)(meth)acrylate" is a concept that encompasses tri(meth)acrylate and tetra(meth)acrylate. In one embodiment, the photosensitive layer preferably contains the above-described ethylenically unsaturated compound B1 and a trifunctional or higher ethylenically unsaturated compound, and more preferably contains the above-described ethylenically unsaturated compound B1 and two or more trifunctional or higher ethylenically unsaturated compounds. In this case, the mass ratio of the ethylenically unsaturated compound B1 to the trifunctional or higher ethylenically unsaturated compounds (total mass of the ethylenically unsaturated compound B1):(total mass of the trifunctional or higher ethylenically unsaturated compounds) is preferably 1:1 to 5:1, more preferably 1.2:1 to 4:1, and even more preferably 1.5:1 to 3:1. In another embodiment, the photosensitive layer preferably contains the above-described ethylenically unsaturated compound B1 and two or more trifunctional ethylenically unsaturated compounds.

[0082] Examples of alkylene oxide-modified trifunctional or higher functional ethylenically unsaturated compounds include caprolactone-modified (meth)acrylate compounds (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd., etc.), alkylene oxide-modified (meth)acrylate compounds (KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E and A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel-Allnex Corporation, etc.), ethoxylated glycerin triacrylate (A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd., etc.), ARONIX (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), ARONIX M-520 (manufactured by Toagosei Co., Ltd.), and ARONIX M-510 (manufactured by Toagosei Co., Ltd.).

[0083] Furthermore, as the ethylenically unsaturated compound other than the ethylenically unsaturated compound B1, the ethylenically unsaturated compounds having an acid group described in paragraphs 0025 to 0030 of JP-A No. 2004-239942 may be used.

[0084] From the viewpoints of resolution and linearity, the ratio Mm / Mb of the content Mm of the ethylenically unsaturated compound in the photosensitive layer to the content Mb of the alkali-soluble resin is preferably 1.0 or less, more preferably 0.9 or less, and particularly preferably 0.5 to 0.9. Furthermore, from the viewpoints of curability and resolution, the ethylenically unsaturated compound in the photosensitive layer preferably contains a (meth)acrylic compound, more preferably a (meth)acrylate compound. Furthermore, from the viewpoints of curability, resolution, and linearity, the ethylenically unsaturated compound in the photosensitive layer preferably contains a (meth)acrylic compound, and the content of the acrylic compound relative to the total mass of the (meth)acrylic compounds contained in the photosensitive layer is more preferably 60 mass% or less.

[0085] The molecular weight (weight average molecular weight (Mw) when the molecular weight has a distribution) of the ethylenically unsaturated compound including the ethylenically unsaturated compound B1 is preferably from 200 to 3,000, more preferably from 280 to 2,200, and even more preferably from 300 to 2,200.

[0086] The polymerizable compound preferably contains an oxyethylene chain. The oxyethylene chain is a partial structure represented by -CH2-CH2-O-. Examples of polymerizable compounds containing an oxyethylene chain include 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane (FA-324M, manufactured by Hitachi Chemical Co., Ltd.), 2,2-bis(4-(methacryloxyethoxypropoxy)phenyl)propane, 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane (BPE-500, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 2,2-bis(4-(methacryloxydodecaethoxytetrapropoxy)phenyl)propane (BPE-500, manufactured by Shin-Nakamura Chemical Co., Ltd.). Examples of suitable ethoxylated bisphenol A diacrylates include 2,2-bis(4-(methacryloxypentadecaethoxy)phenyl)propane (FA-3200MY, manufactured by Hitachi Chemical Co., Ltd.), 2,2-bis(4-(methacryloxypentadecaethoxy)phenyl)propane (BPE-1300, manufactured by Shin-Nakamura Chemical Co., Ltd.), 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane (BPE-200, manufactured by Shin-Nakamura Chemical Co., Ltd.), and ethoxylated (10) bisphenol A diacrylate (NK Ester A-BPE-10, manufactured by Shin-Nakamura Chemical Co., Ltd.).

[0087] The polymerizable compound may be used alone or in combination of two or more. The content of the polymerizable compound in the photosensitive layer is preferably 10% by mass to 70% by mass, more preferably 20% by mass to 60% by mass, and even more preferably 20% by mass to 50% by mass, based on the total mass of the photosensitive layer.

[0088] When the photosensitive layer contains an alkali-soluble resin and a polymerizable compound, the ratio of the mass of the polymerizable compound to the mass of the alkali-soluble resin in the photosensitive layer is preferably 0.6 or more, more preferably 0.7 to 1.1, and particularly preferably 0.8 to 1.0. The ratio of the mass of the polymerizable compound to the mass of the alkali-soluble resin in the photosensitive layer affects the surface free energy of the photosensitive layer. For example, as the ratio of the mass of the polymerizable compound to the mass of the alkali-soluble resin in the photosensitive layer increases, the surface free energy of the photosensitive layer increases. Increasing the surface free energy of the photosensitive layer improves adhesion between the transfer layer and the target object (e.g., substrate) during transfer of the transfer layer to the target object, and also improves resolution. On the other hand, decreasing the ratio of the mass of the polymerizable compound to the mass of the alkali-soluble resin in the photosensitive layer decreases the surface free energy of the photosensitive layer. A decrease in the surface free energy of the photosensitive layer suppresses adhesion of the transfer layer to the surface of the peeled temporary support or protective film, thereby suppressing a decrease in resolution.

[0089] (Photosensitive layer components: polymerization initiator) When the photosensitive layer is a negative photosensitive layer, it preferably contains a polymerization initiator. The polymerization initiator is selected depending on the type of polymerization reaction, and examples thereof include a thermal polymerization initiator and a photopolymerization initiator. Examples of the polymerization initiator include a radical polymerization initiator and a cationic polymerization initiator.

[0090] The negative photosensitive layer preferably contains a photopolymerization initiator. The photopolymerization initiator is a compound that initiates polymerization of a polymerizable compound when exposed to active light such as ultraviolet light, visible light, or X-rays. The photopolymerization initiator is not particularly limited, and known photopolymerization initiators can be used. Examples of the photopolymerization initiator include photoradical polymerization initiators and photocationic polymerization initiators, with photoradical polymerization initiators being preferred.

[0091] Examples of the photoradical polymerization initiator include a photopolymerization initiator having an oxime ester structure, a photopolymerization initiator having an α-aminoalkylphenone structure, a photopolymerization initiator having an α-hydroxyalkylphenone structure, a photopolymerization initiator having an acylphosphine oxide structure, and a photopolymerization initiator having an N-phenylglycine structure.

[0092] From the viewpoints of photosensitivity, visibility of exposed and unexposed areas, and resolution, the negative-type photosensitive layer preferably contains, as a photoradical polymerization initiator, at least one selected from the group consisting of 2,4,5-triarylimidazole dimers and derivatives thereof. Note that the two 2,4,5-triarylimidazole structures in the 2,4,5-triarylimidazole dimers and derivatives thereof may be the same or different. Examples of derivatives of 2,4,5-triarylimidazole dimers include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer.

[0093] As the photoradical polymerization initiator, for example, polymerization initiators described in paragraphs 0031 to 0042 of JP-A No. 2011-95716 and paragraphs 0064 to 0081 of JP-A No. 2015-14783 may be used.

[0094] Examples of the photoradical polymerization initiator include ethyl dimethylaminobenzoate (DBE, CAS No. 10287-53-3), benzoin methyl ether, anisyl (p,p'-dimethoxybenzyl), TAZ-110 (trade name: manufactured by Midori Chemical Industry Co., Ltd.), benzophenone, TAZ-111 (trade name: manufactured by Midori Chemical Industry Co., Ltd.), IrgacureOXE01, OXE02, OXE03, OXE04 (manufactured by BASF), Omnirad651 and 369 (trade name: manufactured by IGM Resins BV), and 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Tokyo Chemical Industry Co., Ltd.).

[0095] Commercially available photoradical polymerization initiators include, for example, 1-[4-(phenylthio)phenyl]-1,2-octanedione-2-(O-benzoyloxime) (trade name: IRGACURE (registered trademark) OXE-01, manufactured by BASF), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime) (trade name: IRGACURE OXE-02, manufactured by BASF), IRGACURE OXE-03 (manufactured by BASF), 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (trade name: Omnirad 379EG, manufactured by IGM Resins BV), and 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (trade name: Omnirad 907, IGM Resins BV), 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one (trade name: Omnirad 127, IGM Resins BV), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone-1 (trade name: Omnirad 369, IGM Resins BV), 2-hydroxy-2-methyl-1-phenylpropan-1-one (trade name: Omnirad 1173, IGM Resins BV), 1-hydroxycyclohexyl phenyl ketone (trade name: Omnirad 184, IGM Resins BV), 2,2-dimethoxy-1,2-diphenylethan-1-one (trade name: Omnirad 651, IGM Resins BV), BV), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: Omnirad TPO H, IGM Resins BV), bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (trade name: Omnirad 819, IGM Resins BV)(trade name: Lunar 6, manufactured by DKSH Japan Co., Ltd.), oxime ester photoinitiator (trade name: Lunar 6, manufactured by DKSH Japan Co., Ltd.), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbisimidazole (2-(2-chlorophenyl)-4,5-diphenylimidazole dimer) (trade name: B-CIM, manufactured by Hampford Chemical Industry Co., Ltd.), 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer (trade name: BCTB, manufactured by Tokyo Chemical Industry Co., Ltd.), 1-[4-(phenylthio)phenyl]-3-cyclopentylpropane-1,2-dione-2-(O-benzoyloxime) (trade name: TR-PBG-305, manufactured by Ordinary Chemical Industry Co., Ltd.), Examples of suitable oxime include 1,2-propanedione, 3-cyclohexyl-1-[9-ethyl-6-(2-furanylcarbonyl)-9H-carbazol-3-yl]-, 2-(O-acetyloxime) (trade name: TR-PBG-326, Changzhou Powerful Electronic New Materials Co., Ltd.), ... and 3-cyclohexyl-1-(6-(2-(benzoyloxyimino)hexanoyl)-9-ethyl-9H-carbazol-3-yl)-propane-1,2-dione-2-(O-benzoyloxime) (trade name: TR-PBG-391, Changzhou Powerful Electronic New Materials Co., Ltd.).

[0096] A photocationic polymerization initiator (photoacid generator) is a compound that generates an acid when exposed to actinic rays. The photocationic polymerization initiator is preferably a compound that responds to actinic rays with a wavelength of 300 nm or more, preferably 300 to 450 nm, and generates an acid, but the chemical structure is not limited. Furthermore, even if a photocationic polymerization initiator is not directly sensitive to actinic rays with a wavelength of 300 nm or more, it can be preferably used in combination with a sensitizer, as long as it responds to actinic rays with a wavelength of 300 nm or more and generates an acid when used in combination with a sensitizer. The cationic photopolymerization initiator is preferably a cationic photopolymerization initiator that generates an acid with a pKa of 4 or less, more preferably a cationic photopolymerization initiator that generates an acid with a pKa of 3 or less, and particularly preferably a cationic photopolymerization initiator that generates an acid with a pKa of 2 or less. There is no particular restriction on the lower limit of the pKa, but it is preferably, for example, −10.0 or more.

[0097] Examples of the photocationic polymerization initiator include ionic photocationic polymerization initiators and nonionic photocationic polymerization initiators. Examples of the ionic photocationic polymerization initiator include onium salt compounds such as diaryliodonium salts and triarylsulfonium salts, and quaternary ammonium salts. Examples of the ionic photocationic polymerization initiator include the ionic photocationic polymerization initiators described in paragraphs 0114 to 0133 of JP 2014-85643 A.

[0098] Examples of nonionic photocationic polymerization initiators include trichloromethyl-s-triazines, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds. Examples of trichloromethyl-s-triazines, diazomethane compounds, and imide sulfonate compounds include the compounds described in paragraphs 0083 to 0088 of JP 2011-221494 A. Examples of oxime sulfonate compounds include the compounds described in paragraphs 0084 to 0088 of WO 2018 / 179640 A.

[0099] The photosensitive layer may contain one type of photopolymerization initiator alone or two or more types. The content of the photopolymerization initiator in the photosensitive layer is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1.0% by mass or more, relative to the total mass of the photosensitive layer. The upper limit is not particularly limited, but is preferably 10% by mass or less, more preferably 5% by mass or less, relative to the total mass of the photosensitive layer.

[0100] (Photosensitive layer components: dye) From the viewpoints of the visibility of exposed and unexposed areas, the pattern visibility after development, and resolution, the photosensitive layer preferably contains a dye, and more preferably contains a dye (also simply referred to as "dye N") whose maximum absorption wavelength in the wavelength range of 400 nm to 780 nm during color development is 450 nm or longer and whose maximum absorption wavelength changes in response to an acid, a base, or a radical. When dye N is contained, adhesion to adjacent layers (for example, a temporary support and an intermediate layer) is improved, resulting in better resolution, although the detailed mechanism is unknown.

[0101] In the present disclosure, the expression "the maximum absorption wavelength of a dye changes in response to an acid, base, or radical" may refer to any of the following: a dye in a colored state that is decolorized by an acid, base, or radical; a dye in a decolorized state that develops a color by an acid, base, or radical; and a dye in a colored state that changes to a colored state of another hue. Specifically, dye N may be a compound that changes from a decolorized state upon exposure to develop a color, or a compound that changes from a colored state upon exposure to decolorize. In this case, the dye may be one whose colored or decolorized state changes when an acid, base, or radical is generated and acts within the photosensitive layer upon exposure, or one whose colored or decolorized state changes when an acid, base, or radical changes the state within the photosensitive layer (e.g., pH). Alternatively, the dye may be one whose colored or decolorized state changes when directly stimulated by an acid, base, or radical without exposure.

[0102] Among these, from the viewpoints of visibility and resolution of exposed and unexposed areas, dye N is preferably a dye whose maximum absorption wavelength changes in response to an acid or a radical, and more preferably a dye whose maximum absorption wavelength changes in response to a radical. From the viewpoint of the visibility of exposed and unexposed areas and resolution, the photosensitive layer preferably contains both a dye whose maximum absorption wavelength changes in response to radicals as dye N, and a photoradical polymerization initiator. From the viewpoint of visibility of exposed and unexposed areas, dye N is preferably a dye that develops color in response to an acid, a base, or a radical.

[0103] An example of the color-developing mechanism of dye N in the present disclosure is an embodiment in which a photoradical polymerization initiator, a cationic photopolymerization initiator (i.e., a photoacid generator), or a photobase generator is added to the photosensitive layer, and after exposure, a radical-reactive dye, an acid-reactive dye, or a base-reactive dye (e.g., a leuco dye) develops color due to a radical, acid, or base generated from the photoradical polymerization initiator, the cationic photopolymerization initiator, or the photobase generator.

[0104] From the viewpoint of visibility of exposed and unexposed areas, dye N preferably has a maximum absorption wavelength of 550 nm or longer in the wavelength range of 400 nm to 780 nm when colored, more preferably 550 nm to 700 nm, and even more preferably 550 nm to 650 nm. Furthermore, dye N may have only one or two or more maximum absorption wavelengths in the wavelength range of 400 nm to 780 nm when colored. When dye N has two or more maximum absorption wavelengths in the wavelength range of 400 nm to 780 nm when colored, it is sufficient that the maximum absorption wavelength with the highest absorbance among the two or more maximum absorption wavelengths is 450 nm or longer.

[0105] The maximum absorption wavelength of dye N can be obtained by measuring the transmission spectrum of a solution containing dye N (liquid temperature 25°C) in the range of 400 nm to 780 nm using a spectrophotometer UV3100 (Shimadzu Corporation) in an atmospheric environment and detecting the wavelength at which the light intensity is minimum (i.e., the maximum absorption wavelength).

[0106] Examples of the dye that develops or loses color upon exposure include leuco compounds. Examples of the dye that loses color upon exposure include leuco compounds, diarylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes, azomethine dyes, and anthraquinone dyes. As the dye N, a leuco compound is preferred from the viewpoint of visibility of exposed and unexposed areas.

[0107] Examples of leuco compounds include leuco compounds having a triarylmethane skeleton (i.e., triarylmethane dyes), leuco compounds having a spiropyran skeleton (i.e., spiropyran dyes), leuco compounds having a fluoran skeleton (i.e., fluoran dyes), leuco compounds having a diarylmethane skeleton (i.e., diarylmethane dyes), leuco compounds having a rhodamine lactam skeleton (i.e., rhodamine lactam dyes), leuco compounds having an indolylphthalide skeleton (i.e., indolylphthalide dyes), and leuco compounds having a leucoauramine skeleton (i.e., leucoauramine dyes). Among these, triarylmethane dyes or fluoran dyes are preferred, and leuco compounds having a triphenylmethane skeleton (i.e., triphenylmethane dyes) or fluoran dyes are more preferred.

[0108] From the viewpoint of visibility of exposed and unexposed areas, the leuco compound preferably has a lactone ring, a sultine ring, or a sultone ring. This allows the lactone ring, sultine ring, or sultone ring of the leuco compound to react with a radical generated from a photoradical polymerization initiator or an acid generated from a photocationic polymerization initiator, thereby converting the leuco compound into a ring-closed state and thereby discoloring, or converting the leuco compound into a ring-open state and thereby developing a color. The leuco compound is preferably a compound having a lactone ring, a sultine ring, or a sultone ring, which develops a color upon ring-opening of the lactone ring, the sultine ring, or the sultone ring by a radical or an acid, and more preferably a compound having a lactone ring, which develops a color upon ring-opening of the lactone ring by a radical or an acid.

[0109] Examples of the dye N include the following dyes and leuco compounds. Specific examples of dyes among the dyes N include brilliant green, ethyl violet, methyl green, crystal violet, basic fuchsin, methyl violet 2B, quinaldine red, rose bengal, metanil yellow, thymolsulfophthalein, xylenol blue, methyl orange, paramethyl red, Congo red, benzopurpurin 4B, α-naphthyl red, Nile blue 2B, Nile blue A, methyl violet, malachite green, parafuchsin, Victoria Pure Blue naphthalene sulfonate, Victoria Pure Blue BOH (manufactured by Hodogaya Chemical Industry Co., Ltd.), oil blue #603 (manufactured by Orient Chemical Industry Co., Ltd.), oil pink #312 (manufactured by Orient Chemical Industry Co., Ltd.), oil red 5B (manufactured by Orient Chemical Industry Co., Ltd.), oil scarlet #308 (manufactured by Orient Chemical Industry Co., Ltd.), Examples of the pigments include Orient Chemical Industry Co., Ltd.), Oil Red OG (Orient Chemical Industry Co., Ltd.), Oil Red RR (Orient Chemical Industry Co., Ltd.), Oil Green #502 (Orient Chemical Industry Co., Ltd.), Spiron Red BEH Special (Hodogaya Chemical Co., Ltd.), m-cresol purple, cresol red, rhodamine B, rhodamine 6G, sulforhodamine B, auramine, 4-p-diethylaminophenyliminonaphthoquinone, 2-carboxyanilino-4-p-diethylaminophenyliminonaphthoquinone, 2-carboxystearylamino-4-pN,N-bis(hydroxyethyl)amino-phenyliminonaphthoquinone, 1-phenyl-3-methyl-4-p-diethylaminophenylimino-5-pyrazolone, and 1-β-naphthyl-4-p-diethylaminophenylimino-5-pyrazolone.

[0110] Specific examples of the leuco compound among the dyes N include p,p',p"-hexamethyltriaminotriphenylmethane (also called leuco crystal violet), Pergascript Blue SRB (manufactured by Ciba-Geigy), crystal violet lactone, malachite green lactone, benzoyl leucomethylene blue, 2-(N-phenyl-N-methylamino)-6-(Np-tolyl-N-ethyl)aminofluoran, 2-anilino-3-methyl-6-(N-ethyl-p-toluidino)fluoran, 3,6-dimethoxyfluoran, 3-(N,N-diethylamino)-5-methyl-7-(N,N-dibenzylamino)fluoran, 3-(N-cyclohexyl-N-methylamino)-6 -methyl-7-anilinofluoran, 3-(N,N-diethylamino)-6-methyl-7-anilinofluoran, 3-(N,N-diethylamino)-6-methyl-7-xylidinofluoran, 3-(N,N-diethylamino)-6-methyl-7-chlorofluoran, 3-(N,N-diethylamino)-6-methoxy-7-aminofluoran, 3-(N,N-diethylamino)-7-(4-chloroanilino)fluoran, 3-(N,N-diethylamino)-7-chlorofluoran, 3-(N,N-diethylamino)-7-(4-chloroanilino)fluoran, 3-(N,N-diethylamino)-7-chlorofluoran, 3-(N,N-diethylamino)-7-benzylaminofluoran, 3-(N,N-diethylamino)-7,8-benzofluoran, 3-(N,N-dibutylamino)-6-methyl-7-anilinofluoran, 3-(N,N-dibutylamino)-6-methyl-7-xylidinofluoran, 3-piperidino-6-methyl-7-anilinofluoran, 3-pyrrolidino-6-methyl-7-anilinofluoran, 3,3-bis(1-ethyl-2-methylindol-3-yl)phthalide, 3,3-bis(1-n-butyl-2-methylindol-3-yl)phthalide 3-(4-diethylaminophenyl)-3-(1-ethyl-2-methylindol-3-yl)phthalide, 3,3-bis(p-dimethylaminophenyl)-6-dimethylaminophthalide, 3-(4-diethylamino-2-ethoxyphenyl)-3-(1-ethyl-2-methylindol-3-yl)-4-azaphthalide, 3-(4-diethylaminophenyl)-3-(1-ethyl-2-methylindol-3-yl)phthalide, and 3',6'-bis(diphenylamino)spiroisobenzofuran-1(3H),9'-[9H]xanthen-3-one.

[0111] From the viewpoints of the visibility of exposed and unexposed areas, the pattern visibility after development, and resolution, dye N is preferably a dye whose maximum absorption wavelength changes in response to radicals, and more preferably a dye that develops color in response to radicals. Preferred examples of dye N include leuco crystal violet, crystal violet lactone, brilliant green, and Victoria Pure Blue naphthalene sulfonate.

[0112] The dyes may be used alone or in combination of two or more. From the viewpoints of visibility of exposed and unexposed areas, pattern visibility after development, and resolution, the content of the dye is preferably 0.1% by mass or more, more preferably 0.1% by mass to 10% by mass, even more preferably 0.1% by mass to 5% by mass, and particularly preferably 0.1% by mass to 1% by mass, relative to the total mass of the photosensitive layer. Furthermore, from the viewpoints of visibility of exposed and unexposed areas, pattern visibility after development, and resolution, the content of dye N is preferably 0.1% by mass or more, more preferably 0.1% by mass to 10% by mass, even more preferably 0.1% by mass to 5% by mass, and particularly preferably 0.1% by mass to 1% by mass, relative to the total mass of the photosensitive layer.

[0113] The content of dye N refers to the content of dye when all of the dye N contained in the photosensitive layer is in a colored state. The following describes the method for quantifying the content of dye N, using a dye that develops color through radicals as an example. Two types of solutions were prepared by dissolving 0.001 g or 0.01 g of dye in 100 mL of methyl ethyl ketone. The photoradical polymerization initiator Irgacure OXE01 (product name, manufactured by BASF) was added to each solution, and radicals were generated by irradiating with 365 nm light, causing all of the dye to develop color. The absorbance of each solution was then measured at a liquid temperature of 25°C under atmospheric conditions using a spectrophotometer (UV3100, manufactured by Shimadzu Corporation), and a calibration curve was created. Next, the absorbance of the solution in which all of the dye had developed color was measured using the same method as above, except that 3 g of photosensitive layer was dissolved in methyl ethyl ketone instead of the dye. The content of the dye contained in the photosensitive layer was calculated based on the absorbance of the resulting solution containing the photosensitive layer and the calibration curve.

[0114] (Photosensitive layer component: thermal crosslinking compound) The photosensitive layer preferably contains a thermally crosslinkable compound from the viewpoints of the strength of the resulting cured film and the adhesiveness of the resulting uncured film. In the present disclosure, thermally crosslinkable compounds having an ethylenically unsaturated group, as described below, are not considered ethylenically unsaturated compounds but are considered thermally crosslinkable compounds. Examples of thermally crosslinkable compounds include methylol compounds and blocked isocyanate compounds. Among these, blocked isocyanate compounds are preferred from the viewpoints of the strength of the resulting cured film and the adhesiveness of the resulting uncured film. Because blocked isocyanate compounds react with hydroxy groups and carboxy groups, for example, when an alkali-soluble resin and / or an ethylenically unsaturated compound has at least one of a hydroxy group and a carboxy group, the hydrophilicity of the resulting film tends to decrease, thereby enhancing the functionality of the film obtained by curing the photosensitive layer when used as a protective film. The term "blocked isocyanate compound" refers to a compound having a structure in which the isocyanate group of an isocyanate is protected (i.e., masked) with a blocking agent.

[0115] The dissociation temperature of the blocked isocyanate compound is not particularly limited, but is preferably 100°C to 160°C, and more preferably 130°C to 150°C. The dissociation temperature of the blocked isocyanate means "the temperature of the endothermic peak accompanying the deprotection reaction of the blocked isocyanate when measured by DSC (Differential Scanning Calorimetry) analysis using a differential scanning calorimeter." As the differential scanning calorimeter, for example, a differential scanning calorimeter (Model: DSC6200) manufactured by Seiko Instruments Inc. can be suitably used. However, the differential scanning calorimeter is not limited thereto.

[0116] Examples of blocking agents having a dissociation temperature of 100°C to 160°C include active methylene compounds [malonic acid diesters (e.g., dimethyl malonate, diethyl malonate, di-n-butyl malonate, and di-2-ethylhexyl malonate)] and oxime compounds (e.g., compounds having a structure represented by -C(=N-OH)- in the molecule, such as formaldoxime, acetaldoxime, acetoxime, methyl ethyl ketoxime, and cyclohexanone oxime). Among these, blocking agents having a dissociation temperature of 100°C to 160°C preferably contain oxime compounds, for example, from the viewpoint of storage stability.

[0117] The blocked isocyanate compound preferably has an isocyanurate structure, for example, from the viewpoint of improving the brittleness of the film and improving the adhesion to the transfer target. A blocked isocyanurate compound having an isocyanurate structure can be obtained, for example, by protecting hexamethylene diisocyanate through isocyanuration. Among blocked isocyanate compounds having an isocyanurate structure, a compound having an oxime structure in which an oxime compound is used as a blocking agent is preferred from the viewpoints that the dissociation temperature can be more easily adjusted to a preferred range and development residues can be reduced compared to compounds not having an oxime structure.

[0118] The blocked isocyanate compound may have a polymerizable group. The polymerizable group is not particularly limited, and known polymerizable groups can be used, with a radical polymerizable group being preferred. Examples of the polymerizable group include ethylenically unsaturated groups such as a (meth)acryloxy group, a (meth)acrylamide group, and a styryl group, as well as groups having an epoxy group such as a glycidyl group. Among these, the polymerizable group is preferably an ethylenically unsaturated group, more preferably a (meth)acryloxy group, and even more preferably an acryloxy group.

[0119] Commercially available blocked isocyanate compounds can be used. Examples of commercially available blocked isocyanate compounds include Karenz (registered trademark) AOI-BM, Karenz (registered trademark) MOI-BM, Karenz (registered trademark) MOI-BP, etc. (all manufactured by Showa Denko K.K.), and the blocked Duranate series (e.g., Duranate (registered trademark) TPA-B80E, Duranate (registered trademark) WT32-B75P, etc., manufactured by Asahi Kasei Chemicals Corporation). Compounds having the following structure can also be used as blocked isocyanate compounds.

[0120] [ka]

[0121] The thermally crosslinkable compound may be used alone or in combination of two or more. When the photosensitive layer contains a thermally crosslinkable compound, the content of the thermally crosslinkable compound is preferably 1% by mass to 50% by mass, more preferably 5% by mass to 30% by mass, based on the total mass of the photosensitive layer.

[0122] (Photosensitive layer components: Other components) The photosensitive layer may contain other components in addition to the components described above. Examples of other components include radical polymerization inhibitors, surfactants, sensitizers, and various additives. The other components may be used alone or in combination of two or more.

[0123] The photosensitive layer may contain a radical polymerization inhibitor. Examples of radical polymerization inhibitors include the thermal polymerization inhibitors described in paragraph 0018 of Japanese Patent No. 4502784. Among these, phenothiazine, phenoxazine, or 4-methoxyphenol is preferred. Other radical polymerization inhibitors include naphthylamine, cuprous chloride, nitrosophenylhydroxyamine aluminum salt, and diphenylnitrosamine. In order to avoid impairing the sensitivity of the photosensitive layer, it is preferable to use nitrosophenylhydroxyamine aluminum salt as the radical polymerization inhibitor.

[0124] The radical polymerization inhibitor may be used alone or in combination of two or more. When the photosensitive layer contains a radical polymerization inhibitor, the content of the radical polymerization inhibitor is preferably 0.001% by mass to 5.0% by mass, more preferably 0.01% by mass to 3.0% by mass, and even more preferably 0.02% by mass to 2.0% by mass, relative to the total mass of the photosensitive layer. Furthermore, the content of the radical polymerization inhibitor is preferably 0.005% by mass to 5.0% by mass, more preferably 0.01% by mass to 3.0% by mass, and even more preferably 0.01% by mass to 1.0% by mass, relative to the total mass of the polymerizable compounds.

[0125] The photosensitive layer preferably contains a surfactant. Examples of the surfactant include those described in paragraph 0017 of Japanese Patent No. 4502784 and paragraphs 0060 to 0071 of JP-A-2009-237362. The surfactant is preferably a nonionic surfactant, a fluorine-based surfactant, or a silicone-based surfactant.

[0126] Commercially available fluorine-based surfactants include, for example, Megafac (trade name) F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-444, F-475, F-477, F-479, F-482, F-551-A, F-552, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, and F-562. 65, F-563, F-568, F-575, F-780, EXP.MFS-330, EXP.MFS-578, EXP.MFS-578-2, EXP.MFS-579, EXP.MFS-586, EXP.MF S-587, EXP.MFS-628, EXP.MFS-631, EXP.MFS-603, R-41, R-41-LM, R-01, R-40, R-40-LM, RS-43, TF-1956, RS-90, R- 94, RS-72-K, DS-21 (all manufactured by DIC Corporation), Fluorard (trade name) FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), Surflon (trade name) S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox (trade name) PF636, PF656, Examples of suitable fluorine-based surfactants include PF6320, PF6520, and PF7002 (manufactured by OMNOVA), Futergent (trade name) 710FL, 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, 208G, 710LA, 710FS, 730LM, 650AC, 681, and 683 (manufactured by NEOS Corporation), and U-120E (Unichem Co., Ltd.). Furthermore, suitable fluorine-based surfactants include acrylic compounds that have a molecular structure with a functional group containing a fluorine atom, and in which the fluorine atom-containing functional group is cleaved upon application of heat, causing the fluorine atom to volatilize. Examples of such fluorosurfactants include the Megafac (product name) DS series manufactured by DIC Corporation (The Chemical Daily, February 22, 2016; The Nikkei Business Daily, February 23, 2016), such as Megafac (product name) DS-21.

[0127] Furthermore, as the fluorosurfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound. A block polymer can also be used as the fluorosurfactant. A fluorine-containing polymer compound containing a structural unit derived from a (meth)acrylate compound having a fluorine atom and a structural unit derived from a (meth)acrylate compound having two or more (preferably five or more) alkyleneoxy groups (preferably ethyleneoxy groups or propyleneoxy groups) can also be preferably used as the fluorosurfactant. A fluorine-containing polymer having an ethylenically unsaturated group in the side chain can also be used as the fluorosurfactant. Examples of suitable fluorosurfactants include Megafac (trade name) RS-101, RS-102, RS-718K, and RS-72-K (all manufactured by DIC Corporation). For example, a compound having a linear perfluoroalkyl group having seven or more carbon atoms may be used as the fluorosurfactant. However, from the viewpoint of improving environmental friendliness, it is preferable to use an alternative material to perfluorooctanoic acid (PFOA) or perfluorooctanesulfonic acid (PFOS) as the fluorosurfactant.

[0128] Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, and sorbitan fatty acid esters. Specific examples include Pluronic (trade name) L10, L31, L61, L62, 10R5, 17R2, and 25R2 (all manufactured by BASF), Tetronic (trade name) 304, 701, 704, 901, 904, and 150R1, and HYDROPALAT WE 3323 (all manufactured by BASF), Solsperse (trade name) 20000 (all manufactured by Lubrizol Japan Co., Ltd.), NCW-101, NCW-1001, NCW-1002 (all manufactured by Fujifilm Wako Pure Chemical Industries Co., Ltd.), Paionin (trade name) D-6112, D-6112-W, D-6315 (all manufactured by Takemoto Oil & Fat Co., Ltd.), Olfine E1010, Surfynol 104, 400, 440 (all manufactured by Nissin Chemical Industry Co., Ltd.), and the like.

[0129] Examples of silicone surfactants include linear polymers consisting of siloxane bonds and modified siloxane polymers having organic groups introduced into the side chains or terminals. Specific examples of silicone surfactants include EXP.S-309-2, EXP.S-315, EXP.S-503-2, and EXP.S-505-2 (all manufactured by DIC Corporation), DOWSIL (trade name) 8032 ADDITIVE, Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, and Toray Silicone SH8400 (all manufactured by Dow Corning Toray Co., Ltd.), as well as X-22-4952, X-22-4272, and X-22- 6266, KF-351A, K354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-34 1, KF-6001, KF-6002KP-101, KP-103, KP-104, KP-105, KP-106, KP-109, KP-112, KP-120, KP-121, KP-124, K P-125, KP-301, KP-306, KP-310, KP-322, KP-323, KP-327, KP-341, KP-368, KP-369, KP-611, KP-620, KP-621, KP-626, KP-652 (all manufactured by Shin-Etsu Chemical Co., Ltd.), F-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Perform Examples include BYK300, BYK306, BYK307, BYK310, BYK320, BYK323, BYK325, BYK330, BYK313, BYK315N, BYK331, BYK333, BYK345, BYK347, BYK348, BYK349, BYK370, BYK377, BYK378, and BYK323 (all manufactured by BYK-Chemie).

[0130] The photosensitive layer may contain one surfactant alone or two or more surfactants. The content of the surfactant is preferably 0.001% by mass to 10% by mass, and more preferably 0.01% by mass to 3% by mass, relative to the total mass of the photosensitive layer.

[0131] The photosensitive layer may contain a sensitizer. The sensitizer is not particularly limited, and known sensitizers, dyes, and pigments can be used. Examples of sensitizers include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds (e.g., 1,2,4-triazole), stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds.

[0132] The sensitizer may be used alone or in combination of two or more. When the photosensitive layer contains a sensitizer, the content of the sensitizer can be appropriately selected depending on the purpose, but from the viewpoints of improving sensitivity to the light source and improving the curing rate by balancing the polymerization rate and chain transfer, the content is preferably 0.01% by mass to 5% by mass, and more preferably 0.05% by mass to 1% by mass, based on the total mass of the photosensitive layer.

[0133] In addition to the above components, the photosensitive layer may contain known additives as needed. Examples of additives include plasticizers, heterocyclic compounds, benzotriazoles, carboxybenzotriazoles, pyridines (such as isonicotinamide), purine bases (such as adenine), and solvents. The photosensitive layer may contain one type of each additive alone or two or more types.

[0134] Examples of benzotriazoles include 1,2,3-benzotriazole, 1-chloro-1,2,3-benzotriazole, bis(N-2-ethylhexyl)aminomethylene-1,2,3-benzotriazole, bis(N-2-ethylhexyl)aminomethylene-1,2,3-tolyltriazole, and bis(N-2-hydroxyethyl)aminomethylene-1,2,3-benzotriazole.

[0135] Examples of carboxybenzotriazoles include 4-carboxy-1,2,3-benzotriazole, 5-carboxy-1,2,3-benzotriazole, N-(N,N-di-2-ethylhexyl)aminomethylenecarboxybenzotriazole, N-(N,N-di-2-hydroxyethyl)aminomethylenecarboxybenzotriazole, N-(N,N-di-2-ethylhexyl)aminoethylenecarboxybenzotriazole, etc. Examples of carboxybenzotriazoles that can be used include commercially available products such as CBT-1 (Johoku Chemical Industry Co., Ltd., trade name).

[0136] The total content of benzotriazoles and carboxybenzotriazoles is preferably 0.01% by mass to 3% by mass, and more preferably 0.05% by mass to 1% by mass, relative to the total mass of the photosensitive layer. A content of 0.01% by mass or more is preferred from the viewpoint of imparting storage stability to the photosensitive layer. On the other hand, a content of 3% by mass or less is preferred from the viewpoint of maintaining sensitivity and suppressing discoloration of the dye.

[0137] The photosensitive layer may contain at least one selected from the group consisting of plasticizers and heterocyclic compounds. Examples of the plasticizer and heterocyclic compound include the compounds described in paragraphs 0097 to 0103 and 0111 to 0118 of WO 2018 / 179640.

[0138] The photosensitive layer may contain a solvent. When the photosensitive layer is formed using a photosensitive resin composition containing a solvent, the solvent may remain in the photosensitive layer.

[0139] The photosensitive layer may further contain known additives such as metal oxide particles, antioxidants, dispersants, acid multipliers, development accelerators, conductive fibers, thermal acid generators, ultraviolet absorbers, thickeners, crosslinkers, and organic or inorganic suspending agents. Additives contained in the photosensitive layer are described in paragraphs

[0165] to

[0184] of JP 2014-85643 A, the contents of which are incorporated herein by reference.

[0140] (Photosensitive layer components: impurities, etc.) The photosensitive layer may contain a predetermined amount of impurities. Specific examples of impurities include sodium, potassium, magnesium, calcium, iron, manganese, copper, aluminum, titanium, chromium, cobalt, nickel, zinc, tin, halogens, and ions thereof. Among these, halide ions, sodium ions, and potassium ions are likely to be mixed in as impurities, so the following contents are preferred.

[0141] The content of impurities in the photosensitive layer is preferably 80 ppm or less, more preferably 10 ppm or less, and even more preferably 2 ppm or less, by mass. The content of impurities can be 1 ppb or more, or may be 0.1 ppm or more, by mass.

[0142] Methods for keeping the impurity content within the above range include selecting raw materials for the composition that contain a small amount of impurities, preventing impurities from being mixed in during the preparation of the photosensitive layer, and removing impurities by washing.

[0143] The amount of impurities can be determined by known methods such as ICP (Inductively Coupled Plasma) emission spectroscopy, atomic absorption spectroscopy, and ion chromatography.

[0144] The content of compounds such as benzene, formaldehyde, trichloroethylene, 1,3-butadiene, carbon tetrachloride, chloroform, N,N-dimethylformamide, N,N-dimethylacetamide, and hexane in the photosensitive layer is preferably low. The content of these compounds relative to the total mass of the photosensitive layer is preferably 100 ppm or less, more preferably 20 ppm or less, and even more preferably 4 ppm or less, by mass. The lower limit, relative to the total mass of the photosensitive layer, can be 10 ppb or more, and can be 100 ppb or more, by mass. The content of these compounds can be reduced in the same manner as for the metal impurities described above. Furthermore, they can be quantified by known measurement methods.

[0145] The water content in the photosensitive layer is preferably 0.01% by mass to 1.0% by mass, and more preferably 0.05% by mass to 0.5% by mass, from the viewpoint of improving reliability and lamination properties.

[0146] (Photosensitive layer components: residual monomer) The photosensitive layer may contain residual monomers corresponding to each structural unit of the alkali-soluble resin. From the viewpoints of patterning ability and reliability, the content of the residual monomers is preferably 5,000 ppm by mass or less, more preferably 2,000 ppm by mass or less, and even more preferably 500 ppm by mass or less, relative to the total mass of the alkali-soluble resin. While the lower limit is not particularly limited, it is preferably 1 ppm by mass or more, and more preferably 10 ppm by mass or more. From the viewpoints of patterning ability and reliability, the content of the residual monomers of each structural unit of the alkali-soluble resin is preferably 3,000 ppm by mass or less, more preferably 600 ppm by mass or less, and even more preferably 100 ppm by mass or less, relative to the total mass of the photosensitive layer. While the lower limit is not particularly limited, it is preferably 0.1 ppm by mass or more, and more preferably 1 ppm by mass or more.

[0147] The amount of residual monomers in the monomers used in synthesizing an alkali-soluble resin by a polymer reaction is also preferably within the above range. For example, when synthesizing an alkali-soluble resin by reacting glycidyl acrylate with a carboxylic acid side chain, the content of glycidyl acrylate is preferably within the above range. The amount of residual monomers can be measured by known methods such as liquid chromatography and gas chromatography.

[0148] (Physical properties of the photosensitive layer, etc.) From the viewpoints of developability and resolution, the thickness of the photosensitive layer is preferably 20 μm or less, more preferably 10 μm or less, even more preferably 8 μm or less, particularly preferably 5 μm or less, and most preferably 1 μm or more and 5 μm or less.

[0149] To obtain better adhesion, the transmittance of the photosensitive layer at a wavelength of 365 nm is preferably 10% or more, more preferably 30% or more, and even more preferably 50% or more. There is no upper limit, but it is preferably 99.9% or less.

[0150] (Method of forming photosensitive layer) The method for forming the photosensitive layer is not particularly limited as long as it is capable of forming a layer containing the above-mentioned components. Examples of methods for forming the photosensitive layer include preparing a photosensitive resin composition containing an alkali-soluble resin, an ethylenically unsaturated compound, a photopolymerization initiator, and a solvent, applying the photosensitive resin composition to the surface of an intermediate layer, etc., and drying the coating film of the photosensitive resin composition. Heat drying and vacuum drying are preferred methods for drying the coating film of the photosensitive resin composition. In the present disclosure, "drying" refers to removing at least a portion of the solvent contained in the composition. Examples of drying methods include natural drying, heat drying, and vacuum drying. The above-mentioned methods can be applied alone or in combination. The drying temperature is preferably 80°C or higher, more preferably 90°C or higher. The upper limit is preferably 130°C or lower, more preferably 120°C or lower. Drying can also be performed by continuously changing the temperature. The drying time is preferably 20 seconds or longer, more preferably 40 seconds or longer, and even more preferably 60 seconds or longer. The upper limit is not particularly limited, but is preferably 600 seconds or less, more preferably 300 seconds or less.

[0151] Examples of the photosensitive resin composition used to form the photosensitive layer include a composition containing an alkali-soluble resin, an ethylenically unsaturated compound, a photopolymerization initiator, the above-mentioned optional components, and a solvent. The photosensitive resin composition preferably contains a solvent to adjust the viscosity of the photosensitive resin composition and facilitate the formation of the photosensitive layer.

[0152] The solvent contained in the photosensitive resin composition is not particularly limited as long as it can dissolve or disperse the alkali-soluble resin, ethylenically unsaturated compound, photopolymerization initiator, and the above-mentioned optional components, and known solvents can be used. Examples of solvents include alkylene glycol ether solvents, alkylene glycol ether acetate solvents, alcohol solvents (e.g., methanol and ethanol), ketone solvents (e.g., acetone and methyl ethyl ketone), aromatic hydrocarbon solvents (e.g., toluene), aprotic polar solvents (e.g., N,N-dimethylformamide), cyclic ether solvents (e.g., tetrahydrofuran), ester solvents, amide solvents, lactone solvents, and mixed solvents containing two or more of these. The photosensitive resin composition preferably contains at least one solvent selected from the group consisting of alkylene glycol ether solvents and alkylene glycol ether acetate solvents. Among these, a mixed solvent containing at least one solvent selected from the group consisting of alkylene glycol ether solvents and alkylene glycol ether acetate solvents and at least one solvent selected from the group consisting of ketone solvents and cyclic ether solvents is more preferred, and a mixed solvent containing at least three solvents, namely at least one solvent selected from the group consisting of alkylene glycol ether solvents and alkylene glycol ether acetate solvents, a ketone solvent, and a cyclic ether solvent, is even more preferred.

[0153] Examples of alkylene glycol ether solvents include ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, diethylene glycol dialkyl ethers, dipropylene glycol monoalkyl ethers, and dipropylene glycol dialkyl ethers. Examples of alkylene glycol ether acetate solvents include ethylene glycol monoalkyl ether acetates, propylene glycol monoalkyl ether acetates, diethylene glycol monoalkyl ether acetates, and dipropylene glycol monoalkyl ether acetates. Examples of solvents that can be used include those described in paragraphs 0092 to 0094 of International Publication No. 2018 / 179640 and those described in paragraph 0014 of Japanese Patent Application Laid-Open No. 2018-177889, the contents of which are incorporated herein by reference.

[0154] The photosensitive resin composition may contain one solvent alone or two or more solvents. The content of the solvent when applying the photosensitive resin composition is preferably 50 to 1,900 parts by mass, more preferably 100 to 900 parts by mass, per 100 parts by mass of the total solid content in the photosensitive resin composition.

[0155] The method for preparing the photosensitive resin composition is not particularly limited, and examples thereof include a method in which each component is dissolved in the above-mentioned solvent to prepare a solution in advance, and the resulting solutions are mixed in a predetermined ratio to prepare the photosensitive resin composition. The photosensitive resin composition is preferably filtered using a filter with a pore size of 0.2 μm to 30 μm before forming the photosensitive layer.

[0156] The method for applying the photosensitive resin composition is not particularly limited, and any known method may be used. Examples of the application method include slit coating, spin coating, curtain coating, and inkjet coating. The photosensitive layer may also be formed by applying the photosensitive resin composition to a protective film described below and drying it.

[0157] (Component of transfer layer: Intermediate layer) The intermediate layer preferably contains an alkali-soluble resin and a polymerizable compound. Examples of the alkali-soluble resin include the alkali-soluble resin that is a component of the photosensitive layer described above and the alkali-soluble resin that is a component of the thermoplastic resin layer described below. Examples of the polymerizable compound include the polymerizable compound that is a component of the photosensitive layer described above.

[0158] When the intermediate layer contains an alkali-soluble resin and a polymerizable compound, the mass ratio of the polymerizable compound to the alkali-soluble resin in the intermediate layer is preferably 0.5 or more, more preferably 0.6 to 1.1, and particularly preferably 0.6 to 0.9. The mass ratio of the polymerizable compound to the alkali-soluble resin in the intermediate layer affects the surface free energy of the intermediate layer. For example, as the mass ratio of the polymerizable compound to the alkali-soluble resin in the intermediate layer increases, the surface free energy of the intermediate layer increases. Increasing the surface free energy of the intermediate layer improves adhesion between the transfer layer and the target object (e.g., substrate) during transfer of the transfer layer to the target object, and also improves resolution. On the other hand, decreasing the mass ratio of the polymerizable compound to the alkali-soluble resin in the intermediate layer decreases the surface free energy of the intermediate layer. A decrease in the surface free energy of the intermediate layer suppresses adhesion of the transfer layer to the surface of the peeled temporary support or protective film, thereby suppressing a decrease in resolution.

[0159] From the viewpoint of adhesion to adjacent layers, the thickness of the intermediate layer is preferably 1 μm or more, more preferably 2 μm or more, and from the viewpoints of developability and resolution, the thickness of the intermediate layer is preferably 20 μm or less, more preferably 10 μm or less, and particularly preferably 5 μm or less.

[0160] The intermediate layer may have a single-layer structure or a multi-layer structure. Examples of preferred intermediate layers include a thermoplastic resin layer and a water-soluble resin layer. The intermediate layer may include a thermoplastic resin layer, a water-soluble resin layer, or both a thermoplastic resin layer and a water-soluble resin layer. The intermediate layer preferably includes a thermoplastic resin layer and a water-soluble resin layer. When the intermediate layer includes a thermoplastic resin layer and a water-soluble resin layer, the transfer film preferably includes a temporary support, a thermoplastic resin layer, a water-soluble resin layer, a photosensitive layer, and a protective film in this order. Examples of intermediate layers include an oxygen-blocking layer having an oxygen-blocking function, such as that described as a "separation layer" in JP-A-5-72724. When the intermediate layer is an oxygen-blocking layer, sensitivity during exposure is improved, the time load on the exposure machine is reduced, and productivity is improved.

[0161] (Component of the intermediate layer: thermoplastic resin layer) The thermoplastic resin layer improves the conformability of the transfer film to the substrate when the transfer film is bonded to the substrate, suppresses the inclusion of air bubbles between the substrate and the transfer film, and improves the adhesion between the substrate and the transfer film, for example.

[0162] (Component of thermoplastic resin layer: alkali-soluble resin) The thermoplastic resin layer preferably contains an alkali-soluble resin as the thermoplastic resin, such as an acrylic resin, a polystyrene resin, a styrene-acrylic copolymer, a polyurethane resin, a polyvinyl alcohol, a polyvinyl formal, a polyamide resin, a polyester resin, a polyamide resin, an epoxy resin, a polyacetal resin, a polyhydroxystyrene resin, a polyimide resin, a polybenzoxazole resin, a polysiloxane resin, a polyethyleneimine, a polyallylamine, and a polyalkylene glycol.

[0163] The alkali-soluble resin is preferably an acrylic resin from the viewpoints of developability and adhesion to adjacent layers. Here, the acrylic resin refers to a resin having at least one structural unit selected from the group consisting of structural units derived from (meth)acrylic acid, structural units derived from (meth)acrylic acid esters, and structural units derived from (meth)acrylic acid amides. The acrylic resin preferably contains structural units derived from (meth)acrylic acid, structural units derived from (meth)acrylic acid esters, and structural units derived from (meth)acrylic acid amides in a total amount of 50% by mass or more relative to the total mass of the acrylic resin. In particular, the total amount of structural units derived from (meth)acrylic acid and structural units derived from (meth)acrylic acid esters is preferably 30% by mass to 100% by mass, more preferably 50% by mass to 100% by mass, relative to the total mass of the acrylic resin.

[0164] The alkali-soluble resin is preferably a polymer having an acid group. Examples of the acid group include a carboxy group, a sulfo group, a phosphate group, and a phosphonate group, with a carboxy group being preferred. From the viewpoint of developability, the alkali-soluble resin is more preferably an alkali-soluble resin having an acid value of 60 mgKOH / g or more, and even more preferably a carboxy-group-containing acrylic resin having an acid value of 60 mgKOH / g or more. The upper limit of the acid value of the alkali-soluble resin is not particularly limited, but is preferably 200 mgKOH / g or less, more preferably 150 mgKOH / g or less.

[0165] The carboxyl group-containing acrylic resin having an acid value of 60 mgKOH / g or more is not particularly limited and can be appropriately selected from known resins. Examples include alkali-soluble resins that are carboxyl group-containing acrylic resins having an acid value of 60 mgKOH / g or more among the polymers described in paragraph

[0025] of JP-A No. 2011-95716, carboxyl group-containing acrylic resins having an acid value of 60 mgKOH / g or more among the polymers described in paragraphs

[0033] to

[0052] of JP-A No. 2010-237589, and carboxyl group-containing acrylic resins having an acid value of 60 mgKOH / g or more among the alkali-soluble resins described in paragraphs

[0053] to

[0068] of JP-A No. 2016-224162. The copolymerization ratio of the structural unit having a carboxyl group in the carboxyl group-containing acrylic resin is preferably 5% to 50% by mass, more preferably 10% to 40% by mass, and even more preferably 12% to 30% by mass, based on the total mass of the acrylic resin. As the alkali-soluble resin, from the viewpoint of developability and adhesion to adjacent layers, an acrylic resin having a structural unit derived from (meth)acrylic acid is particularly preferred.

[0166] The alkali-soluble resin may have a reactive group. The reactive group may be a polymerizable group, for example, a group capable of addition polymerization, polycondensation, or polyaddition, and examples thereof include ethylenically unsaturated groups, polycondensation groups such as hydroxy groups and carboxy groups, and polyaddition reactive groups such as epoxy groups and (blocked) isocyanate groups.

[0167] The weight average molecular weight (Mw) of the alkali-soluble resin is preferably 1,000 or more, more preferably from 10,000 to 100,000, and even more preferably from 20,000 to 50,000.

[0168] The thermoplastic resin layer may contain one kind of alkali-soluble resin alone or two or more kinds of alkali-soluble resins.

[0169] From the viewpoints of developability and adhesion to adjacent layers, the content of the alkali-soluble resin is preferably 10% by mass to 99% by mass, more preferably 20% by mass to 90% by mass, even more preferably 40% by mass to 80% by mass, and particularly preferably 50% by mass to 70% by mass, relative to the total mass of the thermoplastic resin layer.

[0170] (Component of thermoplastic resin layer: pigment) The thermoplastic resin layer preferably contains a dye (also simply referred to as "dye B") whose maximum absorption wavelength in the wavelength range of 400 nm to 780 nm during color development is 450 nm or more and whose maximum absorption wavelength changes in response to an acid, a base, or a radical. Preferred aspects of dye B are the same as those of dye N, except for the points described below.

[0171] From the viewpoints of the visibility and resolution of exposed and unexposed areas, the dye B is preferably a dye whose absorption maximum wavelength changes in response to an acid or a radical, and more preferably a dye whose absorption maximum wavelength changes in response to an acid. From the viewpoints of the visibility and resolution of exposed and unexposed areas, the thermoplastic resin layer preferably contains both a dye whose absorption maximum wavelength changes in response to an acid as dye B, and a compound that generates an acid when exposed to light, as described below.

[0172] The dye B may be used alone or in combination of two or more.

[0173] From the viewpoint of visibility of exposed and unexposed areas, the content of dye B is preferably 0.2 mass% or more, more preferably 0.2 mass% to 6 mass%, even more preferably 0.2 mass% to 5 mass%, and particularly preferably 0.25 mass% to 3.0 mass%, relative to the total mass of the thermoplastic resin layer.

[0174] Here, the content of dye B refers to the content of dye when all of the dye B contained in the thermoplastic resin layer is in a colored state. Below, a method for quantifying the content of dye B is explained using a dye that develops color through radicals as an example. Two types of solutions were prepared by dissolving 0.001 g or 0.01 g of dye in 100 mL of methyl ethyl ketone. The photoradical polymerization initiator Irgacure OXE01 (product name, manufactured by BASF) was added to each solution, and radicals were generated by irradiating with 365 nm light, causing all of the dyes to develop color. The absorbance of each solution was then measured at a liquid temperature of 25°C under atmospheric conditions using a spectrophotometer (UV3100, manufactured by Shimadzu Corporation), and a calibration curve was created. Next, the absorbance of the solution in which all of the dyes had developed color was measured using the same method as above, except that 0.1 g of the thermoplastic resin layer was dissolved in methyl ethyl ketone instead of the dye. The amount of the dye contained in the thermoplastic resin layer is calculated from the absorbance of the obtained solution containing the thermoplastic resin layer based on a calibration curve.

[0175] (Component of thermoplastic resin layer: Compound that generates acid, base or radical when exposed to light) The thermoplastic resin layer may contain a compound that generates an acid, a base, or a radical when exposed to light (also simply referred to as "compound C"). Compound C is preferably a compound that generates an acid, a base, or a radical when exposed to actinic rays such as ultraviolet light and visible light. Known photoacid generators, photobase generators, and photoradical polymerization initiators (i.e., photoradical generators) can be used as compound C. Among these, photoacid generators are preferred.

[0176] From the viewpoint of resolution, the thermoplastic resin layer preferably contains a photoacid generator. Examples of the photoacid generator include the cationic photopolymerization initiators that may be contained in the photosensitive layer described above, and preferred embodiments are the same except for the points described below.

[0177] From the viewpoints of sensitivity and resolution, the photoacid generator preferably contains at least one compound selected from the group consisting of an onium salt compound and an oxime sulfonate compound, and from the viewpoints of sensitivity, resolution, and adhesion, it is more preferable to contain an oxime sulfonate compound. Furthermore, as the photoacid generator, a photoacid generator having the following structure is also preferred.

[0178] [ka]

[0179] The thermoplastic resin layer may contain a photoradical polymerization initiator. Examples of the photoradical polymerization initiator include the photoradical polymerization initiators that may be contained in the photosensitive layer described above, and preferred embodiments are also the same.

[0180] The thermoplastic resin layer may contain a photobase generator. The photobase generator is not particularly limited as long as it is a known photobase generator, and examples thereof include 2-nitrobenzylcyclohexylcarbamate, triphenylmethanol, O-carbamoylhydroxylamide, O-carbamoyloxime, {[(2,6-dinitrobenzyl)oxy]carbonyl}cyclohexylamine, bis{[(2-nitrobenzyl)oxy]carbonyl}hexane-1,6-diamine, 4-(methylthiobenzoyl)-1-methyl-1-morpholinoethane, and (4-morpholinobenzoyl) 1-benzyl-1-dimethylaminopropane, N-(2-nitrobenzyloxycarbonyl)pyrrolidine, hexaamminecobalt(III) tris(triphenylmethylborate), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone, 2,6-dimethyl-3,5-diacetyl-4-(2-nitrophenyl)-1,4-dihydropyridine, and 2,6-dimethyl-3,5-diacetyl-4-(2,4-dinitrophenyl)-1,4-dihydropyridine.

[0181] The thermoplastic resin layer may contain one type of compound C alone, or two or more types thereof.

[0182] The content of compound C is preferably 0.1 to 10% by mass, more preferably 0.5 to 5% by mass, based on the total mass of the thermoplastic resin layer, from the viewpoints of visibility and resolution of exposed and unexposed areas.

[0183] (Component of thermoplastic resin layer: plasticizer) The thermoplastic resin layer preferably contains a plasticizer from the viewpoints of resolution, adhesion to adjacent layers, and developability.

[0184] The plasticizer preferably has a smaller molecular weight (weight average molecular weight (Mw) in the case of an oligomer or polymer) than the alkali-soluble resin. The molecular weight (weight average molecular weight (Mw)) of the plasticizer is preferably 200 to 2,000.

[0185] The plasticizer is not particularly limited as long as it is a compound that is compatible with the alkali-soluble resin and exhibits plasticity, but from the viewpoint of imparting plasticity, the plasticizer preferably has an alkyleneoxy group in the molecule, more preferably a polyalkylene glycol compound, and the alkyleneoxy group contained in the plasticizer more preferably has a polyethyleneoxy structure or a polypropyleneoxy structure.

[0186] From the viewpoints of resolution and storage stability, the plasticizer preferably contains a (meth)acrylate compound. From the viewpoints of compatibility, resolution, and adhesion to adjacent layers, it is more preferable that the alkali-soluble resin is an acrylic resin and the plasticizer contains a (meth)acrylate compound. Examples of the (meth)acrylate compound used as the plasticizer include the (meth)acrylate compounds described above as the ethylenically unsaturated compound contained in the photosensitive layer.

[0187] In the transfer film, when the thermoplastic resin layer and the photosensitive layer are laminated in direct contact with each other, it is preferable that both the thermoplastic resin layer and the photosensitive layer contain the same (meth)acrylate compound, because the thermoplastic resin layer and the photosensitive layer each contain the same (meth)acrylate compound, which suppresses component diffusion between the layers and improves storage stability.

[0188] When the thermoplastic resin layer contains a (meth)acrylate compound as a plasticizer, it is preferable that the (meth)acrylate compound does not polymerize even in the exposed area after exposure, from the viewpoint of adhesion to adjacent layers.

[0189] Furthermore, as the (meth)acrylate compound used as a plasticizer, from the viewpoints of resolution, adhesion to adjacent layers, and developability, a polyfunctional (meth)acrylate compound having two or more (meth)acryloyl groups in one molecule is preferred.

[0190] Furthermore, as the (meth)acrylate compound used as a plasticizer, a (meth)acrylate compound having an acid group or a urethane (meth)acrylate compound is also preferred.

[0191] The thermoplastic resin layer may contain one type of plasticizer alone or two or more types of plasticizers.

[0192] From the viewpoints of resolution, adhesion to adjacent layers, and developability, the content of the plasticizer is preferably 1% by mass to 70% by mass, more preferably 10% by mass to 60% by mass, and particularly preferably 20% by mass to 50% by mass, relative to the total mass of the thermoplastic resin layer.

[0193] (Component of thermoplastic resin layer: surfactant) From the viewpoint of thickness uniformity, the thermoplastic resin layer preferably contains a surfactant. Examples of the surfactant include the surfactants that may be contained in the photosensitive layer described above, and preferred embodiments are also the same.

[0194] The thermoplastic resin layer may contain one type of surfactant alone or two or more types of surfactants.

[0195] The content of the surfactant is preferably 0.001% by mass to 10% by mass, and more preferably 0.01% by mass to 3% by mass, relative to the total mass of the thermoplastic resin layer.

[0196] (Component of thermoplastic resin layer: sensitizer) The thermoplastic resin layer may contain a sensitizer. The sensitizer is not particularly limited, and examples thereof include the sensitizers that may be contained in the photosensitive layer described above.

[0197] The thermoplastic resin layer may contain one type of sensitizer alone or two or more types of sensitizers.

[0198] The content of the sensitizer can be selected appropriately depending on the purpose, but from the viewpoint of improving sensitivity to the light source and visibility of exposed and unexposed areas, it is preferably in the range of 0.01% by mass to 5% by mass, and more preferably in the range of 0.05% by mass to 1% by mass, relative to the total mass of the thermoplastic resin layer.

[0199] (Components of thermoplastic resin layer: additives, etc.) The thermoplastic resin layer may contain known additives in addition to the above components, as necessary. The thermoplastic resin layer is described in paragraphs

[0189] to

[0193] of JP 2014-85643 A, the contents of which are incorporated herein by reference.

[0200] (Physical properties of thermoplastic resin layer, etc.) The thickness of the thermoplastic resin layer is not particularly limited, but is preferably 1 μm or more, more preferably 2 μm or more, from the viewpoint of adhesion to adjacent layers. The upper limit is not particularly limited, but is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less, from the viewpoint of developability and resolution.

[0201] (Method for forming thermoplastic resin layer) The method for forming the thermoplastic resin layer is not particularly limited as long as it is a method capable of forming a layer containing the above-mentioned components. Examples of the method for forming the thermoplastic resin layer include a method of preparing a thermoplastic resin composition containing the above-mentioned components and a solvent, applying the thermoplastic resin composition to the surface of a temporary support or the like, and drying the coating film of the thermoplastic resin composition. The thermoplastic resin composition preferably contains a solvent in order to adjust the viscosity of the thermoplastic resin composition and facilitate the formation of the thermoplastic resin layer.

[0202] The solvent contained in the thermoplastic resin composition is not particularly limited as long as it can dissolve or disperse the above components contained in the thermoplastic resin layer. Examples of the solvent contained in the thermoplastic resin composition include the solvents that may be contained in the photosensitive resin composition described above, and the preferred embodiments are also the same.

[0203] The solvent contained in the thermoplastic resin composition may be one type alone or two or more types. The content of the solvent when applying the thermoplastic resin composition is preferably 50 to 1,900 parts by mass, more preferably 100 to 900 parts by mass, per 100 parts by mass of the total solid content in the thermoplastic resin composition.

[0204] The preparation of the thermoplastic resin composition and the formation of the thermoplastic resin layer may be carried out in accordance with the above-mentioned method for preparing the photosensitive resin composition and the method for forming the photosensitive layer. For example, a solution is prepared in advance by dissolving each component contained in the thermoplastic resin layer in the above-mentioned solvent, and the obtained solution is mixed in a predetermined ratio to prepare a thermoplastic resin composition, and then, The obtained thermoplastic resin composition is applied to the surface of a temporary support, and the coating of the thermoplastic resin composition is dried to form a thermoplastic resin layer. Alternatively, after forming a photosensitive layer and an intermediate layer on a protective film described below, a thermoplastic resin layer may be formed on the surface of the intermediate layer.

[0205] (Constituent element of transfer layer: Water-soluble resin layer) The water-soluble resin layer preferably contains a water-soluble resin. Examples of water-soluble resins include polyvinyl alcohol-based resins, polyvinylpyrrolidone-based resins, cellulose-based resins, acrylamide-based resins, polyethylene oxide-based resins, gelatin, vinyl ether-based resins, polyamide resins, and copolymers thereof. From the viewpoint of suppressing mixing of components between multiple layers, the resin contained in the water-soluble resin layer is preferably a resin different from both the polymer A contained in the photosensitive layer and the thermoplastic resin (e.g., alkali-soluble resin) contained in the thermoplastic resin layer.

[0206] The water-soluble resin layer preferably contains polyvinyl alcohol, and more preferably contains both polyvinyl alcohol and polyvinylpyrrolidone, from the viewpoints of oxygen barrier properties and suppressing mixing of components when multiple layers are applied and during storage after application.

[0207] The water-soluble resin layer may contain one kind of water-soluble resin alone or two or more kinds of water-soluble resins.

[0208] The content of the water-soluble resin in the water-soluble resin layer is not particularly limited, but from the viewpoint of oxygen barrier properties and suppressing mixing of components when coating multiple layers and during storage after coating, the content is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, even more preferably 80% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass, relative to the total mass of the water-soluble resin layer.

[0209] The water-soluble resin layer may contain additives such as surfactants, if necessary.

[0210] The thickness of the water-soluble resin layer is not particularly limited, but is preferably 0.1 μm to 5 μm, and more preferably 0.5 μm to 3 μm. When the thickness of the water-soluble resin layer is within the above range, the oxygen blocking properties are not reduced, mixing of components can be suppressed when multiple layers are applied and during storage after application, and an increase in the time required to remove the water-soluble resin layer during development can be suppressed.

[0211] The method for forming the water-soluble resin layer is not particularly limited, and examples thereof include a method in which a water-soluble resin composition containing the above-mentioned resin and any additives is prepared, applied to the surface of the thermoplastic resin layer or the photosensitive layer, and the coating of the water-soluble resin composition is dried to form a water-soluble resin layer. The water-soluble resin composition preferably contains a solvent to adjust the viscosity of the water-soluble resin composition and facilitate the formation of the water-soluble resin layer.

[0212] The solvent contained in the water-soluble resin composition is not particularly limited as long as it can dissolve or disperse the above resin, and is preferably at least one selected from the group consisting of water and water-miscible organic solvents, and more preferably water or a mixed solvent of water and a water-miscible organic solvent. Examples of water-miscible organic solvents include alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol, and glycerin, with alcohols having 1 to 3 carbon atoms being preferred, and methanol or ethanol being more preferred.

[0213] (Transfer film components: protective film) A transfer film according to an embodiment of the present disclosure includes a protective film. Materials constituting the protective film include resin films and paper, with resin films being preferred from the viewpoints of strength and flexibility. Examples of resin films include polyethylene films, polypropylene films, polyethylene terephthalate films, cellulose triacetate films, polystyrene films, and polycarbonate films. Among these, polyethylene films, polypropylene films, and polyethylene terephthalate films are preferred.

[0214] The thickness (layer thickness) of the protective film is not particularly limited, but is preferably 1 μm to 100 μm, more preferably 5 μm to 50 μm, even more preferably 5 μm to 40 μm, and particularly preferably 15 μm to 30 μm. Furthermore, the arithmetic mean roughness Ra value of the surface of the protective film in contact with the photosensitive layer (hereinafter simply referred to as the "surface of the protective film") is preferably 0.3 μm or less, more preferably 0.1 μm or less, and even more preferably 0.05 μm or less, from the viewpoint of superior resolution. It is believed that the Ra value of the surface of the protective film within the above range improves the uniformity of the layer thickness of the photosensitive layer and the formed resin pattern. The lower limit of the Ra value of the surface of the protective film is not particularly limited, but is preferably 0.001 μm or more.

[0215] The Ra value of the protective film surface is measured using the following method. A 3D optical profiler (New View7300, manufactured by Zygo) is used to measure the protective film surface under the following conditions to obtain a surface profile of the optical film. The Microscope Application of MetroPro ver. 8.3.2 is used as the measurement and analysis software. Next, the Surface Map screen is displayed in the analysis software, and histogram data is obtained on the Surface Map screen. The arithmetic mean roughness is calculated from the obtained histogram data to obtain the Ra value of the protective film surface. If the protective film is attached to a transfer film, the protective film can be peeled off from the transfer film and the Ra value of the surface on the peeled side can be measured.

[0216] The protective film is introduced into the transfer film by a known method. For example, the protective film is disposed on the transfer layer by laminating the transfer layer and the protective film. Examples of devices used to laminate the transfer layer and the protective film include known laminators such as a vacuum laminator and an auto-cut laminator. The laminator is preferably equipped with any heatable roller such as a rubber roller and is capable of applying pressure and heat. In addition, in the production of the transfer film, the transfer layer and the temporary support may be formed in this order on the protective film.

[0217] (Relationship between temporary support, photosensitive layer and protective film) In a transfer film according to one embodiment of the present disclosure, it is preferred that the breaking elongation at 120°C of the cured film obtained by curing the photosensitive layer is 15% or more, the arithmetic mean roughness Ra of the surface of the temporary support facing the photosensitive layer is 50 nm or less, and the arithmetic mean roughness Ra of the surface of the protective film facing the photosensitive layer is 150 nm or less.

[0218] Moreover, the transfer film according to the present disclosure preferably satisfies the following formula (R1). X×Y<1,500 Formula (R1) In the above formula (R1), X represents the breaking elongation (%) of the cured film obtained by curing the photosensitive layer at 120°C, and Y represents the arithmetic mean roughness Ra (nm) of the surface of the temporary support on the photosensitive layer side. X × Y is more preferably 750 or less.

[0219] The breaking elongation at 120°C of the cured film obtained by curing the photosensitive layer is preferably at least twice as large as the breaking elongation at 23°C. The breaking elongation is measured by exposing a 20 μm thick photosensitive layer to 120 mJ / cm 2 After curing by exposure to 400mJ / cm with a high-pressure mercury lamp 2 The cured film is then subjected to additional exposure at 145°C for 30 minutes, and the tensile strength is measured using the cured film.

[0220] Furthermore, the transfer film according to the present disclosure preferably satisfies the following formula (R2). Y≦Z formula (R2) Here, in the above formula (R2), Y represents the value (nm) of the arithmetic mean roughness Ra of the surface of the temporary support on the photosensitive layer side, and Z represents the value (nm) of the arithmetic mean roughness Ra of the surface of the protective film on the photosensitive layer side.

[0221] (Transfer film manufacturing method) The method for producing the transfer film according to the present disclosure is not particularly limited, and a known production method, for example, a known method for forming each layer, can be used. Hereinafter, the method for producing the transfer film according to the present disclosure will be described with reference to Fig. 1. However, the transfer film according to the present disclosure is not limited to one having the configuration shown in Fig. 1.

[0222] Examples of methods for producing the transfer film 100 include a method including the steps of applying an intermediate layer composition to the surface of the temporary support 10 and then drying the coating of the intermediate layer composition to form the intermediate layer 20, and applying a photosensitive resin composition containing an alkali-soluble resin and an ethylenically unsaturated compound to the surface of the intermediate layer 20 and then drying the coating of the photosensitive resin composition to form the photosensitive layer 30. In the above-mentioned production method, it is preferable to use a composition for the intermediate layer containing at least one solvent selected from the group consisting of water and water-miscible organic solvents, and further use a photosensitive resin composition containing an alkali-soluble resin, an ethylenically unsaturated compound, and at least one solvent selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent.

[0223] A transfer film 100 is produced by pressing a protective film 40 onto the photosensitive layer 30 of the laminate produced by the above-described production method. The production method of the transfer film used in the present disclosure preferably includes a step of providing the protective film 40 so that it is in contact with the surface of the photosensitive layer 30 opposite the side on which the temporary support 10 is provided, thereby producing a transfer film 100 comprising the temporary support 10, intermediate layer 20, photosensitive layer 30, and protective film 40. After producing the transfer film 100 by the above-described production method, the transfer film 100 may be wound up to produce and store a transfer film in roll form. The transfer film in roll form can be provided in its original form for the lamination step with a substrate in a roll-to-roll system described below.

[0224] A transfer film according to an embodiment of the present disclosure can be suitably used in various applications requiring precise microfabrication by photolithography. After patterning the photosensitive layer, etching may be performed using the photosensitive layer as a coating, or electroforming, which mainly involves electroplating, may be performed. The cured film obtained by patterning may also be used as a permanent film, for example, as an interlayer insulating film, a wiring protective film, or a wiring protective film having an index matching layer. A transfer film according to an embodiment of the present disclosure is preferably used for forming a resist pattern. A transfer film according to an embodiment of the present disclosure can also be suitably used for applications such as forming various wiring layers in semiconductor packages, printed circuit boards, and sensor substrates, touch panels, electromagnetic wave shielding materials, conductive films such as film heaters, liquid crystal sealants, and the formation of structures in the fields of micromachines and microelectronics.

[0225] In addition, a preferred embodiment of the transfer film according to the present disclosure is one in which the photosensitive layer is a pigmented resin layer. In addition to the above-mentioned applications, the colored resin layer is suitable for forming colored pixels or black matrices in color filters used in liquid crystal display devices (LCDs) and solid-state imaging devices (e.g., CCDs (charge-coupled devices) and CMOSs ​​(complementary metal oxide semiconductors)). Liquid crystal display windows in recent electronic devices may be provided with a cover glass on the rear peripheral edge of a transparent glass substrate or the like to protect the LCD display window. A colored resin layer can be used to form such a light-shielding layer. The aspects of the colored resin layer other than the pigment are the same as those described above.

[0226] The pigment used in the colored resin layer may be appropriately selected according to the desired hue, and may be selected from black pigments, white pigments, and pigments of chromatic colors other than black and white. In particular, when a black pattern is to be formed, a black pigment is preferably selected as the pigment.

[0227] As the black pigment, any known black pigment (such as an organic pigment or an inorganic pigment) can be appropriately selected as long as the effects of the present disclosure are not impaired. Among them, from the viewpoint of optical density, suitable black pigments include, for example, carbon black, titanium oxide, titanium carbide, iron oxide, titanium oxide, and graphite, with carbon black being particularly preferred. As the carbon black, from the viewpoint of surface resistance, carbon black at least a portion of the surface of which is coated with a resin is preferred.

[0228] From the viewpoint of dispersion stability, the particle size of the black pigment is preferably 0.001 μm to 0.1 μm, more preferably 0.01 μm to 0.08 μm, in terms of number average particle size. Here, the particle size refers to the diameter of a circle having the same area as the pigment particle, calculated from a photograph of the pigment particle taken with an electron microscope, and the number average particle size is the average value obtained by calculating the particle sizes of 100 random particles and averaging the particle sizes of the 100 particles.

[0229] As for the pigment other than the black pigment, the white pigment described in paragraphs 0015 and 0114 of JP-A No. 2005-007765 can be used. Specifically, among the white pigments, inorganic pigments such as titanium oxide, zinc oxide, lithopone, precipitated calcium carbonate, white carbon, aluminum oxide, aluminum hydroxide, or barium sulfate are preferred, with titanium oxide or zinc oxide being more preferred, and titanium oxide being even more preferred. Rutile or anatase titanium oxide is more preferred as the inorganic pigment, with rutile titanium oxide being particularly preferred. The surface of the titanium oxide may be subjected to silica treatment, alumina treatment, titania treatment, zirconia treatment, or organic treatment, or two or more treatments may be performed. This suppresses the catalytic activity of the titanium oxide and improves heat resistance, fading resistance, and the like. From the viewpoint of reducing the thickness of the photosensitive layer after heating, the surface treatment of the titanium oxide is preferably at least one of alumina treatment and zirconia treatment, and particularly preferably both alumina treatment and zirconia treatment.

[0230] Furthermore, when the photosensitive layer is a colored resin layer, it is also preferable that the photosensitive layer further contains a chromatic pigment other than a black pigment and a white pigment from the viewpoint of transferability. When a chromatic pigment is contained, the particle size of the chromatic pigment is preferably 0.1 μm or less, more preferably 0.08 μm or less, in terms of better dispersibility. Examples of chromatic pigments include Victoria Pure Blue BO (Color Index (CI) 42595), Auramine (CI 41000), Fat Black HB (CI 26150), Monolight Yellow GT (CI Pigment Yellow 12), Permanent Yellow GR (CI Pigment Yellow 17), Permanent Yellow HR (CI Pigment Yellow 83), Permanent Carmine FBB (CI Pigment Red 146), Hoster Balm Red ESB (CI Pigment Violet 19), Permanent Ruby FBH (CI Pigment Red 11), Fastel Pink B Supra (CI Pigment Red 81), Monastral Fast Blue (CI Pigment Red 146), Examples of pigments suitable for pigmentation include CI Pigment Blue 15), Monolight Fast Black B (CI Pigment Black 1) and carbon, CI Pigment Red 97, CI Pigment Red 122, CI Pigment Red 149, CI Pigment Red 168, CI Pigment Red 177, CI Pigment Red 180, CI Pigment Red 192, CI Pigment Red 215, CI Pigment Green 7, CI Pigment Blue 15:1, CI Pigment Blue 15:4, CI Pigment Blue 22, CI Pigment Blue 60, CI Pigment Blue 64, and CI Pigment Violet 23. Of these, CI Pigment Red 177 is preferred.

[0231] When the photosensitive layer contains a pigment, the content of the pigment is preferably more than 3% by mass and not more than 40% by mass, more preferably more than 3% by mass and not more than 35% by mass, even more preferably more than 5% by mass and not more than 35% by mass, and particularly preferably 10% by mass or more and not more than 35% by mass, relative to the total mass of the photosensitive layer.

[0232] When the photosensitive layer contains pigments other than black pigments (white pigments and chromatic pigments), the content of the pigments other than black pigments is preferably 30% by mass or less, more preferably 1% by mass to 20% by mass, and even more preferably 3% by mass to 15% by mass, relative to the black pigment.

[0233] When the photosensitive layer contains a black pigment and is formed from a photosensitive resin composition, the black pigment (preferably carbon black) is preferably introduced into the photosensitive resin composition in the form of a pigment dispersion. The dispersion may be prepared by premixing the black pigment and a pigment dispersant, adding the resulting mixture to an organic solvent (or vehicle), and dispersing the mixture using a disperser. The pigment dispersant may be selected depending on the pigment and solvent; for example, a commercially available dispersant may be used. The vehicle refers to the medium in which the pigment is dispersed when a pigment dispersion is prepared. It is liquid and includes a binder component that maintains the black pigment in a dispersed state and a solvent component (preferably an organic solvent) that dissolves and dilutes the binder component.

[0234] The dispersing machine is not particularly limited, and examples thereof include known dispersing machines such as a kneader, a roll mill, an attritor, a super mill, a dissolver, a homomixer, and a sand mill. Furthermore, fine pulverization may be performed by utilizing frictional force through mechanical grinding. For details about dispersing machines and fine pulverization, please refer to the descriptions in "Pigment Dictionary" (Kunizo Asakura, 1st Edition, Asakura Shoten, 2000, pp. 438 and 310).

[0235] <Method of manufacturing conductor patterns> A method for producing a conductive pattern according to an embodiment of the present disclosure includes, in this order, peeling off a protective film from a transfer film according to an embodiment of the present disclosure (hereinafter, sometimes referred to as a "protective film peeling step"); bonding the transfer film to a substrate including a metal layer and arranging a transfer layer and a temporary support on the metal layer of the substrate in this order (hereinafter, sometimes referred to as a "laminating step"); exposing the transfer layer to light (hereinafter, sometimes referred to as an "exposure step"); developing the transfer layer to form a resist pattern (hereinafter, sometimes referred to as a "resist pattern forming step"); etching or plating the metal layer not covered by the resist pattern (hereinafter, sometimes referred to as an "etching or plating step"); and peeling off the resist pattern (hereinafter, sometimes referred to as a "resist pattern peeling step"). The method for producing a conductive pattern described above may include peeling off the temporary support between the bonding step and the exposure step (hereinafter, sometimes referred to as a "temporary support peeling step"). The method for producing a conductive pattern described above may include a temporary support peeling step before the exposure step.

[0236] A method for manufacturing a conductive pattern according to another embodiment of the present disclosure includes, in this order, peeling off a protective film from a transfer film according to an embodiment of the present disclosure (i.e., a "protective film peeling step"), bonding the transfer film to a substrate including a metal layer and arranging a transfer layer and a temporary support on the metal layer of the substrate (i.e., a "lamination step"), peeling off the temporary support (i.e., a "temporary support peeling step"), exposing the transfer layer (i.e., an "exposure step"), developing the transfer layer to form a resist pattern (i.e., a "resist pattern formation step"), etching or plating the metal layer that is not covered by the resist pattern (i.e., an "etching or plating step"), and peeling off the resist pattern (i.e., a "resist pattern peeling step").

[0237] Specific aspects of the steps according to the above-described embodiments will be described below. The aspects of the transfer film used in the method for manufacturing a conductor pattern are as described above. In the following description, the description of the transfer film will be omitted.

[0238] (Protective film peeling process) In the protective film peeling step, the protective film of the transfer film is peeled off. A known method is used as the protective film peeling method. In the protective film peeling step, for example, a mechanism similar to the cover film peeling mechanism described in paragraphs 0161 and 0162 of JP 2010-072589 A can be used.

[0239] The peel strength of the protective film when peeled is preferably 0.3 mN / mm to 2.0 mN / mm, more preferably 0.3 mN / mm to 1.5 mN / mm, and particularly preferably 0.5 mN / mm to 1.0 mN / mm. When the peel strength of the protective film is high, unintentional peeling of the protective film is prevented, improving handleability. When the peel strength of the protective film is low, the transfer layer is less likely to adhere to the surface of the peeled protective film. The peel strength of the protective film is measured by the following method. Tape (PRINTACK, manufactured by Nitto Denko Corporation) is attached to the surface of the protective film of the transfer film, and then cut to a size of 70 mm x 10 mm to prepare a sample. The temporary support for the sample is fixed on the sample stage. Using a tension-compression tester (SV-55, manufactured by Imada Seisakusho Co., Ltd.), the tape is pulled in a 180-degree direction at 5.5 mm / s to peel off the protective film, and the peel strength of the protective film is measured. The matters regarding the peel strength of the protective film described above apply not only to the protective film of the transfer film used in the manufacturing method of the conductive pattern according to the present disclosure, but also to the protective film described in the above section "Components of the transfer film: Protective film."

[0240] (Laminating process) In the lamination step, the transfer film and a substrate including a metal layer are laminated together, and the transfer layer and the temporary support are disposed in this order on the metal layer of the substrate. The lamination of the transfer film and the substrate preferably includes pressure-bonding the transfer film and the substrate.

[0241] The method for pressure-bonding the transfer film and the substrate is not particularly limited, and known transfer methods and lamination methods can be used. The transfer film and the substrate are preferably bonded together by overlapping the transfer film and the substrate and applying pressure and heat using a roll or other means. For bonding, known laminators such as a laminator, a vacuum laminator, and an auto-cut laminator, which can further increase productivity, can be used. The lamination temperature is not particularly limited, but is preferably, for example, 70°C to 130°C.

[0242] The method for manufacturing a conductive pattern including the lamination step is preferably carried out by a roll-to-roll method. The roll-to-roll method will be described below. The roll-to-roll method refers to a method in which a substrate that can be wound up and unwound is used as the substrate, and the method includes a step of unwinding the substrate or a structure including the substrate (also referred to as the "unwinding step") before any of the steps included in the method for manufacturing a conductive pattern, and a step of winding the substrate or a structure including the substrate (also referred to as the "winding step") after any of the steps, in which at least any of the steps (preferably all of the steps, or all of the steps except the heating step) are carried out while the substrate or the structure including the substrate is being transported. The unwinding method in the unwinding step and the winding method in the winding step are not particularly limited, and any known method may be used in a manufacturing method that employs the roll-to-roll method.

[0243] Examples of the substrate include a resin substrate, a glass substrate, and a semiconductor substrate. Preferred embodiments of the substrate are described in paragraph 0140 of International Publication No. 2018 / 155193, the contents of which are incorporated herein by reference. Preferred materials for the resin substrate are cycloolefin polymers and polyimides. The thickness of the resin substrate is preferably 5 μm to 200 μm, more preferably 10 μm to 100 μm.

[0244] The substrate includes a metal layer. The substrate may include two or more metal layers. Examples of metals included in the metal layer include Al, Zn, Cu, Fe, Ni, Cr, Mo, Ag, and Au. The metal layer preferably includes at least one selected from the group consisting of copper and silver, and more preferably includes copper or silver.

[0245] The substrate may include a layer other than a metal layer. Examples of the layer other than a metal layer include a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer. Examples of conductive metal oxides include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and SiO2. In the present disclosure, "conductive" refers to a material having a volume resistivity of 1×10 6 The volume resistivity of conductive metal oxides is less than 1×10 4 Preferably less than Ωcm.

[0246] The substrate may include at least one of a transparent electrode and a lead wiring. Such a substrate can be suitably used as a touch panel substrate. The transparent electrode can function suitably as a touch panel electrode. The transparent electrode is preferably composed of a metal oxide film such as ITO (indium tin oxide) or IZO (indium zinc oxide), and a metal mesh and a thin metal wire such as a metal nanowire. Examples of the thin metal wire include thin wires of silver and copper. Among them, conductive silver materials such as silver mesh and silver nanowire are preferred. The material of the lead wiring is preferably a metal. Examples of the metal material for the lead wiring include gold, silver, copper, molybdenum, aluminum, titanium, chromium, zinc, and manganese, as well as alloys composed of two or more of these metal elements. The material of the lead wiring is preferably copper, molybdenum, aluminum, or titanium, and particularly preferably copper.

[0247] (Temporary support peeling process) In the temporary support peeling step, the temporary support is peeled off. By peeling off the temporary support, the transfer layer is usually exposed. As a method for peeling off the temporary support, a known method is applied. In the temporary support peeling step, for example, a mechanism similar to the cover film peeling mechanism described in paragraphs 0161 to 0162 of JP 2010-072589 A can be used.

[0248] The peel strength of the temporary support when peeling it is preferably 0.3 mN / mm to 2.5 mN / mm, more preferably 0.3 mN / mm to 1.5 mN / mm, and particularly preferably 0.5 mN / mm to 1.0 mN / mm. When the peel strength of the temporary support is high, unintentional peeling of the temporary support is prevented, improving handleability. When the peel strength of the temporary support is low, the transfer layer is less likely to adhere to the surface of the peeled temporary support. Furthermore, since the protective film is peeled off before the temporary support, it is preferable to make the peel strength of the temporary support higher than that of the protective film. The peel strength of the temporary support is measured by the following method. The protective film is peeled off from the transfer film, and the transfer film and a substrate (specifically, a copper substrate) are bonded together under conditions of a laminating roll temperature of 100°C, a linear pressure of 0.6 MPa, and a linear speed (laminating speed) of 4.0 m / min, to obtain a laminate. A tape (PRINTACK manufactured by NITTO) was applied to the surface of the temporary support of the laminate obtained by the lamination process described above, and then cut to a size of 70 mm x 10 mm to prepare a sample. The sample substrate was fixed on a sample stage. Using a tension-compression tester (SV-55 manufactured by Imada Seisakusho Co., Ltd.), the tape was pulled at 5.5 mm / s in a 180-degree direction to peel off the temporary support, and the peel strength of the temporary support was measured. Note that the above-mentioned matters regarding the peel strength of the temporary support may also be applied to the temporary support described in the above section "Components of the Transfer Film: Temporary Support." When the above-mentioned matters regarding the peel strength of the temporary support are applied to the temporary support described in the above section "Components of the Transfer Film: Temporary Support," the laminate used to measure the peel strength of the temporary support is obtained by peeling the protective film from the transfer film and laminating the transfer film to the substrate under conditions of a laminating roll temperature of 100°C, a linear pressure of 0.6 MPa, and a linear velocity (lamination speed) of 4.0 m / min.

[0249] (Exposure process) In the exposure step, the transfer layer is exposed. In the exposure step, it is preferable to expose the transfer layer in a pattern. "Pattern exposure" refers to a form of patterned exposure, that is, exposure in a form in which exposed and unexposed areas exist. The positional relationship between exposed and unexposed areas in patterned exposure is not particularly limited and may be adjusted as appropriate. Exposure may be carried out in a direction from the substrate toward the transfer layer, or in a direction from the transfer layer toward the substrate.

[0250] The detailed arrangement and specific size of the pattern in the pattern exposure are not particularly limited. For example, in order to improve the display quality of a display device (e.g., a touch panel) equipped with an input device having circuit wiring and to reduce the area occupied by the lead wiring, at least a part of the pattern (preferably the electrode pattern and / or the lead wiring of the touch panel) preferably includes thin lines having a width of 20 μm or less, more preferably thin lines having a width of 10 μm or less.

[0251] The light source used for exposure can be appropriately selected and used as long as it irradiates light with a wavelength (e.g., 365 nm or 405 nm) that can expose the transfer layer (especially the photosensitive layer). Specific examples include ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps, and LEDs (Light Emitting Diodes). The exposure dose is 5 mJ / cm. 2 ~200mJ / cm 2 is preferred, and 10 mJ / cm 2 ~100mJ / cm 2 Preferred embodiments of the light source, exposure dose, and exposure method used for exposure are described, for example, in paragraphs 0146 to 0147 of WO 2018 / 155193, the contents of which are incorporated herein by reference.

[0252] The exposure step may be carried out after or before the temporary support is peeled off. If the temporary support is peeled off before exposure, the mask may be exposed in contact with the transfer layer (particularly the photosensitive layer) or in close proximity without contact. If exposure is performed without peeling off the temporary support, the mask may be exposed in contact with the temporary support or in close proximity without contact. In order to prevent mask contamination due to contact between the transfer layer (particularly the photosensitive layer) and the mask and to avoid the influence of foreign matter attached to the mask on the exposure, it is preferable to perform pattern exposure without peeling off the temporary support. Note that the exposure method can be appropriately selected from contact exposure in the case of contact exposure, and proximity exposure, lens-based or mirror-based projection exposure, and direct exposure using an exposure laser, etc. in the case of non-contact exposure. In the case of lens-based or mirror-based projection exposure, an exposure machine having an appropriate lens numerical aperture (NA) can be used depending on the required resolution and depth of focus. In the case of the direct exposure method, drawing may be performed on the transfer layer (particularly the photosensitive layer), or reduction projection exposure may be performed on the transfer layer (particularly the photosensitive layer) through a lens. In addition, exposure may be performed not only in the atmosphere but also under reduced pressure or vacuum, and exposure may be performed with a liquid such as water interposed between the light source and the transfer layer (particularly the photosensitive layer).

[0253] (Resist pattern formation process) In the resist pattern forming step, the transfer layer is developed to form a resist pattern. The development can be carried out using a developer.

[0254] As the developer, for example, a known developer such as the developer described in JP-A-5-72724 can be used. The developer is preferably an alkaline aqueous solution containing a compound with a pKa of 7 to 13 at a concentration of 0.05 mol / L to 5 mol / L. The developer may contain a water-soluble organic solvent and / or a surfactant. Examples of alkaline compounds that can be contained in the alkaline aqueous solution include sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, and choline (2-hydroxyethyltrimethylammonium hydroxide). Preferred examples of the developer include the developer described in paragraph 0194 of WO 2015 / 093271.

[0255] A suitable development method is, for example, the development method described in paragraph 0195 of WO 2015 / 093271.

[0256] The development method is not particularly limited, and may be any of puddle development, shower development, shower and spin development, and dip development. Shower development is a development treatment in which a developer is sprayed onto the photosensitive layer after exposure in a shower to remove exposed or unexposed areas. After development, it is preferable to spray a cleaning agent in a shower and remove development residues by scrubbing with a brush. The temperature of the developer is not particularly limited, but is preferably 20°C to 40°C.

[0257] (etching or plating process) In the etching or plating process, etching or plating is performed on the metal layer that is not covered by the resist pattern. When etching is performed on the metal layer that is not covered by the resist pattern, the metal layer that is not covered by the resist pattern is removed, and a conductive pattern is formed. When plating is performed on the metal layer that is not covered by the resist pattern, a conductive pattern is formed on the metal layer that is not covered by the resist pattern. The latter method is sometimes referred to as a semi-additive method. In some embodiments, etching is preferably performed on the metal layer that is not covered by the resist pattern. In some embodiments, plating is preferably performed on the metal layer that is not covered by the resist pattern.

[0258] As the etching method, known methods can be applied, for example, the method described in paragraphs 0209 to 0210 of JP 2017-120435 A, the method described in paragraphs 0048 to 0054 of JP 2010-152155 A, a wet etching method in which the substrate is immersed in an etching solution, and a dry etching method such as plasma etching can be mentioned.

[0259] The etching solution used for wet etching may be an acidic or alkaline etching solution that is appropriately selected depending on the target to be etched. Examples of acidic etching solutions include aqueous solutions of an acidic component selected from hydrochloric acid, sulfuric acid, nitric acid, acetic acid, hydrofluoric acid, oxalic acid, and phosphoric acid, as well as aqueous solutions of an acidic component mixed with a salt selected from ferric chloride, ammonium fluoride, and potassium permanganate. The acidic component may be a combination of multiple acidic components. Examples of alkaline etching solutions include aqueous solutions of an alkaline component selected from sodium hydroxide, potassium hydroxide, ammonia, organic amines, and salts of organic amines (e.g., tetramethylammonium hydroxide), as well as aqueous solutions of an alkaline component mixed with a salt (e.g., potassium permanganate). The alkaline component may be a combination of multiple alkaline components.

[0260] As the plating method, known methods can be applied, for example, electroplating and electroless plating. The plating is preferably electroplating, and more preferably copper electroplating.

[0261] Examples of components of plating solutions used in electroplating include water-soluble copper salts. Examples of water-soluble copper salts that can be used include those commonly used as components of plating solutions. The water-soluble copper salt is preferably at least one selected from the group consisting of inorganic copper salts, copper alkane sulfonates, copper alkanol sulfonates, and copper organic acid salts. Examples of inorganic copper salts include copper sulfate, copper oxide, copper chloride, and copper carbonate. Examples of copper alkane sulfonates include copper methanesulfonate and copper propanesulfonate. Examples of copper alkanol sulfonates include copper isethionate and copper propanol sulfonate. Examples of organic acid copper salts include copper acetate, copper citrate, and copper tartrate.

[0262] The plating solution may contain sulfuric acid, which allows the pH and sulfate ion concentration of the plating solution to be adjusted.

[0263] The electroplating method and conditions are not limited. For example, a conductive pattern can be formed on the conductor pattern by supplying the transparent substrate after the development process to a plating tank containing a plating solution. In electroplating, a conductive pattern can be formed by controlling, for example, the current density and the transport speed of the transparent substrate.

[0264] The temperature of the plating solution used in electroplating is preferably 70°C or less, more preferably 10°C to 40°C. The current density in electroplating is 0.1 A / dm 2 ~100A / dm 2 It is preferable that the current is 0.5A / dm 2 ~20A / dm 2It is more preferable that the current density is set to 1 / 2 or 1 / 4. By increasing the current density, the productivity of the conductor pattern can be improved. By decreasing the current density, the uniformity of the thickness of the conductor pattern can be improved.

[0265] (Removal process of resist pattern) In the resist pattern stripping step, the resist pattern is stripped. The method for stripping the resist pattern is not particularly limited, but includes a method of removing the resist pattern by chemical treatment, and a method of removing the resist pattern using a remover is preferred. As a method for stripping the resist pattern, a method of immersing the substrate having the resist pattern in a stirred remover having a liquid temperature of preferably 30°C to 80°C, more preferably 50°C to 80°C, for 1 minute to 30 minutes can be mentioned.

[0266] Examples of the removal solution include a removal solution obtained by dissolving an inorganic or organic alkaline component in water, dimethyl sulfoxide, N-methylpyrrolidone, or a mixture thereof. Examples of the inorganic alkaline component include sodium hydroxide and potassium hydroxide. Examples of the organic alkaline component include primary amine compounds, secondary amine compounds, tertiary amine compounds, and quaternary ammonium salt compounds. Furthermore, the removal solution may be used for removal by known methods such as a spray method, a shower method, or a puddle method.

[0267] (Post-exposure process and post-bake process) The method for producing a conductive pattern according to an embodiment may include a step of exposing the resist pattern obtained by the resist pattern forming step (post-exposure step) and / or a step of heating the resist pattern (post-bake step). When the method for producing a conductive pattern includes both the post-exposure step and the post-bake step, it is preferable to perform post-bake after the post-exposure step.

[0268] The post-exposure exposure dose was 100 mJ / cm 2 ~5,000mJ / cm 2 is preferred, and 200 mJ / cm 2 ~3,000mJ / cm 2is more preferred.

[0269] The post-baking temperature is preferably 80°C to 250°C, and more preferably 90°C to 160°C.

[0270] The post-baking time is preferably 1 to 180 minutes, more preferably 10 to 60 minutes.

[0271] (Other processes) Examples of processes applicable to the method for manufacturing a conductive pattern include the processes described in paragraphs 0035 to 0051 of JP 2006-23696 A. Examples of processes applicable to the method for manufacturing a conductive pattern include the process of reducing visible light reflectance described in paragraph 0172 of WO 2019 / 022089 A and the process of forming a new conductive layer on an insulating film described in paragraph 0172 of WO 2019 / 022089 A, but are not limited to these processes.

[0272] A method for manufacturing a conductive pattern according to an embodiment may include a step of performing a process for reducing the visible light reflectance of some or all of the multiple metal layers of the substrate. Examples of processes for reducing the visible light reflectance include oxidation. When the substrate has a metal layer containing copper, the visible light reflectance of the metal layer can be reduced by oxidizing the copper to copper oxide and blackening the metal layer. The process for reducing the visible light reflectance is described in paragraphs

[0017] to

[0025] of JP 2014-150118 A and paragraphs

[0041] ,

[0042] ,

[0048] , and

[0058] of JP 2013-206315 A, the contents of which are incorporated herein by reference.

[0273] A method for manufacturing a conductor pattern according to an embodiment preferably includes a step of forming an insulating film on the surface of the conductor pattern and a step of forming a new conductive layer on the surface of the insulating film. Through these steps, a second electrode pattern insulated from the first electrode pattern can be formed. The step of forming the insulating film is not particularly limited, and examples thereof include known methods for forming permanent films. Alternatively, an insulating film having a desired pattern may be formed by photolithography using an insulating photosensitive material. The step of forming a new conductive layer on the insulating film is not particularly limited, and for example, a new conductive layer having a desired pattern may be formed by photolithography using a conductive photosensitive material.

[0274] A preferred method for producing a conductor pattern is to use a substrate having multiple metal layers on both surfaces of the substrate, and to sequentially or simultaneously form circuits on the metal layers formed on both surfaces of the substrate. This configuration allows the formation of a touch panel circuit wiring in which a first conductor pattern is formed on one surface of the substrate and a second conductor pattern is formed on the other surface. It is also preferred to form such a touch panel circuit wiring from both surfaces of the substrate using a roll-to-roll process.

[0275] (Applications of conductor patterns) The conductor pattern can be applied to various devices. Examples of devices equipped with the conductor pattern manufactured by the above-described manufacturing method include input devices, preferably touch panels, and more preferably capacitive touch panels. Furthermore, the input device can be applied to display devices such as organic electroluminescence (EL) display devices and liquid crystal display devices.

[0276] <Touch panel manufacturing method> A method for manufacturing a touch panel according to an embodiment of the present disclosure includes, in this order, peeling off a protective film from a transfer film according to an embodiment of the present disclosure (i.e., a "protective film peeling step"); bonding the transfer film to a substrate including a metal layer and arranging a transfer layer and a temporary support on the metal layer of the substrate in this order (i.e., a "lamination step"); exposing the transfer layer to light (i.e., an "exposure step"); developing the transfer layer to form a resist pattern (i.e., a "resist pattern formation step"); etching or plating the metal layer not covered by the resist pattern (i.e., an "etching or plating step"); and peeling off the resist pattern (i.e., a "resist pattern peeling step"). The method for manufacturing a touch panel described above may include peeling off the temporary support between the lamination step and the exposure step (i.e., a "temporary support peeling step"). The method for manufacturing a touch panel described above may include a temporary support peeling step before the exposure step.

[0277] A method for manufacturing a touch panel according to another embodiment of the present disclosure includes, in this order, peeling off the protective film of a transfer film according to an embodiment of the present disclosure (i.e., the "protective film peeling step"), bonding the transfer film to a substrate including a metal layer and arranging a transfer layer and a temporary support on the metal layer of the substrate (i.e., the "lamination step"), peeling off the temporary support (i.e., the "temporary support peeling step"), exposing the transfer layer (i.e., the "exposure step"), developing the transfer layer to form a resist pattern (i.e., the "resist pattern formation step"), etching or plating the metal layer not covered by the resist pattern (i.e., the "etching or plating step"), and peeling off the resist pattern (i.e., the "resist pattern peeling step").

[0278] Specific aspects of each step in the touch panel manufacturing method, and the order in which each step is performed, are as explained above in the sections "Laminate Manufacturing Method" and "Circuit Wiring Manufacturing Method," and preferred aspects are also the same. The touch panel manufacturing method can refer to known touch panel manufacturing methods, except that touch panel wiring is formed by the above method. Furthermore, the touch panel manufacturing method may include any step (other step) other than those described above.

[0279] Examples of mask patterns used in touch panel manufacturing are shown in Figures 2 and 3. In pattern A shown in Figure 2 and pattern B shown in Figure 3, GR represents a non-image area (light-shielding area), EX represents an image area (exposed area), and DL represents a virtual alignment frame. In a touch panel manufacturing method, for example, by exposing the photosensitive layer through a mask having pattern A shown in Figure 2, a touch panel can be manufactured in which circuit wiring having pattern A corresponding to EX is formed. Specifically, it can be manufactured by the method described in Figure 1 of International Publication No. 2016 / 190405. In one example of the manufactured touch panel, the center of the exposed area EX (the pattern portion where the lines are connected) is the area where transparent electrodes (touch panel electrodes) will be formed, and the periphery of the exposed area EX (the thin line portion) is the area where wiring for the peripheral extraction section will be formed.

[0280] The above-described touch panel manufacturing method produces a touch panel having at least touch panel wiring. The touch panel preferably has a transparent substrate, electrodes, and an insulating layer or a protective layer. Examples of detection methods for the touch panel include known methods such as a resistive film method, a capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method. Among these, the capacitance method is preferred.

[0281] Examples of touch panel types include so-called in-cell types (e.g., those shown in Figures 5, 6, 7, and 8 of JP-A-2012-517051), so-called on-cell types (e.g., those shown in Figure 19 of JP-A-2013-168125 and those shown in Figures 1 and 5 of JP-A-2012-89102), OGS (One Glass Solution) types, TOL (Touch-on-Lens) types (e.g., those shown in Figure 2 of JP-A-2013-54727), various out-cell types (e.g., those shown in Figure 6 of JP-A-2013-164871), and other configurations. Examples of touch panels include those described in paragraph 0229 of JP-A-2017-120435. [Example]

[0282] The following examples further illustrate the embodiments of the present invention. The materials, amounts used, ratios, processing details, processing procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the embodiments of the present invention. Therefore, the scope of the embodiments of the present invention is not limited to the specific examples shown below. Unless otherwise specified, "parts" and "%" are based on mass. In the following examples, the weight average molecular weight of the resin is the weight average molecular weight calculated in terms of polystyrene by gel permeation chromatography (GPC). The theoretical acid value was used for the acid value.

[0283] <Temporary support 1> Temporary support 1 was prepared by the following method.

[0284] (Particle-containing layer-forming composition 1) The components were mixed according to the formulation shown below to obtain particle-containing layer-forming composition 1. After preparing particle-containing layer-forming composition 1, it was filtered through a 6 μm filter (F20, manufactured by Mahle Filter Systems Co., Ltd.) and then subjected to membrane degassing using a 2x6 Radial Flow Superphobic (manufactured by Polypore Corporation).

[0285] 167 parts of acrylic polymer (AS-563A, manufactured by Daicel FineChem Co., Ltd., solid content 27.5% by mass) 0.7 parts nonionic surfactant (Naroacty CL95, manufactured by Sanyo Chemical Industries, Ltd., solid content 100% by mass) 114.4 parts anionic surfactant (Rapisol A-90, manufactured by NOF Corporation, diluted with water to a solids content of 1% by mass) 7 parts carnauba wax dispersion (Cellosol 524, manufactured by Chukyo Yushi Co., Ltd., solid content 30% by mass) 20.9 parts of carbodiimide compound (Carbodilite V-02-L2, manufactured by Nisshinbo Chemical Inc., diluted with water to a solid content of 10% by mass) Matting agent (Snowtex XL, manufactured by Nissan Chemical Co., Ltd., solid content 40% by mass, average particle size 50 nm): 2.8 parts ·Wednesday: 690.2 copies

[0286] (Extrusion molding) Pellets of polyethylene terephthalate using a citric acid chelate organic titanium complex as a polymerization catalyst, as described in Japanese Patent No. 5575671, were dried to a moisture content of 50 ppm or less, then placed in the hopper of a 30 mm diameter single-screw kneading extruder and melted and extruded at 280°C. The melt was passed through a filter (pore size 2 μm) and then extruded from a die onto a cooling roll at 25°C to obtain an unstretched film. The extruded melt was then brought into close contact with the cooling roll using an electrostatic application method.

[0287] (Stretching and Coating) The solidified unstretched film was subjected to sequential biaxial stretching by the following method to obtain a temporary support comprising a polyester film with a thickness of 16 μm and a particle-containing layer with a thickness of 40 nm.

[0288] (a) Longitudinal stretching The unstretched film was stretched in the machine direction (machine direction) by passing it between two pairs of nip rolls with different peripheral speeds. The preheating temperature was 75°C, the stretching temperature was 90°C, the stretching ratio was 3.4 times, and the stretching speed was 1300% / sec.

[0289] (b) Application Particle-containing layer-forming composition 1 was applied to one surface of the longitudinally stretched film using a bar coater so that the thickness of the film would be 40 nm after formation.

[0290] (c) Lateral stretching The film that had been subjected to the above longitudinal stretching and coating was then stretched transversely using a tenter under the following conditions. Preheat temperature: 110℃ Stretching temperature: 120℃ Stretching ratio: 4.2x Stretching speed: 50% / sec

[0291] (Heat fixation and heat relaxation) After the longitudinal and transverse stretching, the biaxially stretched film was heat-set under the following conditions. Heat fixing temperature: 227℃ Heat setting time: 6 seconds

[0292] After heat setting, the tenter width was reduced and the film was heat relaxed under the following conditions. Thermal relaxation temperature: 190℃ Thermal relaxation rate: 4%

[0293] (winding) After heat setting and heat relaxation, both ends were trimmed, and the ends were extruded (knurled) to a width of 10 mm, followed by winding under a tension of 40 kg / m. The width was 1.5 m and the wound length was 6,300 m. The resulting film roll was designated Temporary Support 1. The haze of Temporary Support 1 was 0.2. The haze was measured as total optical haze using a haze meter (NDH2000, manufactured by Nippon Denshoku Industries Co., Ltd.). The thermal shrinkage upon heating at 150°C for 30 minutes was 1.0% on the MD (machine direction) side and 0.2% on the TD (transverse direction, the direction perpendicular to the machine direction on the film surface). The film thickness of the particle-containing layer was measured from a cross-sectional TEM photograph and was found to be 40 nm. The average particle diameter of the particles contained in the particle-containing layer was measured using a Hitachi High-Technologies Corporation HT-7700 transmission electron microscope (TEM) using the method described above and was found to be 50 nm.

[0294] <Water-soluble resin composition> The following components were mixed to obtain a water-soluble resin composition to be used as material 1 for the water-soluble resin layer. Ion-exchanged water: 38.12 parts Methanol (manufactured by Mitsubishi Gas Chemical Co., Ltd.): 57.17 parts Kuraray Poval 4-88LA (polyvinyl alcohol, manufactured by Kuraray Co., Ltd.): 3.22 parts Polyvinylpyrrolidone K-30 (manufactured by Nippon Shokubai Co., Ltd.): 1.49 parts Megafac F-444 (fluorine-based surfactant, manufactured by DIC Corporation): 0.0035 parts

[0295] <Photosensitive resin composition> A mixed solvent containing methyl ethyl ketone (manufactured by Sankyo Chemical Co., Ltd., 60 parts) and propylene glycol monomethyl ether acetate (manufactured by Showa Denko K.K., 40 parts) was prepared. Each of the components listed in Table 1 was mixed with the mixed solvent to prepare photosensitive resin compositions represented by materials 1 to 4 and 5A to 5E in Table 1. The amount of the mixed solvent added was adjusted so that the solids concentration of the photosensitive composition would be 13 mass %.

[0296] [Table 1]

[0297] <Thermoplastic resin composition> The components listed in Table 2 were mixed to obtain a thermoplastic resin composition to be used as the material for the thermoplastic resin layer.

[0298] [Table 2]

[0299] The meanings of the abbreviations listed in Table 2 are as follows: A-2: Benzyl methacrylate / methacrylic acid / acrylic acid copolymer (75% by mass / 10% by mass / 15% by mass, weight average molecular weight: 30,000, Tg: 75°C, acid value: 186 mgKOH / g) B-1: Compound with the structure shown below (a dye that develops color when exposed to acid)

[0300] [ka]

[0301] C-1: Compound with the structure shown below (photoacid generator, compound described in paragraph 0227 of JP-A No. 2013-47765, synthesized according to the method described in paragraph 0227)

[0302] [ka]

[0303] D-3: NK Ester A-DCP (tricyclodecane dimethanol diacrylate, Shin-Nakamura Chemical Co., Ltd.) D-4: 8UX-015A (multifunctional urethane acrylate compound, Taisei Fine Chemical Co., Ltd.) D-5: Aronix TO-2349 (a polyfunctional acrylate compound with a carboxy group, manufactured by Toagosei Co., Ltd.) E-1: Megafac F552 (DIC Corporation) F-1: Phenothiazine (Fujifilm Wako Pure Chemical Industries, Ltd.) F-2: CBT-1 (Johoku Chemical Industry Co., Ltd.) MEK: Methyl ethyl ketone PGME: Propylene glycol monomethyl ether PGMEA: Propylene glycol monomethyl ether acetate

[0304] <Transfer film> According to the descriptions in Table 3, a thermoplastic resin layer, a water-soluble resin layer, and a photosensitive layer were formed, in this order, on the first surface of the temporary support. The thermoplastic resin was formed by coating and drying a thermoplastic resin composition. The water-soluble resin layer was formed by coating and drying a water-soluble resin composition. The photosensitive layer was formed by coating and drying a photosensitive resin composition. A protective film was provided on the photosensitive layer according to the descriptions in Table 3, to obtain a transfer film.

[0305] <Copper substrate> A copper layer having a thickness of 200 nm was formed on the polyethylene terephthalate film by sputtering to obtain a copper substrate, which was used for the following evaluations.

[0306] <Surface free energy> According to the method for calculating the surface free energy described above, the surface free energy of the surface of the transfer layer facing the protective film and the surface free energy of the surface of the transfer layer facing the temporary support were calculated. L , γ L d and γ L p Pure water and methylene iodide were used as known solutions for γ L , γ L d and γ L p The respective values ​​are as follows: Pure water:γ L =72.8mJ / m 2 , γ L d =21.8mJ / m 2 , γ L p =51.0mJ / m 2 Methylene iodide: γ L =50.8mJ / m 2 , γ L d =49.5mJ / m 2 , γ L p =1.3mJ / m 2

[0307] <Roughness Ra> The surface roughness Ra of the temporary support facing the transfer layer and the surface roughness Ra of the transfer layer facing the temporary support were measured using the following method. The protective film was peeled off from the transfer film, and the transfer film was attached to a copper substrate under conditions of a laminating roll temperature of 100°C, a linear pressure of 0.6 MPa, and a linear velocity (laminating speed) of 4.0 m / min. A three-dimensional optical profiler (New View 7300, Zygo) was used to obtain the surface profile of the target surface. The measurement and analysis software used was the "Microscope Application" of "MetroPro ver. 8.3.2." The software displayed the "Surface Map" screen, and histogram data was obtained in the "Surface Map" screen. The arithmetic mean roughness Ra of the target surface was calculated from the obtained histogram data. The measurement results are shown in Table 3.

[0308] <Peel strength of protective film> The peel strength of the protective film was measured using the following method. Tape (PRINTACK manufactured by Nitto Denko Corporation) was attached to the surface of the protective film of the transfer film, and then cut to a size of 70 mm x 10 mm to prepare a sample. The temporary support for the sample was fixed on the sample stage. Using a tension-compression testing machine (SV-55 manufactured by Imada Seisakusho Co., Ltd.), the tape was pulled in a 180-degree direction at 5.5 mm / sec to peel the protective film from the sample, and the peel strength of the protective film was measured. The measurement results are shown in Table 3.

[0309] <Peel strength of temporary support> The peel strength of the temporary support was measured using the following method. The protective film was peeled from the transfer film, and the transfer film was attached to a copper substrate under conditions of a laminating roll temperature of 100°C, a linear pressure of 0.6 MPa, and a linear speed (laminating speed) of 4.0 m / min. Tape (PRINTACK manufactured by NITTO) was attached to the surface of the temporary support and then cut to 70 mm x 10 mm to prepare a sample. The copper substrate of the sample was fixed on a sample stage. Using a tension-compression testing machine (SV-55 manufactured by Imada Seisakusho Co., Ltd.), the tape was pulled in a 180-degree direction at 5.5 mm / sec to peel the temporary support from the sample, and the peel strength of the temporary support was measured. The measurement results are shown in Table 3.

[0310] <Resolution> The protective film was peeled off from the transfer film, and the transfer film was attached to a copper substrate under conditions of a laminating roll temperature of 100°C, a linear pressure of 0.6 MPa, and a linear speed (laminating speed) of 4.0 m / min. The temporary support was peeled off from the resulting laminate, and the transfer layer disposed on the copper substrate was brought into contact with a photomask having a line-and-space pattern, and the transfer layer was exposed using an ultra-high pressure mercury lamp. The exposed transfer layer was subjected to shower development for 40 seconds using a 1.0% by mass aqueous sodium carbonate solution at 28°C. The above series of procedures was repeated while varying the line-and-space (i.e., L / S) of the photomask within a range of 5 / 5 to 8 / 8, and the resolution was evaluated according to the following criteria. A: Resolution can be achieved without residue between resin patterns under conditions of L / S=5 / 5 to L / S=6 / 6. B: Resolution can be achieved without residue between patterns under the conditions of L / S=7 / 7 to L / S=8 / 8. It cannot be resolved under the condition of C:L / S=8 / 8.

[0311] <Lamination> The protective film was peeled off from the transfer film, and the transfer film was attached to a copper substrate under conditions of a laminating roll temperature of 100°C, a linear pressure of 0.6 MPa, and a linear speed (laminating speed) of 4.0 m / min. The resulting laminate was observed using an optical microscope. Bubbles between the transfer film and the copper substrate in an area 1 mm wide and 1 mm long were counted. Based on the number of bubbles observed, the lamination properties were evaluated according to the following criteria. A:0 pieces B: 1 or more but less than 10 C: 10 or more

[0312] <Peeling failure> The protective film was peeled off from the transfer film, and the presence or absence of any deposits of the transfer layer on the surface of the protective film was visually confirmed. Next, the transfer film was attached to a copper substrate under conditions of a laminating roll temperature of 100°C, a linear pressure of 0.6 MPa, and a linear speed (laminating speed) of 4.0 m / min. The temporary support was peeled off from the obtained laminate, and the presence or absence of any deposits of the transfer layer on the surface of the temporary support was visually confirmed. In a plan view, the area of ​​any deposits of the transfer layer observed in an area 100 mm wide and 100 mm long on the surface of the protective film was determined, and the area of ​​any deposits of the transfer layer observed in an area 100 mm wide and 100 mm long on the surface of the temporary support was determined. The area of ​​the area to be observed (i.e., 20,000 mm) was 2 The ratio of the area of ​​the deposits of the transfer layer to the total area was calculated, and the peeling failure was evaluated according to the following criteria. A: 0% B: Over 0% and less than 0.1% C: 0.1% or more

[0313] [Table 3]

[0314] "16KS40" in Table 3 refers to Lumirror 16KS40 manufactured by Toray Industries, Inc. "16FB40" in Table 3 refers to Lumirror 16FB40 manufactured by Toray Industries, Inc. "FG201" listed in Table 3 refers to Alphan FG-201 manufactured by Oji F-Tech Co., Ltd. "M / B" in Table 3 means the mass ratio of the polymerizable compound to the alkali-soluble resin. In Table 3, the "surface free energy [temporary support side]" shown in the "transfer layer" column means the surface free energy of the surface of the transfer layer facing the temporary support. In Table 3, the "surface free energy [protective film side]" listed in the "transfer layer" column means the surface free energy of the surface of the transfer layer facing the protective film. In Table 3, the "surface roughness Ra" shown in the "temporary support" column means the roughness Ra of the surface of the temporary support facing the transfer layer. In Table 3, the "surface roughness Ra" shown in the "transfer layer" column means the roughness Ra of the surface of the transfer layer facing the temporary support.

[0315] In the examples shown in Table 3, the surface free energy of the surface of the transfer layer facing the protective film was 45 mJ / m 2 ~65mJ / m 2 Table 3 shows that the resolution of the example is superior to that of the comparative example.

[0316] (Explanation of symbols) 10: Temporary support 20: Middle class 30: Photosensitive layer 40: Protective film 100: Transfer film GR: Light-shielding area (non-image area) EX: Exposed area (image area) DL: Alignment frame

[0317] The disclosure of Japanese Patent Application No. 2021-030224, filed on February 26, 2021, is incorporated herein by reference in its entirety. All publications, patent applications, and technical standards mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent application, or technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. A temporary support, a transfer layer, and a protective film are included in this order, The surface free energy of the surface of the transfer layer facing the protective film is 45 mJ / m ２ ~65mJ / m ２ That is, Transfer film.

2. The surface free energy of the surface of the transfer layer facing the temporary support is 65 mJ / m ２ The transfer film according to claim 1, wherein:

3. 3. The transfer film according to claim 1, wherein the surface roughness Ra of the transfer layer facing the temporary support is 0.1 nm to 15 nm.

4. The transfer film according to any one of claims 1 to 3, wherein the surface roughness Ra of the temporary support facing the transfer layer is 0.1 nm to 15 nm.

5. The transfer film according to any one of claims 1 to 4, wherein the transfer layer is a photosensitive layer.

6. The transfer film according to any one of claims 1 to 4, wherein the transfer layer comprises an intermediate layer and a photosensitive layer.

7. The transfer film according to claim 6 , wherein the intermediate layer contains an alkali-soluble resin and a polymerizable compound, and the ratio of the mass of the polymerizable compound to the mass of the alkali-soluble resin in the intermediate layer is 0.5 or more.

8. 8. The transfer film according to claim 6, wherein the intermediate layer has a thickness of 10 μm or less.

9. The transfer film according to any one of claims 6 to 8, wherein the intermediate layer comprises a thermoplastic resin layer and a water-soluble resin layer.

10. 10. The transfer film according to claim 5, wherein the photosensitive layer contains an alkali-soluble resin and a polymerizable compound, and the ratio of the mass of the polymerizable compound to the mass of the alkali-soluble resin in the photosensitive layer is 0.6 or more.

11. The transfer film according to any one of claims 5 to 10, wherein the photosensitive layer has a thickness of 10 µm or less.

12. Peeling off the protective film from the transfer film according to any one of claims 1 to 11; bonding the transfer film to a substrate including a metal layer, and disposing the transfer layer and the temporary support in this order on the metal layer of the substrate; exposing the transfer layer to light; developing the transfer layer to form a resist pattern; performing etching or plating on the metal layer that is not covered with the resist pattern; and stripping the resist pattern, in this order. A method for manufacturing a conductor pattern.

13. Peeling off the protective film from the transfer film according to any one of claims 1 to 11; bonding the transfer film to a substrate including a metal layer, and disposing the transfer layer and the temporary support in this order on the metal layer of the substrate; Peeling off the temporary support; exposing the transfer layer to light; developing the transfer layer to form a resist pattern; performing etching or plating on the metal layer that is not covered with the resist pattern; and stripping the resist pattern, in this order. A method for manufacturing a conductor pattern.

14. The method for producing a conductive pattern according to claim 13, wherein the temporary support has a peel strength of 0.3 mN / mm to 2.0 mN / mm when peeled off.

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