Light-emitting device

The light-emitting device enhances optical coupling efficiency by arranging light-emitting elements with light-transmissive and reflective members, addressing the brightness limitations in liquid crystal display devices.

JP7828024B2Active Publication Date: 2026-03-11NICHIA CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-03-17
Publication Date
2026-03-11

AI Technical Summary

Technical Problem

Existing liquid crystal display devices face challenges in achieving high optical coupling efficiency between the light-emitting device and the light guide plate, limiting the brightness of the backlight.

Method used

A light-emitting device design featuring a composite substrate with light-emitting elements arranged in a specific configuration, accompanied by light-transmissive and light-reflective members, and a manufacturing process that includes grinding portions to form convex structures for enhanced light reflection and transmission.

Benefits of technology

The design improves the optical coupling efficiency between the light-emitting device and the light guide plate, resulting in increased brightness of the backlight.

✦ Generated by Eureka AI based on patent content.

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Abstract

To increase optical coupling efficiency between a light-emitting device and a light guide plate.SOLUTION: A light-emitting device includes: a light-emitting element that has a top face having a long side along a first direction, a first side face parallel to the first direction, and a second side face located on a side opposite to the first side face; a translucent member that has a top face having a long side along the first direction, a first side face parallel to the first direction, and a second side face located on a side opposite to the first side face, and is arranged on the top face of the light-emitting element; and a light-reflective member that includes a first portion covering the first side face of the light-emitting element and a first side face of the translucent member, and a second portion covering the second side face of the light-emitting element and the second side face of the translucent member. The first portion of the light-reflective member has a protrusion that has a top face positioned at a place higher than the top face of the translucent member and extends in the first direction. A top face of the second portion of the light-reflective member is positioned at a place lower than the top face of the protrusion.SELECTED DRAWING: Figure 7
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Description

[Technical Field]

[0001] The present disclosure relates to a light emitting device. [Background technology]

[0002] Liquid crystal display devices display images using light sources such as backlights. The backlight includes a light-emitting device including an LED and a light guide plate, and light emitted from the light-emitting device is incident on the side of the light guide plate and is emitted in a planar form from the main surface of the light guide plate. For example, Patent Document 1 discloses an LED package used as a backlight light-emitting device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-167396 Summary of the Invention [Problem to be solved by the invention]

[0004] To achieve a backlight with higher brightness, it is necessary to further improve the optical coupling efficiency between the light emitting device and the light guide plate. [Means for solving the problem]

[0005] A method for manufacturing a light emitting device according to an embodiment of the present disclosure includes a composite substrate including: a plurality of light emitting elements each having an emission surface with a longitudinal axis, the plurality of light emitting elements being two-dimensionally arranged with gaps in the first direction and a second direction perpendicular to the first direction, with the longitudinal axis aligned along a first direction; a plurality of light-transmissive members arranged on the emission surfaces of the plurality of light emitting elements; and a light-reflecting member arranged between the plurality of light emitting elements and the plurality of light-transmissive members so as to cover at least side surfaces of the plurality of light emitting elements and side surfaces of the plurality of light-transmissive members, the light-reflecting member including a pair of first portions located outside two light emitting elements and two light-transmissive members adjacent to each other in the second direction in the second direction, and a second portion located between the two light emitting elements and two light-transmissive members, the pair of first portions being The method includes a step (A) of preparing a composite substrate in which each of the pair of first portions has a first upper surface, the second portion has a second upper surface, and the light-transmitting member has a third upper surface, the first upper surface, the second upper surface, and the third upper surface being exposed on a main surface of the composite substrate; and a step (B) of grinding at least a part of the pair of first portions and the second portion of the light-reflective member and the light-transmitting members of the two light-emitting elements from the exposed first upper surface, second upper surface, and third upper surface to form a convex portion having the first upper surface and extending along the first direction in the first portion, a fourth upper surface in the second portion that is positioned lower than the first upper surface, and a fifth upper surface in the light-transmitting members of the two light-emitting elements that is positioned lower than the first upper surface and is at the same height as the fourth upper surface or lower than the fourth upper surface. [Effects of the Invention]

[0006] According to the embodiments of the present disclosure, a light emitting device with improved light coupling efficiency to a light guide plate can be provided. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view of a light emitting device according to a first embodiment, as viewed from above. [Figure 2]FIG. 2 is a perspective view of the light emitting device shown in FIG. 1 as seen from below. [Figure 3] FIG. 3 is a front view of the light emitting device shown in FIG. [Figure 4] FIG. 4 is a rear view of the light emitting device shown in FIG. [Figure 5] FIG. 5 is a bottom view of the light emitting device shown in FIG. [Figure 6] FIG. 6 is a right side view of the light emitting device shown in FIG. [Figure 7] FIG. 7 is a cross-sectional view of the light emitting device taken along line VII-VII shown in FIG. [Figure 8] FIG. 8 is a cross-sectional view of the light emitting device taken along line VIII-VIII shown in FIG. [Figure 9] FIG. 9 is a schematic side view showing a part of a backlight in which the light emitting device of this embodiment is incorporated. [Figure 10] FIG. 10 is a flowchart showing a method for manufacturing the light emitting device according to the first embodiment. [Figure 11] FIG. 11 is a diagram showing a part of the upper surface of the aggregate substrate. [Figure 12] FIG. 12 is a diagram showing a part of the lower surface of the aggregate substrate. [Figure 13] FIG. 13 is a plan view showing one step in the method for manufacturing a light emitting device. [Figure 14] FIG. 14 is a cross-sectional view showing one step in the method for manufacturing a light emitting device. [Figure 15] FIG. 15 is a cross-sectional view showing one step in the method for manufacturing a light emitting device. [Figure 16] FIG. 16 is a cross-sectional view showing one step in the method for manufacturing a light emitting device. [Figure 17A] FIG. 17A is a perspective view showing one step in the method for manufacturing a light emitting device. [Figure 17B] FIG. 17B is a cross-sectional view of the step shown in FIG. 17A in the method for manufacturing the light emitting device. [Figure 18A] FIG. 18A is a perspective view showing one step in the method for manufacturing a light emitting device. [Figure 18B] FIG. 18B is a cross-sectional view of the step shown in FIG. 18A in the method for manufacturing the light emitting device. [Figure 19A] FIG. 19A is a perspective view showing one step in the method for manufacturing a light emitting device. [Figure 19B] FIG. 19B is a cross-sectional view of the step shown in FIG. 19A in the method for manufacturing the light emitting device. [Figure 20A] FIG. 20A is a perspective view showing one step in the method for manufacturing a light emitting device. [Figure 20B] FIG. 20B is a cross-sectional view of the step shown in FIG. 20A in the method for manufacturing the light emitting device. [Figure 21] FIG. 21 is a perspective view of the light emitting device according to the second embodiment as seen from above. [Figure 22] FIG. 22 is a cross-sectional view of the light emitting device shown in FIG. [Figure 23] FIG. 23 is a cross-sectional view showing one step in the method for manufacturing the light emitting device of the second embodiment. [Figure 24] FIG. 24 is a perspective view of the light emitting device according to the second embodiment as viewed from above. [Figure 25] FIG. 25 is a cross-sectional view of the light emitting device shown in FIG. [Figure 26] FIG. 26 is a cross-sectional view showing one step in the method for manufacturing the light emitting device of the second embodiment. [Figure 27] FIG. 27 is a perspective view of a light emitting device according to another embodiment, seen from above. [Figure 28] FIG. 28 is a perspective view of the light emitting device shown in FIG. 27 as seen from below. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The following embodiments are merely examples, and the light-emitting device according to the present disclosure is not limited to the following embodiments. For example, the numerical values, shapes, materials, steps, and the order of steps shown in the following embodiments are merely examples, and various modifications are possible as long as no technical contradictions occur. Each embodiment described below is merely an example, and various combinations are possible as long as no technical contradictions occur.

[0009] The dimensions, shapes, etc. of the components shown in the drawings may be exaggerated for clarity and may not reflect the dimensions, shapes, and size relationships between the components of an actual surface light source. In addition, to avoid overly complicated drawings, some elements may be omitted and shown schematically, or end views showing only the cut surface may be shown as cross-sectional views.

[0010] In the following description, components having substantially the same functions are denoted by the same reference numerals, and their descriptions may be omitted. In the following description, terms indicating specific directions or positions (e.g., "up," "down," "right," "left," and other terms including these terms) may be used. However, these terms are used merely to facilitate understanding of relative directions or positions in the referenced drawings. As long as the relative direction or position relationship indicated by terms such as "up" and "down" in the referenced drawings is the same, drawings other than those disclosed herein, actual products, manufacturing equipment, etc. may not necessarily have the same arrangement as the referenced drawings. In this disclosure, "parallel" includes cases where two lines, sides, surfaces, etc. are at an angle of approximately 0° to ±1°, unless otherwise specified. In addition, in this disclosure, "perpendicular" or "orthogonal" includes cases where two lines, sides, surfaces, etc. are at an angle of approximately 90° to ±1°, unless otherwise specified.

[0011] (First embodiment)

[0012] [Structure of light-emitting device 101] A light emitting device and a method for manufacturing the light emitting device according to this embodiment will be described. Figures 1 and 2 are perspective views of a light emitting device 101 according to a first embodiment of the present disclosure, as seen from above and below. Figures 3, 4, 5, and 6 are a front view, a rear view, a bottom view, and a right side view, respectively, of the light emitting device 101. Figures 7 and 8 are cross-sectional views of the light emitting device 101 taken along lines VII-VII and VIII-VIII, respectively, shown in Figure 3.

[0013] In these figures, for reference purposes, arrows indicating the mutually orthogonal X, Y, and Z directions are also shown. The X and Y directions are also referred to as the first and second directions.

[0014] Additionally, the relatively positive side in the Z direction is sometimes considered "up" or "high," and the negative side is sometimes considered "down" or "low," and the shapes of components and the positional relationships between components are sometimes described by this. For example, if a component has two surfaces perpendicular to the Z direction, the surface located on the relatively positive side is sometimes called the top surface, and the surface located on the relatively negative side is sometimes called the bottom surface.

[0015] The light-emitting device 101 includes one or more light-emitting elements. In this embodiment, as shown in FIGS. 7 and 8, the light-emitting device 101 includes a first light-emitting element 10 and a second light-emitting element 20. The first light-emitting element 10 has an upper surface 10a, and the second light-emitting element 20 has an upper surface 20a. The upper surfaces 10a and 20a are light-emitting surfaces. The upper surfaces 10a and 20a have longitudinal directions, and the first light-emitting element 10 and the second light-emitting element 20 are arranged in the longitudinal direction. In the illustrated example, the X direction is the longitudinal direction. Note that FIG. 8 is a cross-sectional view at the position of the first light-emitting element 10, but the cross-sectional structure of the first light-emitting element 10 and the cross-sectional structure of the second light-emitting element 20 are the same. Therefore, for ease of understanding, in FIG. 8, the reference symbols of the structure appearing in the cross section of the second light-emitting element 20 are also shown in parentheses.

[0016] The light emitting device 101 further includes a first light-transmissive member 80, a second light-transmissive member 90, and a light-reflective member 60. The first light-transmissive member 80 and the second light-transmissive member 90 are located on the upper surface 10a of the first light emitting element 10 and the upper surface 20a of the second light emitting element 20, respectively. The light-reflective member 60 covers the side surfaces of the first light emitting element 10, the second light emitting element 20, the first light-transmissive member 80, and the second light-transmissive member 90. The light emitting device 101 may further include a substrate 70 to support these components.

[0017] 1 and 2, the light emitting device 101 has, for example, a rectangular parallelepiped shape as a whole. The light emitting device 101 has a front surface 100a, a back surface 100b located opposite the front surface 100a, a top surface 100c, a bottom surface 100d, and side surfaces 100e and 100f. The bottom surface 100d is the surface that faces a board, such as a mounting board, that supplies power to the light emitting device 101.

[0018] 1 and 2, the front surface 100a has a rectangular shape with its longitudinal direction along the X direction, and exposes the top surfaces 80a of the first light-transmissive member 80 and the top surfaces 90a of the second light-transmissive member 90. On the front surface 100a, the first light-transmissive member 80 and the second light-transmissive member 90 each have their longitudinal direction along the X direction, and the first light-transmissive member 80 and the second light-transmissive member 90 are arranged in the longitudinal direction.

[0019] Furthermore, on the front surface 100a, the first light-transmissive member 80 and the second light-transmissive member 90 are surrounded by the light-reflective member 60.

[0020] As shown in FIGS. 1 and 2, the light-reflective member 60 has a convex portion 61T extending along the X direction on the top surface 100c side of the front surface 100a. As shown in FIG. 8, the convex portion 61T has an upper surface 61Ta, which is located higher than the upper surfaces 80a of the first light-transmissive member 80 and 90a of the second light-transmissive member 90. Therefore, light emitted from the first light-transmissive member 80 and the second light-transmissive member 90 of the light-emitting device 101 and propagating toward the positive side of the Y direction is reflected by the convex portion 61T and propagates toward the negative side of the Y direction. This allows light emitted from the light-emitting device 101 to be incident on the side surface of the light guide plate with high optical coupling efficiency. The structure of the light-emitting device 101 will be described in detail below.

[0021] [Substrate 70] The substrate 70 is a support member on which the first light-emitting element 10 and the second light-emitting element 20 are mounted. As shown in Figures 1, 2, 7, and 8, the substrate 70 has a generally rectangular parallelepiped shape as a whole. In response to the first light-emitting element 10 and the second light-emitting element 20 being mounted along the X direction, the upper surface 75a of the substrate 70 typically has a rectangular shape that is longer in the X direction than in the Y direction in the figures.

[0022] The substrate 70 includes a base material 75 having an upper surface 75a and a lower surface 75b located opposite the upper surface 75a, a first wiring 71, a second wiring 72, a third wiring 73, and a conductive member 76. The upper surface 75a of the base material 75 is the upper surface of the substrate 70, and the lower surface 75b of the base material 75 is also the lower surface of the substrate 70. The first wiring 71 and the second wiring 72 are located on the upper surface 75a and the lower surface 75b of the base material 75, respectively. The base material further has a side surface 75d that becomes part of the bottom surface 100d of the light-emitting device 101.

[0023] The substrate 75 has a through-hole 75h (FIG. 7) and a recess 75r (FIG. 8). The through-hole 75h has openings on an upper surface 75a and a lower surface 75b of the substrate 75 and is located inside the substrate 75. A conductive member 76 is disposed in the through-hole 75h, and the conductive member 76 is connected to the first wiring 71 on the upper surface 75a and the second wiring 72 on the lower surface 75b. This electrically connects the first wiring 71 and the second wiring 72.

[0024] 4, 5, and 8, in this embodiment, the recess 75r is a three-dimensional space formed by combining a cylinder with a cone positioned on the upper surface of the cylinder and bisecting the cylinder and cone by the axes of the cylinder and the cone. Note that the apex of the cone may not be sharp. The recess 75r has openings on the side surface 75d and the lower surface 75b, and has a semicircular shape on the lower surface 75b and a pentagonal shape on the side surface 75d. r is not connected to the through hole 75h and is arranged separately.

[0025] In this embodiment, the base material 75 has three recesses 75r. The three recesses 75r are arranged symmetrically with respect to a line that passes through the center of the side surface 75d in the X direction and is perpendicular to the Z direction.

[0026] Third wiring 73 is disposed on the inner wall of recess 75r, and third wiring 73 and second wiring 72 are connected on bottom surface 75b. Solder is disposed in recess 75r and bonded to the wiring pattern of the mounting board, thereby bonding light emitting device 101 to the mounting board at bottom surface 100d. In addition, the wiring pattern of the mounting board is electrically connected to first wiring 71 via solder, third wiring 73, second wiring 72, and conductive member 76.

[0027] The substrate 75 is formed of an insulating material such as resin, ceramic, or glass. The substrate 75 may be formed of a composite material such as fiber-reinforced resin, and for example, a glass epoxy substrate may be used for the substrate 75. Epoxy, bismaleimide triazine (BT), polyimide, etc. may be used as the base material of the substrate 75. Suitable ceramics include aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride, or a mixture of one or more of these. It is advantageous to use a material from these ceramics that has a linear expansion coefficient close to that of the light-emitting element as the material for the substrate 75.

[0028] From the viewpoint of the strength of the base material 75, the thickness of the base material 75 in the Z direction is preferably 0.05 mm or more, more preferably 0.2 mm or more. If the thickness of the base material 75 in the Z direction is 0.6 mm or less, this is advantageous for making the light emitting device thinner. The thickness of the base material 75 in the Z direction is preferably 0.5 mm or less, more preferably 0.4 mm or less.

[0029] The first wiring 71, the second wiring 72, and the third wiring 73 can be made of copper, iron, nickel, tungsten, chromium, aluminum, silver, platinum, gold, titanium, palladium, rhodium, or an alloy containing one or more of these metals. From the viewpoint of heat dissipation, it is preferable to use copper or a copper alloy as the material for these wirings. The first wiring 71, the second wiring 72, and the third wiring 73 can be formed on the substrate 75 in the form of a single layer film or in the form of a multilayer film. If the outermost surfaces of these wirings are made of silver, platinum, aluminum, rhodium, or gold, or an alloy containing one or more of these metals, high light reflectivity and good wettability with solder, etc. can be obtained.

[0030] The conductive member 76 can be made of the same material as the material of the first wiring 71, the second wiring 72, or the third wiring 73. The conductive member 76 may occupy the entire interior of the through hole 75h formed in the substrate 75, or may be a conductive film disposed in a portion of the interior of the through hole 75h, for example, on the surface of the through hole 75h. Furthermore, the area surrounded by the conductive film may be filled with an insulating material such as epoxy resin.

[0031] The substrate 70 may have an insulating layer 77. The insulating layer 77 is formed from a thermosetting resin or a thermoplastic resin, and covers a portion of each of the plurality of second wirings 72 located on the lower surface 75b of the base material 75. The insulating layer 77 has the effect of preventing short circuits between the second wirings 72.

[0032] [First Light-Emitting Element 10 and Second Light-Emitting Element 20] The first light emitting element 10 and the second light emitting element 20 are semiconductor elements that emit light when supplied with current.

[0033] As shown in FIGS. 7 and 8, the first light emitting element 10 has a longitudinal direction along the X direction, for example. The first light-emitting element 10 has a rectangular parallelepiped shape. The first light-emitting element 10 has an upper surface 10a and a lower surface 10b opposite the upper surface, each having a longitudinal axis along a first direction. The upper surface 10a is the main light-emitting surface of the first light-emitting element 10. The lower surface 10b is an electrode surface. The first light-emitting element 10 further has a first side surface 10c parallel to the X direction, a second side surface 10d located opposite the first side surface 10c, a third side surface 10e connected to the first side surface 10c and the second side surface 10d, and a fourth side surface 10f located opposite the third side surface 10e. The first light-emitting element 10 also has an electrode 11 located on the lower surface 10b.

[0034] Similarly, the second light-emitting element 20 has, for example, a rectangular parallelepiped shape with its longitudinal axis along the X direction. The second light-emitting element 20 has an upper surface 20a and a lower surface 20b opposite the upper surface, each of which has its longitudinal axis along the first direction. The upper surface 20a is the main light-emitting surface of the second light-emitting element 20. The lower surface 20b is an electrode surface. The second light-emitting element 20 further has a first side surface 20c parallel to the X direction, a second side surface 20d located opposite the first side surface 20c, a third side surface 20e connected to the first side surface 20c and the second side surface 20d, and a fourth side surface 20f located opposite the third side surface 20e. The second light-emitting element 20 also has an electrode 21 located on the lower surface 20b.

[0035] The electrodes 11 and 21 include a pair of a positive electrode and a negative electrode. Examples of materials for the electrodes 11 and 21 include gold, silver, tin, platinum, rhodium, titanium, aluminum, tungsten, palladium, nickel, or an alloy containing one or more of these. The first light-emitting element 10 is mounted on the substrate 70 by connecting and fixing the electrode 11 to the first wiring 71 of the substrate 70 with a bonding member such as solder. Similarly, the second light-emitting element 20 is mounted on the substrate 70 by connecting and fixing the electrode 21 to the first wiring 71 of the substrate 70 with a bonding member such as solder.

[0036] Each of the first light-emitting element 10 and the second light-emitting element 20 further includes a semiconductor laminate. The semiconductor laminate includes an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer sandwiched between them. The light-emitting layer may have a structure such as a double heterojunction or a single quantum well (SQW), or may have a structure with a group of active layers such as a multiple quantum well (MQW). The semiconductor laminate is configured to be able to emit visible light or ultraviolet light. Such a semiconductor laminate including a light-emitting layer may be, for example, In x Al y Ga 1-x-y N(0≦x, 0≦y, x+y≦1 ).

[0037] The semiconductor stack may have a structure including one or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or may have a structure in which a structure including an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in that order is repeated multiple times. When the semiconductor stack includes multiple light-emitting layers, the light-emitting layers may have different emission peak wavelengths or may have light-emitting layers with the same emission peak wavelength. Note that the same emission peak wavelength also includes cases where the emission peak wavelengths vary by a few nanometers. The combination of emission peak wavelengths between the multiple light-emitting layers can be selected appropriately. For example, when the semiconductor stack includes two light-emitting layers, the light-emitting layers can be selected from combinations such as blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. Each light-emitting layer may include multiple active layers with different emission peak wavelengths or multiple active layers with the same emission peak wavelength.

[0038] [First translucent member 80, second translucent member 90] The light emitting device 101 includes one or more light-transmitting members. In this embodiment, the first light-transmitting member 80 and the second light-transmitting member 90 are generally plate-shaped members disposed above the first light-emitting element 10 and the second light-emitting element 20, respectively. The first light-transmitting member 80 and the second light-transmitting member 90 function as protective layers for the first light-emitting element 10 and the second light-emitting element 20. In addition, the first light-transmitting member 80 and the second light-transmitting member 90 convert the wavelength of the light emitted from the first light-emitting element 10 and the second light-emitting element 20, and It diffuses the light.

[0039] As shown in FIGS. 7 and 8 , the first light-transmissive member 80 has a rectangular parallelepiped shape with its longitudinal axis along the X direction, similar to the first light-emitting element 10. The first light-transmissive member 80 has an upper surface 80a and a lower surface 80b opposite the upper surface, each of which has its longitudinal axis along the first direction. The upper surface 80a is an emission surface through which light emitted from the first light-emitting element 10 is emitted to the outside of the light-emitting device 101. The lower surface 80b is located on the upper surface 10a side of the first light-emitting element 10. The first light-transmissive member 80 further has a first side surface 80c parallel to the X direction, a second side surface 80d located opposite the first side surface 80c, a third side surface 80e connected to the first side surface 80c and the second side surface 80d, and a fourth side surface 80f located opposite the third side surface 80e.

[0040] Similarly, like the second light-emitting element 20, the second light-transmissive member 90 has a rectangular parallelepiped shape with its longitudinal axis along the X direction. The second light-transmissive member 90 has an upper surface 90a and a lower surface 90b opposite the upper surface, each of which has its longitudinal axis along the first direction. The upper surface 90a is an emission surface through which light emitted from the first light-emitting element 10 is emitted to the outside of the light-emitting device 101. The lower surface 90b is located on the side of the upper surface 10a of the first light-emitting element 10. The second light-transmissive member 90 further has a first side surface 90c parallel to the X direction, a second side surface 90d located opposite the first side surface 90c, a third side surface 90e connected to the first side surface 90c and the second side surface 90d, and a fourth side surface 90f located opposite the third side surface 90e.

[0041] In this embodiment, the first light-transmissive member 80 includes a wavelength conversion portion 41 and a light-transmitting portion 51. The wavelength conversion portion 41 is located on the upper surface 10a of the first light-emitting element 10, and the light-transmitting portion 51 is located above the wavelength conversion portion 41. Similarly, the second light-transmitting member 90 includes a wavelength conversion portion 42 and a light-transmitting portion 52. The wavelength conversion portion 42 is located on the upper surface 20a of the second light-emitting element 20, and the light-transmitting portion 52 is located above the wavelength conversion portion 42. The first light-transmitting member 80 and the second light-transmitting member 90 each include the wavelength conversion portion 41 and the wavelength conversion portion 42, but the first light-transmitting member 80 and the second light-transmitting member 90 may not include the wavelength conversion portion 41 and the wavelength conversion portion 42, and may include only the light-transmitting portion 51 and the light-transmitting portion 52.

[0042] [Wavelength conversion units 41 and 42] The wavelength conversion units 41 and 42 are each a roughly plate-shaped member that converts the wavelength of part of the light emitted from the first light-emitting element 10 and the second light-emitting element 20. The wavelength conversion units 41 and 42 contain a base material and phosphor particles dispersed in the base material. Examples of the base material of the wavelength conversion units 41 and 42 include silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, urea resin, phenol resin, polycarbonate resin, trimethylpentene resin, polynorbornene resin, acrylic resin, urethane resin, or fluororesin, or a resin containing two or more of these. Glass can also be selected as the base material of the wavelength conversion units 41 and 42.

[0043] Known materials can be used for the phosphors dispersed in the wavelength conversion sections 41 and 42. The phosphors include yttrium-aluminum-garnet phosphors (e.g., Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25:Eu), chlorosilicate phosphors (e.g., Ca8MgSi4O 16 Cl2:Eu), β-sialon phosphors (e.g., (Si,Al)3(O,N)4:Eu), α-sialon phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu), SLA phosphors (e.g., SrLiAl3N4:Eu), CASN phosphors (e.g., CaAlSiN3:Eu) or SCASN phosphors (e.g., (Sr,Ca)AlSiN3:Eu), etc. nitride phosphors, KSF phosphors (e.g., K2SiF6:Mn), KSAF phosphors (e.g., K2(Si,Al)F6:Mn) or MGF phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), etc. fluoride phosphors, phosphors having a perovskite structure (e.g., CsPb(F,Cl,Br,I)3), or quantum dot phosphors (e.g., CdSe, InP, AgInS2 or AgInSe2), etc. can be used.

[0044] The KSAF phosphor may have a composition represented by the following formula (I). M2[Si p Al q Mn r F s (I)

[0045] In formula (I), M represents an alkali metal and may contain at least K. Mn may be tetravalent Mn ions. p, q, r and s may satisfy 0.9 ≦ p + q + r ≦ 1.1, 0 < q ≦ 0.1, 0 < r ≦ 0.2, 5.9 ≦ s ≦ 6.1. Preferably, 0.95 ≦ p + q + r ≦ 1.05 or 0.97 ≦ p + q + r ≦ 1.03, 0 < q ≦ 0.03, 0.002 ≦ q ≦ 0.02 or 0.003 ≦ q ≦ 0.015, 0.005 ≦ r ≦ 0.15, 0.01 ≦ r ≦ 0.12 or 0.015 ≦ r ≦ 0.1, 5.92 ≦ s ≦ 6.05 or 5.95 ≦ s ≦ �.025. For example, K2[Si 0.946 Al 0.005 Mn 0.049 F 5.995 , K2[Si 0.942 Al 0.008 Mn0.050 F 5.992 ], K2[Si 0.939 Al 0.014 Mn 0.047 F 5.986 Such a KSAF-based phosphor can provide red light emission with high brightness and a narrow half-width of the emission peak wavelength.

[0046] The wavelength conversion section 41 and the wavelength conversion section 42 may contain different phosphors. Furthermore, the wavelength conversion sections 41 and 42 may contain a light diffusing material, which will be described later.

[0047] [Translucent parts 51, 52] The light-transmitting portions 51 and 52 are each formed from a resin material whose base material is, for example, a silicone resin. Typically, the light-transmitting portions 51 and 52 have a transmittance of 60% or more for light having the emission peak wavelengths of the first light-emitting element 10 and the second light-emitting element 20. From the viewpoint of effectively utilizing light, the transmittance of the light-transmitting portions 51 and 52 at the emission peak wavelengths of the first light-emitting element 10 and the second light-emitting element 20 is preferably 70% or more, and more preferably 80% or more.

[0048] In addition to silicone resin, for example, silicone-modified resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, polymethylpentene resin, polynorbornene resin, or a material containing two or more of these can be used as the base material of the light-transmitting portions 51 and 52. Glass may also be selected as the material of the light-transmitting portions 51 and 52.

[0049] The light-diffusing function may be imparted to the translucent portions 51 and 52 by dispersing a light-diffusing material having a refractive index different from that of the base material in the base material. As the light-diffusing material, for example, particles of a resin having a refractive index different from that of the base material, or particles of silicon oxide, aluminum oxide, zirconium oxide, or zinc oxide may be used. As the light-diffusing material dispersed in the base material, D 50 By using nanoparticles having a particle size defined by the formula (1) of 1 nm or more and 100 nm or less, scattering in the light-transmitting member can be increased.

[0050] The light-transmitting portions 51 and 52 cover the upper surfaces of the wavelength conversion portions 41 and 42, respectively, and thus the wavelength conversion portions 41 and 42 are prevented from being exposed to the external environment, which prevents the phosphors from deteriorating. In addition, the light from the first light-emitting element 10 and the second light-emitting element 20 that has been wavelength-converted by the wavelength conversion portions 41 and 42 and the light that has not been converted by the wavelength conversion portions 41 and 42 enter the light-transmitting portions 51 and 52, and these two types of light are mixed and diffused within the light-transmitting portions 51 and 52. Therefore, unevenness in brightness and chromaticity can be suppressed, and mixed color light can be emitted to the outside.

[0051] [Connecting member 30] The bonding member 30 is located between the first light-emitting element 10 and the first light-transmissive member 80 and between the second light-emitting element 20 and the second light-transmissive member 90, and bonds the first light-transmissive member 80 and the second light-transmissive member 90 to the first light-emitting element 10 and the second light-emitting element 20, respectively. The bonding member 30 may cover a part of the side surface of the first light-emitting element 10 and a part of the side surface of the second light-emitting element 20.

[0052] A resin material containing a transparent resin as a base material can be used as the material of the joining member 30. The base material can be, for example, the same material as the base material of the light-transmitting portions 51 and 52. The joining member 30 may have a light diffusion function by dispersing a light diffusion material having a refractive index different from that of the base material.

[0053] [Light-reflective member 60] The light-reflective member 60 covers the side surfaces of the first light-emitting element 10 and the second light-emitting element 20 and the side surfaces of the first light-transmissive member 80 and the second light-transmissive member 90, thereby suppressing light leakage from the side surfaces of these members and increasing the emission efficiency from the front of the light-emitting device 101.

[0054] The light-reflective member 60 includes a first portion 61 and a second portion 62. Specifically, the first portion 61 covers at least a portion of the first side surface 10c of the first light-emitting element 10, the first side surface 80c of the first light-transmissive member 80, at least a portion of the first side surface 20c of the second light-emitting element 20, and the first side surface 90c of the second light-transmissive member 90. The second portion 62 covers at least a portion of the second side surface 10d of the first light-emitting element 10, the second side surface 80d of the first light-transmissive member 80, at least a portion of the second side surface 20d of the second light-emitting element 20, and the second side surface 90d of the second light-transmissive member 90. When a bonding member 30 is disposed between the first light-emitting element 10 and the first light-transmissive member 80 and between the second light-emitting element 20 and the second light-transmissive member 90, the first portion 61 and the second portion 62 also cover the bonding member 30.

[0055] The light-reflective member 60 further includes a third portion 63, a fourth portion 64, and a fifth portion 65. The third portion 63 covers at least a portion of the third side surface 10e of the first light-emitting element 10, the third side surface 80e of the first light-transmissive member 80, and the bonding member 30. The fourth portion 64 is located between the first light-emitting element 10 and the second light-emitting element 20 in the X direction in a plan view. The fourth portion 64 covers at least a portion of the fourth side surface 10f of the first light-emitting element 10, the fourth side surface 80f of the first light-transmissive member 80, at least a portion of the third side surface 20e of the second light-emitting element 20, the third side surface 90e of the second light-transmissive member 90, and the bonding member 30. The fifth portion 65 covers at least a portion of the fourth side surface 10f of the second light-emitting element 20, the fourth side surface 80f of the second light-transmissive member 90, and the bonding member 30. The light reflective member 60 may further include a sixth portion 66 that covers the lower surface 10b of the first light emitting element 10 and the lower surface 20b of the second light emitting element 20. The first portion 61 and the second portion 62 are also disposed adjacent to the third portion 63, the fourth portion 64, and the fifth portion 65.

[0056] In the light-reflective member 60, the first portion 61 has a convex portion 61T that is adjacent to the upper surface 80a of the first light-transmissive member 80 and the upper surface 90a of the second light-transmissive member 90 and extends along the X direction. In this embodiment, the convex portion 61T is also disposed adjacent to the third portion 63, the fourth portion 64, and the fifth portion 65. The convex portion 61T has an upper surface 61Ta, which is located higher than the upper surface 80a of the first light-transmissive member 80 and the upper surface 90a of the second light-transmissive member 90. The height of the upper surface 61Ta relative to the upper surface 90a is, for example, 0.01 mm to 0.06 mm. The second portion 62 has an upper surface 62 that is located lower than the upper surface 61Ta of the convex portion 61T. In this embodiment, the upper surface 62a is flat and is located at the same height as the upper surface 80a of the first light-transmissive member 80 and the upper surface 90a of the second light-transmissive member 90.

[0057] The third portion 63, the fourth portion 64, and the fifth portion 65 also have upper surfaces that are located at the same height as the upper surfaces 80a of the first light-transmissive member 80 and 90a of the second light-transmissive member 90, respectively. Therefore, except for the convex portion 61T, on the front surface 100a of the light-emitting device 101, the upper surface of the light-reflective member 60 and the upper surfaces 80a of the first light-transmissive member 80 and 90a of the second light-transmissive member 90 form an integrated flat surface.

[0058] The light-reflecting member 60 is an integrally molded body consisting of the first portion 61, second portion 62, third portion 63, fourth portion 64, fifth portion 65, sixth portion 66, and protrusion 61T, and covers the upper surface 75a of the substrate 70. However, the protrusion 61T does not have to be an integrally molded body and may be provided as a separate body on the first portion 61. The light-reflecting member 60 is formed, for example, from a resin material in which a light-diffusing material is dispersed. Examples of the base material of the light-reflecting member 60 include silicone resin, modified silicone resin, epoxy resin, urea resin, polycarbonate resin, phenolic resin, acrylic resin, urethane resin, fluororesin, modified resins of these, and resins containing two or more of these. Examples of the light-diffusing material include particles of an inorganic or organic material having a refractive index higher than that of the base material. Examples of the light diffusing material include particles of titanium oxide, magnesium oxide, zirconium dioxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, silicon oxide, various rare earth oxides (e.g., yttrium oxide, gadolinium oxide), etc. The light reflective member 60 is, for example, white.

[0059] In this specification, "light reflectivity" refers to a reflectance of 60% or more at the emission peak wavelength of the light-emitting element (first light-emitting element 10 or second light-emitting element 20). The reflectance of the light-reflective member 60 at the emission peak wavelength of the light-emitting element is preferably 70% or more, and more preferably 80% or more.

[0060] [Effects of Light Emitting Device 101] The effects of the light emitting device 101 configured as above will now be described. Fig. 9 is a schematic side view showing a part of a backlight 301 in which the light emitting device 101 is incorporated. The backlight 301 includes a housing 311, a light guide plate 312, a mounting substrate 313, a support 314, and the light emitting device 101. The light emitting device 101 is mounted on the mounting substrate 313 at the bottom surface 100d, and receives a supply of current from the mounting substrate 313.

[0061] The housing 311 supports the light emitting device 101 and the light guide plate 312. The light guide plate 312 is supported by the housing 311 via supports 314 to adjust the height position so that the front surface 100a, which is the emission surface of the light emitting device 101, faces the side surface 312c of the light guide plate 312. As shown in FIG. 9 , the upper surface 61Ta of the convex portion 61T contacts the side surface 312c of the light guide plate 312. Therefore, a gap G is formed between the side surface 312c of the light guide plate 312 and the upper surface 80a of the first light-transmissive member 80 and the upper surface 90a of the second light-transmissive member 90.

[0062] Light emitted from the upper surface 80a of the first light-transmissive member 80 and the upper surface 90a of the second light-transmissive member 90, which are located on the front surface 100a of the light emitting device 101, enters the light guide plate 312 from the side surface 312c. Since the side surface 312c is not in contact with the upper surface 80a of the first light-transmissive member 80 and the upper surface 90a of the second light-transmissive member 90, and an air layer is interposed between them, total reflection is unlikely to occur for light incident on the side surface 312c of the light guide plate 312, and total reflection is likely to occur for light returning from the side surface 312c of the light guide plate 312 to the light emitting device 101. This makes it possible for light emitted from the light emitting device 101 to enter the light guide plate 312 with high optical coupling efficiency. In addition, light that spreads from the upper surface 80a of the first light-transmissive member 80 and the upper surface 90a of the second light-transmissive member 90 to the positive side in the Y direction is incident on the light guide plate 312. The light is reflected by the convex portion 61T and travels toward the negative side of the Y direction. As a result, the light is emitted obliquely from the upper surface 80a of the first light-transmissive member 80 and the upper surface 90a of the second light-transmissive member 90, and can be returned to the side surface 312c as it travels through the gap G. This makes it possible for the light emitted from the light emitting device 101 to be incident on the side surface of the light guide plate with high optical coupling efficiency. Furthermore, by arranging the light emitting device 101 and the light guide plate 312 so that the convex portion 61T contacts the side surface 312c of the light guide plate 312, it becomes easier to set the gap G to a constant size.

[0063] (Method of manufacturing a light-emitting device) Next, a method for manufacturing the light emitting device according to this embodiment will be described with reference to the drawings. Figure 10 is a flowchart showing the method for manufacturing the light emitting device according to this embodiment.

[0064] The method for manufacturing a light emitting device according to this embodiment includes the step (A) of preparing a composite substrate and the step (B) of forming convex portions of the light reflective member and the upper surface of the light transmissive member. The method for manufacturing a light emitting device according to this embodiment may further include the step (C) of singulating. Each step will be described in detail below.

[0065] [Step (A) of preparing a composite substrate] First, a composite substrate is prepared on which a plurality of light-emitting elements, a plurality of light-transmitting members, and a light-reflecting member are arranged. This process further includes a step (A1) of arranging the plurality of light-emitting elements, a step (A2) of arranging the plurality of light-transmitting members, a step (A3) of arranging the light-reflecting members, and a step (A4) of exposing the light-transmitting members.

[0066] (1) Step (A1) of arranging a plurality of light-emitting elements An aggregate substrate is prepared, and a plurality of light-emitting elements are arranged two-dimensionally on the aggregate substrate with gaps in the first and second directions. In this embodiment, the substrates 70 shown in Figures 1, 3, etc. are arranged two-dimensionally in the X and Y directions, and a plurality of light-emitting elements are arranged on the aggregate substrate connected to each other.

[0067] 11 and 12 show a portion of an upper surface 75'a and a portion of a lower surface 75'b of such an aggregate substrate 70'. The aggregate substrate 70' includes substrates 75' of the substrates 70 arranged two-dimensionally in the X and Y directions and connected to each other. As shown in FIG. 11, a first wiring 71' is arranged on the upper surface 75'a. Furthermore, a plurality of recesses 75' are formed on the lower surface 75'b. A recess 75'r is formed on the substrate 75', and a third wiring 73' is disposed within the recess 75'r. Furthermore, a second wiring 72' is disposed on the lower surface 75'b so as to cover the periphery of the recess 75'r. The second wirings 72' are connected to each other in the Y direction by connecting portions 72'c. Furthermore, a through hole 75h having openings on the upper surface 75'a and the lower surface 75'b is provided in the substrate 75', and a conductive member 76 connecting the first wiring 71' and the second wiring 72' is disposed within the through hole 75h. The recess 75'r has a circular opening on the lower surface 75'b. An insulating layer 77' is further provided on the lower surface 75'b to cover a part of the second wiring 72'.

[0068] The aggregate substrate 70' is a base material 75' having recesses 75'r and conductive members 76 formed therein, and can be obtained by forming a conductive film on both sides of a plate-shaped insulating base material by plating or the like, and then patterning the conductive film.

[0069] Next, a first light-emitting element 10 and a second light-emitting element 20 are prepared as a plurality of light-emitting elements. Here, a plurality of pairs of the first light-emitting element 10 and the second light-emitting element 20 are prepared, and the first light-emitting element 10 and the second light-emitting element 20 are two-dimensionally arranged with gaps in the X direction and the Y direction, as shown in Figures 13 and 14. Specifically, the electrodes 11, 21 of the first light-emitting element 10 and the second light-emitting element 20 are connected to the first wiring 71' using a conductive bonding member such as solder.

[0070] (2) Step (A2) of arranging a plurality of light-transmitting members A plurality of light-transmissive members are arranged on the light-emitting surfaces of a plurality of light-emitting elements. Specifically, as shown in Fig. 15, an uncured bonding member is arranged on the upper surface 10a of the first light-emitting element 10 and the upper surface 20a of the second light-emitting element 20, and a first light-transmissive member 80' and a second light-transmissive member 90' are arranged on the upper surface 10a and the upper surface 20a. By curing the uncured bonding member, the first light-emitting element 10 and the first light-transmissive member 80' are bonded together via the bonding member 30, and the second light-emitting element 20 and the second light-transmissive member 90' are bonded together.

[0071] (3) Step (A3) of arranging a light-reflective member A light-reflective member is disposed to cover the side surfaces of the plurality of light-emitting elements and the side surfaces and top surfaces of the plurality of light-transmissive members. Specifically, as shown in FIG. 16 , an uncured light-reflective member is disposed on the top surface 75′a of the aggregate substrate 70′ so as to cover the side surfaces of the first light-emitting element 10, the side surfaces and top surface 80′a of the first light-transmissive member 80′, the side surfaces of the second light-emitting element 20, the side surfaces and top surface 90′a of the second light-transmissive member 90′, and the bonding member 30. The uncured light-reflective member is then cured to obtain a light-reflective member 60′ that covers the side surfaces of the first light-emitting element 10, the side surfaces and top surface 80′a of the first light-transmissive member 80′, the side surfaces of the second light-emitting element 20, the side surfaces and top surface 90′a of the second light-transmissive member 90′, and the bonding member 30. FIG. 17A is a perspective view showing a portion of the composite substrate 201′ obtained in this manner, and FIG. 17B is a YZ cross-sectional view of the composite substrate 201′ at a position intersecting the first light-emitting element 10. Since the cross section across the second light emitting element 20 also has the same structure, components of the second light emitting element 20 are also shown in parentheses in FIG. 17B.

[0072] (4) Step (A4) of exposing the light-transmitting member In the composite substrate 201′, the light-reflecting member 60′ is ground from the upper surface 60′a so that the upper surface 80′a of the first light-transmissive member 80′ and the upper surface 90′a of the second light-transmissive member 90′ are exposed. Specifically, the entire upper surface 60′a of the light-reflecting member 60′ is ground using a grinding device such as a lapping device. As a result, as shown in FIGS. 18A and 18B , a composite substrate 201 is obtained in which the upper surface 80′a of the first light-transmissive member 80′ and the upper surface 90′a of the second light-transmissive member 90′ are exposed on the main surface 201′a of the composite substrate 201′.

[0073] In the composite substrate 201′, the first light-emitting element 10 and the second light-emitting element 20, which are multiple light-emitting elements, are arranged with their longitudinal directions along the X direction, and as described above, are arranged two-dimensionally with gaps in the X direction and the Y direction.

[0074] The light-reflective member 60' is arranged between the first light-emitting element 10, the first light-transmissive member 80', the second light-emitting element 20 and the second light-transmissive member 90' so as to cover the side surface of the first light-emitting element 10, the side surface of the first light-transmissive member 80', the side surface of the second light-emitting element 20 and the side surface of the second light-transmissive member 90'.

[0075] As shown in FIG. 18B , the light-reflective member 60′ includes a pair of first portions 61′ located outside two first light-emitting elements 10 and two first light-transmissive members 80′ adjacent to each other in the Y direction, and a second portion 62′ located between these two first light-emitting elements 10 and two first light-transmissive members 80′. Each of the pair of first portions 61′ has an upper surface (first upper surface) 61′a, and the second portion 62′ has an upper surface (second upper surface) 62′a. The first light-transmissive member 80′ also has an upper surface (third upper surface) 80′a. Similarly, the light-reflective member 60′ includes a pair of first portions 61′ located outside two second light-emitting elements 20 and two second light-transmissive members 90′ adjacent to each other in the Y direction, and a second portion 62′ located between these two second light-emitting elements 20 and two second light-transmissive members 90′. The pair of first portions 61' each have an upper surface (first upper surface) 61'a, and the second portion 62' has an upper surface (second upper surface) 62'a. The second light-transmitting member has an upper surface (third upper surface) 90'a. That is, by grinding the light-reflective member 60', the first portions The upper surface (first upper surface) 61'a of the portion 61, the upper surface (second upper surface) 62'a of the second portion 62, the upper surface (third upper surface) 80'a of the first light-transmissive member 80', and the upper surface (third upper surface) 90'a of the second light-transmissive member 90' are exposed. The upper surface (first upper surface) 61'a, the upper surface (second upper surface) 62'a, and the upper surfaces (third upper surfaces) 80'a, 90'a are all flat and located at the same height. Furthermore, the upper surface (first upper surface) 61'a, the upper surface (second upper surface) 62'a, and the upper surfaces (third upper surfaces) 80'a, 90'a form a single continuous flat surface.

[0076] [Step (B) of forming the convex portions of the light-reflective member and the upper surface of the light-transmitting member] Next, at least a portion of the pair of first portions 61' and second portion 62' of the light-reflective member 60', the first light-transmissive member 80' on the two first light-emitting elements 10, and the second light-transmissive member 90' on the two second light-emitting elements 20 are ground from the exposed top surface (first top surface) 61'a, top surface (second top surface) 62'a, and top surfaces (third top surfaces) 80'a, 90'a.

[0077] 19A and 19B, a rotary grinding blade (rotary wheel) 250 is moved in the X direction relative to the composite substrate 201' to grind the first portion 61', the second portion 62', the first light-transmissive member 80', and the second light-transmissive member 90' from the upper surface (first upper surface) 61'a, the upper surface (second upper surface) 62'a, and the upper surfaces (third upper surfaces) 80'a, 90'a shown in FIGS. 18A and 18B. This results in a composite substrate 201'' shown in FIGS. 20A and 20B.

[0078] As shown in Figures 20A and 20B, this step forms a convex portion 61'T extending in the X direction in a first portion 61' of the light-reflective member 60'. The first portion 61' has an upper surface (first upper surface) 61'Ta. The second portion 62' has a new upper surface (fourth upper surface) 62a. Furthermore, a first light-transmissive member 80 and a second light-transmissive member 90 are formed, each having a new upper surface (fifth upper surface) 80a and 90a, respectively.

[0079] The top surface (fourth top surface) 62a is located lower than the top surface (first top surface) 61'Ta, and the top surfaces (fifth top surfaces) 80a and 90a are at the same height as the top surface (fourth top surface) 62 or lower than the top surface (fourth top surface) 62a. In this embodiment, the top surfaces (fifth top surfaces) 80a and 90a are located at the same height as the top surface (fourth top surface) 62a and are flat. In other words, the top surfaces (fifth top surfaces) 80a and 90a and the top surface (fourth top surface) 62a form a continuous flat surface.

[0080] The thickness T (width) of the rotary grinding blade 250 (Fig. 19B) may be the same as the interval W between the pair of convex portions 61’T, or may be narrower. If T = W, the above-described structure can be formed by simply moving the rotary grinding blade 250 once in the X direction. On the other hand, when T < W, change the position of the rotary grinding blade 250 in the Y direction and move it in the X direction two or more times. In the Y direction, grinding may be performed across the two first light-emitting elements 10 or the second light-emitting elements 20. That is, the thickness T of the rotary grinding blade 250 may be larger than the center-to-center distance between two adjacent first light-emitting elements 10 in the Y direction. For this reason, the number of movements of the rotary grinding blade 250 can be reduced.

[0081] In the present embodiment, the grinding surface 250s of the rotary grinding blade 250 has a linear shape in a cross section including from one end to the other end of the rotation axis of the rotary grinding blade 250. Therefore, the surface formed by grinding becomes a flat surface.

[0082] Note that the upper surface of the light-transmissive member and the upper surface of the light-reflective member do not necessarily have to be in one plane. That is, after the step (A3) of arranging the light-reflective member, the light-reflective member may be ground to a height such that a portion that will become the convex portion 61T remains, and subsequently, the light-reflective member and the light-transmissive member may be ground except for the portion that will become the convex portion 61T. Also, after the step (A3) of arranging the light-reflective member, without grinding the portion that will become the convex portion 61T, the light-reflective member and the light-transmissive member may be ground until the upper surface of the light-transmissive member is exposed, and then the portion that will become the convex portion 61T that has not been ground may be ground. In either method, a light-emitting device can be obtained that has an upper surface located higher than the upper surface of the light-transmissive member and has convex portions extending along the first direction on the first portion of the light-reflective member.

[0083] Furthermore, as another manufacturing method, in the step (A3) of arranging the light-reflective member, the light-reflective member may be arranged so as to cover the side surfaces of the plurality of light-emitting elements and the side surfaces of the plurality of light-transmitting members. In other words, in the step (A3) of arranging the light-reflective member, the light-reflective member may be arranged so as not to cover the upper surfaces of the plurality of light-transmitting members. Next, the light-reflective member may be provided on the portion that will become the convex portion 61T. Finally, the convex portion 61T may be ground to form the upper surface 61Ta of the convex portion.

[0084] [Single-piece process (C)] Thereafter, as indicated by dashed lines CX1, CX2, and CY in FIGS. 20A and 20B, the obtained composite substrate 201'' is cut in the X direction and Y direction using a rotary blade or the like so as to include the first light-transmissive member 80 and the second light-transmissive member 90, thereby producing the light-emitting device 101 shown in FIGS. 1 to 8. Cutting the composite substrate 201'' in the X direction includes a cut CX1 at the first portion 61' and a cut CX2 at the second portion 62'. By cutting the second portion 62, the circular recess 75'r shown in FIG. 12 is divided, and a semicircular recess 75r is formed on the back surface 100b as shown in FIG. 4.

[0085] [Effects of manufacturing method of light-emitting device] According to the manufacturing method of the light-emitting device of this embodiment, the light-transmitting member is ground across two light-emitting elements in the Y direction, so a wide grinding blade can be used, and light-emitting devices can be manufactured efficiently. Furthermore, the grinding blade may be moved in the X direction two or more times by changing the position of the grinding blade in the Y direction. Since the Y direction corresponds to the height direction of the light-emitting device to be manufactured, it is possible to manufacture light-emitting devices 101 of different heights using the same manufacturing equipment.

[0086] (Second embodiment) FIG. 21 is a perspective view of a light-emitting device 102 of this embodiment as seen from above, and FIG. 22 is a YZ cross-sectional view of the light-emitting device 102. The light-emitting device 102 differs from the light-emitting device 101 of the first embodiment in that the upper surfaces of the light-transmissive members are curved. As shown in FIG. 21 , in the light-emitting device 102, the first light-transmissive member 80 and the second light-transmissive member 90 have curved upper surfaces 80a and 90a, respectively, with a curvature in the Y direction. The upper surfaces 80a and 90a have curved shapes with concave curves toward the first light-emitting element 10 and the second light-emitting element 20 in a YZ cross-section perpendicular to the X direction. As shown in FIG. 22 , the upper surface 62a of the second portion 62 of the light-reflective member 60 includes a curved surface that is continuous with the curved surface of the upper surface 80a of the first light-transmissive member 80 and the curved surface of the upper surface 90a of the second light-transmissive member 90.

[0087] A light-emitting device 102 having such a structure can be manufactured, for example, by changing the shape of the rotary grinding blade 250 from that of the rotary grinding blade 250 of the first embodiment. As shown in FIG. 23 , the grinding surface 250s of the grinding blade 250 used in this embodiment has a curved shape that is convex toward the workpiece in a cross section passing through the axis of the rotary grinding blade 250. In particular, both ends in the Y direction have a curved shape. By using a rotary grinding blade 250 having such a shape, it is possible to form the first light-transmissive member 80 and the second light-transmissive member 90 having the upper surface 80a and the upper surface 90a of the above-mentioned shape.

[0088] Fig. 24 is a perspective view of another light emitting device 103 of this embodiment as seen from above, and Fig. 25 is a YZ cross-sectional view of the light emitting device 103. The light emitting device 103 also differs from the light emitting device 101 of the first embodiment in that the upper surface of the light-transmitting member is a curved surface. As shown in Fig. 25, in the light emitting device 103, The top surface 80a of the first light-transmissive member 80 has a first side 80aL1 adjacent to the first portion 61 and a second side 80aL2 adjacent to the second portion 62 and located lower than the first side 80aL1. The top surface 80a has a curved shape with a convex curve toward the first light-emitting element 10 in a YZ cross section perpendicular to the X direction. Similarly, the top surface 90a of the second light-transmissive member 90 has a first side 90aL1 adjacent to the first portion 61 and a second side 90aL2 adjacent to the second portion 62 and located lower than the first side 90aL1. The top surface 90a has a curved shape with a convex curve toward the second light-emitting element 20 in a YZ cross section perpendicular to the X direction.

[0089] The upper surface 62a of the second portion 62 of the light reflecting member 60 includes a curved surface or a flat surface that is continuous with the curved surfaces of the upper surface 80a of the first light-transmissive member 80 and the upper surface 90a of the second light-transmissive member 90.

[0090] The light emitting device 103 can also be manufactured by changing the shape of the rotary grinding blade 250 from that of the rotary grinding blade 250 of the first embodiment. As shown in FIG. 26, the grinding surface 250s of the grinding blade 250 used in this embodiment has a curved shape that is convex toward the workpiece in a cross section passing through the axis of the rotary grinding blade 250. In particular, both ends in the Y direction have a curved shape. Furthermore, as shown in the figure, the width T of the rotary grinding blade 250 is greater than the distance W2 between the centers of the first light emitting element 10 and the second light emitting element 20 in the Y direction. By using a rotary grinding blade 250 having such a shape, it is possible to form the first light-transmissive member 80 and the second light-transmissive member 90 having the upper surface 80a and the upper surface 90a of the above-mentioned shape.

[0091] In the light emitting device 102 and the light emitting device 103, the upper surface 80a of the first light-transmissive member 80 and the upper surface 90a of the second light-transmissive member 90 are curved, and the spread of emitted light in the Y direction can be adjusted according to the curved surfaces. For example, in the light emitting device 102, it is possible to reduce the spread of light in the Y direction and allow the light to enter the light guide plate.

[0092] (Other forms) Various modifications are possible to the light emitting device and the manufacturing method of the light emitting device of this embodiment. For example, in the first embodiment, the light emitting device 101 has a convex portion 61T on the first portion 61 of the light reflective member 60. In contrast, the light emitting device 104 shown in FIGS. 27 and 28 has a convex portion 62T extending along the X direction on the second portion 62 of the light reflective member 60, i.e., on the bottom surface 100d side. The light emitting device 104 having such a structure can be manufactured by using a method similar to the manufacturing method of the light emitting device of the first embodiment, and by setting the grinding position with the rotary grinding blade 250 so that the convex portion 62T is formed.

[0093] Also, for example, in the second embodiment, the upper surface of the light-transmitting member is curved. In contrast, the grinding blade used in the first embodiment, i.e., the grinding surface 250s of the rotary grinding blade 250, has a linear shape in a cross section including one end of the rotation axis of the rotary grinding blade 250 from one end to the other end, and grinding is performed by tilting the grinding blade from the Z-axis direction. This makes it possible to obtain a light-emitting device in which the upper surface of the light-transmitting member is flat and the upper surface 80a of the first light-transmitting member 80 has a first side 80aL1 adjacent to the first portion 61 and a second side 80aL2 adjacent to the second portion 62 and positioned lower than the first side 80aL1. As long as at least the convex portion 61T of the light-reflective member has an upper surface 61Ta, the surface formed by grinding may be curved or flat. In this example, the upper surface of the light-transmitting member has an inclined surface inclined from the XY plane. The inclination angle of the inclined surface from the XY plane may be at least an angle that exceeds the range of error that may occur in grinding aimed at a desired angle, for example, 1° or more. Furthermore, the upper surface of the light emitting device may have an inclined surface that is inclined over the entire surface, specifically an inclined surface that is inclined over the entire surface from the end on the first portion side to the end on the second portion side. In this case, the convex portion is the entire part that is higher in the Z direction from the first side 80aL1 of the translucent member adjacent to the first portion 61 of the convex portion. Furthermore, the upper surface of the convex portion is flush with the upper surface of the translucent member. By the light emitting device having such an inclined surface, it is possible to easily remove the light emitting device from the light emitting device. The direction of light emitted can be adjusted.

[0094] In the above embodiment, the light emitting device includes two light emitting elements, but the light emitting device may include one or three or more light emitting elements. Also, in the above embodiment, independent light-transmitting members are disposed on the light emitting elements, but one light-transmitting member may be disposed continuously over two or three or more light emitting elements. Furthermore, the convex portion of the first portion only needs to be located adjacent to at least the light-transmitting member, and does not need to be located adjacent to the third, fourth, and fifth portions. [Industrial Applicability]

[0095] The embodiments of the present disclosure are useful for various lighting sources, in-vehicle light sources, display light sources, etc. In particular, they can be advantageously applied to backlight units for liquid crystal display devices. Light-emitting devices according to the embodiments of the present disclosure can be advantageously used as backlights for display devices of mobile devices, which have strict requirements for reducing thickness. [Explanation of symbols]

[0096] 10 First light-emitting element 10a, 20a, 61a, 61'a, 61Ta, 62a, 62'a, top 10b, 20b bottom side 10c, 20c, 80c, 90c 1st side 10d, 20d, 80d, 90d Second side 10e, 20e, 80e, 90e Third side 10f, 20f, 80f, 90f 4th side 11, 21 electrode 20 Second light-emitting element 30 Joint material 41, 42 Wavelength conversion unit 51, 52 Translucent part 60, 60' Light-reflective member 61,61' Part 1 61'a 1st top surface 61T, 61'T convex part 62, 62' 2nd part 62T convex part 63 Part 3 64 Part 4 65 Part 5 66 Part 6 70 boards 70' aggregate board 70'a top surface 71,71' 1st wiring 72, 72' 2nd wiring 73,73' 3rd wiring 75,75' Base material 75r recess 75'r depression 75a Top side 75b Bottom side 75d side 75h through hole 76 Conductive materials 77, 77' insulating layer 80, 80' 1st translucent member 80aL1 First side 80aL2 Side 2 90, 90' Second translucent member 90aL1 Side 1 90aL2 Side 2 90b Bottom side 90f 4th side 100a Front 100b back 100c top 100d bottom 100e side 100f side 101~104 Light-emitting device 201, 201', 201'' composite board 201'a Main surface 250 Rotating Grinding Blade 250s grinding surface 301 Backlight 311 Case 312 Light guide plate 312c side 313 Mounting Board 314 Support

Claims

1. a light emitting element having a top surface having a longitudinal direction along a first direction, a first side surface parallel to the first direction, and a second side surface located opposite to the first side surface; a light-transmitting member disposed on the upper surface of the light-emitting element, the light-transmitting member having a top surface having a longitudinal direction along the first direction, a first side surface parallel to the first direction, and a second side surface located opposite to the first side surface; a light-reflecting member including a first portion covering the first side surface of the light-emitting element and the first side surface of the light-transmitting member, and a second portion covering the second side surface of the light-emitting element and the second side surface of the light-transmitting member; Equipped with the first portion of the light-reflective member has an upper surface that is higher than an upper surface of the light-transmitting member and has a convex portion that extends along the first direction; an upper surface of the second portion of the light reflecting member is located lower than the upper surface of the convex portion; The light-emitting device, wherein the upper surface of the light-transmitting member includes a curved surface having a concave curve facing the light-emitting element side in a cross section perpendicular to the first direction.

2. The light emitting device according to claim 1 , wherein the upper surface of the light reflective member in the second portion includes a curved surface that is continuous with the curved surface of the upper surface of the light transmissive member.

3. A light-emitting element having an upper surface having a longitudinal axis along a first direction, a first side surface parallel to the first direction, and a second side surface located opposite the first side surface; a light-transmitting member disposed on the upper surface of the light-emitting element, the light-transmitting member having a top surface having a longitudinal direction along the first direction, a first side surface parallel to the first direction, and a second side surface located opposite to the first side surface; a light-reflecting member including a first portion covering the first side surface of the light-emitting element and the first side surface of the light-transmitting member, and a second portion covering the second side surface of the light-emitting element and the second side surface of the light-transmitting member; Equipped with the first portion of the light-reflective member has an upper surface that is higher than an upper surface of the light-transmitting member and has a convex portion that extends along the first direction; an upper surface of the second portion of the light reflecting member is located lower than the upper surface of the convex portion; an upper surface of the light-transmitting member has a first side adjacent to the first portion and a second side adjacent to the second portion and positioned lower than the first side, and is a curved surface having a convex curve toward the light-emitting element in a cross section perpendicular to the first direction; a top surface of the light-reflective member in the second portion including a curved surface or a flat surface that is continuous with the curved surface of the top surface of the light-transmitting member;

4. a substrate having an upper surface and a lower surface opposite to the upper surface, the light emitting element and the light reflecting member being disposed on the upper surface; The light emitting device according to claim 1 , wherein the substrate has an opening on the lower surface below the second portion and a plurality of recesses arranged along a direction perpendicular to the first direction.

5. a plurality of the light-emitting elements and a plurality of the light-transmitting members; the plurality of light-emitting elements and the plurality of light-transmitting members are arranged in the first direction, the first portion of the light reflective member covers the first side surfaces of the plurality of light emitting elements and the first side surfaces of the plurality of light transmissive members, The light emitting device according to claim 1 , wherein the second portion of the light reflective member covers the second side surfaces of the plurality of light emitting elements and the second side surfaces of the plurality of light transmissive members.

Citation Information

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