resin composition

By combining spherical fillers with specific particle sizes, the resin composition achieves high filler loading, improving flexibility and adhesion, addressing the challenges of molding and heat dissipation in thermal interface materials.

JP7828291B2Active Publication Date: 2026-03-11TOKUYAMA CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-11-22
Publication Date
2026-03-11

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Abstract

One embodiment of the present invention relates to a resin composition and a method for producing a resin composition. The resin composition contains 100 parts by volume of a resin (A) and 230-640 parts by volume of a filler (B) having an average particle diameter of 5-60 µm. The filler (B) contains a spherical filler (B-1) having an average particle diameter of 0.1-0.7 µm and a filler (B-2) having at least a peak within the range 0.9-3.0 µm in a particle size distribution measured using a laser diffraction method. The proportion of the filler (B-1) is 0.2-5.0 vol.% relative to 100 vol.% of the filler (B).
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Citation Information

Patent Citations

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    JP2018162366A

  • Filler and production method of the same, and high heat-conducting insulation material and production method of the same

    JP2020132827A