Polymer compositions and corresponding articles having improved mechanical properties at high temperatures

Abstract

Described herein is a polymer composition (PC) comprising a polyamide and carbon fiber. As described in detail below, the polyamide (PA) is a semi-aromatic polyamide derived from the polycondensation of an aliphatic diamine, terephthalic acid, and a bis(aminoalkyl)cyclohexane or cyclohexanedicarboxylic acid. It has surprisingly been discovered that incorporating a specific combination of an alicyclic diamine bis(aminoalkyl)cyclohexane or an alicyclic diamine bis(aminoalkyl)cyclohexane and an alicyclic dicarboxylic acid cyclohexanedicarboxylic acid into the polyamide results in a carbon fiber-filled polymer composition (PC) with significantly improved mechanical properties (e.g., tensile modulus and strength) at high temperatures and significantly improved mechanical property retention after heat aging, compared to similar polyamides that do not contain a bis(aminoalkyl)cyclohexane or cyclohexanedicarboxylic acid. Due at least in part to the improved high-temperature mechanical properties and their heat aging retention, the polyamide (PA) can be desirably incorporated into structural articles that are exposed to high temperatures during use.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Provisional Patent Application No. Nr63 / 021,109, filed May 7, 2020, and European Patent Application No. 20185589.7, filed July 14, 2020, the entire contents of each of which are incorporated herein by reference for all purposes.

[0002] The present invention relates to polymer compositions containing polyamide and carbon fiber that have excellent mechanical properties at high temperatures and excellent retention of mechanical properties after heat aging. The present invention also relates to such polymer compositions containing blends of carbon fiber and glass fiber. The present invention still further relates to articles incorporating the polymer compositions. [Background technology]

[0003] Traditionally, semi-aromatic polyamides have been used to manufacture automotive parts due to their relatively high mechanical properties (e.g., tensile modulus and tensile strength) and chemical resistance. However, in application situations where automotive parts are exposed to high temperatures (e.g., 125°C or higher), semi-aromatic polyamides have relatively high flexibility (relatively low tensile modulus) and relatively low strength, making such materials less optimal for automotive structural parts in such application situations. Furthermore, the mechanical properties of such polyamides deteriorate to undesirable levels after long-term exposure to high temperatures. Generally, in such cases, conventional semi-aromatic polyamides have limited application in structural parts that are exposed to high temperatures in their intended use environment. Summary of the Invention

[0004] In a first aspect, the present invention relates to a polymer composition (PC) comprising polyamide (PA) and carbon fibers. The polyamide (PA) contains 20 mol % to 95 mol % of C4 to C6. 12The dicarboxylic acid component (B) is derived from the polycondensation of monomers in a reaction mixture containing a diamine component (A) comprising an aliphatic diamine and 5 mol % to 80 mol % of a bis(aminoalkyl)cyclohexane, where these mol % are based on the total number of moles of each diamine in the diamine component; and a dicarboxylic acid component (B) comprising 30 mol % to 100 mol % of terephthalic acid and 0 mol % to 70 mol % of a cyclohexanedicarboxylic acid, where these mol % are based on the total number of moles of each dicarboxylic acid in the dicarboxylic acid component. In some embodiments, the bis(aminoalkyl)cyclohexane is 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane. In some embodiments, the dicarboxylic acid component (B) comprises 1 mol % to 70 mol % of a cyclohexanedicarboxylic acid, preferably 1,4-cyclohexanedicarboxylic acid, based on the total number of moles of each dicarboxylic acid in the dicarboxylic acid component. In some embodiments, the bis(aminoalkyl)cyclohexane is 1,3-bis(aminomethyl)cyclohexane, and the cyclohexanedicarboxylic acid is 1,4-cyclohexanedicarboxylic acid. In some embodiments, the polymer composition (PC) comprises glass fibers. In some such embodiments, the weight ratio of carbon fibers to glass fibers is 0.05 to 4, preferably 0.15 to 4.

[0005] In some embodiments, the polymer composition (PC) has a tensile modulus at 125°C of at least 20 GPa and a tensile modulus at 150°C of at least 12 GPa. In some embodiments, the polymer composition (PC) has a tensile strength at 125°C of at least 140 MPa and a tensile modulus at 150°C of at least 100 MPa. In some embodiments, the polymer composition (PC) has a tensile strength retention of at least 80%. In some embodiments, the polymer composition (PC) comprises a tensile strength after heat aging of at least 80%, wherein the heat aging comprises heating the polymer composition (PC) at 200°C for 500 hours.

[0006] In another aspect, the invention is directed to an article comprising the polymer composition, the article being an automotive part or an aerospace part. DETAILED DESCRIPTION OF THE INVENTION

[0007] Described herein is a polymer composition (PC) containing polyamide and carbon fiber. As described in detail below, the polyamide (PA) is a semi-aromatic polyamide derived from the polycondensation of an aliphatic diamine, terephthalic acid, and a bis(aminoalkyl)cyclohexane or cyclohexanedicarboxylic acid. It has surprisingly been discovered that incorporating a specific combination of an alicyclic diamine bis(aminoalkyl)cyclohexane or an alicyclic diamine bis(aminoalkyl)cyclohexane and an alicyclic dicarboxylic acid cyclohexanedicarboxylic acid into the polyamide results in a carbon fiber-filled polymer composition (PC) with significantly improved mechanical properties (e.g., tensile modulus and strength) at high temperatures and significantly improved mechanical property retention after heat aging, compared to similar polyamides that do not contain a bis(aminoalkyl)cyclohexane or cyclohexanedicarboxylic acid. Due at least in part to the improved high-temperature mechanical properties and their heat aging retention, polyamide (PA) can be desirably incorporated into structural articles that are exposed to high temperatures during use.

[0008] In this application, any description, even if made in connection with a particular embodiment, is applicable to and interchangeable with other embodiments of the present disclosure. Where an element or component is referred to as being included in and / or selected from a list of recited elements or components, in the relevant embodiments expressly contemplated by this application, the element or component can be any one of the individually recited elements or components, or can be selected from a group consisting of any two or more of the explicitly recited elements or components; any element or component recited in a list of elements or components can be omitted from such list; and any recitation herein of numerical ranges by endpoints should be understood to include all numbers included within the recited ranges, as well as the endpoints of the ranges and their equivalents.

[0009] Unless specifically limited otherwise, the terms "alkyl" and derivative terms such as "alkoxy," "acyl," and "alkylthio," as used herein, include within their scope straight-chain, branched-chain, and cyclic moieties. Examples of alkyl groups are methyl, ethyl, 1-methylethyl, propyl, 1,1-dimethylethyl, and cyclopropyl. Unless specifically stated otherwise, each alkyl and aryl group may be unsubstituted or substituted with halogen, hydroxy, sulfo, C1-C6 alkoxy, C1-C6 alkylthio, C1-C6 acyl, formyl, cyano, C6-C6 alkyl, or C6-C6 alkylthio. 15 Aryloxy or C6-C 15 The term "halogen" or "halo" includes fluorine, chlorine, bromine, and iodine, with fluorine being preferred.

[0010] The term "aryl" refers to a phenyl, indanyl, or naphthyl group. An aryl group can contain one or more alkyl groups, in which case it is sometimes referred to as "alkylaryl," and can be composed of, for example, a cycloaromatic group and two C1-C6 groups (e.g., methyl or ethyl). An aryl group can also contain one or more heteroatoms, such as N, O, or S, in which case it is sometimes referred to as "heteroaryl"; these heteroaromatic rings can be fused to other aromatic systems. Such heteroaromatic rings include, but are not limited to, furanyl, thienyl, pyrrolyl, pyrazolyl, imidazolyl, triazolyl, isoxazolyl, oxazolyl, thiazolyl, isothiazolyl, pyridyl, pyridazyl, pyrimidyl, pyrazinyl, and triazinyl ring structures. Aryl or heteroaryl substituents can be unsubstituted or substituted with halogen, hydroxy, C1-C6 alkoxy, sulfo, C1-C6 alkylthio, C1-C6 acyl, formyl, cyano, C6-C6 alkyl, or C6-C6 alkyl. 15 Aryloxy or C6-C 15 It may be substituted with one or more substituents selected from, but not limited to, aryl, provided that the substituents are sterically compatible and chemical bonding and strain energy rules are satisfied.

[0011] It has surprisingly been discovered that the incorporation of an alicyclic diamine bis(aminoalkyl)cyclohexane or an alicyclic dicarboxylic acid cyclohexanedicarboxylic acid into a polyamide provides a polymer composition (PC) having significantly improved mechanical properties (e.g., tensile modulus and strength) at high temperatures and significantly improved retention of mechanical properties after heat aging relative to similar polyamides derived from an aliphatic diamine and terephthalic acid but lacking the bis(aminoalkyl)cyclohexane and cyclohexanedicarboxylic acid. In some embodiments, the polymer composition (PC) has a tensile modulus at 125°C of at least 15 GPa, at least 17 GPa, at least 20 GPa, or at least 25 GPa. In some embodiments, the polymer composition (PC) has a tensile modulus at 125°C of 35 GPa or less, 30 GPa or less, 25 GPa or less, or 23 GPa or less. In some embodiments, the polymer composition (PC) has a tensile modulus at 125° C. of 20 GPa to 35 GPa, 25 GPa to 35 GPa, 25 GPa to 30 GPa, 15 GPa to 30 GPa, 17 GPa to 27 GPa, 20 GPa to 25 GPa, or 20 GPa to 23 GPa. In some embodiments, the polymer composition (PC) has a tensile modulus at 140° C. of at least 10 GPa, at least 13 GPa, at least 15 GPa, or at least 20 GPa. In some embodiments, the polymer composition (PC) has a tensile modulus at 140° C. of 30 GPa or less, 25 GPa or less, 20 GPa or less, or 18 GPa or less. In some embodiments, the polymer composition (PC) has a tensile modulus at 140° C. of 15 GPa to 30 GPa, 20 GPa to 30 GPa, 15 GPa to 25 GPa, 20 GPa to 25 GPa, 10 GPa to 25 GPa, 13 GPa to 20 GPa, 15 GPa to 20 GPa, or 15 GPa to 18 GPa. In some embodiments, the polymer composition (PC) has a tensile modulus at 150° C. of at least 8 GPa, at least 10 GPa, at least 12 GPa, or at least 16 GPa.In some embodiments, the polymer composition (PC) has a tensile modulus at 150° C. of 25 GPa or less, 20 GPa or less, 18 GPa or less, or 15 GPa or less. In some embodiments, the polymer composition (PC) has a tensile modulus at 150° C. of 12 GPa to 25 GPa, 16 GPa to 25 GPa, 12 GPa to 20 GPa, 16 GPa to 20 GPa, 8 GPa to 20 GPa, 10 GPa to 18 GPa, 12 GPa to 18 GPa, or 12 GPa to 15 GPa. The tensile modulus can be measured as described in the Examples section.

[0012] In some embodiments, the polymer composition (PC) has a tensile strength at 125°C of at least 120 MPa, at least 130 MPa, at least 140 MPa, at least 160 MPa, at least 170 MPa, or at least 180 MPa. In some embodiments, the polymer composition (PC) has a tensile strength at 125°C of 195 MPa or less, 190 MPa or less, 185 MPa or less, 170 MPa or less, 160 MPa or less, or 150 MPa or less. In some embodiments, the polymer composition (PC) has a tensile strength at 125°C of 160 MPa to 195 MPa, 170 MPa to 195 MPa, 180 MPa to 195 MPa, 180 MPa to 190 MPa, 180 MPa to 185 MPa, 120 MPa to 170 MPa, 130 MPa to 160 MPa, or 140 MPa to 150 MPa. In some embodiments, the polymer composition (PC) has a tensile strength at 140°C of at least 110 MPa, at least 115 MPa, at least 120 MPa, at least 140 MPa, at least 150 MPa, or at least 160 MPa. In some embodiments, the polymer composition (PC) has a tensile strength at 140°C of 180 MPa or less, 170 MPa or less, 165 MPa or less, 140 MPa or less, 135 MPa or less, or 130 MPa or less. In some embodiments, the polymer composition (PC) has a tensile strength at 140°C of 140 MPa to 180 MPa, 150 MPa to 180 MPa, 160 MPa to 180 MPa, 160 MPa to 170 MPa, 160 MPa to 165 MPa, 110 MPa to 140 MPa, 115 MPa to 135 MPa, or 120 MPa to 130 MPa. In some embodiments, the polymer composition (PC) has a tensile strength at 150° C. of at least 90 MPa, at least 95 MPa, at least 100 MPa, at least 120 MPa, at least 125 MPa, or at least 130 MPa. In some embodiments, the polymer composition (PC) has a tensile strength at 150° C. of no more than 150 MPa, no more than 140 MPa, no more than 135 MPa, no more than 115 MPa, no more than 110 MPa, or no more than 105 MPa.In some embodiments, the polymer composition (PC) has a tensile strength of 120 MPa to 150 MPa, 125 MPa to 150 MPa, 130 MPa to 150 MPa, 130 MPa to 140 MPa, or 130 MPa to 135 MPa at 150° C. Tensile strength can be measured as described in the Examples section.

[0013] As noted above, the polymer composition also has improved tensile strength retention. Tensile strength retention is given by the following formula: 100*TS1 / TS0, where TS1 is the tensile strength after heat aging, TS0 is the tensile strength before heat aging, and heat aging comprises heating the polymer composition (PC) at a temperature of 200°C for 500 hours. In some embodiments, the polymer composition (PC) has a tensile strength after heat aging of at least 215 MPa, at least 220 MPa, or at least 225 MPa. In some embodiments, the polymer composition (PC) has a tensile strength after heat aging of 240 MPa or less, 235 MPa or less, or 230 MPa or less. In some embodiments, the polymer composition (PC) has a tensile strength after heat aging of 215 MPa to 240 MPa, 220 MPa to 240 MPa, 225 MPa to 240 MPa, 225 MPa to 235 MPa, or 225 MPa to 230 MPa. In some embodiments, the polymer composition (PC) has a tensile strength retention after heat aging of at least 70%, at least 75%, or at least 80%. In some embodiments, the polymer composition (PC) has a tensile strength retention of 95% or less, 90% or less, or 85% or less. In some embodiments, the polymer composition (PC) has a tensile strength retention after heat aging of 70% to 95%, 75% to 95%, 80% to 95%, 80% to 90%, or 80% to 85%.

[0014] Polyamide (PA) The polymer composition (PC) contains a polyamide (PA). The polyamide (PA) contains (1) 20 mol % to 95 mol % of C4 to C 12The carbon fiber-filled polymer composition (PC) is obtained by polycondensation of monomers in a reaction mixture containing (1) a diamine component (A) containing an aliphatic diamine and 5 to 80 mole percent of a bis(aminoalkyl)cyclohexane, where these mole percents are based on the total moles of each diamine monomer in the diamine component; and (2) a dicarboxylic acid component (B) containing 30 to 100 mole percent of terephthalic acid and 0 to 70 mole percent, preferably 1 to 70 mole percent, of a cyclohexanedicarboxylic acid, where these mole percents are based on the total moles of each dicarboxylic acid monomer in the dicarboxylic acid component. It has surprisingly been discovered that the introduction of a bis(aminoalkyl)cyclohexane, or a specific combination of a bis(aminoalkyl)cyclohexane and a cyclohexanedicarboxylic acid, into a semi-aromatic polyamide results in a carbon fiber-filled polymer composition (PC) with excellent high-temperature mechanical properties. The polyamides described herein have a glass transition temperature ("Tg") of at least 145°C, a melting temperature ("Tm") of at least 295°C, and a heat of fusion ("ΔH") of at least 30 J / g. f ").

[0015] Diamine component (A) The diamine component (A) is 20 mol % to 95 mol % of C4 to C 12 It includes all diamines in the reaction mixture, including aliphatic diamines and 5 mole % to 80 mole % of bis(aminoalkyl)cyclohexanes. When referring to the concentration of monomers in diamine component (A), it is understood that the concentration is relative to the total number of moles of all diamines in diamine component (A), unless otherwise specified.

[0016] In some embodiments, C4 to C 12 The aliphatic diamine is represented by the formula: H2N-R1-NH2,(1) (Wherein R'1 is C4 to C 12 Alkyl groups, preferably C6 to C 10 In some embodiments, the C4 to C6 alkyl group is 12The aliphatic diamine is selected from the group consisting of 1,4-diaminobutane (putrescine), 1,5-diaminopentane (cadaverine), 2-methyl-1,5-diaminopentane, hexamethylenediamine (or 1,6-diaminohexane), 3-methylhexamethylenediamine, 2,5-dimethylhexamethylenediamine, 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, 1,7-diaminoheptane, 1,8-diaminooctane, 2,2,7,7-tetramethyloctamethylenediamine, 1,9-diaminononane, 2-methyl-1,8-diaminooctane, 5-methyl-1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, and 1,12-diaminododecane. Preferably, the aliphatic diamine is selected from the group consisting of C4 to C6 12 The aliphatic diamine is selected from the group consisting of 1,6-diaminohexane, 3-methylhexamethylenediamine, 2,2,4-trimethyl-hexamethylenediamine, 2,4,4-trimethyl-hexamethylenediamine, 1,9-diaminononane, 2-methyl-1,8-diaminooctane, 5-methyl-1,9-diaminononane, and 1,10-diaminodecane. Preferably, the aliphatic diamine is selected from the group consisting of C4 to C6 12 Aliphatic diamines are C5-C 10 It is an aliphatic diamine or a C5 to C9 aliphatic diamine. Most preferably, it is a C4 to C 12 The aliphatic diamine is 1,6-diaminohexane.

[0017] In some embodiments, C6 to C 12 The concentration of the aliphatic diamine is 25 mol% to 95 mol%, 30 mol% to 95 mol%, 35 mol% to 95 mol%, 40 mol% to 95 mol%, 45 mol% to 95 mol%, or 50 mol% to 95 mol%. 12 The concentration of the aliphatic diamine is 20 mol% to 90 mol%, 25 mol% to 90 mol%, 30 mol% to 90 mol%, 35 mol% to 90 mol%, 40 mol% to 90 mol%, 45 mol% to 90 mol%, or 50 mol% to 90 mol%.

[0018] The bis(aminoalkyl)cyclohexane is represented by the formula: [ka] (Wherein, R2 and R3 are C1 to C 10 independently selected from alkyl; R i is selected at each position from the group consisting of alkyl, aryl, alkali or alkaline earth metal sulfonate, alkyl sulfonate, and quaternary ammonium; and i is an integer from 0 to 10. The -R3-NH2 group is disposed relative to the meta (1,3-) or para (1,4-) position. Preferably, i is 0, and R2 and R3 are both -CH2-. Most preferably, the bis(aminoalkyl)cyclohexane is selected from 1,3-bis(aminomethyl)cyclohexane ("1,3-BAC") and 1,4-bis(aminomethyl)cyclohexane ("1,4-BAC"). Of course, the bis(aminoalkyl)cyclohexane may be in either the cis or trans conformation. Thus, the diamine component (A) may contain only cis-bis(aminoalkyl)cyclohexane, only trans-bis(aminoalkyl)cyclohexane, or a mixture of cis- and trans-bis(aminoalkyl)cyclohexanes.

[0019] In some embodiments, the concentration of the bis(aminoalkyl)cyclohexane is 5 mol% to 75 mol%, 5 mol% to 70 mol%, 5 mol% to 65 mol%, 5 mol% to 60 mol%, 5 mol% to 55 mol%, or 5 mol% to 50 mol%. In some embodiments, the concentration of the bis(aminoalkyl)cyclohexane is 10 mol% to 75 mol%, 10 mol% to 70 mol%, 10 mol% to 65 mol%, 10 mol% to 60 mol%, 10 mol% to 55 mol%, or 10 mol% to 50 mol%, or 20 mol% to 40 mol%.

[0020] As noted above, in some embodiments, the diamine component (A) comprises one or more additional diamines. The additional diamines may be C4 to C6 12In some embodiments, one, more, or all of the additional diamines are represented by Formula (1), are different from each other, and are C4-C6 12 In some embodiments, each additional diamine is different from an aliphatic diamine. In some embodiments, each additional diamine is selected from the group consisting of 1,2 diaminoethane, 1,2-diaminopropane, propylene-1,3-diamine, 1,3 diaminobutane, 1,4-diaminobutane, 1,5-diaminopentane, 2-methyl-1,5-diaminopentane, 1,6-diaminohexane, 3-methylhexamethylenediamine, 2,5 dimethylhexamethylenediamine, 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, 1 The diamine component is selected from the group consisting of 1,7-diaminoheptane, 1,8-diaminooctane, 2,2,7,7-tetramethyloctamethylenediamine, 1,9-diaminononane, 2-methyl-1,8-diaminooctane, 5-methyl-1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane, 1,13-diaminotridecane, 2,5-bis(aminomethyl)tetrahydrofuran, and N,N-bis(3-aminopropyl)methylamine. This category also includes alicyclic diamines such as isophoronediamine, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, and bis-p-aminocyclohexylmethane. In some embodiments, the diamine component does not include alicyclic diamines other than bis(aminoalkyl)cyclohexane. As used herein, "free of a monomer (e.g., a bis(aminoalkyl)cyclohexane)" means that the concentration of the monomer in the corresponding component (e.g., a diamine component (A)) is less than 1 mol %, preferably less than 0.5 mol %, more preferably less than 0.1 mol %, even more preferably less than 0.05 mol %, and most preferably less than 0.01 mol %.

[0021] Dicarboxylic acid component (B) Dicarboxylic acid component (B) includes all dicarboxylic acids in the reaction mixture, including 30 mol% to 100 mol% terephthalic acid and 0 mol% to 70 mol%, preferably 1 mol% to 70 mol%, cyclohexanedicarboxylic acid. When referring to the concentration of monomers in dicarboxylic acid component (B), it will be understood that the concentration is relative to the number of moles of all dicarboxylic acids in dicarboxylic acid component (A), unless otherwise specified.

[0022] In some embodiments, the concentration of terephthalic acid is 35 mol% to 100 mol%, 35 mol% to 100 mol%, 40 mol% to 100 mol%, 45 mol% to 100 mol%, or 50 mol% to 100 mol%. In some embodiments, the concentration of terephthalic acid is 30 mol% to 99 mol%, 35 mol% to 99 mol%, 40 mol% to 99 mol%, 45 mol% to 99 mol%, or 50 mol% to 99 mol%. In some embodiments, the concentration of terephthalic acid is 30 mol% to 95 mol%, 35 mol% to 97 mol%, 40 mol% to 97 mol%, 45 mol% to 97 mol%, or 50 mol% to 97 mol%.

[0023] Cyclohexanedicarboxylic acid is represented by the formula: [ka] (In the formula, R j is selected from the group consisting of alkyl, aryl, alkali or alkaline earth metal sulfonates, alkyl sulfonates, and quaternary ammonium; j is an integer from 0 to 10. The explicit -COOH group is positioned relative to the meta (1,3-) or para (1,4-) positions, preferably the para position. Preferably, the cyclohexanedicarboxylic acid is 1,4-cyclohexanedicarboxylic acid ("CHDA") (j is 0). Of course, the cyclohexanedicarboxylic acid may be in the cis or trans conformation. Thus, the dicarboxylic acid component (B) may contain only cis-cyclohexanedicarboxylic acid, only trans-cyclohexanedicarboxylic acid, or a mixture of cis- and trans-cyclohexanedicarboxylic acids.

[0024] In some embodiments, the concentration of cyclohexanedicarboxylic acid is between 1 mol% and 70 mol%, between 1 mol% and 65 mol%, between 1 mol% and 60 mol%, between 1 mol% and 55 mol%, or between 1 mol% and 50 mol%.

[0025] As noted above, in some embodiments, dicarboxylic acid component (B) comprises one or more additional dicarboxylic acids. Each additional dicarboxylic acid is different from the others and different from terephthalic acid and cyclohexanedicarboxylic acid. In some embodiments, one, more, or all of the additional dicarboxylic acids are represented by Formula (3), each different from the others and different from cyclohexanedicarboxylic acid.

[0026] In some embodiments, the one or more additional dicarboxylic acids are C4-C 12 The dicarboxylic acids are independently selected from the group consisting of aliphatic dicarboxylic acids, aromatic dicarboxylic acids, and alicyclic dicarboxylic acids. 10 Examples of aliphatic dicarboxylic acids include, but are not limited to, succinic acid [HOOC-(CH2)2-COOH], glutaric acid [HOOC-(CH2)3-COOH], 2,2-dimethyl-glutaric acid [HOOC-C(CH3)2-(CH2)2-COOH], adipic acid [HOOC-(CH2)4-COOH], 2,4,4-trimethyl-adipic acid [HOOC-CH(CH3)-CH2-C(CH3)2-CH2-COOH], pimelic acid [HOOC-(CH2)5-COOH], suberic acid [HOOC-(CH2)6-COOH], azelaic acid [HOOC-(CH2)7-COOH], sebacic acid [HOOC-(CH2)8-COOH], 1,12-dodecanedioic acid [HOOC-(CH2) 10 -COOH].

[0027] Examples of desirable aromatic dicarboxylic acids include, but are not limited to, phthalic acids such as isophthalic acid (IA), naphthalenedicarboxylic acids (e.g., naphthalene-2,6-dicarboxylic acid), 4,4'-bibenzoic acid, 2,5-pyridinedicarboxylic acid, 2,4-pyridinedicarboxylic acid, 3,5-pyridinedicarboxylic acid, 2,2-bis(4-carboxyphenyl)propane, 2,2-bis(4-carboxyphenyl)hexafluoropropane, 2,2-bis(4-carboxyphenyl)ketone, 4,4'-bis(4-carboxyphenyl)sulfone, 2,2-bis(3-carboxyphenyl)propane, 2,2-bis(3-carboxyphenyl)hexafluoropropane, 2,2-bis(3-carboxyphenyl)ketone, and bis(3-carboxyphenoxy)benzene.

[0028] Examples of suitable alicyclic dicarboxylic acids include, but are not limited to, cyclopropane-1,2-dicarboxylic acid, 1-methylcyclopropane-1,2-dicarboxylic acid, cyclobutane-1,2-dicarboxylic acid, tetrahydrofuran-2,5-dicarboxylic acid, and 1,3-adamantanedicarboxylic acid.

[0029] In some embodiments where the polyamide (PA) comprises one or more additional dicarboxylic acids, the total concentration of the one or more additional dicarboxylic acids is 20 mole % or less.

[0030] Polyamide (PA) repeating unit Polyamide (PA) formed by polycondensation of the monomers in the diamine component and dicarboxylic acid component described above has repeating units R represented by the following formulas: PA1 and R PA2 : [ka] and further comprising, when cyclohexanedicarboxylic acid is present in the dicarboxylic acid component (B), the repeating unit R PA3 and R PA4 are the following expressions: [ka] (In the formula, R1~R3, R i , R j , i and j are defined above). Those skilled in the art will recognize that the repeating unit R PA1 C4~C 12 Formed by polycondensation of aliphatic diamine and terephthalic acid, it has the repeating unit R PA3 C4~C 12 Formed by polycondensation of aliphatic diamine and cyclohexanedicarboxylic acid, the repeating unit R PA2 is formed from the polycondensation of bis(aminoalkyl)cyclohexane with terephthalic acid, and the repeating unit R PA4 It will be recognized that R is formed from the polycondensation of a bis(aminoalkyl)cyclohexane with a cyclohexanedicarboxylic acid. In some embodiments, R is —(CH)— m where m is 5 to 10, preferably 5 to 9, and most preferably 6. Additionally or alternatively, in some embodiments, R2 and R3 are both —CH2— and i and j are both zero. In some embodiments, the bis(aminealkyl)cyclohexane is 1,3-bis(aminomethyl)cyclohexane and the cyclohexanedicarboxylic acid is 1,4-cyclohexanedicarboxylic acid.

[0031] In some embodiments, the repeating unit R PA1 and R PA2 In some embodiments where optional cyclohexanedicarboxylic acid is present in dicarboxylic acid component (B), the total concentration of repeating units R PA1 ~R PA4is at least 50 mol%, at least 60 mol%, at least 70 mol%, at least 80 mol%, at least 90 mol%, at least 95 mol%, at least 97 mol%, at least 98 mol%, at least 99 mol%, or at least 99.5 mol%. When referring to mole % of a repeat unit, it will be understood that the concentration is relative to the total number of repeat units in the indicated polymer, unless otherwise specified.

[0032] Polyamide (PA) is a semi-crystalline polyamide. As used herein, a semi-crystalline polyamide has a heat of fusion ("ΔH") of at least 5 Joules per gram ("J / g"). f In some embodiments, the polyamides (PA) described herein have a ΔH of at least 30 J / g, or at least 35 J / g. f Additionally or alternatively, in some embodiments, the polyamide (PA) has a ΔH of 60 J / g or less, or 55 J / g or less. f In some embodiments, the polyamide (PA) has a ΔH of 30 J / g to 60 J / g, or 35 J / g to 60 J / g, or 30 J / g to 55 J / g, or 35 J / g to 55 J / g. f ΔH f can be measured according to ASTM D3418 using a heating rate of 20°C / min.

[0033] The polyamide (PA) has a Tg of at least 145° C., preferably at least 150° C. In some embodiments, the polyamide (PA) has a Tg of 190° C. or less, 180° C. or less, or 170° C. or less. In some embodiments, the polyamide (PA) has a Tg of 145° C. to 190° C., 145° C. to 180° C., 145° C. to 170° C., 150° C. to 190° C., 150° C. to 180° C., or 150° C. to 170° C. The Tg can be measured according to ASTM D3418.

[0034] The polyamide (PA) has a Tm of at least 295° C., preferably at least 300° C. In some embodiments, the polyamide (PA) has a Tm of 360° C. or less, 350° C. or less, or 340° C. or less. In some embodiments, the polyamide (PA) has a Tm of 295° C. to 360° C., 295° C. to 350° C., 295° C. to 340° C., 300° C. to 360° C., 300° C. to 350° C., or 300° C. to 340° C. Tm can be measured according to ASTM D3418.

[0035] In some embodiments, the polyamide (PA) can have a number average molecular weight ("Mn") ranging from 1,000 g / mol to 40,000 g / mol, e.g., from 2,000 g / mol to 35,000 g / mol, from 4,000 to 30,000 g / mol, or from 5,000 g / mol to 20,000 g / mol. The number average molecular weight Mn can be measured by gel permeation chromatography (GPC) using ASTM D5296 with polystyrene standards.

[0036] The polyamides (PA) described herein can be prepared by any conventional method adapted to the synthesis of polyamides and polyphthalamides. Preferably, the polyamides (PA) are prepared by reacting (heating) the monomers in the presence of less than 60% by weight, preferably less than 50% by weight, of water to a temperature of at least Tm+10°C (Tm being the melting temperature of the polyamide (PA)), where the weight percentages are based on the total weight of the reaction mixture.

[0037] The polyamides (PA) described herein can be prepared, for example, by thermal polycondensation (also called polycondensation or condensation) of aqueous solutions of monomers and comonomers. In one embodiment, the polyamides (PA) contain at least C4 to C6 copolymers in the reaction mixture. 12The polyamide (PA) is formed by reacting an aliphatic diamine, a bis(aminoalkyl)cyclohexane, terephthalic acid, and, if present in the dicarboxylic acid component (B), cyclohexanedicarboxylic acid. In some embodiments, the total number of moles of diamine in the reaction mixture is substantially equimolar to the total number of moles of dicarboxylic acid in the reaction mixture. As used herein, substantially equimolar means a value that is ±15% of the indicated number of moles. For example, in relation to the concentrations of diamine and dicarboxylic acid in the reaction mixture, the total number of moles of diamine in the reaction mixture is ±15% of the total number of moles of dicarboxylic acid in the reaction mixture. The polyamide (PA) may contain a chain limiter, which is a monofunctional molecule capable of reacting with an amine moiety or a carboxylic acid moiety and is used to control the molecular weight of the polyamide (PA). For example, the chain limiter may be acetic acid, propionic acid, benzoic acid, and / or benzylamine. A catalyst may also be used. Examples of catalysts include phosphorous acid, ortho-phosphoric acid, meta-phosphoric acid, alkali metal hypophosphites such as sodium hypophosphite, and phenylphosphinic acid. Stabilizers, such as phosphites, may also be used.

[0038] Polymer Composition (PC) The polymer composition (PC) contains polyamide (PA), carbon fiber, and one or more optional components selected from the group consisting of reinforcing agents and additives, including, but not limited to, toughening agents, plasticizers, colorants, pigments (e.g., black pigments such as carbon black and nigrosine), antistatic agents, dyes, lubricants (e.g., linear low-density polyethylene, calcium or magnesium stearate, or sodium montanate), heat stabilizers, light stabilizers, flame retardants (both halogen-free and halogen-containing flame retardants), nucleating agents, acid scavengers, antioxidants, surface adhesion promoters, silane coupling agents, and other processing aids.

[0039] In some embodiments, the concentration of polyamide (PA) in the polymer composition (PC) is at least 20 wt%, at least 30 wt%, or at least 40 wt%. In some embodiments, the concentration of polyamide (PA) in the polymer composition (PC) is 85 wt% or less, 80 wt% or less, or 70 wt% or less. In some embodiments, the concentration of polyamide (PA) in the polymer composition (PC) is 20 wt% to 85 wt%, 30 wt% to 80 wt%, or 40 wt% to 70 wt%. As used herein, weight percent is based on the total weight of the polymer composition unless otherwise specified.

[0040] The polymer composition also contains carbon fibers. In some embodiments, the carbon fibers are polyacrylonitrile ("PAN")-based carbon fibers or pitch (a viscoelastic material composed of aromatic hydrocarbons)-based carbon fibers. As demonstrated in the examples, excellent results have been obtained with PAN-based carbon fibers. In some embodiments, the carbon fibers are standard modulus carbon fibers or intermediate modulus carbon fibers. Standard modulus carbon fibers have a tensile modulus of 227 GPa to 235 GPa. Intermediate modulus carbon fibers have a tensile modulus of 282 GPa to 289 GPa. The carbon fibers can be virgin carbon fibers or recycled (post-industrial or post-industrial) carbon fibers (pyrolyzed or oversized). In some embodiments, the carbon fibers have an average length of at least 1 mm, at least 3 mm, at least 4 mm, at least 5 mm, or at least 6 mm. In some embodiments, the glass fibers have an average length of 10 mm or less. In some embodiments, the carbon fibers have an average length of from 1 mm to 10 mm, from 3 mm to 10 mm, from 4 mm to 10 mm, from 5 mm to 10 mm, or even from 6 mm to 10 mm.

[0041] In some embodiments, the carbon fiber concentration in the polymer composition (PC) is at least 10 wt%, at least 15 wt%, or at least 20 wt%. In some embodiments, the carbon fiber concentration in the polymer composition (PC) is 70 wt% or less, 60 wt% or less, or 50 wt% or less. In some embodiments, the carbon fiber concentration in the polymer composition (PC) is 10 wt% to 70 wt%, 15 wt% to 70 wt%, 20 wt% to 70 wt%, 10 wt% to 60 wt%, 15 wt% to 60 wt%, 20 wt% to 60 wt%, 10 wt% to 50 wt%, 15 wt% to 50 wt%, or 20 wt% to 50 wt%.

[0042] In some embodiments, the polymer composition (PC) contains a reinforcing agent in addition to the carbon fiber. A wide selection of reinforcing agents, also called reinforcing fibers or fillers, can be added to the polymer composition (PC). In some embodiments, the reinforcing agent is selected from inorganic fillers (including but not limited to talc, mica, kaolin, calcium carbonate, calcium silicate, magnesium carbonate), glass fiber, additional carbon fiber, synthetic polymer fiber, aramid fiber, aluminum fiber, titanium fiber, magnesium fiber, boron carbide fiber, rock wool fiber, steel fiber, and wollastonite.

[0043] Typically, the reinforcing agent is a fibrous or particulate reinforcing agent. A fibrous reinforcing agent refers to a material having a length, width, and thickness in which the average length is significantly greater than both the width and thickness. Typically, such materials have an aspect ratio, defined as the average ratio between the length and the maximum width and thickness, of at least 5, at least 10, at least 20, or at least 50. In some embodiments, the fibrous reinforcing agent (e.g., glass fiber or carbon fiber) has an average length of 3 mm to 50 mm. In some such embodiments, the fibrous reinforcing agent has an average length of 3 mm to 10 mm, 3 mm to 8 mm, 3 mm to 6 mm, or 3 mm to 5 mm. In alternative embodiments, the fibrous reinforcing agent has an average length of 10 mm to 50 mm, 10 mm to 45 mm, 10 mm to 35 mm, 10 mm to 30 mm, 10 mm to 25 mm, or 15 mm to 25 mm. The average length of the reinforcing fibers can be understood as the average length of the reinforcing fibers before they are incorporated into the polymer composition (PC), or as the average length of the reinforcing fibers in the polymer composition (PC).

[0044] Glass fibers are silica-based glass compounds containing several metal oxides that can be tailored to produce different types of glass. The primary oxide is silica in the form of silica sand, with other oxides, such as calcium, sodium, and aluminum, being introduced to lower the melting temperature and inhibit crystallization. Glass fibers can be added as endless fibers or chopped glass fibers. Glass fibers generally have an equivalent diameter of 5-20 μm, preferably 5-15 μm, and more preferably 5-10 μm. All glass fiber types, such as A, C, D, E, M, S, R, and T glass fibers (as explained in Additives for Plastics Handbook, 2nd ed., John Murphy, Chapter 5.2.3, pp. 43-48), or any mixtures thereof, can be used.

[0045] E, R, S, and T glass fibers are known in the art. They are described, inter alia, in Fiberglass and Glass Technology, Wallenberger, Frederick T.; Bingham, Paul A. (Eds.), 2010, XIV, Chapter 5, pp. 197-225. R, S, and T glass fibers consist essentially of oxides of silicon, aluminum, and magnesium. In particular, they typically contain 62-75 wt. % SiO2, 16-28 wt. % Al2O3, and 5-14 wt. % MgO. On the other hand, R, S, and T glass fibers contain less than 10 wt. % CaO.

[0046] In some embodiments, the glass fiber is a high modulus glass fiber. High modulus glass fiber has a modulus of elasticity, measured according to ASTM D2343, of at least 76, preferably at least 78, more preferably at least 80, and most preferably at least 82 GPa. Examples of high modulus glass fibers include, but are not limited to, S-, R-, and T-glass fibers. Commercially available sources of high modulus glass fibers are S-1 and S-2 glass fibers manufactured by Taishan and AGY, respectively.

[0047] The morphology of the glass fiber is not particularly limited. As noted above, the glass fiber can have a circular cross-section ("circular glass fiber") or a non-circular cross-section ("flat glass fiber"). Examples of suitable flat glass fibers include, but are not limited to, glass fibers having oval, elliptical, and rectangular cross-sections. In some embodiments where the polymer composition contains flat glass fibers, the flat glass fibers have a cross-sectional longest dimension of at least 15 μm, preferably at least 20 μm, more preferably at least 22 μm, and even more preferably at least 25 μm. Additionally or alternatively, in some embodiments, the flat glass fibers have a cross-sectional longest dimension of at most 40 μm, preferably at most 35 μm, more preferably at most 32 μm, and even more preferably at most 30 μm. In some embodiments, the flat glass fibers have a cross-sectional diameter in the range of 15 to 35 μm, preferably 20 to 30 μm, and more preferably 25 to 29 μm. In some embodiments, the flat glass fibers have a cross-sectional minimum diameter of at least 4 μm, preferably at least 5 μm, more preferably at least 6 μm, and even more preferably at least 7 μm. Additionally or alternatively, in some embodiments, the flat glass fibers have a cross-sectional minimum diameter of at most 25 μm, preferably at most 20 μm, more preferably at most 17 μm, and even more preferably at most 15 μm. In some embodiments, the flat glass fibers have a cross-sectional minimum diameter in the range of 5 to 20 μm, preferably 5 to 15 μm, and more preferably 7 to 11 μm.

[0048] In some embodiments, flat glass fibers have an aspect ratio of at least 2, preferably at least 2.2, more preferably at least 2.4, and even more preferably at least 3. The aspect ratio is defined as the ratio of the longest cross-sectional dimension of a glass fiber to the shortest cross-sectional dimension of the same cross-section. Additionally or alternatively, in some embodiments, flat glass fibers have an aspect ratio of at most 8, preferably at most 6, and more preferably at most 4. In some embodiments, flat glass fibers have an aspect ratio of 2 to 6, preferably 2.2 to 4. In some embodiments, the glass fibers are round glass fibers, the glass fibers have an aspect ratio of less than 2, preferably less than 1.5, more preferably less than 1.2, even more preferably less than 1.1, and most preferably less than 1.05. Of course, those skilled in the art will understand that, regardless of the morphology (e.g., round or flat) of the glass fiber, the aspect ratio cannot be less than 1 by definition.

[0049] In some embodiments, the concentration of reinforcing agent (e.g., glass or carbon fiber) in the polymer composition (PC) is at least 10 wt%, at least 15 wt%, or at least 20 wt%. In some embodiments, the concentration of reinforcing agent in the polymer composition (PC) is 70 wt% or less, 60 wt% or less, or 50 wt% or less. In some embodiments, the concentration of reinforcing agent in the polymer composition (PC) is 10 wt% to 70 wt%, 15 wt% to 70 wt%, 20 wt% to 70 wt%, 10 wt% to 60 wt%, 15 wt% to 60 wt%, 20 wt% to 60 wt%, 10 wt% to 50 wt%, 15 wt% to 50 wt%, or 20 wt% to 50 wt%. In some embodiments, the polymer composition (PC) contains carbon fiber and glass fiber, the total concentration of carbon fiber and glass fiber is within the aforementioned ranges. In alternative such embodiments, the carbon fiber concentration and the glass fiber concentration are each independently within the above-mentioned ranges.

[0050] In some embodiments where the polymer composition (PC) contains carbon fibers and glass fibers, the weight ratio of carbon fibers to glass fibers (weight of carbon fibers in the polymer composition (PC) / weight of glass fibers in the polymer composition (PC)) is at least 0.05, at least 0.15, at least 0.2, at least 0.5, at least 0.75, or at least 1. In some embodiments where the polymer composition (PC) contains carbon fibers and glass fibers, the weight ratio of carbon fibers to glass fibers is 4 or less, 3 or less, 2 or less, or 1 or less. In some embodiments where the polymer composition (PC) contains carbon fibers and glass fibers, the weight ratio of carbon fibers to glass fibers is 0.05-4, 0.05-3, 0.05-2, 0.05-1, 0.15-4, 0.15-3, 0.15-2, 0.15-1, 0.2-5, 0.2-4, 0.2-3, 0.2-1, 0.5-4, 0.5-3, 0.5-2, 0.5-1, 1-4, 1-3, or 1-2.

[0051] In some embodiments, the polymer composition (PC) contains a toughening agent. The toughening agent is generally a polymer with a low Tg, for example, having a Tg below room temperature, below 0°C, or even below -25°C. As a result of its low Tg, the toughening agent is typically elastomeric at room temperature. The toughening agent may be a functionalized polymer backbone.

[0052] The polymer backbone of the toughening agent may be selected from elastomeric backbones comprising polyethylene and copolymers thereof, such as ethylene-butene; ethylene-octene; polypropylene and copolymers thereof; polybutene; polyisoprene; ethylene-propylene-rubber (EPR); ethylene-propylene-diene monomer rubber (EPDM); ethylene-acrylate rubber; butadiene-acrylonitrile rubber, ethylene-acrylic acid (EAA), ethylene-vinyl acetate (EVA); acrylonitrile-butadiene-styrene rubber (ABS); block copolymer styrene ethylene butadiene styrene (SEBS); block copolymer styrene butadiene styrene (SBS); core-shell elastomers of the methacrylate-butadiene-styrene (MBS) type, or mixtures of one or more of the above.

[0053] When the toughening agent is functionalized, the backbone functionalization can result from copolymerization of monomers containing functional groups or from grafting the polymer backbone with additional components.

[0054] Specific examples of functionalized toughening agents are, inter alia, terpolymers of ethylene, acrylic esters and glycidyl methacrylate, copolymers of ethylene and butyl ester acrylate; copolymers of ethylene, butyl ester acrylate and glycidyl methacrylate; ethylene-maleic anhydride copolymers; EPR grafted with maleic anhydride; styrene copolymers grafted with maleic anhydride; SEBS copolymers grafted with maleic anhydride; styrene-acrylonitrile copolymers grafted with maleic anhydride; ABS copolymers grafted with maleic anhydride.

[0055] In some embodiments, the concentration of the toughening agent in the polymer composition (PC) is at least 1 wt%, at least 2 wt%, or at least 3 wt%. In some embodiments, the concentration of the toughening agent in the polymer composition (PC) is 20 wt% or less, 15 wt% or less, or 10 wt% or less. In some embodiments, the concentration of the toughening agent in the polymer composition (PC) is 1 wt% to 20 wt%, 2 wt% to 15 wt%, or 3 wt% to 10 wt%.

[0056] As mentioned above, the polymer composition (PC) is preferably incorporated into electrical and electronic articles that are exposed to high temperatures in their intended use environment (e.g., in an engine bay or in close proximity thereto). Thus, in some embodiments, in the event of overvoltage or other combustion sources (e.g., in an automotive or aerospace engine bay application situation), a flame retardant is preferably incorporated into the polymer composition (PC). Furthermore, for similar reasons, the flame retardant is preferably a halogen-free flame retardant.

[0057] In some embodiments, the halogen-free flame retardant is an organophosphorus compound selected from the group consisting of phosphinates, diphosphinates, and condensates thereof. Preferably, the organophosphorus compound is a phosphinate of formula (I), a diphosphinate of formula (II), and condensates thereof: [ka] (wherein R1 and R2 are the same or different, and each of R1 and R2 is hydrogen or a linear or branched C1-C6 alkyl group or an aryl group; R3 is a linear or branched C1-C6 alkyl group or an aryl group; 10 Alkylene group, C6-C 10 an arylene group, an alkyl-arylene group, or an aryl-alkylene group; M is selected from calcium ions, magnesium ions, aluminum ions, zinc ions, titanium ions, and combinations thereof; m is an integer of 2 or 3; n is an integer of 1 or 3; and x is an integer of 1 or 2.

[0058] Preferably, R1 and R2 are independently selected from methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, n-pentyl, and phenyl; R3 is selected from methylene, ethylene, n-propylene, isopropylene, n-butylene, tert-butylene, n-pentylene, n-octylene, n-dodecylene, phenylene, naphthylene, methylphenylene, ethylphenylene, tert-butylphenylene, methylnaphthylene, ethylnaphthylene, tert-butylnaphthylene, phenylmethylene, phenylethylene, phenylpropylene, and phenylbutylene; and M is selected from aluminum and zinc ions.

[0059] Phosphinate is preferred as the organic phosphorus compound.Suitable phosphinates are described in U.S. Patent No. 6,365,071, which is incorporated herein by reference.Particularly preferred phosphinates are aluminum phosphinate, calcium phosphinate, and zinc phosphinate.Excellent results have been obtained with aluminum phosphinate.Among the aluminum phosphinates, ethylmethyl aluminum phosphinate and diethyl aluminum phosphinate and their combinations are preferred.Particularly excellent results have been obtained when diethyl aluminum phosphinate is used.

[0060] In some embodiments, the concentration of the halogen-free flame retardant in the polymer composition (PC) is at least 5% by weight or at least 7% by weight. In some embodiments, the concentration of the halogen-free flame retardant in the polymer composition (PC) is 20% by weight or less or 15% by weight or less. In some embodiments, the concentration of the halogen-free flame retardant in the polymer composition (PC) is 5% to 20% by weight, 7% to 20% by weight, 5% to 15% by weight, or 7% to 15% by weight.

[0061] In some embodiments, most preferably those incorporating halogen-free flame retardants, the polymer composition (PC) further contains an acid scavenger, including but not limited to silicone, silica, boehmite, metal oxides such as aluminum oxide, calcium oxide, iron oxide, titanium oxide, manganese oxide, magnesium oxide, zirconium oxide, zinc oxide, molybdenum oxide, cobalt oxide, bismuth oxide, chromium oxide, tin oxide, antimony oxide, nickel oxide, copper oxide, and tungsten oxide, metal powders such as aluminum, iron, titanium, manganese, zinc, molybdenum, cobalt, bismuth, chromium, tin, antimony, nickel, copper, and tungsten, and metal salts such as barium metaborate, zinc carbonate, magnesium carbonate, calcium carbonate, and barium carbonate. In some embodiments where the polymer composition (PC) contains an acid scavenger, the concentration of the acid scavenger is 0.01% to 5% by weight, 0.05% to 4% by weight, 0.08% to 3% by weight, 0.1% to 2% by weight, 0.1% to 1% by weight, 0.1% to 0.5% by weight, or 0.1% to 0.3% by weight.

[0062] In some embodiments, the concentration of all additives in the polymer composition (PC) is at least 0.1 wt%, at least 0.2 wt%, or at least 0.3 wt%. In some embodiments, the concentration of all additives in the polymer composition (PC) is 20 wt% or less, 15 wt% or less, 10 wt% or less, 7 wt% or less, or 5 wt% or less. In some embodiments, the concentration of all additives in the polymer composition (PC) is 0.1 wt% to 20 wt%, 0.1 wt% to 15 wt%, 0.1 wt% to 10 wt%, 0.2 wt% to 7 wt%, or 0.3 wt% to 5 wt%.

[0063] In some embodiments, the polymer composition (PC) further comprises one or more additional polymers, in some such embodiments, at least one of the additional polymers is a semi-crystalline or amorphous polyamide, such as an aliphatic polyamide, a semi-aromatic polyamide, or more generally a polyamide obtained by polycondensation between an aromatic or aliphatic saturated diacid and an aliphatic saturated or aromatic primary diamine, a lactam, an amino acid, or a mixture of these different monomers.

[0064] Preparation of polymer composition (PC) The present invention further relates to a method for producing a polymer composition (PC), which requires melt blending a polyamide (PA) with one or more optional components (reinforcing agents and additives).

[0065] Any melt blending method can be used to mix the polymeric and non-polymeric components in the context of the present invention. For example, the polymeric and non-polymeric components can be fed into a melt mixer such as a single-screw or twin-screw extruder, a stirrer, a single-screw or twin-screw kneader, or a Banbury mixer, and the addition step can be simultaneous addition of all components or batchwise stepwise addition. When the polymeric and non-polymeric components are added gradually in a batchwise manner, a portion of the polymeric and / or non-polymeric components is added first and then melt-mixed with the remaining polymeric and non-polymeric components added thereafter until a well-mixed composition is obtained. When the reinforcing agent exhibits a long physical form (e.g., long glass fibers and continuous fibers), stretch extrusion or pultrusion can be used to prepare the reinforced composition.

[0066] Articles and uses The present invention also relates to articles (PC) comprising the polymer composition, which are desirably incorporated into any article that will be exposed to high temperatures and aqueous polyol solutions during their intended use (e.g., exposed to temperatures of 125°C, 140°C, or 150°C for at least 30 minutes, 1 hour, or 10 hours) for at least one reason: improved mechanical performance at high temperatures and improved mechanical retention after heat aging.

[0067] In some embodiments, the article is selected from the group consisting of automotive parts (such as motorcycle components, all-terrain vehicle components, and marine components) and aerospace parts (such as airplane components, helicopter components, unmanned aerial vehicle components, missile components, rocket components, and satellite components).Examples of automotive parts include, but are not limited to, thermal management system components (such as, but not limited to, thermostat housings, water inlet / outlet valves, water pumps, water pump impellers, and heater cores and end caps), air management system components (such as, but not limited to, turbocharger actuators, turbocharger bypass valves, turbocharger hoses, EGR valves, CAC housings, exhaust gas recirculation systems, electronically controlled throttle valves, and hot air ducts), transmission and launch gear components (such as, but not limited to, dual clutch transmissions, automated manual transmissions, continuously variable transmissions, automatic transmissions, torque converters, dual mass flywheels, power take-offs, clutch cylinders, seal rings, thrust washers, thrust bearings, needle bearings, and check balls), automotive electronics components, automotive lighting components (such as, but not limited to, motor end caps, sensors, ECU housings, bobbins, and solenoids), and fuel and selective catalytic reduction ("SCR") systems (including, but not limited to, SCR module housings and connectors, SCR module housings and connectors, fuel flanges, rollover valves, quick connects, filter housings, fuel rails, fuel delivery modules, fuel hoses, fuel pumps, fuel injector O-rings, and fuel hoses); fluid system components (e.g., fuel system components) (including, but not limited to, inlet and outlet valves, and fluid pump components); interior components (e.g., dashboard components, display components, and seat components); and structural and lightweight components (e.g., gears and bearings, sunroofs, brackets and mounts, electrical battery housings, thermal management components, braking system components, and pumps and EGR systems).The polymer compositions are further desirably incorporated into the aforementioned articles where they are exposed to high temperatures (eg, in an engine bay).

[0068] In some embodiments, articles are molded from polymer composition (PC) by any process compatible with thermoplastics, such as extrusion, injection molding, blow molding, rotational molding, or compression molding. Polymer composition (C) can also be used to overmold preformed shapes to create composite structures.

[0069] In some embodiments, an article can be printed from the polymer composition (PC), for example by a process comprising the step of extrusion of the polymer composition (PC) in the form of a filament, or by a process comprising the step of laser sintering of the polymer composition (PC), in this case in powder form.

[0070] The present invention also relates to a method of manufacturing a three-dimensional (3D) object by an additive manufacturing system, the method comprising providing a part material comprising a polymer composition (C) and printing layers of the three-dimensional object from the part material.

[0071] The polymer composition (PC) can therefore also be in the form of threads or filaments used in 3D printing processes, for example fused filament manufacturing, also known as fused deposition modeling ("FDM").

[0072] The polymer composition (PC) can also be in the form of a powder, such as a substantially spherical powder, used in 3D printing processes, such as selective laser sintering ("SLS").

[0073] Uses and Articles of Polymer Composition (PC) The present invention relates to the use of a polymer composition (PC) or an article as described above for manufacturing an automotive or aerospace part. The present invention also relates to the use of a polymer composition (PC) for 3D printing an object. [Example]

[0074] This example demonstrates the synthesis, thermal performance, and mechanical performance of polyamides.

[0075] The raw materials used to form the samples are as follows: - Polyamide 1 ("PA1"): PA6, T / 1,3-BAC, T / 6, CHDA / 1,3-BAC, CHDA (Tg=165°C and Tm=330°C), synthesized form - Hexamethylenediamine (70% by weight, from Ascend Performance Materials) - 1,3-bis(aminomethyl)cyclohexane (from Mitsubishi Gas Chemical Company) - Terephthalic Acid (from Flint Hills Resources) - 1,4-Cyclohexanedicarboxylic acid (from Eastman Chemical Company) - Polyamide 2 ("PA2"): PA6T / 6I (70 / 30) (from Solvay Specialty Polymers) - Polyamide 3 ("PA3"): PA6T / 6I (70 / 30) (from Solvay Specialty Polymers) - Polyamide 4 ("PA4"): PA6T / 66(65 / 35) (from Solvay Specialty Polymers) - Polyamide 5 ("PA5"): PA6T / 66(65 / 35) (from Solvay Specialty Polymers) - Polyamide 6 ("PA6"): PA6T / 66(55 / 45) (from Solvay Specialty Polymers) - Polyamide 7 ("PA7"): PA6T / 6I / 66(65 / 25 / 10) (from Solvay Specialty Polymers) - Reinforcement: Maleic anhydride grafted SEBS copolymer (KRATON TM FG 1901 GT, from Kraton Corporation) - Heat Stabilizer 1 ("HS1"): CuI / KI / Magnesium Stearate (HS Triblend, from Ajay North America) - Heat Stabilizer 2 ("HS2"): 4-(1-methyl-1-phenylethyl)N-[4-(1-methyl-1-phenylethyl)phenyl]aniline (NAUGARD® 445, from Addivant) - Additive package 1: Additive package containing heat stabilizers, lubricants and pigments - Additive Package 2: An additive package containing antioxidants, heat stabilizers, lubricants and pigments - Nucleating agent: Talc (Mistron Vapor, from Imerys) - Reinforcement 1 ("CF"): Carbon fiber (CF.OS.U1-6mm, from Apply Carbon SA / Procotex SA Corporation) Reinforcement 2 ("GF"): E-glass fiber (ChopVantage® HP 3610, from Nippon Electric Glass Co., Ltd.)

[0076] Example 1 - Synthesis of PA1 This example demonstrates the synthesis of polyamide 1.

[0077] PA1 was prepared in an autoclave reactor equipped with a distillate line and a pressure regulator. The reactor was charged with 498 g of 70% hexamethylenediamine, 165 g of 1,3-bis(aminomethyl)cyclohexane, 635 g of terephthalic acid, 20 g of 1,4-cyclohexanedicarboxylic acid, 355 g of deionized water, 7.2 g of glacial acetic acid, and 0.32 g of phosphoric acid. The reactor was sealed, purged with nitrogen, and heated to 260°C. Evolved steam was slowly vented to maintain an internal pressure of 120 psig. The temperature was increased to 3350°C. The reaction mixture was held at 335°C for 60 minutes while the reaction pressure was reduced to atmospheric pressure. The polymer was discharged from the reactor and used in the preparation of compound formulations.

[0078] Example 2 - Mechanical performance of carbon fiber filled systems This example demonstrates the mechanical performance of polymer compositions containing carbon fibers.

[0079] To demonstrate mechanical performance, polymeric resins (either PPA1, PPA2, or PPA3) were melt-blended with various components in an extruder to form polymeric compositions. The polymeric compositions were then molded into test specimens. Tensile modulus and strength were measured according to ISO 527-2 on dumbbell-shaped ISO Type 1A tensile specimens with the following nominal dimensions: 170 mm overall length, 75 mm gauge length, 80 mm parallel length, 10 mm parallel width, 20 mm grip width, and 4 mm thickness. Tensile modulus and strength were measured at test temperatures ranging from 23°C to 150°C. Tables 1 and 2 show the sample parameters and tensile properties, respectively. In the tables, "E" denotes an example, and "CE" denotes a counterexample. All values ​​in Table 1 (and Table 3) are reported in weight percent.

[0080] [Table 1]

[0081] [Table 2]

[0082] Referring to Table 2, samples formed from PA1 unexpectedly had significantly improved tensile modulus and strength at high temperatures relative to samples formed from PA2, PA4, PA6, and PA7. For example, with respect to tensile modulus, E1 was significantly harder (higher tensile modulus) relative to those of CE1-CE4 at 125°C, 140°C, and 150°C. Similar results were obtained for tensile strength. Notably, a comparison of E1 with CE2-CE4 demonstrates improved tensile modulus and strength at high temperatures due to the introduction of the linear aliphatic dicarboxylic acid, adipic acid, versus the introduction of the alicyclic diamine bis(aminoalkyl)cyclohexane and alicyclic dicarboxylic acid, cyclohexanedicarboxylic acid. A comparison of CE1 with CE2 demonstrates similar improvements due to the introduction of the aromatic dicarboxylic acid, isophthalic acid. The results shown in Table 2 are particularly surprising because, at room temperature (23°C), the tensile modulus and strength of E1 are the same as or lower than those of CE1-CE4. The results demonstrate that E1 has excellent mechanical performance at high temperatures and is well suited for structural articles exposed to high temperatures in their intended application conditions (eg, in an engine bay).

[0083] Retention of mechanical performance was also demonstrated. To demonstrate retention of mechanical performance, test specimens were heat aged by placing them in an oven (air atmosphere) and heating at 200°C for 500 hours. Tensile strength was measured as above, but at room temperature (23°C), before ("as molded") and after heat aging. Table 3 shows the results of the heat aging tests.

[0084] [Table 3]

[0085] Referring to Table 3, samples formed from PA1 surprisingly had improved tensile strength and tensile strength retention after heat aging relative to samples formed from PA2, PA4, PA6, and PA7. Also, as noted above with respect to high-temperature mechanical performance, a comparison of E1 with CE2-CE4 demonstrates improved tensile modulus and strength with the incorporation of the alicyclic diamine bis(aminoalkyl)cyclohexane or alicyclic dicarboxylic acid cyclohexanedicarboxylic acid relative to the incorporation of the linear aliphatic dicarboxylic acid adipic acid. A comparison of CE1 with CE2 demonstrates similar improvements with the incorporation of the aromatic dicarboxylic acid isophthalic acid.

[0086] Example 3 - Mechanical performance of carbon and glass fiber filled systems This example demonstrates the mechanical performance of a polymer composition containing a combination of carbon and glass fibers.

[0087] To demonstrate mechanical performance, polymer compositions were formed by melt blending polymer resins (either PA1, PA3, PA5, PA6, or PA7) with various ingredients in an extruder. The polymer compositions were then molded into test specimens. Tensile modulus and tensile strength were measured as described above at test bar temperatures ranging from 23°C to 150°C. Tables 4 and 5 show the sample parameters and tensile properties, respectively. Values ​​in Table 4 are reported in weight percent.

[0088] [Table 4]

[0089] [Table 5]

[0090] Referring to Table 5, samples formed from PA1 unexpectedly had significantly improved tensile modulus and strength at high temperatures relative to samples formed from PA3, PA5, PA6, and PA7. For example, with respect to tensile modulus, E2 was significantly harder (higher tensile modulus) at 125°C, 140°C, and 150°C relative to those of CE6-CE8. Similar results were obtained for tensile strength. Notably, a comparison of E2 with CE6-CE8 demonstrated improved tensile modulus and strength with the introduction of an alicyclic diamine bis(aminoalkyl)cyclohexane or an alicyclic dicarboxylic acid cyclohexanedicarboxylic acid relative to the introduction of a linear aliphatic dicarboxylic acid adipic acid. A comparison of E2 with CE5 demonstrated similar results with the introduction of an aromatic dicarboxylic acid isophthalic acid. The results shown in Table 5 are particularly surprising because the tensile modulus and strength of E2 at room temperature (23°C) are slightly higher or lower than those of CE5-CE8. The results demonstrate that E2 has excellent mechanical performance at high temperatures and is well suited for structural articles exposed to high temperatures in their intended application conditions (eg, in an engine bay).

[0091] The above-described embodiments are intended to be illustrative and not limiting. Further embodiments are within the concept of the present invention. Additionally, while the present invention has been described with reference to specific embodiments, those skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the present invention. Any incorporation by reference of the above documents is limited to not incorporating any subject matter contrary to the explicit disclosure herein.

Claims

1. a polyamide (PA) in a concentration of 20% to 85% by weight based on the total weight of the polymer composition (PC), carbon fibers at a concentration of 10% to 70% by weight based on the total weight of said polymer composition (PC); A polymer composition (PC) comprising: said polyamide (PA) 20 mol % to 95 mol % C ４ ~C １２ an aliphatic diamine, - 5 mol % to 80 mol % of bis(aminoalkyl)cyclohexanes; wherein these mole percentages are based on the total number of moles of each diamine in the diamine component; and - 30 mol % to 100 mol % of terephthalic acid, - 1 mol % to 70 mol % of cyclohexanedicarboxylic acid; and the mole percentages are based on the total number of moles of each dicarboxylic acid in the dicarboxylic acid component. derived by polycondensation of monomers in a reaction mixture comprising the C 4 to C 12 aliphatic diamine is selected from the group consisting of 1,4-diaminobutane, 1,5-diaminopentane, 2-methyl-1,5-diaminopentane, 1,6-diaminohexane, 3-methylhexamethylenediamine, 2,5-dimethylhexamethylenediamine, 2,2,4-trimethyl-hexamethylenediamine, 2,4,4-trimethyl-hexamethylenediamine, 1,7-diaminoheptane, 1,8-diaminooctane, 2,2,7,7-tetramethyloctamethylenediamine, 1,9-diaminononane, 2-methyl-1,8-diaminooctane, 5-methyl-1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, and 1,12-diaminododecane; the bis(aminoalkyl)cyclohexane is 1,3-bis(aminomethyl)cyclohexane, and the cyclohexanedicarboxylic acid is 1,4-cyclohexanedicarboxylic acid; Polymer composition (PC).

2. 2. The polymer composition (PC) according to claim 1, comprising glass fibers.

3. The polymer composition (PC) according to claim 2, wherein the glass fiber concentration is from 10% to 70% by weight.

4. A polymer composition (PC) according to claim 2 or 3, wherein the weight ratio of said carbon fibres to said glass fibres is between 0.05 and 4.

5. A polymer composition (PC) according to any one of claims 1 to 4, having a tensile modulus at 125°C of at least 20 GPa and a tensile modulus at 150°C of at least 12 GPa.

6. A polymer composition (PC) according to any one of claims 1 to 5, having a tensile strength at 125°C of at least 140 MPa and a tensile modulus at 150°C of at least 100 MPa.

7. 7. The polymer composition (PC) according to any one of claims 1 to 6, having a tensile strength retention of at least 80%, said tensile strength retention being given by the following formula: 100*TS1 / TS0, where TS1 is the tensile strength after heat aging and TS0 is the tensile strength before heat aging, and where heat aging consists of heating the polymer composition (PC) at a temperature of 200°C for 500 hours.

8. 8. A polymer composition (PC) according to any one of claims 1 to 7, having a tensile strength after heat aging of at least 80%, wherein heat aging comprises heating said polymer composition (PC) at 200°C for 500 hours.

9. An article comprising a polymer composition (PC) according to any one of claims 1 to 8, which is an automotive or aerospace part.

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