Chemically amplified positive photosensitive composition, method for manufacturing substrate with mold, and method for manufacturing plated object

The chemically amplified photosensitive composition addresses the challenge of forming resist patterns with large undercuts and suppressed footing, ensuring plated objects' stability through controlled acid generator decomposition and specific resin components.

JP7828433B2Active Publication Date: 2026-03-11TOKYO OHKA KOGYO CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-01-24
Publication Date
2026-03-11

AI Technical Summary

Technical Problem

Conventional chemically amplified positive photoresist compositions struggle to form resist patterns with large undercuts while suppressing footing, leading to potential collapse of plated objects under applied loads.

Method used

A chemically amplified positive photosensitive composition comprising an acid generator, an acrylic resin with specific structural units, a sulfur-containing compound, an acid diffusion inhibitor, and an organic solvent, which forms resist patterns with controlled acid generator decomposition rates, enabling large undercuts and suppressed footing.

Benefits of technology

The composition effectively forms resist patterns with large undercuts and minimal footing, enhancing the stability of plated objects against tipping and collapse.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007828433000074
    Figure 0007828433000074
  • Figure 0007828433000075
    Figure 0007828433000075
  • Figure 0007828433000001
    Figure 0007828433000001
Patent Text Reader

Abstract

Provided is a chemically amplified positive photosensitive composition which forms a pattern to serve as a template in a process for creating a plated article on a substrate which comprises a metal layer on the surface thereof, said composition easily forming a resist pattern having a cross section shape in which a large undercut is formed and footing is suppressed.　This invention uses a chemically amplified positive photosensitive composition containing an acid generating agent (A) which generates an acid when irradiated using an active light ray or radiation, a resin (B) which has alkaline solubility that increases due to the activity of the acid, a sulfur-containing compound (E) containing a sulfur atom which can coordinate with the metal layer on the substrate, an acid diffusion suppressing agent (F), and an organic solvent (S), said resin (B) containing an acrylic resin (B3) which contains a specific constituent unit (B3-1), wherein the decomposition rate (%) of the acid generating agent (A) determined using specific steps 1)-4) is greater than 0.5 and less than 10.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Energy ray-sensitive acid generating agent, energy ray-sensitive acid generating agent composition and curable composition

    JP1997176112A

  • Photoresist composition

    JP1999052562A