Electronic Module

Abstract

To provide an electronic module capable of reducing a switching loss, a heat generation, and an electromagnetic noise and improving a control stability.SOLUTION: An electronic module 10-1 comprises: a semiconductor chip 12 that is sealed with an insulation resin, and has an electrode part 20; a substrate 14 mounting the semiconductor chip; a wiring part 16 that is patterned onto the substrate; and a connection clip 18 in which an upper surface part of a part other than at least electrode part of the semiconductor chip or the upper part and a side part is / are covered and arranged, and which electrically connects the electrode part with the wiring part.EFFECT: The electronic module which is a low noise, and satisfies a high heat dissipation can be provided because the connection clip blocks an electromagnetic noise generated from the semiconductor chip, and further discharges a heat generated from the semiconductor chip.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic module. [Background technology]

[0002] Patent document 1 discloses a module including a die pad frame, a semiconductor chip arranged on the upper surface of the die pad frame, with a first electrode provided on the upper surface and a second electrode provided on the lower surface, a conductive connecting member for the die pad that electrically connects the second electrode of the semiconductor chip to the upper surface of the die pad frame, a conductive connecting member for a first clip that electrically connects the first electrode of the semiconductor chip to the lower surface of the first clip frame, and a sealing resin that seals the semiconductor chip, the die pad frame, the first clip frame, the conductive connecting member for the first clip, and the conductive connecting member for the die pad.

[0003] Patent Document 2 discloses a clip including a first leg portion, a second leg portion, a third leg portion, a first connecting portion, and a second connecting portion. The first leg portion, the second leg portion, and the third leg portion are arranged in a non-linear manner, which reduces the number of parts.

[0004] Patent Document 3 discloses a semiconductor module in which a plurality of semiconductor chips, each having electrodes on its front and back surfaces, are mounted on a lead frame in an array, with the electrodes connected in parallel and each being taken out. The lead frame has a shape that covers the array of semiconductor chips, and is fixed to the lead frame via the semiconductor chips. The semiconductor chip-side surface is provided with clip leads having protrusions at locations corresponding to the electrodes on the front surfaces of the semiconductor chips, leads electrically connected to the lead frame, and leads electrically connected to the clip leads. The electrodes on the back surfaces of the semiconductor chips are connected to the lead frame, and the electrodes on the front surfaces of the semiconductor chips are joined to the protrusions of the clip leads via a solder layer. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 6457144 [Patent Document 2] Japanese Patent Application Laid-Open No. 2013-239678 [Patent Document 3] Japanese Patent Application Laid-Open No. 2012-89563 Summary of the Invention [Problem to be solved by the invention]

[0006] However, wiring from the terminals of an electronic module to electronic elements has a large parasitic inductance, and there is a demand for reducing switching loss, heat generation, and electromagnetic noise, as well as improving the control stability of the electronic module. Furthermore, there is also a growing demand for conventional electronic modules to have improved reliability against thermal stress, such as thermal expansion, caused by switching loss, and for device miniaturization. In particular, in recent years, attention has been focused on higher currents and faster operation, making it difficult for conventional electronic modules to meet these demands. Thus, there is a demand for reducing switching loss, heat generation, and electromagnetic noise, as well as improving control stability, for conventional electronic modules. An object of the present invention is to provide an electronic module that meets these demands. [Means for solving the problem]

[0007] (1) The electronic module according to the present invention is characterized by comprising a semiconductor chip sealed with insulating resin and having an electrode portion, a substrate on which the semiconductor chip is mounted, a wiring portion patterned on the substrate, and a connecting clip arranged to cover at least the top surface portion of the semiconductor chip other than the electrode portion, or the top surface portion and side surface portion, and electrically connecting the electrode portion and the wiring portion.

[0008] (2) In the electronic module according to the present invention, the connecting clip has heat dissipation fins.

[0009] (3) In the electronic module according to the present invention, the semiconductor chip is a diode, the electrode portion has a cathode electrode portion and an anode electrode portion, and the connecting clip is connected to either the cathode electrode portion or the anode electrode portion.

[0010] (4) In the electronic module according to the present invention, the semiconductor chip is a transistor, the electrode portion has a source electrode portion, a drain electrode portion, and a gate electrode portion, and the connection clip is connected to either the source electrode portion, the drain electrode portion, or the gate electrode portion.

[0011] (5) In the electronic module according to the present invention, the gate electrode portion and the wiring portion are electrically connected by a conductive member set to a predetermined resistance value.

[0012] (6) In the electronic module according to the present invention, a part or all of the connecting clip to the semiconductor chip is exposed from the insulating resin.

[0013] (7) In the electronic module according to the present invention, a part of the insulating resin is an electromagnetic wave absorbing resin having an electromagnetic wave absorbing function, and the electromagnetic wave absorbing resin is provided on the connecting clip.

[0014] (8) In the electronic module according to the present invention, the semiconductor chip contains silicon carbide, gallium nitride, gallium oxide, or diamond semiconductor. [Effects of the Invention]

[0015] The electronic module is configured to include a semiconductor chip sealed with insulating resin and having an electrode portion, a substrate on which the semiconductor chip is mounted, a wiring portion patterned on the substrate, and a connection clip that is positioned to cover at least the top surface or the top and side surfaces of the semiconductor chip other than the electrode portion, and electrically connects the electrode portion and the wiring portion.The connection clip blocks electromagnetic noise generated by the semiconductor chip and also dissipates heat generated by the semiconductor chip, making it possible to provide an electronic module that is low noise and has high heat dissipation properties. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a diagram illustrating a first embodiment according to the present invention; [Figure 2] FIG. 10 is a diagram illustrating a second embodiment according to the present invention. [Figure 3] 10A and 10B are diagrams illustrating a third embodiment in which the connecting clip has heat dissipation fins. [Figure 4] FIG. 10 is a cross-sectional view illustrating a fourth embodiment in which a diode is used as a semiconductor chip. [Figure 5] 10A and 10B are diagrams illustrating a fifth embodiment in which a transistor is used in a semiconductor chip. DETAILED DESCRIPTION OF THE INVENTION

[0017] An electronic module for carrying out the present invention will be described below with reference to the drawings. Note that each drawing is a schematic diagram and does not necessarily reflect the actual dimensions precisely. The embodiments described below do not limit the invention according to the claims. Furthermore, not all of the elements and combinations thereof described in each embodiment are necessarily essential to the solution of the present invention. In each embodiment, the same reference numerals are used across embodiments for configurations and elements with the same basic configuration, features, functions, etc. (including components that are not completely identical in shape, etc.), and repeated description may be omitted.

[0018] An electronic module according to an embodiment of the present invention comprises a semiconductor chip sealed with insulating resin and having an electrode portion, a substrate on which the semiconductor chip is mounted, a wiring portion patterned on the substrate, and a connecting clip arranged to cover at least the top surface of the semiconductor chip other than the electrode portion, or the top surface and side surface, and electrically connecting the electrode portion and the wiring portion.

[0019] (First embodiment) Fig. 1 is a diagram illustrating a first embodiment of the present invention. Fig. 1(A) is a perspective view, Fig. 1(B) is a plan view, Fig. 1(C) is a cross-sectional view taken along line AA of Fig. 1(B), and Fig. 1(D) is a cross-sectional view taken along line BB of Fig. 1(B). As shown in Figs. 1(A) to 1(D), an electronic module 10-1 is sealed with insulating resin and includes a semiconductor chip 12 having electrodes 20, a substrate 14 on which the semiconductor chip 12 is mounted, a wiring portion 16 patterned on the substrate 14, and a connection clip 18 that is disposed to cover at least the upper surface of the semiconductor chip 12 except for the electrodes 20 and electrically connects the electrodes 20 and the wiring portion 16. The connecting clip 18 has a recess 19 are. The material of the connecting clip 18 is a conductive metal, such as copper.

[0020] 1A, electronic module 10-1 has wiring section 16-1 provided on substrate 14, and semiconductor chip 12 connected thereto. Connection clip 18-1 is disposed to cover the upper surface of semiconductor chip 12 except for electrode section 20, and electrically connects electrode section 20 to wiring section 16-3. The back electrode of semiconductor chip 12 is connected to wiring section 16-1, and connection clip 18-2 connects the control electrode section of semiconductor chip 12 to wiring section 16-2.

[0021] As shown in Fig. 1(C), the AA cross section has a structure in which the substrate 14, wiring portion 16-1, semiconductor chip 12, electrode portion 20, and connection clip 18-1 are stacked. As shown in Fig. 1(D), the connection clip 18-1 connects the electrode portion 20 of the semiconductor chip 12 to the wiring portion 16-3. Similarly, the connection clip 18-2 connects the semiconductor chip 12 to the wiring portion 16-2.

[0022] (Second embodiment) 2A to 2D are diagrams illustrating a second embodiment of the present invention. Fig. 2A is a perspective view, Fig. 2B is a plan view, Fig. 2C is a cross-sectional view taken along line AA of Fig. 2B, and Fig. 2D is a cross-sectional view taken along line BB of Fig. 2B. As shown in Figs. 2A to 2D, an electronic module 10-2 is sealed with insulating resin and includes a semiconductor chip 12 having electrodes 20, a substrate 14 on which the semiconductor chip 12 is mounted, wiring portions 16 patterned on the substrate 14, and the top and side surfaces of the semiconductor chip 12 other than the electrodes 20, which are covered by connecting clips 18-1. The electrodes 20 and wiring portions 16 are electrically connected by connecting clips 18. Connecting Clip 18 is provided with a recess 19.

[0023] 1 is that the connection clip 18-1 covers not only the top surface but also the side surface of the electrode portion 20 of the semiconductor chip 12. The rest is the same as the embodiment shown in FIG. 1, and a description thereof will be omitted.

[0024] The connecting clip 18-1 covers the top surface of the semiconductor chip 12 other than the electrode portion 20, as well as the side surface, so that it provides a higher noise shielding effect against electromagnetic noise generated by the semiconductor chip 12 than if only the top surface were covered, and also allows for better dissipation of heat generated by the semiconductor chip. This makes it possible to provide an electronic module that is low noise and has high heat dissipation properties.

[0025] 1 and 2, electronic modules 10-1 and 10-2 are sealed with insulating resin and comprise a semiconductor chip 12 having electrode portions 20, a substrate 14 on which the semiconductor chip 12 is mounted, wiring portions 16 patterned on the substrate 14, connection clips 18 that electrically connect the electrode portions 20 and the wiring portions 16, and the semiconductor chip 12 whose top surface or top surface and side surfaces other than the electrode portions 20 are covered with the connection clips 18. Therefore, the connection clips 18 block electromagnetic noise generated from the semiconductor chip 12 and further dissipate heat generated from the semiconductor chip, making it possible to provide an electronic module that is low noise and has high heat dissipation properties.

[0026] (Third embodiment) 3A to 3D are diagrams illustrating a third embodiment in which the connection clip has heat dissipation fins. Fig. 3A is a perspective view, Fig. 3B is a plan view, Fig. 3C is a cross-sectional view taken along line AA of Fig. 3B, and Fig. 3D is a cross-sectional view taken along line BB of Fig. 3B. As shown in Figs. 3A to 3D, the electronic module 10-3 has a connection clip 18-1 that has heat dissipation fins 22. Except for the fact that the connection clip 18-1 has heat dissipation fins 22, the electronic module 10-3 is the same as the first embodiment shown in Fig. 1, and a description thereof will be omitted.

[0027] In the electronic module 10-3 according to the embodiment of the present invention, the connecting clip 18-1 has heat dissipation fins 22, which more effectively dissipates heat generated from the semiconductor chip 20. This makes it possible to provide an electronic module that is low noise and has high heat dissipation capabilities.

[0028] (Fourth embodiment) FIG. 4 is a cross-sectional view illustrating a fourth embodiment in which a diode is used as a semiconductor chip. As shown in FIG. 4, in an electronic module 10-4, a diode 24 has an anode electrode portion 26 and a cathode electrode portion 28 and is mounted on a substrate 14. The anode electrode portion 26 is connected to connecting clips 18-1 and 18-2, and the cathode electrode portion 28 is connected to wiring portion 16-2. The diode 24 is connected from the anode electrode portion 26 to wiring portion 16-3 via connecting clip 18-1 and to wiring portion 16-1 via connecting clip 18-2, and is then connected to other electronic elements, etc. The cathode electrode portion 28 is connected to wiring portion 16-2. The wiring portion 16-2 may be grounded, for example. The anode electrode portion 26 and the cathode electrode portion 28 may be reversed, as determined by the circuit design.

[0029] The connecting clip 18-1 connects the anode electrode portion 26 and the wiring portion 16-3, and extends over the surface of the diode 24 to cover the diode 24. This allows for more effective dissipation of heat generated from the diode 24. The connecting clip 18-2 connects the anode electrode portion 26 and the wiring portion 16-1. The connecting clip 18-2 may also extend over the surface of the diode 24 to cover the diode 24.

[0030] As shown in FIG. 4, in the electronic module 10-4, for example, the semiconductor chip 12 is a diode 24, the electrode portion has an anode electrode portion 26 and a cathode electrode portion 28, and the connecting clips 18-1 and 18-2 are preferably connected to either the anode electrode portion 26 or the cathode electrode portion 28.

[0031] In the electronic module 10-4 according to an embodiment of the present invention, the connection clips 18-1 and 18-2 are connected to either the anode electrode portion 26 or the cathode electrode portion 28, so that a diode-equipped electronic module can be provided that is low noise and also has high heat dissipation properties.

[0032] (Fifth embodiment) 5A and 5B are diagrams illustrating a fifth embodiment in which a transistor is used in a semiconductor chip. FIG. 5A is a perspective view, FIG. 5B is a plan view, FIG. 5C is a cross-sectional view taken along line AA in FIG. 5B, and FIG. 5D is a cross-sectional view taken along line CC in FIG. 5B. In the electronic module 10-5, a transistor 30 has a source electrode portion 32, a drain electrode portion 34, and a gate electrode portion 36. The source electrode portion 32 has a , provided with recess 19 The connecting clip 18-1 is connected to the gate electrode portion 36, and the connecting clip 18-2 is connected to the gate electrode portion 36.

[0033] 5(A) to 5(D), in the electronic module 10-5, the semiconductor chip 12 is preferably a transistor 30 such as a MOSFET. In this case, the transistor 30 is, for example, a MOSFET having a source electrode portion 32 and a gate electrode portion 36 on one surface and a drain electrode portion 34 on the other surface. The connection clip 18-1 connects the wiring portion 16-3 and the source electrode portion 32, and the connection clip 18-2 connects the wiring portion 16-2 and the gate electrode portion 36.

[0034] The semiconductor chip 12 is a transistor 30, the electrodes of which include a source electrode 32, a drain electrode 34, and a gate electrode 36, and the connection clips 18-1 and 18-2 are connected to either the source electrode 32, the drain electrode 34, or the gate electrode 36, so that the connection clips 18-1 and 18-2 block electromagnetic noise generated by the transistor 30 and also dissipate heat generated by the transistor 30. This makes it possible to provide a transistor-mounted electronic module that is low noise and also has high heat dissipation properties.

[0035] In the electronic module 10-5 according to the embodiment of the present invention, for example, it is preferable to configure the gate electrode section 36 and the wiring section 16-2 so that they are connected by a conductive member set to a predetermined resistance value.

[0036] Since the gate electrode section 36 and the wiring section 16-2 are electrically connected by a conductive member set to a predetermined resistance value, even if electromagnetic noise is superimposed between the gate electrode section 36 and the source electrode section 32, the conductive member set to a predetermined resistance value converts the electromagnetic noise into heat, thereby reducing the electromagnetic noise. This makes it possible to provide an electronic module that can prevent malfunctions.

[0037] (Sixth embodiment) Regarding the embodiment of the present invention, the description of the parts common to the first embodiment etc. will be omitted. Only the characteristic parts of this embodiment will be described without drawing.

[0040] Electronic module according to an embodiment of the present invention To In this case, for example, semiconductor chips Go to Connection Click P's It is preferable that a part or the whole of the insulating resin is exposed.

[0041] Semiconductor chip Go to Connection Click P's Part or all but Insulation tree Fat? Exposure If we configure it as follows: , connection click P's Physical conditions, including electrical potential and temperature conditions, can be inspected, and electronic modules can be inspected. Lu's The user can process the exposed portion as needed.

[0042] (Seventh embodiment) The above-described embodiment Child Module To In this case, for example, a part of the insulating resin 38 is an electromagnetic wave absorbing resin having an electromagnetic wave absorbing function, and the electromagnetic wave absorbing resin is preferably provided on the connection clips 18-1 and 18-2.

[0043] A portion of the insulating resin 38 is an electromagnetic wave absorbing resin that has an electromagnetic wave absorbing function, and since the electromagnetic wave absorbing resin is provided on the connecting clips 18-1 and 18-2, an electronic module with low loss, low noise, and high heat dissipation can be provided.

[0044] (Eighth embodiment) 1, the electronic module 10-2 shown in FIG. 2, the electronic module 10-3 shown in FIG. 3, or According to embodiment 6 Electronic Module To In this case, for example, the semiconductor chip 12 preferably includes silicon carbide, gallium nitride, gallium oxide, or diamond semiconductor.

[0045] The semiconductor chip 12 is made of one or more of silicon carbide, gallium nitride, gallium oxide, and diamond, which allows for high-speed operation with low loss and low noise, thereby providing an electronic module that is high-speed, low-loss, low-noise, and has high heat dissipation.

[0046] The above describes an embodiment of the present invention, but the present invention is not limited to the above-described embodiment and can also be applied to electronic modules equipped with multiple semiconductor chips, and various modifications and applications are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0047] 10-1, 10-2, 10-3, 10-4, 10-5, 10-6 Electronic Module 12 Semiconductor chips 14 PCB 16,16-1,16-2,16-3 Wiring section 18, 18-1, 18-2 Connection clip 19 Recess 20 Electrode section 22 Heat dissipation fin 24 Diode 26 Anode electrode part 28 Cathode electrode part 30 transistors 32 Source electrode 34 Drain electrode 36 Gate electrode part 38 Insulating resin

Claims

[Claim 1] A substrate, a first wiring portion, a second wiring portion, and a third wiring portion formed on the substrate; a diode having a first electrode portion and a second electrode portion formed on one surface and the other surface, respectively, the first electrode portion being directly connected to the first wiring portion of the substrate; a first connecting clip and a second connecting clip that connect the second wiring portion and the third wiring portion of the substrate to the second electrode portion of the diode at different positions on the other surface, respectively; an insulating resin that seals the semiconductor chip, the substrate, the wiring portion, and the connecting clip; An electronic module comprising: the second connecting clip is configured to be above the first connecting clip with a space therebetween and to cover the entire surface of the second electrode portion of the diode when viewed in a plan view; An electronic module comprising:

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