Manufacturing equipment

Abstract

To provide a manufacturing apparatus for an electronic component that can shorten the distance in which an operator is to travel to operate the manufacturing apparatus.SOLUTION: A manufacturing apparatus is a manufacturing apparatus for an electronic component. The electronic component is manufactured through a plurality of processes. The manufacturing apparatus includes a plurality of mechanisms, a housing, a first observation window, and a reception unit. Each of the plurality of mechanisms performs one of the processes included in the plurality of processes. The housing covers each of the plurality of mechanisms. The first observation window is provided in the housing and is switchable between a transparent state and an opaque state. The reception unit receives operation instructions for the manufacturing apparatus. The plurality of mechanisms are aligned in a predetermined direction. The first observation window and the reception unit are spaced apart from each other in the predetermined direction. When the first observation window is in an opaque state, the first observation window receives operation instructions.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a manufacturing apparatus, and more particularly to an apparatus for manufacturing electronic components. [Background technology]

[0002] Japanese Patent Application Laid-Open Publication No. 2022-13023 (Patent Document 1) discloses a resin molding device. This resin molding device includes a resin supply module, multiple compression molding modules, and a conveying module. In this resin molding device, the resin supply module, multiple compression molding modules, and conveying module are arranged in this order in one direction, and a display unit is provided on the conveying module. This resin molding device is operated via the display unit provided on the conveying module (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-13023 Summary of the Invention [Problem to be solved by the invention]

[0004] In the resin molding apparatus disclosed in Patent Document 1, for example, if an operator needs to operate the resin molding apparatus while located near the resin supply module, the operator must move from near the resin supply module to near the transfer module. In other words, the operator may need to move a long distance to operate the resin molding apparatus. However, Patent Document 1 does not disclose a means for solving this problem.

[0005] The present invention has been made to solve such problems, and its object is to provide a manufacturing apparatus that can shorten the distance that an operator must travel to operate the manufacturing apparatus for electronic components. [Means for solving the problem]

[0006] The manufacturing apparatus according to the present invention is an apparatus for manufacturing electronic components. Electronic components are manufactured through a plurality of processes. The manufacturing apparatus includes a plurality of mechanisms, a housing, a first observation window, and a reception unit. Each of the plurality of mechanisms performs one of the processes. The housing covers each of the plurality of mechanisms. The first observation window is provided in the housing and is switchable between a transparent state and an opaque state. The reception unit receives operation instructions for the manufacturing apparatus. The plurality of mechanisms are aligned in a predetermined direction. The first observation window and the reception unit are spaced apart from each other in the predetermined direction. When the first observation window is in an opaque state, the first observation window receives the operation instructions. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a manufacturing apparatus that can reduce the distance that an operator must travel to operate the manufacturing apparatus for electronic components. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a diagram schematically illustrating the front of the resin molding apparatus. [Figure 2] FIG. 2 is a diagram schematically illustrating a plan view of the interior of the resin molding device. [Figure 3] FIG. 2 is a diagram schematically illustrating a part of the cross section taken along the line III-III in FIG. [Figure 4] FIG. 4 is a diagram schematically illustrating a part of the cross section taken along line IV-IV in FIG. [Figure 5] 10A and 10B are diagrams for explaining state transitions of an observation window. [Figure 6] 10 is a flowchart showing the operation procedure of the observation window and the lighting device. [Figure 7] 10 is a flowchart showing the operation procedure of the locking mechanism and the lighting device. DETAILED DESCRIPTION OF THE INVENTION

[0009] An embodiment according to one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail below with reference to the drawings. Note that the same or corresponding parts in the drawings are designated by the same reference numerals, and their description will not be repeated. Furthermore, for ease of understanding, each drawing is drawn schematically with objects appropriately omitted or exaggerated.

[0010] [1. Configuration of manufacturing equipment] 1 is a diagram schematically showing the front of a resin molding apparatus 100 according to the present embodiment. The resin molding apparatus 100 is configured to resin-seal a substrate W (see FIG. 2) on which electronic components such as semiconductor chips are mounted, thereby producing a resin-molded product (e.g., a semiconductor device). In the resin molding apparatus 100, the component-mounting surface of the substrate W on which the electronic components are mounted is resin-sealed.

[0011] Examples of the substrate W include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, and ceramic substrates. The substrate W may be a carrier used in FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). The substrate W may or may not already have wiring applied thereto.

[0012] As shown in FIG. 1, the resin molding apparatus 100 includes a substrate supply / storage module A (hereinafter also simply referred to as "module A"), two resin molding modules B (hereinafter also simply referred to as "module B"), and a resin material supply module C (hereinafter also simply referred to as "module C"). Module A, the two modules B, and module C are arranged in this order along the X-axis direction. Each of the modules AC is detachable and replaceable with another module. Furthermore, in the resin molding apparatus 100, the number of modules AC can be increased or decreased.

[0013] In resin molding apparatus 100, a resin molded product is manufactured through a plurality of processes. Each of modules AC includes a mechanism for performing at least one of the plurality of processes, as will be described in detail later. Resin molding apparatus 100 is entirely covered by housing 15, and in each of modules AC, housings 15A-15C, which are parts of housing 15, cover the mechanism.

[0014] A reception unit 10 is provided on the front side of module A. The reception unit 10 is configured with a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor, and has a touch panel function. An operator of the resin molding apparatus 100 can operate each of modules AC, for example, through the reception unit 10.

[0015] A rectangular door 20 is provided on the front of each housing 15 of the module AC. A handle 40 is provided on the front of each door 20. Each door 20 is a hinged door or a double-door (double-door). The rotation axis of each door 20 extends in the Z-axis direction. An operator can open the door 20 by pulling the handle 40.

[0016] Each door 20 is provided with an observation window 30. As will be described in detail later, the observation window 30 can be switched between a transparent state and an opaque state. When the observation window 30 is in the transparent state, the operator can observe the inside of the housing 15 through the observation window 30. On the other hand, when the observation window 30 is in the opaque state, the operation screen of the resin molding apparatus 100 is displayed on the observation window 30. When the observation window 30 is in the opaque state, the operator can give operation instructions to the resin molding apparatus 100 through the observation window 30. Note that each door 20 is separated from the reception unit 10 in the X-axis direction.

[0017] 2 is a diagram schematically illustrating a plan view of the interior of resin molding apparatus 100 according to the present embodiment. As shown in FIG. 2, resin molding apparatus 100 includes module A, two modules B, module C, and controller 200.

[0018] Module A includes a substrate supply unit 1, a substrate storage unit 2, a substrate placement unit 3, and a substrate transport mechanism 4. The substrate supply unit 1 is configured to supply a substrate W before resin sealing (hereinafter also referred to as a "pre-sealed substrate") onto the substrate placement unit 3. The substrate storage unit 2 is configured to store a substrate W (a resin molded product) that has already been sealed with resin (hereinafter also referred to as a "sealed substrate"). The substrate placement unit 3 is configured to move in the Y-axis direction between a position corresponding to the substrate supply unit 1 and a position corresponding to the substrate storage unit 2. The substrate transport mechanism 4 is configured to move in the X-axis direction and the Y-axis direction in module A and each module B. The substrate transport mechanism 4, for example, holds a pre-sealed substrate W on the substrate placement unit 3, transports it to module B, and places the sealed substrate W on the substrate placement unit 3.

[0019] Each module B includes a compression molding unit 5. The compression molding unit 5 is configured to manufacture an encapsulated substrate W (a resin molded product) by compression molding. A granular resin material P having thermosetting properties is used in this compression molding. The resin material P may be a thermoplastic resin material. The resin material P may also be a liquid resin. The compression molding unit 5 includes a molding die 50 and a clamping mechanism 53. The molding die 50 includes an upper die 52 and a lower die 51. The upper die 52 and the lower die 51 are arranged opposite each other in the Z-axis direction. An observation window 30B (FIG. 1) is arranged in front of (on the near side of) the molding die 50. The clamping mechanism 53 raises the lower die 51, thereby clamping the molding die 50.

[0020] A cavity 51C is formed in the upper surface of the lower mold 51. A film (release film) on which resin material P is placed is placed in the cavity 51C. A substrate W is placed on the lower surface of the upper mold 52. With the film on which resin material P is placed placed in the cavity 51C of the lower mold 51 and the substrate W placed on the lower surface of the upper mold 52, the molding die 50 is clamped. As a result, the component mounting surface of the substrate W is sealed with resin.

[0021] Module C includes a moving table 6, a resin material storage unit 7, a resin material supply mechanism 8, a release film supply unit (not shown), and a resin material transport mechanism 9. The moving table 6 is configured to move in module C in the X-axis direction and the Y-axis direction.

[0022] The resin material accommodation unit 7 includes a film and a frame-shaped member (not shown) placed on the upper surface of the film. A space (recess 71) corresponding to the size of the cavity 51C of the lower mold 51 is formed in the resin material accommodation unit 7. The resin material accommodation unit 7 is placed on the moving table 6. The resin material supply mechanism 8 is configured to supply the resin material P to the resin material accommodation unit 7 from above the resin material accommodation unit 7. The resin material P dropping from the discharge port of the resin material supply mechanism 8 is spread evenly in the recess 71 of the resin material accommodation unit 7 by the moving table 6 moving relative to the discharge port of the resin material supply mechanism 8.

[0023] The resin material conveying mechanism 9 is configured to move in the X-axis direction and the Y-axis direction in module C and module B. The resin material conveying mechanism 9 is configured to convey the resin material containing section 7 containing the resin material P to the lower mold 51 and supply the resin material P to the cavity 51C of the lower mold 51. In the resin molding apparatus 100, one or more mechanisms included in each module are lined up in the X-axis direction.

[0024] The controller 200 is configured to control the entire resin molding apparatus 100. The controller 200 controls, for example, module A, two modules B, and module C. The controller 200 includes, for example, a hardware processor such as a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory), and is configured to execute information processing based on programs and various data. The controller 200 may be located anywhere within the resin molding apparatus 100, and may be configured by multiple controllers.

[0025] Fig. 3 is a diagram schematically showing a part of the cross section taken along line III-III in Fig. 1. Referring to Fig. 3, the structure around door 20 is substantially the same in each of modules A and C. Here, the structure around door 20B included in module B will be described as a representative example.

[0026] As described above, the door 20B can be opened and closed. In the housing 15B, a locking mechanism 65 is provided at a position facing the tip surface of the door 20B when the door 20B is closed. The locking mechanism 65 is configured to switch the door 20B between a locked state and an unlocked state in accordance with a control signal transmitted from the controller 200 (see FIG. 2), for example. When the door 20B is in the locked state, the door 20B cannot be opened, and when the door 20B is in the unlocked state, the door 20B can be opened. When the door 20B is in the unlocked state, the operator can pull the handle 40 to open the door 20B.

[0027] Illumination devices 60A and 60B are provided inside the housing 15B to illuminate the observation window 30 from inside the housing 15B. The illumination devices 60A and 60B are respectively provided near one of the four sides of the door 20 that faces side SD1 and near side SD1. Side SD1 is, for example, a side on which a hinge connecting the door 20B to the housing 15B is provided, and is also a side of the four sides of the door 20B that is considered to be the axis of rotation of the door 20B. Each illumination device 60 is, for example, configured with an LED (Light Emitting Diode) illumination. For example, when the observation window 30 is in an opaque state, each illumination device 60 emits light to illuminate the observation window 30. This reduces the difficulty in viewing the display screen caused by reflection of ambient light on the outer surface of the observation window 30. Control of each illumination device 60 will be described in detail later.

[0028] FIG. 4 is a schematic diagram showing a portion of the cross section taken along line IV-IV in FIG. 3. As shown in FIG. 4, the observation window 30 includes a touch panel 31, a display 32, and a heat insulating plate 33. The touch panel 31 is configured to receive operation instructions for the resin molding apparatus 100 from an operator. The display 32 is configured by a display device that can switch between a transparent state and an opaque state. The display 32 can be realized by various known display devices. The heat insulating plate 33 is configured by a transparent plate, for example, an acrylic plate, that can insulate heat generated in each mechanism of the resin molding apparatus 100 inside the housing 15.

[0029] In the observation window 30, the touch panel 31, the display 32, and the heat insulating plate 33 are arranged in this order from the outside to the inside of the resin molding apparatus 100. In this way, in the observation window 30, the heat insulating plate 33 is arranged inside the display 32. According to the resin molding apparatus 100, since the heat insulating plate 33 is arranged between the mechanism arranged in the housing 15 and the display 32, deterioration of the display 32 can be suppressed even if the temperature of the mechanism rises and the temperature inside the housing 15 becomes high.

[0030] The touch panel 31 and the display 32 are fixed to each other, for example, by adhesive 35 at their peripheral edges. The bezel BZ1 is a frame member that covers the observation window 30 from the sides and includes a first portion BZ10 that forms the front surface of the bezel BZ1 and a second portion BZ11 that extends rearward from the first portion BZ10. An opening H1 that penetrates the bezel BZ1 in the front-to-rear direction (Y-axis direction (see FIG. 1)) is formed in the center of the bezel BZ1. An operator operates the resin molding apparatus 100 through the touch panel 31 exposed through the opening H1. A boss BS1 is welded to the rear surface of the first portion BZ10. The bezel BZ1 and a clamper CL1 are connected to each other by inserting a bolt (not shown) into the boss BS1. The observation window 30 is fixed to the housing 15 by sandwiching the peripheral edge of the observation window 30 between the bezel BZ1 and the clamper CL1 via cushions CS1 and CS2. In the example shown in FIG. 4, the touch panel 31 and the display 32 are fixed with adhesive 35 so as to leave a space between them, but they may be fixed so as not to leave a space between them.

[0031] As described above, the heat insulating plate 33 is located further inside the resin molding apparatus 100 than the display 32. The heat insulating plate 33 is fixed to the second part BZ11 of the bezel BZ1 without contacting the surface of the display 32. In this way, by providing a space between the heat insulating plate 33 and the display 32 (and the touch panel 31), the heat insulating effect can be further improved.

[0032] Referring again to FIG. 3, a control board SS1 is disposed inside the housing 15B and near side SD1 of the door 20B. A control device CP1 is mounted on the control board SS1. The control device CP1 includes a CPU, RAM, ROM, etc., and is configured to control each of the touch panel 31 and the display 32. The control device CP1 is configured to communicate with, for example, the controller 200. The touch panel 31 and the display 32 are electrically connected to the control board SS1 by a wiring group L1. The wiring group L1 is concentrated near side SD1 of the four sides of the door 20B. Therefore, according to the resin molding apparatus 100, even when the door 20B is opened, the change in the distance between the observation window 30B and the control board SS1 is relatively small, and therefore the length of each wiring can be shortened compared to, for example, when the wiring is concentrated near one of the four sides of the door 20B other than side SD1.

[0033] [2. Operation through the observation window] As described above, the resin molding apparatus 100 according to this embodiment includes module A, two modules B, and module C. Module A, the two modules B, and module C are aligned in the X-axis direction, and the length of the resin molding apparatus 100 in the X-axis direction is long. Suppose that in the resin molding apparatus 100, each observation window 30 is simply made of an acrylic plate, and it is not possible to give instructions to operate the resin molding apparatus 100 through the observation window 30. In this case, if an operator needs to operate the resin molding apparatus 100 while positioned near module C, the operator must move from near module C to near module A. In other words, operating the resin molding apparatus 100 requires moving a long distance.

[0034] In resin molding apparatus 100 according to the present embodiment, when observation window 30 is in an opaque state, observation window 30 accepts operation instructions for resin molding apparatus 100. Therefore, according to resin molding apparatus 100, for example, when an operator of resin molding apparatus 100 is observing the manufacturing state of electronic components such as resin molded products through observation window 30 in a transparent state, the operator can switch observation window 30 from the transparent state to the opaque state, thereby allowing the operator to issue operation instructions for resin molding apparatus 100. In other words, according to resin molding apparatus 100 according to the present embodiment, the operator can issue operation instructions for resin molding apparatus 100 without moving to the position of reception unit 10.

[0035] Fig. 5 is a diagram illustrating the state transition of the observation window 30. With reference to Fig. 5, when the observation window 30 is in the transparent state, the operator can observe the inside of the housing 15 through the observation window 30. When the observation window 30 is in the transparent state, for example, if the operator touches the observation window 30 (touch panel 31) with a finger and slides the finger upward (swipe up), the observation window 30 switches from the transparent state to the opaque state (opaque state A).

[0036] In the non-transparent state A, the observation window 30 displays, for example, one or more windows WD1. Each window WD1 displays, for example, information relating to the current state of the resin molding apparatus 100. Examples of information displayed in each window WD1 include the flow rate and flow rate when the resin material P is sprayed, the temperature, pressure, and vacuum pressure of the molding die 50, and the temperature of the heater that heats the molding die 50. In the non-transparent state A, the observation window 30 may display an operation panel, which will be described later.

[0037] When the observation window 30 is in the opaque state A, for example, if the operator touches the observation window 30 (touch panel 31) with a finger and slides the finger to the left (left swipe), the observation window 30 switches from the opaque state A to the opaque state B. For example, one or more windows WD1 are displayed on the observation window 30 in the opaque state B. Each window WD1 displays, for example, an operation panel of the resin molding apparatus 100. The operator can operate the resin molding apparatus 100 by touching the operation panel. Information regarding the current state of the resin molding apparatus 100 described above may be displayed on the observation window 30 in the opaque state B. Furthermore, two screens (opaque states A and B) do not necessarily need to be provided for the opaque states; only one screen may be provided for the opaque states, or three or more screens may be provided for the opaque states.

[0038] Furthermore, window WD1 displayed in observation window 30 in non-transparent states A and B may display an image for advertising resin molding apparatus 100 (such as an image showing at least part of the device name, model number, and manufacturer name of resin molding apparatus 100). According to resin molding apparatus 100 according to this embodiment, an image for advertising resin molding apparatus 100 is displayed in observation window 30, so that resin molding apparatus 100 can be advertised to potential users who are viewing resin molding apparatus 100, for example.

[0039] Furthermore, the window WD1 displayed on the observation window 30 in the non-transparent states A and B may display the name and photo of the operator of the resin molding apparatus 100, the type of resin molded product being produced or the type of substrate W, the frame size and resin model, memos, a calendar, shift work, production schedule, production results, and information regarding cleaning times. Conventionally, this information has been shared by attaching handwritten notes to the apparatus, etc. Displaying this information in the window WD1 displayed on the observation window 30 in the non-transparent states A and B can reduce the hassle of attaching handwritten notes to the apparatus, etc.

[0040] When the observation window 30 is in the opaque state B, if the operator, for example, touches the observation window 30 (touch panel 31) with a finger and slides the finger to the right (swipe right), the observation window 30 switches from the opaque state B to the opaque state A. When the observation window 30 is in the opaque state A or the opaque state B, if the operator, for example, touches the observation window 30 (touch panel 31) with a finger and slides the finger downward (swipe down), the observation window 30 switches from the opaque state to the transparent state. Note that the screen displayed on the observation window 30 in the opaque states A and B is an example of an "operation screen." Furthermore, the operation method for transitioning the state of the observation window 30 is merely an example.

[0041] [3. Operation of manufacturing equipment] 6 is a flowchart showing the operation procedure of the observation window 30 and the illumination device 60. The process shown in this flowchart is executed by the controller 200 at predetermined intervals when the observation window 30 is in the transmissive state.

[0042] 6, the controller 200 determines whether or not an instruction to switch the observation window 30 from the transparent state to the opaque state has been received (step S100). Specifically, the controller 200 determines whether or not a signal indicating that the touch panel 31 has received a swipe-up operation by the operator has been received from the control device CP1. If it is determined that an instruction to switch the observation window 30 from the transparent state to the opaque state has not been received (NO in step S100), the controller 200 repeats the processing of step S100 until an instruction to switch the observation window 30 from the transparent state to the opaque state is received.

[0043] On the other hand, when it is determined that an instruction to switch the observation window 30 from the transmissive state to the opaque state has been received (YES in step S100), the controller 200 transmits a signal to the control device CP1 to instruct the control device CP1 to switch the display 32 from the transmissive state to the opaque state and to display an operation screen on the display 32 (step S110). In addition, the controller 200 controls each lighting device 60 to turn on.

[0044] Thereafter, the controller 200 determines whether or not an instruction to switch the observation window 30 from the opaque state to the transparent state has been received (step S120). Specifically, the controller 200 determines whether or not a signal indicating that the touch panel 31 has received a swipe-down operation by the operator has been received from the control device CP1. If it is determined that an instruction to switch the observation window 30 from the opaque state to the transparent state has not been received (NO in step S120), the controller 200 repeats a predetermined process until an instruction to switch the observation window 30 from the opaque state to the transparent state is received. Here, the predetermined process refers to a process of switching the state of the observation window 30 between the opaque states A and B in accordance with the operation received from the operator.

[0045] On the other hand, if it is determined that an instruction to switch the observation window 30 from the opaque state to the transmissive state has been received (YES in step S120), the controller 200 transmits a signal to the control device CP1 instructing the control device CP1 to switch the display 32 from the opaque state to the transmissive state (step S110). In addition, the controller 200 controls each lighting device 60 to turn off.

[0046] In resin molding apparatus 100 according to the present embodiment, illumination device 60 is turned off in response to switching of observation window 30 from the opaque state to the transmissive state. Therefore, according to resin molding apparatus 100, illumination device 60 does not emit light toward the operator when observation window 30 is in the transmissive state, and therefore, deterioration in visibility inside housing 15 can be suppressed compared to when illumination device 60 emits light toward the operator when observation window 30 is in the transmissive state.

[0047] 7 is a flowchart showing the operation procedure of the locking mechanism 65 and the lighting device 60. The processing shown in this flowchart is executed by the controller 200 at a predetermined interval when the door 20 is in a locked state and the observation window 30 is in an opaque state.

[0048] 7, controller 200 determines whether or not an instruction to switch door 20 from a locked state to an unlocked state has been received (step S200). Specifically, controller 200 determines whether or not an unlock instruction from the operator has been received via reception unit 10 or observation window 30. If it is determined that an instruction to switch door 20 from a locked state to an unlocked state has not been received (NO in step S200), controller 200 repeats the processing of step S200 until an instruction to switch door 20 from a locked state to an unlocked state is received.

[0049] On the other hand, if it is determined that an instruction to switch the door 20 from the locked state to the unlocked state has been received (YES in step S200), the controller 200 controls the locking mechanism 65 to switch from the locked state to the unlocked state, and also controls each lighting device 60 to turn off (step S210).

[0050] Thereafter, the controller 200 determines whether or not an instruction to switch the door 20 from the unlocked state to the locked state has been received (step S220). Specifically, the controller 200 determines whether or not a lock instruction from the operator has been received via the reception unit 10 or the observation window 30. If it is determined that an instruction to switch the door 20 from the unlocked state to the locked state has not been received (NO in step S220), the controller 200 repeats the processing of step S220 until an instruction to switch the door 20 from the unlocked state to the locked state is received.

[0051] On the other hand, if it is determined that an instruction to switch the door 20 from the unlocked state to the locked state has been received (YES in step S220), the controller 200 controls the locking mechanism 65 to switch from the unlocked state to the locked state, and also controls each lighting device 60 to turn on (step S230).

[0052] In resin molding apparatus 100 according to the present embodiment, when observation window 30 is in an opaque state, lighting device 60 is turned off in response to door 20 being switched from a locked state to an unlocked state. Therefore, according to resin molding apparatus 100, lighting device 60 does not emit light toward the operator when door 20 is open, and therefore, a decrease in visibility inside housing 15 can be suppressed compared to when lighting device 60 emits light toward the operator when door 20 is open.

[0053] [4. Features] As described above, in the resin molding apparatus 100 according to the present embodiment, when the observation window 30 is in an opaque state, the observation window 30 receives operation instructions for the resin molding apparatus 100. Therefore, according to the resin molding apparatus 100, for example, when an operator of the resin molding apparatus 100 is observing the manufacturing state of an electronic component such as a resin molded product through the observation window 30 in a transparent state, the operator can switch the observation window 30 from the transparent state to the opaque state, thereby allowing the operator to issue operation instructions for the resin molding apparatus 100. In other words, according to the resin molding apparatus 100, the operator can issue operation instructions for the resin molding apparatus 100 without moving to the position of the reception unit 10.

[0054] 5. Other Embodiments The concept of the above embodiment is not limited to the embodiment described above. Hereinafter, examples of other embodiments to which the concept of the above embodiment can be applied will be described.

[0055] <5-1> In the above embodiment, the technology enabling device operation instructions through an observation window is applied to a compression molding resin molding device. However, the scope of application of the present technology is not limited thereto. For example, the present technology may be applied to a transfer molding or injection molding resin molding device or a cutting device. The cutting device, for example, cuts a package substrate (object to be cut) to separate the package substrate into multiple electronic components (package components). In the package substrate, a substrate or lead frame on which a semiconductor chip is mounted is resin-sealed. Note that the object to be cut does not necessarily have to be a package substrate and may be, for example, a substrate (including a wafer) that is not resin-sealed. Substrates that are separated by cutting an unsealed substrate are also included in the "electronic component." The present technology may also be applied to a wafer cleaning device, a coater / developer, an annealing device, a film thickness measurement device, a wafer appearance inspection device, an exposure device, a film formation device, a bonding device, and the like.

[0056] <5-2> In the above embodiment, the reception unit 10 is configured as a display device such as a liquid crystal monitor or an organic EL monitor. However, the configuration of the reception unit 10 is not limited to this. The reception unit 10 may be configured as, for example, an observation window 30. In this case, the operator can observe the manufacturing state of electronic components such as resin molded products through the reception unit 10 in a transparent state, and can give operating instructions for the resin molding apparatus 100 through the reception unit 10 in an opaque state.

[0057] <5-3> In the above embodiment, the resin molding apparatus 100 is configured with a plurality of modules. However, the resin molding apparatus 100 does not necessarily have to be configured with a plurality of modules. Each mechanism included in the module AC may be included in a single housing.

[0058] <5-4> In the above embodiment, the observation window 30 provided in each module includes a touch panel 31 and a display 32. However, the configuration of the observation window 30 provided in each module is not necessarily limited to this. For example, the observation window 30 provided in some modules may be configured only with an acrylic plate. It is sufficient that at least one observation window 30 of the multiple observation windows 30 provided in the resin molding apparatus 100 includes a touch panel 31 and a display 32.

[0059] <5-5> In the above embodiment, the reception unit 10 or the observation window 30 is provided on the front side of the resin molding apparatus 100. However, the reception unit 10 or the observation window 30 may be provided on the side and / or rear side of the resin molding apparatus 100.

[0060] <5-6> In the above embodiment, the door 20 is a hinged door or a double door (double swing door). However, the door 20 may be a door of any type, for example, a flip-up door.

[0061] The above describes exemplary embodiments of the present invention. That is, the detailed description and the accompanying drawings are disclosed for the purpose of illustrative explanation. Therefore, some of the components described in the detailed description and the accompanying drawings may be non-essential components for solving the problems. Therefore, just because these non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately recognized that these non-essential components are essential.

[0062] Furthermore, the above-described embodiments are merely illustrative of the present invention in all respects. Various improvements and modifications to the above-described embodiments are possible within the scope of the present invention. For example, at least a portion of the configuration of any of the embodiments may be combined with at least a portion of the configuration of any of the other embodiments. In other words, when implementing the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0063] [6. Notes] <Technology 1> (composition) An apparatus for manufacturing electronic components, The electronic component is manufactured through a plurality of processes, a plurality of mechanisms each performing any one of the steps included in the plurality of steps; a housing that covers each of the plurality of mechanisms; a first observation window provided in the housing and switchable between a transmission state and a non-transmission state; a reception unit that receives an operation instruction for the manufacturing device, the plurality of mechanisms are arranged in a predetermined direction, the first observation window and the reception unit are spaced apart from each other in the predetermined direction, When the first observation window is in the opaque state, the first observation window accepts the operation instruction. (Effects, etc.) In this manufacturing apparatus, when the first observation window is in an opaque state, the first observation window accepts operation instructions for the manufacturing apparatus. Therefore, with this manufacturing apparatus, for example, when an operator of the manufacturing apparatus is observing the manufacturing state of an electronic component through the first observation window in a transparent state, the operator can issue operation instructions for the manufacturing apparatus by switching the first observation window from the transparent state to the opaque state. In other words, with this manufacturing apparatus, the operator can issue operation instructions for the manufacturing apparatus without moving to the position of the reception unit.

[0064] <Technology 2> (composition) The manufacturing apparatus according to Technology 1, wherein when the first observation window is in the opaque state, the first observation window displays an operation screen of the manufacturing apparatus. (Effects, etc.) According to this manufacturing apparatus, an operation screen of the manufacturing apparatus is displayed on the first observation window, so that the operator can give instructions to operate the manufacturing apparatus through the operation screen.

[0065] <Technology 3> (composition) The manufacturing apparatus according to Art 2, wherein the operation screen includes an image for advertising the manufacturing apparatus. (Effects, etc.) According to this manufacturing apparatus, an image for advertising the manufacturing apparatus is displayed in the first observation window, so that the manufacturing apparatus can be advertised to potential users who are touring the manufacturing apparatus, for example.

[0066] <Technology 4> (composition) The manufacturing apparatus according to any one of Technology 1 to Technology 3, wherein the first observation window includes a display that can be switched between the transmissive state and the opaque state, and a touch panel arranged outside the display. (Effects, etc.) According to this manufacturing device, it is possible to switch the first observation window between a transmissive state and a non-transmissive state, and to issue operating instructions for the manufacturing device through the first observation window.

[0067] <Technology 5> (composition) The manufacturing apparatus according to technique 4, wherein the first observation window further includes a heat insulating plate disposed inside the display. (Effects, etc.) According to this manufacturing device, since a heat insulating plate is disposed inside the display at the first observation window, deterioration of the display can be suppressed even if the temperature inside the housing becomes high.

[0068] <Technology 6> (composition) Further, a control board on which a first control device for controlling the display is mounted is provided, The housing includes a rectangular door; the first observation window is provided in the door, The manufacturing apparatus according to Technology 4 or Technology 5, wherein the wiring connecting the display and the control board is concentrated near one of the four sides of the door that is considered to be the axis of rotation. (Effects, etc.) In this manufacturing device, the wiring connecting the display and the control board is concentrated near one of the four sides of the door that is considered to be the axis of rotation. Therefore, with this manufacturing device, the change in the distance between the display and the control board is relatively small even when the door is opened, so the length of the wiring can be shortened compared to, for example, when the wiring is concentrated near an edge other than the edge that is considered to be the axis of rotation.

[0069] <Technology 7> (composition) an illumination device that illuminates the first observation window from inside the housing; a second control device that controls the lighting device; The manufacturing apparatus according to any one of techniques 1 to 6, wherein the second control device controls the lighting device to turn off in response to the first observation window being switched from the opaque state to the transparent state. (Effects, etc.) In this manufacturing apparatus, the illumination device is turned off in response to the first observation window being switched from the opaque state to the transmissive state. Therefore, with this manufacturing apparatus, the illumination device does not emit light toward the operator when the first observation window is in the opaque state, which makes it possible to suppress a decrease in visibility inside the housing compared to when the illumination device emits light toward the operator when the first observation window is in the opaque state.

[0070] <Technology 8> (composition) an illumination device that illuminates the first observation window from inside the housing; a second control device that controls the lighting device; The door can be switched between a locked state and an unlocked state, The manufacturing apparatus described in Technology 6, wherein the second control device controls the lighting device to turn off when the first observation window is in the opaque state in response to the door being switched from the locked state to the unlocked state. (Effects, etc.) In this manufacturing apparatus, when the first observation window is in the opaque state, the lighting device is turned off in response to the door being switched from the locked state to the unlocked state. Therefore, with this manufacturing apparatus, since the lighting device does not emit light toward the operator when the door is open, it is possible to suppress a decrease in visibility inside the housing compared to when the lighting device emits light toward the operator when the door is open.

[0071] <Technology 9> (composition) the reception unit is configured with a second observation window, the second observation window is provided in the housing and is switchable between a transmissive state and a non-transmissive state; The manufacturing apparatus according to any one of Techniques 1 to 8, wherein the second observation window accepts the operation instruction when the second observation window is in the non-transparent state. (Effects, etc.) In this manufacturing apparatus, the reception unit is configured as a second observation window, and therefore, with this manufacturing apparatus, an operator can observe the manufacturing state of the electronic component through the second observation window in a transparent state, and can give operating instructions to the manufacturing apparatus through the second observation window in an opaque state.

[0072] <Technology 10> (composition) The manufacturing apparatus according to any one of Techniques 1 to 9, wherein the electronic component is a semiconductor device. (Effects, etc.) According to this manufacturing apparatus, for example, when an operator of the manufacturing apparatus is observing the manufacturing state of a semiconductor device through a first observation window in a transparent state, the operator can switch the first observation window from the transparent state to an opaque state, thereby allowing the operator to give operating instructions to the manufacturing apparatus. [Explanation of symbols]

[0073] 1 substrate supply section, 2 substrate storage section, 3 substrate placement section, 4 substrate transport mechanism, 5 compression molding section, 6 moving table, 7 resin material storage section, 8 resin material supply mechanism, 9 resin material transport mechanism, 10 reception section, 15 housing, 20 door, 30 observation window, 31 touch panel, 32 display, 33 heat insulating plate, 35 adhesive, 40 handle, 50 molding die, 51 lower die, 51C cavity, 52 upper die, 53 mold clamping mechanism, 60 lighting device, 65 locking mechanism, 100 resin molding device, 200 controller, A substrate supply / storage module, B resin molding module, BS1 boss, BZ1 bezel, BZ10 first part, BZ11 second part, C resin material supply module, CL1 clamper, CP1 control device, CS1, CS2 cushion, H1 opening, L1 Wiring group, P resin material, SD1 side, SS1 control board, W board, WD1 window.

Claims

1. An apparatus for manufacturing electronic components, the manufacturing apparatus is a resin molding apparatus including a molding die for resin sealing, The electronic component is a resin-molded product that has been sealed with resin and is manufactured through a plurality of processes, a plurality of mechanisms each performing any one of the steps included in the plurality of steps; a housing that covers each of the plurality of mechanisms; a first observation window provided in the housing and switchable between a transmission state and a non-transmission state; a reception unit that receives an operation instruction for the manufacturing device, any one of the plurality of mechanisms includes the molding die; the plurality of mechanisms are arranged in a predetermined direction, the first observation window and the reception unit are spaced apart from each other in the predetermined direction, When the first observation window is in the opaque state, the first observation window is configured to receive the operation instruction and display information about a current state of the manufacturing apparatus, The information regarding the current state of the manufacturing apparatus includes information regarding at least one of the flow rate when spraying resin material into the molding mold, the flow rate when spraying resin material into the molding mold, the temperature of the molding mold, the pressure of the molding mold, the vacuum pressure of the molding mold, and the temperature of a heater that heats the molding mold.

2. The manufacturing apparatus according to claim 1 , wherein the first observation window displays an operation screen of the manufacturing apparatus when the first observation window is in the non-transparent state.

3. The manufacturing apparatus according to claim 2 , wherein the operation screen includes an image for advertising the manufacturing apparatus.

4. The manufacturing apparatus according to claim 1 , wherein the first observation window includes a display that can be switched between the transmissive state and the opaque state, and a touch panel that is disposed outside the display.

5. The manufacturing apparatus according to claim 4 , wherein the first observation window further includes a heat insulating plate disposed inside the display.

6. a control board on which a first control device for controlling the display is mounted; The housing includes a rectangular door; the first observation window is provided in the door, 5. The manufacturing apparatus according to claim 4, wherein wiring connecting the display and the control board is concentrated in the vicinity of one of the four sides of the door that is regarded as the axis of rotation.

7. an illumination device that illuminates the first observation window from inside the housing; a second control device that controls the lighting device, The manufacturing apparatus according to claim 1 , wherein the second control device controls the lighting device to turn off in response to the first observation window being switched from the opaque state to the transmissive state.

8. an illumination device that illuminates the first observation window from inside the housing; a second control device that controls the lighting device, The door can be switched between a locked state and an unlocked state, 7. The manufacturing apparatus of claim 6, wherein the second control device controls the lighting device to turn off when the door is switched from the locked state to the unlocked state when the first observation window is in the opaque state.

9. the reception unit is configured with a second observation window, the second observation window is provided in the housing and is switchable between the transmissive state and the opaque state; The manufacturing apparatus according to claim 1 , wherein the second observation window accepts the operation instruction when the second observation window is in the non-transparent state.

10. The manufacturing apparatus according to claim 1 , wherein the electronic component is a semiconductor device.

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