resin composition

Abstract

To provide a resin composition which has good dielectric characteristics, peeling resistance, and heating resistance.SOLUTION: A resin composition contains a resin mixture (A), a liquid rubber resin (B), an inorganic filler (C), a catalyst (D), and a siloxane coupling agent (E). The resin mixture (A) contains a bismaleimide resin.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a resin composition.

Background Art

[0002] In recent years, with the development of the fifth-generation mobile communication technology (5th Generation Mobile Network, commonly known as 5G), the demand for copper-clad laminate materials capable of high-capacity data transmission has also been increasing. To pursue high-speed transmission, by reducing the surface roughness of the copper foil (for example, making Rz less than 0.5 micrometers), good signal transmission performance at high frequencies can be obtained. However, when the surface roughness of the copper foil decreases, the physical adhesion to the circuit board in the laminated structure may decrease (for example, the peel strength is less than 2 lb / in). Therefore, a solution to solve the above problems is urgently needed.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The present invention provides a resin composition having good dielectric properties, peel resistance, and heat resistance.

Means for Solving the Problems

[0004] The resin composition of the present invention includes a resin mixture (A), a liquid rubber resin (B), an inorganic filler (C), a catalyst (D), and a siloxane coupling agent (E). The resin mixture (A) includes a bismaleimide resin.

[0005] In one embodiment of the present invention, the bismaleimide resin includes a bismaleimide-modified olefin resin, a bismaleimide-modified polyphenylene ether resin, a bismaleimide-modified dicyclopentadiene resin, or a combination thereof.

[0006] In one embodiment of the present invention, the bismaleimide resin further includes a biphenyl-based bismaleimide resin.

[0007] In one embodiment of the present invention, the weight-average molecular weight of the bismaleimide resin is 500 g / mol to 5000 g / mol.

[0008] In one embodiment of the present invention, the amount of resin mixture (A) used is 10 to 30 parts by weight per 100 parts by weight of the total amount of the resin composition used.

[0009] In one embodiment of the present invention, the liquid rubber resin (B) includes LDM-02, LF-310T50, COD-103, a divinylbenzene-containing polymer, or a combination thereof.

[0010] In one embodiment of the present invention, the inorganic filler (C) includes silica.

[0011] In one embodiment of the present invention, the inorganic filler (C) includes surface-modified silica having acrylic groups or vinyl groups.

[0012] In one embodiment of the present invention, the median particle size of the inorganic filler (C) is 0.3 micrometers to 3.0 micrometers.

[0013] In one embodiment of the present invention, the siloxane coupling agent (E) comprises a vinylsilane compound, an acrylicsilane, or a combination thereof.

[0014] In one embodiment of the present invention, with respect to 100 parts by weight of the total amount of the resin composition, the amount of liquid rubber resin (B) used is 30 to 50 parts by weight, the amount of inorganic filler (C) used is 25 to 50 parts by weight, the amount of catalyst (D) used is 0.1 to 2 parts by weight, and the amount of siloxane coupling agent (E) used is 0.1 to 5 parts by weight. [Effects of the Invention]

[0015] Based on the above, the resin composition of the present invention comprises a resin mixture (A), a liquid rubber resin (B), an inorganic filler (C), a catalyst (D), and a siloxane coupling agent (E). Here, the resin mixture (A) comprises a bismaleimide resin. As a result, the resin composition has good dielectric properties, peel resistance, and heat resistance.

[0016] To make the above-mentioned features and advantages of the present invention clearer and easier to understand, examples are shown below, and their details are described below. [Modes for carrying out the invention]

[0017] The following are examples illustrating the content of the present invention in more detail. The implementation details provided in the embodiments are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. Anyone skilled in the art can modify or change these implementation details as needed for actual implementations.

[0018] In this specification, the range expressed as "from one number to another number" is a summary expression to avoid listing every single number within that range in the specification. Therefore, the description of a particular numerical range includes any number within that range and any smaller numerical range bounded by any number within that range, just as any number and a smaller numerical range are described in the explanatory text of the specification.

[0019] <Resin composition>

[0020] The present invention provides a resin composition comprising a resin mixture (A), a liquid rubber resin (B), an inorganic filler (C), a catalyst (D), and a siloxane coupling agent (E). Furthermore, the resin composition of the present invention may optionally contain other additives. The various components described above will be explained in detail below.

[0021] Resin mixture (A)

[0022] The resin mixture (A) contains a bismaleimide (BMI) resin. The bismaleimide resin is not particularly limited, and an appropriate bismaleimide resin can be selected as needed. In this embodiment, the bismaleimide resin may include a bismaleimide-modified olefin resin, a bismaleimide-modified polyphenylene ether resin (PPE-BMI), a bismaleimide-modified dicyclopentadiene resin (DCPD-BMI), a combination thereof, or other suitable bismaleimide resins.

[0023] The bismaleimide-modified olefin resin may include BMI-3000 (trade name; manufactured by DMI (Designer Molecules Inc.)) or other suitable bismaleimide-modified olefin resins.

[0024] The bismaleimide-modified polyphenylene ether resin may be the bismaleimide-modified polyphenylene ether resin disclosed in Taiwan Patent Registration Number I774559 or other suitable bismaleimide-modified polyphenylene ether resins. The full text of the disclosure of Taiwan Patent Registration Number I774559 is incorporated herein by reference. For example, the chemical structure of the bismaleimide-modified polyphenylene ether resin can be represented by the following formula (1).

[0025]

Chemical formula

[0026] In formula (1), R may be a direct bond, a methylene group, an ethylene group, an isopropyl group, a 1-methylpropyl group, a sulfonyl group, or a fluorenyl cation group, n may represent an integer from 3 to 25, and is preferably an integer from 10 to 18.

[0027] The bismaleimide-modified dicyclopentadiene resin may be the bismaleimide-modified dicyclopentadiene resin published in Taiwan Patent Application No. 112131621 or another suitable bismaleimide-modified dicyclopentadiene resin. The full text of Taiwan Patent Application No. 112131621 is incorporated herein by reference. For example, the chemical structure of the bismaleimide-modified dicyclopentadiene resin can be represented by the following formula (2).

[0028] [ka]

[0029] In formula (2), m may represent an integer between 0 and 18, and is preferably an integer between 2 and 10.

[0030] The bismaleimide resin may further contain a biphenyl-based bismaleimide resin or another suitable maleimide resin. The biphenyl-based bismaleimide resin may contain a fluorinated biphenyl-based bismaleimide resin. The biphenyl-based bismaleimide resin may contain MIR-3000 (trade name; manufactured by Nippon Kayaku Co., Ltd.), MIR-5000 (trade name; manufactured by Nippon Kayaku Co., Ltd.), DI-0928 (trade name; manufactured by SHIFENG TECHNOLOGY CO., LTD.), DI-0929 (trade name; manufactured by SHIFENG TECHNOLOGY CO., LTD.), or another suitable maleimide resin.

[0031] In this embodiment, the bismaleimide resin preferably comprises at least one selected from the group consisting of a bismaleimide-modified olefin resin and a bismaleimide-modified polyphenylene ether resin and a bismaleimide-modified dicyclopentadiene resin. The bismaleimide resin preferably comprises a bismaleimide-modified olefin resin and a bismaleimide-modified polyphenylene ether resin, and may further comprise a bismaleimide-modified dicyclopentadiene resin. When the bismaleimide resin comprises a bismaleimide-modified polyphenylene ether resin, the resin composition has good peel resistance. When the bismaleimide resin comprises a bismaleimide-modified dicyclopentadiene resin, the resin composition has good heat resistance.

[0032] In this embodiment, the weight-average molecular weight of the bismaleimide resin may be 500 g / mol to 5000 g / mol, and preferably 600 g / mol to 4000 g / mol.

[0033] For every 100 parts by weight of the total amount of resin composition used, the amount of resin mixture (A) used is 10 to 30 parts by weight, preferably 16.5 to 23.4 parts by weight.

[0034] Liquid rubber resin (B)

[0035] The liquid rubber resin (B) is not particularly limited, and any suitable liquid rubber resin can be selected as needed. In this embodiment, the liquid rubber resin (B) may include LDM-02 (product name; manufactured by Denka Company Limited), LF-310T50 (product name; manufactured by Nippon Steel Corporation), COD-103 (product name; manufactured by Nippon Soda Co., Ltd.), divinylbenzene-containing polymers (DVB resin series), combinations thereof, or other suitable liquid rubber resins, and is preferably from the LDM-02 series.

[0036] For every 100 parts by weight of the total amount of resin composition used, the amount of liquid rubber resin (B) used is 30 to 50 parts by weight, preferably 35 to 45 parts by weight.

[0037] Inorganic filler (C)

[0038] The inorganic filler (C) is not particularly limited, and a suitable inorganic filler can be selected as needed. For example, the inorganic filler (C) may be spherical. In this embodiment, the inorganic filler (C) may contain silica, preferably surface-modified silica, and more preferably surface-modified spherical silica. Specific examples of commercially available spherical silica include EQK0610-SMS (trade name; manufactured by Sanji Co., Ltd.) or other suitable spherical silica. The median particle size (particle size D50) of the inorganic filler (C) may be 0.3 micrometers to 3.0 micrometers, and preferably 0.5 micrometers to 2 micrometers.

[0039] The inorganic filler (C) may include a surface-modified filler having acrylic or vinyl groups, and is preferably surface-modified silica having acrylic or vinyl groups. Compared to unmodified silica, surface-modified silica having acrylic or vinyl groups has superior electrical properties, thereby enabling the resin composition to have good dielectric properties.

[0040] The amount of inorganic filler (C) used is 25 to 50 parts by weight, preferably 30 to 40 parts by weight, per 100 parts by weight of the total amount of resin composition used.

[0041] Catalyst (D)

[0042] Catalyst (D) is not particularly limited, and an appropriate catalyst can be selected as needed. For example, catalyst (D) may include a peroxide or another suitable catalyst. Specific examples of commercially available peroxides include Luperox F (trade name, abbreviated as LuF; manufactured by Arkema Corporation), DCP (trade name; manufactured by Arkema Corporation), Percumyl P (trade name; manufactured by NOF Corporation), Trigonox A-W70 (trade name; manufactured by Akzo Nobel NV), combinations thereof, or other suitable peroxides.

[0043] The amount of catalyst (D) used is 0.1 to 2 parts by weight, preferably 0.5 to 1 part by weight, per 100 parts by weight of the total amount of resin composition used.

[0044] Siloxane coupling agent (E)

[0045] The siloxane coupling agent (E) is not particularly limited, and a suitable siloxane coupling agent can be selected as needed. For example, the siloxane coupling agent (E) may include silane compounds having different functional groups. In this embodiment, the siloxane coupling agent (E) may include vinylsilane compounds, acrylicsilanes, combinations thereof, or other suitable siloxane coupling agents. Specific examples of commercially available siloxane coupling agents (E) include Z6030 (trade name; manufactured by Dow Corning Inc.), KBM503 (trade name; manufactured by Shin-Etsu Chemical Co., Ltd.), or other suitable siloxane coupling agents.

[0046] The amount of siloxane coupling agent (E) used is 0.1 to 5 parts by weight, preferably 0.2 to 2 parts by weight, per 100 parts by weight of the total amount of resin composition used. When the resin composition contains siloxane coupling agent (E), the compatibility and degree of crosslinking between the resin composition and the glass fiber cloth and powder can be improved.

[0047] <Method for preparing resin compositions>

[0048] The method for preparing the resin composition is not particularly limited. For example, each component of the resin composition may be placed in a stirrer and stirred until it is uniformly mixed into a solution, and a solvent may be added as needed. By uniformly mixing it, a liquid resin composition can be obtained.

[0049] The solvent may include toluene, xylene, acetone, butanone, methyl isobutyl ketone (MIBK), cyclohexanone, dimethylacetamide, combinations thereof, or other suitable solvents. The amount of solvent used is not particularly limited, and an appropriate amount can be selected as needed. In the liquid resin composition, the solids content may be 10% to 40%. In this embodiment, the solids content can be fixed at 35%. This allows for the calculation of the amount of each component used in the resin composition.

[0050] Furthermore, the resin composition of the present invention can be processed into resin-coated copper (RCC) substrates according to actual design requirements. Because the resin composition of the present invention has good dielectric properties, peel resistance, and heat resistance, the primer layer formed by the resin composition of the present invention has good compatibility with the prepreg and copper foil, and the copper foil substrate (CCL) formed thereby also has low dielectric constant, low dielectric loss tangent, high peel strength, and good heat resistance, resulting in desirable reliability (the desired electrical properties can be maintained). More specifically, the dielectric constant of the resin-coated copper substrate including the primer layer formed by the resin composition may be about 3.0 to 3.35, the dielectric loss tangent may be less than about 0.002, the peel strength between the copper foil and prepreg may exceed about 4 lb / in, and a laminate with a solder float value exceeding 10 minutes is considered to have good quality. The dielectric constant of the pure primer layer formed by the resin composition may be about 2.71, and the dielectric loss tangent may be about 0.00088.

[0051] The present invention will be described in more detail below with reference to examples. The following examples are for illustrative purposes only, and the scope of the present invention includes, but is not limited to, the scope described in the following patent application, as well as its substitutes and modifications.

[0052] Examples of bismaleimide resin synthesis

[0053] Synthesis Example 1: Bismaleimide-modified polyphenylene ether resin (PPE-BMI)

[0054] Low molecular weight polyphenylene ether resin material with a number average molecular weight (Mn) of 12,000 or less, or 10,000 or less (e.g., Mn = 500, 1400, 1600, or 1800), was dissolved in dimethylacetamide, and then potassium carbonate and tetrafluoronitrobenzene were added. The reaction solution was heated to 140°C and reacted for 8 hours, then cooled to room temperature, and the solid was removed by filtration. When the filtrate was precipitated using methanol / water, the precipitate was nitrated polyphenylene ether resin. The nitrated polyphenylene ether resin was then dissolved in dimethylacetamide and hydrogenated at 90°C for 8 hours to obtain amination polyphenylene ether resin. The amination polyphenylene ether resin was then added to toluene, maleic anhydride and p-toluenesulfonic acid were added thereto, and the mixture was heated to 120°C under reflux and reacted for 8 hours to obtain bismaleimide-modified polyphenylene ether resin (PPE-BMI).

[0055] Synthesis Example 2: Bismaleimide-modified dicyclopentadiene resin (DCPD-BMI)

[0056] A dicyclopentadienephenol resin containing 1 mole of hydroxyl groups (for example, weight-average molecular weight 1,300 (trade name ERM6140, manufactured by SONGWON), 1,100 (trade name ERM6115, manufactured by SONGWON), or 800 (trade name ERM6105, manufactured by SONGWON)) and 1.25 moles of 4-halonitrobenzene (where the halogen may be fluorine, chlorine, bromine, or iodine) were added to 6 moles of dimethylacetamide (DMAC) as the reaction solvent, and the mixture was reacted at 120°C for 300 minutes to carry out a nitration reaction. Then, hydrogen gas was introduced, and the mixture was reacted at 90°C for 480 minutes to carry out a hydrogenation reaction and produce a modified dicyclopentadiene-type bisamine. Next, 3 moles of maleic anhydride and 9.7% by weight of toluenesulfonic acid were added, and the mixture was reacted at 120°C for 420 minutes to obtain a bismaleimide resin (referred to as DCPD-BMI) containing a dicyclopentadiene structure in the main chain. It has the structure represented by formula (2) above, and its average molecular weight may be 800 to 10000, and preferably 1000 to 4000.

[0057] Examples of resin compositions

[0058] Examples 1 to 5 and Comparative Examples 1 to 4 of the resin composition are described below.

[0059] Examples 1 to 5 and Comparative Examples 1 to 4

[0060] According to the contents of Tables 1 and 2, the resin compositions for each experimental example were mixed with a mixed solvent of 50% toluene and 50% xylene to form resin compositions with a solid content concentration of approximately 10 wt% to 40 wt%. The obtained resin compositions were applied to a copper foil laminate surface (roughness Rz less than 1 μm, thickness approximately 35 μm). The dried film after application was approximately 1 to 2 micrometers thick, and it was baked at 120°C for 3 to 5 minutes to form a resin-coated copper substrate. Two prepregs were laminated between 35 μm thick copper foils (roughness Rz less than 1 μm). Here, the prepreg model number was NPG188H (RC: 73%; 0.1 mm, manufactured by Nanya Plastics Industry Co., Ltd.), and a hot press was used at a pressure of 25 kg / cm². 2 The copper foil substrate was pressed at 85°C and maintained at a constant temperature for 20 minutes. It was then heated to 220°C at a rate of 3°C / min and maintained at a constant temperature for 90 minutes. Next, it was slowly cooled to 25°C, and the resulting copper foil substrate was evaluated according to the following evaluation method. The results are shown in Table 2.

[0061] [Table 1]

[0062] [Table 2]

[0063] <Evaluation Method>

[0064] Dielectric constant (Dk): The dielectric constant at a wavenumber of 10 GHz was tested using a dielectric analyzer (Keysight Technologies). A smaller dielectric constant indicates that the resin composition has better dielectric properties.

[0065] Dielectric loss tangent (Df): The dielectric loss tangent at a frequency of 10 GHz was tested using a dielectric analyzer (Keysight Technologies). A smaller dielectric loss tangent indicates that the resin composition has good dielectric properties.

[0066] Peel Strength: The peel strength of the metal substrate was tested according to the IPC-TM-650-2.4.8 test method, and the peel strength between the copper foil and the circuit carrier substrate was tested using a tensile testing machine. A higher peel strength indicates that the resin composition is less likely to peel off the circuit board, i.e., it has good peel resistance.

[0067] Heat resistance: A copper foil substrate sample (referred to as a laminate) is placed in an oven at 288°C to induce blistering, and the time from the start time until the first blister appears is measured. If the solder float value of the laminate exceeds 10 minutes, it is considered to be of good quality (abbreviated as "OK"), and if the solder float value of the laminate is less than 10 minutes, it is considered to be of poor quality (abbreviated as "NG").

[0068] <Evaluation Results>

[0069] As can be seen from Table 2, when the resin composition comprises a resin mixture (A), a liquid rubber resin (B), an inorganic filler (C), a catalyst (D), and a siloxane coupling agent (E), and the resin mixture (A) contains a bismaleimide resin (Examples 1-5), the resin composition simultaneously possesses good dielectric properties, peel resistance, and heat resistance.

[0070] Furthermore, compared to resin compositions (Comparative Examples 1-4) in which the amount of resin mixture (A) used is outside the range of 10 to 30 parts by weight per 100 parts by weight of the total amount of resin composition used, resin compositions (Examples 1-5) in which the amount of resin mixture (A) used is within the above range have greater peel strength, i.e., more preferable peel resistance.

[0071] Furthermore, compared to resin compositions that do not contain bismaleimide-modified polyphenylene ether resin (PPE-BMI) in the bismaleimide resin (Comparative Examples 1-4), the resin compositions that contain bismaleimide-modified polyphenylene ether resin in the bismaleimide resin (Examples 1-5) have greater peel strength, i.e., more favorable peel resistance.

[0072] Furthermore, compared to resin compositions that do not contain bismaleimide-modified polyphenylene ether resin (PPE-BMI) and bismaleimide-modified dicyclopentadiene resin (DCPD-BMI) in the bismaleimide resin (Comparative Examples 2-4), the resin compositions that contain bismaleimide-modified polyphenylene ether resin and bismaleimide-modified dicyclopentadiene resin in the bismaleimide resin (Examples 1-3) have greater peel strength and better heat resistance, i.e., they have more preferable peel resistance and heat resistance.

[0073] In summary, the resin composition of the present invention comprises a resin mixture (A), a liquid rubber resin (B), an inorganic filler (C), a catalyst (D), and a siloxane coupling agent (E), and since the resin mixture (A) contains a bismaleimide resin, it has good dielectric properties, peel resistance, and heat resistance, and good applicability.

[0074] Although the present invention has been disclosed through embodiments described above, these are not intended to limit the invention, and any person with ordinary skill in the relevant art may make certain changes and modifications without departing from the spirit and scope of the invention. The scope of protection of the present invention shall be determined by the scope of the appended patent application. [Industrial applicability]

[0075] The resin composition of the present invention can be applied to electronic materials such as copper-clad laminates.

Claims

1. A resin composition, The resin mixture (A) contains a bismaleimide resin, and the bismaleimide resin contains a bismaleimide-modified polyphenylene ether resin. Liquid rubber resin (B) and Inorganic filler (C), Catalyst (D), Siloxane coupling agent (E), Includes, A resin composition wherein, with respect to 100 parts by weight of the total amount of the resin composition, the amount of the resin mixture (A) used is 10 to 30 parts by weight, the amount of the liquid rubber resin (B) used is 30 to 50 parts by weight, the amount of the inorganic filler (C) used is 25 to 50 parts by weight, the amount of the catalyst (D) used is 0.1 to 2 parts by weight, and the amount of the siloxane coupling agent (E) used is 0.1 to 5 parts by weight.

2. The bismaleimide resin further comprises a bismaleimide-modified olefin resin, a bismaleimide-modified dicyclopentadiene resin, or a combination thereof. The resin composition according to claim 1.

3. The bismaleimide resin further comprises a biphenyl-based bismaleimide resin. The resin composition according to claim 2.

4. The weight-average molecular weight of the bismaleimide resin is 500 g / mol to 5000 g / mol. The resin composition according to claim 1.

5. The inorganic filler (C) contains silica, The resin composition according to claim 1.

6. The inorganic filler (C) includes surface-modified silica having acrylic groups or vinyl groups. The resin composition according to claim 1.

7. The median particle size of the inorganic filler (C) is 0.3 micrometers to 3.0 micrometers. The resin composition according to claim 1.

8. The siloxane coupling agent (E) comprises a vinylsilane compound, an acrylicsilane, or a combination thereof. The resin composition according to claim 1.

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