Light-emitting device

Abstract

To provide a light-emitting device with a narrow light distribution.SOLUTION: A light-emitting device 100 includes a light-emitting element 20, a pair of wires 21 electrically connected to the light-emitting element, a sealing member covering the light-emitting element, and a light-shielding member disposed on the upper surface of the sealing member. The light-shielding member has a first light-shielding member and a second light-shielding member separated from the first light-shielding member.SELECTED DRAWING: Figure 2B

Description

[Technical Field]

[0001] This disclosure relates to a light-emitting device. [Background technology]

[0002] One example of a light-emitting device is a bullet-shaped light-emitting device. For example, Patent Document 1 discloses a vehicle light fixture in which a convex lens portion and a sealing resin portion are formed separately, and a light-shielding member is placed between the convex lens portion and the sealing resin portion. Also, for example, Patent Document 2 discloses a configuration in which a light-emitting semiconductor device has a light-shielding aperture in the optical path from a light-emitting element chip provided in the lens portion to the lens portion. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2004-063499 [Patent Document 2] Japanese Utility Model Publication No. 01-018766 [Overview of the project] [Problems that the invention aims to solve]

[0004] The embodiments described herein aim to provide a light-emitting device with a narrow light distribution. [Means for solving the problem]

[0005] The light-emitting device disclosed in the embodiment comprises a light-emitting element, a pair of conductive members electrically connected to the light-emitting element, a sealing member covering the light-emitting element, and a light-shielding member disposed on the upper surface of the sealing member, wherein the light-shielding member comprises a first light-shielding member and a second light-shielding member spaced apart from the first light-shielding member.

[0006] The light-emitting device disclosed in the embodiment comprises a light-emitting element, a pair of conductive members electrically connected to the light-emitting element, a sealing member covering the light-emitting element, and a light-shielding member disposed on the upper surface of the sealing member, wherein the sealing member has a recess on its upper surface at a position that does not overlap with the light-emitting element in a plan view, and the light-shielding member is disposed within the recess. [Effects of the Invention]

[0007] According to embodiments of this disclosure, it is possible to provide a light-emitting device with a narrow light distribution. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic perspective view illustrating a light source device equipped with a light-emitting device according to the embodiment. [Figure 2A] This is a schematic perspective view illustrating a light-emitting device according to an embodiment. [Figure 2B] This is a schematic perspective view showing an enlarged portion of the light-emitting device according to the embodiment. [Figure 2C] This is a schematic perspective view showing a portion of Figure 2B, excluding the sealing member and the light-transmitting member. [Figure 3A] This is a schematic front view illustrating a part of the light-emitting device according to the embodiment. [Figure 3B] This is a schematic side view illustrating a part of the light-emitting device according to the embodiment. [Figure 3C] This is a schematic plan view illustrating a part of the light-emitting device according to the embodiment. [Figure 4A] This is an explanatory diagram showing a simulation of the light beam of the light-emitting device according to the embodiment. [Figure 4B] This is an explanatory diagram showing the relationship between the light rays and the light-shielding member of the light-emitting device according to the embodiment. [Figure 5] This is a flowchart showing a method for manufacturing a light-emitting device according to an embodiment. [Figure 6A] This is a schematic front view illustrating a method for manufacturing a light-emitting device according to an embodiment. [Figure 6B] This is a schematic front view illustrating a method for manufacturing a light-emitting device according to an embodiment. [Figure 6C] It is a schematic perspective view exemplifying a magnified part of FIG. 6B. [Figure 7A] It is a schematic front view exemplifying a manufacturing method of a light-emitting device according to an embodiment. [Figure 7B] It is a schematic perspective view exemplifying a manufacturing method according to an embodiment. [Figure 8A] It is a schematic front view exemplifying a manufacturing method according to an embodiment. [Figure 8B] It is a schematic perspective view exemplifying a manufacturing method according to an embodiment. [Figure 9A] It is a schematic front view exemplifying a manufacturing method according to an embodiment. [Figure 9B] It is a schematic front view exemplifying a manufacturing method according to an embodiment. [Figure 10A] It is a schematic plan view exemplifying a part of a light source device. [Figure 10B] It is a cross-sectional view taken along line XB-XB of FIG. 10A. [Figure 11A] It is a schematic plan view exemplifying a first modification. [Figure 11B] It is a schematic plan view exemplifying a second modification. [Figure 11C] It is a schematic plan view exemplifying a third modification. [Figure 12A] It is a schematic front view exemplifying a light-emitting device of another embodiment. [Figure 12B] It is a schematic front view exemplifying a first modification of a light-shielding member of an embodiment. [Figure 12C] It is a schematic front view exemplifying a second modification of a light-shielding member of an embodiment.

MODE FOR CARRYING OUT THE INVENTION

[0009] Embodiments will be described below with reference to the drawings. However, the embodiments shown below are illustrative examples of a light-emitting device and a method for manufacturing a light-emitting device for realizing the technical idea related to this disclosure, and are not limited to those described below. Furthermore, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are merely illustrative and not intended to limit the scope of the present invention unless otherwise specified. Note that the size and positional relationships of the members shown in each drawing may be exaggerated or simplified in order to clarify the explanation. Also, in the embodiments, "covering" is not limited to direct contact, but also includes indirectly covering, for example, through other members. Furthermore, the X direction is the direction along the X axis, the Y direction is the direction along the Y axis, and the Z direction is the direction along the Z axis. The positive direction refers to the direction particularly toward the + side in each X, Y, and Z direction. The negative direction refers to the direction particularly toward the - side in each X, Y, and Z direction. For example, the direction along the Y axis and toward the - side is called the negative Y direction. A plane containing the X and Z directions is called the XZ plane, a plane containing the X and Y directions is called the XY plane, and a plane containing the Y and Z directions is called the YZ plane.

[0010] [Light-emitting device] A light-emitting device 100 according to an embodiment will be described with reference to Figures 1 to 3C. Figure 1 is a schematic perspective view illustrating a light source device equipped with a light-emitting device. Figure 2A is a schematic perspective view illustrating a light-emitting device according to an embodiment. Figure 2B is a schematic perspective view showing an enlarged portion of the light-emitting device according to an embodiment. Figure 2C is a schematic perspective view showing an enlarged portion of Figure 2B, excluding the sealing member and the light-transmitting member. Figure 3A is a schematic front view illustrating a portion of the light-emitting device. Figure 3B is a schematic side view illustrating a portion of the light-emitting device. Figure 3C is a schematic top view illustrating a portion of the light-emitting device.

[0011] The light-emitting device 100 can be used, for example, in a light source device 200. The light source device 200 is a device in which many light-emitting devices 100 are arranged in a row.

[0012] The light-emitting device 100 comprises a light-emitting element 20, a pair of conductive members 10, a sealing member 41, and a light-shielding member 43. The pair of conductive members 10 are electrically connected to the light-emitting element 20. The pair of conductive members have a first conductive member 11 and a second conductive member 12. The sealing member 41 covers the light-emitting element 20. The light-shielding member 43 is positioned on the upper surface 411 of the sealing member 41. The light-shielding member 43 has a first light-shielding member 43a1 and a second light-shielding member 43a2 that is separated from the first light-shielding member 43a1.

[0013] In the light-emitting device 100, the sealing member 41 has a recess 143 on its upper surface 411 at a position that does not overlap with the light-emitting element 20 in a plan view. The light-shielding member 43 is placed within the recess 143. There are at least two recesses 143. The light-shielding member 43 is placed within at least two recesses 143.

[0014] The light-emitting device 100 further includes a light-transmitting member 42. The light-transmitting member 42 covers the light-shielding member 43 and the sealing member 41. The various components of the light-emitting device 100 will be described below.

[0015] In the referenced drawings, the X direction is the direction in which the pair of conductive members 10 (first conductive member 11 and second conductive member 12) are aligned. The Y direction is the direction in which the pair of conductive members 10 (first conductive member 11 and second conductive member 12) extend. The Z direction is perpendicular to the X and Y directions. Note that the Y direction may sometimes be described as the up and down direction. The upward direction in the light-emitting device 100 is shown as the positive Y direction in the drawings.

[0016] (Conductive member 10) The conductive member 10 is electrically connected to the light-emitting element 20 by wires 21 and 22. The conductive member 10 functions as a connection terminal for connecting to the outside. The conductive member 10 has a first conductive member 11 and a second conductive member 12. As shown in Figure 2C, the first conductive member 11 is on which the light-emitting element 20 is arranged and is electrically connected to the light-emitting element 20 via wires 21. The second conductive member 12 is also electrically connected to the light-emitting element 20 via wires 21. The second conductive member 12 is arranged at a distance from the first conductive member 11 in the X direction. The first conductive member 11 is, for example, a cathode electrode, and the second conductive member 12 is, for example, an anode electrode.

[0017] The first conductive member 11 has a base 110. The base 110 has a cup portion 111 on which the light-emitting element 20 is placed. As shown in Figure 3C, the cup portion 111 is located approximately in the center of the light-emitting device 100 in a plan view.

[0018] As shown in Figure 2C, the cup portion 111 is a recess defined by a bottom surface 151 and side walls 155 surrounding the bottom surface 151. The light-emitting element 20 is positioned on the bottom surface 151. The cup portion 111 has an opening that widens upward. The inner surface 152 of the side wall 155 is inclined. In plan view, the shape of the opening of the cup portion 111 is, for example, circular, elliptical, or a shape that is partially or completely deformed therefrom.

[0019] As shown in Figure 3A, the height H of the cup portion 111 from the bottom surface 151 to the edge 111a of the cup portion 111 is 0.2 mm or more and 0.4 mm or less.

[0020] As shown in Figure 2C, the cup portion 111 has a rim 111a. The upper surface of the base 110 has a flat portion located above the rim 111a of the cup portion 111. The other end of the wire 21 connected to the light-emitting element 20 is connected to the flat portion of the base 110. The flat portion of the base 110 may be at the same height as the rim 111a of the cup portion 111. The second conductive member 12 has a flat portion to which the other end of the wire 22 connected to the light-emitting element 20 is connected.

[0021] As shown in Figure 2A, the first conductive member 11 has a connecting end 114. The connecting end 114 is located below the base 110.

[0022] Examples of materials for the first conductive member 11 and the second conductive member 12 include iron, copper, iron-containing copper, tin-containing copper, or copper-plated, gold-plated, or silver-plated aluminum, iron, copper, etc., or combinations thereof. For example, the first conductive member 11 and the second conductive member 12 have different plating in the portion covered by the translucent member 42 and the portion exposed from the translucent member 42. The portion covered by the translucent member 42 has a silver plating with copper as the base. This makes it easier to reflect the light emitted by the light-emitting element 20. On the other hand, the portion exposed from the translucent member 42 has a solder plating containing tin, copper, silver, or tin and copper. This reduces the occurrence of silver migration. Furthermore, from the viewpoint of suppressing silver migration, it is preferable to use the conductive member on which the light-emitting element 20 is placed as a cathode electrode.

[0023] (Light-emitting element 20) The light-emitting element 20 has a first surface 20A and a second surface 20B opposite to the first surface 20A. The first surface 20A of the light-emitting element 20 is positioned facing the conductive member 10. As shown in Figure 2C, the light-emitting element 20 is positioned on the bottom surface 151 of the cup portion 111 of the first conductive member 11.

[0024] The shape and size of the light-emitting element 20 can be selected arbitrarily. For example, the plan view shape of the light-emitting element 20 can be a square, rectangle, or hexagon. The length of the light-emitting element 20 in the X direction is, for example, 0.15 mm or more and 0.5 mm or less.

[0025] The light-emitting element 20 includes at least a semiconductor structure and has a positive and negative pair of element electrodes. The semiconductor structure includes an n-side semiconductor layer, a p-side semiconductor layer, and an active layer sandwiched between the n-side semiconductor layer and the p-side semiconductor layer. The active layer may be a single quantum well (SQW) structure or a multiple quantum well (MQW) structure including multiple well layers. The semiconductor structure includes multiple semiconductor layers made of nitride semiconductors. The nitride semiconductor is In x Al y Ga 1-x-y The semiconductor comprises all compositions in which the composition ratios x and y are varied within their respective ranges in the chemical formula N (0 ≤ x, 0 ≤ y, x + y ≤ 1). The emission peak wavelength of the active layer can be appropriately selected depending on the purpose. The active layer is configured to emit, for example, visible light or ultraviolet light.

[0026] A semiconductor structure may include multiple light-emitting sections, each containing an n-side semiconductor layer, an active layer, and a p-side semiconductor layer. When a semiconductor structure includes multiple light-emitting sections, each light-emitting section may include well layers with different emission peak wavelengths, or well layers with the same emission peak wavelength. Note that "same emission peak wavelength" includes variations of a few nanometers. The combination of emission peak wavelengths of the multiple light-emitting sections can be selected as appropriate. For example, when a semiconductor structure includes two light-emitting sections, possible combinations of light emitted by each section include blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. For example, when a semiconductor structure includes three light-emitting sections, possible combinations of light emitted by each section include blue light, green light, and red light. Each light-emitting section may include one or more well layers with emission peak wavelengths different from the other well layers.

[0027] As shown in Figure 3C, the light-emitting element 20 is positioned approximately at the center of the sealing member 41. Preferably, the light-emitting element 20 is further positioned approximately at the center of the light-transmitting member 42. Approximately at the center does not mean the exact center, but includes a position that is visible as being close to the center.

[0028] (Sealing member 41) The sealing member 41 covers the light-emitting element 20. The sealing member 41 further covers the base 110 and a portion of the connecting end 114 of the first conductive member 11. The sealing member 41 may be a single layer or multiple layers. For example, the sealing member 41 may have a first layer that covers the light-emitting element 20 and is located inside the cup portion 111, and a second layer that covers the base 110 and a portion of the connecting end 114. As shown in Figure 3A, the sealing member 41 is, for example, substantially elliptical in shape. The sealing member 41 has an upper surface 411, a lower surface 412, and a side surface 413 that connects the upper surface 411 and the lower surface 412. The upper surface 411 of the sealing member 41 is located above the base 110 of the first conductive member 11.

[0029] As shown in Figure 3A, the upper surface 411 of the sealing member 41 has a recess 143. The light-shielding portion 43 is positioned within the recess 143. The recess 143 is defined by its bottom surface and side surface. As shown in Figure 3C, the recess 143 is positioned so as not to overlap with the light-emitting element 20. For example, there are two recesses 143. The light-emitting device 100 has a first recess 143a1 at a position corresponding to above the first conductive member 11. The light-emitting device 100 also has a second recess 143a2 at a position corresponding to above the second conductive member 12. As shown in Figure 3A, it is preferable that the first recess 143a1 and the second recess 143a2 are symmetrical. This makes it easier to align the light distribution in the positive X direction and the light distribution in the negative X direction in the light-emitting device 100.

[0030] The bottom surface defining the first recess 143a1 is inclined. The bottom surface defining the second recess 143a2 is inclined. The bottom surface defining the first recess 143a1 is inclined along wire 21. The bottom surface defining the second recess 143a2 is inclined along wire 22. These allow contact between wires 21 and 22 and the recess 143 to be avoided, and the length in the Y direction between the recess 143 and the light-emitting element 20 can be shortened. As shown in Figure 3A, the depth of the first recess 143a1 is shallower on the inside than on the outside. The depth of the second recess 143a2 is shallower on the inside than on the outside. The depth at the deepest part of the first recess 143a1 and the second recess 143a2 is, for example, 0.1 mm or more and 0.2 mm or less. As shown in Figure 3B, the bottom surface defining the first recess 143a1 as viewed from the X direction can be a curved surface or a flat surface. The bottom surface defining the second recess 143a2 is the same as that of the first recess 143a1.

[0031] As shown in Figure 3C, the shape of the opening of the first recess 143a1 and the shape of the opening of the second recess 143a2 are, for example, substantially semicircular shapes having a straight portion and an arc-shaped portion. The shape of the opening of the first recess 143a1 and the shape of the opening of the second recess 143a2 are symmetrical. Here, symmetry means that a variation in shape of ±3% is permitted. The straight portion of the first recess 143a1 and the straight portion of the second recess 143a2 are arranged to face each other. The straight portion of the first recess 143a1 and the straight portion of the second recess 143a2 are arranged with a space directly above the light-emitting element 20. Preferably, the straight portion of the first recess 143a1 and the straight portion of the second recess 143a2 are arranged to overlap a part of the edge 111a of the cup portion 111. This allows a portion of the light emitted by the light-emitting element 20 that is emitted in the X direction to be absorbed by the light-shielding member 43.

[0032] As shown in Figure 3A, the length of the sealing member 41 in the Y direction is, for example, 2.5 mm or more and 4 mm or less. As shown in Figure 3C, the sealing member 41 has a major axis in the X direction. The length of the major axis of the sealing member 41 is, for example, 2.5 mm or more and 3.4 mm or less. The length of the minor axis of the sealing member 41 is, for example, 1.6 mm or more and 2.5 mm or less. The ratio of the length of the major axis to the length of the minor axis of the sealing member 41 is, for example, 1.3:1. The sealing member 41 may also have a major axis in the Z direction. On the lower surface 412 of the sealing member 41, the shortest distance D1 between the side surface 413 of the sealing member 41 and the conductive member 10 is, for example, 250 μm or more.

[0033] The sealing member 41 preferably has high light transmittance to the light emitted by the light-emitting element 20. High light transmittance of the sealing member 41 means that it has a light transmittance of 50% or more, preferably 60% or more, and more preferably 80% or more, with respect to the emission peak wavelength of the light emitted by the light-emitting element 20. Examples of materials for the sealing member 41 include weather-resistant light-transmitting resins such as epoxy resin, urea resin, and silicone, as well as glass. The sealing member 41 may also contain a light-diffusing material. The inclusion of a light-diffusing material in the sealing member 41 can alleviate thermal stress. The refractive index of the light-diffusing material is preferably close to that of the sealing member 41. This reduces light scattering by the sealing member 41 and maintains the light-shielding effect of the light-shielding member 43. Examples of light-diffusing materials include barium titanate, titanium oxide, aluminum oxide, and silicon oxide.

[0034] (Light-shielding material) The light-shielding member 43 blocks a portion of the light emitted by the light-emitting element 20. As shown in Figure 3A, the light-shielding member 43 is positioned above the second surface 20B of the light-emitting element 20, leaving a gap. This allows the light-emitting device 100 to block a portion of the light emitted by the light-emitting element 20 with the light-shielding member 43. Therefore, in the light-emitting device 100, light mainly emanates from above the light-emitting element 20, and is less likely to be emitted from the sides of the light-emitting element 20 in the X direction. Thus, the light distribution of the light-emitting device 100 can be narrowed. The light-shielding member 43 is positioned on the upper surface 411 of the sealing member 41. The light-shielding member 43 includes a first light-shielding member 43a1 positioned spaced above the first conductive member 11, and a second light-shielding member 43a2 positioned spaced above the second conductive member 12.

[0035] The plan view shape of the first light-shielding member 43a1 and the plan view shape of the second light-shielding member 43a2 is, for example, approximately semicircular. The approximately semicircular shape has a straight portion at one end and a curved portion that curves continuously from the straight portion toward the other end in a plan view. It is preferable that the first light-shielding member 43a1 and the second light-shielding member 43a2 are arranged with their approximately semicircular straight portions facing each other. It is even more preferable that the straight portions of the first light-shielding member 43a1 and the second light-shielding member 43a2 overlap with a part of the edge 111a of the cup portion 111 in a plan view. This makes it possible to absorb a portion of the light emitted by the light-emitting element 20 that is emitted in the X direction.

[0036] The first light-shielding member 43a1 has thickness in the Y direction. The first light-shielding member 43a1 has an upper surface and a lower surface. The second light-shielding member 43a2 is the same as the first light-shielding member 43a1. As shown in Figure 3A, the length in the Y direction between the edge 111a of the cup portion 111 and the lowest part of the lower surface of the first light-shielding member 43a1 is preferably 200 μm or more and 500 μm or less. Also, the length in the Y direction between the edge 111a of the cup portion 111 and the lowest part of the lower surface of the second light-shielding member 43a2 is preferably 200 μm or more and 500 μm or less. This makes it easier to absorb a portion of the light emitted by the light-emitting element 20. It is preferable that the first light-shielding member 43a1 and the second light-shielding member 43a2 are arranged to be at the same height. This makes it easier to align the light distribution in the positive X direction and the light distribution in the negative X direction in the light-emitting device 100. In addition, the heights of the first light-shielding member 43a1 and the second light-shielding member 43a2 may be different within a range of 200 μm or less.

[0037] Furthermore, the lower surface of the first light-shielding member 43a1 is inclined. The depth of the first light-shielding member 43a1 is shallower on the inside than on the outside. The depth of the second light-shielding member 43a2 is shallower on the inside than on the outside. These features allow for shorter Y-direction lengths between the light-emitting element 20 and the first light-shielding member 43a1, and between the light-emitting element 20 and the second light-shielding member 43a2, by avoiding contact between the wire 21 and the first light-shielding member 43a1, and between the light-emitting element 20 and the second light-shielding member 43a2. If more light-shielding is desired from the light-emitting element 20, this can be adjusted by increasing the thickness of the first light-shielding member 43a1 and the second light-shielding member 43a2.

[0038] As shown in Figure 3C, it is preferable that the curved portions of the first light-shielding member 43a1 and the second light-shielding member 43a2 are shaped to conform to the curved state of the sealing member 41 in plan view. In other words, the outer shape of the sealing member 41 has an arc-shaped portion in plan view, and a part of the outer shape of the light-shielding member 43 follows the arc-shaped portion of the sealing member 41. This makes it possible to enlarge the outer shape of the light-shielding member 43. Therefore, the light distribution of the light-emitting device 100 can be made narrower.

[0039] As shown in Figure 3C, the straight portions of the first light-shielding member 43a1 and the second light-shielding member 43a2 are larger than the diameter of the cup portion 111 in which the light-emitting element 20 is placed. This allows them to absorb light reflected by the side walls 155 of the cup portion 111. Furthermore, the length of the first light-shielding member 43a1 from the center of the straight portion to the top of the curved portion extends beyond the edge 111a of the cup portion 111 to the flat portion of the first conductive member 11. Similarly, the length of the second light-shielding member 43a2 from the center of the straight portion to the top of the curved portion extends beyond the edge 111a of the cup portion 111 to the flat portion of the second conductive member 12. These allow them to absorb light reflected by the side walls 155 of the cup portion 111.

[0040] The upper surface of the first light-shielding member 43a1 is substantially flat. Similarly, the upper surface of the second light-shielding member 43a2 is also substantially flat. As a result, it becomes difficult for an air layer to be formed between the sealing member 41, the light-shielding member 43, and the light-transmitting member 42, which will be described later.

[0041] The first light-shielding member 43a1 and the second light-shielding member 43a2 have light-absorbing properties that allow them to absorb light. The first light-shielding member 43a1 and the second light-shielding member 43a2 are, for example, made by incorporating a light-absorbing material into a resin that serves as the base material. The first light-shielding member 43a1 and the second light-shielding member 43a2 are preferably made of a material that absorbs 70% or more of the light or visible light emitted from the light-emitting element 20, and more preferably a material that absorbs 90% or more. Furthermore, the first light-shielding member 43a1 and the second light-shielding member 43a2 may have a light transmittance of 40% or less with respect to the peak wavelength of the light-emitting element 20.

[0042] The resin used as the base material for the first light-shielding member 43a1 and the second light-shielding member 43a2 can be the same material as that used for the sealing member 41 and the light-transmitting member 42. Furthermore, carbon black, pigments, dyes, or glass fillers colored with carbon black can be used as light-absorbing materials. For example, the first light-shielding member 43a1 and the second light-shielding member 43a2 can be made from a resin with a silicone resin base material containing carbon black as a light-absorbing material. The first light-shielding member 43a1 and the second light-shielding member 43a2 may also have light-reflecting properties. For example, titanium dioxide can be contained in the base resin as a light-reflecting material. This allows some of the light reflected by the light-shielding member 43 towards the light-emitting element 20 to be reflected by the cup portion 111, thereby improving the light extraction from the light-emitting device 100.

[0043] (Translucent member) The light-transmitting member 42 covers the light-shielding member 43 and the sealing member 41. Preferably, the light-transmitting member 42 further covers at least a portion of the side surface 413 of the sealing member 41. As shown in Figure 2A, it is more preferable that the light-transmitting member 42 covers the top surface 411, the side surface 413, and the bottom surface 412 of the sealing member 41. This makes it possible to lengthen the moisture intrusion path in the light-emitting device 100 and improve the reliability of the light-emitting device 100. In this case, the sealing member 41 is located inside the light-transmitting member 42. The light-shielding member 43 is located between the sealing member 41 and the light-transmitting member 42. As shown in Figure 3A, the sealing member 41 is located approximately in the center of the length of the light-transmitting member 42 in the Y direction.

[0044] As shown in Figure 3A, the longest length of the light-transmitting member 42 in the Y direction can be, for example, 5.5 mm or more and 9.5 mm or less, and is preferably 6.5 mm or more and 8.2 mm or less.

[0045] The light-transmitting member 42 has a lens portion 42a and a base portion 42b. As shown in Figure 3A, the light-transmitting member 42 has the lens portion 42a and the base portion 42b in that order from the positive Y direction to the negative Y direction. The lens portion 42a and the base portion 42b are integral. However, the lens portion 42a and the base portion 42b may be separate parts.

[0046] The lens portion 42a of the light-transmitting member 42 is located above the base portion 42b. The lens portion 42a is located above the light-emitting element 20. As shown in Figure 3A, the lens portion 42a has a convex shape that protrudes in the positive Y direction. In cross-sectional view, the outer shape of the lens portion 42a is arc-shaped. Of the light emitted by the light-emitting element 20, the light that is not blocked by the light-shielding member 43 is emitted outside the light-emitting device 100 through the lens portion 42a.

[0047] The base 42b of the light-transmitting member 42 is arranged continuously with the lens portion 42a. As shown in Figure 2A, the base 42b has an elliptical cylindrical shape. The light-emitting element 20 and the sealing member 41 are arranged on the base 42b.

[0048] As shown in Figure 3C, the plan view shape of the base portion 42b is an ellipse having a major axis and a minor axis. The base portion 42b has the same major and minor axes as the lens portion 42a. However, the base portion 42b may have different major and minor axes than the lens portion 42a.

[0049] The external shape of the base 42b of the translucent member 42 in a plan view is similar to the external shape of the sealing member 41 in a plan view. However, the external shapes of the sealing member 41 and the external shape of the base 42b of the translucent member 42 in a plan view may be different.

[0050] In a plan view, the length of the base portion 42b in the X direction can be, for example, 3.4 mm or more and 4.4 mm or less, and is preferably 3.6 mm or more and 4.2 mm or less. Also, in a plan view, the length of the base portion 42b in the Z direction can be, for example, 2.5 mm or more and 3.5 mm or less, and is preferably 2.7 mm or more and 3.3 mm or less.

[0051] The same material as that used for the sealing member 41 can be used for the light-transmitting member 42. However, the light-transmitting member 42 may be made of a different material than that used for the sealing member 41.

[0052] The light-transmitting member 42 and the sealing member 41 may contain a coloring agent. This can increase the contrast ratio between when the lights are on and when they are not.

[0053] As a coloring agent, one containing either a pigment or a dye may be used.

[0054] Examples of colorants that can be used include copper phthalocyanates, CI pigment green 36, and N,N'-dimethyl-3,4:9,10-perylene bisdicarboimide. Alternatively, a colorant containing either a pigment or a dye may be used.

[0055] While there are no particular limitations on the type of pigment used, examples include those made from inorganic or organic materials, and the following are some examples of materials used:

[0056] Examples of inorganic materials include red iron oxide (Fe2O3), red lead (Pb3O4), titanium nickel antimony oxide, titanium nickel barium oxide, titanium chromium antimony oxide, and titanium chromium niobium oxide.

[0057] Examples of organic materials include anthraquinone-based, azo-based, quinac conductive material-based, perylene-based, diketopyrrolopyrrole-based, monoazo-based, disazo-based, pyrazolone-based, benzimidazolone-based, quinoxaline-based, azomethine-based, isoindolinone-based, and isoindoline-based materials. While there are no particular limitations on the types of dyes used, examples include anthraquinone dyes, methine dyes, azomethine dyes, oxazine dyes, azo dyes, styryl dyes, coumarin dyes, porphyrin dyes, dibenzofuranone dyes, diketopyrrolopyrrole dyes, rhodamine dyes, xanthene dyes, and pyromethene dyes.

[0058] Note that the pigment and the dye preferably do not basically convert the light from the light-emitting element 20 into different wavelengths. This is because, as will be described later, when the wavelength conversion member is included, it does not affect the wavelength conversion member.

[0059] The light-transmissive member 42 and the sealing member 41 may contain a light stabilizer. Examples of the light stabilizer include benzotriazole-based, benzophenone-based, salicylate-based, cyanoacrylate-based, hindered amine-based, and the like.

[0060] The light-transmissive member 42 and the sealing member 41 may contain a wavelength conversion member. Examples of the wavelength conversion member include a phosphor. Examples of the phosphor include yttrium aluminum garnet-based phosphors (e.g., (Y,Gd)3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (e.g., Ca8MgSi4O 16 Cl2:Eu), silicate-based phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu) and other oxynitride-based phosphors, LSN-based phosphors (e.g., (La,Y)3Si6N 11:Ce), BSESN-based phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), etc., nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si 1-x Al x )F 6-x :Mn where x satisfies 0 < x < 1), or fluoride-based phosphors such as MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2), etc. can be used. Note that the light-emitting device 100 may emit various colors by combining the light-emitting element 20 and the wavelength conversion member.

[0061] [Simulation of Light-Emitting Device] Next, a simulation of the case where the light-shielding member 43 is placed and the light-emitting element 20 is made to emit light will be explained with reference to Figures 4A and 4B. For the simulation, a ray tracing simulation was performed using the optical simulation software "LightTools" (registered trademark). Figure 4A shows the simulation result when the light-emitting element is a volume light-emitting light source, and is shown with 300 rays. In Figure 4A, an arbitrary number of rays can be selected in the optical simulation software, and the rays with the highest probability are displayed. Figure 4B shows the simulation result when the upper left vertex of the light-emitting element is a point light source, and is shown with 11 rays. In Figure 4B, in the optical simulation software, (1) an arbitrary number of rays, (2) an arbitrary single light source point, and (3) the radiation direction and radiation angle can be selected. In this case, the rays are displayed at equal intervals within the selected range, rather than by probability. In both cases, the cup reflectance was set to 100%, the light-shielding reflectance to 0%, the encapsulant refractive index to 1.5, and the environmental refractive index to 1.0.

[0062] Furthermore, in Figures 4A and 4B, the sealing member and the light-transmitting member are not distinguished and are shown as resin 40. In Figure 4A, light rays from the light-emitting element 20 that follow a low-probability path are not shown. As shown in Figure 4B, most of the light rays L1 from the light-emitting element 20 are blocked by the first light-shielding member 43a1. Light rays L1a that are not blocked by the first light-shielding member 43a1 are not shown in Figure 4A. From this, it can be determined that the light rays L1a follow a low-probability path.

[0063] Therefore, the first light-shielding member 43a1 and the second light-shielding member 43a2 can block the light emitted by the light-emitting element 20. As a result, the light-emitting device 100 can narrow its light distribution by blocking a portion of the light emitted by the light-emitting element 20 with the first light-shielding member 43a1 and the second light-shielding member 43a2.

[0064] [Manufacturing method for light-emitting devices] Next, a method for manufacturing a light-emitting device according to an embodiment will be described with reference to Figures 5 to 9C. Figure 5 is a flowchart showing the method for manufacturing a light-emitting device according to an embodiment. Figure 6A is a front view showing the state of the conductive member in the method for manufacturing a light-emitting device according to an embodiment. Figure 6B is a front view showing the state in which a light-emitting element is placed on the conductive member shown in Figure 6A. Figure 6C is a perspective view showing an enlarged view of the portion in Figure 6B in which the light-emitting element is placed. Figure 7A is a schematic front view showing the state of the sealing member covering the light-emitting element. Figure 7B is a perspective view showing the state in which the sealing member according to the embodiment has been formed. Figure 8A is a schematic front view showing the state in which a light-shielding member is formed on the sealing member. Figure 8B is a perspective view showing the state in which a light-shielding member has been formed on the sealing member of Figure 8A. Figure 9A is a schematic front view showing the state in which the sealing member having the light-shielding member is covered with a light-transmitting member. Figure 9B is a front view showing the light-emitting device in a state in which it has been pieced after the light-transmitting member has been formed.

[0065] A method for manufacturing the light-emitting device 100 includes the steps of: preparing a first conductive member 11 having a light-emitting element 20 and a second conductive member 12 positioned away from the first conductive member 11 and electrically connected to the light-emitting element 20 via wires 21 and 22; forming a sealing member 41 that continuously covers a part of the first conductive member 11 and a part of the second conductive member 12, and directly or indirectly covers the light-emitting element; and forming a light-shielding member 43 on the upper surface 411 of the sealing member 41 in step S30. The method for manufacturing the light-emitting device 100 further includes the step of forming a light-transmitting member 42 that covers the sealing member 41 and the light-shielding member 43. The method for manufacturing the light-emitting device 100 further includes a piece-forming step S50 for piece-forming the light-emitting device 100.

[0066] (Preparation process) Preparation step S10 will be explained with reference to Figures 6A to 6C. Preparation step S10 is the step of preparing a first conductive member 11 on which the light-emitting element 20 is arranged, and a second conductive member 12 which is arranged away from the first conductive member 11 and electrically connected to the light-emitting element 20 via wires 21 and 22. Preparation step S10 includes a step S11 for preparing the conductive member 300 and a step S12 for arranging the light-emitting element.

[0067] Step S11, which prepares the conductive member 300, is a step in which a plurality of first conductive members 11 and second conductive members 12 are connected via connecting portions 310, as shown in Figure 6A.

[0068] As shown in Figure 6B, step S12 for arranging the light-emitting elements involves placing the light-emitting elements 20 on each of the first conductive members 11 of the prepared conductive member 300 and electrically connecting them to the first conductive member 11 and the second conductive member 12. The light-emitting elements 20 are placed on the bottom surface 151 of the cup portion 111 of the first conductive member 11 via an adhesive member.

[0069] As shown in Figure 6C, the light-emitting element 20 is electrically connected to the first conductive member 11 and the second conductive member 12 via wires 21 and 22. In step S12, the intermediate body 400 is prepared by electrically connecting the light-emitting element 20 with the first conductive member 11 and the second conductive member 12.

[0070] (Process for forming the sealing member) Step S20 for forming the sealing member will be explained with reference to Figures 7A and 7B. Step S20 for forming the sealing member is a step for forming a sealing member 41 that continuously covers a part of the first conductive member 11 and a part of the second conductive member 12, and that directly or indirectly covers the light-emitting element 20.

[0071] First, in step S20 for forming the sealing member 41, a first casting case C01 having a plurality of first recesses C11 is prepared, as shown in Figure 7A. The first recesses C11 have a first protrusion C11a and a second protrusion C11b. Next, the sealing member 41 is placed in the first recesses C11. A part of the first conductive member 11 and a part of the second conductive member 12 of the intermediate body 400 are inserted into the first recesses C11 in which the sealing member 41 is placed. The sealing member 41 is hardened with the intermediate body 400 inserted in the first recesses C11. After the sealing member has hardened, the intermediate body 400 is removed from the first casting case C01. This makes it possible to obtain the intermediate body 400 with the sealing member 41 formed on it, as shown in Figure 7B. As shown in Figure 7B, the intermediate body 400 on which the sealing member 41 is formed has a first recess 143a1 at a position corresponding to the first protrusion C11a and a second recess 143a2 at a position corresponding to the second protrusion C11b.

[0072] (Process for forming light-shielding material) Step S30 for forming the light-shielding member will be explained with reference to Figures 8A and 8B. Step S30 for forming the light-shielding member is a step in which a light-shielding member 43 is formed on the upper surface 411 of the sealing member 41. The light-shielding member 43 is placed in the first recess 143a1 and the second recess 143a2 formed in step S20 for forming the sealing member. The light-shielding member 43 is placed in the first recess 143a1 and the second recess 143a2 by fixing the intermediate body 400 on which the sealing member 41 is formed with a jig, for example, using the nozzle NS of a filling device. By curing the placed light-shielding member 43, an intermediate body 400 on which the light-shielding member 43 shown in Figure 8B is formed can be obtained. Alternatively, a pre-formed light-shielding member 43 may be placed in the first recess 143a1 and the second recess 143a2 using an adhesive or the like.

[0073] (Process for forming a light-transmitting member) Step S40 for forming the light-transmitting member will be explained with reference to Figures 9A and 9B. Step S40 for forming the light-transmitting member is a step in which a light-transmitting member 42 is formed to cover the sealing member 41 and the light-shielding member 43.

[0074] First, in step S40 for forming the translucent member, a second casting case C02 having a second recess C12 is prepared. As shown in Figure 9A, the second casting case C02 has a plurality of second recesses C12. Next, the translucent member 42 is placed inside the second recesses C12. The sealing member 41 of the intermediate body 400 is inserted into the second recess C12 where the translucent member 42 is placed. The translucent member 42 is cured with the intermediate body 400 inserted into the second recess C12. After the translucent member 42 has cured, the intermediate body 400 is removed from the second casting case C02. This makes it possible to obtain the intermediate body 400 with the translucent member 42 formed thereon, as shown in Figure 9B.

[0075] (Singulation process) The individualization process will be explained based on Figure 9B. The individualization process S50 is the process of individualizing the material into pieces for the light-emitting device 100. The intermediate material 400 is connected by a connecting part 310. After the connecting part 310 is detached, the material is individualized into pieces for the light-emitting device 100.

[0076] Next, the light source device 200 in which the light-emitting device 100 is used will be described with reference to Figures 10A and 10B. Figure 10A is a plan view partially showing a light source device formed by aligning the light-emitting devices according to the embodiment. Figure 10B is a cross-sectional view taken along the line XB-XB in Figure 10A.

[0077] As shown in Figure 10A, the light source device 200 comprises a plurality of light-emitting devices 100 and a mounting substrate 60. The plurality of light-emitting devices 100 are arranged on the mounting substrate 60. The plurality of light-emitting devices 100 are arranged in alignment in the X and Z directions. In a plan view, the first light-shielding member 43a1 and the second light-shielding member 43a2 of the light-emitting device 100 are arranged parallel to the X direction of the light source device 200.

[0078] As shown in Figure 10A, the light source device 200 is configured with a first light-emitting device 100a that emits blue light, a second light-emitting device 100b that emits red light, and a third light-emitting device 100c that emits green light. The light source device 200 is configured with the light-emitting devices 100a, 100b, and 100c positioned at the vertices of a triangle. The light source device 200 can display full color by arranging many sets of light-emitting devices 100a, 100b, and 100c, each representing one pixel. The order in which the light-emitting devices 100a, 100b, and 100c are arranged is not limited. It is preferable to place the light-emitting device 100b that emits green light in the center of each set of three light-emitting devices. This is because good white color can be obtained by placing the light-emitting device that emits light of the wavelength requiring the most brightness in the center.

[0079] The light source device 200 has a light-emitting device 100 that can block light emitted in the X direction. As a result, the light source device 200 does not need to be equipped with a separate member for blocking light.

[0080] As shown in Figure 10B, the light source device 200 further includes a waterproof member 70. The waterproof member 70 embeds a portion of the light-transmitting member 42. Furthermore, the waterproof member 70 is positioned between adjacent light-emitting devices 100 to protect the light-emitting devices 100 and the mounting substrate 60 from water and other elements.

[0081] [Modified examples of light-transmitting members and sealing members] Next, modified examples of the translucent member and the sealing member will be described with reference to Figures 11A to 11D. Figure 11A is a plan view showing a first modified example of the translucent member and sealing member of the embodiment. Figure 11B is a plan view showing a second modified example of the translucent member and sealing member of the embodiment. Figure 11C is a plan view showing a third modified example of the translucent member and sealing member of the embodiment. Components already described will be denoted by the same reference numerals and their descriptions will be omitted as appropriate.

[0082] As shown in Figure 11A, the light-emitting device 100A1 differs from the light-emitting device 100 in that the sealing member 41 has a circular shape in plan view, and the light-transmitting member 42 also has a circular shape in plan view. In other respects, it is the same as the light-emitting device 100. In the light-emitting device 100A1, the curved portions of the first light-shielding member 43a1 and the second light-shielding member 43a2 are arc-shaped, concentric with the circle of the sealing member 41.

[0083] As shown in Figure 11B, the light-emitting device 100A2 differs from the light-emitting device 100 in that the sealing member 41 has a circular shape in plan view, and the light-transmitting member 42 has an elliptical shape in plan view. In other respects, it is the same as the light-emitting device 100. The light-transmitting member 42 has an elliptical shape in plan view, with a minor axis in the Z direction and a major axis in the X direction.

[0084] As shown in Figure 11C, the light-emitting device 100A3 differs from the light-emitting device 100 in that the sealing member 41 has an elliptical shape in plan view, and the light-transmitting member 42 has a circular shape in plan view. In other respects, it is the same as the light-emitting device 100. The sealing member 41 has an elliptical shape in plan view, with a minor axis in the Z direction and a major axis in the X direction. The curved portions of the first light-shielding member 43a1 and the second light-shielding member 43a2 have a shape that follows the elliptical shape of the sealing member 41.

[0085] Figure 12A is a schematic front view illustrating another embodiment of the light-emitting device. Light-emitting device 100A differs from light-emitting device 100 in that it does not have a light-transmitting member. The light-emitting devices 100, 100A1 to 100A3 described above may also be configured without a light-transmitting member.

[0086] [Modified examples of light-shielding materials] Next, modified examples of the light-shielding member will be described as shown in Figures 12B and 12C. Figure 12B is a front view showing a first modified example of the light-shielding member of the embodiment. Figure 12C is a front view showing a second modified example of the light-shielding member of the embodiment. Components already described will be denoted by the same reference numerals and their descriptions will be omitted.

[0087] The light-emitting device 100B differs from the light-emitting device 100 in that the light-shielding member 43B is positioned only above the second conductive member 12. As shown in Figure 12B, the light-emitting device 100B has the light-shielding member 43B on the upper surface 411 of the sealing member 41B. As a result, the light-emitting device 100B is less likely to emit light from the side of the light-emitting element 20 in the negative X direction. Although the light-emitting device 100B is shown without a light-transmitting member 42, a light-transmitting member 42 may be included. In other respects, it is the same as the light-emitting device 100.

[0088] The light-emitting device 100C differs from the light-emitting device 100 in that the first light-shielding member 43a1 and the second light-shielding member 43a2 protrude from the upper surface 411 of the sealing member 41. As shown in Figure 12C, the upper surface 411 of the sealing member 41 of the light-emitting device 100C is flat. The light-shielding member 43C is positioned on the flat upper surface 411 of the sealing member. The thickness of the first light-shielding member 43c1 and the second light-shielding member 43c2 is constant. Although the light-emitting device 100C is shown without a light-transmitting member 42, a light-transmitting member 42 may be included. In other respects, it is the same as the light-emitting device 100.

[0089] Light-emitting devices 100, 100A1, 100A2, 100A3, 100A, 100B, and 100C can also be applied to surface-mount type light-emitting devices. [Industrial applicability]

[0090] The light-emitting device and light source device according to the embodiments of this disclosure can be suitably used in outdoor displays. In addition, the light-emitting device and light source device according to the embodiments of this disclosure can be used as backlight sources for liquid crystal displays, various lighting fixtures, indoor displays, various display devices such as advertisements and destination signs, etc.

[0091] This disclosure includes embodiments of the following items: [Section 1] Light-emitting element and A pair of conductive members electrically connected to the light-emitting element, A sealing member covering the light-emitting element, The sealing member comprises a light-shielding member disposed on the upper surface of the sealing member, The light-emitting device comprises a first light-shielding member and a second light-shielding member separated from the first light-shielding member. [Section 2] Light-emitting element and A pair of conductive members electrically connected to the light-emitting element, A sealing member covering the light-emitting element, The sealing member comprises a light-shielding member disposed on the upper surface of the sealing member, The light-emitting device wherein the sealing member has a recess on its upper surface at a position that does not overlap with the light-emitting element in a plan view, and the light-shielding member is disposed within the recess. [Section 3] The light-emitting device according to claim 2, wherein at least two recesses are provided, and the light-shielding member is provided within at least two of the recesses. [Section 4] The light-emitting device according to any one of claims 1 to 3, further comprising a light-transmitting member that covers the light-shielding member and the sealing member. [Section 5] The light-emitting device according to any one of claims 1 to 4, wherein the light-transmitting member further covers at least a portion of the side surface of the sealing member. [Section 6] The light-shielding member is a light-absorbing member, as described in any one of claims 1 to 5. [Section 7] The light-emitting device according to any one of claims 1 to 6, wherein the lower surface of the light-shielding member is inclined. [Section 8] One of the pair of conductive members has a cup portion on which the light-emitting element is arranged. The light-emitting device according to any one of claims 1 to 7, wherein, in a plan view, the light-shielding member is arranged so as not to overlap with the cup portion. [Section 9] The light-shielding member is separated from the pair of conductive members in the direction of separation, according to any one of claims 1 to 8. [Section 10] The sealing member has a recess on its upper surface at a position that does not overlap with the light-emitting element in a plan view. The light-shielding member is disposed within the recess, and the light-emitting device is as described in any one of claims 1 to 9. [Section 11] The light-emitting device according to any one of claims 1 to 10, wherein the light-shielding member is positioned 200 μm or more and 500 μm or less from the upper surface of the pair of conductive members. [Section 12] The outer shape of the sealing member has an arc-shaped portion in a plan view. The light-emitting device according to any one of claims 1 to 11, wherein a part of the outer shape of the light-shielding member follows the arc-shaped portion of the sealing member. [Explanation of symbols]

[0092] 10,300 conductive members 11 First conductive member 110 base 111 Cup section 114 Connection end 12 Second conductive member 151 Base 152 Inner surface 155 Side wall 20 Light-emitting elements 20A, Page 1 20B 2nd side 21 wires 22 wires 41 Sealing member 411 Top surface 412 Bottom surface 413 Side view 42 Translucent member 42a Lens section 42b base 43 Light-shielding material 43a1 First light-shielding member 43a2 Second light-shielding member 143 recess 143a1 First recess 143a2 Second recess 60 mounted circuit boards 70 Waterproofing materials 100 Light-emitting devices 200 Light source device 310 Connection section 400 Intermediate C01 First Casting Case C02 Second Casting Case C11 First dent C12 Second dent

Claims

1. Light-emitting element and A pair of conductive members electrically connected to the light-emitting element, A sealing member covering the light-emitting element, The sealing member comprises a light-shielding member disposed on the upper surface of the sealing member, One of the pair of conductive members has a cup portion on which the light-emitting element is arranged. The light-shielding member comprises a first light-shielding member and a second light-shielding member spaced apart from the first light-shielding member, and is positioned in a location that does not overlap with the cup portion in a plan view, thereby providing a light-emitting device.

2. The light-emitting device according to claim 1, wherein the sealing member has a recess on its upper surface, and the light-shielding member is disposed within the recess.

3. The light-emitting device according to claim 2, wherein at least two recesses are provided, and the light-shielding member is provided within at least two of the recesses.

4. The light-emitting device according to any one of claims 1 to 3, further comprising a light-transmitting member that covers the light-shielding member and the sealing member.

5. The light-emitting device according to claim 4, wherein the light-transmitting member further covers at least a portion of the side surface of the sealing member.

6. The light-shielding member is light-absorbing, as described in any one of claims 1 to 3.

7. The light-emitting device according to any one of claims 1 to 3, wherein the lower surface of the light-shielding member is inclined such that the outer depth of the light-shielding member is deeper than the inner depth, and the depth increases toward the outside.

8. The light-emitting device according to claim 1 or claim 3, wherein the light-shielding member is separated from the pair of conductive members in the direction of separation.

9. The sealing member has a recess on its upper surface at a position that does not overlap with the light-emitting element in a plan view. The light-shielding member is disposed within the recess, as described in claim 1.

10. The light-emitting device according to any one of claims 1 to 3, wherein the light-shielding member is arranged 200 μm or more and 500 μm or less from the upper surface of the pair of conductive members.

11. The outer shape of the sealing member has an arc-shaped portion in a plan view. The light-emitting device according to any one of claims 1 to 3, wherein a part of the outer shape of the light-shielding member follows the arc-shaped portion of the sealing member.

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