Heating device
The heating device addresses non-uniform temperature distribution by using a heating plate with recesses and insulating members to connect heaters, achieving improved heat uniformity and durability.
JP7833332B2Active Publication Date: 2026-03-19KYOCERA CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-04-21
- Publication Date
- 2026-03-19
AI Technical Summary
Technical Problem
Conventional heating devices experience non-uniform temperature distribution due to heat dissipation from cartridge heaters with different polarities through lead electrodes, leading to inconsistent heating.
Method used
A heating device design featuring a heating plate with recesses for heaters, anode and cathode electrode arrays, and insulating members to connect multiple heaters, reducing heat dissipation and promoting uniformity.
Benefits of technology
Improves heat uniformity by minimizing temperature differences across the heating surface, enhancing durability and reducing stress on components.
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Abstract
To improve thermal uniformity.SOLUTION: A heating apparatus comprises a heating plate, a plurality of heaters, a first collective electrode, a second collective electrode, and an insulation member. The heating plate has a heating surface, and a plurality of recesses on its rear face that is opposite to the heating surface. Each of the plurality of heaters is located in each of the plurality of recesses. The heaters each have a first lead electrode with a first polarity and a second lead electrode with a second polarity. The first collective electrode is connected to each of the first lead electrodes provided in two or more heaters among the plurality of heaters. The second collective electrode is connected to the second lead electrodes provided in two or more heaters among the plurality of heaters. The insulation member is located between the first collective electrode and the second collective electrode.SELECTED DRAWING: Figure 6
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Citation Information
Patent Citations
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