Composite having high thermal conductivity and method for manufacturing the composite

A composite of oriented hBN particles in an organic polymer addresses the need for more efficient thermal management materials, achieving high thermal conductivity and improved heat dissipation in electronic devices.

JP7833541B2Active Publication Date: 2026-03-19SAINT GOBAIN CERAMICS & PLASTICS INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-10-14
Publication Date
2026-03-19

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Abstract

The composite article can include a composite including an organic polymer and ceramic particles including hexagonal boron nitride (hBN) particles distributed throughout the organic polymer, where the amount of the hBN particles ranges from 40 volume % to 90 volume % based on a total volume of the composite, and where the composite has an in-plane thermal conductivity of at least 15 W / mK. The hBN particles in the composite can have a March-Doulas orientation parameter η of at least 50%.
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Citation Information

Patent Citations

  • Heat-conductive sheet

    JP2012039060A

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    JP2016108457A

  • Composition containing boron nitride aggregated particle, and molding using composition containing boron nitride aggregated particle

    JP2016135732A

  • High aspect ratio boron nitride, method, and composition containing the same

    JP2017510540A

  • Hexagonal boron nitride powder, method for producing the same, resin composition and resin sheet

    JP2018104260A