Tape application device

Abstract

To provide a tape sticking device which can prevent tape from peeling and dropping from a frame.SOLUTION: A tape sticking device 2 comprises: a frame support part 4 which supports a frame F; tape sticking means which sticks tape T to the frame F supported by the frame support part 4; a camera 8 which images the tape T stuck to the frame F; and determination means which determines whether or not the tape T is properly stuck to the frame F on the basis of the image captured by the camera 8.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a tape sticking device for sticking a tape to a frame having an opening for accommodating a wafer at the center.

Background Art

[0002] A wafer on which a plurality of devices such as ICs and LSIs are partitioned by a dicing line and formed on the surface is divided into individual device chips by a dicing device or a laser processing device, and each divided device chip is used in an electric device such as a mobile phone or a personal computer.

[0003] Some laser processing devices are of a type that condenses laser light of a wavelength having permeability to the wafer inside the wafer and forms a modified layer along the dicing line. Then, the wafer on which the modified layer is formed along the dicing line is divided into individual device chips by, for example, an expanding device developed by the applicant (see Patent Document 1).

[0004] The expanding device disclosed in Patent Document 1 includes a sticking means for sticking a tape to a wafer, a dividing means for expanding the tape to which the wafer is stuck and dividing it into individual device chips along the modified layer, and a frame sticking means for sticking the tape to which the wafer divided into individual device chips is stuck to a frame having an opening for accommodating the wafer at the center. It is arranged to efficiently divide the wafer into individual device chips and stick the tape to the frame.

[0005] By the way, the applicant has developed a processing device that integrates a wafer having a ring-shaped reinforcing portion remaining on the back surface corresponding to the outer peripheral surplus region and a frame with a tape, and efficiently removes the ring-shaped reinforcing portion from the outer periphery of the wafer, and filed a patent application on July 17, 2020 (Japanese Patent Application No. 2020-123201).

[0006] This processing apparatus comprises a frame table for supporting a frame, a tape application means disposed above the frame table for applying tape to the frame, a tape-attached frame for transporting the tape-attached frame to a wafer table and pressing the tape of the tape-attached frame against the back surface of a wafer supported on the wafer table, and a reinforcement removal means for irradiating a laser beam onto a reinforcement formed on the outer circumference of the wafer to remove the reinforcement. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2019-110188 [Overview of the project] [Problems that the invention aims to solve]

[0008] In the expansion device disclosed in Patent Document 1, the tape may not be properly attached to the frame by the frame attachment means. In such cases, the tape may peel off the frame and fall off.

[0009] Furthermore, even with the above-mentioned processing apparatus, there are cases where the tape cannot be properly attached to the frame by the tape application means. In such cases, there is still a risk that the tape may peel off the frame and fall off.

[0010] The object of the present invention is to provide a tape application device that can prevent the tape from peeling off and falling from the frame. [Means for solving the problem]

[0011] According to the present invention, the following tape application device is provided that solves the above problems. That is, "A tape application device for applying tape to a frame having an opening in the center for housing a wafer, The system includes a frame support portion for supporting the frame, a tape application means for applying tape to the frame supported by the frame support portion, a camera for capturing images of the tape applied to the frame, and a determination means for determining whether or not the tape is properly applied to the frame based on the image captured by the camera. fruit, The determination means binarizes each image captured by the camera and determines whether the tape is properly attached to the frame for each image captured area based on the ratio of black to white areas. A tape application device is provided.

[0012] Preferably, the determination means binarizes the image and determines whether the tape is properly attached to the frame based on the ratio of black to white areas. [Effects of the Invention]

[0014] The tape application apparatus of the present invention includes a frame support portion for supporting a frame, tape application means for applying tape to a frame supported by the frame support portion, a camera for capturing images of the tape applied to the frame, and determination means for determining whether or not the tape is properly applied to the frame based on the image captured by the camera. The determination means performs a binarization process on each imaging area captured by the camera, and determines whether the tape is properly attached to the frame for each imaging area based on the ratio of black to white areas. Therefore, the tape is prevented from peeling off the frame and falling off. [Brief explanation of the drawing]

[0015] [Figure 1] A perspective view showing a first embodiment of a tape application device configured according to the present invention. [Figure 2] Figure 1 is a schematic diagram of the tape application device. [Figure 3] A schematic diagram showing the pressure roller positioned in the pressing position and tape attached to one end of the frame. [Figure 4] A schematic diagram showing the state after moving the pressure roller from the state shown in Figure 3. [Figure 5] A schematic diagram showing the state after the pressing roller has been moved further from the state shown in Figure 4. [Figure 6] A schematic diagram showing a camera capturing images of tape attached to a frame. [Figure 7]Schematic diagram of an image of the tape attached to the frame captured by a camera. [Figure 8] (a) Schematic diagram of an image corresponding to the imaging area indicated by the dashed line A in FIG. 7, (b) Schematic diagram of an image corresponding to the imaging area indicated by the dashed line B in FIG. 7, (c) Schematic diagram of an image corresponding to the imaging area indicated by the dashed line C in FIG. 7, (d) Schematic diagram of an image corresponding to the imaging area indicated by the dashed line D in FIG. 7. [Figure 9] (a) Perspective view showing a second embodiment of the tape attaching device configured according to the present invention, (b) View taken along the line B-B in (a).

Mode for Carrying Out the Invention

[0016] (First Embodiment) First, a first embodiment of the tape attaching device configured according to the present invention will be described with reference to FIGS. 1 to 8.

[0017] (Tape Attaching Device 2) As shown in FIG. 1, the tape attaching device, denoted as 2 as a whole, includes a frame support portion 4 that supports a frame F, a tape attaching means 6 that attaches a tape T to the frame F supported by the frame support portion 4, a camera 8 that images the tape T attached to the frame F, and a determination means 10 that determines whether or not the tape T is properly attached to the frame F based on the image captured by the camera 8.

[0018] (Frame Support Portion 4) The frame support portion 4 includes a support table 12 on which the frame F is placed and a lifting means 14 that raises and lowers the support table 12.

[0019] The lifting means 14 includes a guide member 16 that supports the support table 12 so as to be movable up and down, and a lifting mechanism (not shown) attached to the guide member 16. The lifting mechanism may have, for example, a ball screw connected to the support table 12 and extending in the vertical direction, and a motor that rotates this ball screw. The lifting means 14 raises and lowers the support table 12 along the guide member 16 by operating the lifting mechanism.

[0020] (Tape application means 6) The tape application means 6 includes a tape feeding unit 18 for feeding out tape T, a tape winding unit 20 for winding up used tape T, and a pressure roller 22 disposed between the tape feeding unit 18 and the tape winding unit 20, which presses and moves the fed-out tape T from one end to the other of a frame F supported by a support table 12 to apply it.

[0021] (Tape feed unit 18) The tape feeding unit 18 includes a support roller 24 that supports a roll tape RT on which tape T is wound in a cylindrical shape before use, a feeding roller 26 positioned below the support roller 24, a motor (not shown) that rotates the feeding roller 26, and a driven roller 28 that rotates in conjunction with the rotation of the feeding roller 26.

[0022] The tape feeding unit 18 uses a motor to rotate the driven roller 28 together with the feeding roller 26, thereby feeding the tape T, which is held between the feeding roller 26 and the driven roller 28, from the roll tape RT. In addition, the release paper P is peeled off the tape T as it passes between the feeding roller 26 and the driven roller 28, and the peeled release paper P is wound onto the release paper roller 30 and collected.

[0023] (Tape winding section 20) The tape winding unit 20 includes a winding roller 32 for winding up used tape T, a motor (not shown) for rotating the winding roller 32, and a pair of guide rollers 34 installed between the feed roller 26 and the winding roller 32.

[0024] In the tape winding section 20, the motor rotates the winding roller 32, and the used tape T, which has a circular opening Ta formed in the portion attached to the frame F, is guided by a pair of guide rollers 34 and wound up by the winding roller 32.

[0025] (Pressure roller 22) Referring to Figures 2 and 3, the pressing roller 22 is raised and lowered by a pressing roller positioning means (not shown), and is positioned at the upper standby position shown in Figure 2 and the lower pressing position shown in Figure 3. Furthermore, when the pressing roller 22 is positioned at the lower pressing position, it is moved in the Y-axis direction by a pressing roller moving means (not shown).

[0026] The Y-axis direction is indicated by the arrow Y in Figure 1. The X-axis direction, indicated by the arrow X in Figure 1, is perpendicular to the Y-axis direction, and the Z-axis direction, indicated by the arrow Z in Figure 1, is the vertical direction perpendicular to both the X-axis and Y-axis directions. The XY plane defined by the X-axis and Y-axis directions is essentially horizontal.

[0027] (cutting mechanism 36) As shown in Figure 1, the tape application means 6 further includes a cutting mechanism 36 for cutting the tape T that protrudes from the outer circumference of the frame F. The cutting mechanism 36 includes a Z-axis guide member 38 extending in the Z-axis direction, a Z-axis movable member 40 supported by the Z-axis guide member 38 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the Z-axis movable member 40 in the Z-axis direction. The Z-axis feed means may have a configuration comprising a ball screw connected to the Z-axis movable member 40 and extending in the Z-axis direction, and a motor for rotating this ball screw.

[0028] The cutting mechanism 36 also includes a motor 42 fixed to the lower surface of the tip of the Z-axis movable member 40, and an arm 44 rotated by the motor 42 about an axis extending in the Z-axis direction. First and second hanging pieces 46a and 46b are attached to the lower surface of the arm 44 at intervals from each other. A circular cutter 48 is supported on the first hanging piece 46a so as to be rotatable about an axis perpendicular to the Z-axis direction, and a pressing roller 50 is supported on the second hanging piece 46b so as to be rotatable about an axis perpendicular to the Z-axis direction.

[0029] (Camera 8) A support piece 52 is attached to the arm 44 of the cutting mechanism 36, and the camera 8 is supported by the support piece 52. The camera 8 images the tape T attached to the frame F from above. The image data captured by the camera 8 is output to the determination means 10.

[0030] (Judgment means 10) The determination means 10 is incorporated into the control means 54 that controls the operation of the tape application device 2. The control means 54 consists of a computer having a central processing unit (CPU) that performs calculations according to a control program, a read-only memory (ROM) that stores the control program and the like, and a read-write random access memory (RAM) that stores calculation results and the like.

[0031] (Frame F) The frame F to which the tape T is attached by the tape attachment device 2 described above is annular in shape and has a circular opening Fa in the center for accommodating a wafer.

[0032] (Tape T) Tape T may be an adhesive tape with an adhesive layer on one side, or it may be a heat-sealable sheet without an adhesive layer. The heat-sealable sheet is a sheet of thermoplastic synthetic resin (for example, polyolefin resin) that softens or melts and exhibits adhesive properties when heated to a temperature near its melting point.

[0033] While adhesive tape has a release liner P attached to its adhesive surface, the heat-sealing sheet may or may not have a release liner P attached to its pressure-sensitive surface. When a heat-sealing sheet without a release liner P is used, the tape application device 2 does not need to collect the release liner P, and therefore does not need to be equipped with a release liner roller 30.

[0034] Furthermore, if the tape T is a heat-sealable sheet, a heater and a temperature sensor (neither of which are shown) are built into at least one of the support table 12 or the pressure roller 22, and when the heat-sealable sheet is attached to the frame F, at least one of the support table 12 or the pressure roller 22 is heated to a temperature near the melting point of the heat-sealable sheet.

[0035] The operation of the tape application device 2, as described above, will now be explained.

[0036] First, before the frame F is placed on the support table 12, the support table 12 is positioned to receive the frame F (for example, the positions shown in Figures 1 and 2), and the pressure roller 22 is positioned in the upper standby position. Then, the tape T is fed from the roll tape RT, and the tape T, with the release paper P removed, is positioned above the support table 12 in a taut state without any slack. If the tape T is an adhesive tape, the adhesive side of the tape T positioned above the support table 12 is facing downwards.

[0037] Next, once the frames F that have been unloaded from the frame storage means (not shown) containing multiple frames F by the frame unloading means (not shown) are placed on the support table 12, the control means 54 operates the lifting means 14 and the pressing roller positioning means to position the support table 12 at the adhesive start position, as shown in Figure 3, and also positions the pressing roller 22 at the lower pressing position, thereby applying tension to the tape T and attaching the tape T to one end of the frame F.

[0038] As described above, when the support table 12 is positioned at the adhesive start position and the pressure roller 22 is positioned at the pressing position, the tape T forms an elevation angle α from the pressure roller 22 toward the guide roller 34 on the lower side of the tape winding section 20, as shown in Figure 3.

[0039] Next, while pressing the tape T against the frame F with the pressure roller 22, the pressure roller 22 is moved in the Y-axis direction toward the other end of the frame F. This allows the tape T to be attached to the frame F while applying uniform tension to the tape T.

[0040] When moving the pressure roller 22, the support table 12 is raised in synchronization with the movement of the pressure roller 22 to maintain a constant tension on the tape T. Specifically, as shown in Figures 4 and 5, the support table 12 is controlled by the control means 54 to gradually rise in synchronization with the movement of the pressure roller 22 so that the elevation angle α remains constant.

[0041] Furthermore, if the tape T is a heat-sealable sheet, the tape T can be heat-sealed to the frame F by adjusting the temperature of the upper surface of the support table 12 or the outer surface of the pressure roller 22 to a temperature at which the tape T softens or melts, and then rolling the pressure roller 22 in the Y-axis direction while applying a constant tension to the tape T with the pressure roller 22. Of course, when heat-sealing the tape T, the support table 12 is gradually raised in synchronization with the movement of the pressure roller 22 so that the elevation angle α remains constant.

[0042] After the tape T is attached to the frame F, the cutter 48 and press roller 50 of the cutting mechanism 36 are lowered, pressing the cutter 48 against the tape T on the frame F, and pressing the frame F from above the tape T with the press roller 50. Next, the arm 44 is rotated by the motor 42, moving the cutter 48 and press roller 50 in a circular motion along the frame F. This allows the tape T that extends beyond the outer circumference of the frame F to be cut along the frame F.

[0043] Furthermore, since the frame F is held down from above the tape T by the pressing roller 50, misalignment of the frame F and the tape T is prevented when the tape T is being cut. The used tape T, which has a circular opening Ta formed on it, is wound up by the tape winding unit 20.

[0044] Once the tape T is attached to the frame F, the camera 8 is rotated in the direction indicated by arrow R1, as shown in Figure 6, and the tape T attached to the frame F is imaged from above by the camera 8. The image data captured by the camera 8 is output to the determination means 10.

[0045] Then, the determination means 10 binarizes the image captured by the camera 8 and converts it into a two-color image 56 of black and white as shown in Figure 7. In the binarized image 56, in the annular region Rc where the frame F and the tape T overlap (an annular region enclosed by the periphery of the opening Fa of the frame F and the outer circumference To of the tape T), the parts where the frame F and the tape T are in close contact are shown in black, and the parts where the frame F and the tape T are not in close contact are shown in white.

[0046] The determination means 10 determines that the tape T is not properly attached to the frame F if the ratio of the black portion (the portion where the frame F and tape T are in close contact) in the entire annular region Rc is not equal to or greater than a threshold (for example, 95%). If it is determined that the tape T is not properly attached to the frame F, the process of pressing the tape T onto the frame F using the pressure roller 22 (attachment process) is repeated. On the other hand, if the ratio of the black portion in the entire annular region Rc is equal to or greater than the threshold, it is determined that the tape T is properly attached to the frame F.

[0047] Thus, in the tape application device 2, after applying the tape T to the frame F, it checks whether the tape T is properly applied to the frame F based on whether the ratio of the black portion in the entire annular region Rc is above a threshold. If the tape T is not properly applied to the frame F, the application process is repeated by the pressure roller 22, so that frames F with improperly applied tape T are not transported to subsequent processes. Therefore, it is prevented that the tape T will peel off and fall from the frame F in subsequent processes.

[0048] Furthermore, the determination means 10 may determine whether or not the tape T is properly attached to the frame F by a determination method different from the determination method described above. For example, the determination means 10 may binarize the image for each imaging area captured by the camera 8 and determine whether or not the tape T is properly attached to the frame F for each imaging area based on the ratio of black areas to white areas.

[0049] Specifically, the camera 8 is moved while imaging is repeatedly performed to acquire multiple images that partially include the annular region Rc. When acquiring multiple images, the combination of all the images is designed to include the entire annular region Rc. Next, all the acquired images are binarized to convert them into two-color images A, B, C, D, ..., black and white, as shown in Figure 8. Images A to D in Figure 8 correspond to the imaging regions shown by the dashed lines A to D in image 56 shown in Figure 7.

[0050] Next, for each of the binarized images A, B, C, D, ..., it is checked whether the ratio of the black portion of the annular region Rc is above a threshold. If, in all images, the ratio of the black portion of the annular region Rc is below the threshold, it is determined that the tape T is not properly attached to frame F.

[0051] Even if the proportion of black areas in the entire annular region Rc is above the threshold, there may be regions where the proportion of black areas is below the threshold when focusing on a part of the annular region Rc (i.e., the area of ​​adhesion between frame F and tape T is locally below the threshold). In this case, there is a risk that tape T may peel off from frame F, starting from the region below the threshold.

[0052] Therefore, the determination means 10 determines that the tape T is not properly attached to frame F if even one image is extracted from all the binarized images A, B, C, D, ... in which the ratio of the black portion of the annular region Rc is less than a threshold. This makes it even more reliable to send only frames F with the tape T properly attached to them to the next process.

[0053] (Second Embodiment) Next, a second embodiment of a tape application device configured according to the present invention will be described with reference to Figure 9.

[0054] (Tape application device 62) As shown in Figure 9, the tape application device 62 includes a frame support portion 64 that supports the frame F, a tape application means 66 that applies tape T to the frame F supported by the frame support portion 64, a camera 68 that images the tape T applied to the frame F, and a determination means 10 that determines whether or not the tape T is properly applied to the frame F based on the image captured by the camera 68.

[0055] (Frame support section 64) The frame support section 64 includes a support member 70 that suctions and supports the frame F, and a lifting means (not shown) for raising and lowering the support member 70.

[0056] The support member 70 is annular in shape and has a circular opening 70a in the center for accommodating the wafer W. The support member 70 is also connected to a suction means (not shown), and numerous suction holes (not shown) are formed on the lower surface of the support member 70. The support member 70 is configured to support the frame F by attracting it with the suction means, which generates suction force in the numerous suction holes.

[0057] The means for raising and lowering the frame support portion 64, although not shown in the figure, may consist of a ball screw connected to the support member 70 and extending in the vertical direction, and a motor that rotates this ball screw.

[0058] (Tape application means 66) The tape application means 66 includes a tape holding part 72 for holding the tape T, a pressing roller 74 for pressing the tape T against a frame F supported by a support member 70, and a circular cutter 76 for cutting the tape T attached to the frame F. The tape holding part 72 holds the tape T, from which the release paper P has been peeled off, in a substantially horizontal position while keeping it taut without any slack.

[0059] The tape application means 66 further includes a circular rotary table 78, a motor 80 for rotating the rotary table 78, and a lifting means (not shown) for raising and lowering the rotary table 78. The pressing roller 74 and cutter 76 are rotatably supported on the upper surface of the rotary table 78.

[0060] Although not shown in the diagram, a lifting mechanism for raising and lowering the cutter 76 is provided on the rotary table 78. The lifting mechanism positions the cutter 76 in a standby position where the upper end of the cutter 76 is lower than the upper end of the pressure roller 74, and in a cutting position where the upper end of the cutter 76 is higher than the upper end of the pressure roller 74.

[0061] (Camera 68) The camera 68 is supported on the upper surface of the rotary table 78. As shown in Figure 9(b), the camera 68, the pressure roller 74, and the cutter 76 are arranged on the same circumference corresponding to the size of the frame F. In the second embodiment, the camera 68 images the tape T attached to the frame F from below.

[0062] The operation of the tape application device 62, as described above, will now be explained.

[0063] First, the tape T, from which the release paper P has been peeled off, is held by the tape holding part 72 in a taut state without any slack. The frame F is then supported by suction on the lower surface of the support member 70, and the supported frame F is positioned above the tape T. In the example shown in Figure 9, a wafer W is attached to the tape T.

[0064] Next, the support member 70 is lowered and the rotary table 78 is raised, sandwiching the tape T between the lower surface of the frame F and the upper end of the pressure roller 74. At this time, the cutter 76 is positioned in a standby position (the upper end of the cutter 76 is lower than the upper end of the pressure roller 74). Then, by rotating the rotary table 78, the pressure roller 74 is made to rotate along the lower surface of the frame F, and the tape T is attached to the frame F.

[0065] If the tape T is a heat-sealable sheet, the temperature of the lower surface of the support member 70 or the temperature of the outer surface of the pressure roller 74 is adjusted to a temperature at which the tape T softens or melts, and then the pressure roller 74 is rotated.

[0066] After attaching the tape T to the frame F, the rotary table 78 is lowered slightly, and the cutter 76 is positioned at the cutting location. Next, the rotary table 78 is raised, and the upper end of the cutter 76 is pressed against the tape T. Then, by rotating the rotary table 78, the cutter 76 is moved around the underside of the frame F, and the tape T that extends beyond the outer circumference of the frame F is cut along the frame F.

[0067] After cutting the tape T, the rotary table 78 is lowered slightly. Next, the rotary table 78 is rotated so that the tape T attached to the frame F is imaged from below by the camera 68. The image data captured by the camera 68 is output to the determination means 10.

[0068] Then, the determination means 10, similar to the first embodiment described above, binarizes the image captured by the camera 68. If the ratio of the black portion of the annular region Rc (the portion in contact between the frame F and the tape T) is not equal to or greater than a threshold, it is determined that the tape T is not properly attached to the frame F. In this case, the tape T attachment process is repeated using the pressure roller 74. On the other hand, if the ratio of the black portion of the annular region Rc is equal to or greater than a threshold, it is determined that the tape T is properly attached to the frame F.

[0069] In the second embodiment as well, the determination means 10 may also perform a binarization process on each imaging area captured by the camera 68 and determine whether the tape T is properly attached to the frame F based on the ratio of black to white areas for each imaging area.

[0070] As described above, in the tape application devices 2 and 62 according to the first and second embodiments, it is determined whether or not the tape T is properly applied to the frame F based on the images captured by the cameras 8 and 68. Therefore, frames F on which the tape T is not properly applied are not transported to subsequent processes. Consequently, the tape T is prevented from peeling off and falling from the frame F in subsequent processes. [Explanation of symbols]

[0071] 2: Tape application device (first embodiment) 4: Frame support section 6: Tape application method 8: Camera 10: Judgment means 62: Tape application device (second embodiment) 64: Frame support section 66: Tape application method 68: Camera

Claims

1. A tape application device for applying tape to a frame having an opening in the center for housing a wafer, The system includes a frame support portion for supporting the frame, a tape application means for applying tape to the frame supported by the frame support portion, a camera for capturing images of the tape applied to the frame, and a determination means for determining whether or not the tape is properly applied to the frame based on the image captured by the camera. The determination means is a tape application device that binarizes the image for each imaging area captured by the camera and determines whether the tape is properly attached to the frame for each imaging area based on the ratio of black to white areas.

2. The tape application device according to claim 1, wherein the determination means binarizes the image and determines whether or not the tape is properly applied to the frame based on the ratio of the black portion to the white portion.

Images