Wafer transfer method and wafer transfer apparatus

Abstract

To safely transfer a wafer by replacing an adhesive tape without cutting the adhesive tape.SOLUTION: A wafer transfer method that transfers a wafer of a first workpiece unit including a first ring frame, a first adhesive tape and the wafer onto a second adhesive tape, and forms a second workpiece unit includes: a ring frame arrangement step of sandwiching a claw body between the first ring frame and the second ring frame, and thereby overlapping the second ring frame with the first ring frame without bringing the second ring frame into contact with the first ring frame; a sticking step of sticking the second adhesive tape onto a surface that is not stuck to the first adhesive tape of the wafer, and holding the wafer by the second ring frame through the second adhesive tape; and a peeling step of peeling the first adhesive tape from the wafer, and peeling the first adhesive tape from the first ring frame.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a wafer transfer method for attaching a wafer adhered to a first adhesive tape to a second adhesive tape and then peeling the first adhesive tape from the wafer, and a wafer transfer apparatus for transferring a wafer from the first adhesive tape to the second adhesive tape.

Background Art

[0002] In the manufacturing process of device chips used in electronic devices such as mobile phones and personal computers, first, a plurality of division planned lines (streets) intersecting each other are set on the surface of a wafer made of a material such as a semiconductor. Then, devices such as ICs (Integrated Circuits) and LSIs (Large-scale Integration) are formed in each region partitioned by the division planned lines. After that, when the wafer is divided along the division planned lines, individual device chips are formed. The division of the wafer is carried out, for example, by a cutting device equipped with an annular cutting blade.

[0003] Before the wafer is carried into the cutting device, an adhesive tape having a diameter larger than that of the wafer is adhered to the back surface of the wafer. This adhesive tape is called a dicing tape. The inner peripheral portion of a ring frame having an opening large enough to accommodate the wafer is adhered to the outer peripheral portion of the adhesive tape. That is, the wafer, the adhesive tape, and the ring frame are integrated to form a frame unit, and the wafer that becomes a part of the frame unit and has its surface side exposed upward is carried into the cutting device and processed.

[0004] In cutting equipment, cutting fluid is supplied to the workpiece and cutting blade while the workpiece is being cut in order to remove heat and cutting chips generated from the workpiece and cutting blade during cutting. However, when the cutting fluid, which has incorporated cutting chips, comes into contact with the surface of the workpiece and dries, the cutting chips can adhere to devices formed on the surface of the workpiece. Therefore, in order to prevent contamination of the surface side, adhesive tape is sometimes attached to the surface side instead of the back side of the wafer to form a frame unit, and the back side is exposed upwards (see Patent Document 1).

[0005] However, in this case, each chip formed by cutting the wafer will have its device formation surface facing the adhesive tape side. Therefore, when picking up the chip from the adhesive tape and mounting it to a predetermined mounting target, the circuit pattern of the device cannot be captured by the imaging unit, and the chip cannot be aligned while taking the position of the circuit pattern into consideration. For this reason, after cutting the wafer, a transfer operation (re-attachment operation) is performed in which new adhesive tape is attached to the exposed back side of the wafer and the old adhesive tape is peeled off from the wafer (see Patent Document 2).

[0006] More specifically, first, the first adhesive tape of the first frame unit, which includes the wafer, the first adhesive tape, and the first ring frame, is cut along the outer circumference of the wafer. Then, the second ring frame is placed around the wafer in place of the first ring frame, and the second adhesive tape is attached to the side of the wafer that does not have the first adhesive tape and to the second ring frame. Finally, the wafer transfer (adhesive tape replacement) is completed by peeling off the first adhesive tape remaining on the wafer. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2010-82644 [Patent Document 2] Japanese Patent Publication No. 2017-162870 [Overview of the project] [Problems that the invention aims to solve]

[0008] However, when performing wafer transfer using this method, there is a risk that the cutting tool used to cut the first adhesive tape may come into contact with the wafer, potentially damaging the wafer (chip). Furthermore, cutting the first adhesive tape generates debris, which may adhere to the wafer and contaminate it.

[0009] By the time the transfer process is carried out, the wafer has undergone various processing steps that have incurred enormous costs and time. Therefore, damage or contamination of the wafer (chip) at this stage, just before the chip is completed, would result in significant losses. Consequently, there is a demand to perform the wafer transfer process (replacement of adhesive tape) without cutting the adhesive tape.

[0010] This invention has been made in view of the above problems, and its object is to provide a wafer transfer method and a wafer transfer apparatus that can safely transfer wafers by replacing adhesive tape without cutting it. [Means for solving the problem]

[0011] According to one aspect of the present invention, a wafer transfer method for forming a second work unit is formed by transferring a wafer of a first work unit, which includes a first ring frame having a first opening in the center, a first adhesive tape attached to the first ring frame so as to close the first opening, and a wafer attached to the first adhesive tape in the first opening of the first ring frame, to a second adhesive tape attached to the second ring frame so as to close a second opening provided in the center of the second ring frame, comprising: a ring frame arrangement step of overlapping the second opening with the first opening, facing the second ring frame to a surface of the first ring frame of the first work unit that is not attached to the first adhesive tape, and overlapping the second ring frame with the first ring frame without contacting the first ring frame by sandwiching a claw body between the first ring frame and the second ring frame; The second ring frame is supported by the claw body. The method comprises: an attachment step of attaching the second adhesive tape to the surface of the wafer that is not attached to the first adhesive tape, so that the first ring frame and the second ring frame are in contact and overlapping, and holding the wafer with the second ring frame via the second adhesive tape; and a peeling step of peeling the first adhesive tape from the wafer and peeling the first adhesive tape from the first ring frame, so that the first ring frame and the second ring frame are in contact and overlapping. , the wafer is transferred to the second adhesive tape without cutting the first adhesive tape. A wafer transfer method characterized by the following is provided.

[0012] Preferably, in the attachment step, the second adhesive tape, which has been previously attached to the second ring frame, is attached to the wafer.

[0013] Preferably, the process further includes a cleaning step in which the wafer is washed with a liquid after the peeling step.

[0014] More preferably, in the peeling step, a release tape is attached to the first adhesive tape, and the release tape is moved to peel the first adhesive tape away from the first ring frame and the wafer.

[0015] Preferably, when the wafer is attached to the second adhesive tape in the attachment step, the relative positions of the wafer and the first ring frame in the direction through the first opening are adjusted in advance, accompanied by deformation of the first adhesive tape, thereby bringing the wafer closer to the second adhesive tape.

[0016] Furthermore, according to another aspect of the present invention, a wafer transfer apparatus for forming a second work unit, comprising: a first work unit including a first ring frame having a first opening in the center; a first adhesive tape attached to the first ring frame so as to close the first opening; and a wafer attached to the first adhesive tape in the first opening of the first ring frame, transfers the wafer of the first work unit to a second adhesive tape attached to the second ring frame so as to close a second opening provided in the center of the second ring frame, the apparatus comprising: a wafer support portion that supports the wafer via the first adhesive tape; a ring frame support portion that supports the first ring frame via the first adhesive tape; a first work unit support unit that supports the first work unit with the side of the wafer not attached to the first adhesive tape exposed upwards; and a first work unit support unit facing the first ring frame supported by the ring frame support portion of the first work unit support unit. A second ring frame support unit includes a first claw portion having the function of supporting a second ring frame and the function of being sandwiched between the first ring frame and the second ring frame, the first claw portion being movable between a region between the first ring frame and the second ring frame and the outside of the region, and a second ring frame support unit positioned above the second ring frame support unit and not attached to the first adhesive tape of the wafer supported by the wafer support portion of the first work unit support unit. The device comprises: a tape application unit for applying the second adhesive tape to the surface; a holding unit having a second claw portion, which is inserted between the first ring frame and the second ring frame to hold the second ring frame with the second claw portion and to hold the wafer via the second adhesive tape; and a peeling unit that, while the holding unit is holding the wafer, peels the first adhesive tape from the wafer and peels the first adhesive tape from the first ring frame. The tape application unit applies the second adhesive tape to the wafer while the second ring frame is supported by the first claw portion, and transfers the wafer to the second adhesive tape without cutting the first adhesive tape. A wafer transfer apparatus is provided, characterized by the following:

[0017] Preferably, the system further includes a tape supply unit that pre-applies the second adhesive tape to the second ring frame so as to close the second opening, before the second ring frame is supported by the second ring frame support unit.

[0018] Preferably, the system further includes a cleaning unit for cleaning the wafer from which the first adhesive tape has been peeled off by the peeling unit with a liquid.

[0019] More preferably, the release unit includes a release tape supply unit on which a release tape, comprising a base material and an adhesive layer formed on one side of the base material, is mounted in a roll-like manner and can be pulled out; a plurality of rollers that guide the release tape pulled out from the release tape supply unit to form a path for the release tape; a movable body having a pressing part for pressing and attaching the release tape to the first adhesive tape; a drive unit for moving the movable body; and a winding unit for winding up and recovering the release tape. The release tape is pressed and attached to the first adhesive tape by the pressing part, the release tape is moved by moving the movable body with the drive unit to peel the first adhesive tape from the first ring frame and the wafer with the release tape, and the release tape with the first adhesive tape attached is wound up and recovered by the winding unit.

[0020] Preferably, the first work unit support unit further includes a lifting mechanism for raising and lowering the wafer support portion and the ring frame support portion relative to each other. [Effects of the Invention]

[0021] In one aspect of the present invention, a wafer transfer method and wafer transfer apparatus are used. First, a second ring frame is placed on top of a first ring frame of a first work unit, with a claw body (claw portion) sandwiched between them. The claw body then functions as a separator, so that the second ring frame overlaps the first ring frame without contacting it. Next, a second adhesive tape is attached to the wafer, and the wafer is held by the second ring frame via the second adhesive tape.

[0022] Finally, by peeling the first adhesive tape from the wafer and the first ring frame, a second work unit including the wafer, the second adhesive tape, and the second ring frame is formed. Thereby, the transfer of the wafer is completed. When the wafer is transferred in this way, the step of cutting the first adhesive tape with a cutting tool becomes unnecessary. Therefore, the cutting tool does not come into contact with the wafer, and adhesion of cutting chips generated by cutting the first adhesive tape to the wafer does not occur.

[0023] In particular, a predetermined interval is formed between the second ring frame and the first ring frame by the claw body (claw portion) being sandwiched therebetween. Therefore, when the second adhesive tape is attached to the wafer, a situation where the second adhesive tape hangs down and adheres to the first adhesive tape is prevented.

[0024] Therefore, according to one aspect of the present invention, there are provided a wafer transfer method and a wafer transfer apparatus capable of safely transferring a wafer by replacing the adhesive tape without cutting it.

Brief Description of the Drawings

[0025] [Figure 1] FIG. 1(A) is a perspective view schematically showing a wafer, and FIG. 1(B) is a perspective view schematically showing a first work unit. [Figure 2] It is a perspective view schematically showing a wafer transfer apparatus. [Figure 3] It is a perspective view schematically showing a cassette, a push-pull arm, a first ultraviolet irradiation unit, a first work unit transfer unit, and a work unit support unit. [Figure 4] It is a perspective view schematically showing a ring frame housing portion, a ring frame transfer unit, a ring frame support table, and an adhesive tape supply unit. <UNK>0000107<UNK> [Figure 5] It is a perspective view schematically showing a ring frame housing portion. [Figure 6]Figure 6(A) is a schematic perspective view showing the first work unit support unit and the second ring frame support unit, Figure 6(B) is a schematic perspective view showing the ring frame placement step, and Figure 6(C) is a schematic perspective view showing the adhesion step. [Figure 7] This is a schematic cross-sectional view illustrating the adhesion step. [Figure 8] This is a schematic perspective view showing the holding unit and the release unit. [Figure 9] Figure 9(A) is a schematic cross-sectional view showing one cross-section of the bonded object held by the holding unit, and Figure 9(B) is a schematic cross-sectional view showing another cross-section of the bonded object held by the holding unit. [Figure 10] Figure 10(A) is a schematic cross-sectional view showing the initial stage of the peeling step, and Figure 10(B) is a schematic cross-sectional view showing the final stage of the peeling step. [Figure 11] This is a schematic cross-sectional view showing the retrieval of the first ring frame. [Figure 12] This is a schematic perspective view showing the reversing unit, transfer table, second work unit transport unit, guide rail table, second ultraviolet irradiation unit, cleaning unit, and push-pull arm. [Figure 13] This is a schematic perspective view showing the guide rail table, push-pull arm, second ultraviolet irradiation unit, and cleaning unit separated from each other. [Figure 14] This is a flowchart showing the flow of each step in the wafer transfer method. [Modes for carrying out the invention]

[0026] Embodiments of the present invention will be described with reference to the attached drawings. In the wafer transfer method and wafer transfer apparatus according to this embodiment, a wafer attached to a first adhesive tape is transferred to a second adhesive tape. That is, the first adhesive tape that was attached to the wafer is replaced with the second adhesive tape. The wafer that was included in the first work unit then becomes included in the second work unit.

[0027] First, the wafer transferred from the first adhesive tape to the second adhesive tape will be described. Figure 1(A) is a perspective view showing the front surface 1a side of wafer 1. Figure 1(B) includes a perspective view showing the back surface 1b side of wafer 1. Wafer 1 is, for example, a roughly disc-shaped substrate made of a semiconductor material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor materials. However, wafer 1 is not limited to these.

[0028] The surface 1a of wafer 1 is divided by a plurality of intersecting division lines 3. Devices 5, such as ICs and LSIs, are formed in each region of the surface 1a of wafer 1 that is divided by the division lines 3. By dividing wafer 1 along the division lines 3, individual device chips, each having a device 5, can be manufactured. Dividing wafer 1 is carried out using processing equipment such as a cutting machine or a laser processing machine.

[0029] When wafer 1 is loaded into the processing equipment, a work unit is formed in advance by integrating wafer 1, an adhesive tape called dicing tape, and a ring frame made of a material such as metal. At this time, if the adhesive tape is attached to the back surface 1b of wafer 1, the front surface 1a is exposed, so processing debris generated during processing adheres to device 5 and contaminates device 5.

[0030] Therefore, the surface 1a side of the wafer 1 may be attached to the adhesive tape to form a frame unit. Figure 1(B) is a schematic perspective view showing a first work unit 11a formed by integrating a first ring frame 9, a first adhesive tape 7, and a wafer 1.

[0031] The first ring frame 9 is made of a metal material such as aluminum or stainless steel. A first opening 9c is provided in the center of the first ring frame 9. The first opening 9c penetrates from the front surface 9a to the back surface 9b of the first ring frame 9 and has a diameter larger than the diameter of the wafer 1.

[0032] The first adhesive tape 7 is attached to the first ring frame 9 so as to cover the first opening 9c. The first adhesive tape 7 has a diameter larger than the diameter of the first opening 9c of the first ring frame 9. The first adhesive tape 7 includes, for example, a base layer formed of a resin film and an adhesive layer formed on one side of the base layer. Preferably, the adhesive layer is made of an ultraviolet-curing resin. In this case, the adhesive strength of the adhesive layer can be reduced by irradiating the first adhesive tape 7 with ultraviolet light.

[0033] When the first adhesive tape 7 is attached to the first ring frame 9 so as to cover the first opening 9c, the adhesive layer of the first adhesive tape 7 is exposed in the first opening 9c. Then, the wafer 1 is attached to the first adhesive tape 7 from the surface 1a side in the first opening 9c.

[0034] Wafer 1 is transported to the processing apparatus while contained in the first work unit 11a shown in Figure 1(B), where it is processed and divided. Afterward, the first work unit 11a is removed from the processing apparatus. However, if the first adhesive tape 7 is attached to the surface 1a of wafer 1, it becomes difficult to confirm the circuit patterns and other elements constituting the device 5.

[0035] Therefore, in the wafer transfer method and wafer transfer apparatus according to this embodiment, a second adhesive tape is attached to the back surface 1b side of the wafer 1, and the wafer 1 is transferred by peeling the wafer 1 off the first adhesive tape 7. Then, a second work unit is formed, which consists of the wafer 1, the second adhesive tape, and the second ring frame.

[0036] However, the wafer transfer method and wafer transfer apparatus according to this embodiment are not limited thereto, and a first adhesive tape 7 may be attached to the back surface 1b of the wafer 1, and a second adhesive tape may be attached to the front surface 1a. Hereinafter, an example will be described in which a first work unit 11a is formed by attaching the first adhesive tape 7 to the front surface 1a side of the wafer 1, and a second work unit is formed by attaching the second adhesive tape to the back surface 1b and peeling off the first adhesive tape 7 from the front surface 1a side. However, in the following description, the front surface 1a and back surface 1b may be read interchangeably.

[0037] The transfer of wafer 1 is performed using the wafer transfer apparatus 2 shown in Figure 2. First, the wafer transfer apparatus 2 will be described in detail. Figure 2 is a schematic perspective view of the wafer transfer apparatus 2. The first work unit 11a, which includes wafer 1, is loaded into the wafer transfer apparatus 2 in a cassette 8a capable of accommodating multiple first work units 11a. The second work unit formed by the transfer of wafer 1 in the wafer transfer apparatus 2 is then housed in a cassette 8b capable of accommodating multiple second work units.

[0038] As shown in Figure 2, the wafer transfer apparatus 2 includes a base 4 that supports each component. On the front side of the base 4 are a cassette table 6a on which a cassette 8a containing the first work unit 11a is placed, and a cassette table 6b on which a cassette 8b containing the second work unit is placed. The cassette tables 6a and 6b can be raised and lowered vertically (in the Z-axis direction) by a lifting mechanism (not shown).

[0039] Multiple storage rails are provided on both side walls of the storage space of cassettes 8a and 8b, at corresponding height positions. The ring frame of the work unit housed in cassettes 8a and 8b has one end resting on a storage rail on one side wall and the other end resting on a corresponding storage rail on the other side wall.

[0040] In the wafer transfer apparatus 2, a cassette 8a containing multiple first work units 11a is placed on the cassette table 6a, and the first work units 11a are successively unloaded from the cassette 8a, and the wafer 1 contained in each is replaced with a second adhesive tape. Then, the formed second work units are successively placed in the cassette 8b which is placed on the cassette table 6b.

[0041] On the rear side (positive X-axis direction side) of the upper surface of the base 4 adjacent to the cassette table 6a, there is a temporary storage table consisting of a pair of guide rails 12 that move closer to and further away from each other while maintaining a state parallel to the X-axis direction. Also, adjacent to the temporary storage table on the upper surface of the base 4, there is a push-pull arm (unloading unit) 10 for unloading the first work unit 11a, which is housed in the cassette 8a placed on the cassette table 6a, from the cassette 8a.

[0042] Figure 3 is a schematic perspective view showing a cassette 8a placed on a cassette table 6a, a pair of guide rails 12, and a push-pull arm 10. Each of the pair of guide rails 12 has a horizontal support surface 12a (along the XY plane) that supports the first ring frame 9 of the first work unit 11a from below, and a stopper surface 12b (along the XZ plane) that is approximately perpendicular to the support surface 12a. The stopper surfaces 12b of each guide rail 12 face each other.

[0043] The push-pull arm 10 is connected to a moving mechanism (not shown) that moves the push-pull arm 10 along the X-axis direction, and is movable along the X-axis direction by this moving mechanism. A gripping portion is provided on the side of the push-pull arm 10 facing the cassette 8a (cassette table 6a) for gripping the first ring frame 9 of the first work unit 11a. The gripping portion grips the first ring frame 9 from above and below.

[0044] As shown in Figure 3, the wafer transfer apparatus 2 includes a first ultraviolet irradiation unit 14 located in the area directly below a pair of guide rails 12 inside the base 4. In Figure 3, the first ultraviolet irradiation unit 14 is indicated by a dashed line. The first ultraviolet irradiation unit 14 has the function of irradiating the first work unit 11a, which is pulled out by the pair of guide rails 12, with ultraviolet light from below, and is equipped with an ultraviolet light source.

[0045] When the first work unit 11a housed in the cassette 8a is unloaded using the push-pull arm (unloading unit) 10, the push-pull arm 10 is moved toward the cassette 8a and the first ring frame 9 is gripped by the push-pull arm 10. At this time, the cassette table 6a is raised or lowered so that the height of the gripping part of the push-pull arm 10 corresponds to the height of the first work unit 11a to be unloaded.

[0046] Subsequently, when the push-pull arm 10 is moved away from the cassette 8a, the first work unit 11a is pulled out from the cassette 8a onto the support surface 12a of the guide rail 12. At this time, the position of the push-pull arm 10 can be adjusted to position the first work unit 11a in a predetermined position in the X-axis direction. After that, the grip of the first ring frame 9 by the push-pull arm 10 is released.

[0047] Next, the pair of guide rails 12 are moved in a linked direction toward each other, and the first ring frame 9 is sandwiched between the abutment surfaces 12b of the pair of guide rails 12, thereby positioning the first work unit 11a at a predetermined position in the Y-axis direction.

[0048] Furthermore, the first work unit 11a, which is pulled out onto the pair of guide rails 12, is irradiated from below with ultraviolet light by the first ultraviolet irradiation unit 14. When the adhesive layer of the first adhesive tape 7 is made of ultraviolet curing resin, the adhesive strength of the adhesive layer decreases when the first adhesive tape 7 is irradiated with ultraviolet light. Therefore, when peeling the first adhesive tape 7 from the wafer 1 and the first ring frame 9 as described later, the first adhesive tape 7 can be peeled off easily and cleanly.

[0049] The wafer transfer apparatus 2 includes a first work unit support unit 26 positioned adjacent to a temporary placement unit composed of a pair of guide rails 12. The first work unit support unit 26 has the function of supporting the first work unit 11a. When the first work unit 11a is supported by the first work unit support unit 26, the back surface 1b of the wafer 1, opposite to the front surface 1a attached to the first adhesive tape 7, is exposed upwards.

[0050] The first work unit support unit 26 includes a wafer support portion 28 that supports the wafer 1 of the first work unit 11a via the first adhesive tape 7, and a ring frame support portion 30 that supports the first ring frame 9 via the first adhesive tape 7.

[0051] The wafer support portion 28 has a circular upper surface that serves as the support surface, with a diameter approximately the same as that of the wafer 1. The ring frame support portion 30 has an annular upper surface that serves as the support surface, and its inner periphery has a diameter approximately the same as that of the first opening 9c of the first ring frame 9.

[0052] Furthermore, the first work unit support unit 26 includes a wafer support section 28 and a ring frame support section 30, and a lifting section (not shown) that moves them up and down relative to each other. There are no particular restrictions on the lifting section, but a ball screw type lifting mechanism or a lifting mechanism equipped with an air cylinder can be applied. The wafer support section 28 and the ring frame support section 30 can each be moved up and down independently along the Z-axis direction.

[0053] Furthermore, the wafer support portion 28 may incorporate a heating mechanism (heater) such as an electric heating element, and the wafer 1 supported by the wafer support portion 28 may be heated to a predetermined temperature in the range of 30°C to 80°C. When the wafer 1 supported by the wafer support portion 28 is heated, the second adhesive tape is heated and softened when it is attached to the wafer 1 as described later. In this case, the second adhesive tape becomes more easily deformable to follow the shape of the surface (back surface 1b) of the wafer 1 to which it is attached, and the adhesive force is strengthened.

[0054] The wafer transfer apparatus 2 includes a first work unit transport unit 16 that transports the first work unit 11a from a temporary placement unit composed of a pair of guide rails 12 to a first work unit support unit 26. The first work unit transport unit 16 transports the first work unit 11a, which is positioned at a predetermined position in the X-axis and Y-axis directions, with predetermined movements, and transports the first work unit 11a to a predetermined position on the first work unit support unit 26.

[0055] The first work unit transport unit 16 includes a rail 18 aligned with the X-axis direction, an arm 20 whose base end is slidably mounted on the rail 18, and a holding part 22 provided below the tip of the arm 20, which extends horizontally, via a lifting mechanism 24. The holding part 22 has the function of, for example, suction-holding the first ring frame 9 of the first work unit 11a from above. The lifting mechanism 24 is composed of an air cylinder or the like and has the function of raising and lowering the holding part 22.

[0056] Returning to Figure 2, we will continue our explanation of the wafer transfer apparatus 2. The wafer transfer apparatus 2 includes a second ring frame support unit 72 above the first work unit support unit 26, which supports the second ring frame. The second ring frame support unit 72 will be described in detail later. The wafer transfer apparatus 2 also has a supply mechanism on the rear side (backward side in the X-axis direction) of the first work unit support unit 26 on the base 4, which supplies the second ring frame to the second ring frame support unit 72.

[0057] The second ring frame supply mechanism will be explained using Figure 4. Figure 4 is a schematic perspective view showing the ring frame housing section 32, the ring frame transport unit 38, the ring frame support table 48, and the adhesive tape supply unit 50.

[0058] The ring frame housing section 32 has the function of stacking and housing multiple second ring frames and is located inside the base 4. The second ring frames used to form the second work unit are supplied from the ring frame housing section 32.

[0059] Figure 5 is a schematic perspective view of the ring frame housing section 32. Figure 5 schematically shows a second ring frame 13 housed in the ring frame housing section 32. For the sake of explanation, Figure 5 shows only one second ring frame 13 housed in the ring frame housing section 32. Needless to say, the second ring frame 13 housed in the ring frame housing section 32 is not limited to just one.

[0060] Here, the second ring frame 13 is configured in the same way as the first ring frame 9. That is, the second ring frame 13 is made of a metal material such as aluminum, and a second opening 13c is formed in the center that penetrates the surface 13a and the back surface 13b. The second ring frame 13 is housed in the ring frame housing section 32 with, for example, the surface 13a facing downwards and the back surface 13b side to which the second adhesive tape is attached (as described later) facing upwards.

[0061] The ring frame housing section 32 includes a support table 34 on which a plurality of stacked second ring frames 13 are placed, and a plurality of positioning columns 36 that are erected from the outer periphery of the support table 34 and surround the second ring frames 13 from the outer periphery. Notches, straight sections, and arc sections are formed on the outer periphery of the second ring frames 13 for various purposes. The positioning columns 36 are positioned to correspond to the shape of the outer periphery of the second ring frames 13.

[0062] The positioning column 36 defines the position, orientation, and front / back orientation of the second ring frame 13 housed in the ring frame housing section 32. Conversely, the second ring frame 13 cannot be placed on the support table 34 unless it is in the predetermined position and orientation. Furthermore, because the positioning column 36 gets in the way, it is not possible to place the second ring frame 13 on the support table 34 with the front surface 13a facing up and the back surface 13b facing down.

[0063] Therefore, when the second ring frame 13 housed in the ring frame housing section 32 is transported by a predetermined transport operation, the second ring frame 13 can be supplied to a predetermined location in a predetermined position and orientation.

[0064] Next, a ring frame transport unit 38 for transporting the second ring frame 13 housed in the ring frame housing section 32 will be described. As shown in Figure 4, the ring frame transport unit 38 comprises a rail 42 along the Y-axis, a movable body 40 slidably mounted on the rail 42, an arm portion 44 extending from the movable body 40 in the X-axis direction, and a holding portion 46 disposed at the tip of the arm portion 44.

[0065] The arm portion 44 is movable up and down along the movable body 40. That is, the ring frame transport unit 38 is equipped with a lifting mechanism (not shown) on the movable body 40 to move the arm portion 44 up and down along the Z-axis. In addition, the holding portion 46 can hold the second ring frame 13 from above by suction. That is, the ring frame transport unit 38 is equipped with a suction mechanism (not shown) connected to the holding portion 46 to transport the second ring frame 13 while holding it by suction.

[0066] One end of the rail 42 reaches the vicinity of the ring frame housing section 32, and the other end of the rail 42 reaches the vicinity of the ring frame support table 48, which will be described next. The ring frame transport unit 38 transports the second ring frame 13 from the ring frame housing section 32 to the ring frame support table 48.

[0067] On the ring frame support table 48, a second adhesive tape is attached to the back surface 13b of the second ring frame 13 so as to close the second opening 13c. Above the ring frame support table 48, an adhesive tape supply unit 50 is provided to supply the second adhesive tape to the second ring frame 13. Next, the adhesive tape supply unit 50 will be described.

[0068] The adhesive tape supply unit 50 includes a feed roll 52 on which a long length of supply tape 58 is wound, a plurality of rollers 56 that form the path of the supply tape 58 fed from the feed roll 52, and a take-up roll 54 that winds up the supply tape 58. The adhesive tape supply unit 50 is supported by a lifting mechanism (not shown) and can be raised and lowered above the ring frame support table 48.

[0069] The supply tape 58 has, for example, a base layer made of resin or the like, and an adhesive layer formed on one side of the base layer. When the supply tape 58 is cut into a predetermined shape, a second adhesive tape can be formed. The adhesive tape supply unit 50 includes a cutting section 60 for cutting the supply tape 58. The cutting section 60 has a rotating shaft section 62 along the Z axis, an arm section 64 extending horizontally from the lower end of the rotating shaft section 62, and a cutter (cutting tool) 66 disposed below the tip of the arm section 64.

[0070] The rotating shaft portion 62 of the cutting section 60 is positioned directly above the center of the second opening 13c of the second ring frame 13, which is supported by the ring frame support table 48. The arm portion 64 is longer than the diameter of the second opening 13c. The cutting section 60 has a rotational drive source, such as a motor (not shown), that rotates the rotating shaft portion 62, and by operating this rotational drive source, the cutter 66 is moved along an annular trajectory with the arm portion 64 as its diameter.

[0071] When supplying the second adhesive tape from the adhesive tape supply unit 50 to the second ring frame 13, first, the adhesive tape supply unit 50 is lowered toward the second ring frame 13 which is supported by the ring frame support table 48. Then, the supply tape 58 is attached to the exposed back surface 13b of the second ring frame 13. After that, the cutter 66 of the cutting section 60 is made to cut into the supply tape 58 on the second ring frame 13, and the cutter 66 is rotated around the second opening 13c to cut the supply tape 58 into a circular shape.

[0072] This allows the second adhesive tape 15 (see Figure 6(B), etc.) to be supplied to the back surface 13b of the second ring frame 13. However, the supply tape 58 may also be a support tape on which a plurality of second adhesive tapes, pre-formed into a predetermined shape, are arranged in a row, and the second adhesive tape 15 may be transferred from the supply tape 58, which is the support tape, to the second ring frame 13. In this case, the cutting section 60 is unnecessary, and no cutting debris is generated when the supply tape 58 is cut.

[0073] Furthermore, the adhesive tape supply unit 50 does not necessarily have to be positioned above the ring frame support table 48, and the second adhesive tape 15 does not necessarily have to be supplied to the second ring frame 13 by the ring frame support table 48. For example, the adhesive tape supply unit 50 may supply the second adhesive tape 15 to the second ring frame 13 and the wafer 1 on a second ring frame support unit 72, which will be described later.

[0074] The second ring frame 13 is transported from the ring frame support table 48 to the second ring frame support unit 72, which is located above the first work unit support unit 26. The wafer transfer apparatus 2 has a ring frame transport unit 68 that transports the second ring frame 13 from the ring frame support table 48 to the second ring frame support unit 72.

[0075] The ring frame transport unit 68 is configured similarly to the ring frame transport unit 38 described above. It comprises a rail 70 along the X-axis, a movable body (not shown) slidably mounted on the rail 70, an arm extending from the movable body in the Y-axis direction, and a holding part disposed at the tip of the arm. This holding part is vertically movable and can hold the second ring frame 13 from above by suction. In other words, the ring frame transport unit 68 can transport the second ring frame 13 while holding it by suction.

[0076] Next, the second ring frame support unit 72 will be described. Figure 6(A) schematically shows the second ring frame support unit 72. The second ring frame support unit 72 comprises a plurality of thin plate-shaped first claw portions (claw bodies) 74. The plurality of first claw portions 74 are arranged on the same horizontal plane (on the XY plane) so as to surround the central space in a ring shape. A predetermined gap is secured between adjacent first claw portions 74, and as will be described later, the second claw portion 102 of the holding unit 90 (see Figure 9(A), etc.) is inserted into this gap.

[0077] The inner periphery of each first claw portion 74 is arc-shaped, and the central space enclosed by the inner periphery of each first claw portion 74 is approximately circular. The second ring frame support unit 72 is equipped with a sliding mechanism (not shown) that allows each first claw portion 74 to slide radially outward in this central circular space. The sliding mechanism is composed of, for example, a ball screw type moving mechanism or an air cylinder type telescopic mechanism.

[0078] When each first claw portion 74 is not sliding radially outward, the diameter of the circular space surrounded by the inner periphery of each first claw portion 74 is greater than or equal to the diameter of the first opening 9c of the first ring frame 9 and the diameter of the second opening 13c of the second ring frame 13. In this case, as described later, when the second adhesive tape 15 is attached to the wafer 1, the first claw portion 74 is hidden by the first ring frame 9 and the second ring frame 13, preventing the first adhesive tape 7 or the second adhesive tape 15 from sticking to the first claw portion 74.

[0079] However, the diameter of the circular space is not limited to this. For example, the diameter of the circular space may be smaller than the diameters of the first opening 9c and the second opening 13c, and larger than the diameter of the wafer 1. In this case, the first claw portion 74 prevents contact between the first adhesive tape 7 and the second adhesive tape 15 when the second adhesive tape 15 is attached to the wafer 1. In this case, since there is a possibility of contact between the first adhesive tape 7 and the second adhesive tape 15 and the first claw portion 74, it is preferable to perform a treatment (fluororesin coating, etc.) on the surface of the first claw portion 74 to reduce the frictional force so that the adhesive layer does not stick easily.

[0080] Next, the usage of the second ring frame support unit 72 will be described. First, the second ring frame 13 is transported onto the first claw portion 74. Figure 6(B) schematically shows the second ring frame 13 supported by the first claw portion 74. In the example shown in Figure 6(B), the second adhesive tape 15 is attached to the back surface 13b side of the second ring frame 13 that is exposed above. In Figure 6(B), the second opening 13c of the second ring frame 13 is shown by a dashed line.

[0081] The second ring frame 13 is transported to a predetermined position on the first claw portion 74 such that the centers of the circular space enclosed by the first claw portion 74 and the second opening 13c overlap. The first work unit 11a is placed on the first work unit support unit 26. At this time, the first claw portion 74 supports the second ring frame 13 so as to face the first ring frame 9 which is supported by the ring frame support portion 30 of the first work unit support unit 26.

[0082] Then, in this state, the wafer support portion 28 and the ring frame support portion 30 of the first work unit support unit 26 are raised. Figure 6(C) is a schematic perspective view showing the raised wafer support portion 28 and ring frame support portion 30. Figure 7 also includes a schematic cross-sectional view showing the raised wafer support portion 28 and ring frame support portion 30.

[0083] When both are raised, as shown in Figure 7, the first claw portion 74 is sandwiched between the first ring frame 9 and the second ring frame 13. The distance between the first ring frame 9 and the second ring frame 13 at this time corresponds to the thickness of the first claw portion 74. In other words, the first claw portion 74 functions as a spacer that separates the two by a predetermined distance.

[0084] At this time, it is preferable that the wafer support portion 28 of the first work unit support unit 26 rises higher than the ring frame support portion 30, as shown in Figure 7. For example, the wafer transfer apparatus 2 controls the height of the wafer support portion 28 so that the back surface 1b of the wafer 1 is higher than the surface 9a of the first ring frame 9. In this state, the second adhesive tape 15 is attached to the back surface 1b of the wafer 1.

[0085] Here, if the wafer support 28 is equipped with a heating mechanism, it is preferable to activate the heating mechanism to heat the wafer 1 to a predetermined temperature. When the second adhesive tape 15 comes into contact with the back surface 1b of the high-temperature wafer 1, the second adhesive tape 15 is heated, softened, and becomes more easily deformable. For example, if an uneven shape is formed on the back surface 1b of the wafer 1, when the second adhesive tape 15 is softened, the second adhesive tape 15 will deform to follow this uneven shape and adhere to the wafer 1, so the second adhesive tape 15 adheres to the wafer 1 more firmly.

[0086] The wafer transfer apparatus 2 is positioned above the second ring frame support unit 72 and includes a tape application unit 76 that applies the second adhesive tape 15 to the back surface 1b of the wafer 1, which is supported by the wafer support portion 28 of the first work unit support unit 26. The tape application unit 76 includes a roller 78 that rolls over the second adhesive tape 15 and presses the second adhesive tape 15 downward, thereby bringing the second adhesive tape 15 into contact with and applying it to the back surface 1b of the wafer 1.

[0087] The roller 78 extends horizontally (in the XY plane), is movable up and down in a direction perpendicular to the horizontal plane (in the Z-axis direction), and is also movable in a direction perpendicular to the direction in which the roller 78 extends on the horizontal plane. In order to allow the roller 78 to move within the second opening 13c of the second ring frame 13, the length of the roller 78 is smaller than the diameter of the second opening 13c of the second ring frame 13, and greater than or equal to the diameter of the wafer 1.

[0088] As shown in Figure 7, the tape application unit 76 lowers the roller 78 into the second opening 13c of the second ring frame 13 and presses the second adhesive tape 15 from above, thereby attaching the second adhesive tape 15 to one end of the back surface 1b of the wafer 1. Then, the roller 78 is moved on a horizontal plane, and the second adhesive tape 15 is attached to the entire surface of the back surface 1b of the wafer 1.

[0089] At this time, the first claw portion 74 separates the first ring frame 9 and the second ring frame 13 by a predetermined distance. Furthermore, the wafer support portion 28 of the first work unit support unit 26 is positioned higher than the ring frame support portion 30. In this case, the distance between the second adhesive tape 15 and the first ring frame 9 and the first adhesive tape 7 becomes relatively large, while the wafer 1 approaches the second adhesive tape 15.

[0090] Therefore, even if the second adhesive tape 15 hangs down outside the wafer 1, it is less likely to come into contact with the first ring frame 9 or the first adhesive tape 7. If the second adhesive tape 15 were to come into contact with these and stick, it would be necessary to peel off the second adhesive tape 15. In this case, it is possible that the wafer 1 or other components would be subjected to stress and damaged, or that the second adhesive tape 15 would undergo unnecessary stretching.

[0091] In particular, when the adhesive layers of the first adhesive tape 7 and the second adhesive tape 15 come into contact with each other, they stick together with an extremely large force. When separating them, a considerable force is applied to each element, causing damage, deformation, or stretching of each component, making it impossible to form the second work unit in the desired state. This problem can be prevented by using the first claw portion 74 as a separator to ensure the distance between the first ring frame 9 and the second ring frame 13, and by raising the wafer support portion 28 relatively.

[0092] This effect is particularly pronounced when the first claw portion 74 is not positioned to overlap the first opening 9c and the second opening 13c, and when the first claw portion 74 is not inserted between the first adhesive tape 7 and the second adhesive tape 15.

[0093] For example, if the diameter of wafer 1 is 6 inches, the inner diameter of the first opening 9c of the first ring frame 9 is 194 mm, and the thickness of the first ring frame 9 and the second ring frame 13 is 1.2 mm, then the thickness of the first claw portion 74 should be 2 mm. The length of the roller 78 should be 156 mm, which is greater than the diameter of wafer 1.

[0094] However, in each cross-sectional view, including Figure 7, the first claw portion 74 is depicted as thinner than the first ring frame 9 and the second ring frame 13 for the sake of explanation. The thickness of each component is not limited to those shown in Figure 7, etc. Using the first claw portion 74 that exceeds the thickness of the first ring frame 9 and the second ring frame 13 allows them to be separated by a sufficient distance, preventing contact between the adhesive tapes. However, the thickness of the first claw portion 74 is not limited to this.

[0095] When wafer 1 is attached to the second adhesive tape 15, a composite body is formed in which the first ring frame 9, the first adhesive tape 7, the second ring frame 13, the second adhesive tape 15, and wafer 1 are integrated. In the wafer transfer apparatus 2, a second work unit is formed by separating the first ring frame 9 and the first adhesive tape 7 from this composite body.

[0096] As shown in Figure 2, the wafer transfer apparatus 2 includes a peeling unit 108 that peels the first adhesive tape 7 from the wafer 1 and peels the first adhesive tape 7 from the first ring frame 9. It also includes a composite transport mechanism 80 that holds the composite including the wafer 1 and transports it toward the peeling unit 108.

[0097] The combined body transport mechanism 80 and its operation will now be described. The combined body transport mechanism 80 is movably supported on a support portion 82 along the Y-axis direction. Figure 8 includes a schematic perspective view of the combined body transport mechanism 80. A rail 84 is provided on one surface of the support portion 82 along the Y-axis direction. One end of the rail 84 reaches near the second ring frame support unit 72, and the other end reaches near the separation unit 108.

[0098] The base end of an arm 86 slidably mounted on the rail 84 is aligned with the X-axis direction, and a holding unit 90 is fixed to the tip of the arm 86 via a lifting unit 88, which consists of an extendable and retractable air cylinder mechanism or the like, aligned with the Z-axis direction. In other words, the height position of the holding unit 90 can be changed by operating the lifting unit 88.

[0099] The holding unit 90 has the function of holding an assembly that includes a first ring frame 9, a first adhesive tape 7, a wafer 1, a second adhesive tape 15, and a second ring frame 13. The assembly can be transported by moving the holding unit 90 that holds the assembly along the rail 84. The holding unit 90 includes a suction holding part 92 that holds the wafer 1 by suction from above, a plurality of second claw parts 102 that hold the second ring frame 13, and a third claw part 106 that holds the first ring frame 9.

[0100] The suction holding section 92 has a flat lower surface and is connected to a suction mechanism (not shown) that extends through this lower surface, and has the function of holding the wafer 1 by suction via the second adhesive tape 15. The suction holding section 92 may also have a built-in heating mechanism (heater), such as an electric heating wire, and the wafer 1 held by the suction holding section 92 may be heated to a predetermined temperature in the range of 30°C to 80°C.

[0101] Figure 9(A) is a schematic cross-sectional view showing the holding unit 90 cut along the XZ plane or the YZ plane. Figure 9(B) is a schematic cross-sectional view showing the holding unit 90 cut along a plane in which the XZ plane or the YZ plane is rotated 45° around the Z axis.

[0102] As shown in Figure 9(A), the holding unit 90 includes a second claw moving unit 94 that moves each second claw portion 102 along the radial direction in the XY plane. The second claw moving unit 94 includes, for example, an extendable portion 98 formed by an air cylinder mechanism, and a movable body 100 connected to the tip of the extendable portion 98. The second claw portion 102 is connected to the movable body 100, and when the extendable portion 98 is operated, the second claw portion 102 moves along the radial direction of the holding unit 90.

[0103] The tip of the second claw portion 102 is formed with a thickness and shape that allows it to fit between the first ring frame 9 and the second ring frame 13. When the second claw portion movement portion 94 is operated, the hook-shaped tip of the second claw portion 102 can move back and forth between the two. When the second claw portion 102 is positioned between the two, it contacts the downward-facing surface 13a of the second ring frame 13 and holds the second ring frame 13 from below.

[0104] The position of the second claw portion 102 of the holding unit 90 corresponds to the position of the gap between the multiple adjacent first claw portions 74 of the second ring frame support unit 72 shown in Figure 6(A), etc. The holding unit 90 can insert the second claw portion 102 into the gap between the adjacent first claw portions 74 while the second ring frame 13 is supported by the first claw portions 74, and the second claw portion 102 can support the second ring frame 13 from below.

[0105] Furthermore, as shown in Figure 9(B), the holding unit 90 includes a shaft portion 104 that rotatably connects the upper end of the third claw portion 106 to the outer circumference of the suction holding portion 92. In addition, the holding unit 90 includes a third claw portion opening / closing portion 96 that can open and close the third claw portion 106 by rotating the third claw portion 106 around the shaft portion 104 using a rotation drive source (not shown).

[0106] When the third claw opening / closing mechanism 96 is activated to close the third claw 106, the key-shaped lower end of the third claw 106 wraps around to the underside of the first ring frame 9, and the first ring frame 9 is supported from below by the third claw 106. Conversely, when the third claw opening / closing mechanism 96 is activated to open the third claw 106, the support of the first ring frame 9 is released.

[0107] When transporting the assembly, including the first ring frame 9, etc., while holding it in the holding unit 90, first the holding unit 90 is placed on the second ring frame 13, which is supported by the first claw portion 74. At this time, since the third claw portion 106 interferes with the first claw portion 74, the third claw portion opening / closing part 96 is operated to open the third claw portion 106.

[0108] Then, the suction holding unit 92 is activated to hold the wafer 1 by suction via the second adhesive tape 15, and the second claw portion 102 is inserted into the gap between the first ring frame 9 and the second ring frame 13, which are formed and maintained by the first claw portion 74. At this time, the second claw portion 102 enters between the adjacent first claw portions 74.

[0109] Here, the second ring frame support unit 72 can move the first claw portion 74 between the region between the first ring frame 9 and the second ring frame 13 and the area outside that region. Next, the first claw portion 74 is moved radially outward to release the support of the second ring frame 13 by the first claw portion 74. Then, the assembly including the first ring frame 9, etc., is held by the holding unit 90.

[0110] Subsequently, the holding unit 90 is moved along the rail 84 to transport the assembly. During this transport process, the third claw opening / closing part 96 is activated to close the third claw 106, causing the first ring frame 9 to be supported from below by the third claw 106. At this time, the first claw 74 does not interfere with the third claw 106. Figures 9(A) and 9(B) are schematic cross-sectional views showing the holding unit 90 that holds the assembly.

[0111] Here, the first claw portion 74 of the second ring frame support unit 72 is positioned at a predetermined height that does not interfere with the processes performed by the wafer transfer apparatus 2. This predetermined height is such that it does not interfere with the transport operation of the first work unit transport unit 16, which transports the first work unit 11a from the pair of guide rails 12 to the first work unit support unit 26.

[0112] Furthermore, this predetermined height position is the height position at which the first ring frame 9 can be gripped by the first claw portion 74 and the ring frame support portion 30 when the ring frame support portion 30 of the first work unit support unit 26 is raised. In addition, this predetermined height position is the height position at which the combined body, including the second ring frame 13 supported by the second ring frame support unit 72, can be held by the holding unit 90.

[0113] The holding unit 90, which holds the bonded assembly including the wafer 1, reaches above the peeling unit 108. Next, the peeling unit 108 will be described. With the holding unit 90 holding the wafer 1, the peeling unit 108 peels the first adhesive tape 7 from the wafer 1 and also peels the first adhesive tape 7 from the first ring frame 9. Figure 8 includes a schematic perspective view of the peeling unit 108. Figures 10(A), 10(B), and 11 also include schematic side views of the peeling unit 108.

[0114] The release unit 108 includes a release tape supply unit 110 on which a release tape 114, composed of a base material and an adhesive layer formed on one side of the base material, is mounted in a roll-like state and can be pulled out; and a winding unit 126 for winding up and collecting the release tape 114. Furthermore, the release unit 108 has a plurality of rollers 116 that guide the release tape 114 pulled out from the release tape supply unit 110 and form a path for the release tape 114.

[0115] The release tape supply unit 110 includes a feed roller 112 on which a roll of unused release tape 114 is mounted, and a rotational drive source (not shown) for rotating the feed roller 112. The winding unit 126 includes a winding roller 128 on which used release tape 114 is wound up to form a roll, and a rotational drive source (not shown) for rotating the winding roller 128.

[0116] Furthermore, the peeling unit 108 includes a movable body 118 on which some of the multiple rollers 116 that form the path of the peeling tape 114 are arranged, and a drive unit 124 that moves the movable body 118. The drive unit 124 has a rail 120 along the X-axis direction. The movable body 118 is mounted on the rail 120 so as to be slidable along the X-axis direction, and the drive unit 124 has a drive source (not shown) that moves the movable body 118 along the rail 120.

[0117] The release tape 114, supplied to the mobile body 118 from the outside, is guided by the roller 116 and moves along the path, eventually reaching the outside of the mobile body 118. To prevent slack in the release tape 114 when the mobile body 118 is moved, and to prevent excessive tension from being applied to the release tape 114, the feed roller 112 and the take-up roller 128 are rotated as appropriate. This adjusts the length of the release tape 114 as it moves along the path.

[0118] Furthermore, the peeling unit 108 has a pressing part 122 on the moving body 118 that pushes up the peeling tape 114 as it moves along its path. The pressing part 122 is movable along the X-axis with the moving body 118 and is also movable up and down along the Z-axis relative to the moving body 118. When the pressing part 122 is raised along the Z-axis, the peeling tape 114 is pressed against the first adhesive tape 7 of the assembly including the wafer 1 held by the holding unit 90, and the peeling tape 114 adheres to the first adhesive tape 7.

[0119] Next, the process of peeling the first adhesive tape 7 by the peeling unit 108 will be described. First, the movable body 118 is moved below the holding unit 90 that holds the assembly including the wafer 1. At this time, the position of the movable body 118 is adjusted so that the pressing part 122 is positioned below the end of the first adhesive tape 7. Figure 10(A) is a schematic cross-sectional view showing the assembly in this state. Then, the pressing part 122 is raised, and the peeling tape 114 is pressed and attached to one end of the first adhesive tape 7.

[0120] Subsequently, the drive unit 124 moves the movable body 118, thereby moving the release tape 114 and pulling the first adhesive tape 7 with the release tape 114. At this time, the feed roller 112 and the take-up roller 128 are rotated or stopped as appropriate. As a result, the first adhesive tape 7 is peeled off from one end of the first ring frame 9.

[0121] Then, as the release tape 114 is wound up by the winding roller 128 and the moving body 118 is moved further, the first adhesive tape 7 begins to peel off from the first ring frame 9, and the first adhesive tape 7 also begins to peel off from the wafer 1. As the movement of the moving body 118 continues, the first adhesive tape 7 is finally completely peeled off from the wafer 1 and the first ring frame 9. 10(B) is a schematic cross-sectional view showing the wafer 1, etc., just before the peeling of the first adhesive tape 7 is completed.

[0122] Furthermore, by rotating the winding roller 128 further, the release tape 114 to which the first adhesive tape 7 is attached can be wound up and recovered by the winding unit 126. Figure 11 schematically shows the first adhesive tape 7 recovered by the winding unit 126. In this state, the dismantling of the first work unit 11a is complete.

[0123] Furthermore, if the holding unit 90 is equipped with a heating mechanism, the heating mechanism may be activated when peeling the first adhesive tape 7 from the wafer 1 to heat the wafer 1 to a predetermined temperature. When the heating mechanism is activated, the first adhesive tape 7 is also heated and softened in the area where it is attached to the wafer 1. Therefore, even if the first adhesive tape 7 deforms to conform to the uneven shape of the surface 1a of the wafer 1 and adheres firmly to the surface 1a, it becomes easier to peel the first adhesive tape 7 from the wafer 1.

[0124] When the first work unit 11a is dismantled by the peeling unit 108 and the wafer 1 is separated from the first ring frame 9, a second work unit 11b is formed, which includes the wafer 1, the second adhesive tape 15, and the second ring frame 13. In other words, the transfer of the wafer 1 from the first adhesive tape 7 to the second adhesive tape 15 is performed.

[0125] At this time, the second ring frame 13 is supported by the second claw portion 102, and the wafer 1 continues to be held by the suction holding portion 92 via the second adhesive tape 15. That is, the holding unit 90 holds the second work unit 11b. The first ring frame 9, separated from the wafer 1, is then supported by the third claw portion 106. Next, the first ring frame 9 is retrieved.

[0126] Figure 11 is a schematic cross-sectional view showing the retrieval of the first ring frame 9. Figure 11 schematically shows a retrieval container 129 located below the holding unit 90. The retrieval container 129 is sized to accommodate the first ring frame 9, is open at the top, and is used to house and retrieve the separated first ring frame 9. When the first ring frame 9 is retrieved into the retrieval container 129, the movable body 118 of the detachment unit 108 is retracted from the area below the holding unit 90.

[0127] In Figure 11, for the sake of explanation, a side view of the second claw portion 102 and a side view of the third claw portion 106 of the holding unit 90 are superimposed. However, the holding unit 90 may have a claw mechanism that integrates the second claw portion 102 and the third claw portion 106 and their associated elements, as shown in Figure 11. Furthermore, the second claw portion 102 and the third claw portion 106 may act together on a specific portion of the outer edge of the bonded object including the wafer 1. In other words, there are no restrictions on the positions of the second claw portion 102 and the third claw portion 106 in the XY plane, as long as they can support their respective objects.

[0128] When retrieving the first ring frame 9, the holding unit 90 continues to hold the wafer 1 and the second ring frame 13, while the third claw opening / closing unit 96 is activated to release only the holding of the first ring frame 9 by the third claw 106. As a result, the first ring frame 9 loses its support and falls into the retrieval container 129.

[0129] The first ring frames 9 are successively collected in the collection container 129. The collected first ring frames 9 are removed from the wafer transfer apparatus 2, and after a predetermined cleaning process is performed, they are reused for forming work units.

[0130] After the first ring frame 9 and the first adhesive tape 7 are separated from the wafer 1, the second work unit 11b is cleaned before being discharged from the wafer transfer apparatus 2. Next, a cleaning unit 166 for cleaning the second work unit 11b and a transport mechanism for transporting the second work unit 11b to the cleaning unit 166 will be described.

[0131] Figure 12 schematically shows an inversion unit 130 that receives the second work unit 11b from the holding unit 90 and inverts it, and a transfer table 140 on which the second work unit 11b is temporarily placed. The inversion unit 130 has a rail 132 along the X-axis, a movable body 134 slidably mounted on the rail 132, a rotating arm 136 extending from the movable body 134 along the Y-axis, and a holding part 138 fixed to the tip of the rotating arm 136.

[0132] The base end of the rotating arm 136 is connected to the movable body 134 so as to be able to move up and down and rotate. When the rotating arm 136 is rotated, the orientation of the holding part 138 changes. The holding part 138 is connected to a suction mechanism (not shown) and has the function of contacting the surface 13a side of the second ring frame 13 of the second work unit 11b and holding the second ring frame 13 by suction.

[0133] When the inversion unit 130 inverts the second work unit 11 vertically, first the rotating arm 136 is rotated to invert the top and bottom of the holding unit 138. Then the holding unit 138 is moved below the holding unit 90 and raised to bring it into contact with the surface 13a side of the second ring frame 13. Then the suction holding of the second ring frame 13 by the holding unit 138 is started.

[0134] Subsequently, the suction holding of the wafer 1 by the suction holding part 92 of the holding unit 90 is released, and the second claw moving part 94 is activated to move the second claw 102, thereby releasing the support of the second ring frame 13. As a result, the second work unit 11b is held by the holding part 138 of the inversion unit 130.

[0135] Subsequently, the movable body 134 is moved in the X-axis direction while the rotating shaft 62 is rotated 180° to change the orientation of the second work unit 11b. At this time, the surface 13a of the second ring frame 13 of the second work unit 11b faces upward and the back surface 13b faces downward. Then, the holding unit 138 is moved onto the transfer table 140, releasing the suction holding of the second ring frame 13 by the holding unit 138. As a result, the second work unit 11b is placed on the transfer table 140.

[0136] The wafer transfer apparatus 2 includes a pair of guide rail tables 156 on which the second work unit 11b is placed, and a second work unit transport unit 142 that transports the second work unit 11b from the transfer table 140 to the guide rail tables 156. The second work unit transport unit 142 includes a rail 146 along the X-axis direction, a support portion 144 that supports the rail 146, a movable body 148 that is slidably mounted on the rail 146, and a drive source (not shown) that moves the movable body 148 along the rail 146.

[0137] The base end of an arm 150 extending along the Y-axis is connected to the movable body 148, and a holding part 154 is connected to the tip of the arm 150 via an axial lifting part 152 that is extendable and retractable along the Z-axis. The holding part 154 is connected to a suction mechanism (not shown) and has the function of suction-holding the second ring frame 13 of the second work unit 11b.

[0138] The pair of guide rail tables 156 are capable of supporting the second work unit 11b and can move closer to or further apart from each other along the Y-axis. A circular opening 158 is formed in the center of the pair of guide rail tables 156, extending vertically through it. The diameter of the opening 158 is larger than the diameter of the wafer 1.

[0139] Below the pair of guide rail tables 156, a second ultraviolet irradiation unit 160 is provided, which can irradiate the second work unit 11b, supported by the pair of guide rail tables 156, with ultraviolet light from below through an opening 158. Below the second ultraviolet irradiation unit 160, a cleaning unit 166 is provided for cleaning the second work unit 11b.

[0140] Figure 13 is a schematic perspective view showing a pair of guide rail tables 156, a second ultraviolet irradiation unit 160, and a cleaning unit 166, separated perpendicularly to each other for ease of explanation. The cleaning unit 166 comprises a cleaning chamber 168, a holding table 170 provided on the floor of the cleaning chamber 168, and a cleaning nozzle 172 capable of supplying liquid to the upper surface of the second work unit 11b placed on the holding table 170. The cleaning unit 166 cleans the wafer 1 from which the first adhesive tape 7 has been peeled off by the peeling unit 108 with liquid.

[0141] The holding table 170 is equipped with a suction mechanism (not shown) and has the function of holding the second work unit 11b from below by suction. Furthermore, a clamping mechanism (not shown) for gripping the second ring frame 13 from the outer circumference may be provided on the outer circumference of the holding table 170. The holding table 170 is also rotatable around a rotation axis that passes through the center of its upper surface in the Z-axis direction.

[0142] The cleaning nozzle 172 is a pipe-shaped member comprising a shaft portion erected along the Z-axis direction outside the holding table 170, and an arm portion extending horizontally (in the XY plane) from the tip of the shaft portion. A liquid supply source and a rotation drive source (not shown) are connected to the lower end of the shaft portion of the cleaning nozzle 172, and the tip of the arm portion serves as a liquid outlet.

[0143] The liquid used for cleaning, ejected from the cleaning nozzle 172, is, for example, pure water. The cleaning liquid may also be mixed with high-pressure air, and the mixed fluid may be ejected from the cleaning nozzle 172. Furthermore, the cleaning nozzle 172 rotates around its axis and retracts from above the holding table 170 so as not to obstruct the movement of the second work unit 11b when it is being loaded or unloaded from the holding table 170. Conversely, when the liquid is being ejected, the nozzle tip is positioned above the holding table 170.

[0144] In the cleaning unit 166, liquid is sprayed onto the second work unit 11b from the cleaning nozzle 172 while rotating the holding table 170 that holds the second work unit 11b. As a result, the second work unit 11b is cleaned by the liquid. After that, by stopping the spraying of liquid from the cleaning nozzle 172 while continuing to rotate the holding table 170, the second work unit 11b can be dried.

[0145] When cleaning the second work unit 11b temporarily placed on the transfer table 140, the second work unit 11b is held by the holding part 154 of the second work unit transport unit 142, and the holding part 154 is moved above the guide rail table 156. At this time, the pair of guide rail tables 156 are spaced apart from each other so that the second work unit 11b can be raised and lowered between them.

[0146] Subsequently, the holding unit 154 is lowered to place the second work unit 11b on the holding table 170 of the washing unit 166, and the holding unit 154 releases the second work unit 11b from its grip. Then, the holding table 170 holds the second work unit 11b, and the second work unit 11b is washed and dried. After that, the holding unit 154 of the second work unit transport unit 142 holds the second work unit 11b, and the holding table 170 releases the second work unit 11b from its grip.

[0147] Next, the holding unit 154 is raised to lift the second work unit 11b, and the pair of guide rail tables 156 are moved closer to each other. Then, the second work unit 11b is placed on the pair of guide rail tables 156, and the holding unit 154 releases the second work unit 11b from its grip.

[0148] Next, the second ultraviolet irradiation unit 160 irradiates the second work unit 11b with ultraviolet light from below. Figure 13 includes a schematic perspective view of the second ultraviolet irradiation unit 160. The second ultraviolet irradiation unit 160 comprises a rail 162 along the Y-axis and a UV light source unit 164 slidably connected to the rail 162. The UV light source unit 164 has a plurality of UV light sources arranged facing upward on the upper surface of a support along the X-axis. These UV light sources are, for example, ultraviolet LEDs.

[0149] The second ultraviolet irradiation unit 160 includes a drive source (not shown) that moves the UV light source unit 164 along the rail 162. When the UV light source of the UV light source unit 164 is activated to irradiate ultraviolet light upwards and the UV light source unit 164 is moved along the rail 162, ultraviolet light is irradiated onto the second work unit 11b from below through the opening 158.

[0150] When ultraviolet light is irradiated onto the second adhesive tape 15 of the second work unit 11b, the second adhesive tape 15 hardens, and its adhesive strength to the wafer 1 decreases. In this case, it becomes easier to peel the wafer 1 from the second adhesive tape 15 outside the wafer transfer apparatus 2, and for example, it becomes easier to pick up individual device chips formed by dividing the wafer 1.

[0151] Finally, the second work unit 11b, which is placed on a pair of guide rail tables 156, is placed in a cassette 8b which is placed on a cassette table 6b. The wafer transfer apparatus 2 is equipped with a push-pull arm (loading unit) 174 located adjacent to the pair of guide rail tables 156, which can move along the X-axis while gripping the second ring frame 13 of the second work unit 11b. The push-pull arm 174 is used to load the second work unit 11b into the cassette 8b.

[0152] The push-pull arm 174 is configured in the same way as the push-pull arm 10 described using Figure 3, etc. When housing the second work unit 11b in the cassette 8b, the second ring frame 13 is first clamped along the Y-axis direction by the upright portions of the pair of guide rail tables 156 to adjust the position of the second work unit 11b in the Y-axis direction.

[0153] Next, the push-pull arm 174 is moved along the X-axis to push the second work unit 11b into the cassette 8b. At this time, the height of the cassette table 6b is adjusted so that the height of the second work unit 11b matches the height of the storage area in the cassette 8b. Then, the second work unit 11b moves to the predetermined storage area, and the storage of the second work unit 11b into the cassette 8b is completed.

[0154] The wafer transfer apparatus 2, with the configuration described above, transfers the wafer 1 attached to the first adhesive tape 7 to the second adhesive tape 15 to form the second work unit 11b. The wafer transfer apparatus 2 can perform the transfer operation without cutting the first adhesive tape 7 around the wafer 1. Therefore, there is no risk of the cutting tool used to cut the first adhesive tape 7 coming into contact with the wafer 1, and there is no risk of cutting debris adhering to the wafer 1 and contaminating the device 5, etc.

[0155] Next, the wafer transfer method according to this embodiment using the wafer transfer apparatus 2 will be described, and the method of using the wafer transfer apparatus 2 will be summarized. Figure 14 is a flowchart showing the flow of each step of the wafer transfer method. The wafer transfer method described below is a method of transferring the wafer 1 of a first work unit 11a, which includes a first ring frame 9, a first adhesive tape 7, and the wafer 1, to a second adhesive tape 15 attached to a second ring frame 13. This forms a second work unit 11b.

[0156] First, a ring frame placement step S10 is performed in which the second ring frame 13 is placed on top of the first ring frame 9 of the first work unit 11a without contacting it. In the ring frame placement step S10, as shown in Figure 6(B), the first work unit 11a is transported onto the first work unit support unit 26.

[0157] Then, the second adhesive tape 15 is attached to the back surface 13b of the second ring frame 13 using the adhesive tape supply unit 50 (see Figure 4) so ​​as to close the second opening 13c. After that, the second ring frame 13 is placed on the first claw portion (claw body) 74 of the second ring frame support unit 72.

[0158] At this time, the second ring frame 13 is positioned so that its second opening 13c overlaps with the first opening 9c of the first ring frame 9, and the second ring frame 13 faces the surface of the first ring frame 9 of the first work unit 11a that is not attached to the first adhesive tape 7. In other words, the surface 13a of the second ring frame 13 faces the surface 9a of the first ring frame 9.

[0159] Then, the wafer support portion 28 and ring frame support portion 30 of the first work unit support unit 26, which supports the first work unit 11a, are raised, and the first ring frame 9 is brought into contact with the lower surface of the first claw portion (claw body) 74. As a result, the first claw portion (claw body) 74 is sandwiched between the first ring frame 9 and the second ring frame 13. This causes the second ring frame 13 to overlap the first ring frame 9 without contacting it.

[0160] Furthermore, "sandwiching the first claw portion (claw body) 74 between the first ring frame 9 and the second ring frame 13" refers to a state in which the first claw portion (claw body) 74 is in contact with both the first ring frame 9 and the second ring frame 13 and positioned between them. This refers to a state in which the first claw portion (claw body) 74 functions as a spacer to form a predetermined distance between them, and it is not necessary for any force to be applied between them to bring them closer together.

[0161] In other words, it is not necessary for both the first claw portion (claw body) 74 to be held in place by a clamping mechanism such as a clip or clamp. The force that brings the first ring frame 9 into contact with the first claw portion (claw body) 74 and the force that brings the second ring frame 13 into contact with the first claw portion (claw body) 74 may be different types of forces.

[0162] Following the ring frame placement step S10, the adhesion step S20 is performed. In the adhesion step S20, the second adhesive tape 15 is attached to the side (back surface 1b) of the wafer 1 that is not attached to the first adhesive tape 7, while the first ring frame 9 and the second ring frame 13 are overlapping and not in contact. As a result, the wafer 1, which is held by the first ring frame 9 via the first adhesive tape 7, is held by the second ring frame 13 via the second adhesive tape 15.

[0163] Figure 7 is a schematic cross-sectional view showing the adhesion step S20. The adhesion step S20 is performed by the roller 78 of the tape adhesion unit 76. If the second adhesive tape 15 has already been attached to the second ring frame 13, the roller 78 presses the second adhesive tape 15 from above in the area overlapping with the wafer 1, and the roller 78 is rolled to adhere the second adhesive tape 15 to the wafer 1.

[0164] In the wafer transfer method according to this embodiment, a predetermined gap is provided between the first ring frame 9 and the second ring frame 13 by sandwiching the first claw portion (claw body) 74 between them. Therefore, problems such as the second adhesive tape 15 hanging down and coming into contact with and adhering to the first adhesive tape 7 are less likely to occur.

[0165] When the two are adhered to each other, it is not easy to separate them, and excessive force may be applied to the wafer 1 during the separation process, potentially damaging the wafer 1. By using the first claw portion (claw body) 74 to create a predetermined gap between the two, the hanging second adhesive tape 15 is less likely to come into contact with the first adhesive tape 7, thus reducing the likelihood of problems.

[0166] Here, when the wafer 1 is attached to the second adhesive tape 15 in the attachment step S20, it is preferable to adjust the relative positions of the wafer 1 and the first ring frame 9 in the direction of penetration of the first opening 9c in advance. For example, the wafer support portion 28 of the first work unit support unit 26 is raised relative to the ring frame support portion 30, so that the upper surface of the wafer support portion 28 is positioned at a height higher than the upper surface of the ring frame support portion 30.

[0167] In this case, as shown in Figure 7, the first adhesive tape 7 deforms, and the first adhesive tape 7 partially enters the first opening 9c of the first ring frame 9. At this time, compared to the case where the upper surfaces of the wafer support portion 28 and the ring frame support portion 30 are at the same height, that is, compared to the case where the first adhesive tape 7 is not deformed, the back surface 1b of the wafer 1 is brought closer to the second adhesive tape 15.

[0168] Therefore, the roller 78 can be inserted deeply into the second opening 13c of the second ring frame 13, that is, the second adhesive tape 15 can be brought into contact with the back surface 1b of the wafer 1 without forcibly pushing down the second adhesive tape 15. As a result, damage or irreversible stretching of the second adhesive tape 15 is less likely to occur.

[0169] When the adhesion step S20 is performed, a composite body is formed in which the first ring frame 9, the first adhesive tape 7, the wafer 1, the second adhesive tape 15, and the second ring frame 13 are integrated. In the wafer transfer method according to this embodiment, the peeling step S30 is then performed in which the first adhesive tape 7 is peeled off from the wafer 1 and the first adhesive tape 7 is peeled off from the first ring frame 9. The peeling step S30 is performed in a state in which the first ring frame 9 and the second ring frame 13 overlap without contacting each other.

[0170] Figure 10(A) is a schematic cross-sectional view showing the bonded body when the peeling step S30 is performed, and Figure 10(B) is a schematic cross-sectional view showing the wafer 1 etc. from which the first adhesive tape 7 has been peeled off in the peeling step S30. The peeling step S30 is performed, for example, by the peeling unit 108 of the wafer transfer apparatus 2.

[0171] In the peeling step S30, the bonded assembly including the wafer 1 is held by the holding unit 90, and the movable body 118 of the peeling unit 108 is moved below the holding unit 90. Then, the pressing part 122 of the peeling unit 108 is raised to push up the peeling tape 114, and the peeling tape 114 is attached to one end of the first adhesive tape 7. Next, the movable body 118 is moved to move the peeling tape 114, thereby pulling the first adhesive tape 7 with the peeling tape 114 and peeling the first adhesive tape 7 from the first ring frame 9 and the wafer 1.

[0172] When the first adhesive tape 7 is peeled off from the first ring frame 9 and the wafer 1, the second work unit 11b (Figure 11), which consists of the wafer 1, the second adhesive tape 15, and the second ring frame 13, remains in the holding unit 90. This completes the transfer of the wafer 1 from the first adhesive tape 7 to the second adhesive tape 15.

[0173] After performing the peeling step S30, a further cleaning step S40 may be performed in which the wafer 1 is washed with a liquid. The cleaning step S40 is performed by a cleaning unit 166 as shown in Figure 13, etc. In the cleaning step S40, the second work unit 11b, including the wafer 1, is transported to the cleaning unit 166. The second work unit 11b is then held in place by the holding table 170.

[0174] Next, while rotating the holding table 170, a liquid such as pure water is sprayed onto the wafer 1 from the cleaning nozzle 172. This allows the surface 1a side of the wafer 1 to which the first adhesive tape 7 was attached to be cleaned. After that, by stopping the spraying of liquid from the cleaning nozzle 172 while continuing to rotate the holding table 170, the wafer 1 can be dried.

[0175] As described above, according to the wafer transfer method of this embodiment, the second adhesive tape 15 is attached to the wafer 1 with the first claw portion (claw body) 74 sandwiched between the first ring frame 9 and the second ring frame 13. After that, the first adhesive tape 7 is peeled off from the wafer 1, etc.

[0176] Therefore, the first adhesive tape 7 can be removed from the wafer 1 without cutting the first adhesive tape 7 around the wafer 1. Moreover, problems such as the second adhesive tape 15 sticking to the first adhesive tape 7 are less likely to occur. Consequently, there is no risk of the cutting tool coming into contact with the wafer 1, and processing debris generated by cutting the first adhesive tape 7 does not adhere to the wafer 1. In other words, the wafer 1 can be safely transferred by replacing the first adhesive tape 7 without cutting it.

[0177] It should be noted that the present invention is not limited to the embodiments described above and can be implemented with various modifications. For example, in the above embodiment, when attaching the second adhesive tape 15 to the back surface 1b of the wafer 1, the second ring frame 13 is placed on top of the first claw portion (claw body) 74 and the first ring frame 9 is placed below it, with the first claw portion (claw body) 74 sandwiched between them. However, the present invention is not limited to this embodiment.

[0178] For example, the first ring frame 9 may be placed on top of the first claw portion (claw body) 74, and the second ring frame 13 may be placed below it, with the first claw portion (claw body) 74 sandwiched between the two, and the second adhesive tape 15 may be attached to the wafer 1. In other words, the attachment step S20 may be performed with each structure inverted.

[0179] Furthermore, while we have described a case in which the second adhesive tape 15 is attached to the wafer 1 in advance by the adhesive tape supply unit 50, the present invention is not limited to this. For example, the second adhesive tape 15 may be supplied simultaneously to the back surface 13b of the second ring frame 13 and the back surface 1b of the wafer 1.

[0180] In this case, the adhesive tape supply unit 50 is preferably positioned above the second ring frame support unit 72. The first claw portion (claw body) 74 is then sandwiched between the first ring frame 9 of the first work unit 11a and the second ring frame 13, which does not have the second adhesive tape 15 attached to it. After that, the second adhesive tape 15 is preferably supplied from the adhesive tape supply unit 50 to the wafer 1 and the second ring frame 13.

[0181] In this case, the roller 78 of the tape application unit 76 should be longer than the diameter of the second adhesive tape 15. The back surface 1b of the wafer 1 should be positioned at the same height as the back surface 13b of the second ring frame 13. The roller 78 should increase the adhesion force to the wafer 1 by pressing the second adhesive tape 15 from above, and also increase the adhesion force to the second ring frame 13.

[0182] Furthermore, the structures, methods, etc., according to the above embodiments can be modified as appropriate without departing from the scope of the objectives of the present invention. [Explanation of Symbols]

[0183] 1 wafer 1a,9a,13a surface 1b,9b,13b Back side Planned division into 3 lines 5 devices 7,15 Adhesive tape 9,13 Ring Frame 9c,13c opening 11a, 11b Work Unit 2. Wafer transfer apparatus 4 base 6a, 6b Cassette Table 8a, 8b Cassette 10,174 Push-pull arms 12 Guide rails 12a Support surface 12b Butt surface 14. First UV irradiation unit 16. First work unit transport unit 18 rails 20 Arm 22 Holding part 24 Lifting mechanism 26. First work unit support unit 28 Wafer support section 30 Ring frame support section 32 Ring frame housing 34 Support Table 36 Positioning Column 38 Ring Frame Transport Unit 40 Mobile Units 42 rails 44 Arm 46 Holding part 48 Ring Frame Support Table 50 Adhesive Tape Supply Units 52 Feed Roll 54 Reel Roll 56 Rollers 58 Supply Tape 60 Cut section 62 Rotating shaft section 64 Arm 66 Cutter 68 Ring Frame Transport Unit 70 rails 72 Second ring frame support unit 74. First claw portion (claw body) 76 Tape application unit 78 rollers 80 Combined body transport mechanism 82 Support part 84 rails 86 Arm 88 Lifting Unit 90 holding unit 92 Suction holding part 94 Second claw moving part 96 Third claw opening / closing part 98 Telescopic part 100 Mobile Units 102 Second claw portion 104 Shaft 106 Third claw portion 108 Peeling Unit 110 Release Tape Supply Unit 112 Feed Roller 114 Release Tape 116 Rollers 118 Mobile Unit 120 rails 122 Pressing part 124 Drive Unit 126 Winding section 128 Winding roller 129 Collection containers 130 Reversing Unit 132 rails 134 Mobile Unit 136 Rotating Arm 138 Holding part 140 handover tables 142 Second work unit transport unit 144 Support part 146 rails 148 Mobile Unit 150 Arm 152 Lifting section 154 Holding part 156 Guide Rail Table 158 Opening 160 Second UV irradiation unit 162 rails 164 UV light source section 166 Washing Unit 168 Washing Room 170 Holding Table 172 Cleaning Nozzles

Claims

1. A wafer transfer method for forming a second work unit, comprising: a first work unit including a first ring frame having a first opening in the center; a first adhesive tape attached to the first ring frame so as to close the first opening; and a wafer attached to the first adhesive tape within the first opening of the first ring frame; and transferring the wafer of the first work unit to a second adhesive tape attached to the second ring frame so as to close a second opening located in the center of the second ring frame, wherein A ring frame placement step in which the second opening is overlapped with the first opening, the second ring frame is brought into contact with the surface of the first ring frame of the first work unit that is not attached to the first adhesive tape, and the claw body is sandwiched between the first ring frame and the second ring frame so that the second ring frame is overlapped with the first ring frame without contacting it, The second ring frame is supported by the claw body, and the first ring frame and the second ring frame overlap without contact, and the second adhesive tape is attached to the side of the wafer that is not attached to the first adhesive tape, and the wafer is held by the second ring frame via the second adhesive tape, in this attachment step, The method includes a peeling step of peeling the first adhesive tape from the wafer and peeling the first adhesive tape from the first ring frame while the first ring frame and the second ring frame are overlapping and not in contact, A wafer transfer method characterized by transferring the wafer to the second adhesive tape without cutting the first adhesive tape.

2. The wafer transfer method according to claim 1, characterized in that the second adhesive tape, which has been previously attached to the second ring frame, is attached to the wafer in the attachment step.

3. The wafer transfer method according to claim 1 or 2, further comprising a cleaning step of cleaning the wafer with a liquid after the peeling step.

4. The wafer transfer method according to any one of claims 1 to 3, characterized in that in the peeling step, a release tape is attached to the first adhesive tape, and the release tape is moved to peel the first adhesive tape from the first ring frame and the wafer with the release tape.

5. A wafer transfer method according to any one of claims 1 to 4, characterized in that when the wafer is attached to the second adhesive tape in the attachment step, the relative positions of the wafer and the first ring frame in the direction of penetration of the first opening are adjusted in advance, accompanied by deformation of the first adhesive tape, thereby bringing the wafer closer to the second adhesive tape.

6. A wafer transfer apparatus for forming a second work unit, comprising a first work unit including a first ring frame having a first opening in the center, a first adhesive tape attached to the first ring frame so as to close the first opening, and a wafer attached to the first adhesive tape in the first opening of the first ring frame, and transferring the wafer of the first work unit to a second adhesive tape attached to the second ring frame so as to close a second opening located in the center of the second ring frame, A first work unit support unit having a wafer support portion that supports the wafer via the first adhesive tape, and a ring frame support portion that supports the first ring frame via the first adhesive tape, wherein the first work unit is supported with the side of the wafer not attached to the first adhesive tape exposed upwards, A second ring frame support unit includes a first claw portion having the function of supporting the second ring frame so as to face the first ring frame supported by the ring frame support portion of the first work unit support unit, and the function of being sandwiched between the first ring frame and the second ring frame, wherein the first claw portion can move between a region between the first ring frame and the second ring frame and the outside of that region. A tape application unit is positioned above the second ring frame support unit and applies the second adhesive tape to the surface of the wafer supported by the wafer support portion of the first work unit support unit that is not attached to the first adhesive tape, A holding unit having a second claw portion, the second claw portion being inserted between the first ring frame and the second ring frame to hold the second ring frame with the second claw portion and to hold the wafer via the second adhesive tape, A peeling unit that, while the holding unit is holding the wafer, peels the first adhesive tape from the wafer and peels the first adhesive tape from the first ring frame, Equipped with, The tape application unit applies the second adhesive tape to the wafer while the second ring frame is supported by the first claw portion. A wafer transfer apparatus characterized by transferring the wafer to the second adhesive tape without cutting the first adhesive tape.

7. The wafer transfer apparatus according to claim 6, further comprising a tape supply unit that pre-attaches the second adhesive tape to the second ring frame so as to close the second opening before the second ring frame is supported by the second ring frame support unit.

8. The wafer transfer apparatus according to claim 6 or 7, further comprising a cleaning unit for cleaning the wafer from which the first adhesive tape has been peeled off by the peeling unit with a liquid.

9. The peeling unit is, A release tape supply unit is equipped with a release tape that is wound in a roll and can be pulled out, the release tape being composed of a base material and an adhesive layer formed on one side of the base material. Multiple rollers that guide the release tape drawn from the release tape supply unit and form a path for the release tape, A movable body having a pressing part for pressing and attaching the release tape to the first adhesive tape, A drive unit for moving the movable body, It includes a winding unit for winding up and collecting the release tape, A wafer transfer apparatus according to any one of claims 6 to 8, characterized in that the release tape is pressed and attached to the first adhesive tape by the pressing unit, the release tape is moved by moving the moving body with the drive unit to peel the first adhesive tape off the first ring frame and the wafer with the release tape, and the release tape to which the first adhesive tape has been attached is wound up and recovered by the winding unit.

10. The wafer transfer apparatus according to any one of claims 6 to 9, characterized in that the first work unit support unit further comprises a lifting unit for raising and lowering the wafer support unit and the ring frame support unit relative to each other.

Images