Film frame carrier for curved wafer stage

Abstract

To provide an assembly including a film frame carrier reducing a time required for transferring a semiconductor die to a target and an arrangement of semiconductor dies arranged thereon.SOLUTION: In an apparatus 1, a wafer chuck includes a rotationally mounted curved shell 122 on which the arrangement of semiconductor dies 2A can be arranged. A wafer stage further includes a first motor for rotating the curved shell around a rotational axis 122A. The curved configuration allows for an improved throughput of the wafer stage. A film frame carrier 3 to be used with the wafer stage has an asymmetric bending stiffness.SELECTED DRAWING: Figure 1A

Description

Technical Field

[0001] Aspects of the present disclosure relate to an apparatus for transferring semiconductor dies from an array of semiconductor dies to a target. Further aspects of the present disclosure relate to a wafer stage used in such an apparatus, a film frame carrier used in such an apparatus, and an assembly comprising a film frame carrier and an array of semiconductor dies disposed thereon.

Background Art

[0002] Apparatuses for transferring semiconductor dies from a diced semiconductor wafer to a target are known in the art. For example, Patent Document 1 discloses an apparatus comprising a wafer stage having a wafer chuck on which a diced semiconductor wafer can be placed, and a target stage having a target chuck on which a target can be placed. Both the wafer stage and the target stage comprise one or more motors for changing the relative position between the diced semiconductor wafer on the wafer chuck and the target on the target chuck. The apparatus further comprises a release unit in the form of a needle for releasing the semiconductor die from the diced semiconductor wafer. The release unit, the wafer stage, and the target stage are controlled using a controller.

[0003] In known systems, a diced semiconductor wafer is brought close to a target, which is, for example, a printed circuit board. When the semiconductor die on the semiconductor wafer is aligned with the intended position on the target, the needle is guided to align with the semiconductor die. The needle is then pressed against the target to release the semiconductor die from the semiconductor wafer.

[0004] The above die transfer is referred to as direct die transfer. More specifically, between the step of releasing the die and the step of placing the die on the target, the die is transferred from the diced semiconductor wafer to the target without being placed or supported.

[0005] A key advantage for the type of equipment described above is the number of semiconductor dies that can be transferred per unit time. This time is often limited by the step of positioning the semiconductor wafer relative to the target. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] U.S. Patent Application Publication No. 2017 / 140959 [Overview of the project]

[0007] One aspect of the present disclosure relates to an apparatus for transferring semiconductor dies from an array of semiconductor dies to a target, wherein the apparatus employs a different mode in which the array of semiconductor dies is positioned relative to the target. According to one aspect of the present disclosure, this different mode of positioning can achieve a reduction in the time required to transfer the semiconductor dies to the target.

[0008] According to one aspect of the present disclosure, the wafer chuck of the apparatus comprises a rotatably mounted curved shell on which an array of semiconductor dies can be arranged. Furthermore, the wafer stage comprises a first motor for rotating the curved shell around a rotation axis.

[0009] The apparatus disclosed in Patent Document 1 comprises a linear XY stage using linear motors configured to displace a semiconductor wafer in the X and Y directions. The acceleration obtained by such a wafer stage is limited by the motor topology and power loss. To improve the performance of such a wafer stage, for example, to improve the positioning speed, the topology of the moving coils is required. However, this would bring about the associated problem of cooling the moving coils to increase power dissipation capacity.

[0010] According to one aspect of the present disclosure, the problem of acceleration limitations by a linear motor is mitigated by using a rotatably mounted curved shell on which an array of semiconductor dies can be arranged. This shell is part of a wafer stage and is actuated using a first motor configured to rotate the curved shell around a rotation axis.

[0011] Motors designed to impart rotational motion have a high force or torque per unit heat generated, and / or a high force / torque per unit power and per unit weight of the magnets used. This means they can achieve higher acceleration for a given mass and power level than linear moving magnet motors.

[0012] The apparatus is preferably configured to directly transfer a semiconductor die from an array of semiconductor dies onto a target. A release unit may be configured to release a semiconductor die from an array of semiconductor dies so that the semiconductor die falls onto the target. In this case, the release unit does not engage with the semiconductor die at the moment the semiconductor die reaches the desired position on the target. In other embodiments, an auxiliary unit can be used to orient the released semiconductor die toward the target. For example, a burst of compressed air may be used to push the released semiconductor die toward the target. In such a case, the semiconductor die can be displaced toward the target against the force of gravity.

[0013] A wafer chuck can be configured to support a carrier on which an array of semiconductor dies is carried. For example, the carrier can be a tape, film, or foil. Furthermore, the carrier can be part of a film frame carrier.

[0014] The arrangement of semiconductor dies can be composed of diced semiconductor wafers or structured semiconductor wafers. A structured semiconductor wafer may comprise multiple semiconductor dies arranged in a pattern different from the pattern on which the dies were arranged before the semiconductor wafers from which they originated were diced. Alternatively, a structured semiconductor wafer may comprise multiple semiconductor dies derived from different semiconductor wafers. In this case, the semiconductor dies are individually arranged on carriers such as films, foils, or tapes.

[0015] The axis of rotation preferably runs at least substantially parallel to the target chuck. In this way, the position of the release unit can be kept constant when rotating the curved shell to align the next semiconductor die with the release unit, provided that this die needs to be released in the same position as the previous semiconductor die. Note that the target is usually moved when the next semiconductor die is released. Furthermore, the axis of rotation may coincide with the longitudinal axis of symmetry of the curved shell.

[0016] The wafer stage may further include a second motor for translating the curved shell back and forth, preferably along a direction parallel to the axis of rotation and / or a direction coincident with the axis of rotation. The wafer stage may further include another second motor for translating the curved shell in a direction perpendicular to the direction provided by the second motor. For example, the second motor and the other second motor may cooperate to translate the curved shell in an XY plane similar to the plane on which the target table of the target stage is translated.

[0017] The wafer stage may further include a second auxiliary motor for translating the curved shell back and forth along a direction perpendicular to the rotation axis, preferably perpendicular to the target chuck. For example, the second auxiliary motor may be configured to displace the curved shell vertically to ensure or maintain a certain vertical separation between the semiconductor die being released and the target. If such separation is too small, the target and the semiconductor die may come into contact during the movement of the target and / or the curved shell. If the separation is too large, variations in the position and / or orientation of the semiconductor die on the target may become unacceptable.

[0018] As an addition or alternative, the apparatus may further comprise a stationary frame and a first carriage, with a second motor and / or auxiliary second motor configured to translate the first carriage relative to the stationary frame, and the first motor configured to rotate the curved shell relative to the first carriage. In this case, the rotation and translation of the curved shell are superimposed. In other embodiments, the second motor and / or auxiliary motor are configured to translate the curved shell relative to the stationary frame, and the first motor is configured to rotate the curved shell relative to the stationary frame. In this case, the rotation and translation are performed independently of each other relative to the stationary frame.

[0019] The curved shell can be at least partially translucent to light having a first wavelength. In this case, the release unit may be equipped with a light source, such as a laser, to output a light beam having the wavelength. The array of semiconductor dies can be attached to a tape, foil, or film using a light-absorbing agent, such as a photosensitive adhesive. The light-absorbing agent can be configured to release at least locally from the array of semiconductor dies when irradiated with light having the wavelength. For example, the light-absorbing agent can be configured to release at least locally from its attachment by photoablation and / or by a chemical reaction resulting from the absorption of light by the light-absorbing agent. The light source can be configured to irradiate a given semiconductor die in the array of semiconductor dies and separate it from adjacent semiconductor dies. For example, the light source can be configured to illuminate one semiconductor die in the array of semiconductor dies at a time. However, the release unit may be equipped with a beam splitter configured to receive a light beam from the light source and to split the received beam into a plurality of further beams, each further beam configured to illuminate its respective given semiconductor die.

[0020] The light source can be configured to emit light toward the curved shell, preferably in a substantially perpendicular manner. The light source is then preferably positioned inside and / or above or below the curved shell. Alternatively, the light source can be configured to emit light in a direction substantially parallel to the axis of rotation. In this case, the release unit may further comprise a light-directing unit. The light source can be configured to emit light toward the light-directing unit, preferably in a direction substantially parallel to the axis of rotation, and the light-directing unit can be configured to direct light from the light source toward the curved shell, preferably in a substantially perpendicular direction. In this case, the light source can be positioned outside and / or next to the curved shell.

[0021] The optical directional unit may comprise one or more mirrors and / or one or more prisms. Furthermore, the optical directional unit may preferably comprise one or more actuators controllable by a controller, the actuators being configured to change the orientation of one or more mirrors and / or one or more prisms relative to the incident light from the light source, for the purpose of directing light from the light source toward the curved shell at different angles. In this way, the location where the light from the light source strikes the curved shell can be changed even if the curved shell does not change its position along its longitudinal axis. The optical directional unit may be, for example, MEMS-based. For example, MEMS-based mirrors are relatively lightweight, allowing for high-speed switching between adjacent dies.

[0022] Instead of using light, the release unit may alternatively comprise a needle-like engaging element and an actuator for moving the engaging element to engage with or disengage from the array of semiconductor dies for the purpose of releasing the semiconductor dies from the array of semiconductor dies. The engaging element is typically located inside and / or above or below the curved shell.

[0023] As described above, in order to completely deplete the array of semiconductor dies, it is necessary to change the position at which the release unit releases the semiconductor dies from the array of semiconductor dies. For this purpose, the release unit may comprise a second carriage fitted with a light source or a combination of actuator and needle, and a third motor for moving the second carriage relative to the curved shell. In this case, the motion of the second carriage and the motion of the curved shell are superimposed. Furthermore, typically, the third motor only displaces the second carriage relative to the curved shell along and / or parallel to the longitudinal axis of the curved shell. Alternatively, the release unit may comprise a second carriage fitted with a light source or a combination of actuator and needle, and a third motor for moving the second carriage relative to a fixed frame. In this case, the motion of the second carriage and the motion of the curved shell are independent of each other. In either case, the second carriage can be configured to translate inward and / or upward or downward of the curved shell. Furthermore, if the release unit comprises the aforementioned light source and optical directional unit, the light source may be fixedly mounted on a fixed frame, and the optical directional unit may be mounted on a second carriage.

[0024] The target stage may further include a fourth motor and / or a fifth motor for translating the target chuck in a plane, preferably in a plane parallel to the axis of rotation, and / or an auxiliary fourth motor for translating the target chuck back and forth in a direction perpendicular to the axis of rotation, preferably in a direction perpendicular to the target chuck. The fourth motor and / or the fifth motor can be positioned to translate the target chuck relative to the stationary frame. Alternatively, motion in two mutually orthogonal directions can be superimposed. For example, the fourth motor can displace a third carriage relative to the stationary frame, and the fifth motor can displace the target chuck relative to the third carriage.

[0025] The curved shell can be provided with a coupling unit to enable the array of semiconductor dies to be coupled to the curved shell. For example, the curved shell can be provided with a plurality of openings. In this case, the apparatus may further include a vacuum unit for generating an attraction force applied to the array of semiconductor dies through the plurality of openings. Alternatively or additionally, the curved shell can be provided with a mechanical coupling unit for mechanically coupling the array of semiconductor dies. The array of semiconductor dies is preferably carried by a film frame carrier. In this case, the mechanical coupling unit preferably includes a clamping unit for clamping the film frame carrier on the curved shell.

[0026] The curved shell can be a circular cylindrical shell such as a drum or a partial circular cylindrical shell. For example, the shell can be a 1 / n circular cylindrical shell. When n = 2, the shape corresponds to a semi-cylindrical shell. When n = 1, the shape corresponds to a circular cylindrical shell such as a drum. However, aspects of the present disclosure are similarly relevant to curved shells whose cross-section perpendicular to the axis of rotation and / or the longitudinal axis is not circular or partially circular. In these cases, it is preferable to translate the curved shell and the target relative to each other in order to maintain a substantially constant separation between the target and the semiconductor die to be released next.

[0027] Having a curved shell on which an array of dies is disposed provides the possibility of mounting an inspection system near the location where the semiconductor dies are released. For example, the apparatus may include a first inspection system arranged to inspect semiconductor dies from an array of semiconductor dies before being disposed on a target. The first inspection system may be arranged to determine the position and / or orientation of the semiconductor dies of the array of semiconductor dies, and the controller may be configured to control the wafer stage, the target stage, and / or the release unit depending on the determined position and / or orientation. When coupling an array of semiconductor dies to a curved shell, the position and / or orientation of the semiconductor dies may change, for example, due to wrinkles or other distortions of the carrier on which the semiconductor dies are disposed. The first inspection system may record the position and / or orientation of the semiconductor dies, preferably relative to the curved shell and / or relative to the ideal position and / or orientation of the semiconductor dies. This recorded position can also be used to perform corrections before releasing the die. For example, if the die is shifted along the axis of rotation relative to its ideal position, the curved shell may perform a slight translation in another direction before the release unit releases the semiconductor die. In such a case, the position of the release unit need not be changed. In other embodiments, the target is displaced together with the release unit while maintaining the curved shell in the same position. In yet another embodiment, the release unit, the target, and the curved shell are all moved.

[0028] The first inspection system may be arranged, additionally or alternatively, to determine whether the semiconductor dies of the array of semiconductor dies are damaged. In this case, the controller may be configured to control the wafer stage, the target stage, and / or the release unit so that, if the semiconductor die is determined to be damaged, that semiconductor die is not disposed on the target. In this way, damaged semiconductor dies can be skipped.

[0029] The apparatus may include a second inspection system positioned to determine whether a semiconductor die has been released from the array of semiconductor dies. The controller may then be configured to control the wafer stage, target stage, and / or release unit to release the semiconductor die if it is determined that the semiconductor die has not been released. In this way, the release unit may attempt to release the semiconductor die again.

[0030] Alternatively or as an addition, the apparatus may further include a third inspection system positioned to check whether the semiconductor die is properly positioned on the target. In this case, the controller may be configured to store the position of the semiconductor die on the target and / or the intended position of the semiconductor die. In a later stage, the semiconductor die can be removed from the target in this position.

[0031] The first, second, and / or third inspection systems may include cameras, and it is preferable that the same camera be used in two or more of the first, second, and third inspection systems. The cameras of the first, second, and / or third inspection systems can be mounted to move relative to a stationary frame. For example, the camera can be configured to move along the longitudinal axis of the curved shell.

[0032] The release unit can be configured to release a semiconductor die from an array of semiconductor dies, which is then positioned in a release position relative to a fixed frame. The array of semiconductor dies may comprise a plurality of semiconductor dies arranged in a matrix of rows and columns, where the rows extend at least substantially parallel to the axis of rotation.

[0033] The target may comprise a column or row of adjacent placement positions, where each semiconductor die from an array of semiconductor dies is placed, and each column or row of adjacent placement positions extends at least substantially perpendicular or parallel to the axis of rotation. An example of such a target is a carrier tape comprising a plurality of cavities where semiconductor dies are to be placed. In this case, the controller can be configured to control the wafer stage to rotate the curved shell intermittently or continuously to place semiconductor dies from the same column of the array of semiconductor dies at each placement position of the target, and after exhausting the column of the array of semiconductor dies to be placed, shift the translational movement of the curved shell to the column next to the semiconductor die in the array of semiconductor dies. Furthermore, the controller can be configured to maintain a release position relative to the fixed frame while the translational movement of the curved shell shifts to an adjacent column of semiconductor dies in the array of semiconductor dies. For example, the release unit may remain stationary relative to the fixed frame while the curved shell rotates and translates.

[0034] In addition to the above, the target may comprise a plurality of the aforementioned rows where placement positions are adjacent to each other, and where each semiconductor die is placed from an array of semiconductor dies. In this case, the controller may be configured to control the wafer stage and / or target stage to cause a mutual translational movement between the target and the curved shell after semiconductor dies have been provided from the array of semiconductor dies to all placement positions in the same row on the target. In this case, the controller may be configured to maintain the release position relative to the fixed frame during the mutual translational movement between the target and the curved shell. Alternatively, the controller may be configured to maintain the position of the row on the target in a direction parallel to the axis of rotation relative to the fixed frame, and to change the release position to shift to the next row on the target after semiconductor dies have been provided from the array of semiconductor dies to all placement positions in the same row on the target.

[0035] The apparatus may comprise a plurality of the aforementioned release units for substantially simultaneously releasing semiconductor dies from the array of semiconductor dies at different row placement positions on a target. Each release unit may be independently controlled by a controller.

[0036] A further aspect of the present disclosure provides a wafer stage having a wafer chuck on which an array of semiconductor dies can be arranged, the wafer chuck comprising a rotatably mounted curved shell on which an array of semiconductor dies can be arranged, and the wafer stage further comprising a first motor for rotating the curved shell around a rotation axis. The wafer stage may further be configured as a wafer stage of the apparatus described above.

[0037] A further aspect of this disclosure provides a film frame carrier configured to be mounted on the curved shell of the apparatus described above. The film frame carrier is sometimes referred to as a tape frame.

[0038] The film frame carrier comprises a ring-shaped body having a mounting surface configured to bond to a support surface of a flexible carrier film, foil, or tape, on which an array of semiconductor dies is arranged. The ring-shaped body may, but is not limited to, a circular, rectangular, or square shape.

[0039] The ring-shaped body has asymmetric bending rigidity, which allows it to be bent so that the mounting surface of the ring-shaped body changes from a first shape to a more concave second shape, and prevents or limits bending so that the mounting surface becomes more convex than the first shape. Because the bending rigidity is asymmetric, the ring-shaped body can be gripped on the opposite side to move it without losing rigidity. This makes it possible to automatically transport the film frame carrier to the curved shell and / or to dic the wafer while the wafer is mounted on the flexible carrier film bonded to the ring-shaped body. The first shape may correspond to the most convex shape that the mounting surface can achieve.

[0040] The asymmetric bending stiffness can be configured to allow the ring-shaped body to be bent so that the mounting surface of the ring-shaped body reversibly changes from a first shape to a more concave second shape. Alternatively, the bending may induce plastic deformation in the ring-shaped body.

[0041] The first shape may correspond to an essentially flat shape. Additionally or alternatively, the curvature of the mounting surface when having the first shape is 0.2 m. -1 It can be less than 3.3m, and the curvature of the mounting surface when it has the second shape is 3.3m -1 This can be done.

[0042] The ring-shaped body may include a leaf spring and / or may be at least partially formed by a leaf spring. Furthermore, the surface of the leaf spring may form or be part of the mounting surface. The ring-shaped body may further include a restricting means connected to the leaf spring to prevent or limit bending of the ring-shaped body so that the shape of the mounting surface is more convex than the first shape. The restricting means may be coupled to the leaf spring on a surface oriented away from the mounting surface. Additionally or alternatively, the restricting means may include a plurality of segments connected to the leaf spring, such that when the mounting surface is in the first shape, adjacent segments abut each other, thereby preventing or limiting bending of the leaf spring so that the shape of the mounting surface is more convex than the first shape, and the segments are configured to separate from each other when the leaf spring is bent so that the mounting surface deforms into a more concave shape than the first shape.

[0043] Alternatively, the ring-shaped body may comprise multiple segments, which are hinged together. For example, each pair of adjacent segments among the multiple segments may be configured to pivot relative to each other about their respective axes of rotation. Furthermore, the axes of rotation describing the pivotal motion of all adjacent pairs of segments among the multiple segments may be parallel to each other.

[0044] For at least one pair of adjacent segments among a plurality of segments, one segment may include a first coupling structure located at a first end of the one segment, and the other segment may include a second coupling structure located at a second end of the other segment. The first and second coupling structures can be hinged to each other so that the one segment and the other segment can pivot relative to each other about an axis of rotation. The one segment may include the second coupling structure located at a second side of the one segment opposite to the first side of the one segment. The other segment may include the first coupling structure located at a first side of the other segment opposite to the second side of the other segment.

[0045] The first coupling structure may have a first opening, and the second coupling structure may have a projection element that is rotatably received in the first opening and defines an axis of rotation. This projection element may be a pin, a rod, or a shaft.

[0046] Alternatively, the first coupling structure may have a first opening, and the second coupling structure may have a second opening, and the film frame carrier may be rotatably received in at least one of the first and second openings and include a shaft defining an axis of rotation.

[0047] For each pair of adjacent segments among a plurality of segments, one segment may have a first contact surface and the other segment may have a second contact surface. The first and second contact surfaces may be formed and positioned with respect to the axis of rotation so as to contact each other, in order to prevent the ring-shaped body from bending, such that when the mounting surface has a first shape, the shape of the mounting surface becomes more convex than the first shape.

[0048] The segments can be made from a material selected from the group consisting of steel, aluminum, titanium, polymers, or combinations thereof.

[0049] A further aspect of the present disclosure provides an assembly comprising a film frame carrier as defined above and a carrier film, foil, or tape having a support surface on which an array of dies is arranged, wherein the support surface of the carrier film, foil, or tape having the array of dies is coupled to the mounting surface of the film frame carrier.

[0050] A carrier film, foil, or tape can be provided as an attachment layer by attaching an array of semiconductor dies to a support surface and bonding the carrier film, foil, or tape to the mounting surface of a film frame carrier. The attachment layer may comprise a light-absorbing agent, such as a photosensitive adhesive, which is configured to release at least locally from its attachment to the array of semiconductor dies when irradiated with light having the aforementioned wavelength. The light-absorbing agent may be configured to release at least locally from its attachment by photoablation and / or by a chemical reaction resulting from the absorption of light by the light-absorbing agent. More specifically, the energy absorbed by the light-absorbing layer may be used not only to release the semiconductor dies but also to provide some propulsion force to drive the semiconductor dies toward a target.

[0051] The arrangement of a semiconductor die is composed of diced semiconductor wafers or structured semiconductor wafers. [Brief explanation of the drawing]

[0052] More specific descriptions are made with reference to embodiments, some of which are shown in the accompanying drawings, so that the features of this disclosure may be understood in detail. However, it should be noted that the accompanying drawings only show typical embodiments and are therefore not intended to limit the scope. The drawings are for the purpose of facilitating the understanding of this disclosure and are therefore not necessarily drawn to scale. The merits of the claimed subject matter will be apparent to those skilled in the art when reading this description in conjunction with the accompanying drawings. In the drawings, similar reference numerals were used to designate similar elements.

[0053] [Figure 1A] This invention illustrates a part of an embodiment of an apparatus for positioning semiconductor dies onto a target from an array of semiconductor dies, according to one aspect of this disclosure. [Figure 1B] A corresponding schematic diagram is shown. [Figure 2] A schematic cross-sectional view corresponding to the apparatus in Figure 1A is shown. [Figure 3A] Further embodiments and figures of an apparatus for positioning semiconductor dies onto a target from an array of semiconductor dies are shown according to one aspect of this disclosure. [Figure 3B] Further embodiments and figures of an apparatus for positioning semiconductor dies onto a target from an array of semiconductor dies are shown according to one aspect of this disclosure. [Figure 3C] Further embodiments and figures of an apparatus for positioning semiconductor dies onto a target from an array of semiconductor dies are shown according to one aspect of this disclosure. [Figure 3D] Further embodiments and figures of an apparatus for positioning semiconductor dies onto a target from an array of semiconductor dies are shown according to one aspect of this disclosure. [Figure 3E] Further embodiments and figures of an apparatus for positioning semiconductor dies onto a target from an array of semiconductor dies are shown according to one aspect of this disclosure. [Figure 4] A first embodiment of a flexible film frame carrier according to one aspect of the present invention is shown. [Figure 5]A ring-shaped body for a flexible film frame carrier according to one aspect of the present invention is shown. [Modes for carrying out the invention]

[0054] The following describes embodiments for placing a semiconductor die from a diced semiconductor wafer onto a target. However, the present invention is not limited to placing a semiconductor die from a diced semiconductor wafer. In general, the semiconductor die may be placed from an array of dies including, but not limited to, diced semiconductor wafers and structured wafers.

[0055] Figure 1A shows part of an embodiment of an apparatus 1 for placing a semiconductor die 2A from a diced semiconductor wafer 2 onto a target 113 according to one aspect of the present disclosure. Here, the diced semiconductor wafer 2 is placed on a carrier film 4 mounted on a flexible film frame carrier (FFFC) 3. Typically, the wafer is supplied to the apparatus 1 from a cassette 5, tray, etc. This can be done in an automated manner.

[0056] The FFFC3, whose cross-section is shown in Figure 5, comprises a ring-shaped body 30 having a mounting surface 31 that is bonded to the support surface 43 of the carrier film 4. Here, the flexible carrier film 4 includes a backing / support layer 42, which is typically made of polyvinyl chloride and covered by a mounting layer 41. Using this mounting layer 41, a diced semiconductor wafer 2 comprising multiple semiconductor dies 2A is attached to the backing layer 42.

[0057] Since the ring-shaped body 30 has asymmetrical bending rigidity, it can be bent so that the mounting surface 31 changes from a first shape as shown in the upper diagram of Figure 5 to a more concave second shape as shown in the middle diagram of Figure 5. At the same time, the asymmetrical rigidity prevents the ring-shaped body 30 from being bent so that the shape of the mounting surface 31 becomes more convex than the first shape.

[0058] The ring-shaped body 30 comprises a leaf spring 32 and a plurality of segments 34, each of which is connected to the leaf spring 32 using its respective connecting portion 33. In the first shape, adjacent segments 34, more specifically, the surface 35A of one segment 34A and the surface 35B of the adjacent segment 34B are in contact with each other. As a result, the ring-shaped body 30 cannot be bent by moving its left and right ends upward relative to the central part of the ring-shaped body 30 in Figure 5. However, conversely, it is also possible for the mounting surface 31 to take on a more recessed shape. This is shown in the center view of Figure 5. Here, segments 34A and 34B are moving away from contact. By using the leaf spring 32, the shape deformation of the ring-shaped body 30 can be reversed. However, an embodiment in which bending from the first shape to the second shape consists of plastic deformation is also possible. In such an embodiment, the ring-shaped body 30 can be discarded after use.

[0059] Another embodiment of the ring-shaped body 30 for FFFC having asymmetrical bending rigidity is shown in Figure 4. In this embodiment, the ring-shaped body 30 consists of a plurality of segments 34, which are hinged together. For example, Figure 4 shows segments 34A and 34B. These segments each have openings 36A and 36B, in which a shaft 37 is positioned, hinged to the segments 34A and 34B. This is shown in more detail in the cross-sectional view corresponding to lines L1 and L2. The shaft 37 can be fixedly connected to one of the segments 34A and 34B and can rotate within the other opening 36A and 36B. Alternatively, the shaft 37 can rotate within both openings 36A and 36B.

[0060] In Figure 4, the mounting surface 31 of the ring-shaped body 30 is shown in a first shape, which is essentially flat. Similar to the embodiment in Figure 5, the mounting surface 31 can be coupled to the support surface 43 of the carrier film 4. Segments 34A and 34B each have contact surfaces 35A and 35B, respectively. The positioning of surfaces 35A and 35B relative to the shaft 37 determines that the ring-shaped body 30 cannot be bent so that the mounting surface 31 is more convex. However, it is possible to bend the ring-shaped body 30 so that the mounting surface 31 is more concave. It should be noted that surfaces 35A and 35B may be positioned in different locations. For example, they may be in different longitudinal positions but substantially in line with the shaft 37.

[0061] Returning to Figure 1A, the FFFC3, which has a diced semiconductor wafer 2 as embodied and placed thereon as shown in Figure 5, can be mounted on a rotatably mounted curved shell 122 that can rotate around a rotation axis 122A. For this purpose, the curved shell 122 may have a number of small openings that can exert an attractive force on the FFFC3. Alternatively, the FFFC3 may be mounted on the curved shell 122 using a mechanical mounting such as a clamp.

[0062] It should be noted that Figure 1A does not show the ring-shaped body 30 for the semiconductor wafer 2 placed on the curved shell 122, for illustrative purposes only. Furthermore, Figure 1A shows that the segment 34 is generally elongated, having a longitudinal axis parallel to the rotation axis 122A.

[0063] By rotating and translating the curved shell 122, the diced semiconductor wafer 2 can also be positioned relative to a target 113 on which the semiconductor die 2A is to be placed. The target 113 is positioned on the support surface 112A of the target chuck 112. Once properly positioned, a release unit (not shown in Figure 1A) can be used to release the semiconductor die 2A from the diced semiconductor wafer 2, thereby positioning the semiconductor die 2A in the intended location on the target 113.

[0064] Figure 1B schematically shows the apparatus of Figure 1A. As shown, apparatus 1 includes a controller 100 that controls the target stage 110, wafer stage 120, and release unit 130 based on data received from inspection system 140. Controller 100 further controls a dispensing device 150 configured to dispense droplets 151 of conductive adhesive, solder, etc., onto the target 113.

[0065] The target stage 110 includes one or more motors for controlling the position of the target chuck 112 on which the target 113 is positioned. For example, the target stage 110 may include a motor MT0 for translating the target chuck 112 along the X direction, which is taken parallel to the rotation axis 122A; a motor MT2 for translating the target chuck 112 along the Z direction, which is taken perpendicular to the support surface 112A of the target chuck 112; and a motor MT1 for translating the target chuck 112 along the Y direction, which is taken perpendicular to the X and Z directions.

[0066] The wafer stage 120 includes one or more motors for controlling the position of the curved shell 122 on which the semiconductor wafer 2 is placed. For example, the wafer stage 120 may include a motor MW0 for translating the curved shell 122 along the X direction, a motor MW2 for translating the curved shell 122 along the Z direction, and a motor MW3 for rotating the curved shell 122 around a rotation axis 122A.

[0067] The release unit 130 may include a motor MR0 for translating the light source 132 in the X direction.

[0068] It should be noted that this disclosure is not limited to the above-described combinations of motors. The target stage 110, wafer stage 120, and release unit 130 may be equipped with more or fewer motors and / or motors for translation in different directions.

[0069] The inspection system 150 may include one or more optical cameras for recording images of the semiconductor wafer 2 and / or the semiconductor die 2A placed thereon, and / or the target 113. Based on these recorded images, which may be in the form of still images or moving images, the controller 100 controls the target stage 110, the wafer stage 120, and / or the release unit 130 to ensure that each semiconductor die 2A to be placed is positioned in the intended location on the target 113. This placement process will now be described in more detail with reference to Figure 2.

[0070] Figure 2 is a schematic cross-sectional view corresponding to the apparatus in Figure 1. Here, a target 113 is shown, which is, for example, a printed circuit board. The target 113 has multiple intended placement positions on which a semiconductor die 2A from a diced semiconductor wafer 2 needs to be placed. Before placing the semiconductor die 2A, droplets 151 of a conductive adhesive, solder, etc., are dispensed onto the target 113 by an ejector 150, for example, by ejection.

[0071] As shown in inset I, the target 113 may be provided with a plurality of droplets 151 arranged in rows R and column C, and similarly, semiconductor dies 2A may be arranged on the semiconductor wafer 2 in a matrix of rows r and column c. Here, we assume that column c on the diced semiconductor wafer 2 and column C on the target 113 extend perpendicular to the longitudinal axis of the curved shell 122 and / or the rotation axis 122a, respectively.

[0072] After depositing or otherwise positioning droplets 151 on target 113, target 113 is moved under the curved shell 122 to receive the semiconductor die 2A released from the diced semiconductor wafer 2. A release unit 130 is used for this purpose.

[0073] The curved shell 122 has a constant cross-section along the axis of rotation 122a, at least for the majority of its length. The curved shell 122 can be a partially circular or a circular cylindrical shell. Various examples of the cross-section of the curved shell 122 are shown in Figure 1A, where Example A corresponds to a partially circular cylindrical shell, Example B corresponds to a circular cylindrical shell, and Example C corresponds to a further partially circular cylindrical shell, i.e., a semicircular cylindrical shell.

[0074] Referring again to Figure 2, the release unit 130 includes a laser light source 132 that irradiates a light beam 133 through a curved shell 122 onto the semiconductor die 2A to be released from the carrier film 4. For this purpose, the curved shell 122 is at least partially translucent with respect to light coming from the laser light source 132. The curved shell 122 can be made entirely of a translucent material, or it can be translucent in certain areas and opaque in other areas. For example, the curved shell 122 can be made of glass, quartz, or fused silica.

[0075] The mounting layer 41 comprises a light-absorbing agent such as a photosensitive adhesive. When the mounting layer 41 is irradiated with light from the laser light source 132, it loses its adhesion to the semiconductor die 2A. For example, light absorption causes a chemical reaction in the light-absorbing agent, resulting in a decrease in the tackiness of the mounting layer 41. Additionally or alternatively, light absorption may also cause a rapid and localized rise in temperature. This may result in localized ablation and / or even the generation of gaseous components that propel the released semiconductor die 2A toward the target 113.

[0076] The semiconductor die 2A that has lost its mounting falls onto its intended placement position on the target 113. The curved shell 122 is then rotated by the motor M3 to align another semiconductor die 2A with the laser light source 132. Furthermore, the curved shell 122 and the target 113 are translated relative to each other to bring the next intended placement position into the correct position relative to the curved shell 122.

[0077] As shown in Figure 2, various inspection systems can be installed. The inspection system can be used to inspect the semiconductor die 2A from the diced semiconductor wafer 2 before it is placed on the target 113. Such inspection may consist of determining the position and orientation of the semiconductor die 2A. This allows for final correction before releasing the semiconductor die 2A, for example, by translating the curved shell 122, the target 113, and / or the laser light source 132. It should be noted that each semiconductor die 2A may be slightly offset from its ideal position and / or orientation. Such deviations may occur during dicing and / or when mounting the FFFC 3 onto the curved shell 122. Recording such deviations is possible by one or more cameras 141 of the inspection system 140. Since the curved shell 122 is at least locally translucent, it is also possible to place the cameras 141 inside the curved shell 122.

[0078] Another camera, or the same camera, may also be used to check whether the semiconductor die 2A is damaged before releasing it. If it is determined that the semiconductor die 2A is damaged, the controller 100 of the apparatus 1 may decide to skip that semiconductor die.

[0079] Another camera, or the same camera, can also be used to check whether semiconductor die 2A has been released. If it is determined that this semiconductor die has not been released, another release attempt can be made.

[0080] The inspection system 140 can also use the camera 142 to check whether the droplet 151 is correctly positioned on the target 113, and / or monitor or check the position and / or orientation of the target 113.

[0081] It should be noted that, due to the curved nature of the curved shell 122, the camera of the inspection system 140 can be positioned in close proximity to the semiconductor die 2a that it needs to inspect.

[0082] Figures 3A to 3E illustrate further embodiments of an apparatus for directly placing a semiconductor die onto a target from a diced semiconductor wafer, according to one aspect of the present disclosure.

[0083] Each embodiment shown in Figures 3A to 3E includes a stationary frame 160 that serves as a reference for various movements within the device.

[0084] In Figure 3A, motor MT0 is used to translate the carriage 111 in the x-direction relative to the frame 160. Motor MT1 is used to translate the target chuck 112 in the y-direction relative to the carriage 111. Furthermore, motor MW3 is used to rotate the curved shell 122 relative to the frame 160.

[0085] The laser light source 132 is mounted on a carriage 131 that is translated in the x-direction relative to the frame 160 using a motor MR0.

[0086] The apparatus shown in Figure 3A can be used to position multiple semiconductor dies 2A on multiple spaced rows of targets 113 that extend perpendicular to the rotation axis 122A.

[0087] For example, target 113 can be translated in the Y direction while rotating the curved shell 122 to position semiconductor dies 2A located in the same row on semiconductor wafer 2. When a row on semiconductor wafer 2 is exhausted, both the target chuck 112 and the laser light source 132 are translated in the x direction so that they align with the semiconductor dies 2A of the next row on semiconductor wafer 2. Once a complete row on target 113 is filled, the target chuck 112 is moved in the x direction to position the new row advancing beneath the curved shell 122.

[0088] In the embodiment shown in Figure 3B, the target chuck 112 can be translated only in the y-direction using motor MT1. The curved shell 122 can be rotated relative to the carriage 121 using motor MW3. Meanwhile, the carriage 121 can be translated in the x-direction using motor MW0. The laser light source 132 mounted on the carriage 131 can be translated in the x-direction relative to the frame 160 using motor MR0, the frame 160 being partially omitted here for illustrative purposes. Motor MR0 may include, for example, a ball screw, a lead screw, a belt drive, or a linear motor to provide translation for the carriage 131.

[0089] The apparatus shown in Figure 3C differs from the embodiment shown in Figure 3B in that the motor MR0 translates the carriage 131 relative to the carriage 121 instead of the frame 160.

[0090] Figures 3D and 3E show cross-sectional views corresponding to the apparatus shown in Figure 3A. More specifically, the target chuck 112 can be translated in the x and y directions, while the curved shell 122 can only rotate relative to the frame 160. The laser light source 132 can be translated only in the x direction relative to the frame 160 using the motor MR0.

[0091] In Figure 3D, the laser light source 132 irradiates a light beam 133 onto the mounting layer on which the semiconductor die 2A is attached to the carrier film, via the translucent curved shell 122. Alternatively, the release unit 130 may include a needle and a needle actuator for engaging and disengaging the needle from the underlying semiconductor die. In this case, both the needle actuator and the needle are located inside the curved shell 122 and are both translated in the X direction.

[0092] In Figure 3E, the laser light source 132 is mounted on the outside of the curved shell 122. The laser light source 132 emits a beam of light 133 toward the mirror unit 134. The mirror unit 134 deflects the light toward the curved shell 122. The mirror unit 134 may comprise one or more mirrors and one or more mirror actuators to allow the deflection angle to be changed. The mirror unit 134 can be translated in the x-direction using a motor MR0, which can be embodied, for example, as a linear motor.

[0093] The present invention has been described above using detailed embodiments. However, the present invention is not limited to these embodiments. Rather, various modifications are possible without departing from the scope of the invention as defined by the appended claims and equivalents.

[0094] The specific and preferred embodiments of the present invention are described in the appended independent claims. Combinations of features from the dependent claims and / or independent claims may be made as appropriate, not merely as specified in the claims.

[0095] The scope of this disclosure includes any novel features or combinations of features disclosed expressly or implicitly, or generalizations thereof, whether relating to the claimed invention or mitigating any or all of the problems addressed by the invention. The applicant hereby notes that new claims may be formulated for such features during the examination of this application or any further applications derived therefrom. In particular, with reference to the attached claims, the features of the dependent claims may be combined with the features of the independent claims, and the features of each independent claim may be combined in any appropriate manner, not merely in the specific combinations enumerated in the claims.

[0096] Features described in the context of separate embodiments may also be provided in combination in a single embodiment. Conversely, for the sake of brevity, various features described in the context of a single embodiment may also be provided separately or in any suitable subcombination.

[0097] The term “to include” does not exclude other elements or steps, and the term “one” does not exclude multiple elements or steps. Reference numerals in the claims shall not be construed as limiting the claims. [Explanation of Symbols]

[0098] 1 device 2 Semiconductor wafers 2A Semiconductor Die 3. Film frame carrier 4 Carrier film 5 cassettes 30 Ring-shaped body 31 Mounting surface 32 leaf springs 33 Connection part 34, 34A, 34B segments 35A, 35B Contact surface 36A, 36B opening 37 Shaft 41 Mounting layer 42 Backing Layers 43 Support surface 100 controllers 110 Target Stages 111 Carriage Target Stage 112 Target Chuck 113 Target 120 wafer stages 121 Carrier Wafer Stage 122 Curved Shell 122A Rotating shaft 130 Liberation Units 131 Carrier Liberation Unit 132 Laser light source 133 Beam of Light 134 Mirror Unit 140 Inspection Systems 141, 142 Camera 150 Discharge device 151 Adhesive / solder droplets 160 Fixed Frame M0 Motor X direction M1 Motor y direction M2 motor z direction M3 motor rotation

Claims

1. A film frame carrier configured to be mounted on a curved shell, A body having a mounting surface configured to be bonded to the support surface of a flexible carrier film, foil, or tape having a support surface on which an array of semiconductor dies is arranged. Equipped with, The film frame carrier is characterized in that the main body is ring-shaped and has asymmetric bending rigidity, which allows the ring-shaped main body to be bent so that the mounting surface of the ring-shaped main body changes from a first shape to a more concave second shape, and prevents or restricts bending the ring-shaped main body so that the shape of the mounting surface becomes more convex than the first shape.

2. The asymmetric bending rigidity is configured to allow the ring-shaped body to be bent such that the mounting surface of the ring-shaped body reversibly changes from having the first shape to a more concave second shape, wherein the first shape corresponds to an arbitrarily essentially flat shape, as described in claim 1.

3. The curvature of the mounting surface when it has the first shape is 0.2 m －１ The curvature of the mounting surface when it has the second shape is less than 3.3 m －１ The film frame carrier according to claim 2 is as described above.

4. The ring-shaped body comprises a leaf spring and / or is at least partially formed by the leaf spring, and further comprises a limiting means connected to the leaf spring to prevent or limit the bending of the ring-shaped body such that the shape of the mounting surface is more convex than the first shape, The restricting means is optionally coupled to the leaf spring on a surface oriented away from the mounting surface, and / or The film frame carrier according to claim 3, wherein the restricting means optionally comprises a plurality of segments connected to the leaf spring, and when the mounting surface is in the first shape, adjacent segments abut each other, thereby preventing or restricting bending the leaf spring so that the shape of the mounting surface becomes more convex than the first shape, and the segments are configured to separate from each other when the leaf spring is bent so that the mounting surface deforms into a more concave shape than the first shape.

5. The film frame carrier according to claim 1, wherein the ring-shaped body comprises a plurality of segments, and the segments are hinged to each other.

6. The film frame carrier according to claim 5, wherein each pair of adjacent segments among the plurality of segments is configured to pivot relative to each other about their respective axes of rotation.

7. The film frame carrier according to claim 6, wherein the axes of rotation describing the pivotal motion of all pairs of adjacent segments among the plurality of segments are parallel to each other.

8. The film frame carrier according to claim 7, wherein, of the plurality of segments, for at least one pair of adjacent segments, one segment comprises a first coupling structure located at a first end of the one segment, and the other segment comprises a second coupling structure located at a second end of the other segment, and the first coupling structure and the second coupling structure are hinged to each other such that the one segment and the other segment can pivot relative to each other about a rotation axis.

9. The film frame carrier according to claim 8, wherein one segment comprises the second coupling structure disposed on the second side of the one segment opposite to the first side of the one segment, and the other segment comprises the first coupling structure disposed on the first side of the other segment opposite to the second side of the other segment.

10. The first coupling structure comprises a first opening, and the second coupling structure comprises a projection element rotatably received in the first opening and defining the axis of rotation, wherein the projection element is optionally a pin, rod, or shaft, or The film frame carrier according to claim 9, wherein the first coupling structure comprises a first opening, the second coupling structure comprises a second opening, and the film frame carrier comprises a shaft that is rotatably received in at least one of the first opening and the second opening and defines the axis of rotation.

11. A film frame carrier according to any one of claims 6 to 10, wherein, for each pair of adjacent segments among the plurality of segments, one segment comprises a first contact surface and the other segment comprises a second contact surface, the first contact surface and the second contact surface are formed and positioned to contact each other with respect to the axis of rotation for the purpose of preventing the ring-shaped body from bending such that the shape of the mounting surface becomes more convex than the first shape when the mounting surface has the first shape, and / or the segments are made of a material selected from the group consisting of steel, aluminum, titanium, polymer or a combination thereof.

12. A film frame carrier according to any one of claims 1 to 10, A carrier film, foil, or tape having a support surface on which an array of semiconductor dies is arranged, An assembly that includes, The carrier film, foil, or tape having an array of semiconductor dies is bonded to the mounting surface of the film frame carrier, The array of semiconductor dies is optionally composed of diced semiconductor wafers or structured semiconductor wafers.

13. The assembly according to claim 12, wherein the carrier film, foil, or tape has an array of semiconductor dies attached to the support surface, and the carrier film, foil, or tape is bonded to the mounting surface of the film frame carrier to provide a mounting layer.

14. The assembly according to claim 13, wherein the mounting layer comprises a light-absorbing agent such as a photosensitive adhesive, and the light-absorbing agent is configured to release at least locally from the arrangement of semiconductor dies when irradiated with light having a specific wavelength.

15. The assembly according to claim 14, wherein the light absorber is configured to be released at least locally by photoablation and / or by a chemical reaction caused by the light absorber as a result of absorbing the light.

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