Semiconductor module
The semiconductor module design with a metal foil and island-like structures enhances bonding between the substrate and molding agent, addressing resin peeling and moisture penetration issues by increasing adhesion and reducing delamination.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-01-16
- Publication Date
- 2026-04-07
AI Technical Summary
In semiconductor modules with ceramic substrates, thermal stress causes resin peeling, leading to moisture penetration and operational issues, particularly pronounced with silicon nitride substrates due to large linear expansion coefficient differences.
A semiconductor module design featuring a metal foil with island-like portions on the substrate, bonded via a molding agent, increasing the bonding area and adhesion by forming multiple island-like structures and intervening portions to reinforce the substrate-molding agent bond.
Reduces delamination of the molding agent from the substrate, maintaining stable bonding even with significant thermal stress, especially when using silicon nitride ceramic substrates.
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention relates to a semiconductor module.
Background Art
[0002] A semiconductor module is formed, for example, by providing a metal foil on a heat dissipation surface on one side of a substrate and molding it with resin. As a substrate of a conventional semiconductor module, for example, a ceramic substrate is used. For the technology of such a semiconductor module, reference can be made to, for example, the technology disclosed in Patent Document 1.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Disclosure of the Invention
Problems to be Solved by the Invention
[0004] By the way, in a module heat dissipation surface where the contact area between the ceramic substrate and the resin is small, when repeated thermal stress occurs, the resin and the ceramic substrate peel off, moisture penetrates, and the penetrated moisture further penetrates from the module heat dissipation surface to the other surface where electronic components are provided, and problems may occur in the operation of the semiconductor module (power module).
[0005] In particular, when the substrate is a silicon nitride substrate, the problem of peeling becomes prominent because the difference in the linear expansion coefficient between the resin and the substrate is large.
[0006] An object of the present invention is to provide a semiconductor module that solves the above problems.
Means for Solving the Problems
[0007] To solve the above problems, the semiconductor module of the present invention is a semiconductor module in which a metal foil is provided on a substrate and molded with a molding agent, wherein the metal foil includes island portions, the island portions are formed by forming multiple island-shaped portions of metal foil, the intervening portions are formed by interposing a molding agent between adjacent island portions, and further have intervening portions, wherein the substrate and the molding agent are joined at the intervening portions.
[0008] According to the present invention, the above configuration makes it possible to increase the bonding area between the substrate and the molding agent, improve the adhesion of the molding agent to the substrate, and reduce the amount of delamination of the molding agent from the substrate. Furthermore, by forming the metal foil into multiple island-like portions, the bonding area between the metal foil and the molding agent is increased, and the bonding between the substrate and the molding agent is reinforced by the island portions of the metal foil, further improving the adhesion of the molding agent to the substrate.
[0009] The island portion has a first island portion and a second island portion. The first island portion is formed on the edge side of the metal foil, and the second island portion is formed on the corner side of the metal foil. The area of the second island portion is larger than the area of the first island portion. The length of the edge portion of the second island portion that joins with the molding agent is longer than the length of the edge portion of the first island portion that joins with the molding agent. This makes it possible to relatively increase the adhesion force of the substrate to the molding agent at the corners, which are prone to peeling.
[0010] The first and second island portions are discontinuous from the rest of the metal foil, and each island portion has a third island portion, which is provided on the edge side of the metal foil and is provided as a peninsula-shaped continuous portion that is continuous with the rest of the metal foil at a position corresponding to the terminal installation position, the area of the third island portion is larger than the area of the first island portion and also larger than the area of the second island portion, and the length of the edge portion of the third island portion that joins with the molding agent is longer than the length of the edge portion that joins with the molding agent of the first island portion and also longer than the length of the edge portion that joins with the molding agent of the second island portion, thereby reducing the likelihood of the molding agent peeling off from the substrate.
[0011] The other part of the metal foil is the central part of the metal foil, and the central part of the metal foil is rectangular with the corners cut at an angle, and the edges of the central part of the metal foil have an angled edge at the corner and a straight edge connecting adjacent corners, and the intervening part is the first intervening part, and of the edges of the first island part, the edges opposite to the edges connecting adjacent corners of the central part of the metal foil are formed parallel to the edges connecting adjacent corners, and of the edges of the second island part, The side of the central part of the metal foil opposite the sloping side on the corner side is formed parallel to the sloping side on the corner side, and the space between the central part of the metal foil and the island part is made into a second intervening part in which a molding agent is interposed. This makes it possible to keep the width of the second intervening part formed between the side of the central part of the metal foil and the side of the first and second island parts opposite it constant, and to make the adhesion force of the substrate to the molding agent in the second intervening part uniform.
[0012] By making the second island section a polygon with more sides than the first island section, the number of sides that are joined at the corners that are prone to peeling is relatively increased, which can relatively increase the adhesion force of the substrate to the molding agent.
[0013] Multiple first islands are provided between one second island and another second island adjacent to that first second island, and further multiple islands are provided between one second island and one third island. This improves the adhesion of the substrate to the molding agent on the edge side of the metal foil where the first islands are formed. It also improves the adhesion of the substrate to the molding agent near the second and third islands.
[0014] By using a metal foil made of a material with greater bonding strength to the molding agent than the substrate, the adhesion of the substrate to the molding agent can be reinforced through the bonding between the metal foil and the molding agent in the intervening portion.
[0015] The difference in the coefficient of thermal expansion between the substrate and the molding agent can be 3 × 10⁻⁶ / K or greater.
[0016] The substrate can be made of silicon nitride ceramic, and the molding agent can be made of a material containing resin. [Effects of the Invention]
[0017] According to the present invention, the amount of delamination of the molding agent from the substrate can be reduced. [Brief explanation of the drawing]
[0018] [Figure 1] This is a perspective view showing the overall configuration of a semiconductor module according to an embodiment of the present invention. [Figure 2] This is an enlarged perspective view showing a close-up of a portion of a semiconductor module. [Figure 3] This is an enlarged cross-sectional view showing a magnified portion of a semiconductor module. [Modes for carrying out the invention]
[0019] Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 3. FIG. 1 is a perspective view showing the overall configuration of a semiconductor module according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view showing a part of the semiconductor module enlarged, and FIG. 3 is an enlarged cross-sectional view showing a part of the semiconductor module enlarged.
[0020] Referring to FIGS. 1 to 3, the outline of the semiconductor module 1 of the present invention will be described. The semiconductor module 1 is a semiconductor module 1 in which a metal foil 200 is provided on a substrate 100 and molded by a molding agent 300.
[0021] One surface 101 side of the substrate 100 (the one surface 101 side of the substrate 100 is the back surface side of the substrate 100) functions as a heat dissipation surface, and the other surface 102 side (the other surface 102 side is the front surface side of the substrate 100) functions as an installation surface on which various electronic components such as terminals 400 and lead frames are installed.
[0022] That is, on the edge 101a side of one surface 101 of the substrate 100, a frame-shaped protruding portion 101b made of the molding agent 300 is formed by molding the molding agent 300, and the region 101c inside the protruding portion 101b functions as a heat dissipation surface.
[0023] The metal foil 200 is provided on one surface 101 side of the substrate 100. More specifically, the metal foil 200 is provided in the region 101c inside the frame-shaped protruding portion 101b on one surface 101 side of the substrate 100. That is, the substrate 100 and the metal foil 200 are configured to be joined to the molding agent 300 via the protruding portion 101b, and the metal foil 200 is provided on the substrate 100 via the molding agent 300. By providing the metal foil 200 in the region 101c inside the frame-shaped protruding portion 101b, the inner region 101c can function as a heat dissipation surface.
[0024] The metal foil 200 includes island portions 210. The island portions 210 are formed by dividing the edge 201 side of the metal foil 200 into a plurality of island shapes on the edge 101a side of one surface 101 of the substrate 100.
[0025] The island section 210 has a first island section 211, a second island section 212, and a third island section 213. The first island portion 211 is roughly rectangular, or more precisely, rectangular. The first island portion 211 is formed so as to be scattered in multiple locations on all sides 201a of the edge portion 201 of the metal foil 200. That is, the first island portion 211 is provided so as to be scattered in multiple locations between one second island portion 212 and another second island portion 212 adjacent to that first second island portion 212. Furthermore, the first island portion 211 is provided so as to be scattered in multiple locations between one second island portion 212 and one third island portion 213.
[0026] The second island portion 212 is hexagonal in shape. The second island portion 212 is a polygon with more sides than the first island portion 211 and the third island portion 213. The second island portions 212 are formed so as to be scattered on the corner portion 201b side of the edge portion 201 side of the metal foil 200. One second island portion 212 is formed at each corner portion 201b. The first island portion 211 and the second island portions 212 are discontinuous portions that are discontinuous from the central portion 214 side of the metal foil 200, more specifically than from the other portion 214 of the metal foil 200.
[0027] The third island portion 213 is more precisely rectangular than roughly rectangular. The third island portion 213 is provided on the two opposing sides 201a of the edge 201 of the metal foil 200, and is a peninsula-shaped continuous portion that is continuous with the central portion 214 of the metal foil 200. The third island portion 213 is provided at a position corresponding to the installation position of the terminal 400 on the other side 102 of the substrate 100.
[0028] Furthermore, the semiconductor module 1 has intervening portions 220 between adjacent island portions 211, 212, 213 and between the central portion 214 of the metal foil 200 and the island portions 211, 212, 213. The intervening portion 220 has a first intervening portion 221 and a second intervening portion 222. In other words, the first intervening portion 221 is configured to be interposed between adjacent island portions 211, 212, and 213. More specifically, the first intervening portion 221 is configured with the molding agent 300 interposed between adjacent island portions 211, 212, and 213.
[0029] Furthermore, the second intervening portion 222 is configured to interpose between the central portion 214 and the island portions 211, 212, and 213 of the metal foil 200. More specifically, the second intervening portion 222 is constructed by interposing the molding agent 300 between the central portion 214 and the island portions 211, 212, and 213 of the metal foil 200. The first intervening portion 221 and the second intervening portion 222 are components that do not include the metal foil 200.
[0030] The depths of the first intervening portion 221 and the second intervening portion 222 are equal to the thickness of the metal foil 200, more specifically to the thickness of the island portions 211, 212, 213 and the central portion 214. In the molding process of the semiconductor module 1, the molding agent 300 can be flowed from the protruding portion 101b side to the first intervening portion 221 and the second intervening portion 222 side. The molding agent 300 that has flowed into the first intervening portion 221 and the second intervening portion 222 then cools and solidifies. This allows the substrate 100 and the metal foil 200 to be joined to the molding agent 300 in the first intervening portion 221 and the second intervening portion 222.
[0031] Here, the area of the first second island 212 is larger than the area of the first island 211. The sum of the lengths of all the edges 212a that join the molding agent 300 of the first second island 212 (the sum of the lengths of the 6 edges 212a of the first second island 212) is longer than the sum of the lengths of all the edges 211a that join the molding agent 300 of the first island 211 (the sum of the lengths of the 4 edges 211a of the first island 211).
[0032] Furthermore, the area of the first third island 213 is larger than the area of the first island 211, and also larger than the area of the first second island 211. The sum of the lengths of all the edges 213a of the first third island 213 that are joined to the molding agent 300 (the sum of the lengths of the three edges 213a of the first third island 213) is longer than the sum of the lengths of all the edges 211a of the first first island 211 that are joined to the molding agent 300 (the sum of the lengths of the four edges 211a of the first first island 211), and also longer than the sum of the lengths of all the edges 212a of the first second island 212 that are joined to the molding agent 300 (the sum of the lengths of the six edges 212a of the first second island 212).
[0033] Furthermore, the central portion 214 side of the metal foil 200 is rectangular in shape, with the corner portion 214a side cut at an angle. The edge portion 214b of the central portion 214 of the metal foil 200 has an angled edge portion 214b1 on the corner portion 214a side and a straight edge portion 214b2 connecting adjacent corner portions 214a. Moreover, of the edge portions 211a of the first island portion 211, the edge portion 211a1 opposite to the edge portion 214b1 connecting adjacent corner portions 214a of the central portion 214 of the metal foil 200 is formed parallel to the edge portion 214b1 connecting adjacent corner portions 214a. Furthermore, of the edges 212a of the second island portion 212, the edge 212a1 that faces the inclined edge 214b2 on the corner portion 214a side of the central portion 214 of the metal foil 200 is formed parallel to the inclined edge 214b2 on the corner portion 214a side (as described above, the space between the central portion 214 of the metal foil 200 and the island portions 211, 212 is a second intervening portion 222 in which the molding agent 300 is interposed).
[0034] The materials of the substrate 100, metal foil 200, and molding agent 300 of the semiconductor module 1 configured as described above can be as follows.
[0035] In other words, the substrate 100 can be made of, for example, ceramic, and the ceramic can be alumina ceramic or silicon nitride ceramic. When the substrate 100 is made of alumina ceramic, the coefficient of thermal expansion of the substrate 100 can be about 7 × 10⁻⁶ / K. When the substrate 100 is made of silicon nitride ceramic, the coefficient of thermal expansion of the substrate 100 can be about 3 × 10⁻⁶ / K.
[0036] The island portions 210 and central portions 214 of the metal foil 200 are made of a material that has a greater bonding force to the molding agent 300 than the substrate 100. The metal foil 200 can be, for example, copper foil, and copper foil can be made of a material containing copper. When the metal foil 200 is copper foil, the coefficient of linear expansion of the metal foil 200 can be approximately 16.6 × 10⁻⁶ / K.
[0037] The molding agent 300 can be composed of, for example, a resin-containing material. When the molding agent 300 is made of resin, the coefficient of linear expansion of the molding agent 300 is approximately 7 to 10 × 10⁻⁶ / K. When the substrate 100 is made of alumina ceramic, the difference in the coefficient of linear expansion between the substrate 100 and the molding agent 300 is approximately 0 to 3 × 10⁻⁶ / K. When the substrate 100 is made of silicon nitride ceramic, the difference in the coefficient of linear expansion between the substrate 100 and the molding agent 300 is 3 × 10⁻⁶ / K or more, more specifically approximately 4 to 7 × 10⁻⁶ / K.
[0038] In other words, the semiconductor module 1 is constructed by molding a metal foil 200 onto a substrate 100 using a molding agent 300. When the substrate 100 is made of alumina ceramic and the molding agent 300 is made of resin, the difference in coefficients of thermal expansion is small, and even when there are large temperature changes, the molding agent 300 is less likely to peel off from the substrate 100, allowing for stable bonding between the substrate 100 and the molding agent 300.
[0039] In contrast, when the substrate 100 is made of silicon nitride ceramic and the molding agent 300 is made of resin, the molding agent 300 tends to peel off from the substrate 100 when the difference in coefficients of linear expansion is large and the temperature changes are large. However, in this embodiment, by adopting the island-like structure on the edge 201 side of the metal foil 200 in the semiconductor module 1 as described above, it is possible to reduce the peeling of the molding agent 300 from the substrate 100 even when the substrate 100 is made of silicon nitride ceramic.
[0040] In other words, in this embodiment, the metal foil 200 has island portions 210 and a first intervening portion 221. The island portions 210 are formed by creating multiple island-like structures on the edge 201 side of the metal foil 200 on the edge 101a side of the substrate 100. The first intervening portion 221 is formed by intervening a molding agent 300 between adjacent island portions 210. By joining the substrate 100 and the molding agent 300 at the first intervening portion 221, the bonding area between the substrate 100 and the molding agent 300 can be increased. This improves the adhesion of the molding agent 300 to the substrate 100 and reduces the likelihood of the molding agent 300 peeling off from the substrate 100. Furthermore, by forming multiple island-like island portions 210 on the edge 201 side of the metal foil 200, the number of bonding areas between the metal foil 200 and the molding agent 300 is increased, and the bonding between the substrate 100 and the molding agent 300 is reinforced by the island portions 210 of the metal foil 200, further improving the adhesion force of the molding agent 300 to the substrate 100.
[0041] Furthermore, the island portion 210 has a first island portion 211 and a second island portion 212. The first island portion 211 is formed to be scattered on the edge portion 201a side of the metal foil 200 on the edge portion 201 side, and the second island portion 212 is formed to be scattered on the corner portion 201b side of the edge portion 201 of the metal foil 200. The area of one second island portion 212 is larger than the area of one first island portion 211. The sum of the lengths of all the edges 212a that join with the molding agent 300 of one second island portion 212 is longer than the sum of the lengths of all the edges 211a that join with the molding agent 300 of one first island portion 211. This makes it possible to relatively increase the adhesion force of the substrate 100 to the molding agent 300 at the easily peelable corner portion 201b.
[0042] Furthermore, the island portion 210 has a third island portion 213, which is provided on the two opposing side portions 201a on the edge portion 201 side of the metal foil 200, and is provided as a peninsula-shaped continuous portion that is continuous with the central portion 214 side of the metal foil 200, at a position corresponding to the installation position of the terminal 400, and the area of the first third island portion 213 is larger than the area of the first island portion 211, and further larger than the area of the first second island portion 212. By setting the area such that the sum of the lengths of all the edges 213a that join the molding agent 300 of the first third island 213 is longer than the sum of the lengths of all the edges 211a that join the molding agent 300 of the first first island 211, and further longer than the sum of the lengths of all the edges 212a that join the molding agent 300 of the first second island 212, the amount of delamination of the molding agent 300 from the substrate 100 can be reduced.
[0043] In other words, since a large current flows through terminal 400, the temperature changes are large at the location corresponding to the installation position of terminal 400. However, as described above, the third island portion 213 is provided at the location corresponding to the installation position of terminal 400, and the area of the first third island portion 213 is larger than the area of the first island portion 211 and also larger than the area of the second island portion 212. The sum of the lengths of all the edges 213a that join the molding agent 300 of the first third island portion 213 is By making the length of the first island portion 211 longer than the sum of the lengths of all the edges 211a that join with the molding agent 300 of the first island portion 211, and longer than the sum of the lengths of all the edges 212a that join with the molding agent 300 of the first second island portion 212, the adhesion force of the substrate 100 to the molding agent 300 near the third island portion 213 can be relatively increased, and the peeling of the molding agent 300 from the substrate 100 can be reduced even when there are large temperature changes.
[0044] Furthermore, of the edges of the first island portion 211, the edge portion 211a that faces the edge portion 214b2 connecting adjacent corner portions 214a of the central portion 214 of the metal foil 200 is formed parallel to the edge portion 214b2 connecting adjacent corner portions 214a, and of the edges of the second island portion 212, the edge portion 212a that faces the inclined edge portion 214b1 on the corner portion 214a side of the central portion 214 of the metal foil 200 is formed parallel to the inclined edge portion on the corner side. By forming a second intervening portion 222 parallel to portion 214b1, and between the central portion 214 and the island portions 211 and 212 of the metal foil 200, in which the molding agent 300 is interposed, the width of the second intervening portion 222 formed between the edge portion 214b of the central portion 214 of the metal foil 200 and the edges 211a and 212a of the first island portion 211 and the second island portion 212 opposite to it can be made constant. This makes it possible to make the adhesion force of the substrate 100 to the molding agent 300 in the second intervening portion 222 uniform.
[0045] Furthermore, by making the second island portion 212 a polygon with more sides than the first island portion 211 and the third island portion 213, the number of sides joined at the easily peeled corner portion 214a is relatively increased, which can relatively increase the adhesion force of the substrate 100 to the molding agent 300.
[0046] Furthermore, by providing multiple first island portions 211 between one second island portion 212 and another second island portion 212 adjacent to that first second island portion 212, and by providing even more multiple first island portions 211 between one second island portion 212 and one third island portion 213, the adhesion of the substrate 100 to the molding agent 300 on the edge portion 201a side of the metal foil 200 where the first island portion 211 is formed can be improved. In addition, the adhesion of the substrate 100 to the molding agent 300 near the second island portions 212 and near the third island portion 213 can also be improved.
[0047] It should be noted that the present invention is not limited to the embodiments described above, and various modifications and applications are possible within the scope of the invention described in the claims.
[0048] For example, in the embodiments described above, the substrate 100 is made of alumina ceramic or silicon nitride ceramic, but the desired effects can be achieved even if other materials are used. However, by using silicon nitride ceramic for the substrate 100, the technical effects of the present invention can be fully realized.
[0049] Furthermore, while the metal foil 200 is specified as copper foil, other metal materials can also be used to achieve the desired effect. However, using copper foil for the metal foil 200 results in a stronger bond with the molding agent 300 than with the substrate 100, making it a more preferable embodiment.
[0050] Furthermore, although the molding agent 300 is specified to be a resin, various materials that can achieve the technical effects of the present invention can be used.
[0051] Furthermore, in the metal foil 200, the area of one second island portion 212 is larger than the area of one first island portion 211, and the sum of the lengths of all the edges 212a that join the molding agent 300 of one second island portion 212 is longer than the sum of the lengths of all the edges 211a that join the molding agent 300 of one first island portion 211. However, for example, the area of one second island portion 212 is smaller than the area of one first island portion 211, and the sum of the lengths of all the edges 212a that join the molding agent 300 of one second island portion 212 is shorter than the sum of the lengths of all the edges 211a that join the molding agent 300 of one first island portion 211 can also be used to achieve the desired effect.
[0052] However, it is preferable to make the area of the first second island portion 212 larger than the area of the first island portion 211, and to make the sum of the lengths of all the edges 212a that join with the molding agent 300 of the first second island portion 212 longer than the sum of the lengths of all the edges 211a that join with the molding agent 300 of the first island portion 211, as this increases the adhesion force of the substrate 100 to the molding agent 300 and constitutes a more preferable embodiment.
[0053] Furthermore, the area of the first third island portion 213 is larger than the area of the first island portion 211, and also larger than the area of the first second island portion 212. The sum of the lengths of all the edges 213a that join the molding agent 300 of the first third island portion 213 is longer than the sum of the lengths of all the edges 211a that join the molding agent 300 of the first island portion 211, and also longer than the sum of the lengths of all the edges 212a that join the molding agent 300 of the second island portion 212. For example, the area of the first third island portion 213 is smaller than the area of the first island portion 211 and the area of the first second island portion 212, based on the dimensional relationship with the terminal 400, and the sum of the lengths of all the edges 213a of the first third island portion 213 that join with the molding agent 300 is shorter than the sum of the lengths of all the edges 211a of the first island portion 211 that join with the molding agent 300 and the sum of the lengths of all the edges 212a of the second island portion 212 that join with the molding agent 300, thereby achieving the desired effect.
[0054] However, it is preferable to make the area of the first third island portion 213 larger than the area of the first first island portion 211, and also larger than the area of the first second island portion 212, and to make the sum of the lengths of all the edges 213a of the first third island portion 213 that join with the molding agent 300 longer than the sum of the lengths of all the edges 211a of the first island portion 211 that join with the molding agent 300, and also longer than the sum of the lengths of all the edges 212a of the first second island portion 212 that join with the molding agent 300, as this can relatively increase the adhesion force of the substrate 100 to the molding agent 300.
[0055] Furthermore, of the edges 211a of the first island portion 211, the edge 211a1 opposite to the edge 214b2 connecting adjacent corners 214a of the central portion 214 of the metal foil 200 is formed parallel to the edge 214b2 connecting adjacent corners 214a, and of the edges 212a of the second island portion 212, the edge 212a2 opposite to the inclined edge 214b1 on the corner 214a side of the central portion 214 of the metal foil 200 is formed parallel to the inclined edge 214b1 on the corner 214a side. However, the desired effect can be achieved even if they are not parallel.
[0056] However, it is a more preferable embodiment if, among the edges 211a of the first island portion 211, the edge 211a1 facing the edge 214b2 connecting adjacent corners 214a of the central portion 214 of the metal foil 200 is formed parallel to the edge 214b2 connecting adjacent corners 214a, and among the edges 212a of the second island portion 212, the edge 212a facing the inclined edge 214b1 on the corner 214a side of the central portion 214 of the metal foil 200 is formed parallel to the inclined edge 214b1 on the corner 214a side. This allows for more uniform adhesion of the substrate 100 to the molding agent 300.
[0057] Furthermore, while the first island portion 211 and the third island portion 213 are rectangular in shape, and the second island portion is hexagonal, the desired effect can be achieved even if other shapes are used.
[0058] Furthermore, although the second island portion 212 is designed to have more sides than the first island portion 211 and the third island portion 213, the desired effect can also be achieved by using a polygon with the same number of sides or a polygon with fewer sides. However, a polygon with more sides than the first island portion 211 and the third island portion 213 for the second island portion 212 is more preferable because it increases the adhesion force of the substrate 100 to the molding agent 300.
[0059] Furthermore, the first island portion 211 is provided in multiples between one second island portion 212 and another second island portion 212 adjacent to that second island portion 212, and further multiples are provided between one second island portion 212 and one third island portion 213. However, the desired effect can be achieved even if there is only one first island portion instead of multiple. However, providing multiple first island portions 211 between one second island portion 212 and another second island portion 212 adjacent to that second island portion 212, and further multiples between one second island portion 212 and one third island portion 213, is a more preferable embodiment because it increases the adhesion force of the substrate 100 to the molding agent 300. [Explanation of Symbols]
[0060] 1: Semiconductor module 100: Circuit board 101: One side 101a:Edge 101b:Protrusion 101c: Inner area 102: Other aspects 200: Metal foil 201: Edge 201a: Edge 201b: Corner 210: Islands 211: The first island 211a: Edge 211a1: Edge 212: The second island 212a: Edge 212a1: Edge 213: The third island 213a: Edge 214: Other parts (central part) 214a: corner 214b: Edge 214b1: Sloping edge 214b2: Straight edge 220: Interposition part 221: First intervening part 222: Second intervening part 300: Molding agent 400: Terminal
Claims
1. A semiconductor module in which a metal foil is provided on a substrate and molded with a molding agent, The aforementioned metal foil includes island portions, The aforementioned island portion is formed by shaping the metal foil into multiple island-like structures. Furthermore, it has an intervening part, The intervening portion is formed by the molding agent being interposed between adjacent island portions. The substrate and the molding agent are joined in the intervening portion. The island portion has a first island portion and a second island portion, the first island portion is formed on the edge side of the metal foil, and the second island portion is formed on the corner side of the edge side of the metal foil. The area of the second island portion of the first island portion of the first island portion is larger than the area of the first island portion of the first island portion, and the length of the edge of the second island portion of the first island portion that joins with the molding agent is longer than the length of the edge of the first island portion that joins with the molding agent. The first island portion and the second island portion are discontinuous portions that are separate from the rest of the metal foil, and the island portion has a third island portion, the third island portion is provided on the edge side of the metal foil and is provided as a peninsula-shaped continuous portion that is continuous with the rest of the metal foil at a position corresponding to the terminal installation position. A semiconductor module characterized in that the area of the third island portion is larger than the area of the first island portion, and also larger than the area of the second island portion, and the length of the edge portion of the third island portion that joins with the molding agent is longer than the length of the edge portion of the first island portion that joins with the molding agent, and also longer than the length of the edge portion of the second island portion that joins with the molding agent.
2. The other portion of the metal foil is the central portion of the metal foil, and the central portion of the metal foil is rectangular in shape with the corners cut at an angle, and the edges of the central portion of the metal foil have the angled edges at the corners and the straight edges connecting adjacent corners, and the intervening portion is the first intervening portion. Of the edges of the first island portion, the edge opposite to the edge connecting the adjacent corners in the central part of the metal foil is formed parallel to the edge connecting the adjacent corners. Of the edges of the second island portion, the edge facing the inclined edge on the corner side of the central part of the metal foil is formed parallel to the inclined edge on the corner side. The semiconductor module according to claim 1, characterized in that the space between the central part of the metal foil and the island part is a second intervening part in which the molding agent is interposed.
3. The semiconductor module according to claim 1, characterized in that the second island portion is a polygon with more sides than the first island portion.
4. The semiconductor module according to claim 1, characterized in that a plurality of the first island portions are provided between one second island portion and another second island portion adjacent to the first second island portion, and a further plurality of the first second island portions are provided between the first third island portion.
5. The semiconductor module according to claim 1, characterized in that the metal foil is made of a material whose bonding force to the molding agent is greater than that of the substrate.
6. The semiconductor module according to claim 1, characterized in that the difference in the coefficient of linear expansion between the substrate and the molding agent is 3 × 10⁻⁶ / K or more.
7. The semiconductor module according to claim 1, characterized in that the substrate is made of silicon nitride ceramic and the molding agent is made of a material containing resin.
Citation Information
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