Usepoint ultrasonic homogenizer for reducing CMP slurry aggregation
The use of an ultrasonic transducer and temperature control near the slurry nozzle in CMP systems addresses abrasive particle aggregation, ensuring uniform and efficient polishing by deaggregating and maintaining optimal slurry conditions.
JP7842200B2Active Publication Date: 2026-04-07APPLIED MATERIALS INC
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-07-13
- Publication Date
- 2026-04-07
Smart Images
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Abstract
An exemplary slurry supply assembly may include a slurry fluid source. The assembly may include a slurry supply lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled to an output of the slurry fluid source. The assembly may include a deagglomeration tube fluidly coupled to the lumen outlet. The deagglomeration tube may include a tube inlet and a tube outlet. The assembly may include one or more ultrasonic transducers coupled to the deagglomeration tube.
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Citation Information
Patent Citations
Grinding fluid filtering device
CN210205982U
Polishing solution feeding device
JP1995164320A
Slurry recycle system for CMP device and method therefor
JP1999277434A
Polishing device and its method
JP2000198062A
Supplying device for slurry
JP2000202774A