Method for manufacturing laminates, laminates, electrical and electronic equipment, transportation equipment, and production machinery

JP7843990B2Active Publication Date: 2026-04-13IWATE UNIVERSITY
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
IWATE UNIVERSITY
Filing Date
2021-11-04
Publication Date
2026-04-13

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    Figure 0007843990000016
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    Figure 0007843990000001
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Abstract

To provide a process for producing a laminate in which the surface of the metal layer on the side in contact with the resin is smooth, the adhesion between the metal layer and the resin in a high temperature environment is excellent, and the cost is low, and to provide a laminate, an electrical and electronic appliance, a transportation machine, and a production machinery.SOLUTION: A production process of the present disclosure is a process for producing a laminate that includes a resin substrate, and a metal layer provided on the resin substrate, and the process includes a surface treatment step in which the surface of the resin substrate is modified with a functional group that can adsorb a silane coupling agent represented by a predetermined chemical formula, and a barrier layer formation step in which the silane coupling agent is adsorbed on the surface after the modification with the functional group to form a barrier layer.SELECTED DRAWING: Figure 1
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Citation Information

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